Sound channel structure and antenna module

Abstract

The invention discloses a sound channel structure and an antenna module. The sound channel structure comprises an audio module, an antenna module and an equipment shell, the audio module comprises a main channel, a through hole corresponding to the main channel is formed in the equipment shell, the main channel and the through hole form a sound channel used for transmitting sound signals, and the antenna module is arranged between the audio module and the equipment shell and does not influence communication of the sound channel. The antenna module and the equipment shell as well as the antenna module and the audio module are sealed, so that sound leakage from gaps among the audio module, the antenna module and the equipment shell when a sound signal is transmitted to the sound channel is prevented; the antenna module comprises a conducting layer, the conducting layer comprises a plurality of independent conducting parts, and filling parts consistent with the conducting parts in thickness are arranged in the remaining space, except the conducting parts, on the conducting layer of the antenna module. According to the invention, sound can be prevented from leaking from gaps among the audio module, the antenna module and the equipment shell when passing through the sound channel.

Description

Technical Field

[0001] The present invention relates to the field of mobile communication technology, and in particular to a sound channel structure and an antenna module. Background Art

[0002] With increasingly fierce competition in the consumer electronics market and increasingly stringent customer requirements for products, such as IP69 protection, the demand for excellence in all areas is becoming increasingly extreme. This creates compatibility issues between the functional requirements of antenna modules in electronic products and the airtightness requirements of audio modules. While placing the antenna module in the audio module's sound channel meets the product's antenna functional requirements, the sound channel is prone to airtightness issues, resulting in sound leakage, creating a significant conflict between these two requirements. Summary of the Invention

[0003] The present invention provides a sound channel structure and an antenna module, which are used to solve the problem that when the antenna module is arranged at the sound channel of the audio module, the audio module is prone to airtightness problems and thus sound leakage.

[0004] The present invention provides a sound channel structure, including: an audio module, an antenna module, and a device housing. The audio module includes a main channel. The device housing is provided with a through hole corresponding to the main channel. The main channel and the through hole form a sound channel for transmitting sound signals. The antenna module is arranged between the audio module and the device housing and does not affect the penetration of the sound channel. The antenna module and the device housing, as well as the antenna module and the audio module, are sealed to prevent sound signals from leaking from the gap between the audio module, the antenna module, and the device housing when the sound signal is transmitted to the sound channel.

[0005] Furthermore, it also includes a sealing member, the antenna module adopts an FPC antenna, the FPC antenna includes a flexible surface and a radiating surface, the radiating surface of the FPC antenna is in contact with the device housing through the sealing member, and the FPC antenna is in contact with the audio module through the flexible surface, and the device housing is used to achieve sealing between the audio module, the antenna module and the device housing by elastically compressing the sealing member and the flexible surface when pressure is applied to the sealing member.

[0006] Furthermore, a sticky material is provided on the flexible surface, and the flexible surface is sealed and fixedly connected to the audio module through the sticky material.

[0007] Furthermore, the sealing element includes sealing foam.

[0008] Furthermore, the audio module includes a microphone.

[0009] The present invention also provides an antenna module for the sound channel structure, the antenna module includes a conductive layer, the conductive layer includes multiple independent conductive parts, and the remaining space on the conductive layer of the antenna module except the conductive parts is provided with a filling part with the same thickness as the conductive part.

[0010] Furthermore, the conductive portion and the filling portion are both made of the same material, and the conductive portion and the filling portion are infinitely close to each other but not in contact with each other, so as to avoid the filling portion affecting the conductive portion.

[0011] Furthermore, the conductive portion and the filling portion are both made of copper foil material, and the surface of the conductive layer is coated with a protective layer with insulating properties.

[0012] The present invention also provides a method for designing the conductive layer of the antenna module, characterized by comprising the following steps:

[0013] S01. Designing the layout position of the conductive portion on the conductive layer according to antenna performance requirements;

[0014] S02. Designing a filling portion according to the remaining space on the conductive layer except the conductive portion.

[0015] The present invention also provides a method for processing the conductive layer of the antenna module, comprising: synchronously forming the conductive portion and the filling portion using the same process.

[0016] It can be seen from the above technical solutions that the present invention has the following advantages:

[0017] On the one hand, the present invention seals the audio module and the device casing on both sides of the antenna module, so that when the antenna module is set at the sound channel of the audio module, it can prevent sound from leaking from the gap between the audio module, the antenna module and the device casing during the process of passing through the sound channel. While meeting the functional requirements of the antenna module in the electronic device, it does not affect the airtightness requirements of the audio module.

