Drive control device

Abstract

In a first drive control device (DA1) which is a drive control device according to the present invention, the center (G3) of a third microcomputer (MP13) is disposed on one side across a virtual line (VL) connecting the center (G1) of a first microcomputer (MP11) and the center (G2) of a second microcomputer (MP12), and when viewed from a direction orthogonal to the virtual line (VL) in the horizontal direction of a circuit board (1), the center (G3) of the third microcomputer (MP13) is aligned with the center (G2) of the second microcomputer (MP12). At least a portion of the third microcomputer (MP13) is configured to overlap with at least one of the first microcomputer (MP11) and the second microcomputer (MP12).

Description

Technical Field

[0001] The present invention relates to a drive control device. Background Art

[0002] As a conventional drive control device, for example, the drive control device described in the following Patent Document 1 is known.

[0003] Roughly speaking, this drive control device includes three CPUs (microcomputers) and is a so-called redundant system drive control device capable of driving and controlling dual-system motors using two of the three CPUs.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2004-80939 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] However, the conventional drive control device does not take into account the placement of the three CPUs. Therefore, for example, as shown in the patent document, if the three CPUs are arranged side by side with their centers aligned in a straight line, the wiring distance between the CPUs at the ends becomes longer than the wiring distance between the central CPU and the CPUs at the ends. This reduces the noise immunity of the drive control device, leaving room for improvement.

[0009] Therefore, the present invention has been made in view of the technical problems of the conventional drive control device, and an object of the present invention is to provide a drive control device capable of suppressing a decrease in noise immunity.

[0010] Means for solving problems

[0011] In one embodiment of the present invention, the center of a third microcomputer is arranged on one side across a virtual line connecting the centers of a first microcomputer and a second microcomputer, and when viewed in a direction perpendicular to the virtual line in the horizontal direction of a circuit substrate, at least a portion of the third microcomputer is arranged to overlap with at least one of the first microcomputer and the second microcomputer.

[0012] Effects of the Invention

[0013] According to the present invention, it is possible to suppress a decrease in noise resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a block diagram showing the system configuration of the drive control device according to the present invention.

[0015] Figure 2 It is a plan view of a circuit board in the first embodiment of the drive control device according to the present invention.

[0016] Figure 3 This is a schematic diagram of a circuit board showing the main portion of the first embodiment of the present invention.

[0017] Figure 4 This diagram shows another example of the first embodiment of the present invention and is a schematic diagram showing a change in the arrangement (layout) of microcomputers on a circuit board.

[0018] Figure 5 It is a schematic diagram of a circuit board according to a modified example of the first embodiment of the present invention.

[0019] Figure 6 This is a schematic diagram of a circuit board showing a main portion of a second embodiment of the present invention.

[0020] Figure 7 This is a schematic diagram of a circuit board showing a main portion of a third embodiment of the present invention.

[0021] Figure 8 1 is a schematic diagram showing a circuit board of a main part of a fourth embodiment of the present invention. Figure 8 (a) is a top view, Figure 8 (b) is the Figure 8 (a) AA line cross-sectional view.

[0022] Figure 9 is a schematic diagram of a circuit board according to a modified example of the fourth embodiment of the present invention. Figure 9 (a) is a top view, Figure 9 (b) is the Figure 9 (a) BB line cross-sectional view. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments of the drive control device according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, an example in which the drive control device according to the present invention is applied to an ECU for a steering system of an automobile will be described.

[0024] [First embodiment]

[0025] Figure 1 A block diagram showing a system configuration of a steering system to which a drive control device (a first drive control device DA1 described later) according to the present embodiment is applied is shown.

[0026] like Figure 1As shown, the steering system ST is a so-called steer-by-wire system, in which a steering wheel (not shown) and a steering wheel (not shown) are not mechanically connected. Specifically, the steering system ST has a triple redundant system, comprising three steering angle sensors: first, second, and third steering angle sensors AS1, AS2, and AS3; a first drive control unit DA1 that generates a steering force on the steering wheel (not shown) based on the steering angle input to each steering angle sensor AS1, AS2, and AS3; and a second drive control unit DA2 that generates a reaction force on the steering wheel (not shown) as steering resistance based on the steering angle input to each steering angle sensor AS1, AS2, and AS3.

[0027] The first drive control device DA1 includes first and second steering motors SM1 and SM2 as dual-system steering motors, first, second, and third microcomputers MP11, MP12, and MP13 as three microprocessors (microcomputers) constituting a triple-system control system, and first, second, and third inverters IV11, IV12, and IV13.

[0028] In the first, second, and third microcomputers MP11, MP12, and MP13 that make up the triple-system control system, the first and second microcomputers MP11 and MP12 respectively constitute the main system, while the third microcomputer MP13 constitutes the backup system. Specifically, the first microcomputer MP11 drives and controls the first steering motor SM1 via the first inverter IV11. Similarly, the second microcomputer MP12 drives and controls the second steering motor SM2 via the second inverter IV12. In the event of a failure in either the first or second microcomputer MP12, the third microcomputer MP13 takes over drive and controls the first or second steering motor SM1 or SM2 via the third inverter IV13.

[0029] Furthermore, the first steering angle θ1 detected by the first steering angle sensor AS1 is input to the first microcomputer MP11 via the first CAN driver CD11. Similarly, the second steering angle θ2 detected by the second steering angle sensor AS2 is input to the second microcomputer MP12 via the second CAN driver CD12. Meanwhile, the third steering angle θ3 detected by the third steering angle sensor AS3 is directly input to the third microcomputer MP3.

