PCB and sensor

Abstract

The invention discloses a PCB and a sensor, and relates to the technical field of sensors, the PCB is used for installing a sensing assembly of the sensor, the PCB comprises a plurality of bonding pads, each bonding pad is provided with an installation position, the installation positions are used for installing the sensing assembly, the bonding pads are sequentially arranged in the preset direction, any two adjacent bonding pads are connected through a connecting part, and the bonding pads are arranged in the preset direction. The connecting part is provided with a cutting line and a cutting groove, and the cutting groove is located in the extending direction of the cutting line. According to the technical scheme provided by the invention, the plurality of bonding pads are arranged in the PCB, any two adjacent bonding pads are connected through the connecting part, the connecting part is provided with the cutting line and the cutting groove, and the cutting groove is located in the extension direction of the cutting line; according to the utility model, the cutting groove is arranged on the connecting part, so that the cutting groove can occupy the distance of part of the connecting part, the cutting distance of a machine is shortened, and the time for the machine to vibrate the PCB is shortened, thereby preventing the sensing assembly mounted on the PCB from bearing too long-time vibration, and reducing the defective rate of the sensor.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a PCB board and a sensor. Background Art

[0002] A sensor is a detection device that senses measured information and, according to a specific pattern, converts it into an electrical signal or other desired information output format to meet requirements for information transmission, processing, storage, display, recording, and control. Conventional PCBs in sensors are typically cut from a larger PCB to the required sensor area. Because some sensors contain fragile components, the prolonged vibration generated by cutting the PCBs containing these components can easily shatter them, resulting in defective products. Summary of the Invention

[0003] The main purpose of the present invention is to provide a PCB board and a sensor, aiming to reduce the defective rate of the sensor.

[0004] To achieve the above-mentioned purpose, the PCB board proposed in the present invention is used to install the sensing component of the sensor. The PCB board includes: multiple solder pads, each of the solder pads has an installation position, and the installation position is used to install the sensing component. The multiple solder pads are arranged in sequence along a preset direction, and any two adjacent solder pads are connected by a connecting portion. The connecting portion is provided with a cutting line and a cutting groove, and the cutting groove is located in the extension direction of the cutting line.

[0005] In one embodiment, at least two cutting grooves are provided at intervals in the extending direction of the cutting line; or, two cutting grooves are provided, and the two cutting grooves are provided at both ends of the cutting line.

[0006] In one embodiment, the cutting groove extends along the extension direction of the cutting line, and the cutting groove is arranged to pass through the thickness direction of the PCB board. The PCB board has two first side walls arranged opposite to each other at both ends of the cutting line. The cutting groove passes through the first side walls, and an opening for the electric cutter to enter is formed on the side of the cutting groove close to the first side wall.

[0007] In one embodiment, the first side wall is provided with a positioning groove, and the positioning groove is used to cooperate with a preset structure to limit the sensor to a preset position.

[0008] In one embodiment, the cutting groove further has a guide portion and a transition groove, the guide portion is extended along the extension direction of the cutting line, the transition groove is provided at one end of the guide portion close to the cutting line, the opening is provided at one end of the guide portion away from the transition groove, and the width of the guide portion is greater than the width of the electric cutter.

[0009] In one embodiment, the bottom surface of the transition groove facing the opening is in an arc shape.

[0010] In one embodiment, the PCB board further defines a plurality of cutting holes, the plurality of cutting holes are spaced apart along an extending direction of the cutting line, and the plurality of cutting holes are arranged on the cutting line avoiding positions of the cutting grooves.

[0011] In one embodiment, the cross-sectional shape of the cutting hole is circular; and / or the cutting hole is a through hole that passes through the thickness direction of the PCB board.

[0012] In one embodiment, the total length of the cutting groove accounts for 25% to 50% of the total length of the connecting portion.

[0013] The present invention further provides a sensor comprising a solder pad and a sensing component; the sensing component is mounted at a mounting position of the solder pad, and the solder pad is formed by cutting the PCB board described in any one of the above items along a cutting line.

