Planar electronic device with screen

Abstract

A planar electronic device comprises a housing, an energy storage module, a processor and at least one user input device wherein the housing has a front surface on which an electronic display screen is arranged and a rear surface opposite to the front surface; the maximum thickness between the front surface and the rear surface opposite to the front surface is less than 1cm; the planar electronic device has a top portion on which is provided a hole for receiving at least one pin passing therethrough.

Description

Technical Field

[0001] The present invention relates to the field of flat handheld electronic devices with a screen. Background Art

[0002] Flat handheld electronic devices with screens (such as computers, game consoles, mobile phones, cameras, music synthesizers, educational toys, and surveillance equipment) are now widely used. However, even basic devices are expensive, partly due to the cost of components and partly due to manufacturing costs, component assembly costs, and product packaging and distribution costs.

[0003] It would be advantageous to provide a handheld electronic device having a screen that has low manufacturing and distribution costs while ensuring a rugged, wear-resistant structure and a long service life.

[0004] Patent GB2591840A, entitled “Electronic Device with Printed Circuit Board”, discloses an electronic device with a multi-layer PCB stacking structure.

[0005] The present invention arises just in this technical background.Some embodiments are also devoted to providing a device that is easy to recycle. Summary of the Invention

[0006] According to a first aspect of the present invention, a planar electronic device is provided. The device may include a housing having a front surface and an opposing rear surface. The maximum thickness between the front surface and the opposing rear surface of the housing may be less than 1 centimeter. The device may include an energy storage module. The device may include a processor. The device may include at least one user input device. Typically, an electronic display is provided on the front surface.

[0007] The at least one user input device may include one or more buttons corresponding to piano keys. The one or more buttons corresponding to piano keys may be arranged along a side of the device.

[0008] The thickness of the electronic device may vary along its length. For example, the minimum thickness of the electronic device may be at least 1 mm, typically at least 2 mm, at least 3 mm, or at least 4 mm. The thickness of the electronic device may typically vary within a range of at least 1 mm, at least 2 mm, or at least 3 mm.

[0009] Typically, the planar electronic device has a top portion with a hole thereon for accommodating at least one pin therethrough. The hole for accommodating the at least one pin may be a single hole of a regular shape (e.g., circular) or an irregular shape (e.g., kidney-shaped).

[0010] Typically, the aperture is a circular hook receiving aperture.

[0011] Accordingly, the flat electronic device can be hung on the ring hook through the hole. Thus, the device can be conveniently displayed on a point-of-sale display rack using the ring hook and can be displayed and sold together with other flat products (such as gift cards, etc.) designed for the ring hook of the display rack.

[0012] The position of the hole (i.e., the hole for receiving the at least one pin) thus defines which end is the top of the device. When the planar device is suspended from a pin (e.g., a circular hook), the top end (i.e., the end where the top is located) will be at the uppermost position. The opposite end is referred to herein as the bottom. The sides (left and right) refer to the edges extending up and down along the front and back surfaces of the housing when the device is suspended from the hole.

[0013] Typically, the screen is located below the aperture.

[0014] Typically, the holes are in the form of slots with a width of 32±4 mm.

[0015] The hole may have a height of 6 to 8 mm. The hole may include a notch or spaced notches to accommodate a hook rod having a diameter of 6.5 ± 1 mm. Accordingly, the flat device is compatible with standard European hook point-of-sale displays.

[0016] However, in some embodiments, a hole may be made in the electronic device through a protrusion (eg, a tab) mounted on top of the electronic device, rather than through the housing (and typically also through the PCB).

[0017] The width of the planar device may be 50-120 mm, typically 75-95 mm. The height of the planar device may be 100-150 mm, typically 120-130 mm. The thickness of the planar device may be less than 1 cm. The thickness of the planar device may be less than 0.75 cm. The thickness of the planar device may be less than 0.5 cm.

[0018] The weight of the planar device may be less than (or equal to) 150 grams, less than (or equal to) 100 grams, less than (or equal to) 75 grams, or less than (or equal to) 50 grams. In one example, the weight of the planar device may be 75 grams.

[0019] The housing is generally in the shape of a cube.

[0020] Typically, the shell is formed from a creased sheet. In other examples, the shell can be formed by stacking multiple layers, as described below.

[0021] The creased plate can be foldable. The construction of the electronic device may include folding a plate to form the creased plate. The construction process may include forming one or more creases. Typically, the creased plate is flexible. The creased plate may be made of a material such as elastic plastic and have creases.

[0022] The folding plate is typically provided with a hole (i.e., the hole for accommodating the at least one pin). The PCB may also have a corresponding hole (i.e., the hole for accommodating the at least one pin). Thus, in use, a pin (e.g., a ring hook) may pass through the housing and the PCB. The hole in the PCB may correspond and / or be aligned with the hole in the housing. This provides additional strength and / or facilitates the use of areas on both sides of the hole to mount electronic components connected to the PCB, thereby contributing to a compact overall configuration.

[0023] The folding plate may include: a back portion having a hole (i.e., the hole for accommodating the at least one pin) and a flap portion having a corresponding hole (i.e., the hole for accommodating the at least one pin), wherein the flap portion folds over the top of the PCB when in use so as to align with the hole. Typically, a gasket is provided around the periphery of the hole.

[0024] The crease plate may include one or more flaps, which generally wrap around the PCB to form the housing. The one or more flaps may be fixed by an adhesive.

[0025] The shell can be made of cardboard. Therefore, the creased plate can be a cardboard with creases.

[0026] The housing may comprise one or more layers of cardboard. The cardboard may have a protective layer. The flat device may have a housing formed from folded cardboard. Using cardboard not only reduces the environmental impact of the product and facilitates recycling, but also allows for a lighter and thinner product. Using injection molding would require complex and expensive processes to achieve the same thickness.

[0027] The cardboard shell may be multi-layered. The cardboard shell may include one or more coatings. For example, the cardboard shell may include a waterproof coating and / or a coloring coating.

[0028] The cardboard housing can be textured or coated with a textured material. For example, the cardboard housing can include a plastic-like (e.g., "soft-touch") coating or layer. The cardboard housing can be made of sulfite-free acid-free paper, such as Plike (Plike is a registered trademark). Advantageously, flat electronic devices with a "soft-touch" feel have a better grip and can be recycled. Because cardboard is lighter, shipping (e.g., mailing) costs can be reduced.

[0029] The housing can be made of a plate with a width more than twice that of the flat device and folded around the printed circuit board.

[0030] These flat devices typically include a printed circuit board (PCB) mounted with a display and multiple electronic components. The PCB may include multiple metal reinforcements to reduce its flexibility. This additional reinforcement facilitates the use of flexible sheet materials (e.g., cardboard) as the housing and is preferable to using a metal chassis or the like.

[0031] Typically, the energy storage module is a battery. Typically, the energy storage module is installed in a cavity formed by a hole in the PCB. The energy storage module can penetrate the entire thickness of the PCB, thereby being exposed on both the front and back surfaces of the PCB.

[0032] The device can use a PCB with a thickness of less than 1 mm. The PCB can have multiple metal reinforcement areas for reducing flexibility. The hole for accommodating the at least one pin can be formed by overlapping the holes on the PCB and the housing. This allows the thickness of the device to be extremely compressed, especially when the housing is made of a flexible material (e.g., cardboard). Some or all of the metal reinforcement areas can be metal reinforcement areas. Some or all of the metal reinforcement areas can include metal areas filled between signal conduction areas.

[0033] At least some of the metal reinforcement areas may span most of the width of the device. At least some of the metal reinforcement areas may span most of the length of the device. Some or all of the metal reinforcement areas may not conduct signals. For example, they may be electrically isolated, although they may effectively serve as a ground plane. The width of some or all of the metal reinforcement areas may exceed 1 mm. The thickness of some or all of the metal reinforcement areas may exceed the signal conductors on the PCB. Pairs of parallel metal reinforcement areas may be symmetrically distributed on the front and back surfaces of the PCB to reduce flexibility.

[0034] Typically, the thickness of the metal reinforcement area on the PCB is at least 10 microns. The thickness of the metal reinforcement area of ​​the PCB can typically be at least 20 microns, at least 30 microns, at least 35 microns, at least 50 microns, at least 60 microns, or at least 70 microns. The thickness of the metal reinforcement area of ​​the PCB can typically be at least 1 ounce or at least 2 ounces. The metal area can be formed on the rear surface of the PCB. Advantageously, the metal area enhances the strength of the electronic device by adding supportive structure to the PCB.

[0035] Typically, at least 25% of at least one surface of the PCB is metallized. The metallization may be copper or gold. Typically, at least 25%, at least 50%, or at least 75% of the at least one surface of the PCB is metallized. The surfaces may be the front surface of the PCB (i.e., the surface provided with the display screen) and / or the rear surface of the PCB (i.e., the side opposite the surface provided with the display screen). Advantageously, the metallization enhances the strength of the electronic device by adding supportive structure to the PCB.

[0036] Typically, the housing is provided with a display window; the electronic display screen can be seen through the display window.

[0037] The electronic display screen may be a part of an electronic display unit; the electronic display unit is usually attached to the housing using adhesive tape; a viewing area of ​​the electronic display screen may be seen through the display window.

[0038] The electronic display screen may be, for example, an LCD, TFT, OLED, or electronic paper. The electronic display screen may utilize an LED array. The LED array may be a high-power COB LED array. The LED array may be an integrated programmable RGB LED.

[0039] The electronic device may include an LED array. The LED array may be a high-power COB LED array. The LED array may be an integrated programmable RGB LED.

[0040] The electronic display screen may be part of an electronic display unit; the electronic display unit is typically rectangular and has a viewable area; electronic drive circuitry is disposed along one side of the viewable area. Typically, the display window is rectangular. Typically, the center of the display window is offset from the longitudinal axis of the housing (i.e., offset to the side).

[0041] Therefore, the visible area of ​​the electronic display unit is visible through the offset display window, while facilitating the packaging of the electronic display unit within the housing.

[0042] The creased sheet (optionally cardboard) may form the bulk of the front surface of the planar device and may have one or more user-actuatable button structures mounted thereon.

[0043] The one or more button structures may be formed as part of the fold plate, for example, by embossing. The one or more button structures may be attached (e.g., bonded) to the fold plate. This provides a simple and economical way to form the housing and the one or more buttons disposed thereon in a compact device.

[0044] One or more cavities may be defined within the housing.

[0045] The planar electronic device may include one or more spacers within the housing. Typically, the one or more spacers define one or more cavities for accommodating one or more electronic circuit components.

