Perovskite double-glass assembly dual composite packaging structure, manufacturing device and preparation method

Abstract

The invention relates to the technical field of photovoltaic module manufacturing, in particular to a perovskite double-glass module dual composite packaging structure, a manufacturing device and a preparation method. A dual composite packaging structure of a perovskite double-glass assembly comprises front plate glass, back plate glass and a packaging adhesive film layer located between the front plate glass and the back plate glass, the front plate glass and the back plate glass are oppositely arranged, the opposite edges of the front plate glass and the back plate glass are provided with laser welding seams, and a perovskite cell layer is deposited on the front plate glass. The packaging adhesive film layer wraps the surface and the periphery of the perovskite cell layer and extends to the laser welding seam to form a double-sealing structure with the welding seam. A perovskite double-glass assembly packaging structure adopting a packaging adhesive film lamination and peripheral laser welding synergistic process replaces traditional butyl rubber edge packaging through an adhesive film interface bonding and laser welding sealing composite technology, and the problems of water and oxygen barrier and long-term reliability of a perovskite assembly are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic module manufacturing, and in particular to a perovskite double-glass module double composite packaging structure, a manufacturing device and a preparation method. Background Art

[0002] Perovskite materials are widely used in optoelectronic devices due to their excellent photoelectric properties (such as high absorption coefficient and long carrier diffusion length). However, the sensitivity of perovskite materials makes the perovskite layer susceptible to water and oxygen corrosion, and traditional film packaging (such as EVA or POE) is prone to microcracks due to aging, leading to component failure.

[0003] At present, the commonly used packaging method is EVA / POE film and butyl rubber around the components. Although EVA / POE film can bond the interlayer materials, the edges still rely on butyl rubber for sealing. However, butyl rubber is prone to delamination and yellowing when exposed to a humid and hot environment for a long time, and the water vapor permeability (WVTR) is only 10 -3 -10 -4 g / m² / day, which cannot meet the requirements of perovskite components (need ≤10 -6 g / m² / day).

[0004] The patent announced as CN117529126A discloses a laser welding packaging process for perovskite cells, which is achieved by full laser welding. However, this requires extremely high process precision. The risk of micro-cracks in the glass will affect the yield, and it cannot fully absorb the stress between the component layers, and is prone to stratification under long-term mechanical loads. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: in order to solve the problem that the traditional butyl adhesive and encapsulation film form of encapsulation in the above-mentioned background technology is not enough to solve the water and oxygen penetration problem on all sides; and the full laser welding process has a safety risk in terms of strength, and the broken glass easily falls off and poses a safety hazard. A perovskite double-glass component double composite encapsulation structure is provided, which adopts the encapsulation film lamination and the four-sided laser welding collaborative process of the perovskite double-glass component encapsulation structure, and replaces the traditional butyl adhesive edge encapsulation through the composite technology of film interface bonding and laser welding sealing, thereby solving the water and oxygen barrier and long-term reliability problems of the perovskite component.

[0006] The technical solution adopted by the present invention to solve its technical problems is: a double composite packaging structure of a perovskite double-glass component, including a front glass, a back glass and an encapsulation film layer located between the two. The front glass and the back glass are arranged opposite to each other, and laser welds are provided at the opposite edges of the two. A perovskite cell layer is deposited on the front glass. The encapsulation film layer wraps the surface and surrounding areas of the perovskite cell layer and extends to the laser weld, forming a double sealing structure with the weld.

[0007] The encapsulation film layer and the laser weld are combined to form a double-sealed structure, which significantly improves the water and oxygen barrier performance and effectively solves the core problem of perovskite's easy hydrolysis and oxidation; the encapsulation film layer extends to the laser weld to fill the microscopic gap between the glass and the battery layer to avoid edge leakage; the front glass and back glass are symmetrically designed to reduce thermal stress deformation and extend the life of the component.

[0008] According to one embodiment of the present invention, a low-melting-point glass powder layer is pre-coated at the laser welding seam position of the front glass.

[0009] The low-melting-point glass powder layer reduces the laser welding temperature, matches the thermal sensitivity of perovskite, avoids high-temperature loss of the battery layer, and pre-coating improves weld density and reduces porosity defects.

