Groove shape measuring method, groove shape measuring device, method for controlling machining device, and machining device

Abstract

The groove shape measurement method comprises: a coordinate data acquisition step (step S1) for acquiring a plurality of pieces of three-dimensional coordinate data (three-dimensional coordinate data groups (60)) indicating the shape of a machined groove (9) formed in a workpiece (W) to be machined by a machining device (cutting device (10)) along a machining feeding direction (X direction); a projection data generation step (step S2) for generating two-dimensional projection data (62) for projecting the three-dimensional coordinate data onto a machining groove (9) on a two-dimensional plane (two-dimensional plane (61)) perpendicular to the machining feeding direction; and a cross-sectional profile calculation step (step S3) for calculating the cross-sectional profile (64) of the machining groove (9) on the basis of the two-dimensional projection data (62).

Description

Technical Field

[0001] The present invention relates to a groove shape measurement method for measuring the cross-sectional profile of a machined groove, a groove shape measurement device, a control method for a machining device, and a machining device. This application claims priority based on Japanese Patent Application No. 2023-020119 filed in Japan on February 13, 2023, and incorporates the contents of that application herein. Background Art

[0002] A known dicing device (processing device) uses a disc-shaped blade rotated at high speed by a spindle to cut a workpiece such as a wafer. In such a dicing device, the cross-sectional profile of the machined groove (also called a cut groove) is measured for purposes such as determining the condition of the blade during machining, assessing the quality of the machined groove, detecting debris, and detecting deviations in the machined groove's machining position.

[0003] For example, the cutting device described in Patent Document 1 repeatedly captures XY plane images of a processing groove formed along the X direction (processing feed direction) while moving a confocal microscope in the Z direction, and then stacks each XY plane image in the Z direction to form three-dimensional data (also called a three-dimensional model) of the processing groove. In addition, the cutting devices described in Patent Documents 1 and 2 use a white interference microscope or a laser displacement meter to measure a three-dimensional coordinate data set representing the shape of the processing groove, and construct the three-dimensional data of the processing groove based on the three-dimensional coordinate data set. Furthermore, the cutting devices described in Patent Documents 1 and 2 cut a certain section from the three-dimensional data of the processing groove and calculate the cross-sectional profile of the processing groove.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2015-085397

[0005] Patent Document 2: Japanese Patent Application Laid-Open No. 2021-084201

[0006] However, the cutting apparatuses described in Patent Documents 1 and 2 require the construction of three-dimensional data of the machined grooves, which increases the processing load on a control device of the cutting apparatus, such as a PC (personal computer), that performs this construction process.

[0007] Figure 18 This is an illustration for explaining the problems of the prior art. Figure 18 As shown, in the cutting devices described in Patent Documents 1 and 2, a certain cross section is cut out from the three-dimensional data of the machined groove 9 formed along the X direction (machining feed direction) on the workpiece W, and the cross-sectional profile of the machined groove 9 is calculated. At this time, if the shape of the machined groove 9 changes in the X direction, the cross-sectional profile will change depending on the cutting positions CP1 and CP2 of the cross section, and therefore it may not be possible to obtain a highly reliable cross-sectional profile of the machined groove 9. Summary of the Invention

[0008] In view of this situation, the object of the present invention is to provide a groove shape measuring method, a groove shape measuring device, a control method for a processing device, and a processing device, which can reduce the processing load of the control device of the processing device and obtain a high-reliability cross-sectional profile of the processed groove.

[0009] The groove shape measurement method for achieving the purpose of the present invention includes: a coordinate data acquisition step, acquiring multiple three-dimensional coordinate data representing the shape of the processing groove formed by the processing device on the workpiece along the processing feed direction; a projection data generation step, generating two-dimensional projection data of the processing groove by projecting the three-dimensional coordinate data acquired in the coordinate data acquisition step onto a two-dimensional plane perpendicular to the processing feed direction; and a cross-sectional profile calculation step, calculating the cross-sectional profile of the processing groove based on the two-dimensional projection data generated in the projection data generation step.

[0010] According to this groove shape measuring method, the cross-sectional profile of the machined groove can be calculated without calculating the three-dimensional data of the machined groove.

[0011] In another aspect of the groove shape measurement method of the present invention, in the cross-sectional profile calculation step, at least one of noise removal and statistical processing is performed on the two-dimensional projection data to calculate the cross-sectional profile, thereby obtaining a highly reliable cross-sectional profile.

[0012] In another aspect of the groove shape measurement method of the present invention, the two-dimensional projection data generation process performed in the projection data generation step and the cross-sectional profile calculation process performed in the cross-sectional profile calculation step are distributed among multiple computing devices. This reduces the processing load on each computing device.

[0013] In the groove shape measuring method according to another aspect of the present invention, one of the plurality of computing devices is a control device that controls the machining device. This can reduce the processing load on the control device.

[0014] In another aspect of the groove shape measurement method of the present invention, the plurality of computing devices includes a control device provided for each of the plurality of machining devices and a common computing device shared by the plurality of machining devices. This reduces costs, reduces the processing load on the control device, and allows for the acquisition of a highly reliable cross-sectional profile of the machined groove, even when multiple machining devices are installed.

[0015] In another aspect of the groove shape measurement method of the present invention, the two-dimensional projection data generation process performed in the projection data generation step and the cross-sectional profile calculation process performed in the cross-sectional profile calculation step are performed solely by a computing device separate from the control device that controls the machining device. This further reduces the processing load on the control device.

[0016] In another aspect of the groove shape measurement method of the present invention, the computing device is a shared computing device used by multiple machining devices. This allows for cost reduction, reduced processing load on the control device, and the acquisition of a highly reliable cross-sectional profile of the machined groove, even when multiple machining devices are installed.

[0017] Another aspect of the present invention includes a groove shape measurement method comprising a numerical calculation step for calculating a desired numerical value representing the machining state of the machined groove based on the cross-sectional profile calculated in the cross-sectional profile calculation step. This allows the cross-sectional profile of the machined groove and the desired numerical value to be calculated without calculating three-dimensional data of the machined groove.

[0018] In another aspect of the groove shape measurement method of the present invention, the cross-sectional profile calculation step performs at least one of noise removal and statistical processing on the two-dimensional projection data to calculate the cross-sectional profile, thereby obtaining a highly reliable cross-sectional profile and desired numerical values.

[0019] In another aspect of the groove shape measurement method of the present invention, the two-dimensional projection data generation process performed in the projection data generation step, the cross-sectional profile calculation process performed in the cross-sectional profile calculation step, and the numerical value calculation process in the numerical value calculation step are distributed among multiple computing devices. This reduces the processing load on each computing device.

[0020] In the groove shape measuring method according to another aspect of the present invention, one of the plurality of computing devices is a control device that controls the machining device. This can reduce the processing load on the control device.

[0021] In another aspect of the groove shape measurement method of the present invention, the plurality of computing devices includes a control device provided for each of the plurality of machining devices and a common computing device shared by the plurality of machining devices. This reduces costs, reduces the processing load on the control device, allows for highly reliable cross-sectional profiles of the machined grooves, and enables computational processing to calculate desired numerical values ​​from the cross-sectional profiles, even when multiple machining devices are installed.

[0022] In another aspect of the groove shape measurement method of the present invention, the two-dimensional projection data generation process performed in the projection data generation step, the cross-sectional profile calculation process performed in the cross-sectional profile calculation step, and the numerical value calculation process performed in the numerical value calculation step are performed solely by a computing device separate from the control device that controls the machining device. This allows for cost reduction, even when multiple machining devices are installed, while also reducing the processing load on the control device, acquiring a highly reliable cross-sectional profile of the machined groove, and calculating desired numerical values ​​from the cross-sectional profile.

[0023] In another aspect of the groove shape measurement method of the present invention, the computing device is a common computing device shared by multiple machining devices. This allows for cost reduction, even when multiple machining devices are installed, while also reducing the processing load on the control device, enabling the acquisition of a highly reliable cross-sectional profile of the machined groove, and computational processing for calculating a desired numerical value from the cross-sectional profile.

[0024] A control method for a machining device for achieving the objectives of the present invention includes: a coordinate data acquisition step for acquiring a plurality of three-dimensional coordinate data representing the shape of a machined groove formed on a workpiece by the machining device; a projection data generation step for generating two-dimensional projection data of the machined groove by projecting the three-dimensional coordinate data acquired in the coordinate data acquisition step onto a two-dimensional plane; a cross-sectional profile calculation step for calculating a cross-sectional profile of the machined groove based on the two-dimensional projection data generated in the projection data generation step; a numerical calculation step for calculating a desired numerical value representing the machining state of the machined groove based on the cross-sectional profile calculated in the cross-sectional profile calculation step; and a control step for feedback-controlling the machining device based on the numerical value calculated in the numerical calculation step so that the numerical value satisfies a preset threshold value. Thus, a machined groove having a desired machined shape can be formed.