[0046] One or more gaskets may span the housing. One or more gaskets may extend between the front of the housing and the PCB. One or more gaskets may also have one or more holes. Thus, the housing, the one or more gaskets and their holes, and typically the PCB, may collectively define one or more cavities.

[0047] The one or more electronic circuit components may include, for example, a processor, a memory, a system-on-chip device having a processor and a memory, a microphone, a speaker, an interface circuit, a power supply circuit, a wireless communication transceiver circuit, and an electrical connector (e.g., a USB port). The electronic circuit may include a system-on-module (SoM) chip, which is typically soldered onto the PCB.

[0048] The one or more gaskets can be used to maintain the shape of a flexible, folded (e.g., folded) housing and protect the components within the housing. This makes it easier to use cardboard or other flexible sheet materials to make the housing and avoids the need for structures such as a metal chassis. The housing (e.g., folded plate) can contact the one or more gaskets. The one or more gaskets can also contact the PCB. Thus, the one or more gaskets can extend from the PCB to the housing.

[0049] The one or more spacers may be made of cardboard, for example, consisting of multiple layers of cardboard. This simplifies recycling of the product.

[0050] There may be at least one cavity for accommodating one or more electronic circuit components located on the left and / or right side of the hole for accommodating the at least one pin.

[0051] This structure fully utilizes the space on both sides of the hole (ie, the hole for accommodating the at least one pin), thereby making it possible to manufacture a compact device.

[0052] The planar electronic device may include at least one spacer; the spacer includes at least one fixed portion and at least one actuating portion; the actuating portion defines one or more button actuators.

[0053] The fixing portion of the gasket is generally used to define one or more cavities. One or more cavities may be formed between at least one fixing portion and at least one actuating portion.

[0054] The button actuator may include a spacer extending from the housing to the electrical contacts of the PCB so as to open or close one or more electrical contacts when pressed by a user. Thus, in use, when a user presses on the deformable housing, pressure may be transferred through the spacer, thereby opening or closing the electrical contacts on the PCB. Typically, the housing includes one or more user-actuatable button structures, each of which covers a button actuator, so that when a corresponding user-actuatable button structure is pressed, the corresponding button actuator moves to open or close one or more electrical contacts.

[0055] The button actuator may be a dome switch or a snap-action dome. The dome switch or snap-action dome may be fixed to the PCB using an adhesive such as tape or glue. However, the button actuator may also be pre-soldered on the PCB.

[0056] In some embodiments, when a user presses a corresponding user-actuatable button structure, the user-actuatable button structure can directly contact the electrical contact on the PCB. The user-actuatable button structure can include a conductive contact area (e.g., a conductive carbon contact sheet). The conductive contact area can be secured by an adhesive.

[0057] The button actuator may include at least one (typically at least two) button clusters; at least one cavity may be provided near a corner of the button cluster.

[0058] The cavity may be located between two button clusters, and above or below the button clusters.

[0059] The one or more buttons may include circular buttons, rectangular piano keys, rectangular (eg, square) keyboard buttons, and the like.

[0060] The one or more button actuators may be connected to each other by a flexible spacer with a gap therearound.

[0061] The one or more button actuators may be connected to each other by a bifurcated flexible spacer and may be connected to at least one fixed portion of the gasket by a single bifurcated spacer. The at least one fixed portion of the gasket may be an outer edge that defines the gasket.

[0062] A power button may be disposed within the cavity. The power button may be located in the cavity near a corner of a button cluster, for example, between two button clusters. Therefore, triggering the power button requires pressing or squeezing the housing firmly. This prevents the device from being accidentally activated during transport or hanging for display. A protrusion extending forward from the front surface of the housing may partially or completely surround the power button to reduce the likelihood of accidental activation. The power button may also optionally function as a power off button.

[0063] The planar electronic device may include one or more button clusters on the front surface and one or more keys on the back surface, typically with the one or more keys on the back surface corresponding to spaces between the button clusters on the front surface.

[0064] This design keeps the device thin and light while reducing the probability of users accidentally pressing the rear button when intending to operate the front button (or vice versa).

[0065] The planar electronic device may include, from top to bottom along the longitudinal axis of the device: a top portion provided with the flexible spacer, a display area provided with the display screen, an energy storage module area provided with the energy storage module, and a user interface area provided with one or more buttons.

[0066] This layout makes full use of the space inside the housing, allows the device to be hung on a ring hook, and ergonomically places the buttons near the bottom of the device and spaced away from the screen. This configuration provides high ease of use.

[0067] The energy storage module may span the device.

[0068] In some examples, the planar device may use other energy storage modules instead of batteries, such as supercapacitors and other different types of energy storage devices.

[0069] As previously described, the housing may be formed by stacking a plurality of layers. The device may include a first layer forming the front surface of the housing. The device may include a second layer forming the rear surface of the housing. The device may include a third layer interposed between the first and second layers. The third layer may form a portion of the housing.

[0070] Advantageously, the layered structure is easier to manufacture and assemble as fewer separate parts need to be combined when assembling the device.

[0071] Advantageously, by forming a device with distinct layers, each layer can be selected to provide a specific technical function for the device. For example, the first and second layers could provide connectivity for electronic components, while the third layer could be used to provide structural support for the device. In some cases, a single layer could perform multiple functions, reducing the total number of layers in the device.

[0072] Furthermore, because the third layer separates the first and second layers, the device exhibits improved bending resistance compared to designs where the first and second layers are stacked directly. The third layer, for example, provides additional structural strength by separating the first and second layers to resist forces that would otherwise cause the device to bend.

[0073] At least one of the first, second and third layers may have a predetermined shape selected to provide a specific function. For example, the first and second layers may be designed to have a shape with holes through which a user can access components of the device, allowing the user to interact with the device. As another example, the third layer may be designed to have a shape with a gasket, wherein the gasket separates the first and second layers; and / or may be designed to have a shape with a cavity, wherein the cavity is capable of accommodating electronic components therein. As another example, the third layer may be designed to have a shape that provides the device with tactile protrusions through which a user can interact with the device. When the device is assembled, these tactile protrusions may be configured as holes that extend through the first and / or second layers.

[0074] Typically, the outward-facing surface of the first layer constitutes the front surface of the housing. The inward-facing surface of the first layer may be located within the interior of the device. Typically, the outward-facing surface of the second layer constitutes the rear surface of the housing. The inward-facing surface of the second layer may be located within the interior of the device. Typically, the first layer is the top layer of the device. Typically, the second layer is the rear layer of the device.

[0075] The side surfaces (eg, top, bottom, left, and right) of the housing may be formed by edges of the first and second layers and side surfaces of the third layer.

[0076] The first and second layers may be made of the same material. The third layer may be made of a different material than the first and second layers. Typically, the holes in the device for receiving the pins therethrough are formed by overlapping holes in the first, second, and third layers. The device may include exactly three layers.

[0077] At least one of the first, second, and third layers can be multi-layered. At least one of the first and second layers can include a coating sheet that serves as part of the multi-layer structure. The coating sheet can serve as an outer surface (e.g., an outermost layer) of the device. Accordingly, in some embodiments, the coating sheet serves as the outermost surface of the device.

[0078] For example, the first layer may include a front glass coating sheet. The front glass coating sheet may form the front surface of the device. The second layer may include a rear glass coating sheet. The rear glass coating sheet may form the rear surface of the device.

[0079] The first and / or second layers may include a PCB bonded to a transparent (e.g., optically clear or colorless) substrate (e.g., glass). The PCB bonded to the transparent substrate may be a flexible PCB. The PCB may be embedded in the transparent substrate. When the first and second layers include flexible PCBs bonded to a transparent substrate, communication between the PCBs in the first and second layers is achieved through the connection of the two flexible PCBs.

[0080] At least one of the first and second layers may be a PCB.

[0081] Advantageously, since the PCB forms part of the housing and the electrical connections, using the PCB as a layer to form the front and / or rear surfaces further reduces the number of components. This reduces the manufacturing complexity of the device.

[0082] Furthermore, because PCBs excel in tensile strength, the device is better able to resist bending when subjected to external forces. Therefore, when PCBs are used for the first or second layer, the device's strength is higher; if both the first and second layers (i.e., the front and back surfaces of the housing) are PCBs, the device's strength is further enhanced.

[0083] Typically, electrical components are provided on the PCBs of the first and / or second layers. These components are typically located on the inward-facing surfaces of the PCBs of the first and / or second layers. Typically, no electronic components are located on the outward-facing surfaces of the PCBs of the first and / or second layers. This design is highly advantageous because the electrical components are protected by the housing.

[0084] The processor may be a computing module. The computing module may be disposed on the PCB of the first and / or second layer. The computing module may include another PCB of its own. For example, the computing module may be a Raspberry Pi (RTM) or other system-on-module (SOM). In other examples, a central processing unit and other electronic components may be directly mounted on the PCB of the first and / or second layer to form a computing module.

[0085] The thickness of the PCB of the first layer may be 0.5 mm or less, and / or the thickness of the PCB of the second layer may be 1 mm or less.

[0086] Advantageously, the thinner the PCB used in the device, the lighter and more compact the device. Lightweight and compact devices are particularly useful for portable consumer electronic devices, as they are easy to carry and can be used "on the go." However, by providing a thicker PCB on the rear surface, the strength of the housing is maintained.

[0087] When both the first and second layers are PCBs, the thickness of the PCB on the first layer may be smaller than that of the PCB on the second layer. When the device is assembled, there may be no exposed electronic components on the first or second PCBs, as they are all located on the inward-facing surface of the PCBs.

[0088] The thickness of the PCB of the second layer may be greater than that of the PCB of the first layer.

[0089] The thickness of the PCB of the first layer may be 0.5 mm or thinner, for example, 0.4 mm or thinner, 0.3 mm or thinner, or 0.2 mm or thinner.

[0090] The thickness of the PCB of the second layer may be 1 mm or less. The thickness of the PCB of the second layer may be 0.8 mm or less. The thickness of the PCB of the second layer may be 0.6 mm or less.

[0091] The display screen may be offset from the central longitudinal axis of the front surface of the housing. The area between the edge of the display screen and the edge of the front surface of the housing may cover several electronic components on the first or second PCB, such as the input / output ports described below.

[0092] The elasticity of the third layer may vary. The elasticity of the third layer may vary with position on at least one surface of the third layer. The elasticity of the third layer may vary with position on the rear surface of the third layer. The elasticity of the third layer may vary with position on the front surface of the third layer.

[0093] Advantageously, by varying the elasticity of the front and / or rear surfaces of the third layer over time, different properties can be imparted to different portions of the third layer, depending on the technical functions required. For example, portions of the third layer where high strength is desired (e.g., portions used to provide structural support for the device) can have lower elasticity. For another example, portions of the third layer where high toughness is desired (e.g., portions used to allow a user to interact with (e.g., actuate) a button on the device) can have higher elasticity.