[0018] On the other hand, the present invention can alleviate the thickness difference of the antenna module caused by the lack of the conductive part in the remaining space of the conductive layer due to the provision of a filling part with the same thickness as the conductive part, reduce the sealing gap caused by the thickness difference of the antenna module, and prevent sound leakage through the sound channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of a sound channel structure provided by an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of the conductive layer structure of an antenna module provided by an embodiment of the present invention;

[0022] Figure 3 Schematic diagram of the sealing between the sealing member and the antenna module provided by an embodiment of the present invention (excluding the filling portion)

[0023] Figure 4 A schematic diagram of the sealing between the sealing member and the antenna module provided in an embodiment of the present invention (including the filling portion);

[0024] Figure 5 A schematic diagram of the internal structure of an antenna module provided by an embodiment of the present invention;

[0025] Figure 6 This is a comparison data chart of the air tightness test of an audio module provided by an embodiment of the present invention.

[0026] Explanation of the accompanying drawings: 1. Microphone; 11. Main channel; 2. FPC antenna; 21. Protective layer; 22. Conductive layer; 221. Conductive part; 222. Filling part; 223. Remaining space; 23. Base material; 231. AD glue; 232. PI layer; 233. 3M glue; 234. Release paper; 3. Device housing; 31. Through hole; 4. Sealing foam; 5. Through hole. DETAILED DESCRIPTION

[0027] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] The terms "first," "second," "third," "fourth," and so forth (if any) in the description and drawings of the present invention are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that, for example, the implementation of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product, or apparatus.

[0029] See also Figure 1 , Figure 1 A sound channel structure is provided in an embodiment of the present invention.

[0030] A sound channel structure provided by an embodiment of the present invention includes: an audio module, an antenna module, and a device housing 3. The audio module includes a main channel 11. A through hole 31 corresponding to the main channel 11 is opened on the device housing 3. The main channel 11 and the through hole 31 form a sound channel for transmitting sound signals. The antenna module is arranged between the audio module and the device housing 3 and does not affect the penetration of the sound channel. The antenna module and the device housing 3, as well as the antenna module and the audio module, are sealed to prevent sound signals from leaking from the gap between the audio module, the antenna module and the device housing 3 when passing through the sound channel.

[0031] It can be understood that, in a specific implementation, by sealing the two sides of the antenna module with the audio module and the device housing 3 respectively, when the antenna module is set at the sound channel, it is possible to prevent sound from leaking from the gap between the audio module, the antenna module and the device housing 3 during the process of passing through the sound channel, while meeting the functional requirements of the antenna module in the electronic device, without affecting the airtightness requirements of the audio module.

[0032] In a more specific embodiment, a seal is also included. The antenna module adopts an FPC antenna 2, which includes a flexible surface and a radiating surface. The radiating surface of the FPC antenna 2 is abutted against the device housing 3 through a seal. The FPC antenna 2 is abutted against the audio module through a flexible surface. The device housing 3 is used to achieve sealing between the audio module, the antenna module and the device housing 3 by elastically compressing the seal and the flexible surface when pressure is applied to the seal.

[0033] It can be understood that, in a specific implementation, under the pressure of the device housing 3, the seal and the flexible surface are elastically compressed, the FPC antenna 2 is sealed and abutted against the audio module through its flexible surface, and the radiation surface of the FPC antenna 2 is sealed and abutted against the device housing 3 through the seal. The elastic deformation characteristics of the flexible surface formed by the substrate 23 of the FPC antenna 2 can fit tightly against the surface of the audio module during assembly. The direct contact interface formed by this adaptability can effectively prevent sound leakage, thereby eliminating the need for additional sealing parts for sealing, simplifying the overall structure, and freeing up valuable space inside the device, which is particularly beneficial for modern electronic products that pursue extreme lightness and miniaturization.

[0034] In a more specific embodiment, the antenna module and the seal are arranged between the device housing 3 and the audio module. In order to avoid the antenna module and the seal blocking the sound signal from propagating in the sound channel, the antenna module and the seal are provided with through holes at positions corresponding to the sound channel. When sealing is achieved between the audio module, the antenna module, the seal and the device housing 3, the main channel 11 of the audio module, the through hole 5 of the antenna module and the seal, and the through hole 31 of the device housing 3 are connected to form a sound channel.

