Printed circuit board processing method of digital thermometer

Abstract

The invention relates to the technical field of digital thermometers, and provides a method for processing a printed circuit board of a digital thermometer, which comprises the following steps of: 1, laminating a plurality of core boards into a first-level multi-layer board A1, and forming a through hole I in the surface of the multi-layer board A1; step 2, pressing the plurality of core boards into a second-stage multilayer board A2, and forming through holes II in the surface of the multilayer board A2; step 3, laminating the multi-layer board A1 and the multi-layer board A2 to obtain the digital thermometer composite board; and 4, embedding copper sheets into the inner walls of the through hole I and the through hole II, and performing resin filling. The curing quality of the release layer and the flatness of the multi-layer board A1 are ensured by accurately controlling the pressing process of the multi-layer board and strictly controlling the drying temperature and time. The copper sheets are embedded in an electroplating mode and are filled with resin, so that the conductivity and the connection reliability of the through holes can be improved, and the electrical performance and the mechanical stability of the whole printed circuit board are improved.

Description

Technical Field

[0001] The invention relates to the technical field of digital thermometers, in particular to a method for processing a printed circuit board of a digital thermometer. Background Art

[0002] A digital thermometer is a temperature measurement instrument built using digital technology. It uses a temperature sensor to convert the temperature into an electrical signal, which is then converted to a digital signal via an analog-to-digital converter (ADC). The temperature is then displayed digitally on a display unit (such as an LCD). Digital thermometers offer high accuracy, excellent stability, intuitive readings, and ease of use. They are widely used in various industrial and mining enterprises, universities, and research institutes. The temperature measurement process of a digital thermometer is supported by a circuit board.

[0003] Existing methods for manufacturing digital thermometer printed circuit boards (PCBs) produce poor heat dissipation. This results in the components on the outermost core board radiating high temperatures, which in turn affect the PCB and the components on the board, causing electronic components to expand, resistance to drop, and solder joints to fall off. Therefore, a method for manufacturing digital thermometer PCBs is needed. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention provides a method for processing a printed circuit board of a digital thermometer, which solves the problem that the printed circuit board processed by the existing digital thermometer printed circuit board method has poor heat dissipation effect, resulting in the high temperature emitted by the components on the surface of the outermost core board affecting the circuit board and the components on the surface of the circuit board.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0006] A method for processing a printed circuit board of a digital thermometer comprises the following steps:

[0007] Step 1: Press multiple core boards into a first-level multilayer board A1, and open a through hole 1 on the surface of the multilayer board A1;

[0008] Step 2: Press multiple core boards together to form a secondary multilayer board A2, and open a second through hole on the surface of the multilayer board A2;

[0009] Step 3: Laminating the multilayer board A1 and the multilayer board A2 to obtain a digital thermometer composite board;

[0010] Step 4: embed copper sheets into the inner walls of through hole 1 and through hole 2 and fill them with resin;

[0011] Step 5: Pressing the composite board and at least one core board together to obtain a finished board, encapsulating the finished board, and forming a heat conduction groove around the finished board. Then, filling the heat conduction groove with liquid heat conduction material, and solidifying the heat conduction material by cooling;

[0012] Step 6: Open a signal through hole in the filled through hole 1 and through hole 2, and electroplate the inner wall of the signal through hole to form a printed circuit board.

[0013] Preferably, in the step 1, the multilayer board A1 is composed of N stacked metal layers A and embedded with a release layer, and the release layer is bonded to the multilayer board by curing.

[0014] Preferably, the multilayer board A2 in step 2 is composed of M stacked metal layers B, wherein the metal layer B is provided with a plurality of copper layers, and an insulating layer is provided between two adjacent copper layers.

[0015] Preferably, metal patterns for identification are printed on the surfaces of the topmost metal layer A and the topmost metal layer B.

[0016] Preferably, the aperture of the through hole 1 is D1, the aperture of the through hole 2 is D2, and 2mil≤(D1-D2)≤4mil.