[0094] The elasticity of the third layer may vary with position on both its front and rear surfaces.

[0095] Typically, the portion of the third layer with lower elasticity may be the rigid portion of the third layer. Typically, the portion of the third layer with higher elasticity may be the flexible portion of the third layer.

[0096] The elastic modulus of the third layer may vary with position on at least one of its front and rear surfaces. The compressive strength of the third layer may vary with position on at least one of its front and rear surfaces. The stiffness of the third layer may vary with position on at least one of its front and rear surfaces. The toughness of the third layer may vary with position on at least one of its front and rear surfaces.

[0097] The planar electronic device may have a top portion with a hole thereon for receiving at least one pin therethrough. The hole for receiving the at least one pin may be formed by overlapping holes on the first, second and third layers.

[0098] Advantageously, this configuration makes optimal use of the space within the housing while enabling the device to be hung from a loop hook.

[0099] The PCB of the first and / or second layer may be provided with one or more electronic components near the hole for accommodating the at least one pin.

[0100] Typically, when the device is assembled, the first, second and third layers are aligned so that the holes in the layers overlap to form the hole extending through the entire thickness of the device for receiving at least one pin therethrough.

[0101] The third layer may be formed from one or more polymeric materials.

[0102] Advantageously, polymer materials are readily available, strong materials that can be easily molded into desired shapes and tailored to desired properties. This is particularly advantageous when the elasticity of the front and rear surfaces of the third layer varies with position, as the polymer material can have different properties to achieve this technical feature.

[0103] The third layer may be formed from one or more (eg synthetic) polymeric materials. The polymeric material may be silicone.

[0104] The third layer may be formed from a polymer other than silicone. The third layer may include an integrated silicone area, for example, to form a button actuator. The third layer may be formed using an "overmolding" process.

[0105] The third layer may comprise regions comprised of zones of polymer material.The regions of the third layer forming the gasket may be formed from a separate sheet of polymer material from the sheet of polymer material forming the button actuator.

[0106] The polymer material may be a thermally conductive polymer. The third layer may be formed of a thermally conductive material. The thermally conductive material may be a metal (e.g., aluminum). The third layer may be compatible with one or more electronic components of the PCB that typically generate heat (e.g., a processor).

[0107] Advantageously, using the thermally conductive material of the third layer means that the entire third layer is used as a heat sink to carry away heat generated by electronic components on the PCB.

[0108] The third layer may be transparent. The third layer may be colorless. The third layer may be optically transparent.

[0109] At least 25% of at least one surface of the PCB of the first and / or second layer may be metallized, and optionally, the metallization may be gold.

[0110] The metallization may be immersion gold. The metallization may be copper. The metallization may be silver. Typically, at least 25%, for example, at least 50% or at least 75%, of at least one surface of the first and / or second layer of the PCB is metallized.

[0111] The metallization may be performed on the inward-facing surface of the PCB of the first and / or second layers (eg, to provide electrical connections between electronic components mounted thereon).

[0112] The metallization may be performed on the outward-facing surface of the first and / or second PCBs. The metallization performed on the outward-facing surface of the first and / or second PCBs may be used to convey information (e.g., images or text) to a user. The outward-facing surface of the first and / or second PCBs may have areas not coated with a solder mask.

[0113] Advantageously, by shaping the solder mask so that the metallization layer is exposed at the desired location on the outward-facing surface of the PCB, text and images can be formed on the surface. This is particularly useful because applying the solder mask is already part of the manufacturing process of forming the traces on the PCB, so no further process steps (e.g., printing) are required to print text and images on the outer surface of the device.

[0114] The metallization of the outward-facing surface of the first and / or second layer may include an area of ​​printed material (ideally a metal, such as gold) for conveying information to a user. The metallization of the outward-facing surface of the first and / or second layer may be formed by providing an area of ​​printed material (ideally a metal, such as gold) on the outward-facing surface. The area of ​​printed material (ideally a metal, such as gold) may include a base layer that is different from the material of the conductive traces on the PCB. The base layer may be formed of nickel.

[0115] Information can be conveyed to a user via graphics formed on the outward-facing surfaces of the first and / or second layers. These graphics can be formed using a screen printing process. These graphics can be formed from a printed material (ideally a metal, such as gold). The graphics can be formed during the manufacturing process of the PCBs of the first and / or second layers.

[0116] The metallization of the outward-facing surface of the first and / or second layer can be achieved by removing the coating of the metal (e.g., gold) surface to reveal the underlying metal (e.g., gold).

[0117] The device may include one or more spacers within the housing that, together with the first and / or second layers, define one or more cavities for housing one or more electronic circuit components.

[0118] Advantageously, providing the electronic circuit components within the cavity not only protects these components from damage, but also provides a compact device with structural support because the spacing defines the cavity and provides structural support for the device.

[0119] The one or more electronic circuit components may be connected to the first or second layer of PCBs. The one or more electronic circuit components may be distributed on the first and second layers of PCBs. One or more electronic circuit components may be disposed on the first layer of PCBs; one or more electronic circuit components may also be disposed on the second layer of PCBs.

[0120] The third layer may include the one or more spacers and the one or more holes, thereby defining one or more of the cavities.

[0121] Advantageously, the third layer provides a number of different functions through the use of the spacers and cavities. Typically, the one or more spacers provide a structure that separates the first and second layers from one another, preventing the PCBs of the first and second layers from contacting one another, which could result in unintended contact and / or damage between components on the inward-facing surfaces of the PCBs of the first and / or second layers. As will be appreciated, the third layer increases the thickness of the device and improves its resistance to bending. However, by providing holes in the third layer to provide cavities within which the electronic circuit components of the PCBs can be housed, the added thickness is kept to a minimum.

[0122] The third layer may be formed from a single piece, thereby having one spacer. The third layer may be formed from multiple pieces, thereby having more than one spacer.

[0123] The one or more cavities may extend through the entire thickness of the third layer and be surrounded by the first and second layers. Typically, the one or more cavities are formed by inwardly facing surfaces of the first and second layers (wherein an electronic component may be mounted to one of these surfaces) and the walls of the gasket defining the aperture of the third layer. In this manner, the electronic component may be surrounded by the gasket.

[0124] The one or more cavities may partially extend through the third layer and be surrounded by the PCB on one side and by the gasket on the opposite side. Typically, the one or more cavities are formed by the inward-facing surface of the first or second layer (the surface on which the electronic component can be mounted) and the wall of the gasket defining the hole in the third layer. In this way, the electronic component can be surrounded by the gasket.

[0125] The one or more electronic circuit components may include a speaker. The first or second layer PCB and the peripheral gasket enclose the speaker to form a sound baffle.

[0126] Advantageously, the sound baffle directs sound out of the device without requiring holes to be formed in the device through which the sound must pass. This reduces the steps required for manufacture because there is no need to provide speaker holes in the first or second layers through which the sound must pass.

[0127] The speaker can be mounted on the PCB of the second layer. Since the PCB of the first layer is thin, the sound baffle guides the sound toward the PCB of the first layer, so that the sound is transmitted toward the user during use.

[0128] Typically, the peripheral gasket refers to a portion of the third layer that defines the walls of the hole of the cavity that houses the electronic component (eg, the speaker).

[0129] In some examples, the PCB of the first layer and / or the PCB of the second layer may include a hole aligned with the speaker such that sound passes through the hole in the PCB.

[0130] The third layer may include a gasket, the gasket including at least one fixing portion and at least one actuating portion, the actuating portion defining one or more button actuators, and the at least one fixing portion may have lower elasticity than the one or more button actuators.

[0131] Advantageously, the fixed portion and the at least one actuating portion provide different functions, as the fixed portion does not move and has a lower elasticity than the button actuator. This means that the fixed portion provides structural rigidity to the device, while the button actuator allows the user to interact with the device by pressing.

[0132] The fixing portion may include one or more cavities for accommodating electronic components. The actuating portion may include one or more cavities for accommodating electronic components. The at least one actuating portion may contact the electronic component of the corresponding button when the device is assembled and actuate the button when pressed.

[0133] The electronic components forming the contacts of the buttons on the corresponding PCB can be adhered (e.g., using tape or manually) to the PCB. The electronic components forming the contacts of the buttons on the corresponding PCB can be reflow soldered to the PCB during the manufacturing process.

[0134] At least one of the first and second layers may include one or more holes.At least one of the button actuators of the gasket may leak out through one of the one or more holes.

[0135] Advantageously, because the button actuator is exposed on the exterior of the device, a user may access the button actuator for interacting with and controlling the device.

[0136] The third layer may include an elastic sheet portion that forms a contact surface for the button, which is activated by a user touching the contact surface. The contact surface of the button may be textured to provide a tactile surface for the user. The contact surface of the button may be different from the front and back surfaces of the PCB housing. The front side of the third layer may form the contact surface for the button on the front surface of the device. The rear side of the third layer may form the contact surface for the button on the rear surface of the device.

[0137] The button actuator may be formed on the front surface of the third layer such that the button actuator is exposed on the front surface of the housing. The button actuator may be formed on the rear surface of the third layer such that the button actuator is exposed on the rear surface of the housing. When the device is assembled, the button actuator may overlap with electronic components on the first and / or second PCBs such that physical movement of the button causes an input to the device.

[0138] At least one of the one or more button actuators may extend through a corresponding hole in the first or second layer.At least one of the one or more button actuators may protrude from the front / rear surface of the housing.

[0139] Advantageously, because the button actuator protrudes from the electronic device, it is more tactile than if the button actuator were flush with the front / rear surfaces of the housing. This improves the usability of the device because the button is easily accessible and can be quickly located. This is particularly advantageous when the electronic device is used as a gaming device, as computer games often require quick button location and actuation.

[0140] Typically, the apertures of the first and / or second layers define the periphery of buttons on the front / rear surface of the housing.

[0141] At least one of the one or more button actuators may protrude from the front / rear surface of the housing because the button actuator is higher relative to the front / rear surface of the housing. Typically, the one or more button actuators extend from the front and / or rear surface in a direction perpendicular to the surface.

[0142] Typically, the button actuator may protrude from the front and / or rear surface of the housing of the device by, for example, at most 0.3 mm, at most 0.2 mm, or at most 0.1 mm.

[0143] When the third layer includes button actuators to form one or more button clusters on the front surface and one or more buttons on the rear surface, the button actuators on the front and rear surfaces of the third layer are offset from each other (i.e., a front button actuator does not overlap a rear button actuator). Advantageously, this means that each button can be actuated independently, preventing accidental actuation of overlapping buttons.