[0025] The groove shape measuring device for achieving the purpose of the present invention includes: a coordinate data acquisition unit, which acquires multiple three-dimensional coordinate data representing the shape of a machining groove formed by a machining device on a workpiece along a machining feed direction; a projection data generation unit, which generates two-dimensional projection data of the machining groove by projecting the three-dimensional coordinate data acquired by the coordinate data acquisition unit onto a two-dimensional plane perpendicular to the machining feed direction; and a cross-sectional profile calculation unit, which calculates the cross-sectional profile of the machining groove based on the two-dimensional projection data generated by the projection data generation unit.

[0026] A groove shape measuring device according to another aspect of the present invention includes a numerical calculation unit that calculates a desired numerical value representing a machining state of the machined groove based on the cross-sectional profile calculated by the cross-sectional profile calculation unit.

[0027] The processing device for achieving the purpose of the present invention includes: a processing part that forms a processing groove on a workpiece; the above-mentioned groove shape measuring device; and a control part that feedback controls the processing part based on the value calculated by the numerical calculation part so that the value meets a preset threshold.

[0028] The present invention can reduce the processing load of a control device of a machining device and obtain a highly reliable cross-sectional profile of a machined groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a perspective view of the cutting device according to the first embodiment.

[0030] Figure 2 This is a three-dimensional view of the processing area.

[0031] Figure 3 This is a block diagram of the cutting device according to the first embodiment.

[0032] Figure 4 This is an explanatory diagram for explaining generation of two-dimensional projection data by the projection data generating unit.

[0033] Figure 5 This is an explanatory diagram for explaining the cross-sectional profile calculation performed by the cross-sectional profile calculation unit.

[0034] Figure 6 This is a flowchart showing the flow of a process for measuring the cross-sectional profile of a machined groove performed by the cutting device according to the first embodiment.

[0035] Figure 7 This is a block diagram of a cutting device according to a second embodiment.

[0036] Figure 8 This is a block diagram of a cutting device according to a third embodiment.

[0037] Figure 9 This is a block diagram of a cutting device according to a fourth embodiment.

[0038] Figure 10 It is a block diagram of a cutting device according to a fifth embodiment.

[0039] Figure 11 It is a block diagram of a cutting device according to a sixth embodiment.

[0040] Figure 12 This is an explanatory diagram for explaining an example of calculation processing performed by the numerical calculation unit of the sixth embodiment.

[0041] Figure 13 This is a flowchart showing the flow of the measurement process and feedback control of the cross-sectional profile of the machined groove performed by the cutting device according to the sixth embodiment.

[0042] Figure 14 It is a block diagram of a cutting device according to a seventh embodiment.

[0043] Figure 15 This is a schematic diagram showing an example of the structure of a laser processing unit.

[0044] Figure 16 This is an explanatory diagram for explaining an example of numerical calculation processing performed by the numerical calculation unit of the seventh embodiment.

[0045] Figure 17 This is an explanatory diagram for explaining an example of numerical calculation processing performed by the numerical calculation unit of the seventh embodiment.

[0046] Figure 18 This is an explanatory diagram for explaining the problems of the conventional technology. DETAILED DESCRIPTION

[0047] [First embodiment]

[0048] Figure 1 1. The XYZ directions in the figure are directions perpendicular to each other, the XY directions are directions parallel to the horizontal direction, and the Z direction is a direction perpendicular to the horizontal direction.

[0049] like Figure 1 As shown, the cutting device 10 cuts a flat workpiece W (workpiece) such as a silicon wafer (semiconductor wafer). In addition, the cutting device 10 measures the machining groove 9 (see the above-mentioned) formed on the workpiece W by the cutting process. Figure 11 ) of the cross-sectional profile 64 (refer to Figure 5 ). Therefore, the cutting device 10 also functions as the cross-sectional shape measuring device of the present invention. The cutting device 10 includes a loading port 12, a conveying mechanism 14, a processing unit 16, and a cleaning unit 18.

[0050] A cassette containing a plurality of workpieces W mounted on a frame F is placed on the loading port 12. A conveying mechanism 14 conveys the workpieces W. The processing unit 16 performs cutting processing on the workpieces W. The cleaning unit 18 rotates and cleans the workpieces W after the cutting processing. In addition, a control unit 50 (equivalent to the control unit of the present invention, see FIG. 1 ) for controlling the operation of each unit of the cutting device 10 is provided inside the housing 10A of the cutting device 10. Figure 3 ) etc. In addition, the control device 50 for controlling the device may be provided outside the housing 10A.

[0051] The unprocessed workpiece W stored in a cassette placed on the load port 12 is transported by the transport mechanism 14 to the processing unit 16. The processing unit 16 performs cutting processes such as slicing or grooving to separate the workpieces into individual chips. The workpiece W processed by the processing unit 16 is then transported by the transport mechanism 14 to the cleaning unit 18. After cleaning in the cleaning unit 18, the workpiece W is transported by the transport mechanism 14 to the load port 12 and stored in a cassette.

[0052] Figure 2 16 is a perspective view of the exterior of the processing portion. Figure 2 and the aforementioned Figure 1 As shown, the processing unit 16 is a dual-spindle cutting machine including a pair of blades 21A and 21B, a blade cover (not shown), a pair of spindles 22A and 22B, microscopes 23 and 24 , and a work table 31 .

[0053] The blades 21A and 21B are formed into a disc shape. In addition, the front end shape of the blades 21A and 21B, that is, the cross-sectional shape of the blade outer periphery (the blade tip portion) along the radial direction of the blades 21A and 21B is rectangular (other shapes such as a V-shape are also possible). The blades 21A and 21B are arranged relative to each other in the Y direction and are rotatably held on the main shafts 22A and 22B respectively around the blade rotation axis parallel to the Y direction.

[0054] The spindles 22A and 22B have built-in high-frequency motors that rotate the blades 21A and 21B at high speed about the blade rotation axis. The blades 21A and 21B thereby cut the workpiece W from the front side (device formation side) of the workpiece W. The cutting process of the workpiece W by the blades 21A and 21B forms the machined groove 9 in the workpiece W.

[0055] The microscope 23 is integrally mounted on the Z bracket 44 with the spindle 22A (or the spindle 22B), for example, and is held so as to be movable in the Y and Z directions integrally with the spindle 22A via the Y bracket 43 and the Z bracket 44. The microscope 23 images the front surface pattern of the workpiece W and the machined groove 9 from the front side of the workpiece W. The image of the front surface of the workpiece W captured by the microscope 23 is used for grooving inspection to align the blades 21A and 21B with respect to the cutting street of the workpiece W and to confirm the position of the machined groove 9.

[0056] The microscope 24 is integrally mounted on the Z bracket 44 with the spindle 22B (or the spindle 22A), and is held so as to be movable in the Y and Z directions by the Y bracket 43 and the Z bracket 44. The microscope 24 uses, for example, a white interference microscope or a laser microscope (laser displacement meter), and acquires a three-dimensional coordinate data set 60 (also referred to as point group data, see [ 60 ]) representing the shape (stereoscopic shape) of the machined groove 9. Figure 4). The three-dimensional coordinate data set 60 will be described in detail later and is used to generate a cross-sectional profile 64 of the machined groove 9 (see Figure 5 ) In addition, both the microscopes 23 and 24 may be composed of a "microscope for alignment and groove inspection" and a "microscope for acquiring three-dimensional coordinate data sets (white interference microscope, etc.)".

[0057] Furthermore, in this embodiment, the microscope 23 and the microscope 24 are provided separately, but the two may be integrated.

[0058] The work table 31 has a porous workpiece holding surface 31 a, and the workpiece W is sucked and held by the workpiece holding surface 31 a from the back side of the workpiece W. The work table 31 is held so as to be movable in the X direction by an X bracket 36 described later, and is held so as to be rotatable about a rotation axis CA by a rotation unit 37 described later.

[0059] The processing unit 16 is provided with an X-base 32, an X-guide 34, an X-drive unit 35, an X-carriage 36, and a rotation unit 37. The X-base 32 has a flat plate shape extending in the X-direction, and the X-guide 34 is provided on its upper surface in the Z-direction. The X-guide 34 extends in the X-direction and guides the X-carriage 36 in the X-direction. The X-drive unit 35 uses an actuator such as a linear motor to move the X-carriage 36 in the X-direction along the X-guide 34.

