Disinfection device, manufacturing method thereof, disinfection equipment and wallet

Abstract

The invention provides a disinfection device, a manufacturing method thereof, disinfection equipment and a wallet. The sterilizing device includes: a thermally conductive layer having a first edge and a second edge extending in a first direction and opposed to each other, and a third edge and a fourth edge extending in a second direction intersecting the first direction and opposed to each other; the heating layer is located on one side of the heat conduction layer and is configured to generate heat, the heat conduction layer is configured to conduct the heat generated by the heating layer, and the heating layer comprises a snakelike metal wire with a plurality of metal wire parts; the plurality of metal wire parts extend to the second edge of the heat conduction layer along the second direction, and the plurality of metal wire parts are arranged from the third edge of the heat conduction layer to the fourth edge of the heat conduction layer along the first direction; the multiple metal wire parts are sequentially connected end to end to form the snakelike metal wire.

Description

Technical Field

[0001] The present invention relates to the field of disinfection, in particular to a disinfection device and a manufacturing method thereof, disinfection equipment, and a wallet. Background Art

[0002] Cash is widely used worldwide. Frequent transactions between people make banknotes a potential risk for the spread of epidemics. Traditional disinfection techniques using chemical or physical treatments have various drawbacks. Chemical agents such as alcohol are widely used, but they incur additional costs and contaminate large amounts of banknotes. UV light can kill living organisms by destroying DNA or RNA, but it cannot penetrate deeply into objects. Furthermore, steam heating at high temperature or high pressure offers high throughput, but the heating and cooling process takes a long time and introduces water or moisture into the banknotes.

[0003] In view of the above problems existing in the prior art, it is necessary to find a disinfection and sterilization method that is effective, low-cost, short-time and has little environmental burden. Summary of the Invention

[0004] According to a first aspect of the present disclosure, a disinfection device is provided, comprising: a heat-conducting layer having a first edge and a second edge extending along a first direction and opposite to each other, and a third edge and a fourth edge extending along a second direction intersecting the first direction and opposite to each other; and a heating layer, which is located on one side of the heat-conducting layer and is configured to generate heat, wherein the heat-conducting layer is configured to conduct the heat generated by the heating layer, and wherein the heating layer comprises a serpentine metal wire having a plurality of metal wire portions, the plurality of metal wire portions all extending along the second direction to the second edge of the heat-conducting layer, the plurality of metal portion wires are arranged along the first direction from the third edge of the heat-conducting layer to the fourth edge of the heat-conducting layer, and the plurality of metal wire portions are sequentially connected end to end to form the serpentine metal wire.

[0005] In some embodiments, each metal wire portion is straight, and the line spacing and line width between multiple metal wire portions are continuously modulated according to a modulation function, wherein the modulation function is: f(x) = (xa) × (xb) × (xc) × (xd) × (xe) × (xf), where a = 0.1, b = 0.13, c = 0.49, d = 1–c, e = 1–b, f = 1–a, the value range of position x is 0 to 1, f(x) represents the ratio of the line spacing offset of the metal wire portion at position x to the unmodulated line spacing, and f(x) is normalized to obtain F(x), the line spacing offset = F(x) × k × unmodulated line spacing, wherein k is a scaling factor, k = 0.4, the unmodulated line spacing is a constant, the modulated line spacing between the metal wire portions at position x = unmodulated line spacing - line spacing offset × 2, and the modulated line width of the metal wire portion at position x = unmodulated line width + line spacing offset × 2.

[0006] In some embodiments, the unmodulated line spacing is 200 microns, and the unmodulated line width is 300 microns or 150 microns.

[0007] In some embodiments, the disinfection device also includes: two contact terminals, both located on one side of the serpentine metal wire close to the first edge, and respectively connected to the first metal wire at the third edge and the second metal wire at the fourth edge of the serpentine metal wire, respectively located at the heat-conducting layer, wherein the orthographic projections of the two contact terminals on the heat-conducting layer do not overlap with the orthographic projections of the serpentine metal wire on the heat-conducting layer.

[0008] In some embodiments, the multiple metal wire portions are distributed on the heat-conducting layer in an axisymmetric manner relative to the symmetry axis of the heat-conducting layer, the symmetry axis extends along the second direction, and the two contact terminals are located on both sides of the symmetry axis of the heat-conducting layer and are distributed on the heat-conducting layer in an axisymmetric manner relative to the symmetry axis of the heat-conducting layer.

