Electronic device

Abstract

The invention provides an electronic device. The electronic equipment comprises a middle frame, a screen, a rear cover, a loudspeaker and a first bonding layer, the loudspeaker adopts an open rear cavity design, and the first bonding layer is bonded between the screen and the middle frame, so that the first bonding layer can not only reduce the range of sound spread to the screen by blocking the rear cavity of the loudspeaker, but also improve the sound quality of the loudspeaker. And the adhesive can provide support for the screen through the cohesiveness, so that the overall coverage of the screen is improved, the vibration of the screen is inhibited, and the vibration of the screen is reduced.

Description

Technical Field

[0001] The present application relates to the field of audio technology, and in particular to an electronic device. Background Art

[0002] With the development of audio technology in electronic devices, in order to enhance the low-frequency performance of speakers, speakers usually adopt an open back cavity design, using the entire internal space of the electronic device as the back cavity.

[0003] However, the open back design of the speaker causes the audio emitted from the back cavity to propagate towards the screen, causing screen vibration issues. Summary of the Invention

[0004] The present application provides an electronic device. The electronic device includes a middle frame, a screen, a back cover, a speaker, and a first adhesive layer. The speaker adopts an open back cavity design. By bonding the first adhesive layer between the screen and the middle frame, the first adhesive layer not only blocks the sound from the back cavity of the speaker, thereby reducing the range of sound propagation to the screen, but also provides support for the screen through its adhesiveness, improving the overall coverage of the screen, thereby suppressing screen vibration and reducing screen vibration.

[0005] In the first aspect, the present application provides an electronic device. The electronic device includes a middle frame, a screen, a back cover, a speaker and a first adhesive layer. The screen and the back cover are installed on opposite sides of the middle frame, the screen and the middle frame form a first space, the back cover and the middle frame form a second space, the middle frame is provided with a first through hole, and the first through hole connects the first space and the second space. The speaker is installed in the second space, and the speaker includes a first cavity and a second cavity respectively located on both sides of the diaphragm. The first cavity is connected to the outside of the electronic device through the sound outlet on the electronic device, and the second cavity is connected to the second space. The electronic device has a first end and a second end relative to each other, the first through hole is located at the first end, the speaker is located at the first end, and the first adhesive layer is located on the side of the first through hole close to the second end, and is bonded between the screen and the middle frame.

[0006] In this application, because the second cavity of the speaker can communicate with the second space, the speaker can achieve an open rear cavity design. This design eliminates the need to seal the second cavity, saving the space occupied by the sealed second cavity and improving the overall space utilization of the electronic device. At the same time, the speaker can use the entire internal space of the electronic device as the rear cavity, significantly increasing the rear cavity volume compared to a sealed second cavity design, thereby enhancing the theoretical low-frequency performance of the speaker.

[0007] In the present application, due to the provision of the first adhesive layer, when the reverse phase sound formed in the second cavity propagates to the first space via the second space and the first through hole, the first adhesive layer can form a barrier to the reverse phase sound, reducing the range of the reverse phase sound continuing to propagate toward the second end in the first space, thereby reducing the range of contact between the reverse phase sound and the screen, and further reducing the range of acoustic-solid coupling excitation generated by the reverse phase sound and the screen, so that the screen vibration range is small and the energy of the screen vibration reverse phase sound generated by the screen vibration is reduced. Such a design can weaken the energy of the screen vibration reverse phase sound when it meets the external sound of the speaker outside the electronic device, thereby reducing the impact of the screen vibration reverse phase sound on the external sound and improving the external sound effect of the electronic device. In addition, because the first adhesive layer adheres between the screen and the middle frame, separating the vibration area of ​​the screen, in other words, the first adhesive layer provides a support point for the screen, improves the overall rigidity of the screen, and can reduce the amplitude of the overall vibration of the screen, which is conducive to alleviating the screen vibration problem and also helps to reduce the energy of the screen vibration reverse phase sound generated by the screen vibration.

[0008] In some possible implementations, the electronic device further includes a second adhesive layer, the second adhesive layer bonding the middle frame and the screen and extending along the circumference of the middle frame. The second adhesive layer includes a first side, a second side, a third side, and a fourth side connected end to end. The first side and the third side are arranged oppositely in a first direction, and the second side and the fourth side are arranged oppositely in a second direction, the second direction intersecting the first direction. The first side is located at a first end of the electronic device and is located on both sides of the first through hole together with the first adhesive layer. The first adhesive layer includes a first adhesive layer, at least a portion of which extends along the second direction.

[0009] In this implementation, the first adhesive layer can be combined with the second adhesive layer to form a sealed or nearly sealed space at the first end of the electronic device to block the reverse phase sound that enters the first space through the first through hole, thereby improving the effect of blocking the reverse phase sound from continuing to propagate toward the second end, thereby reducing the screen vibration problem and improving the sound output of the speaker. By designing at least a portion of the first adhesive layer to extend along the second direction, so that the first adhesive layer can form a barrier in the first space, it is beneficial to block the reverse phase sound that enters the first space through the first through hole, thereby improving the effect of blocking the reverse phase sound from continuing to propagate toward the second end, thereby reducing the screen vibration problem and improving the sound output of the speaker.

[0010] In some possible implementations, there is a first gap between the first adhesive layer and the second edge, the first gap has a first size along the first direction, the first gap has a second size along the second direction, and the ratio of the first size to the second size is greater than or equal to 10:1; and / or, there is a second gap between the first adhesive layer and the fourth edge, the second gap has a third size along the first direction, the second gap has a fourth size along the second direction, and the ratio of the third size to the fourth size is greater than or equal to 10:1.

[0011] In this implementation, a long gap is designed between the first adhesive layer and the second adhesive layer so that the first adhesive layer and the second adhesive layer form an approximate partition structure, so that the anti-phase sound entering the first space through the first through hole is difficult to continue to propagate toward the second end of the electronic device through the first gap and the second gap. Therefore, most of the anti-phase sound entering the first space through the first through hole only generates acoustic-solid coupling excitation between the area of ​​the first adhesive layer close to the first end and the screen, so that the screen is only excited by the energy of the anti-phase sound in a smaller area, which can reduce the overall vibration amplitude of the screen, thereby weakening the energy of the screen vibration anti-phase sound generated by the screen vibration, and further weakening the interference of the screen vibration anti-phase sound on the external sound of the speaker, which is beneficial to improving the sound output effect of the speaker.

[0012] In some possible implementations, there is a first gap between the first adhesive layer and the second edge, and the electronic device also includes a first sealing strip, which fills the first gap and bonds the first adhesive layer to the second edge; and / or, there is a second gap between the second adhesive layer and the fourth edge, and the electronic device also includes a second sealing strip, which fills the second gap and bonds the first adhesive layer to the fourth edge.

[0013] In this embodiment, the first and second sealing strips are used to fill the first gap and the second gap respectively, so that the first space can be completely divided into two parts at the first adhesive layer, so that the anti-phase sound entering the first space through the first through hole is blocked on the side of the first adhesive layer near the first end. Therefore, most of the anti-phase sound entering the first space through the first through hole only generates acoustic-solid coupling excitation between the area of ​​the first adhesive layer near the first end and the screen. In this way, the screen is only excited by the energy of the anti-phase sound in a smaller area, which can reduce the overall vibration amplitude of the screen, thereby reducing the energy of the screen vibration anti-phase sound generated by the screen vibration, and further reducing the interference of the screen vibration anti-phase sound on the external sound of the speaker, which is beneficial to improving the sound output effect of the speaker. In addition, because the first and second gaps are filled, the first and third parts of the first adhesive layer do not need to be set longer, which is beneficial to reducing costs and freeing up installation space for other components in the electronic device.

