PCB manufacturing method, PCB and electronic equipment

Abstract

The invention relates to the technical field of PCB manufacturing, particularly discloses a PCB manufacturing method, a PCB and electronic equipment, and is used for solving the technical problem of short circuit of an inner layer of a metal-based product. The method comprises the steps that an inner-layer base material is processed based on an inner-layer processing technology, an inner-layer core plate is obtained, a window is formed in the periphery of a target area of a metal layer of the inner-layer core plate, and the target area is the position, used for containing a metal base, in the metal layer of the inner-layer core plate; and based on an outer layer processing technology, outer layer processing treatment is carried out on the inner layer core board to obtain a target PCB, matching milling treatment is carried out on an area corresponding to the target area in the target PCB, and the metal base is located in a metal base groove formed by matching milling and is fixed in the target area.

Description

Technical Field

[0001] The present application relates to the field of PCB technology, and in particular to a PCB board manufacturing method, a PCB board, and an electronic device. Background Art

[0002] The development of new energy and AI (artificial intelligence) modules is placing stricter demands on product heat dissipation, posing both greater challenges and opportunities for the entire PCB industry. Currently, there are two primary approaches to achieving PCB heat dissipation: designing heat dissipation holes within the PCB's heat dissipation area for localized heat dissipation; and embedding a metal matrix within the area for localized heat dissipation. Products with this embedded metal matrix are called metal-based products. Metal-based products are composite materials composed of a metal or its alloy as a matrix, artificially bonded with one or more metal or non-metallic reinforcements.

[0003] The existing production process for metal-based products involves milling a slot in the PCB (for the metal base) and then placing the metal base into the slot. This milling process generates a large amount of copper wire and copper chips (copper wire is produced when the milling cutter cuts copper). When this copper wire connects to the inner layer pattern and the metal base, it can cause a short circuit, creating an inner layer short. Summary of the Invention

[0004] The embodiments of the present application provide a PCB board manufacturing method and a PCB board to solve the technical problem that traditional processing solutions may cause short circuits in the inner layers of metal-based products.

[0005] A method for manufacturing a PCB board, the method comprising: Based on the inner layer processing technology, the inner layer base material is processed to obtain the inner layer core plate, wherein the periphery of the target area of ​​the metal layer of the inner layer core plate is provided with a window, and the target area is a position in the metal layer of the inner layer core plate for placing the metal base; Based on the outer layer processing technology, the inner layer core board is subjected to outer layer processing to obtain a target PCB board, wherein the area corresponding to the target area in the target PCB board is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area.

[0006] Furthermore, the opening formed by the windowing is a closed contour, or the opening formed by the windowing is a non-closed contour.

[0007] Furthermore, the opening formed by the window is a closed rectangular outline.

[0008] Furthermore, the size of the rectangular outline is 5*5mm, 10*10mm, 20*20mm, 30*30mm, 40*40mm, 50*50mm, 60*60mm or 70*70mm.

[0009] Furthermore, the width of the opening formed by the window is 0.127 mm, 0.1524 mm, 0.2032 mm, 0.254 mm, 0.3048 mm, 0.3556 mm, 0.4064 mm, 0.4572 mm or 0.508 mm.

[0010] Furthermore, the size parameters of the window are the sizes of the metal-based finished board tested through a reflow test.

[0011] Furthermore, the inner layer residual copper rate of the target PCB board is greater than a preset residual copper rate.

[0012] Furthermore, the inner layer base material is processed based on the inner layer processing technology to obtain the inner layer core plate, including: The inner layer substrate is sequentially subjected to cutting, inner layer pre-treatment, inner layer exposure, inner layer etching and inner layer inspection treatment to obtain an inner layer core board, wherein the inner layer pre-treatment includes dry film lamination treatment, and the inner layer etching includes etching treatment based on circuit patterns and etching treatment to obtain the window.

[0013] A PCB board is manufactured based on the manufacturing method of the metal substrate as described in any one of the above items.

[0014] An electronic device comprises the PCB board.