[0010] According to one embodiment of the present invention, the low-melting-point glass powder layer comprises 70-85 wt % of low-melting-point glass powder, 5-10 wt % of nano-scale bonding agent, and 10-20 wt % of organic vehicle.

[0011] Nano-scale bonding agents enhance the adhesion between the glass powder and the substrate, the organic carrier ensures coating uniformity, decomposes without residue after sintering, and the component ratio balances fluidity and bonding strength.

[0012] According to one embodiment of the present invention, the melting point of the low-melting-point glass powder is 250-300° C., and the particle size thereof is 5-20 μm.

[0013] The melting point of 250-300°C is compatible with the processing temperature of POE or EVA films, and the particle size of 5-20μm ensures sufficient sintering.

[0014] According to one embodiment of the present invention, at least one laser weld is provided, and the width of the laser weld is 0.6-6 mm, and the height thereof is 0.1-0.8 mm.

[0015] The multi-pass weld design provides redundant sealing, the 0.6-6mm width balances sealing strength and material cost, and the 0.1-0.8mm height avoids stress concentration.

[0016] According to one embodiment of the present invention, the encapsulation film layer is made of modified POE or EVA, and the film is doped with nano water-blocking fillers and 1-5 wt % of graphene oxide or nano clay.

[0017] Modified POE or EVA has better UV aging resistance than traditional EVA; nano water-blocking fillers and graphene oxide form a tortuous water vapor diffusion path; nano clay can improve the mechanical strength of the film and inhibit crack propagation.

[0018] According to one embodiment of the present invention, the thickness of the packaging film layer is 0.3-1.0 mm.

[0019] The thickness of 0.3 to 1.0 mm ensures complete wrapping of the perovskite layer while avoiding light loss caused by excessive thickness.

[0020] Also provided is a manufacturing device for the double composite packaging structure of the perovskite double-glass component described in the above scheme, comprising a transmission frame, a laminator and a cooling table arranged in sequence, the transmission frame being provided with a conveyor belt for conveying the stacked components, an X-axis linear module being provided in the upper cover of the laminator, a Y-axis linear module being provided on the slider of the X-axis linear module, a cylinder being connected to the slider of the Y-axis linear module via a connecting frame, the cylinder being connected to a mounting frame, a laser head being installed on the mounting frame, a heat insulation layer being provided on the mounting frame around the laser head, and an annular gas nozzle being connected below the laser head via a connecting piece.

[0021] The laminator integrates a laser welding head to avoid component transfer contamination or misalignment. The combination of X-axis and Y-axis linear modules and cylinders achieves three-dimensional positioning, ensuring the positioning accuracy of the laser head. The annular gas nozzle sprays nitrogen or argon to inhibit welding oxidation, and the thermal insulation layer can prevent the lamination heating from affecting the optical components.

[0022] A method for preparing the double composite packaging structure of the perovskite double-glass component described in the above solution is also provided, comprising the following steps: S1. Cell preparation: Clean the surface of the transparent conductive glass, deposit a perovskite cell layer to form a circuit, and clean the edges of the conductive glass around the deposited perovskite cell layer to form a front glass with a deposited perovskite cell layer; S2. Laying the surrounding packaging materials: The perovskite cell layer is 0.3 to 6 mm away from the four sides of the conductive glass. The low-melting-point glass powder slurry is evenly applied in the area by coating or dispensing, and then pre-sintered to completely or partially decompose the organic carrier in the low-melting-point glass powder. S3, stacking: Lay the encapsulation film layer on the perovskite cell layer, ensure that the encapsulation film layer is placed in the center, put on the back glass, align it with the front glass and fix it; S4, low temperature lamination: S41. Preliminary fixation: Use vacuum adsorption. The initial vacuum rate is ≤5mbar / s to avoid film displacement. Adjust the vacuum rate to 50-100mbar / s, the pressure to 1-10kPa, the temperature to 40-60℃, and the time to 1-3min to soften the encapsulation film layer and expel the bubbles between the layers. S42: Lamination and pressure holding: Set the temperature to 80-110°C, vacuum for 50-300 seconds, and set the vacuum pressure to 40-100 kPa for 7-10 minutes to ensure that the interface between the adhesive film layer and the front and back glass panels is bonded. S5. Laser welding: The laminator is integrated with a laser welding head. Welding is started under vacuum conditions, following multiple concentric scanning paths to avoid local overheating, and nitrogen or argon gas is used for cooling.