[0014] The technical solution of the present invention is to set a plurality of soldering pads on a PCB board. The PCB board is used to install the sensing component of the sensor. Each soldering pad has a mounting position. The mounting position is used to install the sensing component. The plurality of soldering pads are arranged in sequence along a preset direction. Any two adjacent soldering pads are connected by a connecting portion. The connecting portion is provided with a cutting line and a cutting groove. The cutting groove is located in the extension direction of the cutting line. When the PCB board equipped with the sensing component is cut along the cutting line, the cutting line is shortened because the cutting groove occupies part of the distance of the connecting portion. Therefore, when the machine cuts the PCB board along the cutting line, the cutting distance of the machine is shortened, and the time for the machine to generate vibration on the PCB board is also shortened. This avoids the sensing component installed on the PCB board from being damaged by excessively long-term vibration, and reduces the defective rate of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 A schematic structural diagram of an embodiment of a PCB board provided by the present invention;

[0017] Figure 2 This is a schematic structural diagram of an embodiment of a sensor provided by the present invention.

[0018] Description of Figure Numbers:

[0019] 100, PCB board; 1, solder pad; 11, mounting position; 12, connecting portion; 121, cutting line; 122, cutting groove; 122a, opening; 122b, guide portion; 122c, transition groove; 13, first side wall; 131, positioning groove;

[0020] 200. Sensor; 201. Sensing component.

[0021] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] A sensor is a detection device that senses measured information and, according to a specific pattern, converts it into an electrical signal or other desired information output format to meet requirements for information transmission, processing, storage, display, recording, and control. Conventional PCBs in sensors are typically cut from a larger PCB to the required sensor area. Because some sensors contain fragile components, the prolonged vibration generated by cutting the PCBs containing these components can easily shatter them, resulting in defective products.

[0026] The present invention provides a PCB board 100 .

[0027] See also Figure 1-2 In one embodiment of the present invention, the PCB board 100 is used to install the sensing component 201 of the sensor 200. The PCB board 100 includes: multiple pads 1, each pad 1 has a mounting position 11, the mounting position 11 is used to install the sensing component 201, the multiple pads 1 are arranged in sequence along a preset direction, and any two adjacent pads 1 are connected by a connecting portion 12. The connecting portion 12 is provided with a cutting line 121 and a cutting groove 122. The cutting groove 122 is located in the extension direction of the cutting line 121.

[0028] In this embodiment, the solder pad 1 is used to provide a mounting position 11 for the sensor component 201 to be attached and installed. The sensor component 201 is soldered to the mounting position 11 of the solder pad 1 using soldering equipment, or adhered to the mounting position 11 using colloid. Multiple solder pads 1 are arranged in sequence along a preset direction and connected by a connecting portion 12. The sensor component 201 is soldered to a PCB board 100 having multiple solder pads 1 and then cut by a machine. This can reduce the difficulty of installation and prevent the solder pads 1 from becoming loose and difficult to fix during installation due to the small size of the cut PCB, thereby improving the installation efficiency of the sensor component 201. The sensor component 201 contains a sensor chip, which is sometimes made of fragile materials such as ceramics. This makes the chip unable to withstand long-term severe vibration. Otherwise, it is easy to break, resulting in defective sensor 200. In this embodiment, a cutting groove 122 is provided in the connecting portion 12 between the multiple pads 1. The cutting groove 122 is located in the extension direction of the cutting line 121. The cutting groove 122 is used to reduce the length of the connecting portion 12 and the length of the cutting line 121, so that the cutting machine does not need to cut too long a distance, thereby reducing the vibration time of the sensing component 201 and the probability of damage to the sensing component 201, thereby reducing the defective rate; or enabling the machine to cut at a lower power during cutting, thereby slowing down the vibration effect on the chip. Even if the cutting efficiency becomes lower, the cutting length is also reduced, and the production efficiency of the final product will not be affected while ensuring the defective rate.

[0029] The technical solution of the present invention is to provide a plurality of solder pads 1 on a PCB board 100. The PCB board 100 is used to mount a sensing component 201 of a sensor 200. Each solder pad 1 has a mounting position 11. The mounting position 11 is used to mount the sensing component 201. The plurality of solder pads 1 are arranged in sequence along a preset direction. Any two adjacent solder pads 1 are connected by a connecting portion 12. The connecting portion 12 is provided with a cutting line 121 and a cutting groove 122. The cutting groove 122 is located in the extending direction of the cutting line 121. When the PCB board 100 with the sensing component 201 mounted thereon is cut along the cutting line 121, the cutting groove 122 occupies part of the distance of the connecting portion 12, shortening the cutting line 121. Therefore, when a machine cuts the PCB board 100 along the cutting line 121, the cutting distance of the machine is shortened, and the time for the machine to vibrate the PCB board 100 is shortened. This prevents the sensing component 201 mounted on the PCB board 100 from being subjected to excessive vibration, thereby reducing the defective rate of the sensor 200.