[0060] The rotating unit 37 is mounted on the upper surface of the X-bracket 36. Furthermore, the worktable 31 is mounted on the upper surface of the rotating unit 37. The rotating unit 37 is driven by a rotation drive unit (not shown) composed of a motor and gears. As a result, the rotating unit 37 rotates the worktable 31 in the θ direction about its rotation axis CA.

[0061] The workpiece W conveyed from the loading port 12 by the conveying mechanism 14 is sucked and held by the worktable 31, and is thereby moved and rotated integrally with the worktable 31. In addition, the processing unit 16 may be provided with a plurality of worktables 31.

[0062] The processing unit 16 is also equipped with a Y base 41, a Y guide 42, a pair of Y brackets 43, and a pair of Z brackets 44. The Y base 41 has a gate-like shape that spans the X base 32 in the Y direction. The Y guide 42 is provided on the side surface of the Y base 41 on the X direction side. The Y guide 42 extends in the Y direction and is used to guide the pair of Y brackets 43 in the Y direction. The pair of Y brackets 43 are independently moved along the Y guide 42 by a Y drive unit (not shown), such as a stepping motor and a ball screw.

[0063] A Z carriage 44 is mounted on each of the pair of Y carriages 43 so as to be movable in the Z direction by a Z drive unit (not shown) composed of an actuator such as a stepping motor. Furthermore, the spindle 22A and the microscope 23 are mounted on one Z carriage 44, while the spindle 22B and the microscope 24 are mounted on the other Z carriage 44.

[0064] During the cutting process of the workpiece W, the various parts of the processing unit 16 are driven to perform the cutting feed of the workpiece W in the X direction (processing feed direction) and the indexing feed of the blades 21A and 21B in the Y direction and the cutting feed in the Z direction, thereby forming a processing groove 9 along each cutting path of the workpiece W.

[0065] Figure 3 1 is a block diagram of the cutting device 10 according to the first embodiment. Figure 3 Among the various structures of the cutting device 10, the following cross-sectional profile 64 (see Figure 5 ) is omitted from the diagram as appropriate (described later). Figures 7 to 9 Same).

[0066] like Figure 3 As shown, the device control control device 50 uniformly controls the actions of the various parts of the cutting device 10, and functions as a control device and a groove shape measuring device of the present invention. The device control control device 50 has an arithmetic circuit composed of various processors (Processor) and memories. Various processors include CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit) and programmable logic devices [(such as SPLD (Simple Programmable Logic Devices), CPLD (Complex Programmable Logic Device) and FPGA (Field Programmable Gate Arrays)], etc. In addition, the various functions of the device control control device 50 can be implemented by one processor or by multiple processors of the same or different types.

[0067] The device control device 50 functions as a device control unit 52 and a processing unit 54 by executing a control program (not shown).

[0068] During the cutting process of the workpiece W, the device control unit 52 controls each unit of the processing unit 16 to perform known alignment and formation of the processed groove 9 (cutting process) (see Patent Documents 1 and 2 above).

[0069] In addition, when measuring the cross-sectional profile 64 of the machining groove 9 (refer to Figure 5 ), the device control unit 52 controls each unit of the processing unit 16 (microscope 24, etc.) and performs the shape measurement of the known processing groove 9 using the microscope 24 (refer to the above-mentioned patent documents 1 and 2).

[0070] For example, if microscope 24 is a white interference microscope, device control unit 52 controls various components of processing unit 16 to adjust the position of microscope 24 relative to workpiece W so that microscope 24 is located above the machined groove 9 in the Z direction. Subsequently, device control unit 52 controls various components of processing unit 16 to continuously irradiate machined groove 9 with illumination light from microscope 24 and capture interference light (reflected light from machined groove 9 and reference light from the reference surface) using the microscope 24's two-dimensional imaging element while scanning the machined groove 9 in the Z direction. Furthermore, if the shape measurement range of machined groove 9 is wider than the measurable range of microscope 24, the position of microscope 24 relative to workpiece W is changed in the X or Y direction, and the above-described scanning in the Z direction, irradiation with illumination light from microscope 24, and capture of interference light are repeated. Microscope 24 may also be connected to a processing unit separate from processing unit 54, described later, that processes or constructs a set of image data captured by scanning microscope 24 in the Z direction. In this case, the observation unit may be constituted by the microscope 24 and a processing unit different from the processing unit 54 described later. The observation unit is connected to the processing unit 54 and can transmit and receive data with the processing unit 54.

[0071] Furthermore, the device control unit 52 calculates the cross-sectional profile 64 (see Figure 5 ), performs various evaluations such as status judgment of the blades 21A and 21B during processing, judgment of the processing quality of the processing groove 9, detection of debris, and detection of the offset amount of the processing position of the processing groove 9, and performs correction of the cutting process based on the evaluation results.

[0072] The processing unit 54 performs a cross-sectional profile 64 (see FIG. 6 ) of the processed groove 9 based on the shape measurement result of the processed groove 9 performed by the microscope 24. Figure 5) is generated without constructing the three-dimensional data (three-dimensional model) of the machined groove 9. The processing unit 54 functions as a coordinate data acquisition unit 55, a projection data generation unit 56, and a cross-sectional profile calculation unit 57. In addition, at least one of the functions of the processing unit 54 (the coordinate data acquisition unit 55, the projection data generation unit 56, and the cross-sectional profile calculation unit 57) may be provided in the microscope 24.

[0073] When the shape of the machined groove 9 is measured using the microscope 24, the coordinate data acquisition unit 55 acquires a three-dimensional coordinate data set 60 (see FIG. 1 ) consisting of a plurality of three-dimensional coordinate data (XYZ coordinate data) representing the shape (three-dimensional shape) of the machined groove 9 based on various signals output from the microscope 24. Figure 4 For example, when the microscope 24 is a white interference microscope, the coordinate data acquisition unit 55 acquires a three-dimensional coordinate data set 60 based on the interference signal output from each pixel of the two-dimensional imaging element of the microscope 24 during the scanning of the microscope 24 in the Z direction (see the above-mentioned patent document 2).

[0074] Figure 4 1 is an explanatory diagram for explaining the generation of the two-dimensional projection data 62 by the projection data generating unit 56. Figure 4 In the figure, the three-dimensional coordinate data set 60 shown by reference numeral 4A is represented by three-dimensional data (image) in order to illustrate the projection of the three-dimensional coordinate data set 60 by the projection data generating unit 56 onto a two-dimensional plane. However, in this embodiment, the generation of three-dimensional data of the processed groove 9 is not performed. Projection includes acquiring data required to generate a two-dimensional image from the three-dimensional coordinate data set 60, acquiring data required to generate a two-dimensional image from the three-dimensional coordinate data set 60 and generating a two-dimensional image, acquiring two-dimensional coordinate data or two-dimensional data from the three-dimensional coordinate data set 60, acquiring two-dimensional coordinate data or two-dimensional data from the three-dimensional coordinate data set 60 and generating a two-dimensional image, converting the three-dimensional coordinate data set 60 into a two-dimensional coordinate data set or two-dimensional data, and converting the three-dimensional coordinate data set 60 into a two-dimensional coordinate data set or two-dimensional data and generating a two-dimensional image.

[0075] like Figure 4As shown in the image diagram in reference numeral 4A, the projection data generating unit 56 projects each point of the three-dimensional coordinate data group 60 (point group) of the machined groove 9 onto an imaginary two-dimensional plane 61 (on the YZ plane) perpendicular to the X direction, which is the machining feed direction, to generate two-dimensional projection data 62 of the machined groove 9 as shown in reference numeral 4B. Furthermore, the "machining feed direction" in this specification is not limited to the relative movement direction of the workpiece W relative to the blades 21A and 21B during cutting (here, the X direction). If the measurement of a workpiece W after machining is completed and the measurement of a machined line having an angle difference with the machined groove 9 currently being machined (generally orthogonal, but not limited to this), it also includes the longitudinal direction of the machined groove 9 (any direction parallel to the XY plane).

[0076] In the two-dimensional projection data 62, as shown by arrow A1 in the figure, a shape deviation of the machined groove 9 occurs in the X direction (see Figure 11 ), and data deviations due to vibrations, etc., when the shape of the machined groove 9 is measured by the microscope 24. Therefore, the shape deviations of the machined groove 9 along the X direction are reflected in the two-dimensional projection data 62. Since such two-dimensional projection data 62 can be generated simply by projecting each point of the three-dimensional coordinate data set 60 onto the two-dimensional plane 61, the generation processing load is smaller than the generation processing load of the three-dimensional data (three-dimensional model) described in Patent Documents 1 and 2, etc.