[0014] In some possible implementations, the first adhesive layer includes a first portion, a second portion, and a third portion connected in sequence. The first portion of the first adhesive layer is disposed opposite the third portion of the first adhesive layer, and the first portion of the first adhesive layer is closer to the second edge than the third portion of the first adhesive layer. The second portion of the first adhesive layer extends along the second direction, and both the first portion of the first adhesive layer and the third portion of the first adhesive layer extend along the first direction. A first gap exists between the first portion of the first adhesive layer and the second edge; and / or a second gap exists between the third portion of the first adhesive layer and the fourth edge.

[0015] In this implementation, by designing the first adhesive layer into three parts, and the extension direction of the second part of the first adhesive layer is different from that of the first part and the third part, the first adhesive layer is helped to avoid other devices in the electronic device while improving the separation effect of the first adhesive layer on the first space.

[0016] In some possible implementations, the material of the first adhesive layer is different from the material of the first sealing strip and the material of the second sealing strip, thereby improving the sealing effect of the first gap and the second gap.

[0017] In some possible implementations, the surface of the first adhesive layer is smoother than the surfaces of the first sealing strip and the second sealing strip.

[0018] In this implementation, since the first sealing strip and the second sealing strip are formed by a dispensing process, the surfaces of the first sealing strip and the second sealing strip form an uneven structure. Therefore, the surface of the first adhesive layer is smoother than the surfaces of the first sealing strip and the second sealing strip.

[0019] In some possible implementations, the material of the first adhesive layer is adhesive backing.

[0020] In this implementation, the first adhesive layer can be set by directly pasting, and the setting efficiency is high.

[0021] In some possible implementations, the material of the first sealing strip is a combination of one or more of silicone, thermal conductive gel, hot melt adhesive, and UV curing adhesive; and / or, the material of the second sealing strip is a combination of one or more of silicone, thermal conductive gel, hot melt adhesive, and UV curing adhesive.

[0022] In this implementation, since the first sealing strip is made of the aforementioned material, a dispensing process can be used to fill the first gap to form the first sealing strip, thereby improving the sealing effect of the first gap and thus improving the first adhesive layer's ability to block the propagation of antiphase sound. Since the second sealing strip is made of the aforementioned material, a dispensing process can be used to fill the second gap to form the second sealing strip, thereby improving the sealing effect of the second gap and thus improving the first adhesive layer's ability to block the propagation of antiphase sound.

[0023] In some possible implementations, the second adhesive layer is provided using a dispensing process. Thus, after providing the first adhesive layer, the second adhesive layer can be formed using the dispensing process, and the first and third portions of the first adhesive layer are overlapped to form the first and second sealing strips a, thereby ensuring a gap-free connection between the first and second adhesive layers. In other words, the first and second sealing strips a are integrally formed with the second adhesive layer.

[0024] In other possible implementations, after the first adhesive layer and the second adhesive layer are both provided, a dispensing process is used to fill the first gap and the second gap, thereby forming the first sealing strip B and the second sealing strip B. In other words, the first sealing strip B and the second sealing strip B are both independent structures.

[0025] In some possible implementations, the first adhesive layer is directly bonded to the second side and the fourth side, thereby forming a partition of the first space, so as to block the anti-phase sound entering the first space through the first through hole on the side of the first adhesive layer close to the first end. Therefore, most of the anti-phase sound entering the first space through the first through hole only generates acoustic-solid coupling excitation between the area of ​​the first adhesive layer close to the first end and the screen, so that the screen is only excited by the energy of the anti-phase sound in a smaller area, which can reduce the overall vibration amplitude of the screen, thereby weakening the energy of the screen vibration anti-phase sound generated by the screen vibration, and further weakening the interference of the screen vibration anti-phase sound on the external sound of the speaker, which is beneficial to improving the sound output effect of the speaker.

[0026] In some possible implementations, the material of the first adhesive layer is one or a combination of silicone, thermally conductive gel, hot melt adhesive, and UV-curable adhesive. This design allows the first adhesive layer to be directly formed via a dispensing process, which helps avoid gaps between the first adhesive layer and the second adhesive layer, thereby improving the partitioning effect of the first space. Furthermore, since the first adhesive layer can be formed via a dispensing process, the efficiency of the shape design of the first adhesive layer is improved. For example, the shape of the first adhesive layer can be straight to improve installation efficiency, or zigzag to provide structural clearance for other components.

[0027] In some possible implementations, the first adhesive layer and the second adhesive layer are separate adhesive layer structures. In other possible implementations, the first adhesive layer and the second adhesive layer can be formed simultaneously using a dispensing process, thereby forming an integrated structure. In still other examples, a hole can be drilled in the adhesive backing to form an integrated, shaped adhesive backing, based on the shape of the middle frame and the position of the first through hole, thereby obtaining an integrated first adhesive layer and second adhesive layer.

[0028] In some possible implementations, the first adhesive layer includes a second adhesive layer, the second adhesive layer being located between the first end and the second end, the second adhesive layer being made of a material selected from the group consisting of adhesive and thermally conductive gel, or a combination thereof, and the second adhesive layer being directly bonded to the screen.

[0029] In this implementation, since the hardness of the thermal conductive gel after curing is relatively low as that of the backing glue, when the material of the second adhesive layer is a combination of one or more of the backing glue and the thermal conductive gel, the second adhesive layer can be directly bonded to the screen without damaging the screen. This design makes the setting of the second adhesive layer simple and efficient, and does not take up too much thickness space of the electronic device.

[0030] In some possible implementations, the first adhesive layer includes a second adhesive layer positioned between the first end and the second end. The second adhesive layer is made of one or a combination of silicone, hot melt adhesive, and UV-curable adhesive. The electronic device also includes a film-proof indomycete positioned between the screen and the second adhesive layer, with the orthographic projection of the second adhesive layer on the screen falling within the film-proof indomycete.

[0031] Since silicone, hot melt adhesive and UV curing adhesive have high hardness after curing, by setting anti-film imprint Mylar between the second adhesive layer and the screen, the second adhesive layer can be prevented from directly contacting the screen, thereby avoiding the formation of film marks on the screen, which is beneficial to protecting the screen.

[0032] In some possible implementations, the electronic device further includes a vapor chamber mounted on the midframe and positioned between the screen and the midframe. The second adhesive layer is bonded between the vapor chamber and the film-proof imprint. The vapor chamber is used to dissipate heat for other components within the electronic device.

[0033] In some possible implementations, the vapor chamber is provided with a first groove, the opening of the first groove faces the screen, and at least a portion of the second adhesive layer is located in the first groove.

[0034] In this implementation, by designing a groove on the heat spreader, the heat spreader is locally thinned, which can overcome the problem of limited space for installing the anti-film imprint due to the heat spreader occupying space in the thickness direction of the electronic device.

[0035] In some possible implementations, the electronic device further includes a vapor chamber mounted on the middle frame and positioned between the screen and the middle frame. The vapor chamber has a first opening extending through the vapor chamber along the stacking direction of the screen and the middle frame. At least a portion of the second adhesive layer is positioned within the first opening, and the second adhesive layer is directly bonded to the portion of the middle frame positioned within the first opening.

[0036] In this implementation, by designing an opening on the heat spreader, the heat spreader is partially eliminated, so that the heat spreader does not occupy the thickness space of the electronic device at the first opening. Therefore, it can further overcome the space limitation of the heat spreader design on the anti-film imprint.

[0037] In some possible implementations, the second adhesive layer is a block-shaped structure as a whole, which is simple and efficient in design. For example, the second adhesive layer can be a circular, elliptical, polygonal, or special-shaped structure.

[0038] In other possible implementations, the second adhesive layer includes multiple spaced-apart block structures, which can provide more bonding areas between the screen and the midframe, thereby improving the bonding stability between the screen and the midframe and helping to suppress screen vibration. The shapes of the multiple block structures can be the same or different, and are not limited here.