[0035] In a more specific embodiment, an adhesive material is provided on the flexible surface, and the flexible surface is sealed and fixedly connected to the audio module through the adhesive material.

[0036] It can be understood that, in a specific implementation, when the flexible surface of the FPC antenna 2 is tightly attached to the surface of the audio module through the adhesive material, it not only ensures the sealing between the audio module and the FPC antenna 2, but also can firmly stick the FPC antenna 2 to the audio module, so that the FPC antenna 2 is fixed to the end face of the audio module, creating convenient conditions for the subsequent installation of the seal and the device housing 3, without the need to further adjust the position of the FPC antenna 2, thereby improving the assembly efficiency and the sealing reliability of the sound channel structure.

[0037] In a more specific embodiment, the sealing member includes sealing foam 4 .

[0038] It can be understood that, in specific implementation, based on the elastic deformation ability and pore structure characteristics of the sealing foam 4, the gap is filled under external pressure and a physical barrier is formed to prevent sound leakage. Specifically, the sound wave energy is absorbed by the porous structure inside the sealing foam 4, and the gap is filled with elastic material to form a physical sealing barrier. The transmission of solid vibration is suppressed with the help of viscoelasticity. At the same time, the air layer formed by the closed-cell structure buffers the sound bridge effect, preventing sound leakage from multiple dimensions such as sound energy absorption, path blocking, vibration damping and sound bridge buffering.

[0039] In a more specific embodiment, the audio module includes a microphone 1 .

[0040] It is understood that, in specific implementations, microphone 1 and FPC antenna 2 are both positioned close to device housing 3 to enhance sound reception and signal quality. Microphone 1's proximity to device housing 3 effectively reduces sound loss and interference during internal transmission, quickly capturing external sound signals and ensuring high-fidelity sound recording. FPC antenna 2's proximity to the housing reduces shielding and interference from electromagnetic signals caused by metal and circuitry within the device, fully utilizing the open space to enhance signal reception and transmission capabilities, ensuring the stability and efficiency of the wireless connection. This significantly improves sound reception and signal quality, providing users with a smooth audio and network experience.

[0041] It should be noted that the FPC antenna 2 is first adhered to the outer wall surface at the outlet of the main channel 11 of the microphone 1, the sealing foam 4 is installed to the outside of the FPC antenna 2, and the device housing 3 is installed. Pressure is applied to the sealing foam 4 through the device housing 3 to achieve sealing between the microphone 1 and the FPC antenna 2 and between the FPC antenna 2 and the device housing 3.

[0042] In a more specific embodiment, the sound channel structure of this embodiment is installed on a mobile phone product, and the microphone 1 and the FPC antenna 2 are both arranged at the bottom of the mobile phone product. Figure 1 As shown, Figure 1 This is a schematic diagram of the internal structure of a mobile phone after cutting open, showing the assembly structure of the microphone 1, FPC antenna 2, sealing foam 4, and the bottom shell. It is understandable that in specific implementations, first, when users hold a mobile phone, their palms typically naturally grip the middle or upper middle portion of the phone. If the antenna is placed at the top or middle, it is easily blocked by the palm, resulting in signal attenuation. Positioning the bottom away from the grip area reduces signal shielding by the human body, ensuring stable calls and network connections. Second, the top of the phone often integrates components such as the camera and earpiece, while the middle contains large metal components such as the motherboard and battery. These can generate electromagnetic interference with the antenna signal. The bottom space is relatively "clean," reducing metal shielding and improving antenna efficiency. Third, when the user is talking, the bottom of the phone is close to the mouth, allowing microphone 1 to pick up the human voice more directly, reducing sound transmission distance and loss, and improving call clarity.

[0043] It should be noted that the FPC antenna 2 is arranged between the device housing 3 and the microphone 1. The FPC antenna 2 is arranged closer to the device housing 3, which can shorten the transmission path of the signal to the outside world, reduce the reflection and absorption of electromagnetic waves by internal components of the body, and improve the radiation efficiency of the antenna.

[0044] It should be noted that the working principle of microphone 1 is: when people speak, sound waves of different frequencies are generated. The through hole 31 at the bottom of the mobile phone case is the sound entry channel for the sound waves. After the sound waves enter the main channel 11 of microphone 1 through through hole 31 and reach the inside of microphone 1, the change in air pressure drives the diaphragm to produce mechanical vibrations. Microphone 1 converts the mechanical vibration signal into an electrical signal to realize sound collection.