[0023] In step S2, edge cleaning is performed to avoid edge short circuits and reserve a packaging margin of 0.3 to 6 mm; pre-sintering can decompose the organic carrier to prevent volatilization and gas generation during lamination; step S4 is vacuumed in stages, and in the initial stage, the film is prevented from shifting and bubbling residues, the film is softened at 40 to 60°C, and interfacial chemical bonding is achieved at 80 to 110°C, which is lower than the decomposition temperature of perovskite throughout the process; step S5 is a multi-channel concentric scan, with uniform heat input and reduced thermal stress.

[0024] According to one embodiment of the present invention, the laser welding in step S5 adopts ultraviolet or green laser with a wavelength of 200 to 550 nm and a power density of 10² to 10 5 W / cm², with a serpentine scanning path. Ultraviolet or green lasers with a wavelength of 200-550nm can achieve high glass absorption and reduce thermal diffusion damage; the serpentine path achieves high coverage.

[0025] Beneficial effects of the present invention: The perovskite double-glass module encapsulation method uses a collaborative process of encapsulation film lamination and all-around laser welding. The internal adhesive layer uses a low-temperature curing film to achieve interface bonding between the perovskite layer and the double-glass. The edge sealing layer is formed by all-around laser welding to form a continuous molten glass weld, achieving: (1) Double sealing protection, the film blocks water and oxygen between layers, the laser weld locks the edge penetration path, and the WVTR is reduced to 10 -7 g / m² / day; (2) Low temperature compatibility, lamination temperature <110°C to avoid thermal decomposition of perovskite; (3) Cost reduction: butyl rubber usage is reduced by 100%, film thickness is reduced by 30%, and overall cost is reduced by 15-20%; (4) Stress buffering and sealing strengthening, pre-coating low-melting-point glass powder on the edge to reduce welding temperature and reduce thermal shock to the film; (5) Low-temperature lamination-welding integrated process, lamination temperature ≤100, protecting the perovskite active layer, laser welding is completed after lamination, no transfer tooling is required, reducing the risk of contamination; (6) Compared with butyl rubber sealing, laser welding sealing is used on all sides, the edge packaging width is narrower and the component size is smaller. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described below with reference to the accompanying drawings and examples.

[0027] Figure 1It is a structural schematic diagram of the double composite packaging structure of the perovskite double-glass component of the present invention.

[0028] Figure 2 yes Figure 1 Schematic diagram of the structure of the center and front glass.

[0029] Figure 3 yes Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0030] Figure 4 It is a structural schematic diagram of a manufacturing device for a double composite packaging structure of a perovskite double-glass component according to the present invention.

[0031] Figure 5 yes Figure 4 Schematic diagram of the structure inside the upper cover of the middle layer press.

[0032] In the figure: 1. Front glass; 2. Back glass; 3. Encapsulation film layer; 4. Perovskite cell layer; 5. Low-melting-point glass powder layer; 6. Transfer rack; 61. Conveyor belt; 7. Laminator; 8. Cooling table; 9. X-axis linear module; 10. Y-axis linear module; 11. Cylinder; 12. Laser head; 13. Thermal insulation layer; 14. Annular gas nozzle. DETAILED DESCRIPTION

[0033] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner.

[0034] Example 1 like Figures 1 to 3 As shown, the double composite packaging structure of the perovskite double-glass component includes a front glass 1, a back glass 2 and a packaging film layer 3 located therebetween. The front glass 1 and the back glass 2 are arranged opposite to each other, and laser welds are provided at the opposite edges of the two. A perovskite cell layer 4 is deposited on the front glass 1. The packaging film layer 3 wraps the surface and the surrounding area and extends to the laser weld to form a double sealing structure with the weld. The laser weld position of the front glass 1 is pre-coated with a low-melting-point glass powder layer 5.

[0035] The front glass 1 and back glass 2 have a symmetrical rigid structure, which suppresses thermal stress deformation and improves mechanical strength. The front glass 1 is made of high-light-transmittance material, and the back glass 2 is made of weather-resistant material. The combination of the two further extends the life of the component.