[0009] In some embodiments, the plurality of metal wire portions are arranged along the first direction to form a row of serpentine metal wires, and the outer contour of the serpentine metal wires matches the shape of the object to be sterilized.

[0010] In some embodiments, the lengths of the plurality of wire portions are the same and are 10 to 11 centimeters, and the outer contour of the serpentine wire is a rectangle with a length of 10 to 11 centimeters and a width of 10 to 11 centimeters.

[0011] In some embodiments, the current input to the contact terminal is less than 2.1 amps, causing the serpentine wire to be heated to a target temperature of 89.5 to 90.5 degrees Celsius.

[0012] In some embodiments, the disinfection device further comprises: an encapsulation layer located on a side of the serpentine metal wire away from the heat conductive layer.

[0013] In some embodiments, the heat conductive layer comprises polyimide, the serpentine metal wire comprises copper, the packaging layer comprises polyimide tape, and the polyimide tape comprises a polyimide film and a polyimide glue on the polyimide film.

[0014] In some embodiments, the disinfection device further comprises: a temperature sensor disposed on the serpentine wire and configured to obtain the temperature of the serpentine wire; and a controller configured to perform PID control on the heating of the serpentine wire according to the temperature of the serpentine wire obtained by the temperature sensor.

[0015] According to a second aspect of the present disclosure, a disinfection device is provided, comprising: a first shell, on which the above-mentioned disinfection device is provided as a first disinfection device; a second shell, on which the above-mentioned disinfection device is provided as a second disinfection device, wherein one side edge of the first shell and one side edge of the second shell are hinged to each other, so that the object to be disinfected can be clamped between the first disinfection device and the second disinfection device for disinfection; a temperature sensor, which is provided on at least one of the first disinfection device or the second disinfection device and is configured to obtain the temperature of the serpentine wire in the at least one disinfection device; and a controller, which is configured to perform PID control on the heating of the serpentine wire in the at least one disinfection device according to the temperature obtained by the temperature sensor.

[0016] According to a third aspect of the present disclosure, there is provided a wallet comprising a first part and a second part that can be folded in half, wherein the above-mentioned disinfection device is provided in at least one of the first part and the second part.

[0017] According to a fourth aspect of the present disclosure, a method for manufacturing a disinfection device is provided, comprising: providing a stack of a heat-conducting layer and a metal material layer, wherein the heat-conducting layer has a first edge and a second edge extending along a first direction and opposite to each other, and a third edge and a fourth edge extending along a second direction intersecting the first direction and opposite to each other; and laser scribing the metal material layer to form a heating layer, the heating layer being formed as a serpentine metal wire having a plurality of metal wire portions, the plurality of metal wire portions all extending along the second direction to the second edge of the heat-conducting layer, the plurality of metal wire portions being arranged along the first direction from the third edge of the heat-conducting layer to the fourth edge of the heat-conducting layer, and the plurality of metal wire portions being sequentially connected end to end to form the serpentine metal wire.

[0018] In some embodiments, laser scribing the metal material layer to form a heating layer includes: forming each metal wire portion into a straight line, so that the line spacing and line width between the multiple metal wire portions are continuously modulated according to a modulation function, wherein the modulation function is: f(x) = (xa) × (xb) × (xc) × (xd) × (xe) × (xf), where a = 0.1, b = 0.13, c = 0.49, d = 1–c, e = 1–b, f = 1–a, and the value range of position x is 0 to 1, f(x) represents the ratio of the line spacing offset of the metal wire portion at position x to the unmodulated line spacing, f(x) is normalized to obtain F(x), line spacing offset = F(x) × k × unmodulated line spacing, wherein k is a scaling factor, k = 0.4, the unmodulated line spacing is a constant, the modulated line spacing between the metal wire portions at position x = unmodulated line spacing - line spacing offset × 2, the modulated line width of the metal wire portion at position x = unmodulated line width + line spacing offset × 2. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The following drawings, in accordance with various disclosed embodiments, are examples only for illustrative purposes and are not intended to limit the scope of the invention.

[0020] Figure 1 A schematic diagram showing the structure of a disinfection device according to one embodiment of the present disclosure.

[0021] Figure 2 A schematic diagram illustrating the uniformity of a disinfection device according to one embodiment of the present disclosure.