[0045] In a more specific embodiment, the FPC antenna 2 and the sealing foam 4 are arranged between the mobile phone housing and the microphone 1. In order to prevent the FPC antenna 2 and the sealing foam 4 from blocking the propagation of the sound signal in the sound channel, the FPC antenna 2 and the sealing foam 4 are provided with a through hole 5 at a position corresponding to the sound channel. When sealing is achieved between the microphone 1, the FPC antenna 2, the sealing foam 4 and the device housing 3, the main channel 11 of the microphone 1, the through hole 5 of the FPC antenna 2 and the sealing foam 4, and the through hole 31 of the device housing 3 are connected to form a sound channel.

[0046] It should be noted that when the sound signal of this embodiment is transmitted to the sound channel, it passes through the through hole 31 of the mobile phone case, the through hole 5 of the FPC antenna 2 and the sealing foam 4, and the main channel 11 of the microphone 1 in sequence. If there is a gap between the FPC antenna 2 and the microphone 1 and the device case 3 and no sealing is achieved, when the sound signal is transmitted to the sound channel, sound will leak from the gap, generating noise, affecting the sound reception quality, and making the final collected sound unclear and distorted.

[0047] In a more specific embodiment, Figure 5 As shown, the FPC antenna 2 includes a substrate 23, a conductive layer 22, and a protective layer 21. The surface of the substrate 23 of the FPC antenna 2 is a flexible surface, and the surface of the protective layer 21 of the FPC antenna 2 is a radiating surface. The protective layer 21 includes an oil layer, the conductive layer 22 includes copper foil, and the substrate 23 includes AD glue 231, PI layer 232, 3MM glue, and release paper 234.

[0048] Oil layer: Matte gray oil is applied to insulate the internal circuitry from environmental influences (such as moisture and dust), preventing copper foil oxidation and short circuits. It also enhances the antenna's corrosion resistance and mechanical wear resistance. In FPC production, some coatings may aid in lamination or etching processes, ensuring precise formation of the copper foil pattern. The oil layer thickness is 18µm. Epoxy resin-based insulating matte gray oil, for example, offers a dense, cured film with a high breakdown voltage (up to tens of kilovolts), effectively isolating the current.

[0049] Copper foil: A conductive material, the copper foil forms the conductive layer 22 of the FPC antenna 2 and is used to form the antenna's radiating elements, feeder lines, and other circuit structures. It transmits and receives electromagnetic signals (such as those in WiFi, Bluetooth, and 5G frequency bands) through current conduction. The thickness (e.g., 18μm, 35μm) and purity of the copper foil directly affect the antenna's conductivity, signal loss, and mechanical flexibility. Thinner copper foil is more suitable for flexible bending scenarios. The copper foil thickness in this embodiment of the present invention is 18μm.

[0050] AD glue 231: Acrylic adhesive, used to bond copper foil and PI layer, provides strong adhesion to ensure that the layers do not separate during flexible bending. It also has temperature resistance (such as resistance to high welding temperatures) and aging resistance to maintain structural stability for long-term use. Some AD glues also have insulating properties to prevent leakage between the copper foil and PI layer, while buffering mechanical stress and reducing material damage during bending.

[0051] PI layer 232: Polyimide, the substrate material for FPCs, offers excellent flexibility (able to be bent over 100,000 times) and high-temperature resistance (long-term temperature resistance ≥ 200°C). It provides a flexible support structure for the antenna, enabling it to adapt to complex installation scenarios such as curved and folded surfaces. PI's stable dielectric constant reduces signal transmission losses and acts as an insulating layer to isolate the copper foil from other layers, ensuring circuit safety.

[0052] 3M adhesive 233: Pressure-sensitive adhesive, such as 3M double-sided tape, is used to attach the FPC antenna to the device housing, motherboard, or other components. It provides adjustable stickiness (some 3M adhesives support repeated attachment), facilitating assembly and maintenance. The elastic material of 3M adhesive absorbs vibrations during device operation, preventing mechanical stress on the antenna that could cause solder joints to fall off or structural damage.

[0053] Release paper 234: covers the surface of the 3M adhesive to prevent the adhesive from adhering to impurities or losing its stickiness during transportation and processing. When in use, the release paper 234 can be torn off to expose the sticky surface, which facilitates antenna installation.