[0039] In some other possible implementations, the second adhesive layer includes multiple spaced-apart strips, which help improve the stability of the bond between the screen and the midframe. The strips can be of the same or different lengths, without limitation.

[0040] In some other possible implementations, the second adhesive layer is an entire bent strip structure, which can improve the stability of the bonding between the screen and the middle frame.

[0041] In some possible implementations, when the first adhesive layer includes a first adhesive layer, the second adhesive layer is closer to the center of the screen than the first adhesive layer.

[0042] In this implementation, a first adhesive layer is provided to block the reverse phase sound generated in the second cavity of the speaker from continuing its propagation path toward the second end of the electronic device after entering the first space through the second space and the first through-hole. This prevents the reverse phase sound from contacting more areas of the screen, thereby reducing screen vibration reverse phase sound generated by screen vibration. The provision of a second adhesive layer improves the adhesion between the screen and the middle frame in an area near the center of the screen, providing a support point for the screen at the second adhesive layer, thereby dividing the area where the screen vibrates as a whole, which helps to increase the overall rigidity of the screen and thus reduce screen vibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0044] Figure 2A yes Figure 1 The electronic device shown is a schematic structural diagram in some embodiments after being cut along line AA;

[0045] Figure 2B yes Figure 1 The electronic device is shown as a schematic structural diagram of other embodiments after being cut apart along line AA;

[0046] Figure 2C yes Figure 1 The electronic device is shown as a schematic structural diagram of some other embodiments after being cut apart along line AA;

[0047] Figure 3 yes Figure 2A Schematic diagram of acoustic simulation of the electronic device shown;

[0048] Figure 4 yes Figure 2C Schematic diagram of acoustic simulation of the electronic device shown;

[0049] Figure 5 yes Figure 2B or Figure 2CA schematic structural diagram of the first adhesive layer in the electronic device shown in some embodiments;

[0050] Figure 6 yes Figure 2B or Figure 2C Schematic diagram of the structure of the first adhesive layer in the electronic device in other embodiments;

[0051] Figure 7 yes Figure 2B or Figure 2C Schematic diagram of the structure of the first adhesive layer in the electronic device in some further embodiments;

[0052] Figure 8 yes Figure 2B or Figure 2C Schematic diagram of the structure of the first adhesive layer in the electronic device in some further embodiments;

[0053] Figure 9 yes Figure 2B or Figure 2C A schematic diagram of the structure of the second adhesive layer in the electronic device shown in some embodiments;

[0054] Figure 10 yes Figure 2B or Figure 2C Schematic diagram of the structure of the second adhesive layer in other embodiments of the electronic device shown;

[0055] Figure 11 yes Figure 2B or Figure 2C Schematic diagram of the structure of the second adhesive layer in the electronic device in some further embodiments;

[0056] Figure 12 yes Figure 2B or Figure 2C Schematic diagram of the structure of the second adhesive layer in the electronic device in some further embodiments;

[0057] Figure 13 yes Figure 2B or Figure 2C A schematic diagram of the structure of the second adhesive layer in some embodiments of the electronic device shown in FIG. bonding the screen and the middle frame;

[0058] Figure 14A yes Figure 2B or Figure 2C A schematic diagram of the structure of the second adhesive layer in the electronic device shown in other embodiments bonding the screen and the middle frame;

[0059] Figure 14B yes Figure 2B or Figure 2C A schematic diagram of the structure of the second adhesive layer in the electronic device shown in some further embodiments bonding the screen and the middle frame;

[0060] Figure 14C yes Figure 2B or Figure 2C A schematic diagram of the structure of the second adhesive layer in the electronic device shown in some further embodiments bonding the screen and the middle frame;

[0061] Figure 15 yes Figure 2B or Figure 2C The diagram shows a structure of the second adhesive layer in some embodiments of the electronic device bonding the screen and the middle frame. DETAILED DESCRIPTION

[0062] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0063] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed" and "connected" should be understood in a broad sense. For example, "connected" can mean detachably connected or non-detachably connected; it can mean directly connected or indirectly connected through an intermediary. "Multiple" means at least two.

[0064] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inside", "outside", "top", "bottom", "side", etc., are only references to the directions in the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0065] In the embodiments of the present application, the limitations of the relative position relationship mentioned, such as parallel, perpendicular, aligned, etc., are all for the current state of the art, rather than absolutely strict limitations, and a small amount of deviation is allowed, and it is possible to be approximately parallel, approximately perpendicular, approximately aligned, etc. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0066] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0067] See also Figure 1 , Figure 1 1 is a structural diagram of an electronic device 100 provided in an embodiment of the present application.

[0068] In some embodiments, the electronic device 100 may be a device with a sound pickup function, such as a bar phone, a foldable phone, a tablet computer, a multimedia player, headphones, a laptop computer, an in-vehicle device, a foldable terminal device, a television, or a wearable device. The wearable device may be a smart bracelet, a smart watch, a smart head-mounted display, or smart glasses. Figure 1 The electronic device 100 of the embodiment shown is described by taking a bar phone as an example. Of course, other types of electronic devices 100 may also adopt similar structures, which will not be described in detail below.

[0069] For example, the electronic device 100 may include a screen 1, a back cover 2, and a middle frame 3. The screen 1 and the back cover 2 may be mounted on opposite sides of the middle frame 3. An inner cavity of the electronic device 100 may be formed between the screen 1 and the back cover 2.

[0070] The screen 1 can be a flexible display or a rigid display. It can be an organic light-emitting diode (OLED) display, a mini organic light-emitting diode (MID) display, a micro organic light-emitting diode (MID) display, a quantum dot light-emitting diode (QLED) display, or a liquid crystal display (LCD). The back cover 2 is used to protect the internal electronic components of the electronic device 100.

[0071] In some embodiments, the electronic device 100 may further include multiple components (not shown in the figure), which are installed in the inner cavity of the electronic device 100. The multiple components may include, for example, a processor, an internal memory, an external memory interface, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker 4, a receiver, a sound pickup device, an earphone interface, a sensor module, a button, a motor, an indicator, and a subscriber identification module (SIM) card interface.

[0072] The electronic device 100 can implement audio functions such as music playback and recording through the audio module, the speaker 4, the receiver, the sound pickup device, the headphone jack, and the processor.

[0073] The audio module is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signals. The audio module can also be used to encode and decode audio signals. In some embodiments, the audio module can be provided in the processor, or some functional modules of the audio module can be provided in the processor.

[0074] Speaker 4, also known as a "horn," is used to convert audio electrical signals into sound signals. Electronic device 100 can listen to music or make hands-free calls through speaker 4. Electronic device 100 may be provided with one or more speakers 4, which may be located at the top, bottom, or side of electronic device 100.

[0075] The receiver (not shown), also called the "earpiece", is used to convert the audio electrical signal into a sound signal. When the electronic device 100 receives a call or a voice message, the voice can be heard by placing the receiver close to the human ear.

[0076] The sound pickup device (not shown in the figure), also known as a "microphone", "speaker", or "microphone", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can make a sound by putting their mouth close to the sound pickup device to input the sound signal into the sound pickup device. The electronic device 100 can be provided with at least one sound pickup device. In other embodiments, the electronic device 100 can be provided with two sound pickup devices, which can not only collect sound signals but also realize noise reduction function. In other embodiments, the electronic device 100 can also be provided with three, four or more sound pickup devices to realize sound signal collection, noise reduction, and identification of sound sources, and realize directional recording function, etc.

[0077] It should be noted that Figure 1 Some components of the electronic device 100 are shown schematically only. The actual shapes and sizes of these components are not affected by the actual shapes and sizes of the electronic device 100. Figure 1 It should be understood that when the electronic device 100 is in other forms, the electronic device 100 may not include the screen 1 , or the electronic device 100 may include multiple screens 1 .