[0144] The device may include one or more side button actuators disposed on a side of the housing.The device may include one or more input / output ports disposed on a side of the housing.

[0145] Advantageously, by using the sides of the device, the side button actuators and the input / output ports provide more functionality to the device. This means that the device can remain compact while gaining more functionality, as the device does not need to be made larger to accommodate these components on the front / rear surfaces of the housing.

[0146] The side button actuators may correspond to buttons that are used less frequently than the button actuators on the front / rear surfaces of the device. For example, the side buttons may correspond to a power button, a menu button, and / or a function button. The button actuators on the front and / or rear surfaces of the device may correspond to left / right / up / down buttons and / or alphabetical buttons, which are most commonly used to control the device when the device is in use.

[0147] The side button actuator may be located between the first and second layers in line with the aperture for receiving the pin. Typically, the side button actuator is located on a side of the housing that is aligned with the aperture for receiving the pin therethrough in a direction from the top surface to the bottom surface of the device. Advantageously, using the space adjacent to the aperture for receiving the pin therethrough to provide electronic components means that the device is more compact because the amount of free space on the PCB (i.e., PCB space not used for electronic components or connections) is reduced.

[0148] The input / output ports can facilitate connection between the device and external electronic devices. The input / output ports can include one or more of the following: an audio input / output port, a display output port, and a charging port. The input / output ports can be used for data transmission between the device and external devices.

[0149] At least one of the one or more input / output ports may be an integral part of a computing module.

[0150] The one or more input / output ports may be located on a side of the display screen. The one or more input / output ports may be aligned to face a side of the device.

[0151] The device may include a wireless communication module. The wireless communication module may be used to communicate with external devices via Wi-Fi or Bluetooth. In this example, the device may not include any input / output ports for wired connection to external devices.

[0152] Optionally, the device may include a wireless charging module. The wireless charging module may include a wireless charging coil disposed on the PCB of the first or second layer. In this example, the device may not include any charging port for wired charging, although both wired and wireless charging can be implemented by providing a wireless charging module and a charging port in the device.

[0153] The third layer may include one or more side button actuators.The PCB of the first or second layer includes electronic components for each of the side button actuators.

[0154] Advantageously, the side button actuator on the third layer provides additional functionality to the third layer as it also allows a user to interact with the device by pressing a button on the side of the device.

[0155] Since the side of the housing is formed by the edge of the third layer, the user can easily reach the side button actuator. The one or more side button actuators can protrude from the side of the device (e.g., perpendicular to the surface).

[0156] Typically, the PCBs on the first and / or second layers include side-mounted electronic components located below each side button actuator. When the device is assembled, a user can press the side button actuators on the third layer to activate the side buttons. These side-mounted electronic components can be physical surface mount technology (SMT) micro buttons. The physical SMT micro buttons can be soldered to the PCB on the second layer.

[0157] At least one of the one or more side button actuators may protrude from an edge of the front / rear surface of the housing.

[0158] Advantageously, because the side button actuator protrudes from the side of the electronic device, it is more tactile than if the side button actuator were flush with the side of the device. This improves the usability of the device because the button is easy to reach and can be quickly located.

[0159] The side button actuators of the third layer can have a higher elasticity than the fixed portion of the third layer. The side button actuators of the third layer can have the same elasticity as the button actuators on the front and back surfaces of the device. This means that the user can interact with the device by pressing the side buttons.

[0160] At least one of the one or more side button actuators may protrude from the side of the housing in that the side button actuator extends from the corresponding side in a direction perpendicular to the side. The protrusion of the side button actuator may constitute the widest part of the device.

[0161] Typically, the side button actuator may protrude from the side of the housing of the device by, for example, at most 0.3 mm, at most 0.2 mm, or at most 0.1 mm. The electronic components of the side button actuator may be fixed in the corresponding cavity of the third layer.

[0162] The one or more input / output ports may be connected to the PCB of the first or second layer. The third layer may include one or more grooves. Each groove may be used to accommodate at least one of the one or more input / output ports.

[0163] Advantageously, the third layer provides openings for input / output ports so that cables can be plugged into the device. By arranging the input / output ports in the recesses of the third layer, the thickness of the device is minimized, as these ports are mounted on the PCB of the first and / or second layers and accommodated in the recesses of the third layer.

[0164] The first or second layer PCB may include a first area where no electrical contacts are present and no solder resist is applied, and the first area may overlap with the light emitting device in the housing.

[0165] Advantageously, since the area of ​​the PCB covering the light-emitting device is not coated with a solder mask, light can pass through the PCB more easily than if the area were coated with a solder mask. This reduces the number of steps required for manufacturing because there is no need to open holes in the first or second layers for light transmission.

[0166] The absence of electrical contacts may refer to the absence of electronic components mounted on the PCB in the region. The absence of a solder resist layer on the PCB may refer to the absence of a paint-like material in the region.

[0167] Typically, the light emitting device is a light emitting diode (LED). Typically, the light emitting device is mounted on the PCB of the second layer. Typically, the light emitting device is an electronic component held within a cavity of the third layer. Typically, the light emitting device is surrounded by the PCB of the first layer and the walls of the gasket, the walls of the gasket forming an aperture defining the cavity in the third layer. Typically, the PCB of the first layer includes a first area such that light is visible through the front surface of the housing. In other examples, the light emitting device can be mounted on the PCB of the first layer such that light is visible through the PCB of the second layer at the rear surface of the housing.

[0168] The third layer may include an integral waterproof seal (eg typically a gasket). Advantageously, the integral waterproof gasket is easily manufactured as part of the third layer and renders the device waterproof.

[0169] The first and second layers may each include a PCB. The first and second PCBs may communicate with each other via a connector.

[0170] Advantageously, the connection PCB allows the PCBs of the first layer to communicate with the PCBs of the second layer. The connection PCB can provide electronic connections for the PCBs of the first and second layers.

[0171] The connectors may be connections between corresponding connector pins. The connections may be formed by mating board-to-board connectors. The pins may be surface-mounted (SMT) components. As part of the assembly process, the SMT components may be attached to corresponding PCBs and connected together.

[0172] The connector may be a connection PCB. The connection PCB may be a flexible PCB. The flexible PCB may be soldered to at least one of the first and second PCB layers. The flexible PCB may be inserted into a connector socket on at least one of the first and second PCB layers.

[0173] The first and second layers of PCBs may be rigid PCBs. In some examples, the first and / or second layers of PCBs may include rigid-flex PCBs.

[0174] The first and second layer PCBs and the connection PCB may be manufactured as a single part using a rigid-flex PCB process.

[0175] The flexible PCB (with a thickness of about 0.1 mm) can be connected (eg, soldered) to the PCB of the second layer during assembly and inserted into a connector socket on the PCB of the first layer.

[0176] In an example, the device may not include a SOM (system on module), but include a flexible PCB to enable inter-board communication.

[0177] The housing of the planar electronic device is provided with a unique visual indicator visible thereon, which can be used to download one or more software applications to the planar electronic device or to activate one or more software applications pre-recorded therein. The unique visual indicator can be, for example, a number, an alphanumeric code, a QR code, etc. The device can be activated at a point of sale, for example, using a wireless communication device or the visual indicator.

[0178] The device may include one or more additional visual indicators.At least one of the one or more additional visual indicators may include a QR code for an affiliate program.

[0179] The device may include one or more external physical components. The one or more external physical components may be peripheral devices. The one or more external physical components may provide auxiliary functions for the device. The one or more external physical components may include at least one of the following: a knife, a first aid kit, and a compass.

[0180] The display screen may be a touch screen.

[0181] The device may include a peripheral component for interacting with the display screen. The peripheral component for interacting with the display screen may be removably attached to the planar electronic device. For example, the peripheral component may be a stylus. The planar electronic device may include a receiving element for receiving the peripheral component for interacting with the display screen. For example, the receiving element may include a clip, a groove, or a cavity for receiving the peripheral component.

[0182] The present invention extends to a display stand having one or more annular hooks protruding therefrom; on at least one of the annular hooks, a plurality of planar electronic devices according to any of the previously described electronic devices are hung, specifically by passing the at least one pin through a hole thereof for receiving the at least one pin.

[0183] The plurality of planar devices may not be individually packaged (using removable disposable packaging materials). The plurality of planar devices may be transported with the housings of adjacent devices touching each other (e.g., the first layer of one device touching the second layer of an adjacent device) (thus without any packaging material in between). The structures described herein are sufficiently robust to eliminate wasteful overpackaging.

[0184] According to a second aspect of the present invention, a method for constructing a planar electronic device according to the first aspect is provided. The method may include mounting a display screen on a PCB. The method may include mounting an energy storage module on the PCB. The method may include mounting one or more electronic components on the PCB. The method may include wrapping a folded plate with a display screen window around the PCB, such that the display screen is visible through the display screen window, and the folded plate forming a housing for the planar electronic device.

[0185] The method may include installing one or more gaskets on a PCB (typically a front surface) or a housing, wherein the one or more gaskets define one or more cavities in which one or more components attached to the PCB are housed, and the one or more gaskets maintain a certain distance between the housing and the PCB.

[0186] This arrangement provides device structure and protection for one or more components mounted to the PCB.

[0187] The method may also include mounting a plurality of button electrical contacts on the PCB and forming at least one gasket, wherein the gasket includes at least one fixing portion and at least one actuating portion, the actuating portion defining one or more button actuators, and forming one or more user-actuable button structures on the outside of a housing (typically a folding plate), such that the one or more button actuators and the one or more user-actuable button structures cover the button electrical contacts in the planar electronic device. A user can operate a button by pressing the user-actuable button structure to open or close the corresponding electrical contact. Typically, force is transmitted through the corresponding button actuator.

[0188] The method may include mounting a plurality of button electrical contacts to a PCB and forming one or more user-actuable button structures on the exterior of the crimp plate such that they overlie the button electrical contacts in the planar electronic device.

[0189] The method may include positioning the PCB on the housing so that, when the housing is folded, the cavity in the gasket is aligned with the position of the electronic component on the PCB.

[0190] The method may further include forming a metal layer on the PCB to enhance the strength of the electronic device. The method may include forming a metal area that does not conduct signals at gaps between metal traces, thereby reinforcing the PCB.

[0191] This invention offers several significant advantages for flat, handheld electronic devices with screens. Compared to electronic devices constructed solely of a PCB and a cardboard housing, the metal reinforcement on the PCB significantly enhances the device's strength. Furthermore, the spacer between the housing and the PCB further increases the device's strength. Each of these features reduces the device's flexibility and enhances its strength. This allows materials like cardboard to be used for the housing, as these materials offer significant advantages: lightweight, readily available, environmentally friendly, and more recyclable than existing technologies.