[0022] Figure 3 A SEM electron microscope image of a serpentine wire of a disinfection device according to one embodiment of the present disclosure is shown.

[0023] Figure 4A A schematic diagram showing a serpentine metal wire with modulated line spacing and a serpentine metal wire with unmodulated line spacing of a disinfection device according to one embodiment of the present disclosure.

[0024] Figure 4B The figures show a temperature curve of a serpentine metal wire with modulated line spacing and a temperature curve of a serpentine metal wire with unmodulated line spacing of a disinfection device according to one embodiment of the present disclosure.

[0025] Figure 4C The temperature distribution of the serpentine metal wire with modulated line spacing and the temperature distribution of the serpentine metal wire with unmodulated line spacing of the disinfection device according to one embodiment of the present disclosure are shown.

[0026] Figure 5 yes Figure 1 An enlarged schematic diagram of the contact terminals of the disinfection device.

[0027] Figure 6 A schematic diagram illustrating dynamic temperature feedback and real-time control of a disinfection device according to an embodiment of the present disclosure.

[0028] Figure 7 A schematic diagram showing a comparison between a disinfection device according to an embodiment of the present disclosure and an existing heating method.

[0029] Figure 8 FIG. 4 shows temperature changes when a sterilization device according to an embodiment of the present disclosure sterilizes a multi-layer object.

[0030] Figure 9 FIG. 1 shows a ring bending test that a sterilization device according to one embodiment of the present disclosure undergoes.

[0031] Figure 10 The antibacterial experiment and antibacterial test results of the disinfection device according to one embodiment of the present disclosure are shown.

[0032] Figure 11A and Figure 11B A disinfection device including a disinfection apparatus according to one embodiment of the present disclosure is shown.

[0033] Figure 12 A wallet including a disinfection device according to one embodiment of the present disclosure is shown.

[0034] Figure 13 The normalized modulation function of the wire spacing offset for multiple wire sections is shown. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the present disclosure is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0036] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, including direct and indirect connections. Words such as "upper", "lower", "left", "right" and similar words are only used to indicate the relative positional relationship between objects. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0037] Figure 1 A schematic diagram showing the structure of a disinfection device according to an embodiment of the present disclosure is shown. Figure 1 As shown, the disinfection device includes a heat-conducting layer 2 having a first edge A1 and a second edge A2 extending in a first direction X and opposing each other, and a third edge A3 and a fourth edge A4 extending in a second direction Y intersecting or orthogonal to the first direction X and opposing each other; and a heating layer 3 located on one side of the heat-conducting layer 2 and configured to generate heat. The heat-conducting layer 2 is used to conduct the heat generated by the heating layer 3 away. The heat-conducting layer 2 is a polyimide layer, and the heating layer 3 is a copper metal layer.

[0038] The copper metal layer 3 is patterned into a serpentine metal wire 4, which includes multiple metal wire portions. Each of the multiple metal wire portions extends along the second direction Y to the second edge A2 of the thermal conductive layer 2. The multiple metal wire portions are arranged along the first direction X from the third edge A3 to the fourth edge A4 of the thermal conductive layer 2. The multiple metal wire portions are sequentially connected end to end to form the serpentine metal wire 4.

[0039] In one embodiment, the serpentine wires 4 include one or more rows of serpentine wires. In one embodiment, the serpentine wires 4 of the copper metal layer include only one row of serpentine wires, rather than two or more rows. The single row of serpentine wires meanders along the first direction X from the third edge A3 to the fourth edge A4 of the thermally conductive layer 2 and turns back between the first edge A1 and the second edge A2 of the thermally conductive layer 2.

[0040] The disinfection device also includes two contact terminals 6, both located on one side of the serpentine wire 4 near the first edge A1 and connected to the first wire portion 5-1 and the second wire portion 5-2 of the serpentine wire 4 located at the third edge A3 and the fourth edge A4 of the thermally conductive layer 2, respectively. One end of the first wire portion 5-1 located at the third edge A3 of the thermally conductive layer 2 contacts one contact terminal 6, while the other end of the first wire portion 5-1 contacts another wire portion adjacent to the first wire portion 5-1. One end of the second wire portion 5-2 located at the fourth edge A4 of the thermally conductive layer 2 contacts and contacts one contact terminal 6, while the other end of the second wire portion 5-2 contacts and contacts another wire portion adjacent to the second wire portion 5-2.