[0077] Figure 5 1 is an explanatory diagram for explaining the calculation of the cross-sectional profile 64 by the cross-sectional profile calculation unit 57. Figure 5 As shown in the figure 5A, the cross-sectional profile calculation unit 57 calculates the cross-sectional profile 64 of the machined groove 9, as shown in the figure 5B, based on the two-dimensional projection data 62 generated by the projection data generation unit 56. Specifically, the cross-sectional profile calculation unit 57 calculates the cross-sectional profile 64 by performing at least one of noise removal and statistical processing on the two-dimensional projection data 62. For example, an ideal shape of the cross-sectional profile 64 may be recorded and determined (noise removed) by a shape pattern matching method with the two-dimensional projection data 62, or noise may be removed from the two-dimensional projection data 62 using a well-known machine learning method. This cross-sectional profile 64 is used for various evaluations and corrections to the cutting process performed by the device control unit 52 as described above.

[0078] In this embodiment, the projection data generator 56 projects the three-dimensional coordinate data set 60 onto a two-dimensional plane 61 perpendicular to the X direction. However, the two-dimensional plane 61 may also be substantially perpendicular to the X direction. Furthermore, at the intersection of the grid-like cut lanes of the workpiece W, the projection data generator 56 may project the three-dimensional coordinate data set 60 of the machined groove 9 parallel to the X direction onto the two-dimensional plane 61, and project the three-dimensional coordinate data set 60 of the machined groove 9 parallel to the Y direction onto a hypothetical two-dimensional plane perpendicular to the Y direction, which is the longitudinal direction of the machined groove 9. This allows the cross-sectional profile calculation unit 57 to simultaneously calculate the cross-sectional profile 64 of the machined groove 9 parallel to the X direction and the cross-sectional profile 64 of the machined groove 9 parallel to the Y direction.

[0079] [Function of the First Embodiment]

[0080] Figure 6 This is a flowchart showing the flow of a measurement process of the cross-sectional profile 64 of the machined groove 9 by the cutting device 10 of the first embodiment according to the groove shape measuring method of the present invention.

[0081] like Figure 6 As shown, after or during the cutting process of the workpiece W by the cutting device 10, the device control unit 52 controls the various components of the processing unit 16 (particularly the microscope 24) to measure the shape of the processed groove 9 using the microscope 24. Consequently, the coordinate data acquisition unit 55 acquires a three-dimensional coordinate data set 60 representing the three-dimensional shape of the processed groove 9 based on various signals output by the microscope 24 (step S1, corresponding to the coordinate data acquisition step of the present invention).

[0082] Then, as already mentioned Figure 4 As shown, the projection data generating unit 56 projects the three-dimensional coordinate data set 60 obtained by the coordinate data acquiring unit 55 onto a two-dimensional plane 61 to generate two-dimensional projection data 62 of the processing groove 9 (step S2, equivalent to the projection data generating step of the present invention). Figure 11 The two-dimensional projection data 62 shown reflects the shape deviations of the machined groove 9 along the X direction. This allows for statistical evaluation (e.g., averaging) of the shape variations of the machined groove 9 in the X direction (the machining feed direction). Furthermore, projection can increase the number of data points even for steep slopes of the machined groove 9, which have a high data loss rate. Furthermore, compared to conventional methods of generating three-dimensional data (three-dimensional models), this reduces the load on the control unit 50 for controlling the device.

[0083] Then, as already mentioned Figure 5As shown, the cross-sectional profile calculation unit 57 performs noise removal and statistical processing on the two-dimensional projection data 62 generated by the projection data generation unit 56, thereby calculating a cross-sectional profile 64 of the machined groove 9 (step S3, corresponding to the cross-sectional profile calculation step of the present invention). Here, since the two-dimensional projection data 62 reflects the shape deviation of the machined groove 9 along the X direction, the surface information of the machined groove 9 appears at multiple Z positions at the same Y coordinate in the two-dimensional projection data 62. However, by performing noise removal and statistical processing on the two-dimensional projection data 62, a highly reliable cross-sectional profile 64 can be obtained.

[0084] Furthermore, if vibrations are generated during the shape measurement of the machined groove 9 by the microscope 24, the shape measurement results (the point data of the three-dimensional coordinate data set 60 in the present invention and the conventional three-dimensional data) may be biased. For example, in the cutting device 10, air guides / linear motors are sometimes used for the X guide 34 and the X drive unit 35 for the purpose of high precision and high durability. However, in such cases, the restraining force in the X direction is relatively weak. Therefore, if the X-axis slightly oscillates during the shape measurement of the machined groove 9 due to disturbance vibrations in the floor environment where the cutting device 10 is installed or vibrations from other units mounted on the cutting device 10 (such as the spin cleaning device), errors (deviations) may occur in the shape measurement results of the machined groove 9.

[0085] To address this issue, a highly rigid stage must be designed. However, by calculating the cross-sectional profile 64 as in this embodiment, vibration suppression can be achieved with a level of accuracy acceptable to the cutting device 10. The accumulation and projection of the X-direction shape measurement data enables statistical analysis, improving robustness. Furthermore, compared to conventional three-dimensional data measurement, the cross-sectional profile 64 can be measured with higher accuracy.

[0086] After completing the calculation of the cross-sectional profile 64, the device control unit 52 performs various evaluations based on the cross-sectional profile 64, such as status judgment of the blades 21A and 21B, judgment of the processing quality of the processing groove 9, detection of fragments, and detection of the offset of the processing position of the processing groove 9, and performs correction of the cutting process based on the evaluation results (step S4).

[0087] As described above, the cutting device 10 of the first embodiment generates two-dimensional projection data 62 from the three-dimensional coordinate data set 60 of the machined groove 9, and calculates the cross-sectional profile 64 based on the two-dimensional projection data 62. This eliminates the need to generate three-dimensional data and cut a cross section from the three-dimensional data as in the past. In addition, even if vibration occurs during the shape measurement of the machined groove 9, the cross-sectional profile 64 can be measured with high precision. As a result, the processing load of the control device 50 for controlling the device can be reduced, and a highly reliable cross-sectional profile 64 of the machined groove 9 can be obtained. In addition, since the processing load of the control device 50 for controlling the device is reduced, the measurement speed of the cross-sectional profile 64 is improved.

[0088] [Second embodiment]

[0089] Figure 7 This is a block diagram of the cutting device 10 according to the second embodiment. In the cutting device 10 according to the first embodiment, the device control device 50 performs cross-sectional profile measurement processing, including the acquisition of a three-dimensional coordinate data set 60, the generation of two-dimensional projection data 62, and the calculation of a cross-sectional profile 64. In contrast, in the cutting device 10 according to the second embodiment, a portion of the cross-sectional profile measurement processing is performed by a measurement control device (e.g., measurement control device 50A), which is a calculation device separate from the device control device 50.

[0090] like Figure 7 As shown, the cutting device 10 of the second embodiment has a structure that is basically the same as the cutting device 10 of the first embodiment, except that a measurement control device 50A is provided inside the processing unit 16 (or may be provided outside the processing unit 16 or outside the cutting device 10). Therefore, components that are functionally or structurally the same as those of the first embodiment are denoted by the same reference numerals and their descriptions are omitted.

[0091] The measurement control device 50A corresponds to the computing device of the present invention and, together with the device control device 50, constitutes the groove shape measuring device of the present invention. The measurement control device 50A is connected to the device control device 50 via a communication network (not shown). By executing a control program (not shown), the measurement control device 50A functions as the coordinate data acquisition unit 55 and projection data generation unit 56 described in the first embodiment. Thus, in the second embodiment, the measurement control device 50A can execute the acquisition of the three-dimensional coordinate data set 60 by the coordinate data acquisition unit 55 and the generation of the two-dimensional projection data 62 by the projection data generation unit 56. In other words, the measurement control device 50A can execute a portion of the cross-sectional profile measurement process.

[0092] Furthermore, the measurement control device 50A is provided with a data storage unit 58 . The data storage unit 58 stores the two-dimensional projection data 62 generated by the projection data generation unit 56 .

[0093] The device control device 50 of the second embodiment corresponds to the control device of the present invention, and its processing unit 54 functions as a cross-sectional profile calculation unit 57. The cross-sectional profile calculation unit 57 acquires two-dimensional projection data 62 from the data storage unit 58 or refers to the two-dimensional projection data 62 in the data storage unit 58, and calculates a cross-sectional profile 64 based on the two-dimensional projection data 62, similarly to the first embodiment.