[0192] Furthermore, the aperture, display, energy storage module, and control assembly are rationally arranged to form a compact layout. This effectively reduces the overall size and cost of the portable handheld device (e.g., suitable for use as a gaming console). By placing the electronic components within the gasket, the gasket achieves a dual function: enhancing the strength of the electronic device while accommodating and protecting the electronic components, while also conserving internal space within the device.

[0193] According to another aspect of the present invention, a method for constructing the aforementioned planar electronic device is provided. The method may include mounting one or more electronic components onto a first PCB. The method may include mounting a display screen, a battery, and one or more additional electronic components onto a second PCB. The second PCB may include a display screen window. The method may include providing a third layer between the first and second PCBs such that the display screen is visible through the display screen window. The first PCB may constitute the front surface of the housing of the planar electronic device, and the second PCB may constitute the rear surface thereof.

[0194] Advantageously, the number of components is reduced by providing two PCBs forming the front and rear surfaces of the housing of the device, as the PCBs provide connections for the electronic components of the device to the housing of the device. The manufacturing method of assembling a layered device is less complex than in the prior art.

[0195] The device may be permanently assembled once manufactured and separating the layers may damage the device.For example, the method may comprise assembling the first, second and third layers using an adhesive.

[0196] The device can also support non-destructive disassembly and reassembly. For example, the method can include assembling the first, second, and third layers using releasable fasteners (e.g., corresponding magnets on each layer) or screws passing through screw holes formed in each layer. It is understood that other assembly methods are also foreseeable. Because the device can be reassembled, components of the device are replaceable, such as the energy storage module.

[0197] The method may include forming one or more spacers within the third layer. The one or more spacers may define one or more cavities in which one or more components attached to the first and / or second PCBs are housed.

[0198] Advantageously, the third layer includes a cavity arranged to provide space for electronic components attached to the first and / or second PCBs. Thus, when assembling the device, the third layer can be placed on the second PCB by aligning the cavity with the electronic components on the second PCB; and the first PCB can be placed on the third layer by aligning the cavity with the electronic components on the first PCB.

[0199] The method may include mounting a plurality of button electrical contacts on a first and / or second PCB. The method may include forming at least one gasket in a third layer, wherein the gasket includes at least one fixed portion and at least one actuating portion; the actuating portion defining one or more button actuators. The method may include providing each of the one or more button actuators in a corresponding hole in the first or second PCB such that the one or more button actuators overlie the button electrical contacts in the planar electronic device.

[0200] Advantageously, the device can be easily assembled by aligning the button actuators of the third layer with corresponding button electrical contacts on the first or second PCB and corresponding holes in the other PCB.

[0201] The method may include forming the third layer using a first material and a second material. The first material may have lower elasticity than the second material.

[0202] Advantageously, by varying the elasticity of the front and / or rear surface of the third layer according to position, it is possible to impart different properties to the third layer, depending on the technical function required at different positions of the layer.

[0203] The method may include forming the third layer using a two-shot molding process. The two-shot molding process may include a first stage and a second stage. Optionally, the first material is molded in the first stage and the second material is molded in the second stage, or vice versa.

[0204] The electronic device may be a gaming device. The electronic device may be a musical instrument (e.g., a synthesizer). The electronic device may be a flashlight. The electronic device may be a communications device. The electronic device may be a mobile phone. The electronic device may be a long-range handheld radio transceiver. The electronic device may be an energy storage device. The planar electronic device may be a first aid kit version, i.e., a first aid kit. The planar electronic device may include a compass.

[0205] Optional features described for any aspect of the present invention are optional features for all aspects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0206] Exemplary embodiments of the present invention will now be described with reference to the following drawings, in which:

[0207] Figure 1 and Figure 2 An electronic device according to one aspect of the present invention is shown.

[0208] Figure 3 A housing of an electronic device according to one aspect of the present invention is shown.

[0209] Figure 4 An electronic device according to one aspect of the present invention is shown.

[0210] Figure 5 and Figure 6 A schematic diagram of a circuit board of an electronic device according to one aspect of the present invention is shown.

[0211] Figure 7 An electronic device according to one aspect of the present invention is shown.

[0212] Figure 8 、 Figure 9 and Figure 10 The structure of an electronic device according to one aspect of the present invention is shown.

[0213] Figure 11 An electronic device according to one aspect of the present invention is shown.

[0214] Figure 12 and 13 Another electronic device 300 according to an aspect of the present invention is shown.

[0215] Figure 14 An exploded view of an electronic device according to one aspect of the present invention is shown.

[0216] Figure 15 An electronic device according to one aspect of the present invention is shown.

[0217] Figure 16 An apparatus according to one aspect of the present invention is shown.

[0218] Figure 17 A flow chart of a method according to one aspect of the present invention is shown.

[0219] Figure 18 A schematic diagram showing an electronic circuit of an electronic device according to one aspect of the present invention is shown.

[0220] Figures 19 to 30 An electronic device according to another example of the present invention is shown.

[0221] Figure 31 A flowchart of a method according to another example of the present invention is shown.

[0222] Figure 32 A partial schematic diagram of a device according to one aspect of the present invention is shown. DETAILED DESCRIPTION

[0223] Figure 1 and Figure 2An electronic device 100 according to one aspect of the present invention is shown. The electronic device 100 is a handheld game console. The electronic device is formed of a cardboard shell 110. When a user holds and uses the electronic device 100, the cardboard shell 110 is gripped. The cardboard shell 110 is provided with a slot 120 extending through its entire thickness. The slot 120 is located at the top of the electronic device 100. The electronic device 100 can be hung on a ring hook 125 of a display stand through the slot 120. In an exemplary embodiment, the slot 120 has dimensions of 32 mm (width) x 6.5 mm (height); the cardboard shell has dimensions of 89 mm (width) x 128 mm (height) x 0.4 mm (thickness).

[0224] The electronic device 100 includes an LCD display 130 disposed in its display area. The display 130 displays the visual effects of the game to the user. The electronic device 100 includes a first button cluster 140 and a second button cluster 150, which the user uses to control and interact with the electronic device 100, for example, to navigate through a menu displayed on the display 130, move objects displayed on the display 130, or enter data. The first button cluster 140 includes four buttons 140a, 140b, 140c, and 140d that can be individually actuated by the user. The second button cluster 150 includes four buttons 150a, 150b, 150c, and 150d that can be individually actuated by the user. The first and second button clusters 140 and 150 are both located in the user input area of ​​the electronic device 100.

[0225] Button 140a is the up button. Button 140b is the right button. Button 140c is the down button. Button 140d is the left button. Button 150a is the X button. Button 150b is the A button. Button 150c is the B button. Button 150d is the Y button (the X, Y, A, and B buttons are industry standards for game console controllers). The first button cluster 140 includes a first button bulkhead 141 surrounding the buttons 140a, 140b, 140c, and 140d, protecting them while still allowing a user to press them. The second button cluster 150 includes a second button bulkhead 151 surrounding the buttons 150a, 150b, 150c, and 150d, protecting them while still allowing a user to press them.

[0226] The electronic device 100 includes a power button 160 located in the user input area of ​​the electronic device 100. The power button 160 is used to turn on the electronic device 100 and may also be used to turn off the electronic device 100. The electronic device 100 includes a port 170 for connecting accessories. The port 170 can be used to charge the electronic device 100, connect the electronic device 100 to another electronic device, or connect an electronic accessory (for example, headphones). The electronic device 100 also includes an additional input device 145, specifically a microphone. The electronic device 100 includes an additional output device 135, specifically a speaker. Although Figure 1 and Figure 2 It is not shown, but it will be appreciated that there may be multiple ports for connecting various types of external devices or components of the electronic device.

[0227] Figure 3 A mesh of a housing 110 of an electronic device 100 according to one aspect of the present invention is shown. Holes for a speaker 135 and a microphone 145 are omitted in this figure and may not be part of the planar electronic device. That is, the electronic device may include a speaker 135 and a microphone 145 but does not include openings in the housing for these components. The housing 110 includes various surfaces and openings to accommodate the components of the electronic device 100 therein. The edges of each surface are provided with creases so that the housing can be easily folded along predetermined lines. After folding, the mesh can accommodate the components of the electronic device 100. The mesh shows the various faces that will become exterior surfaces after the electronic device 100 is assembled (i.e., folded). For the purposes of this specification, references to various surfaces are intended to correspond to surfaces that will become corresponding exterior surfaces when the electronic device 100 is assembled (i.e., folded).

[0228] The housing 110 includes a front surface 110 a having a front notch 120 a formed thereon, forming a slot 120 for allowing the electronic device to be hung on a hook 125 . The front surface 110 a also has a display screen opening 130 a serving as a display window for accommodating the display screen 130 .

[0229] The housing 110 has a rear surface 110b with a rear notch 120b. When the housing 110 is folded, the rear notch 120b is located behind the front notch 120a. The rear surface 110b includes a first rear button 111 and a second rear button 112, which serve as user-actuable button structures on the housing 110.

[0230] The top surface 110c of the housing 110 constitutes the top of the electronic device 100. The bottom surface 110d of the housing 110 constitutes the bottom end of the electronic device 100. The left side 110f of the housing 110 constitutes the left side of the electronic device 100. The right side 110e of the housing 110 constitutes the right side of the electronic device 100. The housing 110 has a joining surface 110g for forming the electronic device 100 when the housing 110 is folded. The joining surface 110g can fix the electronic device 100 in the folded state. The joining surface 110g can be fixed to the inner surface of the housing 110 by bonding. The predetermined lines are shown by examples 115a, 115b, and 115c, which are creases along the edges of each surface.

[0231] Figure 4 FIG. 1 shows a rear surface 110 b of an electronic device 100 according to an aspect of the present invention. The rear surface 110 b includes rear buttons, namely, a first rear button 111 and a second rear button 112 .

[0232] Figure 5 A schematic diagram of a printed circuit board (PCB) 600 of an electronic device 100 according to one aspect of the present invention is shown. The PCB 600 is assembled and integrates various features and components of the electronic device 100. The PCB 600 includes a PCB slot 620. When the electronic device 100 is assembled, the PCB slot 620 overlaps with the front and rear notches 120a, 120b on the housing 110. The PCB 600 may include a metal reinforcement area. The PCB 600 includes an electronic display unit collectively indicated by the reference numeral 630, which includes a display screen 130 and an electronic drive circuit 635. That is, the display screen 130 and the electronic drive circuit form a single unit of the electronic display unit. As shown in the figure, the display screen 130 is offset from the horizontal center (i.e., not equidistant from the left and right sides 110e, 110f) because the electronic drive circuit 635 is close to the display screen 130 to make the electronic device 100 more compact. It will be understood that Figure 5 The illustrated PCB 600 may also include auxiliary components, such as capacitors and resistors, which are not shown for simplicity.