[0054] The total thickness of the FPC antenna 2 product (excluding release tape) of the embodiment of the present invention is approximately 0.12 mm.

[0055] It should be noted that the provision of PI layer 232 creates a flexible structure, making the contact surface between FPC antenna 2 and the outer wall of microphone 1 a flexible surface. When FPC antenna 2 contacts microphone 1, PI layer 232 can elastically deform to help seal the gap between FPC antenna 2 and microphone 1. The provision of 3M adhesive 233 creates adhesiveness, making the flexible surface sticky, allowing FPC antenna 2 to be fixed to the outer wall of microphone 1 and further enhancing the sealing performance. FPC antenna 2 achieves radiation based on the copper foil of conductive layer 22. Therefore, the conductive layer 22 of FPC antenna 2 must be placed close to device housing 3, and the contact surface between FPC antenna 2 and sealing foam 4 is the radiating surface.

[0056] It should be noted that if Figure 2-Figure 3 As shown, different products have different requirements for the functions and performance of antenna modules. In actual practice, the routing of the FPC antenna 2 is arranged according to the functions and performance requirements of the antenna module. Therefore, the conductive layer 22 of the FPC antenna 2 is provided with a conductive portion 221 (copper foil). The remaining space 223 outside the conductive portion 221 does not have copper foil, resulting in the thickness of the FPC antenna 2 being 18um less in the area without copper foil. The radiating surface of the FPC antenna 2 has a height difference. The inventors have found that in specific implementations, due to this 18um height difference, when the FPC antenna 2 contacts the sealing foam 4, a gap is created between the sealing foam 4 and the radiating surface of the FPC antenna 2 to leak sound. Figure 3 The thickness difference of the copper foil layer T=18um causes a certain fault in the FPC antenna 2 itself. Figure 2 and Figure 3 It is shown that there is a large space between different conductive parts 221, resulting in a large gap between the PPC antenna and the sealing foam 4. The gap cannot be completely sealed, so that the sealing foam 4 and the antenna body are completely closed, resulting in poor airtightness.

[0057] In existing technology, the conductive layer 22 in the airtight sealing area of ​​microphone 1 corresponding to FPC antenna 2 is either completely covered with copper foil or completely free of copper foil to meet the airtightness requirements of microphone 1. This complete or complete absence of copper foil ensures a smooth contact surface between FPC antenna 2 and sealing foam 4, ensuring airtightness. The significant difference between antenna routing and no antenna routing lies in the presence or absence of conductive layer 22, and therefore copper foil. This significantly restricts antenna routing. While addressing the airtightness issues of microphone 1, these existing solutions cannot flexibly arrange copper foil based on the actual needs and performance requirements of the antenna module. Consequently, there is a significant conflict between antenna performance and airtightness requirements.

[0058] In view of the above problems, an embodiment of the present invention provides an antenna module for the sound channel structure of any of the above embodiments, such as Figure 2-Figure 4 As shown, the antenna module includes a conductive layer 22 , which includes a plurality of independent conductive parts 221 . The conductive layer 22 of the antenna module is provided with a filling part 222 having the same thickness as the conductive part 221 except for the conductive part 221 .

[0059] It can be understood that, in specific implementation, this embodiment provides a filling portion 222 having the same thickness as the conductive portion 221 in the remaining space 223 of the conductive layer 22 except the conductive portion 221, thereby alleviating the thickness difference of the antenna module caused by the absence of the conductive portion 221 in the remaining space 223, reducing the sealing gap caused by the thickness difference of the antenna module, and preventing sound leakage through the sound channel.

[0060] It should be noted that, since the conductive portion 221 of the conductive layer 22 has a certain thickness, the conductive portion 221 is not provided in the remaining space 223 of the conductive layer 22 except the conductive portion 221, resulting in a thickness difference in the FPC antenna 2. When the sealing foam 4 contacts the FPC antenna 2, the thickness difference causes a contact gap between the sealing foam 4 and the FPC antenna 2. In this embodiment, a filling portion 222 with the same thickness as the conductive portion 221 is provided in the remaining space 223 of the conductive layer 22 except the conductive portion 221, thereby alleviating the thickness difference and ensuring close contact between the FPC antenna 2 and the sealing foam 4, thereby preventing sound leakage.

[0061] In a more specific embodiment, the conductive portion 221 and the filling portion 222 are both made of the same material, and the conductive portion 221 and the filling portion 222 are infinitely close to each other but not in contact with each other.