[0041] In the present disclosure, the two contact terminals 6 are arranged near the first edge A1 of the thermal conductive layer 2, and the orthographic projections of the two contact terminals 6 on the thermal conductive layer 2 do not overlap with the orthographic projections of the serpentine metal wire 4 on the thermal conductive layer 2. Therefore, the two contact terminals 6 will not affect the heat dissipation area of ​​the serpentine metal wire 4, and thus will not affect the heat dissipation effect of the serpentine metal wire 4.

[0042] Figure 2 A schematic diagram showing the uniformity of a disinfection device according to an embodiment of the present disclosure. Figure 2 As shown, because the heating layer 3 is a row of continuous serpentine metal wires rather than two or more rows, the heat generated by the row of continuous serpentine metal wires is evenly distributed.

[0043] In one embodiment, the number of wire sections, the length of each wire section, and the spacing between wire sections in the serpentine wire 4 are set so that the outer contour of the serpentine wire 4 is a rectangle that matches the size of the object being measured, such as cash or a mask. Alternatively, the number of wire sections, the length of each wire section, and the spacing between wire sections are set so that the outer contour of the serpentine wire 4 is a rectangle that is smaller than the size of the object being measured, such as cash or a mask, thereby achieving portability and compactness.

[0044] In one embodiment, the plurality of metal wire portions in the serpentine metal wire 4 are distributed on the heat conducting layer 2 in an axisymmetric manner relative to a symmetry axis I of the heat conducting layer 2 , and the symmetry axis I extends along the second direction Y.

[0045] In one embodiment, the outer contour of the serpentine wire 4 is a rectangle with a length ranging from 10 to 11 centimeters and a width ranging from 10 to 11 centimeters. Preferably, the outer contour of the serpentine wire 4 is 10 centimeters in length and 10 centimeters in width. In one embodiment, the serpentine wire 4 includes a plurality of wire sections, each of which has the same length, and the length of each wire section ranges from 10 to 11 centimeters, preferably 10 centimeters. The spacing between each two wire sections ranges from 40 microns to 200 microns. The number of the plurality of wire sections depends on the overall size of the serpentine wire, the width of the plurality of wire sections, and the spacing between the plurality of wire sections. The density of the plurality of wire sections ranges from 5 wires / cm to 50 wires / cm.

[0046] In one embodiment, each metal wire portion is linear. One end of each of the metal wire portions is 1 to 3 mm away from the second edge A2 of the thermally conductive layer 2. A metal wire portion of the metal wire portions that is adjacent to the third edge A3 of the thermally conductive layer 2 is 1 to 3 mm away from the third edge. A metal wire portion of the metal wire portions that is adjacent to the fourth edge A4 of the thermally conductive layer 2 is 1 to 3 mm away from the third edge.

[0047] Figure 3 FIG1 shows an SEM electron microscope image of a serpentine wire of a disinfection device according to an embodiment of the present disclosure. Figure 3As shown, the width or line width of the metal wire portion is about 150 microns and the height of the metal wire portion is about 30 microns. In one embodiment, the metal wire portion is a copper wire.

[0048] Figure 4A Schematic diagram showing a serpentine wire with modulated line pitch or modulated interval and a serpentine wire with unmodulated line pitch or unmodulated interval of a disinfection device according to one embodiment of the present disclosure.

[0049] Figure 4A The left side of the figure shows a serpentine wire with unmodulated wire pitch. The widths of the first wire section 5-1 at the third edge A3 of the thermally conductive layer 2 and the second wire section 5-2 at the fourth edge A4 are wider than the remaining wire sections, which have the same width. The first and second wire sections 5-1, 5-2 on either side will soon connect to the contact terminals 6. Because the contact terminals 6 may be subject to significant external forces, the first and second wire sections 5-1, 5-2 on both sides are slightly widened to enhance reliability. In this unmodulated serpentine wire, each wire section has a line width of 300 microns, and the line pitch (i.e., the distance between the two wire sections) is 200 microns.

[0050] Figure 4A The right side of the figure shows a serpentine wire with modulated line spacing. The first and second wire sections 5-1, 5-2 on either side are about to connect to contact terminals 6. Because contact terminals 6 may be subject to significant external forces, the first and second wire sections 5-1, 5-2 on either side are slightly widened to enhance reliability. In a serpentine wire with modulated line spacing, except for the two outermost wires, the line width and line spacing of each remaining wire section are continuously modulated based on the unmodulated line width and line spacing.