[0233] PCB 600 includes a battery 690, which serves as an energy storage module and is located in the battery area of ​​electronic device 100 and can be charged using a charger connected to port 170. The battery spans the lateral width of PCB 600. PCB 600 also includes a processor 695, which may be formed on an integrated circuit. Speaker 135 and microphone 145 are typically provided as components on PCB 600. Processor 695 and speaker 135 are typically located at the top of PCB 600, i.e., near top surface 110c.

[0234] PCB 600 includes several dome switch buttons, including a first dome switch button 640a corresponding to the up button 140a in the first button cluster 140, and a second dome switch button 650a generally corresponding to the X button 150a in the second button cluster 150. For clarity, only a subset of the dome switch buttons are labeled in the figure. However, it will be understood that each button has a corresponding dome switch button on the PCB.

[0235] From the top surface 110 c to the bottom surface 110 d , the electronic device 100 includes a top portion, a display area, a battery area, and a user input area in sequence.

[0236] PCB 600 includes several metallized areas 655a, 655b, and 655c. These metallized areas 655a, 655b, and 655c form a support structure to enhance the strength of the electronic device. Metallized areas 655a, 655b, and 655c form a metal layer that fills the gaps between conductive traces between components (not shown). A small gap exists between the metallized areas and the signal tracks to prevent the metallized areas from becoming part of the conductive traces.

[0237] Figure 6 A schematic diagram of the rear surface of a PCB 600 of an electronic device 100 according to one aspect of the present invention is shown. PCB 600 includes several dome buttons, including a first rear dome button 611 and a second rear dome button 612. PCB 600 includes a PCB slot 620. When electronic device 100 is assembled, PCB slot 620 overlaps with slot 120 in housing 110. A battery 690 is also shown on the rear side of the PCB. In other words, battery 690 is mounted in a cavity extending through the entire thickness of the PCB, thereby being exposed on both the front and rear surfaces of the PCB. The rear surface of PCB 600 may also include a metallized area (not shown).

[0238] Figure 7 The electronic device 100 according to an embodiment of the present invention is shown. Figure 3The same mesh as shown for the housing 110 is shown to illustrate its alignment with the cardboard gaskets 815 and 825. The figure also shows side views 819 and 829 of the gaskets. Gaskets 815 and 825 span the lateral width of the electronic device 100. Gaskets 815 and 825 include several holes. Gaskets 815 and 825 are positioned between the inner surface of the front surface 110a of the housing 110 and the PCB 600, thereby forming cavities for accommodating the electronic components of the electronic device 100. These cavities, with the PCB as the base and the edges of the holes in the gaskets 815 and 825 as the side walls, contain the electronic components. The housing 110a forms a partial cover for the cavities to protect the electronic components, such as the processor 695. The housing 110a forms a partial cover for the cavities to protect the electronic components, such as the speaker 135 and microphone 145.

[0239] The gasket 815 is formed of a continuous structure having two holes 816 and 818 and is located on the top of the electronic device 100. The hole 816 is located to the left of the gasket slot 820 for accommodating the processor 695. The hole 818 is located to the right of the gasket slot 820 for accommodating the speaker 135. When the electronic device 100 is folded (i.e., assembled), the gasket slot 820 overlaps with the front and rear notches 120a and 120b of the housing 110.

[0240] Gasket 825 is formed from a continuous structure, comprising two distinct regions: an outer region 825a, which serves as a fixed spacer, and a button actuator region 825b. A gap 824 is provided between outer region 825a and button actuator region 825b. However, outer region 825a and button actuator region 825b are connected by a central connecting rod 827, which serves as a single bifurcated spacer. When a user presses buttons 140a or 150a on electronic device 100, button actuator region 825b moves toward the corresponding dome switch button 640a or 650a on PCB 600. Gasket 825 is provided with a number of holes. Holes 826a, 826b, 826c, 826d, and 826e accommodate various electronic components, such as resistors, capacitors, and / or camera modules.

[0241] The button actuator region 825b includes a power switch actuator 860 that moves in response to a user pressing the power button 160. The button actuator region 825b includes a first switch actuator 840 located to the left of the power switch actuator 860. The first switch actuator 840 moves in response to a user pressing the first button cluster 140. By way of example, the first switch actuator 840 includes an "up" button actuator 840a corresponding to button 140a. It will be appreciated that the first switch actuator 840 includes button actuators corresponding to the other buttons 140b, 140c, and 140d. The button actuator region 825b includes a second switch actuator 850 located to the right of the power switch actuator 860. The second switch actuator 850 moves in response to a user pressing the second button cluster 150. By way of example, the second switch actuator 850 includes an X button actuator 850a corresponding to button 150a. It is understood that the second switch actuator 850 has button actuators corresponding to the other buttons 540b, 540c, 540d. Each independent button trigger 840a, 850a is connected by a button link (eg, button link 843, 853) serving as a bifurcated flexible spacer.

[0242] Figure 8 、 Figure 9 and Figure 10 FIG2 shows the structure of an electronic device 100 according to one aspect of the present invention. Electronic device 100 is formed by placing gaskets 815 and 825 on the interior of front surface 110a of housing 110. PCB 600 is placed inside rear surface 110b of housing 110. Electronic device 100 is formed by folding the interior of front surface 110a and rear surface 110b relative to each other, encapsulating gaskets 815 and 825 and PCB 600 within housing 110. Figure 10 1 shows an electronic device 100. In this figure, it is assumed that the housing 110 is transparent in order to show the overlapping relationship of the various layers, namely, the front surface 110a of the housing 110, the gaskets 815, 825, the dome switch button on the front surface of the PCB, the rear dome button on the rear surface of the PCB, and the rear surface 110b of the housing 110 (not shown because it has the same shape as the front surface of the housing 110)).

[0243] The accommodating cavity of the speaker 135 formed by the gasket 815 functions as a speaker housing.

[0244] Figure 11 A simplified view of the top surface 110c of the electronic device 100 along line 'a' is shown, with the front surface 110a facing upward and the rear surface 110b facing downward, according to one aspect of the present invention. First and second button clusters 140, 150 are shown on the top surface 110a of the electronic device 100. First and second rear buttons 111, 112 are shown on the rear surface 110b.

[0245] Figure 12 and 13 Another electronic device 300 according to one aspect of the present invention is shown. The electronic device 300 utilizes an injection-molded polymer body 310 with a silicone rubber membrane front panel 310a. The silicone rubber membrane front panel 310a includes a first keyboard section 340 and a second keyboard section 350 bonded to the front surface 310a. The rear surface 310b of the electronic device 300 is provided with a first rear button 311 and a second rear button 312. In the electronic device 300, a power button 360 is located in the upper right corner of the electronic device 300.

[0246] Electronic devices 100 and 300 have a QR code print image, such as print image 385 on electronic device 300, which serves as a visual indicator. The QR code print image is unique to the electronic device to which it is attached or each software on the electronic device, and a user can scan the QR code print image to activate a game stored on the electronic device or download a game from an external device.

[0247] Figure 14 An exploded view of an electronic device 300 according to one aspect of the present invention is shown. The electronic device 300 comprises a front membrane panel 310a bonded to the front portion of a chassis 310. The electronic device 300 has a rear surface formed by a rear membrane panel 310b. The chassis 310 is used to bond the front membrane panel 310a and the rear membrane panel 310b and to mount the PCB 600. The chassis is provided with a first keyboard aperture 340b and a second keyboard aperture 350b for accommodating the first and second keyboard portions 340 and 350, respectively.

[0248] The electronic device 300 also has a first flexible actuator 340c and a second flexible actuator 350c located above a snap-action dome switch button on the PCB 600. The electronic device 300 also includes a third flexible actuator 360a for a power button 360, located above the snap-action dome switch. In some examples, the electronic device can be manufactured using in-mold electronics (IME) technology, embedding the electronic circuitry into the polymer housing, eliminating the need for a separate PCB. Additionally, additional solid-state controls, such as capacitive touch sliders for volume and brightness controls, can be embedded into the housing as part of the same injection molding manufacturing process.

[0249] Figure 15 An electronic device 1500 according to one aspect of the present invention is shown. The electronic device 1500 has a clamshell structure, which means that the front surface 1510a and the back surface 1510b are formed from a single piece.

[0250] Figure 15An electronic device 1500 according to one aspect of the present invention is shown. Electronic device 1500 includes a housing 1510 having a front surface 1510a and a rear surface 1510b. Front surface 1510a is provided with a slot 1520, a display screen 1530, a first button cluster 1540, and a second button cluster 1550. Rear surface 1510b is provided with a first rear button 1511 and a second rear button 1512. Rear surface 1510b also includes a protrusion 1595, which is the portion of housing 1510 surrounding a battery 1590 and display screen 1530. As a result, electronic device 1500 is thicker at protrusion 1595 than in other portions of the electronic device. Housing 1510 is made of vacuum-formed polymer or paper pulp, but may also be made of injection-molded polypropylene or a combination of these materials. Other types of materials are also contemplated for use in forming the housing. A living hinge connects front surface 1510a and rear surface 1510b and may be formed from any of the materials listed above. The first and second figures are a front view and a rear view, respectively.

[0251] As shown in the third figure, from the side view, it can be seen that the protrusion on the front surface 1510a includes the second group of buttons 1550, and the protrusion on the rear surface 1510b includes the first rear button 1511 and the battery 1590.

[0252] The fourth figure shows an expanded internal view of the electronic device 1500. The components of the electronic device 1500 are all enclosed in its clamshell structure. The electronic device 1500 has a movable hinge arranged along line B.

[0253] An alternative to a clamshell case could be a case made of two mating halves (without a living hinge), or two halves connected by an embedded flexible PCB using in-mold electronics (IME). In this example, the front and back surfaces are formed by a first mating half and a second mating half, respectively, that mate together.

[0254] When assembling such electronic devices, the complete motherboard assembly can be placed within an open housing, sealed by a friction fit between the front and rear shells. This construction further simplifies the design, as assembly requires minimal labor time and eliminates the need for additional adhesives during production. Furthermore, the product is slimmer, more closely resembling the appearance of traditional retail gift cards.

[0255] The electronic device 1500, and particularly the housing and gasket, may be formed from materials such as cardboard, polypropylene, paper pulp, and other polymers.