[0094] As described above, in the cutting device 10 of the second embodiment, cross-sectional profile measurement processing can be distributed across multiple computing devices (device control device 50, measurement control device 50A). This reduces the processing load on the device control device 50, allowing the device control device 50 (device control unit 52) ​​to control the operation of various components of the cutting device 10. Furthermore, the speed of measuring the cross-sectional profile 64 can be increased. Furthermore, the same effects as those described in the first embodiment can be achieved.

[0095] [Third embodiment]

[0096] Figure 8 This is a block diagram of the cutting device 10 of the third embodiment. In the cutting device 10 of the second embodiment, the measurement control device 50A performs part of the cross-sectional profile measurement process, but in the cutting device 10 of the third embodiment, the measurement control device 50A performs all of the cross-sectional profile measurement process.

[0097] like Figure 8 As shown, the structure of the cutting device 10 of the third embodiment is basically the same as that of the cutting device 10 of the second embodiment. Therefore, for the components that are the same in function or structure as those in the above embodiments, the same figure marks are marked and their descriptions are omitted.

[0098] The measurement control device 50A of the third embodiment corresponds to the calculation device and groove shape measuring device of the present invention. This measurement control device 50A functions as the coordinate data acquisition unit 55, projection data generation unit 56, and cross-sectional profile calculation unit 57 described in the first embodiment. Thus, in the third embodiment, the measurement control device 50A can perform all cross-sectional profile measurement processes, including the acquisition of a three-dimensional coordinate data set 60 by the coordinate data acquisition unit 55, the generation of two-dimensional projection data 62 by the projection data generation unit 56, and the calculation of a cross-sectional profile 64 by the cross-sectional profile calculation unit 57.

[0099] The data storage unit 58 of the third embodiment stores the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57 .

[0100] The device control device 50 of the third embodiment corresponds to the control device of the present invention, and its processing unit 54 functions as a cross-sectional profile reference unit 59. The cross-sectional profile reference unit 59 references (or may acquire) the cross-sectional profile 64 in the data storage unit 58. This allows the device control unit 52 to perform various evaluations and corrections to the cutting process.

[0101] As described above, in the cutting device 10 of the third embodiment, the entire cross-sectional profile measurement process is performed by the measurement control device 50A, thereby reducing the processing load of the device control device 50 compared to the second embodiment. In addition, the same effects as those described in the above embodiments can be achieved.

[0102] [Fourth embodiment]

[0103] Figure 9 FIG. 1 is a block diagram of a cutting device 10 according to a fourth embodiment. Figure 9 As shown, in the fourth embodiment, a plurality of cutting devices 10 according to the second embodiment or the third embodiment are provided, and each cutting device 10 shares one measurement control device 50A.

[0104] Since the structure of each cutting device 10 (including the measurement control device 50A) of the fourth embodiment is basically the same as the structure of the cutting device 10 of the second embodiment or the third embodiment described above, the components that are functionally or structurally identical to those of the above-mentioned embodiments are marked with the same reference numerals and their descriptions are omitted. The measurement control device 50A is equivalent to the common computing device of the present invention and performs cross-sectional profile measurement processing together with the device control device 50 of each cutting device 10 as described in the second embodiment, or performs cross-sectional profile measurement processing independently as described in the third embodiment.

[0105] Although each cutting device 10 requires a high processing capacity when performing cross-sectional profile measurement processing, it is in a low-load state during cutting processing. Therefore, by having multiple cutting devices 10 share a single measurement control device 50A, as in the fourth embodiment, it is possible to reduce the processing load of the device control control device 50 of each cutting device 10 without increasing the number of measurement control devices 50A. As a result, even when multiple cutting devices 10 are installed, it is possible to achieve low costs and at the same time obtain the same effects as those of the above-mentioned embodiments. In addition, in this case, it is preferable to stagger the timing of the cross-sectional profile measurement processing of each of the multiple cutting devices 10.

[0106] [Fifth embodiment]

[0107] Figure 10 This is a block diagram of the cutting device 10 according to the fifth embodiment. Figure 8 ), the cross-sectional profile measurement process (acquisition of the three-dimensional coordinate data set 60, generation of the two-dimensional projection data 62, and calculation of the cross-sectional profile 64) is performed by the measurement control device 50A. Thus, when the device control device 50 does not perform the cross-sectional profile 64 measurement process, the processing load on the device control device 50 can be reduced regardless of the content of the processing performed by the measurement control device 50A. Therefore, in the cutting device 10 of the fifth embodiment, the measurement control device 50A performs the generation of the cross-sectional profile 64 in the conventional method, that is, the generation of the cross-sectional profile 64 from the three-dimensional data of the machined groove 9.

[0108] like Figure 10 As shown, the structure of the cutting device 10 of the fifth embodiment is basically the same as that of the cutting device 10 of the third embodiment, except that some functions of the measurement control device 50A are different. Therefore, the same reference numerals are attached to the components that are functionally or structurally the same as those of the third embodiment, and their description is omitted.

[0109] The measurement control device 50A according to the fifth embodiment functions as a three-dimensional data generating unit 70 and a cross-sectional profile generating unit 72 in addition to the coordinate data acquiring unit 55 described above.

[0110] The three-dimensional data generating unit 70 generates three-dimensional data (three-dimensional model) of the machined groove 9 using a known method (see Patent Document 1 and Patent Document 2) based on the three-dimensional coordinate data group 60 acquired by the coordinate data acquiring unit 55 .

[0111] The cross-sectional profile generating unit 72 generates a cross-sectional profile 64 of the machined groove 9 by cutting out an arbitrary cross-sectional area or a cross-sectional area specified by the user from the three-dimensional data of the machined groove 9 generated by the three-dimensional data generating unit 70. This cross-sectional profile 64 is stored in the data storage unit 58. Thus, the cross-sectional profile referencing unit 59 of the device control unit 50 refers to (or may obtain) the cross-sectional profile 64 in the data storage unit 58, and the device control unit 52 performs various evaluations and corrections to the cutting process.

[0112] As described above, in the cutting device 10 of the fifth embodiment, by making the measurement control device 50A execute all the processing related to the generation of the cross-sectional profile 64, the processing load of the device control device 50 can be reduced regardless of the content of the processing. Figure 9) As described in the accompanying drawings, the measurement control device 50A of the fifth embodiment can also be shared by multiple cutting devices 10.

[0113] [Sixth embodiment]

[0114] Figure 11 This is a block diagram of a cutting device 10 according to a sixth embodiment. The cutting device 10 according to the sixth embodiment calculates a desired numerical value representing the machining state of the machined groove 9 based on the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57, and controls the machining unit 16 based on the calculated numerical value to achieve the desired shape of the machined groove 9.

[0115] like Figure 11 As shown, the structure of the cutting device 10 of the sixth embodiment is basically the same as that of the cutting device 10 of the first embodiment, except that the processing unit 16 is equipped with a grinding wheel 46 and the processing unit 54 functions as a numerical calculation unit 65. Therefore, the same reference numerals are attached to the components that are the same in function or structure as those of the first embodiment, and their description is omitted.

[0116] The grinding wheel 46 is used for the sharpening and dressing operations of the blades 21A and 21B. The sharpening operation is to eliminate the blockage of the blades 21A and 21B when the sharpness of the blades 21A and 21B is reduced, or to remove the worn abrasive particles and produce a new cutting edge. The dressing operation is to shape the front end faces of the blades 21A and 21B into a flat shape when the front end faces of the blades 21A and 21B are deformed into a semicircular shape, or to shape the blades 21A and 21B into a shape in order to obtain the finished shape of the processing groove 9. In addition, the specific method of the sharpening and dressing operations is omitted here because it is a known technology. In addition, different types of grinding wheels 46 can also be used in the sharpening and dressing operations.

[0117] Figure 12 1 is an explanatory diagram for explaining an example of the calculation processing of the numerical calculation unit 65 of the sixth embodiment. Figure 12 and the aforementioned Figure 11 As shown, the numerical calculation unit 65 calculates a desired numerical value representing the machining state of the machined groove 9 based on the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57. An example of this desired numerical value is a numerical value representing the concavity and convexity of the bottom surface of the machined groove 9. During the cutting of the machined groove 9 by the inserts 21A and 21B, there are cases where chips are not discharged from the machined groove 9, the center portion of the front end surface of the inserts 21A and 21B wears unevenly (abnormally), and the front end surface becomes substantially concave.