[0036] Among them, the laser weld width is 5mm and the height is 0.4mm. The laser weld position of the front glass 1 is pre-coated with Bi2O3-based glass powder (i.e., low-melting-point glass powder). The encapsulation film layer 3 uses a POE film with a thickness of 0.5mm. The POE film is laid on the perovskite battery layer 4 at a distance of 0.3 to 6mm from the four sides. The POE film contains 2wt% graphene oxide (i.e., a nano-scale adhesive agent). The POE film is formed by calendering. The POE film extends outward by 0.8mm and is staggered with the laser weld (as shown in B in the figure), forming a double sealing structure.

[0037] The 5mm wide, 0.4mm high laser weld provides a strong physical barrier, reducing water and oxygen permeability. A Bi2O3-based glass frit pre-coat ensures low-temperature forming during laser welding, preventing thermal damage to the perovskite cell layer 4. The POE film extends 0.8mm across the laser weld to fill potential microcracks. Graphene oxide enhances the film's water resistance and interfacial adhesion. The encapsulation film layer 3 is laid 0.3-6mm from the edge to avoid cutting damage and prevent edge leakage. The 0.5mm thick encapsulation film layer 3 balances protection and light transmittance. After laser welding, the film expands due to heat, filling gaps at the weld edge and ensuring density.

[0038] The perovskite cell layer 4 includes a transparent conductive layer, a first transmission layer, a perovskite absorption layer, a second transmission layer and a back electrode.

[0039] Example 2 like Figures 4 and 5 As shown, the manufacturing apparatus for the double-composite packaging structure of a perovskite double-glass module includes a sequentially arranged conveyor frame 6, a laminator 7, and a cooling stage 8. The conveyor frame 6 is equipped with a conveyor belt 61 for transporting the laminated components. The upper cover of the laminator 7 houses an X-axis linear module 9. The slider of the X-axis linear module 9 is equipped with a Y-axis linear module 10. The slider of the Y-axis linear module 10 is connected to a cylinder 11 via a connecting frame. The cylinder 11 is connected to a mounting frame, on which a laser head 12 is mounted. The mounting frame surrounding the laser head 12 is equipped with an insulation layer 13. An annular gas nozzle 14 is connected below the laser head 12 via a connector. The cooling stage 8 is equipped with a water cooling plate, with a water cooling temperature controlled at 20-25°C and a cooling rate of ≤5°C / s to prevent cracking of the adhesive film due to sudden cooling.

[0040] The laser head 12 (including the focusing lens assembly) is integrated into the upper cover cavity of the laminator 7 and connected to an external optical fiber via a high-temperature sealing flange. It is moved by the X-axis linear module 9 and the Y-axis linear module 10, and raised and lowered by a pneumatic cylinder 11. During the lamination phase, the laser head 12 is retracted to avoid contact with the material. During the welding phase, the pneumatic cylinder 11 pushes the laser head 12 downward, while the X-axis linear module 9 and the Y-axis linear module 10 drive the laser head 12 along the X and Y axes. A ceramic fiber insulation layer (10 mm thick) is placed around the laser head 12 to reduce the effects of lamination heating on the optical components. An annular gas nozzle 14 is installed below the laser head 12, with an Ar / N2 gas flow rate controlled at 15-20 L / min and an oxygen concentration of <200 ppm. The gas line is closed during the lamination vacuum phase and inflated before welding to provide local protection.

[0041] The transfer rack 6 automatically transports the stacked components and is synchronized with the laminator 7 to avoid piling; the laminator 7 integrates lamination and laser welding functions; the cooling table 8 quickly cools down and shapes to prevent deformation caused by thermal residual stress.

[0042] The X-axis linear module 9 and the Y-axis linear module 10 ensure that the laser scanning path (e.g., a serpentine trajectory) fully covers the 5mm-wide weld seam area. During multi-pass welding, path optimization (e.g., concentric scanning) is used to prevent local overheating. The cylinder 11 rises and falls along the Z-axis, pressing down to a distance of 2-5mm from the glass surface during welding to ensure a stable laser focus. The thermal insulation layer 13, with a thickness of 10mm, reduces the temperature rise of the laser head 12 caused by thermal radiation from the laminate, thus preventing thermal drift of the optical lens assembly. The annular gas nozzle 14 creates a localized inert atmosphere to inhibit oxidation of the Bi2O3 glass powder. Simultaneously, the gas flow removes welding heat, keeping the width of the heat-affected zone ≤1mm.