[0078] Please refer to Figures 2A to 2C , Figure 2A yes Figure 1 The electronic device 100 is shown as a schematic structural diagram in some embodiments after being cut along line AA; Figure 2B yes Figure 1 The electronic device 100 is shown as a schematic structural diagram of other embodiments after being cut apart along line AA; Figure 2C yes Figure 1 The electronic device 100 is shown as a schematic diagram of the structure of some embodiments after being cut along line AA. It should be noted that, Figure 2A and Figure 2B Only part of the structure inside the electronic device 100 is shown.

[0079] In some embodiments, the screen 1 and back cover 2 can be mounted on opposite sides of the middle frame 3. The screen 1 and middle frame 3 enclose a first space 5a, and the back cover 2 and middle frame 3 enclose a second space 5b. A speaker 4 can be mounted within the second space 5b. The speaker 4 can include a first cavity 402 and a second cavity 403, respectively located on either side of a diaphragm 401. The first cavity 402 communicates with the exterior of the electronic device 100 through a sound outlet 6 on the electronic device 100, and the second cavity 403 communicates with the second space 5b. The electronic device 100 can have opposing first and second ends 100a, 100b, with the speaker 4 located at the first end 100a.

[0080] In this embodiment, since the second cavity 403 of speaker 4 is connected to the second space 5b, speaker 4 can achieve an open rear cavity design. This design eliminates the need to seal the second cavity 403 of speaker 4, saving the space occupied by the sealed second cavity 403 and improving the overall space utilization of electronic device 100. Furthermore, speaker 4 can utilize the entire internal space of electronic device 100 as a rear cavity, significantly increasing the rear cavity volume compared to a design with a sealed second cavity 403, thereby enhancing the theoretical low-frequency performance of speaker 4.

[0081] There may be one or more holes communicating with the second cavity 403 of the speaker 4 and the second space 5b, and the holes may be located at the bottom and / or side of the speaker 4, which is not limited here.

[0082] The sound hole 6 on the electronic device 100 can be an opening design of the middle frame 3, or an opening design of the back cover 2, or formed by the middle frame 3 and the back cover 2, etc., which is not limited here.

[0083] The speaker 4 can be fixed to the middle frame 3 or the back cover 2 and can be installed through a bracket, a sealing structure, etc., which is not limited here.

[0084] Among them, the first cavity 402 of the speaker 4 and the sound outlet 6 can be directly connected, or connected through other devices (such as a bracket, a sealing structure, the middle frame 3, etc.) to form a connecting channel, etc., which is not limited here.

[0085] The speaker 4 is located at the first end 100a, which facilitates the design of the sound hole 6 and avoids the sound path being too long, which would result in a high design difficulty.

[0086] Typically, multiple devices are provided in both the first space 5a and the second space 5b to realize the various functions of the electronic device 100. For example, a battery is provided in the second space 5b to power other devices. In order to power the screen 1 and the devices located in the first space 5a, it is necessary to design openings on the middle frame 3 for wiring. In addition, some circuit boards are provided in both the first space 5a and the second space 5b, and a circuit connection structure is required to electrically connect at least some of the circuit boards in the two spaces to achieve signal communication. In addition, in order to reasonably arrange these devices in space, the batteries are usually arranged in an area close to the center to facilitate powering each device. Therefore, it is necessary to design openings in the end area of ​​the middle frame 3 to avoid devices, wiring, etc. For example, a first through hole 301 can be provided at the first end 100a of the electronic device 100, and the first through hole 301 connects the first space 5a and the second space 5b.

[0087] Due to the arrangement of the first through hole 301 on the middle frame 3, the second space 5b is connected to the first space 5a. When the diaphragm 401 in the speaker 4 vibrates, in addition to emitting sound through the first cavity 402 (see Figure 2A The path L1 in the second cavity 403 will also form an anti-phase sound that is in opposite phase to the external sound and propagate in the second space 5b and the first space 5a (see Figure 2A When the reverse phase sound is transmitted to the bottom of screen 1 (see Figure 2A The anti-phase sound will generate acoustic-solid coupling with the screen 1, which will stimulate the screen 1 to vibrate, causing screen vibration. The screen 1 vibration will generate anti-phase sound with a phase opposite to the external sound, and propagate toward the outside of the electronic device 100 (see Figure 2A Path L22 in the figure), when the screen vibration anti-phase sound generated by the vibration of the screen 1 meets the external sound of the speaker 4, it will cause a part of the external sound energy to be offset in the external sound field, especially the low frequency band, thereby reducing the external sound effect of the electronic device 100.

[0088] In some embodiments, the electronic device 100 may further include a first adhesive layer 7 , which is located on a side of the first through hole 301 close to the second end 100 b and adhered between the screen 1 and the middle frame 3 .

[0089] In this embodiment, the provision of the first adhesive layer 7 prevents the reverse phase sound generated within the second cavity 403 from propagating through the second space 5b and the first through-hole 301 to the first space 5a. This reduces the range of the reverse phase sound within the first space 5a that continues to propagate toward the second end 100b, thereby reducing the range of contact between the reverse phase sound and the screen 1 and, in turn, the range of acoustic-solid coupling excitation generated by the reverse phase sound and the screen 1. This reduces the vibration range of the screen 1 and the energy of the screen-vibration reverse phase sound generated by the vibration of the screen 1. This design attenuates the energy of the screen-vibration reverse phase sound when it encounters the sound emitted by the speaker 4 outside the electronic device 100, thereby reducing its impact on the external sound and improving the external sound quality of the electronic device 100. Furthermore, because the first adhesive layer 7 bonds between the screen 1 and the middle frame 3, separating the vibration area of ​​the screen 1, it provides a support point for the screen 1, increasing its overall rigidity and reducing the amplitude of the overall vibration of the screen 1, thereby alleviating screen vibration and reducing the energy of the screen-vibration reverse phase sound generated by the vibration of the screen 1.

[0090] Exemplarily, the first adhesive layer 7 may include a first adhesive layer 701 and a second adhesive layer 702. The first adhesive layer 701 is closer to the first through hole 301 than the second adhesive layer 702, and the second adhesive layer 702 is closer to the center of the screen 1 than the first adhesive layer 701. Both the first adhesive layer 701 and the second adhesive layer 702 are bonded between the screen 1 and the middle frame 3.

[0091] In this embodiment, a first adhesive layer 701 is provided to block the reverse phase sound generated in the second cavity 403 of the speaker 4 from passing through the second space 5b and the first through hole 301 into the first space 5a and continuing toward the second end 100b of the electronic device 100. This prevents the reverse phase sound from contacting more areas of the screen 1, thereby reducing the screen-vibration reverse phase sound generated by the vibration of the screen 1. The provision of a second adhesive layer 702 improves the adhesion between the screen 1 and the middle frame 3 in the area near the center of the screen 1, providing a support point for the screen 1 at the second adhesive layer 702, thereby dividing the area where the screen 1 vibrates as a whole, thereby increasing the overall rigidity of the screen 1 and reducing the screen vibration problem.

[0092] In some other embodiments, the middle frame 3 may also have a through hole (eg, Figure 2C At this time, there is also the problem of anti-phase sound propagating from the second space 5b to the second end 100b and entering the first space 5a from the through hole of the second end 100b to cause screen vibration.

[0093] In this embodiment, the second adhesive layer 702 also serves to reduce screen vibration caused by the reverse phase sound by dividing the area where the screen 1 vibrates as a whole. In other words, even if the middle frame 3 also has an opening at the second end of the electronic device 100, the first adhesive layer 7 of this embodiment of the present application can still suppress the vibration of the screen 1, thereby reducing the impact of the reverse phase sound of the screen vibration on the external sound, and improving the external sound quality of the electronic device 100.