[0118] When such uneven wear of the blades 21A and 21B progresses, the quality of the machined groove 9 deteriorates due to burrs, the surface contamination of the workpiece W changes, the shape of the chips changes, the blades 21A and 21B break, and the machined groove of the full-cut blades in the process after machining the interior of the machined groove 9 (during step cutting) becomes serpentine and the blades break. Therefore, by calculating a numerical value representing the bottom surface unevenness of the machined groove 9 (for example, the height difference between the bottom center and the bottom end) by the numerical calculation unit 65, the bottom surface unevenness of the machined groove 9 is monitored, thereby enabling the detection of uneven wear of the blades 21A and 21B at an initial stage.

[0119] Furthermore, the desired numerical values ​​representing the processing state of the machined groove 9 are not limited to the numerical values ​​representing the concavity and convexity of the bottom surface of the machined groove 9. For example, the width of the machined groove 9, the processing depth, the offset of the forming position, the shape of the edge and sidewall surfaces, the cross-sectional shape and its symmetry, etc. can be cited. In addition, when performing step cutting as the cutting process of the machined groove 9 (i.e., forming a first machined groove by one of the blades 21A and 21B and forming a second machined groove on the bottom surface of the first machined groove by the other blade 21A and 21B), the desired numerical values ​​mentioned above can be cited as examples such as the width of the second machined groove, the offset of the center positions of the first and second machined grooves, etc.

[0120] The device control unit 52 of the sixth embodiment performs various evaluations such as status judgment of the blades 21A and 21B, judgment of the processing quality of the processing groove 9, detection of fragments, and detection of the offset amount of the processing position of the processing groove 9 based on the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57 and the numerical calculation results calculated by the numerical calculation unit 65.

[0121] At this time, the device control unit 52 functions as the control unit of the present invention and controls the processing unit 16 so that the processed groove 9 has a desired shape based on the numerical calculation result of the numerical calculation unit 65. Specifically, the device control unit 52 compares the numerical value calculated by the numerical calculation unit 65 with the design value (threshold range) of the numerical value, and controls (feedback control) the processing unit 16 based on the comparison result so that the processed groove 9 has the desired shape.

[0122] For example, when the numerical value calculated by the numerical calculation unit 65 is Figure 12When the numerical value representing the unevenness of the bottom surface of the machined groove 9 described in the preceding text exceeds the design value (threshold range), i.e., when blades 21A and 21B are unevenly worn, the device control unit 52 controls the processing unit 16 to perform a dressing operation on blades 21A and 21B using the grinding wheel 46. Furthermore, when the degree of uneven wear (deformation) of blades 21A and 21B is significant, the device control unit 52 controls the processing unit 16 to perform a dressing operation on blades 21A and 21B using the grinding wheel 46. Thus, by detecting uneven wear of blades 21A and 21B at the initial stage based on the numerical value calculated by the numerical calculation unit 65, the amount of wear on blades 21A and 21B during dressing operations can be reduced. Consequently, the life of blades 21A and 21B can be extended.

[0123] Alternatively, instead of performing the dressing operation or the trimming operation in the cutting device 10 , the operator may be urged to adjust the shapes of the blades 21A and 21B by performing the dressing operation or the like.

[0124] Figure 13 This is a flow chart showing the process of measuring the cross-sectional profile 64 of the machined groove 9 and the feedback control performed by the cutting device 10 of the sixth embodiment, according to the control method of the machining device of the present invention. Figure 13 Until step S3, due to the above Figure 6 The present invention is the same as the first embodiment described in , so the detailed description is omitted here.

[0125] like Figure 13 As shown, once the calculation process of the cross-sectional profile 64 is completed (step S3), the numerical calculation unit 65 calculates the desired numerical value representing the processing state of the processing groove 9 based on the cross-sectional profile 64 (step S3A, equivalent to the numerical calculation step of the present invention). Figure 12 The values ​​shown represent the concavity and convexity of the bottom surface of the processed groove 9, etc.

[0126] Next, the device control unit 52 performs the various evaluations described above based on the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57 and the numerical calculation results calculated by the numerical calculation unit 65 (step S4A). At this time, the device control unit 52 controls (feedback controls) the processing unit 16 based on the result of comparing the numerical value calculated by the numerical calculation unit 65 with the design value (threshold range) of the numerical value so that the processed groove 9 becomes the desired shape (step S5, which corresponds to the control step of the present invention). Thus, for example, in the case of Figure 12 As shown, when uneven wear occurs on the blades 21A and 21B, the device control unit 52 controls the processing unit 16 to perform a sharpening operation or a trimming operation on the blades 21A and 21B. Alternatively, the operator may be urged to perform the sharpening operation or the trimming operation.

[0127] As described above, in the cutting device 10 of the sixth embodiment, by calculating the desired numerical value representing the processing state of the processed groove 9 based on the cross-sectional profile 64, the processing unit 16 can be controlled (feedback controlled) based on the calculation result of the numerical value so that the processed groove 9 becomes the desired shape.

[0128] Furthermore, similarly to the cutting apparatuses 10 of the second and third embodiments, the numerical calculation processing performed by the numerical calculation unit 65 in the cutting apparatus 10 of the sixth embodiment may be executed by the measurement control unit 50A. That is, a portion or all of the processing performed by the processing unit 54 of the sixth embodiment may be executed by the measurement control unit 50A. Furthermore, similarly to the fourth embodiment, a plurality of cutting apparatuses 10 of the sixth embodiment may be provided, with each cutting apparatus 10 sharing a single measurement control unit 50A. Furthermore, similarly to the cutting apparatus 10 of the sixth embodiment, the numerical calculation processing performed by the numerical calculation unit 65 and the feedback control of the processing unit 16 performed by the apparatus control unit 52 may be executed in the cutting apparatus 10 of the fifth embodiment.

[0129] [Seventh embodiment]

[0130] Figure 14 This is a block diagram of a cutting device 10 according to a seventh embodiment. While the aforementioned embodiments illustrate the measurement process of the cross-sectional profile 64 of the machined groove 9 formed in the workpiece W by cutting using a pair of blades 21A and 21B, the structure of the cutting device 10 and the method for forming the machined groove 9 are not particularly limited. The cutting device 10 according to the seventh embodiment forms the machined groove 9 in the workpiece W by laser machining (ablation groove machining) and performs, for example, the measurement process of the cross-sectional profile 64 of the machined groove 9.

[0131] like Figure 14 As shown, the structure of the cutting device 10 of the seventh embodiment is basically the same as that of the cutting device 10 of the first embodiment, except that it includes a laser processing unit 80 instead of the processing unit 16. Therefore, components that are functionally or structurally identical to those of the first embodiment are designated by the same reference numerals, and their descriptions are omitted. In addition, in the seventh embodiment, the laser processing unit 80 and the microscope 24 are provided separately, but the two may also be provided integrally.

[0132] Figure 15 1 is a schematic diagram showing an example of the structure of the laser processing unit 80. Figure 15 As shown, the laser processing unit 80 focuses the laser light L on the cut street of the workpiece W. In this state, the table 31 (workpiece W) is moved in the X direction by the transport mechanism 14, thereby performing laser processing to form the processed grooves 9 (isolation grooves (edge-cut grooves) 9a and hollow grooves (center-cut grooves) 9b) along the cut street.

[0133] Here, in the sixth embodiment, isolation processing and hollowing processing, which are well-known laser processing, are performed simultaneously (for example, refer to Japanese Patent Application Laid-Open No. 2021-192922). Isolation processing is laser processing that uses two lasers L (point light) to form two mutually parallel isolation grooves 9a along the cutting path. Hollowing processing is laser processing that uses linear lasers L to form a hollow groove 9b between the two isolation grooves 9a formed by the isolation processing. In addition, it is also possible to perform conventional laser processing to form the processed groove 9 without performing isolation processing and hollowing processing.

[0134] The laser processing unit 80 includes a laser head 82, reflecting mirrors 84A and 84B, an optical axis position sensor 85, an ATT 86 serving as an attenuator, a BE 88 serving as a beam expander, a focusing lens 94, a position adjustment unit 96, a dust collection unit 98, an LS camera 100 serving as a camera for observing the focusing position (such as an area sensor), a cleaning unit 102, a PM 104 serving as a power meter, and a beam profiler 106.

[0135] The laser head 82 emits laser light L (eg, pulsed laser light). The conditions of the laser light L include, but are not limited to, UV (ultraviolet) pulsed laser light, wavelength of 400 nm or less, repetition frequency of 1 to 100 kHz, and average output of 0.5 to 10 watts.