[0051] Figure 13 The normalized modulation function F(x) of the line spacing of multiple metal wire parts is shown. Figure 13 As shown, the position of the first metal wire portion 5-1 on the far left is x=0, and the position of the second metal wire portion 5-2 on the far right is x=1. Then, the ratio of the line spacing offset of the metal wire portion at position x to the unmodulated line spacing is f(x)×k, where k is a scaling factor. In the present invention, k is set to 0.4, and f(x) is:

[0052] f(x)=(xa)×(xb)×(xc)×(xd)×(xe)×(xf), where a=0.1, b=0.13, c=0.49, d=1-c, e=1-b, f=1-a.

[0053] Normalize f(x) to get the normalized ratio F(x), that is, scale f(x) to the maximum value f_max and minimum value f_min on [0,1]:

[0054] The normalized ratio F(x) is: F(x) = (f(x) - f_min) / (f_max - f_min)

[0055] Line spacing offset = F(x) × k × unmodulated line spacing, where k is a scaling factor, k = 0.4, and the unmodulated line spacing is a constant.

[0056] In one embodiment, the unmodulated line pitch is 200 microns, and the line pitch offset of the wire portion at position x is F(x)×0.4×200 microns.

[0057] The actual line spacing between the wire sections at position x = unmodulated line spacing - 2 x line spacing offset, where the unmodulated line spacing is 200 microns.

[0058] The actual line width of the metal wire portion at position x = unmodulated line width + 2× line spacing offset, where the unmodulated line width is 300 microns.

[0059] In other words, the line pitch offset refers to the amount by which the line pitch is reduced, and the amount by which the line width is increased. Specifically, the smaller the line pitch offset, the closer the actual line pitch is to the unmodulated line pitch, i.e., 200 microns, and the closer the actual line width is to the unmodulated line width, i.e., 300 microns. On the other hand, the larger the line pitch offset, the smaller the actual line pitch is and the larger the actual line width is.

[0060] This function is symmetric about x=0.5, that is, the wire spacing offset is axisymmetric about the center spacing of the wires in the entire heating area.

[0061] Each metal wire portion is linear, and the length of the plurality of metal wire portions is the same and ranges from 10 to 11 centimeters. The spacing between two adjacent metal wire portions in the plurality of metal wire portions ranges from 40 microns to 200 microns. The spacing between two adjacent metal wire portions in the middle of the heat conductive layer is greater than the spacing between two adjacent metal wire portions at either end of the heat conductive layer.

[0062] In one embodiment, when the position x=0.5, the normalized ratio F(0.5)≈0, the line spacing offset=F(0.5)×200 microns×0.4≈0, the actual line spacing=200-0×2=200, and the actual line width

[0063] =300+0×2=300. That is, the spacing offset between two adjacent metal wire portions located in the middle of the serpentine metal wire is 0, and the actual line spacing between the metal wire portions at the position 0.5 is 200 microns; the actual line width of the metal wire portion at this position is 300 microns.

[0064] In one embodiment, when position x=0, the normalized ratio F(0)=1, F(0)×200 μm×0.4=80 μm, that is, the spacing offset between two adjacent metal wire portions located at both ends of the serpentine metal wire is F(0)×0.4×200, i.e., 80 μm. Then, the actual line spacing between the metal wire portions at position 0 is 200-80-80=40 μm, and the line width of the metal wire portion at this position is 300+80+80=460 μm.

[0065] like Figure 4A As shown in the right figure, f(x) has small peaks near x = 0.3 and x = 0.7. In order to obtain a better temperature distribution, the corresponding actual line spacing becomes slightly smaller at these two locations, and the corresponding actual line width becomes slightly larger.

[0066] In one embodiment, the unmodulated line spacing is 200 microns and the unmodulated line width is 300 microns. In another embodiment, the unmodulated line spacing is 200 microns and the unmodulated line width is 150 microns.

[0067] Alternatively, since the wire spacing offset is a function that depends on the position x, there is a "wire spacing offset" even on the left and right sides of a wire portion or space.

[0068] For example, the actual line width of the metal wire portion at position x = line spacing offset (left) + unmodulated line width + line spacing offset (right), where the unmodulated line width is 300 microns.

[0069] Actual line spacing between wire sections at position x = -line spacing offset (left) + unmodulated line spacing - line spacing offset (right), where the unmodulated line spacing is 200 microns.