[0015] It can be seen that in an embodiment of the present application, a PCB board manufacturing method is provided, firstly, based on the inner layer processing technology, the inner layer base material is processed to obtain the inner layer core board, wherein the periphery of the target area of ​​the metal layer of the inner layer core board is provided with a window, and the target area is the position for placing the metal base in the metal layer of the inner layer core board; finally, based on the outer layer processing technology, the inner layer core board is subjected to outer layer processing to obtain the target PCB board, wherein the area of ​​the target PCB board corresponding to the target area is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area, for example, Figure 3 As shown. It can be seen that in this embodiment, the window design is optimized for the inner layer of the target PCB board embedded with the metal base. Since the inner layer window corresponds to the metal base groove position, even if copper wire falls into the slot hole during the milling process, it has been proven through experiments that it will not contact the inner layer, thereby preventing a short circuit. This solves the inner layer short circuit problem of metal-based products and improves the reliability of metal-based products. BRIEF DESCRIPTION OF THE DRAWINGS In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 This is a schematic diagram of the copper wire falling during the milling process; Figure 2 This is a flow chart of a method for manufacturing a PCB board in one embodiment of the present application; Figure 3 This is a schematic diagram of a window structure in a PCB board manufacturing method in one embodiment of the present application; Figure 4 This is a schematic diagram of the structural relationship between the window and the metal base groove in a PCB board manufacturing method in one embodiment of the present application; Figure 5 This is a schematic diagram of the dimensions of a window structure in a PCB board manufacturing method in one embodiment of the present application; Figure 6 This is a schematic diagram of an inner layer processing flow in a PCB board manufacturing method in one embodiment of the present application; Figure 7 This is a schematic diagram of an outer layer processing flow in a PCB board manufacturing method in an embodiment of the present application. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0018] like Figure 1 As shown, during the production process of existing metal-based products, the PCB board is milled to obtain a groove (metal base groove) with an embedded metal base. The copper wire generated by the milling of the metal base groove will connect with the inner layer graphics and / or metal base of the PCB board, resulting in an inner layer short circuit. The inner layer short circuit refers to the abnormal connection of the conductive path between two inner layer circuits inside the PCB board. Such defects will persist in the subsequent processing process. Traditional solutions currently have no better solution to improve it. Moreover, this defect is a reliability risk that will affect the final performance of the final PCB board product. A complete solution is urgently needed.

[0019] In this regard, in an embodiment of the present application, during the PCB board manufacturing process, before milling the metal base groove, a window is opened in the inner layer, which is described in detail below.

[0020] In one embodiment, if Figure 2 As shown, a method for manufacturing a PCB board is provided, the method comprising the following steps: S101. Processing an inner layer substrate based on an inner layer processing process to obtain an inner layer core plate, wherein a window is provided around a target area of ​​the metal layer of the inner layer core plate, the target area being a location in the metal layer of the inner layer core plate for placing a metal base; S102. Based on the outer layer processing technology, the inner core board is subjected to outer layer processing to obtain a target PCB board, wherein the area of ​​the target PCB board corresponding to the target area is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area.

[0021] In this embodiment, a PCB board manufacturing method is provided for manufacturing a PCB board with an embedded metal base, also referred to as a metal-based product, which is recorded as a target PCB board in this embodiment of the application. It should be understood that a PCB board with an embedded metal base is a special type of circuit board, the core or part of the layer structure of which contains a metal base, and the metal base refers to a composite material with metal and its alloy as the matrix, artificially combined with one or more metal or non-metal reinforcements, generally having the advantages of thermal conductivity, electrical conductivity, wear resistance, and a small thermal expansion coefficient. Exemplarily, the metal base types include but are not limited to aluminum base, copper base, and ceramic base, etc., and are not specifically limited. The main role of the metal base in the target PCB board is to meet the needs of heat dissipation, mechanical strength, or electromagnetic shielding.

[0022] In an embodiment of the present application, in order to solve the problem of short circuits in the inner layers of PCB boards that exist in traditional metal-based products, a PCB board manufacturing method is provided in an embodiment of the present application, which mainly includes inner layer processing, lamination, and outer layer processing processes, which are described below respectively: Step S101 corresponds to the inner core board processing process. During this process, an inner layer substrate with a double-sided metal layer (generally a double-sided metal layer) is required to be provided, and then the inner layer substrate is processed based on the inner layer processing technology to obtain an inner core board, wherein windows are provided around the target area of ​​the metal layer of the inner core board, and the target area is the position for placing the metal base in the metal layer of the inner core board, that is, the inner layer window processing. The metal layer of the inner core board is generally a copper layer, and there is no specific limitation.