[0030] The first inverter IV11 is connected to the first steering motor SM1 via a first relay RL11. Similarly, the second inverter IV12 is connected to the second steering motor SM2 via a second relay RL12. Meanwhile, the third inverter IV13 is connected to the first steering motor SM1 via first-third relays RL31 and to the second steering motor SM2 via second-third relays RL32.

[0031] The second drive control device DA2 includes first and second reaction force motors SR1 and SR2 as dual-system reaction force motors, first and second microcomputers MP21 and MP22 as two microprocessors (microcomputers) constituting a dual-system control system, and first and second inverters IV21 and IV22.

[0032] The first microcomputer MP21 drives and controls the first reaction force motor SR1 via a first inverter IV21. Furthermore, the first inverter IV21 is connected to the first reaction force motor SR1 via a first relay RL21. Similarly, the second microcomputer MP22 drives and controls the second reaction force motor SR2 via a second inverter IV22. Furthermore, the second inverter IV22 is connected to the second reaction force motor SR2 via a second relay RL22.

[0033] Furthermore, the first steering angle θ1 detected by the first steering angle sensor AS1 is input to the first microcomputer MP21 via the first CAN driver CD21. Similarly, the second steering angle θ2 detected by the second steering angle sensor AS2 is input to the second microcomputer MP22 via the second CAN driver CD22. Furthermore, the first CAN driver CD21 of the second drive control device DA2 is capable of communicating with the first CAN driver CD11 of the first drive control device DA1, and the second CAN driver CD22 is capable of communicating with the second CAN driver CD12.

[0034] (Structure of drive control device)

[0035] Figure 2 A plan view showing a circuit board constituting the first drive control device DA1 is shown.

[0036] The first drive control device DA1 is driven by Figure 2The circuit substrate 1 shown is a substantially rectangular circuit substrate housed inside a not-shown frame. The circuit substrate 1 is fixed to the not-shown frame via fastening members (such as screws) that penetrate six mounting holes 100 disposed on the outer periphery of the circuit substrate 1. The circuit substrate of the first drive control device DA1 can be composed of a single circuit substrate or a plurality of circuit substrates. In this embodiment, the first drive control device DA1 is composed of a plurality of circuit substrates. Figure 2 The circuit board 1 shown is one of a plurality of circuit boards constituting the first drive control device DA1 , and the circuit board 1 is connected to other circuit boards (not shown) via a harness (not shown) inserted into a connector CN described later.

[0037] Specifically, the circuit substrate 1 has a Figure 2 The first mounting surface 11 shown in the figure is formed with a Figure 2 The electronic circuit (pattern) not shown flows from the left side to the right side. Furthermore, the first mounting surface 11 mainly includes the first, second, and third microcomputers MP11, MP12, and MP13 as three microcomputers, the first, second, and third power supply elements PS1, PS2, and PS3 as three power supply elements (power supply ICs), and the first, second, and third pre-drivers PD11, PD12, and PD13 as three pre-drivers. In addition, on the first mounting surface 11 of the circuit substrate 1, at one end in the longitudinal direction ( Figure 2 A connector CN, which serves as a B2B connector for connecting to another circuit board (not shown), is provided at the right end of the circuit board 1. Furthermore, a plurality of coils 21, a plurality of inspection connectors 22, a plurality of diodes 23, and a plurality of electrolytic capacitors 24 are mounted on the mounting surface of the circuit board 1.

[0038] The first, second and third microcomputers MP11, MP12 and MP13 form a triple system. The first and second microcomputers MP11 and MP12 form a main system and the third microcomputer MP13 forms a backup system. Therefore, when the first and second microcomputers MP11 and MP12 are working normally, the first and second microcomputers MP11 and MP13 are based on the first and second steering angle sensors AS1 and AS2 (refer to Figure 1 ) to calculate the first and second driving torques T1 and T2 based on the first and second steering angles θ1 and θ2 detected by the third microcomputer MP13. On the other hand, if either the first or second microcomputer MP11 or MP12 fails, the third microcomputer MP13, acting as a substitute for the failed first microcomputer MP11 or second microcomputer MP12, calculates the first driving torque T1 or second driving torque T2 based on the first steering angle θ1 or second steering angle θ2.

[0039] Furthermore, the circuit board 1 includes, in addition to the first microcomputer MP11, peripheral electronic components such as chip capacitors and chip resistors, forming a first central arithmetic circuit CC1. Similarly, the circuit board 1 includes, in addition to the second microcomputer MP12, peripheral electronic components such as chip capacitors and chip resistors, forming a second central arithmetic circuit CC2. Furthermore, the circuit board 1 includes, in addition to the third microcomputer MP13, peripheral electronic components such as chip capacitors and chip resistors, forming a third central arithmetic circuit CC3.

[0040] The first power supply element PS1 supplies driving power to the first microcomputer MP11. Furthermore, in addition to the first power supply element PS1, peripheral electronic components such as chip capacitors and chip resistors are included to form the first power circuit PC1. Similarly, the second power supply element PS2 supplies driving power to the second microcomputer MP12. Furthermore, in addition to the second power supply element PS2, peripheral electronic components such as chip capacitors and chip resistors are included to form the second power circuit PC2. Furthermore, the third power supply element PS3 supplies driving power to the third microcomputer MP13. Furthermore, in addition to the third power supply element PS3, peripheral electronic components such as chip capacitors and chip resistors are included to form the third power circuit PC3.