[0030] In one embodiment, at least two cutting grooves 122 are spaced apart along the extending direction of the cutting line 121; alternatively, two cutting grooves 122 are provided, one at each end of the cutting line 121. Providing multiple cutting grooves 122 spaced apart along the extending direction of the cutting line 121 can shorten the duration of the machine's vibration during cutting. Placing the cutting grooves 122 on opposite sides can balance the forces acting on the PCB 100, preventing the PCB 100 from being broken due to unbalanced forces when installing the sensing assembly 201.

[0031] In one embodiment, the cutting groove 122 extends along the direction of the cutting line 121 and extends through the thickness of the PCB 100. The PCB 100 has two first sidewalls 13 disposed oppositely at opposite ends of the cutting line 121. The cutting groove 122 extends through the first sidewalls 13. An opening 122a for the electric cutter to enter is formed on one side of the cutting groove 122 adjacent to the first sidewall 13. The cutting groove 122 extends through the thickness of the PCB 100 and through the first sidewall 13, forming a three-sided structure surrounding the cutting groove 122 in the thickness direction. The electric cutter enters the cutting groove 122 through the opening 122a and moves from the opening 122a toward the cutting line 121 along the direction of the cutting groove 122. The diameter of the electric cutter is smaller than the width of the cutting groove 122. As the electric cutter moves within the cutting groove 122, it does not touch the sides of the cutting groove 122, thereby preventing damage to the edges of the solder pad 1.

[0032] In one embodiment, the first sidewall 13 is provided with a positioning slot 131, which is configured to cooperate with a pre-set structure to retain the sensor 200 in a pre-set position. The positioning slot 131 can correspond to the pre-set structure. When the pre-set structure is engaged with the positioning slot 131, it can temporarily retain the PCB 100 or the solder pad 1, thereby facilitating soldering of the sensing component 201 to the PCB 100 or positioning the finished sensor 200 by the solder pad 1.

[0033] In one embodiment, the cutting groove 122 further comprises a guide portion 122b and a transition groove 122c. The guide portion 122b extends along the extension direction of the cutting line 121. The transition groove 122c is located at the end of the guide portion 122b closest to the cutting line 121, and the opening 122a is located at the end of the guide portion 122b farther from the transition groove 122c. The width of the guide portion 122b is greater than the width of the electric cutter. The guide portion 122b is used to guide the movement path of the electric cutter, causing the electric cutter to first move a certain distance within the guide portion 122b to facilitate determining whether a certain direction of the electric cutter aligns with the extension direction of the cutting line 121, thereby preventing deviation from the cutting line 121. The transition groove 122c is located between the guide portion 122b and the cutting line 121. The width of the transition groove 122c gradually decreases as it extends from the guide portion 122b toward the cutting line 121, thereby allowing the electric cutter to transition from the guide portion 122b to the starting point of the cutting line 121 for subsequent cutting.

[0034] In one embodiment, the bottom surface of the transition groove 122c facing the opening 122a is arc-shaped. This arc-shaped bottom surface reduces stress concentration at the bottom of the transition groove 122c, preventing vibration and damage to the PCB 100 before cutting. Furthermore, the transition groove 122c can be configured in other shapes based on actual needs, and can also be configured to facilitate cutting based on the actual shape of the cutter or the actual operating mode.

[0035] In one embodiment, the PCB 100 further defines a plurality of cutting holes, which are spaced apart along the extending direction of the cutting line 121. The plurality of cutting holes are disposed on the cutting line 121, avoiding the cutting groove 122. Providing the cutting holes can further shorten the length of the cutting line 121 and divide the cutting line 121 into more segments, thereby reducing the vibration duration of each cut.