[0043] Direct welding in a vacuum environment, zero pollution, laser welding and film curing are completed simultaneously, avoiding defects caused by manual intervention.

[0044] Example 3 The method for preparing the double composite packaging structure of the perovskite double-glass component of Example 1 comprises the following specific steps: A perovskite functional layer is deposited on the transparent conductive glass, and laser scribing is used to form a perovskite cell layer 4 with several sub-cells connected in series. The edges of the transparent conductive glass are cleaned with a laser to remove the perovskite layer at the edges, forming a micron-level rough surface (Ra = 1-3μm) to improve the adhesion of the slurry; A low-melting-point glass slurry is applied around the transparent conductive glass with the perovskite cell layer 4. The low-melting-point glass slurry comprises 70-85 wt% of Bi2O3, B2O3, or ZnO, 5-10 wt% of a nano-scale adhesive (e.g., nano-SiO2 or Al2O3), and 10-20 wt% of an organic vehicle (e.g., ethyl cellulose + terpineol). The organic vehicle provides temporary adhesion, and the nanoparticles enhance the physical anchoring of the slurry to the glass substrate. The glass powder particle size is controlled to be 5-20 μm to prevent vacuum extraction due to excessively fine particles. A pre-coating thickness of 50-100 μm is continuously applied along the edge of the glass using a precision dispensing method (needle inner diameter 0.1-0.3 mm, glue quantity control accuracy ±2%). The slurry is then dried with hot air at 80-100°C for 5-10 minutes to partially or completely evaporate the organic vehicle, forming a preliminary solidified layer. The front glass 1 coated with the perovskite cell layer 4, the encapsulation film layer 3 (with added flexible segments, such as SEBS elastomer), and the back glass 2 are stacked and fixed in place in sequence; Use vacuum adsorption to initially fix the stacked structure at a rate of 100-50 mbar / s, a pressure of 1-10 kPa, a temperature of 40-60°C, and a time of 1-3 minutes to eliminate bubbles; The temperature during the lamination stage is 80-110°C to avoid thermal decomposition of perovskite; the pressure is 20-100 kPa (staged control: low-pressure exhaust in the early stage and high-pressure compaction in the later stage); the vacuuming rate is divided into stages, with the initial vacuuming rate ≤5 mbar / s to avoid film displacement; the vacuuming rate during the pressure holding stage is ≤1 mbar; The laminator has 7 heating plates with zoned temperature control. The edge zone temperature can be raised to 120°C to assist in pre-melting the glass powder. After lamination is completed, laser welding is performed, and the nitrogen pressure is released to normal pressure. Using ultraviolet (355nm) or green light (532nm) short-pulse laser, the heat-affected zone (HAZ) is ≤50μm, the power is 30-100W (adjusted according to the glass thickness), the scanning speed is 20-60mm / s, and the spot diameter is 50-100μm; path planning: 2-3 concentric rings are welded around the component with an interval of 0.3-0.8mm, and nitrogen is filled in the lamination cavity to prevent oxidation of the film.

[0045] Gradient cooling: The cooling rate of the laminator 7 is ≤10℃ / min to reduce thermal stress. After laser welding, the temperature is cooled by air to below 50℃. The weld uniformity is monitored by infrared thermal imager (temperature difference ≤5℃), and the weld depth is randomly inspected by laser confocal microscopy.

[0046] Comparative Example 1 Perovskite double-glass components are encapsulated using traditional butyl adhesive and encapsulation film.

[0047] Comparative Example 2 Perovskite double-glass module formed using a full laser welding process.

[0048] The performance comparison test of the component prepared in Example 3 and the component of the comparative example is shown in Table 1.

[0049] Table 1

[0050] With the above-described preferred embodiments of the present invention as a guide, and with reference to the above description, relevant personnel are fully capable of making various changes and modifications without departing from the technical scope of this invention. The technical scope of this invention is not limited to the contents of the specification and must be determined according to the scope of the claims.

Claims

1. A double-glass perovskite module double composite packaging structure, characterized by: The invention comprises a front glass (1), a back glass (2) and an encapsulation film layer (3) located therebetween. The front glass (1) and the back glass (2) are arranged relative to each other, and laser welds are provided at their relative edges. A perovskite cell layer (4) is deposited on the front glass (1). The encapsulation film layer (3) wraps around the surface and periphery of the perovskite cell layer (4) and extends to the laser weld, forming a double sealing structure with the weld.