[0017] Preferably, the copper sheet is embedded in step 4 by electroplating.

[0018] Preferably, when curing the liquid release layer, the drying temperature range is ≥65 and ≤90, and the drying time is less than or equal to 310 seconds.

[0019] Preferably, in step six, after the printed circuit board is formed, the edges of the circuit board are deburred.

[0020] Preferably, the packaging processing method for the finished board in step five is: electroplating both sides of the finished board, and using one side of the finished board as a pad, and the pad is connected to the signal through hole.

[0021] Preferably, the drilling method in step 1, step 2 and step 6 is any one of mechanical drilling and laser drilling.

[0022] The present invention provides a method for processing a printed circuit board of a digital thermometer. The method has the following beneficial effects:

[0023] 1. The present invention can effectively manage the heat generated by the digital thermometer during operation by opening a heat conduction groove in the finished board and filling it with liquid heat conductive material. The high thermal conductivity of the heat conductive material helps to quickly disperse heat and prevent local overheating, thereby improving the thermal stability of the circuit board and the reliability of the product. The heat conductive material is cooled and solidified to ensure that the heat conductive material is tightly bonded to the circuit board, thereby improving the heat conduction efficiency.

[0024] 2. The present invention ensures the curing quality of the release layer and the flatness of the multilayer board A1 by precisely controlling the lamination process of the multilayer board and strictly controlling the drying temperature and time. The copper sheet is embedded by electroplating and then filled with resin, which improves the conductivity and connection reliability of the through-hole, thereby improving the electrical performance and mechanical stability of the entire printed circuit board.

[0025] 3. The present invention prints metal patterns for identification on the surfaces of both the topmost metal layer A and the topmost metal layer B, thereby facilitating identification and positioning during the processing and printing process. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Example:

[0028] An embodiment of the present invention provides a method for processing a printed circuit board of a digital thermometer, comprising the following steps:

[0029] Step 1: Laminating multiple core boards into a first-level multilayer board A1. The multilayer board A1 is composed of N stacked metal layers A and embedded with a release layer. The release layer is bonded to the multilayer boards by curing. A through hole 1 is formed on the surface of the multilayer board A1. When curing the liquid release layer, the drying temperature range is ≥65 and ≤90, and the drying time is less than or equal to 310s.

[0030] By precisely controlling the lamination process of the multilayer board and strictly controlling the drying temperature and time, the curing quality of the release layer and the flatness of the multilayer board A1 are ensured.

[0031] Step 2: Laminating the multiple core boards into a secondary multilayer board A2, wherein the multilayer board A2 is composed of M layers of stacked metal layers B, wherein the metal layers B are provided with multiple copper layers, and an insulating layer is provided between two adjacent copper layers. A second through hole is provided on the surface of the multilayer board A2;

[0032] Step 3: Laminating the multilayer board A1 and the multilayer board A2 to obtain a digital thermometer composite board;

[0033] Step 4: embed copper sheets into the inner walls of through hole 1 and through hole 2 and fill them with resin. The copper sheets are embedded by electroplating.

[0034] Embedding copper sheets by electroplating and filling with resin can improve the conductivity and connection reliability of through-holes, thereby improving the electrical performance and mechanical stability of the entire printed circuit board.

[0035] Step 5: Laminating the composite board with at least one core board to obtain a finished board, encapsulating the finished board, and forming a heat conduction groove around the finished board. Then, the interior of the heat conduction groove is filled with liquid heat conduction material, and the heat conduction material is solidified by cooling. The encapsulation method of the finished board is: electroplating both sides of the finished board, and using one side of the finished board as a pad, which is connected to the signal through hole;

[0036] By opening a heat conduction groove in the finished board and filling it with liquid thermal conductive material, the heat generated by the digital thermometer during operation can be effectively managed. The high thermal conductivity of the thermal conductive material helps to quickly disperse heat and prevent local overheating, thereby improving the thermal stability of the circuit board and the reliability of the product. By cooling and solidifying the thermal conductive material, it is ensured that the thermal conductive material is closely bonded to the circuit board, thereby improving the heat conduction efficiency. The thermal conductive material uses either thermal grease or thermal gel to assist the printed circuit board in dissipating heat.