[0036] In one embodiment, the cutting hole has a circular cross-section; and / or the cutting hole is a through hole extending through the thickness of the PCB 100. The circular hole can be configured to match the shape of the cutter, as long as it extends through the thickness of the PCB 100 to minimize the cutting distance.

[0037] In one embodiment, the total length of the cutting groove 122 accounts for 25% to 50% of the total length of the connecting portion 12. Setting the total length of the cutting groove 122 to between 25% and 50% of the total length of the connecting portion 12 can reduce the defective rate while ensuring the strength of the connecting portion 12 in the PCB board 100, thereby reducing the risk of the PCB board 100 breaking due to insufficient connection strength before cutting.

[0038] The present invention also provides a sensor 200, comprising a solder pad 1 and a sensing component 201. The solder pad 1 is formed by cutting the PCB 100 described above along a cutting line 121. The specific structure of the PCB 100 is similar to that described in the above embodiments. Since the present sensor 200 utilizes all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought about by the technical solutions of the above embodiments, and no further details are given here. The sensing component 201 is mounted on the mounting position 11 of the solder pad 1. Before cutting, the sensing component 201 is first installed in the multiple mounting positions 11 on the PCB 100. Since the PCB 100 is composed of multiple solder pads 1 arranged and connected, the area of ​​the PCB 100 is larger, and the first sidewalls 13 on both sides have more positioning holes. This makes the PCB 100 easier to install and secure. The structure for securing the PCB 100 does not need to be too sophisticated, making it easier to install the sensing component 201 in the mounting position 11, thereby improving the installation efficiency of the sensing component 201. After the sensor component 201 is installed, the PCB board 100 is cut by a machine. Under the action of the cutting groove 122, the probability of fragile components in the sensor component 201 being shattered can be reduced, thereby reducing the defective rate of the sensor 200.

[0039] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made by utilizing the contents of the present invention's description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A PCB board for mounting a sensing component of a sensor, characterized in that: The PCB board includes: Multiple soldering pads, each of which has an installation position, the installation position is used to install the sensing component, the multiple soldering pads are arranged in sequence along a preset direction, any two adjacent soldering pads are connected by a connecting portion, the connecting portion is provided with a cutting line and a cutting groove, and the cutting groove is located in the extension direction of the cutting line.

2. The PCB board according to claim 1, wherein: At least two cutting grooves are provided at intervals in the extending direction of the cutting line; Alternatively, there are two cutting grooves, which are arranged at both ends of the cutting line.

3. The PCB board according to claim 1, wherein: The cutting groove is extended along the extension direction of the cutting line, and is arranged to pass through the thickness direction of the PCB board. The PCB board has two first side walls arranged opposite to each other at both ends of the cutting line. The cutting groove is arranged to pass through the first side walls, and an opening for the electric cutter to enter is formed on the side of the cutting groove close to the first side wall.

4. The PCB board according to claim 3, wherein: The first side wall is provided with a positioning groove, and the positioning groove is used to cooperate with a preset structure to limit the sensor to a preset position.

5. The PCB board according to claim 3, wherein: The cutting groove also has a guide portion and a transition groove, the guide portion is extended along the extension direction of the cutting line, the transition groove is provided at one end of the guide portion close to the cutting line, the opening is provided at one end of the guide portion away from the transition groove, and the width of the guide portion is greater than the width of the electric cutter.

6. The PCB board according to claim 5, wherein: The bottom surface of the transition groove facing the opening is in an arc shape.

7. The PCB board according to claim 1, wherein: The PCB board is further provided with a plurality of cutting holes, the plurality of cutting holes are arranged at intervals along the extending direction of the cutting line, and the plurality of cutting holes are arranged on the cutting line avoiding positions of the cutting grooves.

8. The PCB board according to claim 7, wherein: The cross-section of the cutting hole is circular; And / or, the cutting hole is a through hole set through the thickness direction of the PCB board.

9. The PCB board according to any one of claims 1 to 8, wherein: The total length of the cutting groove accounts for 25% to 50% of the total length of the connecting portion.

10. A sensor, characterized in that: include: A soldering pad and a sensing component; the sensing component is installed at the mounting position of the soldering pad, and the soldering pad is cut along a cutting line of the PCB board according to any one of claims 1 to 9.

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