2. The double composite packaging structure of the perovskite double-glass component according to claim 1, characterized in that: A low-melting-point glass powder layer (5) is pre-coated at the laser welding seam position of the front plate glass (1).

3. The double composite packaging structure of the perovskite double-glass component according to claim 2, characterized in that: The low-melting-point glass powder layer (5) comprises 70-85 wt% of low-melting-point glass powder, 5-10 wt% of nano-level bonding aid, and 10-20 wt% of organic carrier.

4. The double composite packaging structure of the perovskite double-glass component according to claim 3, characterized in that: The low-melting-point glass powder has a melting point of 250-300° C. and a particle size of 5-20 μm.

5. The double composite packaging structure of the perovskite double-glass component according to claim 1, characterized in that: At least one laser weld is provided, and the width of the laser weld is 0.6-6 mm, and the height thereof is 0.1-0.8 mm.

6. The double composite packaging structure of a perovskite double-glass component according to claim 1, characterized in that: The encapsulation film layer (3) is made of modified POE or EVA, and the film is doped with nano water-blocking fillers and 1-5 wt% of graphene oxide or nano clay.

7. The double composite packaging structure of the perovskite double-glass component according to claim 6, characterized in that: The thickness of the packaging film layer (3) is 0.3-1.0 mm.

8. A manufacturing device for a double composite packaging structure of a perovskite double-glass component according to any one of claims 1 to 7, characterized in that: The invention comprises a transmission frame (6), a laminator (7) and a cooling table (8) which are arranged in sequence, wherein the transmission frame (6) is provided with a transmission belt (61) for transmitting the stacked components, an X-axis linear module (9) is provided in the upper cover of the laminator (7), a Y-axis linear module (10) is provided on the slider of the X-axis linear module (9), a cylinder (11) is connected to the slider of the Y-axis linear module (10) via a connecting frame, the cylinder (11) is connected to a mounting frame, a laser head (12) is installed on the mounting frame, a heat insulation layer (13) is provided on the mounting frame around the laser head (12), and an annular gas nozzle (14) is connected to the bottom of the laser head (12) via a connecting piece.

9. A method for preparing a double composite packaging structure of a perovskite double-glass component according to any one of claims 1 to 7, characterized in that: The steps include: S1. Battery preparation: cleaning the surface of the transparent conductive glass, depositing a perovskite battery layer (4) to form a circuit, and cleaning the edges of the conductive glass around the deposited perovskite battery layer (4) to form a front glass (1) with the deposited perovskite battery layer (4); S2. Laying the surrounding packaging materials: The perovskite cell layer (4) is evenly coated with low-melting-point glass powder slurry in the area 0.3 to 6 mm away from the four sides of the conductive glass by coating or dispensing, and then pre-sintering is performed to completely or partially decompose the organic carrier in the low-melting-point glass powder; S3, stacking: laying the encapsulation film layer (3) on the perovskite cell layer (4), ensuring that the encapsulation film layer (3) is placed in the center, and then placing the back glass (2) on the back glass (1) and fixing it in place; S4, low temperature lamination: S41. Preliminary fixation: Use vacuum adsorption. The initial vacuum rate is ≤5mbar / s to avoid film displacement. Adjust the vacuum rate to 50-100mbar / s, the pressure to 1-10kPa, the temperature to 40-60℃, and the time to 1-3min to soften the encapsulation film layer and expel the bubbles between the layers. S42: Lamination and pressure holding: set the temperature to 80-110°C, vacuum for 50-300 seconds, set the vacuum pressure to 40-100 kPa, and the time to 7-10 minutes to ensure that the interface between the adhesive film layer (3) and the front glass (1) and the back glass (2) is bonded; S5. Laser welding: The laminator (7) is integrated with a laser welding head (12), and welding is started under vacuum, following multiple concentric scanning paths to avoid local overheating, and nitrogen or argon gas is used for cooling.

10. The method for preparing a double composite packaging structure of a perovskite double-glass component according to claim 9, characterized in that: The laser welding in step S5 adopts ultraviolet or green laser with a wavelength of 200 to 550 nm and a power density of 10² to 10 5 W / cm², the scanning path is serpentine.

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