[0256] Figure 16 1 shows an apparatus 1600 according to an embodiment of the present invention. The apparatus 1600 is a display stand having six hooks 125, each of which has an electronic device 100 hung thereon. Multiple electronic devices 100 can be hung on each hook 125.

[0257] Figure 17 A flow chart of method 1700 according to one aspect of the present invention is shown. Method 1700 is a method of assembling an electronic device (e.g., electronic device 100) formed from a housing 110 that is foldable around a PCB. Method 1700 includes forming a PCB by mounting 1710 various components onto the PCB. For example, when forming PCB 600, method step 1710 includes mounting a battery 690, an electronic display unit 630, a processor 695, a speaker 135, a microphone 145, a port 170, and a plurality of dome switch buttons 640a, 650a onto PCB 600. PCB slot 620 is formed in the PCB, for example, by laser cutting, which can be part of the PCB manufacturing process.

[0258] Method 1700 includes wrapping 1740 a housing around a PCB to form an electronic device. This includes placing spacers, such as spacers 815, 825, between the PCB and the front surface of the housing. The housing is wrapped around the PCB using predefined creases that indicate the correct folding pattern to accurately assemble the electronic device.

[0259] Method 1700 includes assembling 1720 one or more gaskets on the housing. For example, the gaskets can be bonded to the housing. This method step is optional but will be performed between steps 1710 and 1740. In some methods, the gaskets can be bonded to the PCB first.

[0260] Method 1700 includes placing a PCB on the housing at 1730. The PCB is placed on the housing so that when the housing is folded, the cavity in the gasket is aligned with the electronic components on the PCB. This method step is optional but is performed between steps 1710 and 1740.

[0261] Method 1700 includes mounting 1711 a plurality of button electrical contacts onto a PCB. This method step is optional but will be performed between steps 1710 and 1740. The method step 1711 involves typical electronic circuit manufacturing techniques, including soldering and etching processes.

[0262] Method 1700 includes forming 1712 at least one gasket having an actuation portion, the actuation portion defining one or more button actuators; and, before folding the housing 110, forming one or more user-actuatable button structures on the exterior thereof. This method step is optional, but will be performed between steps 1710 and 1740. The implementation of method step 1712 depends on the material of the housing 110. In the case of a cardboard housing such as that in the electronic device 100, the forming process of the one or more user-actuatable button structures includes embossing, engraving, or die cutting. When the housing is folded, the button electrical contacts, the one or more button actuators, and the user-actuatable portion are aligned with each other.

[0263] The method may further include forming a metal layer on the PCB, for example, by an etching process, which may be part of the PCB manufacturing process. The resulting products do not need to be further individually packaged, but can be bulk packaged, distributed, and then bulk loaded onto ring hook display racks.

[0264] Figure 18 A schematic diagram of an electronic circuit 1800 of an electronic device according to one aspect of the present invention is shown. The electronic circuit 1800 typically includes a processor (e.g., processor 695) and a memory 1810. The electronic circuit 1800 typically also includes a system-on-chip device 1820, which includes a processor 1825 and a memory 1830. The electronic circuit 1800 typically also includes a microphone 145, a speaker 135, and a port 170 for electrically connecting to an external device. The electronic circuit 180 typically includes an interface circuit 1840, a power supply circuit 1850, and a wireless communication transceiver circuit 1860. The components of the electronic circuit 1800 can communicate with each other and / or with devices external to the electronic circuit 1800. Metal tracks can be formed on the PCB that are not connected to any components and are not used, for example, as ground tracks, but are used to conduct signals.

[0265] Typically, electronic circuits may include a communication module, such as a wireless communication module that communicates with external devices using a two-way wireless communication connection. This allows users to communicate through their respective electronic devices without requiring a mobile data or Wi-Fi connection. For example, the two-way wireless communication connection may be Bluetooth.

[0266] The dimensions of the planar device can be adapted to standardized postal services. For example, the planar device can have a maximum length of 240 mm, a maximum width of 165 mm, and a maximum thickness of 5 mm. In one example, the planar device can have a width of 88.5 mm, a height of 128 mm, and a thickness of 4 mm.

[0267] Although the described embodiments all have a front surface with an electronic display screen disposed thereon, in some embodiments, the electronic device is not equipped with an electronic display screen. The flat panel device can communicate with an external device such as a television or speakers to output information to the user.

[0268] Figures 19 to 26 Another example of an electronic device 400 according to the present invention is shown. The electronic device 400 is a handheld gaming console. The electronic device comprises a housing comprising three layers 401, 402, and 403. The third layer 403 is positioned between the first layer 401 and the second layer 402. A slot 420 is provided on the top of the electronic device 400, extending through each layer 401, 402, and 403. When the layers 401, 402, and 403 are assembled, the slot 420 extends through the entire thickness of the electronic device 400. The slot 420 allows the electronic device 400 to be hung from a ring hook on a display stand, such as the ring hook 125.

[0269] The electronic device 400 has a front surface 410a formed by the outward-facing surface of the first layer 401. The electronic device 400 has a rear surface 410b formed by the outward-facing surface of the second layer 402. The electronic device 400 has an upper surface 410c formed by the top edges of the first, second, and third layers 401, 402, 403. The electronic device 400 has a lower surface 410d formed by the bottom edges of the first, second, and third layers 401, 402, 403. The electronic device 400 has a left side surface 410f formed by the left edges of the first, second, and third layers 401, 402, 403. The electronic device 400 has a right side surface 410e formed by the right edges of the first, second, and third layers 401, 402, 403.

[0270] The front surface 410a is provided with a display screen 430 for displaying visual images to a user of the electronic device 400 during use. The front surface 410a is also provided with two clusters of user-actuable buttons 440, 450. Figures 19 to 25 The individual buttons are not shown above, although there may be divisions or symbols to indicate button labels (for example, arrows or the letters "A", "B", "C", "D" to represent "up", "down", "left", and "right"). Two user-operable rear buttons 411 and 412 are provided on the rear surface 410b. A first side button group 460 is provided on the right side 410e, which may include a power button and a menu button. A second side button group 465 is provided on the left side 410f, which may include two "function" buttons. It will be understood that the above button types are only examples, and other buttons for different instructions for electronic devices are also foreseeable.

[0271] A first side port group 470a and a second side port group 470b are also provided on the right side 410e. The side ports 470a and 470b enable the electronic device 400 to communicate with other electronic devices. For example, the side ports 470a and 470b include a high-definition multimedia interface (HDMI) and a micro-USB port. It will be understood that the above-mentioned port types are only examples, and other ports for connecting to different electronic devices are also foreseeable. A charging port 475 is provided on the bottom surface 410d, so that the energy storage module can be charged when needed. It will be understood that the exact positions of the ports 470a, 470b, and 475 may vary in other examples.

[0272] The rear buttons 411, 412 do not overlap (in the thickness direction of the device 400) with the first and second button clusters 440, 450, so that each button 411, 412, 440, 450 can be independently actuated without accidentally actuating other buttons.

[0273] Figure 27 The second layer 402 of the electronic device 400 is shown. The second layer 402 is a PCB 510. Specifically, Figure 27 The inner surface of the PCB 510 is shown, which means that when the first, second and third layers 401, 402 and 403 are assembled, the inner surface of the PCB 510 is the inner surface of the device 400. The outer surface of the PCB 510 is Figure 20 and 26 The rear surface 410b of the device 400 is shown in FIG.

[0274] PCB 510 is the main board of device 400, on which several electronic components are soldered, including several auxiliary parts that are not individually labeled for simplicity. Two speakers 435a and 435b are soldered to PCB 510, while the first button dome group 445 and the second button dome group 455 form electrical contacts for button clusters 440 and 450 through PCB 510. Display screen 430 is soldered to PCB 510. Although Figure 27 Although not shown, a battery connected to the PCB 510 is also connected below the display screen 430. Since the display screen 430 and the battery overlap each other, this design makes the device 400 more compact.

[0275] like Figure 27 As shown, there are several ports 470a, 470b that connect to a computing module 480 (e.g., a Raspberry Pi (RTM), a computer with its own PCB). A charging port 475 is also located on the bottom edge of the PCB 510. The computing module 480 is connected to the computer via a flexible circuit ( Figure 275 (not shown) is connected to PCB 510. Computing module 480 is soldered onto the flexible circuit, which is in turn soldered to PCB 510. Display 430 is offset from the center of the PCB so that ports 470a, 470b are aligned along the right edge of PCB 510, ensuring that the ports are accessible along the right side 410e of device 400 when the device 400 is assembled.

[0276] Also along the right edge of the PCB 510, in the upper right corner, are the electrical contacts 485 for the first side button group 460. These contacts 485 are actuated from the side rather than from the front or back, so they are actuated by pressing the first side button group 460 on the right side 410e of the device 400.

[0277] Also provided on the PCB 510 are electrical contacts 490 for the second side button group 465, which are also actuated from the side rather than from the front or back, so they are actuated by pressing the second side button group 465 on the left side 410f of the device 400.

[0278] PCB 510 includes two cutouts 495a and 495b. The first cutout 495a is a space for accommodating the first rear button 411 when the device 400 is assembled. The second cutout 495b is a space for accommodating the second rear button 412 when the device 400 is assembled.

[0279] Figure 28 The second layer 403 of the electronic device 400 is shown. The third layer 403 is formed by a gasket 710 made of a single integral workpiece. A display window 730 is provided on the gasket. When the device 400 is assembled, the display screen 430 can be seen through the display window 730. A narrow slot 420 is provided on the partition 710 to cooperate with the pin. When the device 400 is assembled, the narrow slot is aligned with the corresponding narrow slot of the other two layers of structure. The gasket 710 is also provided with two holes 735a and 735b, which form cavities for accommodating speakers 435a and 435b respectively when superimposed with the second PCB 510. The gasket 710 includes two grooves 770a and 770b for fixing the ports 470a and 470b when the device 400 is assembled. A first side button actuator group 460 is also provided on the gasket 710. Although Figure 28 It is not shown in the figure, but it is understood that the gasket 710 is provided with a cavity for accommodating other auxiliary components of the second PCB 510.

[0280] The varying elasticity of the gasket 710 will now be described with reference to the fixing portions 713 and 714, the actuating portions 740 and 750 that form the front button actuators 440 and 450, respectively, and the actuating portions 711 and 712 that form the rear button actuators 411 and 412, respectively. The fixing portions 713 and 714 have a lower elasticity than the actuating portions 711, 712, 740, and 750. The fixing portions 713 and 714 are located in areas of the gasket 710 where strength is required, that is, near the edges of the gasket 710, such as the fixing portion 714, and at the corners of the gasket 710, such as the fixing portion 713. These fixing portions 713 and 714 provide structural integrity to prevent damage to the device 400.