[0041] The first pre-driver PD11 drives and controls the first steering motor SM1 based on the first drive torque T1 calculated by the first microcomputer MP11. In addition to the first pre-driver PD11, peripheral electronic components such as chip capacitors and chip resistors constitute a first input circuit DC1. Similarly, the second pre-driver PD12 drives and controls the second steering motor SM2 based on the second drive torque T2 calculated by the second microcomputer MP12. In addition to the second pre-driver PD12, peripheral electronic components such as chip capacitors and chip resistors constitute a second input circuit DC2. Furthermore, the third pre-driver PD13 drives and controls the first steering motor SM1 or the second steering motor SM2 based on the first drive torque T1 or the second drive torque T2 calculated by the third microcomputer MP13. In addition to the third pre-driver PD13, peripheral electronic components such as chip capacitors and chip resistors constitute a third input circuit DC3.

[0042] Figure 3 This is a diagram showing the characteristic structure of this embodiment, and is a schematic diagram showing the positional relationship (layout) between the first, second, and third microcomputers MP11 , MP12 , and MP13 and the first, second, and third power supply elements PS1 , PS2 , and PS3 on the first mounting surface 11 of the circuit board 1 . Figure 4A schematic diagram showing a modified example of the arrangement structure (layout) of the first, second, and third microcomputers MP11 , MP12 , and MP13 on the first mounting surface 11 of the circuit board 1 is shown.

[0043] like Figure 3 As shown, on the circuit substrate 1, the first microcomputer MP11 and the second microcomputer MP12 constituting the main system among the first, second and third microcomputers MP11, MP12 and MP13 are arranged in a direction perpendicular to the long side direction of the circuit substrate 1 ( Figure 3 The first microcomputer MP11 and the second microcomputer MP12 are arranged in a so-called mirror image configuration so as to face each other in the vertical direction. Furthermore, the first microcomputer MP11 and the second microcomputer MP12 are arranged closely together with a distance C1 that is shorter than one side OS or a diagonal line DG of the outer shape of the third microcomputer MP13 in a plan view of the circuit board 1.

[0044] Furthermore, on the circuit board 1, the third microcomputer MP13, which constitutes the backup system among the first, second, and third microcomputers MP11, MP12, and MP13, is arranged downstream of the first and second microcomputers MP11 and MP12, that is, closer to the pre-drivers (first, second, and third pre-drivers PD11, PD12, and PD13) than a virtual line VL connecting the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12. Furthermore, the third microcomputer MP13 is arranged so that a portion of the third microcomputer MP13 overlaps with at least one of the first and second microcomputers MP11 and MP12 when viewed in the horizontal direction of the circuit board 1 from a direction perpendicular to the virtual line VL.

[0045] Here, if Figure 3 As shown, in a plan view of the circuit substrate 1, the third microcomputer MP13 is preferably positioned such that its center G3 is located between the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12 (GS12). More preferably, the third microcomputer MP13 is positioned such that its center G3 is equidistant from the centers G1 and G2 of the first and second microcomputers MP11 and MP12, respectively. In other words, the distance GS13 between the first and third microcomputers MP11 and MP13 is equal to the distance GS23 between the second and third microcomputers MP12 and MP13.

[0046] Furthermore, regarding the above-mentioned "the third microcomputer MP13 is arranged so that a portion of the third microcomputer MP13 overlaps with at least one of the first and second microcomputers MP11 and MP12 when viewed from a direction perpendicular to the virtual line VL in the horizontal direction of the circuit substrate 1", except for the following Figure 3 In addition to the embodiment in which the side OS of the first, second and third microcomputers MP11, MP12 and MP13 is parallel or perpendicular to the virtual line VL, there are also embodiments such as Figure 4 In (a), the diagonal lines DG of the first, second, and third microcomputers MP11 , MP12 , and MP13 are parallel to the virtual line VL.

[0047] Furthermore, since the third microcomputer MP13 constitutes a backup system, for example, Figure 4 (b) Figure 4 As shown in (c), the third microcomputer MP13 may be formed to have a size different from that of the first and second microcomputers MP11 and MP12, which are configured in a mirror state and constitute the main system. In this case, for example, Figure 4 As shown in (d), the first and second microcomputers MP11 and MP12 and the third microcomputer MP13 may be arranged in different directions so that only one side OS of the first and second microcomputers MP11 and MP12 is parallel to or perpendicular to the virtual line VL, and only the diagonal line DG of the third microcomputer MP13 is parallel to the virtual line VL.

[0048] In the present embodiment, the third microcomputer MP13 is arranged in close proximity to the first and second microcomputers MP11 and MP12 in the circuit board 1 at a distance C2 smaller than the distance C1 between the first microcomputer MP11 and the second microcomputer MP12 .