[0070] The carefully designed serpentine wire contains a modulated copper wire / gap ratio generated by COMSOL simulation to obtain better spatial temperature uniformity. The wire sections are the heating source, while the gaps between them and the edges (i.e., the gaps between the first wire section 5-1 and the second wire section 5-2 at the two ends and the third edge A3 and the fourth edge A4, as shown in Figure 2) are the heating source. Figure 1The wire spacing (shown) is a passive area that dissipates some of the heat. Since the entire heating area is a finite region, using uniformly distributed wire spacing or gaps across the entire heating area will result in heat accumulation at the center of the disinfection device and uneven temperature distribution. Therefore, it is necessary to increase the wire spacing of the wire sections at the center while reducing it near the edges. COMSOL simulations can help find an optimized pattern for better spatial uniformity.

[0071] Figure 4B The figure shows a temperature curve B1 of a serpentine wire with modulated line spacing and a temperature curve B2 of a serpentine wire with unmodulated line spacing of a disinfection device according to an embodiment of the present disclosure. Figure 4B As shown, the uniform temperature region of the serpentine wire with modulated wire pitch (e.g., the region between 89.5 and 90.5 degrees Celsius) is larger than the uniform temperature region of the serpentine wire with unmodulated wire pitch B2. Specifically, within the uniform temperature range of 89.5 to 90.5 degrees Celsius, the temperature curve B1 of the serpentine wire with modulated wire pitch has a distance range of -6 mm to +6 mm, compared to the temperature curve B2 of the serpentine wire with unmodulated wire pitch, which has a distance range of -4 mm to +4 mm. Furthermore, within the temperature range above 82 degrees Celsius, the temperature curve B1 of the serpentine wire with modulated wire pitch has a distance range of -12 mm to +12 mm, compared to the temperature curve B2 of the serpentine wire with unmodulated wire pitch, which has a distance range of -10 mm to +10 mm.

[0072] Figure 4C The temperature distribution of the serpentine metal wire with modulated line spacing B1 and the temperature distribution of the serpentine metal wire with unmodulated line spacing B2 of the disinfection device according to one embodiment of the present disclosure are shown.

[0073] like Figure 4C As shown, the temperature profile B1 of the serpentine wires with modulated wire spacing has a larger and more uniform temperature range. Specifically, the second edge A2, third edge A3, and fourth edge A4 of the thermally conductive layer 2 are all in a uniform temperature range, with slight or almost no temperature gradient. Temperature curve B1 shows that within a distance or region between -4 mm and +4 mm, the temperature of the serpentine wires with modulated wire spacing is consistently above 85 degrees Celsius.

[0074] In contrast, the temperature profile B2 of the serpentine wires with unmodulated wire spacing has a smaller and more uneven uniform temperature region. Specifically, a significant temperature gradient exists at the third edge A3 and the fourth edge A4 of the thermally conductive layer 2. Temperature curve B2 shows that within a distance or region of -4 mm to +4 mm, the temperature of the serpentine wires with unmodulated wire spacing decreases from 85 degrees Celsius to 40 degrees Celsius.

[0075] In one embodiment, the maximum current input to the serpentine wire is 2.1 amps or the maximum power is 40 watts, so that the serpentine wire is heated to a target temperature range of 89.5 to 90.5 degrees Celsius.

[0076] It can be seen that the serpentine wire is designed to have a variable wire section width or gap ratio to ensure modulation of the heating power at different spaces inside the disinfection device, thereby ensuring more uniform heating.

[0077] Figure 5 yes Figure 1 An enlarged schematic diagram of the contact terminals of the disinfection device in FIG. Figure 1 and Figure 5 As shown, the orthographic projection of each of the two contact terminals 6 on the heat-conducting layer 2 is approximately L-shaped. The two contact terminals 6 are located on both sides of the symmetry axis I of the heat-conducting layer 2 and are distributed on the heat-conducting layer 2 in an axisymmetric manner relative to the symmetry axis I of the heat-conducting layer 2. The symmetry axis I extends along the second direction Y. Figure 1 As shown, two contact terminals 6 are located near the first edge A1 of the thermally conductive layer 2, one contact terminal 6 is located near the third edge A3 of the thermally conductive layer 2, and the other contact terminal 6 is located near the fourth edge A4 of the thermally conductive layer 2. In one embodiment, one contact terminal 6 is located at a corner shared by the first edge A1 and the third edge A3, and the other contact terminal 6 is located at a corner shared by the first edge A1 and the fourth edge A4.