[0281] Figure 29 and 30 The first layer 401 of the electronic device 400 is shown. The first layer 410b is a PCB 810. Specifically, Figure 29 The outer surface of the PCB 810 is shown, which means that when the first, second and third layers 401, 402 and 403 are assembled, the outer surface of the PCB 810 is the outer surface of the device 400. Figure 30 As shown, it will become the inner surface of the device 400 when the first, second and third layers 401, 402 and 403 are fully assembled.

[0282] PCB 810 is provided with several electronic components soldered to its inward-facing surface, including button domes 811 and 812 for rear buttons 411 and 412. The first button dome 811 forms an electrical contact for the first rear button 411. The second button dome 812 forms an electrical contact for the second rear button 412. When the device 400 is assembled, the button domes 811 and 812 align with corresponding cutouts 495a and 495b in the second layer 402 and the actuators 711 and 712 of the gasket 710, respectively. A port 470b is also provided on the right edge of PCB 810, making it accessible through the right side 410e of the device 400 when the device 400 is assembled.

[0283] PCB 810 is provided with two holes 840 and 850 corresponding to first button cluster 440 and second button cluster 450, respectively. When device 400 is assembled, first button dome group 445 and second button dome group 455 are aligned with cutouts 840 and 850 in first layer 401 and actuators 740 and 750 of gasket 710, respectively. PCB 810 also includes a space 830 to ensure that display screen 430 is visible through PCB 810.

[0284] It can be seen that the third layer 403 is used to provide the front buttons 440, 450 and the rear buttons 711, 712 at the same time, and the cutouts 495a, 495b of the second layer 402 and the holes 840, 850 of the first layer 401 together define the outer edges of each button 440, 450, 711, 712 when the device 400 is assembled.

[0285] Figure 32 A partial schematic diagram of an apparatus according to one aspect of the present invention is shown. The first-layer PCB 810 communicates with the second-layer PCB 510 via a connector 3310. Connector 3310 is positioned adjacent to the Raspberry Pi 510. In this embodiment, connector 3310 utilizes a flexible PCB, one end of which is soldered to the second-layer PCB 510 and the other end of which is inserted into a connector socket 3320 soldered to the first-layer PCB 810.

[0286] Figure 31 A flow chart of a method 3200 according to one aspect of the present invention is shown. The method 3200 may be used to manufacture and assemble the device 400.

[0287] In a first method step 3210, a first PCB is prepared. Method step 3210 includes mounting electronic components on the first PCB, including electronic components for the device's rear buttons. Method step 3210 also includes creating cutouts in the first PCB for the display, front buttons (e.g., first and second button clusters), and slots for pins.

[0288] In a subsequent step 3220, a second PCB is prepared. The second PCB serves as the motherboard of the electronic device and is connected to more electronic components than the first PCB. Method step 3220 includes mounting electronic components on the first PCB, including components for the device's rear buttons, display, and battery. Method step 3220 also includes creating cutouts in the second PCB for the rear buttons and pin slots.

[0289] In the following step 3230, a third layer is prepared. Method 3200 forms 3230 the third layer using a two-shot molding process to provide the third layer with materials having different properties, resulting in elasticity that varies across the third layer. The third layer is molded into a specific shape, including slots for receiving the pins therethrough, a cavity for accommodating electronic components mounted on the first and second PCBs, and a window for viewing the display. The third layer is molded into a button actuator comprising a front surface, a rear surface, and side surfaces of the third layer.

[0290] The next method step 3240 involves stacking the PCBs with the third layer centered and the first and second PCBs on either side. The method may include attaching the PCBs and the third layer to each other by gluing the layers together or using mechanical or magnetic fasteners.

[0291] Method 3200 may include connecting 3250 the first and second PCBs so that they can communicate with each other. This may be accomplished by soldering a connector flex PCB to the second PCB and soldering a connector receptacle to the first PCB. The connector flex PCB includes a plug that plugs into the connector receptacle of the first PCB. Method step 3250 may be performed at any appropriate stage of method 3200.

[0292] As previously mentioned, the resulting products need not be further individually packaged, but can be bulk packaged (typically with the first layer of one device touching the second layer of an adjacent device), distributed, and then bulk loaded onto ring hook displays.

Claims

1. A planar electronic device, characterized in that: include: a housing, an energy storage module, a processor, and at least one user input device, wherein the housing has a front surface on which an electronic display is provided and a rear surface opposite thereto; The maximum thickness between the front surface and the rear surface opposite thereto is less than 1 cm; the planar electronic device has a top with a hole thereon for accommodating at least one pin passing therethrough.

2. The planar electronic device according to claim 1, wherein: The hole is a circular hook receiving hole.

3. The planar electronic device according to claim 2, wherein: The hole is in the shape of a narrow slot with a width of 32±4 mm.

4. The planar electronic device according to any one of the preceding claims, wherein: The apparatus includes a first layer forming the front surface of the housing, a second layer forming the rear surface of the housing, and a third layer located between the first layer and the second layer, the third layer forming a portion of the housing.

5. The planar electronic device according to claim 4, wherein: At least one of the first layer and the second layer is a PCB.

6. The planar electronic device according to claim 5, wherein: The thickness of the PCB of the first layer is 0.5 mm or less, and / or the thickness of the PCB of the second layer is 1 mm or less.

7. The planar electronic device according to any one of claims 4 to 6, wherein: The elasticity of the third layer varies with position on at least one surface of the third layer.

8. The planar device according to any one of claims 4 to 7, wherein The planar electronic device has a top portion having a hole therein for receiving at least one pin therethrough, the hole for receiving the at least one pin being formed by overlapping holes in the first, second and third layers.

9. The planar electronic device according to any one of claims 4 to 8, wherein: The third layer is formed from one or more polymeric materials.

10. The planar electronic device according to any one of claims 5 to 9, wherein: At least 25% of at least one surface of the PCB of the first and / or second layer is metallized, and optionally, the metallization is gold.

11. The planar electronic device according to any one of the preceding claims, wherein: The electronic display screen is a part of an electronic display unit. The electronic display unit is rectangular and has a viewing area with an electronic driving circuit arranged along its edge. The housing includes a rectangular display window with its center offset from the longitudinal axis of the housing.

12. The planar electronic device according to any one of the preceding claims, comprising one or more spacers located within the housing, which together with the first and / or second layer define one or more cavities for accommodating one or more electronic circuit components.

13. The planar electronic device according to claim 12, wherein: When referring to claim 4 or its appendant claims, the third layer comprises the one or more spacers and the one or more holes, thereby defining one or more of the cavities.

14. The planar electronic device according to claim 13, wherein: The one or more electronic circuit components include a speaker, and the first or second layer PCB and the peripheral gasket enclose the speaker to form a sound baffle.

15. The planar electronic device according to any one of claims 12 to 14, characterized in that: The device comprises a top portion, on which a hole is provided for accommodating at least one pin passing therethrough; and the cavity comprises the cavity for accommodating the electronic circuit component located on the left and / or right side of the hole.

16. The planar electronic device according to any one of claims 12 to 15, wherein: The third layer includes a gasket having at least one fixed portion and at least one actuating portion, the at least one actuating portion defining one or more button actuators, the at least one fixed portion being less elastic than the at least one button actuator.

17. The planar electronic device according to claim 16, wherein: The button actuator includes at least one, typically at least two, button clusters.

18. The planar electronic device according to claim 16 or 17, wherein: At least one of the first and second layers includes one or more apertures; at least one of the button actuators of the gasket of the third layer is exposed through the one or more apertures.

19. The planar electronic device according to claim 18, wherein: At least one of the button actuators extends through a corresponding hole in the first or second layer and protrudes from the front / rear surface of the housing.

20. The planar electronic device according to any one of the preceding claims, characterized in that Included are one or more button clusters on the front surface and one or more buttons on the rear surface.

21. The planar electronic device according to any one of the preceding claims, characterized in that Including one or more side button actuators on the side of the housing and / or one or more input / output ports on the side of the housing of the device.

22. The planar electronic device according to claim 21, wherein: When referring to claim 4 or its dependent claims, the third layer includes the one or more side button actuators, and the PCB of the first or second layer includes electronic components of each of the side button actuators.

23. The planar electronic device according to claim 22, wherein: At least one of the one or more side button actuators protrudes from an edge of the front / rear surface of the housing.

24. The planar electronic device according to claim 22 or 23, wherein: The one or more input / output ports are connected to the PCB of the first or second layer, and the third layer includes one or more recesses, each recess being configured to accommodate at least one of the one or more input / output ports.

25. A planar electronic device according to claim 4 or any claim dependent therefrom, wherein: The PCB of the first and / or second layer includes a first area where no electrical contacts exist and no solder resist is coated. Optionally, the first area overlaps with the light emitting device in the housing.

26. The planar electronic device according to any one of the preceding claims, characterized in that The housing is provided with a unique visual indicator that can be used to download one or more software applications to the flat electronic device, or to activate one or more software applications pre-recorded in the flat electronic device.

27. A planar electronic device according to claim 5 or any claim dependent therefrom, wherein: The first and second layers each include a PCB and communicate with each other through a connector.

28. An apparatus comprising: a display stand having one or more loop hooks projecting therefrom; A plurality of planar electronic devices according to any one of claims 1 to 27 are hung on at least one of the ring hooks, specifically by passing the ring hook through the hole thereof for receiving the at least one pin.

29. A method for constructing a planar electronic device according to any one of claims 1 to 27, wherein The method comprises: mounting one or more electronic components onto the first PCB; mounting the display screen, battery, and one or more other electronic components onto a second PCB having a display screen window; and A third layer is provided between the first and second PCBs so that the display screen is visible through the display screen window; the first PCB forms the front surface of the housing of the planar electronic device; and the second PCB forms the rear surface of the housing of the planar electronic device.

30. The method of claim 29, comprising forming one or more spacers in the third layer, wherein: The one or more pads define one or more cavities in which one or more electronic components attached to the first and / or second PCBs are housed.

31. The method according to claim 29 or 30, further comprising: A plurality of button electrical contacts are mounted on the first and / or second PCBs, and at least one gasket is formed in the third layer, wherein the gasket includes at least one fixing portion and at least one actuating portion, and the actuating portion defines one or more button actuators; each of the one or more button actuators is provided in a corresponding hole of the first or second PCB so that the one or more button actuators cover the button electrical contacts in the planar electronic device.

32. A method according to any one of claims 29 to 31, comprising: The third layer is formed using a first material and a second material, wherein the first material has lower elasticity than the second material.

Images