[0049] Furthermore, on the circuit board 1, the first, second, and third power supply elements PS1, PS2, and PS3 are positioned upstream of the first, second, and third microcomputers MP11, MP12, and MP13, that is, on opposite sides of the pre-drivers (first, second, and third pre-drivers PD11, PD12, and PD13) across a virtual line VL. Furthermore, in this embodiment, the first, second, and third power supply elements PS1, PS2, and PS3 are arranged in parallel at approximately equal intervals along the vertical direction of the circuit board 1, that is, in a direction parallel to the virtual line VL. Furthermore, of the first, second, and third power supply elements PS1, PS2, and PS3, the first power supply element PS1 and the second power supply element PS2 are positioned at opposite ends in a mirror-image configuration, and the third power supply element PS3 is positioned between the first and second power supply elements PS1 and PS2.

[0050] (Effects of this embodiment)

[0051] In the aforementioned conventional drive control device, no consideration was given to the placement (layout) of the first, second, and third microcomputers, which serve as the three CPUs. Therefore, for example, as shown in the illustrations in the aforementioned patent document, if the first, second, and third microcomputers are arranged side by side with their centers aligned in a straight line, the wiring distance between the third microcomputer in the center and the first and second microcomputers at the ends becomes longer than the wiring distance between the third microcomputer in the center and the first and second microcomputers at the ends. This, in turn, reduces the noise immunity of the drive control device, leaving room for improvement.

[0052] In contrast, the first drive control device DA1 according to the present embodiment is a drive control device having at least three drive systems for supplying drive power to the windings of the electric motors (the first and second steering motors SM1 and SM2). The first drive system, the second drive system, and the third drive system constituting the three drive systems have a first microcomputer MP11, a second microcomputer MP12, and a third microcomputer MP13 in a rectangular shape when viewed from above on a circuit board 1. The first drive system is driven and controlled by the first microcomputer MP11, the second drive system is driven and controlled by the second microcomputer MP12, and the third drive system is driven and controlled by the third microcomputer MP13. 13 drive control, in a plan view of the circuit substrate 1, the first microcomputer MP11 and the second microcomputer MP12 are arranged closer to each other than the length of a side OS or a diagonal line DG of the outer shape of the third microcomputer MP13, the center G3 of the third microcomputer MP13 is arranged on one side of a virtual line VL connecting the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12, and when viewed in a direction perpendicular to the virtual line VL in the horizontal direction of the circuit substrate 1, at least a portion of the third microcomputer MP13 is arranged so as to overlap with at least one of the first microcomputer MP11 and the second microcomputer MP12.

[0053] Thus, in the first drive control device DA1 according to this embodiment, the center G3 of the third microcomputer MP13 is positioned to one side across the virtual line VL connecting the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12. When viewed horizontally on the circuit board 1 and perpendicular to the virtual line VL, at least a portion of the third microcomputer MP13 overlaps with at least one of the first and second microcomputers MP11 and MP12. Consequently, the wiring distances between the first and second microcomputers MP11 and MP12, the wiring distance between the first and third microcomputers MP11 and MP13, and the wiring distance between the second and third microcomputers MP12 can all be shortened. In other words, in addition to the wiring distances between the first and second microcomputers MP11 and MP12 and the third microcomputer MP13, the wiring distance between the first and second microcomputers MP11 and MP12 can also be shortened. This can suppress a decrease in the noise immunity of the first drive control device DA1.

[0054] In addition, in this embodiment, the first drive system and the second drive system are mainly main systems for driving and controlling the electric motors (the first and second steering motors SM1 and SM2), and the third drive system is a backup system that functions as a substitute when a failure occurs in the first drive system or the second drive system.

[0055] In this way, according to this embodiment, when a failure occurs in one of the first drive system or the second drive system, the third drive system serving as a backup system can replace the failed drive system in the first and second drive systems to maintain redundant control of the electric motors driving the dual systems (the first and second steering motors SM1 and SM2).

[0056] In this embodiment, the center G3 of the third microcomputer MP13 is located between the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12 when viewed in the horizontal direction of the circuit board 1 from a direction perpendicular to the virtual line VL.

[0057] According to the present invention, the center G3 of the third microcomputer MP13 is located between the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12. This reduces the imbalance in distances between the microcomputers MP11, MP12, and MP13, and suppresses functional differences caused by the imbalance.

[0058] Furthermore, particularly in this embodiment, the first microcomputer MP11, the second microcomputer MP12, and the third microcomputer MP13 are arranged at equal distances from each other.

[0059] As described above, according to this embodiment, the first microcomputer MP11, the second microcomputer MP12, and the third microcomputer MP13 are arranged at equal distances from each other. This optimizes the distances between the microcomputers MP11, MP12, and MP13, and reduces functional differences caused by imbalances in the distances between the microcomputers MP11, MP12, and MP13.

[0060] (Variation)

[0061] Figure 5 A modified example of the first embodiment of the drive control device involved in the present invention is shown, and a schematic diagram shows the positional relationship (layout) between the first, second, and third microcomputers MP11, MP12, and MP13 and the first, second, and third power supply elements PS1, PS2, and PS3 on the first mounting surface 11 of the circuit substrate 1.

[0062] like Figure 5 As shown, in the first drive control device DA1 according to this modification, the third microcomputer MP13 is arranged closer to the first microcomputer MP11 and the second microcomputer MP12 than the distance (interval C1) between the first microcomputer MP11 and the second microcomputer MP12, and is arranged closer than the length of one side OS or the diagonal line DG of the outer shape of the third microcomputer MP13.