[0023] It should be noted that the inner core board is the core component of a multi-layer PCB, located in the middle layer of the PCB. It is used to carry internal circuits, provide mechanical support, or implement special functions (such as heat dissipation or shielding). This inner core board may include a metal layer, a thermally conductive structure, or an electromagnetic shielding layer to meet high power, high speed, or high reliability requirements. In addition, the inner layer substrate can be exemplarily made of FR4, high-TG material, or polyimide (flexible board). The inner core board also includes copper foil (metal layer), which is etched to form the internal circuitry.

[0024] It should be noted that in this step, the specific inner layer processing technology is not limited, and the specific processing dimensions, parameters, etc. are not limited. In this step, the main point is that during the inner layer etching process, windows will be set around the target area corresponding to the inner metal layer and the embedded metal base. The windowing means opening a hole.

[0025] Through the above steps, the inner core board obtained already has preliminary functional conductors and reserved metal base installation positions. The opening of windows in the target area of ​​the metal layer will help to accurately embed the metal base and solve the inner layer short circuit problem in subsequent processes.

[0026] In the outer layer processing process, after obtaining the inner layer core board, the outer layer processing is performed on the inner layer core board based on the outer layer processing technology. Exemplarily, the outer layer processing includes conventional outer layer manufacturing processes such as matching, browning, bonding, pre-stacking, matching milling and lamination. It should be noted that in this step, the specific outer layer processing technology is not limited, and the specific processing dimensions, parameters, etc. are also not limited. This step mainly performs matching milling processing on the area corresponding to the target area, that is, CNC matching milling processing is performed according to the preset shape to form a metal base groove with precise dimensions. The position of the metal base groove corresponds to the target position, so that the metal base can be located in the metal base groove formed by matching milling and fixed to the target area at the metal layer position. For example, a high thermal conductivity metal base such as aluminum and copper can be used as the metal base, which is accurately embedded in the metal base groove and bonded or hot-pressed to be cured so that the embedded metal base is firmly combined with the target position of the inner layer.

[0027] Among them, the above-mentioned treatment will select the inner core board, prepreg resin sheet (PP) and copper foil with completed inner layer graphics in sequence according to the design requirements of the target multi-layer structure, and perform manual or automatic panel matching operations in a predetermined stacking order to form a multi-layer material assembly that is ready for lamination. The brown-black treatment is to brown-blacken the copper surface of the inner core board to form a rough and oxidizing brown or black film layer on the copper surface to improve the bonding strength between the copper surface and the prepreg, and enhance the interlayer adhesion of the subsequent laminated structure. Among them, PP will soften and fill the gaps under heating to form an insulating structure. The inner layer of the laminate formed refers to the metal layer inside the laminate, located between the top and bottom layers, and then used for subsequent lamination processing.

[0028] It can be seen that in an embodiment of the present application, a PCB board manufacturing method is provided, firstly, based on the inner layer processing technology, the inner layer base material is processed to obtain the inner layer core board, wherein the periphery of the target area of ​​the metal layer of the inner layer core board is provided with a window, and the target area is the position for placing the metal base in the metal layer of the inner layer core board; finally, based on the outer layer processing technology, the inner layer core board is subjected to outer layer processing to obtain the target PCB board, wherein the area of ​​the target PCB board corresponding to the target area is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area, for example, Figure 3 As shown in the figure, in this embodiment, the window design is optimized for the inner layer of the target PCB board embedded with the metal base. Since the inner layer window corresponds to the metal base groove position, even if copper wire falls into the slot hole during the milling process, it will not contact the inner layer, thus preventing a short circuit. This solves the inner layer short circuit problem of metal-based products and improves the reliability of metal-based products.