[0094] It should be noted that Figure 2C The position, number and size of the second through holes 303 are not limited. It can be understood that in some other embodiments, the second through holes 303 can also be located elsewhere, have more or fewer numbers, have larger or smaller sizes, etc., and the specific design is based on the actual application.

[0095] The electronic device 100 may further include a second adhesive layer 8, which bonds the middle frame 3 to the screen 1 and extends circumferentially along the middle frame 3 to achieve a sealed connection between the middle frame 3 and the screen 1. The first adhesive layer 701 and the second adhesive layer 8 may be arranged at the first end 100a of the electronic device 100 to form a sealed or nearly sealed space. This can block the reverse phase sound that enters the first space 5a through the first through hole 301, thereby effectively preventing the reverse phase sound from continuing to propagate toward the second end 100b, thereby reducing screen vibration and improving the sound output of the speaker 4.

[0096] The first adhesive layer 701 and the second adhesive layer 702 can be made of the same material. Alternatively, the first adhesive layer 701 can be made of a material with better sound insulation, and the second adhesive layer 702 can be made of a material with better bonding properties, so that the first adhesive layer 701 can have a better isolation and blocking effect, and the second adhesive layer 702 can have a better effect of dividing the vibration area of ​​the screen 1.

[0097] Please refer to Figures 2A to 4 , Figure 3 yes Figure 2A Schematic diagram of acoustic simulation of the electronic device 100; Figure 4 yes Figure 2C Schematic diagram of acoustic simulation of the electronic device 100.

[0098] in, Figure 2A and Figure 2C The amplitude of the screen 1 is simulated by the middle speaker 4 under the same working condition. Figure 3 and Figure 4 The simulation diagram shown. Figure 3 and Figure 4 The simulation results of Figure 3 The maximum vibration amplitude is 14.6μm. Figure 4The maximum vibration amplitude in is 5.22μm, from which we can conclude Figure 2C The embodiment employs a first adhesive layer 701 and a second adhesive layer 702, which reduces the maximum vibration amplitude of screen 1 by over 60%. Furthermore, the vibration distribution on screen 1 demonstrates that second adhesive layer 702 significantly divides the vibration region of screen 1, effectively reducing the vibration amplitude in areas of screen 1 with higher amplitudes.

[0099] therefore, Figure 2C The embodiment reduces the vibration amplitude of the screen 1 and the area of ​​the vibration region with higher amplitude through the design of the first adhesive layer 701 and the second adhesive layer 702, thereby reducing the energy of the screen vibration anti-phase sound generated by the vibration of the screen 1, and can greatly reduce the sound cancellation energy caused by the screen vibration, thereby reducing the interference of the sound cancellation on the speaker 4 in the low frequency band (for example, the frequency band below 1kHz).

[0100] It should be noted that Figure 3 and Figure 4 In the simulation, the middle frame 3 in the electronic device 100 is provided with a second through hole 303. Therefore, it can be concluded that even if through holes are provided in the middle frame 3 at both ends of the electronic device 100, the design scheme of the first adhesive layer 7 of the present application can be adopted to reduce screen vibration.

[0101] Please refer to Figure 2B and Figure 5 , Figure 5 yes Figure 2B or Figure 2C FIG. 7 is a schematic structural diagram of the first adhesive layer 701 in the electronic device 100 in some embodiments.

[0102] In some embodiments, the second adhesive layer 8 may include a first edge 801, a second edge 802, a third edge 803, and a fourth edge 804, which are sequentially connected end to end. The first edge 801 and the third edge 803 are arranged opposite each other in a first direction D1, and the second edge 802 and the fourth edge 804 are arranged opposite each other in a second direction D2, where the second direction D2 intersects the first direction D1. The first edge 801 is located at the first end 100a of the electronic device 100 and is located on both sides of the first through hole 301 together with the first adhesive layer 701. The first adhesive layer 7 may include a first adhesive layer 701, at least a portion of which extends along the second direction D2.

[0103] In this embodiment, by designing at least a portion of the first adhesive layer 701 to extend along the second direction D2, the first adhesive layer 701 can form a barrier in the first space 5a, which is beneficial for blocking the reverse phase sound entering the first space 5a through the first through hole 301, thereby improving the effect of blocking the reverse phase sound from continuing to propagate toward the second end 100b, thereby reducing the screen vibration problem and improving the sound output effect of the speaker 4.

[0104] Exemplarily, a first gap 9 exists between the first adhesive layer 701 and the second edge 802. The first gap 9 has a first dimension l1 along the first direction D1 and a second dimension d1 along the second direction D2. The ratio of the first dimension l1 to the second dimension d1 is greater than or equal to 10:1. A second gap 10 exists between the first adhesive layer 701 and the fourth edge 804. The second gap 10 has a third dimension l2 along the first direction D1 and a fourth dimension d2 along the second direction D2. The ratio of the third dimension l2 to the fourth dimension d2 is greater than or equal to 10:1.

[0105] For example, the ratio of the first dimension l1 to the second dimension d1, and the ratio of the third dimension l2 to the fourth dimension d2 may be the same or different, and the ratios may be, but are not limited to, 10:1, or 10.5:1, or 11:1, or 11.5:1, or 12:1, or 12.4:1, or 13:1, or 13.6:1, or 14:1, or 14.2:1, or 15:1, or 15.9:1, or other values ​​greater than 10:1.

[0106] In this embodiment, a long gap is designed between the first adhesive layer 701 and the second adhesive layer 8 so that the first adhesive layer 701 and the second adhesive layer 8 form an approximately partition structure, so that the anti-phase sound entering the first space 5a through the first through hole 301 is difficult to continue to propagate toward the second end 100b of the electronic device 100 through the first gap 9 and the second gap 10. Therefore, most of the anti-phase sound entering the first space 5a through the first through hole 301 only generates acoustic-solid coupling excitation between the area of ​​the first adhesive layer 701 close to the first end 100a and the screen 1. In this way, the screen 1 is only excited by the energy of the anti-phase sound in a smaller area, which can reduce the overall vibration amplitude of the screen 1, thereby weakening the energy of the screen vibration anti-phase sound generated by the screen vibration, and further weakening the interference of the screen vibration anti-phase sound on the external sound of the speaker 4, which is beneficial to improving the sound output effect of the speaker 4.

[0107] The first adhesive layer 701 may include a first portion 701a, a second portion 701b, and a third portion 701c, which are sequentially connected. The first portion 701a of the first adhesive layer 701 is disposed opposite the third portion 701c of the first adhesive layer 701. The first portion 701a of the first adhesive layer 701 is closer to the second edge 802 than the third portion 701c of the first adhesive layer 701. The second portion 701b of the first adhesive layer 701 extends along the second direction D2. Both the first portion 701a of the first adhesive layer 701 and the third portion 701c of the first adhesive layer 701 extend along the first direction D1. A first gap 9 exists between the first portion 701a of the first adhesive layer 701 and the second edge 802, and a second gap 10 exists between the third portion 701c of the first adhesive layer 701 and the fourth edge 804.

[0108] In this embodiment, by designing the first adhesive layer 701 into three parts, and the second part 701b of the first adhesive layer 701 extending in a different direction from the first part 701a and the third part 701c, the first adhesive layer 701 is facilitated to avoid other devices in the electronic device 100 while improving the separation effect of the first adhesive layer 701 on the first space 5a.

[0109] The first portion 701 a of the first adhesive layer 701 may extend toward the second end portion 100 b of the electronic device 100 , or extend toward the first end portion 100 a of the electronic device 100 .

[0110] The third portion 701 c of the first adhesive layer 701 may extend toward the second end portion 100 b of the electronic device 100 , or extend toward the first end portion 100 a of the electronic device 100 .

[0111] The material of the first adhesive layer 701 may be adhesive backing, which is also called double-sided adhesive. The adhesive backing has strong adhesive properties and is easy to set, which is beneficial to improving the setting efficiency of the first adhesive layer 701.