[0063] Thus, in this embodiment, the third microcomputer MP13 is spaced apart from the first and second microcomputers MP11 and MP12 by a distance (interval C2) greater than the distance (interval C1) between the first and second microcomputers MP11 and MP12. This reduces the thermal impact of the third microcomputer MP13 on the first and second microcomputers MP11 and MP12.

[0064] [Second embodiment]

[0065] Figure 6 This figure shows a second embodiment of the drive control device according to the present invention. This embodiment differs from the first embodiment in that the third power supply element PS3 is arranged differently; otherwise, the structure is the same as the first embodiment. Therefore, identical components to those in the first embodiment are assigned the same reference numerals, and their descriptions are omitted.

[0066] (Structure of drive control device)

[0067] Figure 6This is a diagram showing the characteristic structure of this embodiment, and is a schematic diagram showing the positional relationship (layout) between the first, second, and third microcomputers MP11 , MP12 , and MP13 and the first, second, and third power supply elements PS1 , PS2 , and PS3 on the first mounting surface 11 of the circuit board 1 .

[0068] like Figure 6 As shown, in the first drive control device DA1 according to this embodiment, the third power supply element PS3 is arranged above the third microcomputer MP13 in a plan view of the first mounting surface 11 of the circuit board 1, that is, arranged in parallel along a direction substantially parallel to the virtual line VL. In other words, in this embodiment, the first power supply element PS1 is arranged downstream of the first and second microcomputers MP11 and MP12, that is, closer to the pre-drivers (first, second, and third pre-drivers PD11, PD12, and PD13) than the virtual line VL.

[0069] (Effects of this embodiment)

[0070] As described above, in the first drive control device DA1 according to the present embodiment, the first drive system includes the first power supply element PS1 that supplies power to the first microcomputer MP11 and the first pre-driver PD11 that drives the electric motors (the first and second steering motors SM1 and SM2) based on the control signal from the first microcomputer MP11. The second drive system includes the second power supply element PS2 that supplies power to the second microcomputer MP12 and the second pre-driver PD12 that drives the electric motors (the first and second steering motors SM1 and SM2) based on the control signal from the second microcomputer MP12. The third drive system includes the third power supply element PS3 that supplies power to the third microcomputer MP13 and the third pre-driver PD11 that drives the electric motors (the first and second steering motors SM1 and SM2) based on the control signal from the third microcomputer MP13. D13, based on the control signal from the first microcomputer MP11, the second microcomputer MP12 or the third microcomputer MP13, the electric motor (the first and second steering motors SM1, SM2) are driven by the pre-drivers PD11, PD12, PD13 respectively. The first pre-driver PD11, the second pre-driver PD12 and the third pre-driver PD13 are arranged on the opposite sides of the first microcomputer MP11 and the second microcomputer MP12 with the third microcomputer MP13 in between. The first power supply element PS1 and the second power supply element PS2 are arranged on the opposite sides of the first microcomputer MP11 and the second microcomputer MP12 relative to the pre-drivers PD11, PD12, PD13 respectively. The third microcomputer MP13 and the third power supply element PS3 are arranged along the parallel direction of the first microcomputer MP11 and the second microcomputer MP12.

[0071] Thus, in this embodiment, since the third microcomputer MP13 and the third power supply element PS3 are arranged parallel to the first microcomputer MP11 and the second microcomputer MP12, the wiring connecting the third power supply element PS3 and the third microcomputer MP13 does not pass between the first and second microcomputers MP11 and MP12. This suppresses the influence of noise generated by the power supply from the third power supply element PS3 to the third microcomputer MP13 passing between the first and second microcomputers MP11 and MP12.

[0072] Furthermore, in this embodiment, the first and second power supply elements PS1 and PS2 are arranged on opposite sides of the pre-drivers (first, second, and third pre-drivers PD11, PD12, and PD13) across the first and second microcomputers MP11 and MP12. The third microcomputer MP13 and third power supply element PS3 are arranged closer to the pre-drivers (first, second, and third pre-drivers PD11, PD12, and PD13) than the first and second microcomputers MP11 and MP12. This arrangement of the third power supply element PS3, separated from the first and second power supply elements PS1 and PS2, can minimize the thermal impact of the third power supply element PS3 on the first and second power supply elements PS1 and PS2.

[0073] Furthermore, in this embodiment, the third power supply element PS3 and the third microcomputer MP13 are arranged on the respective pre-driver sides (the first, second, and third pre-drivers PD11, PD12, and PD13) with the first and second microcomputers MP11 and MP12 interposed therebetween. Therefore, even when the third microcomputer MP13 and the third power supply element PS3 are not arranged parallel to the first and second microcomputers MP11 and MP12, the wiring connecting the third power supply element PS3 and the third microcomputer MP13 does not pass between the first and second microcomputers MP12 and MP13. This suppresses the effects of noise generated by the power supply from the third power supply element PS3 to the third microcomputer MP13 passing between the first and second microcomputers MP11 and MP12.

[0074] In other words, since the third power supply element PS3 and the third microcomputer MP13 are arranged on the side of each pre-driver (the first, second, and third pre-drivers PD11, PD12, and PD13) with the first and second microcomputers MP11 and MP12 interposed therebetween, even if the third microcomputer MP13 and the third power supply element PS3 are not arranged in the parallel direction of the first microcomputer MP11 and the second microcomputer MP12, the influence of noise generated by the power supply from the third power supply element PS3 to the third microcomputer MP13 passing through the first and second microcomputers MP11 and MP12 can be suppressed.