[0136] The reflectors 84A and 84B are at least rotatable. Furthermore, the positions of the reflectors 84A and 84B may also be adjustable. The optical axis position sensor 85 is, for example, a PSD (Position Sensitive Detector), which detects the optical axis positions of the laser light L passing through the reflector 84A and the reflector 84B, respectively. By adjusting the angles of the reflectors 84A and 84B based on the detection results of the optical axis position sensor 85, the laser light L can be perpendicularly incident on the downstream optical element (here, the ATT 86).

[0137] The ATT 86 is rotatably provided and attenuates the laser light L incident via the reflection mirrors 84A and 84B to an appropriate level (amplitude).

[0138] The BE 88 is provided to be capable of linear motion and rotation. The BE 88 enlarges or reduces the beam diameter of the laser light L incident from the ATT 86. This allows the beam profile of the laser light L at the processing point for isolation processing and hollowing processing to be changed and adjusted.

[0139] The focusing lens 94 is configured to be able to perform linear motion in the Z direction through a Z drive unit (not shown). In addition, the focusing lens 94 is maintained by a position adjustment unit 96 so as to be able to perform linear motion in the XY direction. The focusing lens 94 focuses the two lasers L for isolation processing and the linear laser L for hollowing processing on the cutting path of the workpiece W. By adjusting the position of the focusing lens 94 in the Z direction, the focus of each laser L can be adjusted. As a result, for example, laser processing can be performed at a focus position that is exactly focused relative to the cutting path of the workpiece W, or laser processing can be performed at an offset position. In addition, by adjusting the position of the focusing lens 94 in the XY direction, the position of the processing point for isolation processing and hollowing processing can be adjusted.

[0140] The dust collecting unit 98 includes a dust collecting nozzle (not shown) from which debris generated by laser processing is sucked. By adjusting the position of the dust collecting nozzle, adhesion of debris to the focusing lens 94 can be reduced.

[0141] The LS camera 100 captures images of the points processed by the isolation process and the hollowing process. The cleaning unit 102 removes dirt from the condenser lens 94 .

[0142] PM 104 measures the power of laser L at the processing points for isolation and hollowing. By adjusting the attenuation rate of laser L by ATT 86 based on the measurement results of PM 104, the energy of laser L at the processing point can be adjusted to a desired value.

[0143] The beam profiler 106 measures the beam energy distribution of the laser light L at the processing points of isolation processing and hollowing processing. This makes it possible to measure the beam diameter, position, and energy distribution deviation of the laser light L for isolation processing or hollowing processing.

[0144] return Figure 14 The device control unit 52 of the device control device 50 of the seventh embodiment controls the various components of the laser processing unit 80 during laser processing of the workpiece W, performing known alignment and forming (laser processing) the processed groove 9 (see Japanese Patent Application Laid-Open No. 2021-192922). Furthermore, when measuring the cross-sectional profile 64 of the processed groove 9, the device control unit 52 controls the microscope 24 and other components, similarly to the first embodiment, to measure the shape of the processed groove 9 using the microscope 24.

[0145] The processing unit 54 of the control device 50 for device control of the seventh embodiment is basically the same as the processing unit 54 of the first embodiment except that it functions as the numerical calculation unit 65 in the same way as the sixth embodiment, and generates a cross-sectional profile 64 of the processing groove 9 based on the shape measurement result of the processing groove 9 based on the microscope 24.

[0146] Figure 16 and Figure 17 This is an explanatory diagram for explaining an example of numerical calculation processing performed by the numerical calculation unit 65 of the seventh embodiment. The numerical calculation unit 65 of the seventh embodiment calculates a desired numerical value representing the processing state of the processed groove 9 (the isolation groove 9a and the hollow groove 9b) formed by laser processing based on the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57.

[0147] like Figure 16 As shown, as an example of a desired numerical value in the seventh embodiment, a numerical value representing the unevenness of the bottom surface of the machined groove 9 in the X direction (machining feed direction, longitudinal direction) can be cited. During laser machining, unevenness is generated on the bottom surface of the machined groove 9 along the X direction due to output abnormalities of the laser light L emitted from the laser head 82, focusing abnormalities of the laser light L used for isolation and hollowing machining by the condenser lens 94, and pulse spacing abnormalities of the laser light L (pulsed laser). These unevenness are also reflected in the cross-sectional profile 64. Therefore, by calculating the numerical value representing the unevenness of the bottom surface of the machined groove 9 in the X direction (for example, the unevenness deviation range 64S shown by the dotted mark in the figure), it is possible to detect abnormalities in the output, focusing, and pulse spacing of the laser light L.

[0148] In addition, if Figure 17 As shown, another example of a desired numerical value in the seventh embodiment is a numerical value representing the deviation in the cross-sectional shape of the machined groove 9. During laser processing, the cross-sectional shape of the machined groove 9 varies due to positional fluctuations of the laser light L used for hollowing processing, fluctuations in the optical axis of the laser light L, fluctuations in the positions of the laser light L used for isolation processing and hollowing processing, and fluctuations in the beam diameter of the laser light L. Therefore, by calculating a numerical value representing the deviation in the cross-sectional shape of the machined groove 9 (for example, the ratio of the depths D1 and D2 at the two ends of the machined groove 9 in the Y direction), it is possible to detect fluctuations in the position of the laser light L, fluctuations in the optical axis, and fluctuations in the beam diameter.

[0149] return Figure 14 The seventh embodiment of the cutting apparatus will now be described. The apparatus control unit 52 of the seventh embodiment performs various evaluations, such as determining the status of each component of the laser processing unit 80, determining the quality of the processing of the processed groove 9, detecting debris, and detecting the amount of deviation in the processing position of the processed groove 9, based on the cross-sectional profile 64 calculated by the cross-sectional profile calculation unit 57 and the numerical calculation results calculated by the numerical calculation unit 65.

[0150] Furthermore, similarly to the sixth embodiment, the device control unit 52 of the seventh embodiment controls (feedback controls) the laser processing unit 80 based on the numerical calculation result of the numerical calculation unit 65 so that the processed groove 9 has a desired shape.

[0151] For example, when the numerical value calculated by the numerical calculation unit 65 is Figure 16 When the numerical value representing the concave-convexity of the bottom surface of the processed groove 9 in the X direction exceeds the design value (threshold range), the device control unit 52 determines that at least one of the output abnormality, focusing abnormality and pulse spacing abnormality of the laser L has occurred.

[0152] Furthermore, if an output abnormality of laser light L occurs, the device control unit 52 performs power calibration to adjust the attenuation rate of laser light L in the ATT 86 based on the measurement results of the PM 104, thereby adjusting the energy of laser light L at the processing points for isolation and hollowing to the desired value. Furthermore, if a focusing abnormality of laser light L occurs, the device control unit 52 adjusts the Z-direction position of the condenser lens 94 to appropriately adjust the focusing position of the laser light L for isolation and hollowing.

[0153] Furthermore, if an abnormality occurs in the pulse spacing of the laser light L, the device control unit 52 adjusts the moving speed (processing feed speed) of the table 31 in the X direction by the X drive unit 35 during laser processing, and the frequency of the laser light L emitted from the laser head 82. Furthermore, in this case, the operator may be prompted to inspect the X drive unit 35 and the laser head 82.

[0154] When the numerical value calculated by the numerical calculation unit 65 is Figure 17 When the numerical value representing the deviation of the cross-sectional shape of the processed groove 9 described in the figure exceeds the design value (threshold range), the device control unit 52 determines that at least one of the position change, optical axis change and beam diameter change of the laser L has occurred.

[0155] If the position of the hollowing laser L fluctuates, the device control unit 52 controls BE 88 to adjust the beam diameter of the laser L, thereby adjusting the position and beam profile of the hollowing laser L. Furthermore, if the optical axis of the laser L fluctuates, the device control unit 52 adjusts the angles of the reflectors 84A and 84B so that the laser L is incident perpendicularly on the ATT 86.

[0156] Furthermore, if the position of the isolation and hollowing laser light L fluctuates, the device control unit 52 adjusts the position of the condenser lens 94 in the XY directions via the position adjustment unit 96, thereby appropriately adjusting the position of the processing point of the isolation and hollowing laser light L. Furthermore, if the beam diameter of the laser light L fluctuates, the beam diameter of the laser light L is adjusted by controlling the BE 88, thereby appropriately adjusting the beam diameter of the isolation and hollowing laser light L.

[0157] The process of measuring the cross-sectional profile 64 of the machined groove 9 and the feedback control performed by the cutting device 10 of the seventh embodiment is the same as that of the aforementioned embodiment. Figure 13 The sixth embodiment described in is basically the same, so the detailed description is omitted here.