[0112] It should be noted that Figure 5 The number of the first through holes 301 is shown as three. It can be understood that the number of the first through holes 301 is designed according to the actual needs of the electronic device 100. In some other embodiments, the number of the first through holes 301 can be more or less, which is not limited here.

[0113] Please refer to Figure 2B 、 Figure 6 and Figure 7 , Figure 6 yes Figure 2B or Figure 2C Schematic diagram of the structure of the first adhesive layer 701 in the electronic device 100 in other embodiments; Figure 7 yes Figure 2B or Figure 2C The schematic diagram of the structure of the first adhesive layer 701 in the electronic device 100 in some other embodiments is shown. It should be noted that, Figure 6 and Figure 7 The electronic device 100 shown in the embodiment may include Figure 5 Some technical features of the electronic device 100 shown in the embodiment are not described in detail here.

[0114] In some embodiments, the electronic device 100 may further include a first sealing strip 11 and a second sealing strip 12. The first sealing strip 11 may fill the first gap 9 and bond the first adhesive layer 701 to the second edge 802. The second sealing strip 12 may fill the second gap 10 and bond the first adhesive layer 701 to the fourth edge 804.

[0115] In this embodiment, the first and second sealing strips 11 and 12 fill the first and second gaps 9 and 10, respectively, completely dividing the first space 5a into two portions at the first adhesive layer 701. This blocks the reverse phase sound entering the first space 5a through the first through-holes 301 on the side of the first adhesive layer 701 near the first end 100a. Consequently, the majority of the reverse phase sound entering the first space 5a through the first through-holes 301 generates acoustic-solid coupling excitation only between the area of ​​the first adhesive layer 701 near the first end 100a and the screen 1. This results in the screen 1 being excited by the reverse phase sound energy only within a smaller area, reducing the overall vibration amplitude of the screen 1 and thereby attenuating the energy of the reverse phase sound generated by screen vibration. This in turn reduces the interference of the reverse phase sound with the sound output of the speaker 4, thereby improving the sound quality of the speaker 4. Furthermore, since the first and second gaps 9 and 10 are filled, the first and third portions 701a and 701c of the first adhesive layer 701 do not need to be extended, which not only reduces costs but also frees up space for other components within the electronic device 100.

[0116] For example, the material of the first adhesive layer 701 may be different from the material of the first sealing strip 11 and the material of the second sealing strip 12 , so as to improve the sealing effect of the first gap 9 and the second gap 10 .

[0117] Among them, the material of the first adhesive layer 701 can be back glue, the material of the first sealing strip 11 can be a combination of one or more of silicone, thermal conductive gel, hot melt adhesive, ultraviolet curing adhesive, etc., and the material of the second sealing strip 12 can be a combination of one or more of silicone, thermal conductive gel, hot melt adhesive, ultraviolet curing adhesive, etc.

[0118] In this embodiment, the first adhesive layer 701 can be installed by direct bonding, which is highly efficient. Since the first sealing strip 11 is made of the aforementioned material, a dispensing process can be used to fill the first gap 9 to form the first sealing strip 11. This improves the sealing effect of the first gap 9, thereby enhancing the first adhesive layer 701's ability to block the propagation of anti-phase sound. Since the second sealing strip 12 is made of the aforementioned material, a dispensing process can be used to fill the second gap 10 to form the second sealing strip 12. This improves the sealing effect of the second gap 10, thereby enhancing the first adhesive layer 701's ability to block the propagation of anti-phase sound.

[0119] Among them, since the first sealing strip 11 and the second sealing strip 12 are formed by a dispensing process, the surfaces of the first sealing strip 11 and the second sealing strip 12 will form an uneven structure. Therefore, the surface of the first adhesive layer 701 is smoother than the surfaces of the first sealing strip 11 and the second sealing strip 12.

[0120] For some examples, see Figure 6 The second adhesive layer 8 is provided by a dispensing process. Thus, after providing the first adhesive layer 701, the second adhesive layer 8 is formed by the dispensing process. The first portion 701a and the third portion 701c of the first adhesive layer 701 are overlapped to form the first sealing strip 11a and the second sealing strip 12a. This ensures that there is no gap between the first adhesive layer 701 and the second adhesive layer 8. In other words, in this embodiment, the first sealing strip 11a and the second sealing strip 12a are integrally formed with the second adhesive layer 8.

[0121] For other examples, see Figure 7 After the first adhesive layer 701 and the second adhesive layer 8 are both provided, a dispensing process is used to fill the first gap 9 and the second gap 10, thereby forming the first sealing strip 11b and the second sealing strip 12b. In other words, in this embodiment, the first sealing strip 11b and the second sealing strip 12b are both independent structures.

[0122] It should be noted that Figures 5 to 7 The three embodiments can be combined with each other. For example, a long gap design can be adopted between the first part 701a of the first adhesive layer 701 and the second edge 802, and a gap filling design can be adopted between the second part 701b of the first adhesive layer 701 and the fourth edge 804, etc.

[0123] Please refer to Figure 2B and Figure 8 , Figure 8 yes Figure 2B or Figure 2C The schematic diagram of the structure of the first adhesive layer 701 in the electronic device 100 in some other embodiments is shown. It should be noted that, Figure 8 The electronic device 100 shown in the embodiment may include Figures 5 to 7 Some technical features of the electronic device 100 shown in the embodiment are not described in detail here.

[0124] In some embodiments, the first adhesive layer 701 can be directly bonded to the second side 802 and the fourth side 804, thereby forming a partition of the first space 5a, so as to block the anti-phase sound entering the first space 5a through the first through hole 301 on the side of the first adhesive layer 701 close to the first end 100a. Therefore, most of the anti-phase sound entering the first space 5a through the first through hole 301 only generates acoustic-solid coupling excitation between the area of ​​the first adhesive layer 701 close to the first end 100a and the screen 1, so that the screen 1 is only excited by the energy of the anti-phase sound in a smaller area, which can reduce the overall vibration amplitude of the screen 1, thereby weakening the energy of the screen vibration anti-phase sound generated by the screen vibration, and further weakening the interference of the screen vibration anti-phase sound on the external sound of the speaker 4, which is beneficial to improving the sound output effect of the speaker 4.

[0125] The material of the first adhesive layer 701 can be one or a combination of silicone, thermally conductive gel, hot melt adhesive, and UV curable adhesive. This design allows the first adhesive layer 701 to be directly formed through a dispensing process, which helps avoid the formation of a gap between the first adhesive layer 701 and the second adhesive layer 8, thereby improving the partitioning effect of the first space 5a. In addition, since the first adhesive layer 701 can be formed through a dispensing process, the shape design efficiency of the first adhesive layer 701 is improved. For example, the shape of the first adhesive layer 701 can be straight to improve installation efficiency, or it can be zigzag to avoid other components.

[0126] In some examples, the first adhesive layer 701 and the second adhesive layer 8 are separate adhesive layer structures. In other examples, the first adhesive layer 701 and the second adhesive layer 8 can be formed simultaneously using a dispensing process to form an integrated structure. In still other examples, a hole can be dug in the adhesive to form an integrated special-shaped adhesive layer according to the shape of the middle frame 3 and the position of the first through hole 301, thereby obtaining an integrated first adhesive layer 701 and second adhesive layer 8.

[0127] Please refer to Figure 2B 、 Figures 9 to 12 , Figure 9 yes Figure 2B or Figure 2C The structure diagram of the second adhesive layer 702 in the electronic device 100 in some embodiments is shown; Figure 10 yes Figure 2B or Figure 2C Schematic diagram of the structure of the second adhesive layer 702 in the electronic device 100 in other embodiments; Figure 11 yes Figure 2B or Figure 2C Schematic diagram of the structure of the second adhesive layer 702 in the electronic device 100 in some further embodiments; Figure 12 yes Figure 2B or Figure 2C The schematic diagram of the structure of the second adhesive layer 702 in the electronic device 100 in some other embodiments is shown. Figures 9 to 12 The electronic device 100 shown may include Figures 5 to 8 Some features of the electronic device 100 are shown, and the same features are not repeated here.