[0075] [Third embodiment]

[0076] Figure 7 This figure shows a third embodiment of the drive control device according to the present invention. This embodiment differs from the first embodiment in the arrangement of the third power supply element PS3 and the third microcomputer MP13. The remaining configuration is the same as the first embodiment. Therefore, components identical to those in the first embodiment are assigned the same reference numerals, and their descriptions are omitted.

[0077] (Structure of drive control device)

[0078] Figure 7 This is a diagram showing the characteristic structure of this embodiment, and is a schematic diagram showing the positional relationship (layout) between the first, second, and third microcomputers MP11 , MP12 , and MP13 and the first, second, and third power supply elements PS1 , PS2 , and PS3 on the first mounting surface 11 of the circuit board 1 .

[0079] like Figure 7 As shown, in the first drive control device DA1 according to this embodiment, the third microcomputer MP13 is positioned upstream of the first and second microcomputers MP11 and MP12 on the first mounting surface 11 of the circuit board 1, that is, closer to the first and second power supply elements PS1 and PS2 than the virtual line VL. Furthermore, on the first mounting surface 11, the third power supply element PS3 is not positioned between the first and second power supply elements PS1 and PS2, but rather is positioned above the third microcomputer MP13, that is, arranged in parallel along a direction substantially parallel to the virtual line VL.

[0080] (Effects of this embodiment)

[0081] As described above, in the first drive control device DA1 according to the present embodiment, the third microcomputer MP13 and the third power supply element PS3 are arranged along the parallel direction of the first microcomputer MP11 and the second microcomputer MP12.

[0082] Thus, in this embodiment, similar to the second embodiment, the third microcomputer MP13 and the third power supply element PS3 are arranged parallel to the first microcomputer MP11 and the second microcomputer MP12. Therefore, the wiring connecting the third power supply element PS3 and the third microcomputer MP13 does not pass between the first and second microcomputers MP11 and MP12. This can suppress the influence of noise generated by the power supply from the third power supply element PS3 to the third microcomputer MP13 passing between the first and second microcomputers MP11 and MP12.

[0083] In addition, in this embodiment, the third microcomputer MP13 and the third power supply element PS3 are arranged between the first microcomputer MP11 and the second microcomputer MP12 , and the first power supply element PS1 and the second power supply element PS2 .

[0084] Therefore, even if the third microcomputer MP13 and the third power supply element PS3 are not arranged in parallel with the first microcomputer MP11 and the second microcomputer MP12, the wiring connecting the third power supply element PS3 and the third microcomputer MP13 does not pass between the first and second microcomputers MP11 and MP12. This can suppress the influence of noise generated by the power supply from the third power supply element PS3 to the third microcomputer MP13 passing between the first and second microcomputers MP11 and MP12.

[0085] [Fourth embodiment]

[0086] Figure 8 This figure shows a fourth embodiment of the drive control device according to the present invention. This embodiment differs from the first embodiment in the arrangement of the third power supply element PS3 and the third microcomputer MP13. The remaining configuration is the same as the first embodiment. Therefore, components identical to those in the first embodiment are assigned the same reference numerals, and their descriptions are omitted.

[0087] (Structure of drive control device)

[0088] Figure 8 1 is a diagram showing a main part of a first drive control device DA1 according to a fourth embodiment of the present invention. Figure 8 (a) is a schematic diagram showing the positional relationship (layout) between the first and second microcomputers MP11 and MP12 and the first, second and third power supply elements PS1, PS2 and PS3 on the first mounting surface 11 of the circuit board 1; Figure 8 (b) indicates that along the Figure 8 (a) Cross-sectional view taken along line AA.

[0089] like Figure 8As shown, in the first drive control device DA1 according to this embodiment, the circuit board 1 has Figure 8 (b) shows a first mounting surface 11 on the front surface and a second mounting surface 12 on the back surface. Mounted on the first mounting surface 11 are first and second microcomputers MP11 and MP12, two microcomputers constituting the main system, and first, second, and third power supply elements PS1, PS2, and PS3, three power supply elements (power supply ICs). The positional relationship between the first and second microcomputers MP11 and MP12 and the first, second, and third power supply elements PS1, PS2, and PS3 is the same as in the first embodiment.

[0090] Meanwhile, a third microcomputer MP13 is mounted on the second mounting surface 12. This third microcomputer MP13 constitutes a backup system in the event of a failure in one of the first and second microcomputers MP11 and MP12. Similar to the first embodiment, the third microcomputer MP13 is positioned downstream of the first and second microcomputers MP11 and MP12, that is, closer to the pre-drivers (first, second, and third pre-drivers PD11, PD12, and PD13) than a virtual line VL connecting the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12. Furthermore, the third microcomputer MP13 is positioned so that, when viewed horizontally from a direction perpendicular to the virtual line VL on the circuit board 1, a portion of the third microcomputer MP13 faces at least one of the first and second microcomputers MP11 and MP12 across the circuit board 1.

[0091] Here, if Figure 8 As shown, in a plan view of the circuit board 1, the center G3 of the third microcomputer MP13 is preferably located between the center G1 of the first microcomputer MP11 and the center G2 of the second microcomputer MP12. More preferably, the center G3 of the third microcomputer MP13 is located equidistant from the centers G1 and G2 of the first and second microcomputers MP11 and MP12, respectively.