[0029] In one embodiment, the opening formed by the window is a closed contour, or the opening formed by the window is a non-closed contour. As an example, for example, Figure 3 As shown, the opening formed by the window is a closed rectangular outline. Figure 3 The white rectangle in the middle is the window. Figure 3 The window opening conditions with different size parameters are shown in Figure 2.

[0030] It can be seen that, in combination with the above embodiment, there are multiple solutions for the design of the inner window in this embodiment, which can be a non-closed contour form or a Figure 3 The closed contour form shown enhances the feasibility and diversity of the solution. More specifically, since the cross-section of most metal substrates is generally rectangular, in this embodiment, the opening formed by the window is a closed rectangular contour.

[0031] It should be understood that in order to reduce the copper wire from falling onto the inner pattern during the milling process of the metal base groove, a window is designed for the copper layer (metal layer) in the inner pattern. The cross-sectional shape of the metal base is generally rectangular. As an example, all the inner window designs of the metal base can be rectangular, as shown in the following example. Figure 4 shown.

[0032] In one embodiment, in combination with the above embodiment, the size of the rectangular outline is 5*5mm, 10*10mm, 20*20mm, 30*30mm, 40*40mm, 50*50mm, 60*60mm or 70*70mm. Figure 5 As shown, the size of the rectangular outline refers to the size of the outer rectangular outline of the rectangular window, such as Figure 5 The example window size is 5*5mm. In actual application, the size of the metal base to be embedded can be determined by the size of the inner layer window and the subsequent milling of the metal groove. The window and milling can be carried out according to the size requirements. In one embodiment, the width of the opening formed by the window is 0.127mm, 0.1524mm, 0.2032mm, 0.254mm, 0.3048mm, 0.3556mm, 0.4064mm, 0.4572mm or 0.508mm. It should be noted that the opening formed by the window refers to the spacing between the inner edges of the hole. For example, Figure 5 As shown, Figure 5 The example window width is 0.508mm.

[0033] It should be noted that Figure 5 The examples are only used to illustrate the dimensional relationship and do not limit the actual application.

[0034] In one embodiment, the size parameters of the window are the size of the metal-based finished board tested by reflow soldering test, and the size parameters of the window include the hole width and size.

[0035] It should be noted that larger inner layer window openings increase the number of copper-free areas, which can easily lead to reliability risks. Therefore, when designing the copper layer window size, it is necessary to test whether the metal base area will delaminate after reflow soldering. Experimental data shows that the absence of inner layer short circuits and delamination indicates that the size is appropriate. In this embodiment, the design rationality and effectiveness of the window structure are further improved by testing the reflow soldering method.

[0036] For example, as shown in Table 1 below, in an exemplary experiment, different copper layer window sizes are designed: 5*5mm, 10*10mm, 20*20mm, 30*30mm, 40*40mm, 50*50mm, 60*60mm and 70*70mm, and different hole sizes are designed: 0.0762mm, 0.1016mm, 0.127mm, 0.1524mm, 0.2032mm, 0.254mm, 0.3048mm, 0.3556mm, 0.4064mm, 0.4572mm, 0.508mm Table 1 Table 1 above is obtained after 7 reflow soldering tests. It can be seen that for different window sizes, when the hole width of the inner window is, for example, 0.127 mm, there is no inner layer short circuit.

[0037] In one embodiment, in order to improve the residual copper rate (i.e., the higher the residual copper rate, the smaller the board thickness range), in this embodiment, during the process of processing the inner layer window, the inner layer residual copper rate of the target PCB board is ensured to be greater than the preset residual copper rate, thereby ensuring the board thickness range.

[0038] In one embodiment, step S101, i.e., processing the inner layer substrate based on the inner layer processing technology to obtain the inner layer core board, includes the following steps: The inner layer substrate is sequentially subjected to blanking, inner layer pretreatment, inner layer exposure, inner layer etching and inner layer inspection treatment, wherein the inner layer pretreatment includes dry film lamination treatment, and the inner layer etching includes etching treatment based on circuit patterns and etching treatment to obtain the window.