[0037] Step 6: Open a signal through hole in the filled through hole 1 and through hole 2, and electroplate the inner wall of the signal through hole to form a printed circuit board. After the printed circuit board is formed, deburr the edge of the circuit board;

[0038] Performing signal via opening and electroplating on the through holes can enhance the durability and corrosion resistance of the through holes, thereby improving the long-term stability of the circuit board.

[0039] The surfaces of the topmost metal layer A and the topmost metal layer B are both printed with metal patterns for identification, which facilitates identification and positioning during the processing and printing process.

[0040] The aperture of through hole 1 is D1, the aperture of through hole 2 is D2, and 2mil≤(D1-D2)≤4mil.

[0041] The drilling method in step 1, step 2 and step 6 is either mechanical drilling or laser drilling.

[0042] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A method for processing a printed circuit board of a digital thermometer, characterized in that: The following steps are involved: Step 1: Press multiple core boards into a first-level multilayer board A1, and open a through hole 1 on the surface of the multilayer board A1; Step 2: Press multiple core boards together to form a secondary multilayer board A2, and open a second through hole on the surface of the multilayer board A2; Step 3: Laminating the multilayer board A1 and the multilayer board A2 to obtain a digital thermometer composite board; Step 4: embed copper sheets into the inner walls of through hole 1 and through hole 2 and fill them with resin; Step 5: Pressing the composite board and at least one core board together to obtain a finished board, encapsulating the finished board, and forming a heat conduction groove around the finished board. Then, filling the heat conduction groove with liquid heat conduction material, and solidifying the heat conduction material by cooling; Step 6: Open a signal through hole in the filled through hole 1 and through hole 2, and electroplate the inner wall of the signal through hole to form a printed circuit board.

2. The method for processing a printed circuit board of a digital thermometer according to claim 1, characterized in that: In the step 1, the multilayer board A1 is composed of N stacked metal layers A and embedded with a release layer, and the release layer is bonded to the multilayer board by curing.

3. The method for processing a printed circuit board of a digital thermometer according to claim 2, characterized in that: In the second step, the multilayer board A2 is composed of M stacked metal layers B, wherein the metal layer B is provided with multiple copper layers, and an insulating layer is provided between two adjacent copper layers.

4. The method for processing a printed circuit board of a digital thermometer according to claim 3, characterized in that: Metal patterns for identification are printed on the surfaces of the topmost metal layer A and the topmost metal layer B.

5. The method for processing a printed circuit board of a digital thermometer according to claim 1, characterized in that: The aperture of the through hole 1 is D1, the aperture of the through hole 2 is D2, and 2mil≤(D1-D2)≤4mil.

6. The method for processing a printed circuit board of a digital thermometer according to claim 1, characterized in that: In the fourth step, the copper sheet is embedded in the electroplating method.

7. The method for processing a printed circuit board of a digital thermometer according to claim 2, characterized in that: When curing the liquid release layer, the drying temperature range is ≥65 and ≤90, and the drying time is less than or equal to 310s.

8. The method for processing a printed circuit board of a digital thermometer according to claim 1, characterized in that: In step 6, after the printed circuit board is formed, the edges of the circuit board are deburred.

9. The method for processing a printed circuit board of a digital thermometer according to claim 1, characterized in that: The packaging processing method for the finished board in step five is: electroplating both sides of the finished board, and using one side of the finished board as a pad, and the pad is connected to the signal through hole.

10. The method for processing a printed circuit board of a digital thermometer according to claim 1, characterized in that: The drilling method in step 1, step 2 and step 6 is any one of mechanical drilling and laser drilling.