[0092] (Effects of this embodiment)

[0093] As described above, in the first drive control device DA1 involved in this embodiment, the circuit substrate 1 has a first mounting surface 11 arranged on the surface and a second mounting surface 12 arranged on the back surface, the first microcomputer MP11 is arranged on the first mounting surface 11, and the second microcomputer MP12 or the third microcomputer MP13 is arranged on the second mounting surface 12.

[0094] Thus, according to this embodiment, the third microcomputer MP13 is arranged on the second mounting surface 12 of the circuit board 1, opposite the first mounting surface 11 on which the first microcomputer MP11 is mounted. Consequently, the mounting area of ​​the third microcomputer MP13 on the first mounting surface 11 of the circuit board 1 can be reduced by an amount corresponding to the third microcomputer MP13 arranged on the second mounting surface 12. This allows for a reduction in the size of the circuit board 1, and consequently, the size of the first drive control device DA1.

[0095] In the present embodiment, the third microcomputer MP13 arranged on the second mounting surface 12 is arranged to be partially offset in the planar direction of the circuit board 1 relative to the first microcomputer MP11 arranged on the first mounting surface 11 .

[0096] Thus, in this embodiment, the third microcomputer MP13, located on the second mounting surface 12, is arranged so that at least a portion of the first and second microcomputers MP11 and MP12, located on the first mounting surface 11, are offset in the plane of the circuit board 1. In other words, the third microcomputer MP13 is arranged so that it does not completely overlap with the first and second microcomputers MP11 and MP12 in the plane of the circuit board 1. This prevents the wiring connected to the third microcomputer MP13 from completely overlapping with the wiring connected to the first microcomputer MP11, thereby improving the layout efficiency of the wiring connected to each of the microcomputers MP11, MP12, and MP13.

[0097] In particular, in this embodiment, the third microcomputer MP13 is arranged completely offset from the first and second microcomputers MP11 and MP12 in the plane direction of the circuit board 1. This maximizes the layout of the wiring connected to the microcomputers MP11, MP12, and MP13.

[0098] (Variation)

[0099] Figure 9 This diagram shows a modified example of the fourth embodiment of the drive control device according to the present invention, and schematically illustrates the positional relationship (layout) between the first, second, and third microcomputers MP11, MP12, and MP13 and the first, second, and third power supply elements PS1, PS2, and PS3 on the first mounting surface 11 of the circuit board 1. Specifically, Figure 9 (a) is a schematic plan view showing the first mounting surface 11 of the circuit board 1 , Figure 9 (b) indicates along Figure 9 (a) Cross-sectional view taken along line BB.

[0100] like Figure 9As shown, the first drive control device DA1 involved in this modification has a heat sink 25 as a heat dissipation member for dissipating heat from the first and second microcomputers MP11, MP12, arranged on the second mounting surface 12 on the opposite side of the first mounting surface 11 on which the first and second microcomputers MP11, MP12 are mounted, at a position (region) overlapping with the first and second microcomputers MP11, MP12 across the circuit substrate 1.

[0101] In addition, on the second mounting surface 12 of the circuit board 1, a portion of the third microcomputer MP13 is arranged to overlap with the first and second microcomputers MP11 and MP12 via the circuit board 1 (see FIG. Figure 9 In other words, a portion of the third microcomputer MP13 is arranged to vertically overlap (oppose) the first and second microcomputers MP11 and MP12 with the circuit substrate 1 interposed therebetween in the longitudinal direction of the circuit substrate 1 .

[0102] On the other hand, an electrolytic capacitor 24 serving as a noise removal member for removing noise from the third microcomputer MP13 is arranged on the first mounting surface 11 opposite to the second mounting surface 12 on which the third microcomputer MP13 is mounted, at a position (region) overlapping with the third microcomputer MP13 across the circuit board 1 .

[0103] As described above, the first drive control device DA1 involved in this modified example is provided with a heat dissipation component for dissipating heat from the microcomputer arranged on one mounting surface, or a noise removal component for removing noise from the microcomputer arranged on one mounting surface, on another mounting surface opposite to the mounting surface on which at least one microcomputer among the first microcomputer MP11, the second microcomputer MP12 and the third microcomputer MP13 is arranged.

[0104] Thus, according to this variation, a heat sink 25 is disposed on the second mounting surface 12 of the circuit board 1. This heat sink 25 is a heat dissipating member that dissipates heat from the first and second microcomputers MP11 and MP12 mounted on the first mounting surface 11. This effectively dissipates heat generated by the first and second microcomputers MP11 and MP12. Furthermore, an electrolytic capacitor 24 is disposed on the first mounting surface 11 of the circuit board 1. This electrolytic capacitor 24 is a noise reduction component that reduces noise generated by the third microcomputer MP13 mounted on the second mounting surface 12. This effectively reduces electromagnetic noise generated by the third microcomputer MP13.

[0105] Furthermore, in this modified example, a portion of the third microcomputer MP13 is arranged on the second mounting surface 12 so as to overlap with the first and second microcomputers MP11 and MP12 across the circuit board 1. Consequently, the planar area of ​​the circuit board 1 occupied by the third microcomputer MP13, particularly the length of the circuit board 1 in its longitudinal direction, can be reduced by an amount corresponding to the overlap between the first and second microcomputers MP11 and MP12 and the third microcomputer MP13, thereby miniaturizing the circuit board 1. Consequently, the first drive control device DA1 can be miniaturized.