[0039] In this embodiment, the inner layer substrate is processed into an inner layer, such as Figure 6 As shown, the inner layer substrate is sequentially subjected to blanking, inner layer pre-treatment, inner layer exposure, inner layer etching, and inner layer inspection processing, wherein the inner layer pre-treatment includes dry film lamination processing, and the inner layer etching includes etching processing based on the circuit pattern and etching processing to obtain the window. The main difference from traditional inner layer processing is that the inner layer etching processing will be carried out according to the window processing mentioned in the embodiment of this application. The meaning and explanation of each step are as follows: Blanking: refers to providing the original copper clad laminate and cutting it according to the required size of the inner layer circuit board to obtain the inner layer substrate of preset size.

[0040] Inner layer pretreatment: The copper surface of the inner layer substrate is sequentially subjected to decontamination, roughening and micro-etching treatments to remove surface oxides and enhance the adhesion of subsequent anti-corrosion films. After completion, the substrate surface remains clean and dry.

[0041] Inner layer exposure: The surface of the inner layer substrate after pre-treatment is covered with a resist dry film. The preset inner layer circuit pattern is aligned through an exposure machine and subjected to UV exposure treatment, causing the resist film in the illuminated area to undergo chemical changes to form a pattern transfer structure.

[0042] Inner layer etching: refers to sending the developed inner layer substrate into the etching equipment, using the etching liquid to remove the copper layer not covered by the anti-etching film, leaving only the copper layer of the required circuit pattern part and the window part; after the etching is completed, the residual anti-etching film on its surface is stripped off to obtain the preliminary formed inner layer circuit structure.

[0043] Inner layer inspection: refers to the automatic optical inspection and manual review of the inner layer substrate after etching to confirm the integrity and consistency of the circuit pattern, eliminate the board with open circuit, short circuit or other pattern defects, and ensure that the quality of the inner layer circuit meets the requirements of the subsequent lamination process.

[0044] In one embodiment, S102, performing outer layer processing on the inner core board based on an outer layer processing process to obtain a target PCB board, includes: The inner core board is subjected to bonding, pre-stacking, milling, lamination, drilling, cutting, etc., to obtain the final target PCB board. Among them, more outer layer processing is not specifically limited here. This embodiment mainly includes milling the area corresponding to the target area in the target PCB board, and the metal base is located in the metal base groove formed by milling and fixed to the target area. For example, Figure 7 A schematic diagram of the process of partial outer layer processing is given.

[0045] Panel matching refers to the process of selecting the inner core board with completed inner layer graphics, prepreg resin sheet (PP) and copper foil in sequence according to the target multi-layer structure design requirements, and performing manual or automatic panel matching operations in a predetermined stacking order to form a multi-layer material assembly that is ready for lamination.

[0046] Brown-blackening treatment refers to the brown-blackening treatment of the copper surface of the inner core board to form a rough and oxidizing brown or black film layer on the copper surface, so as to improve the bonding strength between the copper surface and the prepreg and enhance the interlayer adhesion of the subsequent laminated structure.

[0047] Bonding refers to sending the brown-black treated multi-layer structure into the bonding equipment and performing vacuum pre-pressing under set temperature and pressure conditions to initially bond the components of the multi-layer structure and eliminate interlayer bubbles to ensure the stability of the interlayer structure.

[0048] Pre-stacking refers to the precise pre-stacking of bonded multi-layer structures, including the manual or mechanical alignment and stacking of materials using positioning pins and positioning holes, and the insertion of auxiliary pads and isolation layers to form a pre-stacked group that meets the lamination requirements.

[0049] Milling refers to the edge milling of the pre-stacked plates to remove excess parts and form a standard outline, including the milling of metal base grooves to ensure uniformity and mechanical adaptability in the subsequent pressing process.

[0050] Lamination: The pre-stacked materials after milling are sent to the lamination equipment and hot-pressed under high temperature, high pressure and vacuum environment to make the pre-impregnated resin sheet melt, penetrate and solidify, thereby achieving a firm bond between the copper foil and the inner core board, forming a structurally stable multi-layer laminate.

[0051] Target drilling and grinding refers to the target hole drilling operation on the laminated multi-layer plate to form a reference target for subsequent drilling alignment identification; the plate edge is then trimmed and ground to remove burrs and flash, ensure that the plate boundary is neat and smooth, and meet the subsequent processing dimensional tolerance requirements.