[0062] It can be understood that, in specific implementation, the same material is used for preparation, and there is no need to use other materials, which saves additional material procurement costs. At the same time, since the materials of the conductive part 221 and the filling part 222 are both conductive, the conductive part 221 and the filling part 222 are infinitely close but not fitted, which can avoid the filling part 222 affecting the conductive part 221.

[0063] In a more specific embodiment, the conductive portion 221 and the filling portion 222 are both made of copper foil material, and the surface of the conductive layer 22 is coated with a protective layer 21 having insulating properties.

[0064] It is understandable that, in specific implementation, copper foil has low cost and good conductivity, but copper is easily oxidized, and an insulating protective layer needs to be provided on the surface to protect the conductive layer 22 to prevent oxidation from affecting the insulation of the gap between the conductive part 221 and the filling part 222.

[0065] It should be noted that, in the specific implementation, the structural design of the electronic device does not completely seal the FPC antenna 2 with the microphone 1 and device housing 3. Only specific areas require sealing. This sealed area is located around the sound path. Sealing this gap prevents sound leakage and improves the quality of microphone 1's reception.

[0066] Therefore, the embodiment of the present invention divides the FPC antenna into regions according to the sealing area of ​​the microphone 1 while ensuring that the routing design of the antenna FPC antenna 2 remains unchanged. Figure 3 and Figure 4 As shown, in the FPC antenna portion corresponding to the sealing area, adding a spacer copper foil design in the copper foil-free area will minimize the 18um thickness difference caused by the lack of copper foil in the remaining space 223 on the conductive layer 22. Figure 5 As shown, the copper foil layer is located in the middle of the entire FPC, so the actual difference is very small. This design ensures that the antenna performance design is not affected while also meeting the airtightness requirements of the microphone 1.

[0067] An embodiment of the present invention further provides a design method for the conductive layer 22 of the antenna module of any of the above embodiments, comprising the following steps:

[0068] S01. Design the conductive portion 221 (antenna routing): Design the layout position of the conductive portion 221 on the conductive layer 22 based on antenna performance requirements;

[0069] S02 , designing a filling portion 222 (spacer copper foil): designing a filling portion 222 in the remaining space 223 on the conductive layer 22 except for the conductive portion 221 .

[0070] It is understandable that, in a specific implementation, the routing of the conductive portion 221 is no longer restricted by the airtightness of the sound channel, and the conductive portion 221 can be positioned on the conductive layer 22 according to the routing method with the best performance.

[0071] In a more specific implementation example, designing the filling portion 222 includes designing the shape and plane size of the filling portion 222 .

[0072] An embodiment of the present invention further provides a method for processing the conductive layer 22 of the antenna module according to any of the above embodiments, wherein the conductive portion 221 and the filling portion 222 are formed simultaneously using the same process.

[0073] It can be understood that, in a specific implementation, since the conductive part 221 and the filling part 222 are made of the same material, the conductive part 221 and the filling part 222 can be processed and formed simultaneously at one time using the same process, and the two are prepared in the same process, without the need to set up additional molding processes for the conductive part 221 and the filling, which increases additional processing costs.

[0074] In a more specific embodiment, this embodiment provides a processing technology for the antenna module conductive layer 22 , which is used to illustrate the processing method of the antenna module conductive layer 22 , but does not limit the processing method of the antenna module conductive layer 22 of the present invention.

[0075] The processing of FPC antenna copper foil requires chemical cleaning and surface activation pretreatment of the substrate 23 to remove the oxide layer and enhance the bonding strength with the substrate 23. Then, through a pattern transfer process involving photoresist coating, exposure, and development, the antenna circuit (conductive portion 221 and filler portion 222) design is transferred to the copper foil surface. The copper foil is then etched using a wet or dry etching process to form the antenna circuit. The wet method requires controlling the etching solution temperature and spray pressure to reduce side etching, while the dry method is suitable for high-precision scenarios. After etching, surface treatment such as anti-oxidation, nickel-gold immersion, or chemical silver immersion is performed to optimize electrical performance and reliability. PI or PET cover film is then applied through hot pressing to protect the circuit and enhance flexibility, and reinforcement plates are attached to stress concentration areas. Finally, the antenna shape is processed by laser cutting or 3D molding through processes such as hot pressing, depending on the needs. During the process, the accuracy, stress, and high-frequency performance of key links must be strictly controlled to ensure the electrical performance and mechanical reliability of the antenna.