[0158] As described above, in the cutting device 10 of the seventh embodiment that performs laser processing, by calculating the cross-sectional profile 64 based on the two-dimensional projection data 62, it is possible to achieve, as in the first embodiment described above, a reduction in the processing load of the control device 50 for controlling the device and acquisition of a high-reliability cross-sectional profile 64 of the processed groove 9. Furthermore, in the cutting device 10 of the seventh embodiment, by calculating a desired numerical value representing the processing state of the processed groove 9 based on the cross-sectional profile 64, it is possible to control (feedback control) the laser processing unit 80 so that the processed groove 9 has a desired shape, as in the sixth embodiment described above.

[0159] Furthermore, similarly to the cutting apparatuses 10 of the second and third embodiments, part or all of the processing performed by the processing unit 54 of the seventh embodiment may be performed by the measurement control unit 50A. Furthermore, similarly to the fourth embodiment, a plurality of cutting apparatuses 10 of the seventh embodiment may be provided, with each cutting apparatus 10 sharing a single measurement control unit 50A. Furthermore, similarly to the cutting apparatus 10 of the seventh embodiment, the cutting apparatus 10 of the fifth embodiment may also perform laser processing.

[0160] [other]

[0161] In the above-mentioned embodiments, the measurement processing of the cross-sectional profile 64 of the processed groove 9 formed on the workpiece W by cutting or laser processing is described as an example, but the structure of the cutting device 10 and the method of forming the processed groove 9 (including half-cut groove) are not specifically limited.

[0162] In the second to fourth embodiments described above, the number of measurement control devices 50A is one, but a plurality of measurement control devices 50A may be provided.

[0163] Description of Reference Numerals

[0164] 9 processing slots

[0165] 9a isolation slot

[0166] 9b hollow slot

[0167] 10 cutting device

[0168] 10A housing

[0169] 12 loading ports

[0170] 14Transportation Agency

[0171] 16 Processing Department

[0172] 18 Cleaning Department

[0173] 21A blade

[0174] 21B Blade

[0175] 22A spindle

[0176] 22B spindle

[0177] 23 Microscope

[0178] 24 microscopes

[0179] 31 workbench

[0180] 31a Workpiece holding surface

[0181] 32X base

[0182] 34X guide

[0183] 35X drive unit

[0184] 36X bracket

[0185] 37 Rotation Unit

[0186] 41Y base

[0187] 42Y guide

[0188] 43Y bracket

[0189] 44Z bracket

[0190] 46 Grinding Wheel

[0191] 50 Control device for device control

[0192] 50A measurement control device

[0193] 52 Device control unit

[0194] 54 Processing Department

[0195] 55 Coordinate data acquisition unit

[0196] 56 Projection data generation unit

[0197] 57 Cross-section profile calculation unit

[0198] 58 Data Storage

[0199] 59 Cross-section profile reference

[0200] 60 3D coordinate data

[0201] 61 Two-dimensional plane

[0202] 62 2D projection data

[0203] 64 Section Profile

[0204] 65 Numerical Operation Unit

[0205] 70 Three-dimensional data generation department

[0206] 72 Section Profile Generation Unit

[0207] 80 Laser Processing Department

[0208] 82 laser head

[0209] 84A Reflector

[0210] 84B reflector

[0211] 85 Optical axis position sensor

[0212] 86 Attenuator (ATT)

[0213] 88 Beam Expander (BE)

[0214] 90 circuit components

[0215] 92 branch components

[0216] 94 condenser lens

[0217] 96 Position Adjustment Unit

[0218] 98 Dust collection unit

[0219] 100 Line Scan (LS) Camera

[0220] 102 Cleaning Unit

[0221] 104 Power Meter (PM)

[0222] 106 Beam Profiler

[0223] CA Rotary Axis

[0224] CP1, CP2 cut-out position

[0225] F-Frame

[0226] PC50 device control PC

[0227] PC50A Measurement PC

[0228] W workpiece

Claims

1. A method for measuring a groove shape, comprising: a coordinate data acquisition step of acquiring a plurality of three-dimensional coordinate data representing the shape of the machining groove formed on the workpiece by the machining device; a projection data generating step of generating two-dimensional projection data of the processed groove by projecting the three-dimensional coordinate data acquired in the coordinate data acquiring step onto a two-dimensional plane; and The cross-sectional profile calculation step calculates the cross-sectional profile of the machined groove based on the two-dimensional projection data generated in the projection data generation step.

2. The groove shape measuring method according to claim 1, wherein: In the cross-sectional profile calculation step, at least one of noise removal processing and statistical processing is performed on the two-dimensional projection data to calculate the cross-sectional profile.

3. The groove shape measuring method according to claim 1 or 2, wherein: The two-dimensional projection data generation process performed in the projection data generation step and the cross-sectional outline calculation process performed in the cross-sectional outline calculation step are distributedly executed by a plurality of calculation devices.

4. The groove shape measuring method according to claim 3, wherein: One of the plurality of computing devices is a control device that controls the processing device.

5. The groove shape measuring method according to claim 3, wherein: The plurality of computing devices include a control device for the processing device provided for each of the plurality of processing devices and a common computing device shared by the plurality of processing devices.

6. The groove shape measuring method according to claim 1 or 2, wherein: The two-dimensional projection data generation process performed in the projection data generation step and the cross-sectional profile calculation process performed in the cross-sectional profile calculation step are executed only by a calculation device different from a control device that controls the processing device.

7. The groove shape measuring method according to claim 6, wherein: The computing device is a common computing device shared by a plurality of the processing devices.

8. The groove shape measuring method according to claim 1, comprising: The numerical calculation step calculates a desired numerical value representing a machining state of the machined groove based on the cross-sectional profile calculated in the cross-sectional profile calculation step.

9. The groove shape measuring method according to claim 8, wherein: In the cross-sectional profile calculation step, at least one of noise removal processing and statistical processing is performed on the two-dimensional projection data to calculate the cross-sectional profile.

10. The groove shape measuring method according to claim 8 or 9, wherein: The two-dimensional projection data generation process executed in the projection data generation step, the cross-sectional profile calculation process executed in the cross-sectional profile calculation step, and the numerical value calculation process executed in the numerical value calculation step are distributedly executed by a plurality of calculation devices.

11. The groove shape measuring method according to claim 10, wherein: One of the plurality of computing devices is a control device that controls the processing device.

12. The groove shape measuring method according to claim 10, wherein: The plurality of computing devices include a control device for the processing device provided for each of the plurality of processing devices and a common computing device shared by the plurality of processing devices.

13. The groove shape measuring method according to claim 8 or 9, wherein: The generation processing of the two-dimensional projection data performed in the projection data generation step, the calculation processing of the cross-sectional profile performed in the cross-sectional profile calculation step, and the calculation processing of the numerical value in the numerical calculation step are performed only by a calculation device different from the control device that controls the processing device.

14. The groove shape measuring method according to claim 13, wherein: The computing device is a common computing device shared by a plurality of the processing devices.

15. A method for controlling a processing device, comprising: a coordinate data acquisition step of acquiring a plurality of three-dimensional coordinate data representing the shape of the machining groove formed on the workpiece by the machining device; a projection data generating step of generating two-dimensional projection data of the processing groove by projecting the three-dimensional coordinate data acquired in the coordinate data acquiring step onto a two-dimensional plane; a cross-sectional profile calculating step of calculating a cross-sectional profile of the machined groove based on the two-dimensional projection data generated in the projection data generating step; a numerical calculation step of calculating a desired numerical value representing a machining state of the machined groove based on the cross-sectional profile calculated in the cross-sectional profile calculation step; and A control step of controlling the machining device so that the machined groove has a desired shape based on the numerical value calculated in the numerical calculation step.

16. A groove shape measuring device comprising: a coordinate data acquisition unit that acquires a plurality of three-dimensional coordinate data representing the shape of a machining groove formed on a workpiece by a machining device; a projection data generating unit configured to generate two-dimensional projection data of the processing groove by projecting the three-dimensional coordinate data acquired by the coordinate data acquiring unit onto a two-dimensional plane; as well as The cross-sectional profile calculation unit calculates the cross-sectional profile of the machined groove based on the two-dimensional projection data generated by the projection data generation unit.

17. The groove shape measuring device according to claim 16, comprising: The numerical value calculation unit calculates a desired numerical value indicating a machining state of the machined groove based on the cross-sectional profile calculated by the cross-sectional profile calculation unit.

18. A processing device comprising: Processing part, forming a processing groove on the workpiece ； The groove shape measuring device according to claim 17; and The control unit controls the machining unit so that the machined groove has a desired shape based on the numerical value calculated by the numerical calculation unit.

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