[0128] In some embodiments, the second adhesive layer 702 can be located between the first end 100a and the second end 100b. The second adhesive layer 702 can be a block structure as a whole, with a simple and efficient design. For example, the second adhesive layer 702 can be a circular, elliptical, polygonal, or irregular structure.

[0129] In other embodiments, the second adhesive layer 702 may include multiple block-shaped structures spaced apart from each other, thereby providing more bonding areas between the screen 1 and the middle frame 3, thereby improving the bonding stability between the screen 1 and the middle frame 3 and helping to suppress vibration of the screen 1. The shapes of the multiple block-shaped structures may be the same or different, and are not limited here.

[0130] In some other embodiments, the second adhesive layer 702 may include a plurality of spaced-apart strip structures. The provision of the strip structures can help improve the stability of the bond between the screen 1 and the middle frame 3. The plurality of strip structures may have the same or different lengths, which is not limited here.

[0131] In some other embodiments, the second adhesive layer 702 may be a bent strip structure as a whole, which can improve the stability of the bonding between the screen 1 and the middle frame 3 .

[0132] The material of the second adhesive layer 702 may be one or a combination of adhesive, silicone, thermal conductive gel, hot melt adhesive, ultraviolet curing adhesive, etc.

[0133] It should be noted that when the material of the second adhesive layer 702 is adhesive, Figures 9 to 12 The shape of the second adhesive layer 702 shown is the shape of the electronic device 100 after assembly. When the second adhesive layer 702 is prepared by the dispensing process, Figures 9 to 12 The shape of the second adhesive layer 702 shown is a schematic diagram of the dispensing path. When the electronic device 100 is assembled, the shape of the second adhesive layer 702 is different from that of the second adhesive layer 702. Figures 9 to 12 The shapes shown are subject to change.

[0134] It should be noted that Figures 9 to 12 Only some possible shapes and components of the second adhesive layer 702 are illustrated. In other embodiments, the second adhesive layer 702 may also have other shapes, include more or fewer components, etc., which is not limited here.

[0135] Please refer to Figure 2B and Figure 13 , Figure 13 yes Figure 2B or Figure 2C The second adhesive layer 702 in the electronic device 100 is a schematic diagram of the structure of bonding the screen 1 and the middle frame 3 in some embodiments. It should be noted that, Figure 13 The electronic device 100 shown may include Figures 5 to 12 Some features of the electronic device 100 are shown, and the same features are not repeated here.

[0136] In some embodiments, the material of the second adhesive layer 702 may be one or a combination of adhesive and thermal conductive gel, and the second adhesive layer 702 is directly bonded to the screen 1 .

[0137] In this embodiment, since the hardness of the thermal conductive gel after curing and the hardness of the backing glue are both relatively low, for example, the hardness is less than 0.5 MPa, when the material of the second adhesive layer 702 is a combination of one or more of the backing glue and the thermal conductive gel, the second adhesive layer 702 can be directly bonded to the screen 1 without damaging the screen 1. This design makes the setting of the second adhesive layer 702 simple and efficient, and does not occupy too much thickness space of the electronic device 100.

[0138] Please refer to Figure 2B 、 14A to 14C , Figure 14A yes Figure 2B or Figure 2C The second adhesive layer 702 in the electronic device 100 is a schematic structural diagram of bonding the screen 1 and the middle frame 3 in other embodiments; Figure 14B yes Figure 2B or Figure 2C The second adhesive layer 702 in the electronic device 100 is a schematic structural diagram of bonding the screen 1 and the middle frame 3 in some other embodiments; Figure 14C yes Figure 2B or Figure 2C The second adhesive layer 702 in the electronic device 100 is a schematic diagram of the structure of bonding the screen 1 and the middle frame 3 in some other embodiments. It should be noted that, 14A to 14C Can include Figure 13 Some features of the electronic device 100 are shown, and the same features are not repeated here.

[0139] In some embodiments, the material of the second adhesive layer 702 can be one or a combination of silicone, hot melt adhesive, UV curable adhesive, etc. The electronic device 100 can also include a film-proof indomylar 14, which is located between the screen 1 and the second adhesive layer 702, and the orthographic projection of the second adhesive layer 702 on the screen 1 falls within the film-proof indomylar 14.

[0140] In this embodiment, since silicone, hot melt adhesive, and UV curing adhesive have a relatively high hardness after curing, for example, a hardness greater than or equal to 0.5 MPa, by providing an anti-film imprinting mylar 14 between the second adhesive layer 702 and the screen 1, direct contact between the second adhesive layer 702 and the screen 1 can be avoided, thereby avoiding the generation of film imprints on the screen 1, which is beneficial to protecting the screen 1.

[0141] In order to better cover the second adhesive layer 702 with the anti-film imprint 14, the second adhesive layer 702 is designed to have a simple and regular shape, which is conducive to the arrangement of the anti-film imprint 14. For example, the second adhesive layer 702 can be designed to be an integral block.

[0142] The electronic device 100 may further include a heat spreader 13 , which is mounted on the middle frame 3 and located between the screen 1 and the middle frame 3 , for dissipating heat for other devices in the electronic device 100 .

[0143] In some examples, the vapor chamber 13 may be provided with a first groove 131 , the opening of the first groove 131 faces the screen 1 , and at least a portion of the second adhesive layer 702 is located in the first groove 131 .

[0144] In this embodiment, by designing a groove on the heat spreader 13, local thinning of the heat spreader 13 is achieved, which can overcome the problem of limited installation space for the anti-film imprint 14 due to the heat spreader 13 occupying space in the thickness direction of the electronic device 100.

[0145] In other examples, the heat spreader 13 may be provided with a first opening 132, the first opening 132 passes through the heat spreader 13 along the stacking direction of the screen 1 and the middle frame 3, at least a portion of the second adhesive layer 702 is located in the first opening 132, and the second adhesive layer 702 is directly bonded to the portion of the middle frame 3 located in the first opening 132.

[0146] In this embodiment, by designing an opening on the heat spreader 13, the heat spreader 13 is partially eliminated, so that the heat spreader 13 does not occupy the thickness space of the electronic device 100 at the first opening 132. Therefore, it can further overcome the space limitation of the anti-film imprint 14 caused by the design of the heat spreader 13.

[0147] Please refer to Figure 2B and Figure 15 , Figure 15 yes Figure 2B or Figure 2C The second adhesive layer 702 in the electronic device 100 is a schematic diagram of the structure of bonding the screen 1 and the middle frame 3 in some other embodiments. It should be noted that, Figure 15 Can include Figures 13 to 14C Some features of the electronic device 100 are shown, and the same features are not repeated here.

[0148] In some embodiments, the middle frame 3 may be provided with a second groove 302 , the opening of the second groove 302 faces the screen 1 , and at least a portion of the second adhesive layer 702 is located in the first groove 131 .

[0149] In this embodiment, by designing a groove on the middle frame 3, local thinning of the middle frame 3 is achieved, which can overcome the problem of limited space for setting the anti-film imprint 14 due to the small distance between the screen 1 and the middle frame 3, and is conducive to the setting of the anti-film imprint 14.

[0150] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the scope of protection of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0151] It should be noted that all the above drawings are for illustrative purposes only and do not represent the actual size of the product. Furthermore, the dimensional ratios between the components in the drawings are not intended to limit the actual product of the present application.