[0076] In a more specific embodiment, based on Figure 1 The sound channel structure and Figure 2 The FPC antenna 2 conductive layer 22 structure is set for the airtightness comparison test of the microphone 1.

[0077] Test preparation: This includes a high-precision audio signal generator, audio analyzer, and test fixtures to ensure that the equipment is in good performance and calibrated. The device to be tested is installed on the test fixture, ensuring it is securely mounted and correctly connected to avoid any issues affecting the test results. The audio signal generator's output frequency is set to 200Hz, 4000Hz, and 6300Hz, respectively, and the output signal strength is adjusted to an appropriate level.

[0078] Test steps: With the audio signal generator unblocked, output audio signals at 200Hz, 4000Hz, and 6300Hz, respectively. Use an audio analyzer to measure the output signal strength of microphone 1 at each frequency and record the raw data. Process the raw data and, according to the test requirements, deduct 30dB from the raw data in the unblocked state to obtain the final test data.

[0079] Test results: Figure 6 As shown, in both the fully sealed solution (conductive layer 22 completely covered with copper foil) and the antenna plus copper foil spacing solution (conductive layer 22 provided with a conductive portion 221 and a filling portion 222, both of which are copper foil), the test data of microphone 1 at frequencies of 200Hz, 4000Hz, and 6300Hz, after deducting 30dB, were all within the 30-60dB range, exceeding the 30dB threshold, indicating good airtightness. However, in the antenna without copper foil spacing solution (conductive layer 22 provided with only the conductive portion 221, which is copper foil), the test data were below 30dB, indicating poor airtightness. Therefore, the antenna plus copper foil spacing solution of this embodiment meets both the performance requirements of FPC antenna 2 and the airtightness requirements of microphone 1.

[0080] At the same time, since only very small copper foil gaps are added between the conductive parts 221 , this does not affect the performance of the antenna. The data comparison is shown in Table 1.

[0081] Table 1 Comparison of natural performance

[0082]

[0083] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A sound channel structure, characterized in that: include: An audio module, an antenna module, and a device housing. The audio module includes a main channel. A through hole corresponding to the main channel is provided on the device housing. The main channel and the through hole form a sound channel for transmitting sound signals. The antenna module is arranged between the audio module and the device housing and does not affect the penetration of the sound channel. The antenna module and the device housing, as well as the antenna module and the audio module, are sealed to prevent sound signals from leaking from the gap between the audio module, the antenna module, and the device housing when the sound signal is transmitted to the sound signal channel.

2. A sound channel structure according to claim 1, characterized in that: It also includes a sealing member, and the antenna module adopts an FPC antenna, which includes a flexible surface and a radiating surface. The radiating surface of the FPC antenna is in contact with the device housing through the sealing member, and the FPC antenna is in contact with the audio module through the flexible surface. When pressure is applied to the sealing member, the sealing member and the flexible surface are elastically compressed to achieve sealing between the audio module, the antenna module and the device housing.

3. A sound channel structure according to claim 2, characterized in that: The flexible surface is provided with a sticky material, and the flexible surface is sealed and fixedly connected to the audio module through the sticky material.

4. A sound channel structure according to claim 2 or 3, characterized in that: The sealing element includes sealing foam.

5. A sound channel structure according to claim 4, characterized in that: The audio module includes a microphone.

6. An antenna module for the sound channel structure according to any one of claims 1 to 5, characterized in that: The antenna module includes a conductive layer, which includes a plurality of independent conductive parts. A filling part having the same thickness as the conductive part is provided in the remaining space on the conductive layer of the antenna module except for the conductive parts.

7. The antenna module according to claim 6, characterized in that: The conductive part and the filling part are both made of the same material. The conductive part and the filling part are infinitely close to each other but not in contact with each other, so as to avoid the filling part affecting the conductive part.

8. The antenna module according to claim 7, characterized in that: The conductive portion and the filling portion are both made of copper foil material, and the surface of the conductive layer is coated with a protective layer with insulating properties.

9. A method for designing a conductive layer of the antenna module according to any one of claims 6 to 8, characterized in that: The following steps are involved: S01. Designing the layout position of the conductive portion on the conductive layer according to antenna performance requirements; S02. Designing a filling portion according to the remaining space on the conductive layer except the conductive portion.

10. A method for processing the conductive layer of the antenna module according to claim 7 or 8, characterized in that: The conductive part and the filling part are formed simultaneously using the same process.

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