[0106] The present invention is not limited to the configuration disclosed in the above-described embodiments and the like, and can be freely modified according to, for example, the specifications of a drive control device to which the present invention is applied.

[0107] In particular, the present invention has a feature in the configuration of the first, second, and third microcomputers MP11, MP12, MP13 and the first, second, and third power supply elements PS1, PS2, PS3. Therefore, the structure of details that are not directly related to the feature, such as the number of circuit substrates 1, the specific structure of the form of the circuit substrate 1, the peripheral electronic components installed on the circuit substrate 1, etc., can be arbitrarily changed according to the specifications of the drive control device to which the present invention is applied.

[0108] In addition, in the above-mentioned embodiments, the present invention is applied to a triple redundant system. However, the present invention can be applied to a quadruple redundant system or higher as long as it has three or more microcomputers and power supply elements (power supply ICs).

Claims

1. A drive control device, characterized in that: It is a drive control device having at least three drive systems for supplying drive power to the windings of the electric motor. The first drive system, the second drive system, and the third drive system constituting the three drive systems include a first microcomputer, a second microcomputer, and a third microcomputer each having a rectangular shape when viewed from above on a circuit board. The first driving system is driven and controlled by the first microcomputer. The second driving system is driven and controlled by the second microcomputer. The third driving system is driven and controlled by the third microcomputer. In a plan view of the circuit substrate, the first microcomputer and the second microcomputer are arranged closer to each other than the length of one side or a diagonal line of the outer shape of the third microcomputer. The center of the third microcomputer is arranged on one side of a virtual line connecting the center of the first microcomputer and the center of the second microcomputer. When viewed from a direction perpendicular to the virtual line in the horizontal direction of the circuit substrate, at least a portion of the third microcomputer is arranged to overlap with at least one of the first microcomputer and the second microcomputer.

2. The drive control device according to claim 1, characterized in that: The first drive system and the second drive system are mainly the main systems for driving and controlling the electric motor. The third drive system is a backup system that functions as a substitute when a failure occurs in the first drive system or the second drive system.

3. The drive control device according to claim 2, characterized in that: The third microcomputer is arranged closer to the first microcomputer and the second microcomputer than the first microcomputer and the second microcomputer, and closer than the length of one side or a diagonal line of the outer shape of the third microcomputer.

4. The drive control device according to claim 1, wherein: The first drive system includes: a first power supply element for supplying power to the first microcomputer; and a first pre-driver for driving the electric motor based on a control signal from the first microcomputer. The second drive system includes: a second power supply element for supplying power to the second microcomputer; and a second pre-driver that drives the electric motor based on a control signal from the second microcomputer, The third drive system includes: a third power supply element for supplying power to the third microcomputer; and a third pre-driver that drives the electric motor based on a control signal from the third microcomputer, The electric motor is driven by each pre-driver based on a control signal from the first microcomputer, the second microcomputer, or the third microcomputer. The first pre-driver, the second pre-driver, and the third pre-driver are arranged on the opposite side of the first microcomputer and the second microcomputer with the third microcomputer interposed therebetween. The first power supply element and the second power supply element are arranged on the opposite side of the first microcomputer and the second microcomputer from the respective pre-drivers. The third microcomputer and the third power supply element are arranged along the parallel direction of the first microcomputer and the second microcomputer.

5. The drive control device according to claim 4, characterized in that: The third microcomputer and the third power supply element are arranged closer to the pre-drivers than the first microcomputer and the second microcomputer.

6. The drive control device according to claim 4, characterized in that: The third microcomputer and the third power supply element are arranged between the first microcomputer and the second microcomputer, and the first power supply element and the second power supply element.

7. The drive control device according to claim 1, characterized in that: When viewed from a direction perpendicular to the virtual line in the horizontal direction of the circuit substrate, the center of the third microcomputer is arranged to be located between the centers of the first microcomputer and the second microcomputer.

8. The drive control device according to claim 7, characterized in that: The first microcomputer, the second microcomputer, and the third microcomputer are arranged at equal distances from each other.

9. The drive control device according to claim 1, characterized in that: The circuit substrate has a first mounting surface provided on the front surface and a second mounting surface provided on the back surface. The first microcomputer is arranged on the first mounting surface, The second microcomputer or the third microcomputer is configured on the second mounting surface.

10. The drive control device according to claim 9, characterized in that: The second microcomputer or the third microcomputer arranged on the second mounting surface is arranged so as to be partially offset in the planar direction of the circuit board relative to the first microcomputer arranged on the first mounting surface.

11. The drive control device according to claim 10, characterized in that: On another mounting surface opposite to a mounting surface on which at least one of the first microcomputer, the second microcomputer, and the third microcomputer is arranged, a heat dissipation component for dissipating heat from the microcomputer arranged on the one mounting surface, or a noise removal component for removing noise from the microcomputer arranged on the one mounting surface is arranged.

12. The drive control device according to claim 11, characterized in that: The first drive system and the second drive system are mainly the main systems for driving and controlling the electric motor. The third drive system is a backup system that functions as a substitute when a failure occurs in the first drive system or the second drive system. The second microcomputer or the third microcomputer arranged on the second mounting surface is a microcomputer of the backup system.

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