[0152] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device (100), characterized in that It comprises a middle frame (3), a screen (1), a back cover (2), a speaker (4) and a first adhesive layer (7); The screen (1) and the back cover (2) are mounted on opposite sides of the middle frame (3); the screen (1) and the middle frame (3) are arranged to form a first space (5a); the back cover (2) and the middle frame (3) are arranged to form a second space (5b); the middle frame (3) is provided with a first through hole (301); the first through hole (301) connects the first space (5a) and the second space (5b); The loudspeaker (4) is installed in the second space (5b), and the loudspeaker (4) comprises a first cavity (402) and a second cavity (403) respectively located on both sides of the diaphragm (401), the first cavity (402) being connected to the outside of the electronic device (100) through a sound outlet (6) on the electronic device (100), and the second cavity (403) being connected to the second space (5b); The electronic device (100) has a first end (100a) and a second end (100b) opposite to each other, the first through hole (301) is located at the first end (100a), and the speaker (4) is located at the first end (100a); The first adhesive layer (7) is located on a side of the first through hole (301) close to the second end portion (100b), and is bonded between the screen (1) and the middle frame (3).

2. The electronic device (100) according to claim 1, characterized in that The electronic device (100) further comprises a second adhesive layer (8), the second adhesive layer (8) bonding the middle frame (3) and the screen (1), and extending along the circumference of the middle frame (3), the second adhesive layer (8) comprising a first edge (801), a second edge (802), a third edge (803), and a fourth edge (804) connected end to end in sequence, the first edge (801) and the third edge (803) being arranged oppositely in a first direction (D1), the second edge (802) and the fourth edge (804) being arranged oppositely in a second direction (D2), the second direction (D2) intersecting the first direction (D1), the first edge (801) being located at a first end portion (100a) of the electronic device (100), and being located on both sides of the first through hole (301) together with the first adhesive layer (701); The first adhesive layer (7) comprises a first adhesive layer (701), at least a portion of the first adhesive layer (701) extends along the second direction (D2).

3. The electronic device (100) according to claim 2, characterized in that A first gap (9) exists between the first adhesive layer (701) and the second edge (802), the first gap (9) has a first size (l1) along the first direction (D1), the first gap (9) has a second size (d1) along the second direction (D2), and a ratio of the first size (l1) to the second size (d1) is greater than or equal to 10:1; And / or, a second gap (10) exists between the first adhesive layer (701) and the fourth edge (804), the second gap (10) has a third size (l2) along the first direction (D1), the second gap (10) has a fourth size (d2) along the second direction (D2), and the ratio of the third size (l2) to the fourth size (d2) is greater than or equal to 10:

1.

4. The electronic device (100) according to claim 2, characterized in that A first gap (9) exists between the first adhesive layer (701) and the second edge (802), and the electronic device (100) further comprises a first sealing strip (11), the first sealing strip (11) filling the first gap (9) and bonding the first adhesive layer (701) and the second edge (802); And / or, a second gap (10) exists between the second adhesive layer (702) and the fourth edge (804), and the electronic device (100) further includes a second sealing strip (12), the second sealing strip (12) fills the second gap (10) and bonds the first adhesive layer (701) and the fourth edge (804).

5. The electronic device (100) according to claim 3 or 4, characterized in that The first adhesive layer (701) comprises a first portion (701a), a second portion (701b) and a third portion (701c) connected in sequence, the first portion (701a) of the first adhesive layer (701) and the third portion (701c) of the first adhesive layer (701) being arranged opposite to each other, and the first portion (701a) of the first adhesive layer (701) is closer to the second edge (802) than the third portion (701c) of the first adhesive layer (701); The second portion (701b) of the first adhesive layer (701) extends along the second direction (D2), and the first portion (701a) of the first adhesive layer (701) and the third portion (701c) of the first adhesive layer (701) both extend along the first direction (D1); The first gap (9) exists between the first portion (701a) of the first adhesive layer (701) and the second edge (802); And / or, the second gap (10) exists between the third portion (701c) of the first adhesive layer (701) and the fourth edge (804).

6. The electronic device (100) according to claim 4 or 5, characterized in that The material of the first adhesive layer (701) is different from the material of the first sealing strip (11) and the material of the second sealing strip (12).

7. The electronic device (100) according to any one of claims 4 to 6, characterized in that The surface of the first adhesive layer (701) is smoother than the surface of the first sealing strip (11) and the surface of the second sealing strip (12).

8. The electronic device (100) according to any one of claims 3 to 7, characterized in that The material of the first adhesive layer (701) is adhesive backing.

9. The electronic device (100) according to any one of claims 4 to 7, characterized in that The material of the first sealing strip (11) is one or a combination of silicone, thermal conductive gel, hot melt adhesive, and ultraviolet curing adhesive; And / or, the material of the second sealing strip (12) is one or a combination of silicone, thermal conductive gel, hot melt adhesive, and ultraviolet curing adhesive.

10. The electronic device (100) according to claim 2, characterized in that The first adhesive layer (701) is directly bonded to the second edge (802) and the fourth edge (804).

11. The electronic device (100) according to claim 10, characterized in that The material of the first adhesive layer (701) is one or a combination of silicone, thermal conductive gel, hot melt adhesive, and ultraviolet curing adhesive.

12. The electronic device (100) according to any one of claims 1 to 11, characterized in that The first adhesive layer (7) includes a second adhesive layer (702), and the second adhesive layer (702) is located between the first end portion (100a) and the second end portion (100b); The material of the second adhesive layer (702) is one or more of adhesive and thermal conductive gel, and the second adhesive layer (702) is directly bonded to the screen (1).

13. The electronic device (100) according to any one of claims 1 to 11, characterized in that The first adhesive layer (7) includes a second adhesive layer (702), and the second adhesive layer (702) is located between the first end portion (100a) and the second end portion (100b); The material of the second adhesive layer (702) is one or a combination of silicone, hot melt adhesive, and ultraviolet curing adhesive; The electronic device (100) further comprises a film-proof imprint (14), wherein the film-proof imprint (14) is located between the screen (1) and the second adhesive layer (702), and the orthographic projection of the second adhesive layer (702) on the screen (1) falls within the film-proof imprint (14).

14. The electronic device (100) according to claim 13, characterized in that The electronic device (100) further comprises a heat spreader (13), wherein the heat spreader (13) is mounted on the middle frame (3) and is located between the screen (1) and the middle frame (3); The second adhesive layer (702) is bonded between the heat spreader (13) and the film-proof imprint (14).

15. The electronic device (100) according to claim 14, characterized in that The heat spreader (13) is provided with a first groove (131), and the opening of the first groove (131) faces the screen (1); At least a portion of the second adhesive layer (702) is located in the first groove (131).

16. The electronic device (100) according to claim 13, characterized in that The electronic device (100) further comprises a heat spreader (13), wherein the heat spreader (13) is mounted on the middle frame (3) and is located between the screen (1) and the middle frame (3); The heat spreader (13) is provided with a first opening (132), and the first opening (132) passes through the heat spreader (13) along the stacking direction of the screen (1) and the middle frame (3), at least a portion of the second adhesive layer (702) is located in the first opening (132), and the second adhesive layer (702) is directly bonded to the portion of the middle frame (3) located in the first opening (132).

17. The electronic device (100) according to any one of claims 12 to 16, characterized in that: The second adhesive layer (702) is a block-shaped structure as a whole; Alternatively, the second adhesive layer (702) includes a plurality of block structures arranged at intervals; Alternatively, the second adhesive layer (702) includes a plurality of strip structures arranged at intervals; Alternatively, the second adhesive layer (702) is a bent strip structure as a whole.

18. The electronic device (100) according to any one of claims 12 to 17, characterized in that When the first adhesive layer (7) includes a first adhesive layer (701), the second adhesive layer (702) is closer to the center of the screen (1) than the first adhesive layer (701).

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