[0052] In one embodiment, a method for manufacturing a PCB is provided, the method comprising the following steps: S201, sequentially performing blanking, inner layer pre-treatment, inner layer exposure, inner layer etching, and inner layer inspection on the inner layer substrate to obtain an inner layer core board, wherein the inner layer pre-treatment includes dry film lamination, and the inner layer etching includes etching based on the circuit pattern and etching to obtain the window; S202. Based on the inner layer chip, the target PCB board is obtained by performing board matching, brown-blackening, bonding, pre-stacking, matching milling, lamination, and target drilling and grinding in sequence, wherein the area of ​​the target PCB board corresponding to the target area is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area.

[0053] For more details about this embodiment, please refer to the description of the aforementioned embodiment, which will not be repeated here.

[0054] It can be seen that in the embodiment of the present application, a PCB board manufacturing method is provided, which first processes the inner layer substrate based on the inner layer processing technology to obtain the inner layer core board, wherein the periphery of the target area of ​​the metal layer of the inner layer core board is provided with a window, and the target area is the position in the metal layer of the inner layer core board for placing the metal base; finally, based on the outer layer processing technology, the inner layer core board is subjected to outer layer processing to obtain the target PCB board, wherein the area corresponding to the target area in the target PCB board is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area. Through the improvement of the inner and outer layer processing processes, the window design of the inner layer of the target PCB board embedded with the metal base is optimized. Due to the inner layer window corresponding to the metal base groove position, even if copper wire falls into the slot hole during the milling process, it has been proved by experiments that it will not contact the inner layer, thereby preventing short circuit, thereby solving the inner layer short circuit problem of metal-based products and improving the reliability of metal-based products.

[0055] The embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A PCB board manufacturing method, characterized in that: The method comprises: Based on the inner layer processing technology, the inner layer base material is processed to obtain the inner layer core plate, wherein the periphery of the target area of ​​the metal layer of the inner layer core plate is provided with a window, and the target area is a position in the metal layer of the inner layer core plate for placing the metal base; Based on the outer layer processing technology, the inner layer core board is subjected to outer layer processing to obtain a target PCB board, wherein the area corresponding to the target area in the target PCB board is subjected to matching milling processing, and the metal base is located in the metal base groove formed by matching milling and is fixed to the target area.

2. The PCB manufacturing method according to claim 1, wherein: The opening formed by the windowing is a closed contour, or the opening formed by the windowing is a non-closed contour.

3. The PCB manufacturing method according to claim 1, wherein: The opening formed by the window is a closed rectangular outline.

4. The PCB manufacturing method according to claim 3, wherein: The size of the rectangular outline is 5*5mm, 10*10mm, 20*20mm, 30*30mm, 40*40mm, 50*50mm, 60*60mm or 70*70mm.

5. The PCB manufacturing method according to claim 4, characterized in that: The opening formed by the window has a hole width of 0.127 mm, 0.1524 mm, 0.2032 mm, 0.254 mm, 0.3048 mm, 0.3556 mm, 0.4064 mm, 0.4572 mm or 0.508 mm.

6. The PCB manufacturing method according to claim 1, wherein: The size parameters of the window are the sizes obtained by reflow soldering test of the metal-based finished board.

7. The PCB manufacturing method according to claim 1, wherein: The inner layer residual copper rate of the target PCB board is greater than the preset residual copper rate.

8. The PCB manufacturing method according to claim 1, wherein: The inner layer base material is processed based on the inner layer processing technology to obtain the inner layer core plate, including: The inner layer substrate is sequentially subjected to cutting, inner layer pre-treatment, inner layer exposure, inner layer etching and inner layer inspection treatment to obtain an inner layer core board, wherein the inner layer pre-treatment includes dry film lamination treatment, and the inner layer etching includes etching treatment based on circuit patterns and etching treatment to obtain the window.

9. A PCB board, characterized in that: The PCB board is manufactured based on the manufacturing method of the metal substrate according to any one of claims 1 to 8.

10. An electronic device, characterized in that: Including the PCB board as described in claim 9.

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