[0078] like Figure 5As shown, each contact terminal 6 is a planar terminal. Each of the two contact terminals 6 includes a first right-angled trapezoidal portion 6-1 and a second right-angled trapezoidal portion 6-2 formed into an integral structure. The orthographic projection of the contact terminal 6 on the thermally conductive layer 2 is L-shaped. The second right-angled trapezoidal portion 6-2 is stacked along the first direction X on the side of the first right-angled trapezoidal portion 6-1 away from the third edge of the thermally conductive layer 2. The lower base of the second right-angled trapezoidal portion 6-2 contacts the upper base of the first right-angled trapezoid 6-1 to form an integral structure. The hypotenuse of the second right-angled trapezoidal portion 6-2 is aligned with the hypotenuse of the first right-angled trapezoidal portion 6-1 and is located on the same straight line. The second right-angled trapezoidal portion 6-2 is located on the extension line of the hypotenuse of the first right-angled trapezoidal portion 6-1. The second right-angled trapezoidal portion 6-2 and the first right-angled trapezoidal portion 6-1 share a hypotenuse. The first metal wire portion 5-1 intersects with the hypotenuse and lower base of the first right-angled trapezoidal portion 6-1 to form an integral structure, and is located on the same straight line as the lower base of the first right-angled trapezoidal portion 6-1. The second right-angled trapezoidal portion 6-2 is located on a side of the upper base of the first right-angled trapezoidal portion 6-1 away from the lower base of the first right-angled trapezoidal portion 6-1, and the lower base of the second right-angled trapezoidal portion 6-2 contacts the upper base of the first right-angled trapezoidal portion 6-1 to form an integral structure. The length of the lower base of the second right-angled trapezoidal portion 6-2 is greater than the length of the upper base of the first right-angled trapezoidal portion 6-1. The length of the upper base of the second right-angled trapezoidal portion 6-2 is greater than the length of the upper base of the first right-angled trapezoidal portion 6-1. In one embodiment, the area of ​​the second right-angled trapezoidal portion 6-2 is greater than the area of ​​the first right-angled trapezoidal portion 6-1. The right angle side of the second right-angled trapezoidal portion 6-2 is connected to the external pin 7 for receiving current from the outside and transmitting the current to the first metal wire portion 5-1 via the first right-angled trapezoidal portion 6-1. Figure 1 shown.

[0079] The first right-angled trapezoidal portion 6-1 is located on the side of the second right-angled trapezoidal portion 6-2 that is closer to the third edge A3 of the thermally conductive layer 2. The second right-angled trapezoidal portion 6-2 is closer to the first edge A1 of the thermally conductive layer 2 than the first right-angled trapezoidal portion 6-1. The hypotenuse of the first right-angled trapezoidal portion 6-1 and the hypotenuse of the second right-angled trapezoidal portion 6-2 are closer to the serpentine wire 4. The upper base of the second right-angled trapezoidal portion 6-2 is close to the axis of symmetry I. The length of the right-angled side of the second right-angled trapezoidal portion 6-2 is 5 mm. Because the two contact terminals 6 are arranged on the thermally conductive layer 2 in an axisymmetric manner with respect to the axis of symmetry I of the thermally conductive layer 2, the two contact terminals 6 have the same shape and layout, and the shape and layout of the other contact terminal 6 will not be described here.

[0080] In one embodiment, the disinfection device further comprises an encapsulation layer 8, which is located on a side of the serpentine wire 4 away from the heat conducting layer 2, covering the serpentine wire 4 but not covering the two contact terminals 6. Figure 1 The encapsulation layer comprises a polyimide tape comprising a polyimide film and a polyimide adhesive on the polyimide film. The encapsulation layer 8 is attached to the serpentine wire 4 and serves as an electrical and mechanical insulation layer to prevent potential short circuits or oxidation in a humid environment.

[0081] Figure 6 Schematic diagram showing the temperature dynamic feedback and real-time control of a disinfection device according to an embodiment of the present disclosure. Figure 6 As shown, to achieve precise control of the operating temperature and feedback for ultra-fast heating, a temperature sensor, such as a thermocouple 9, is provided on the surface of the disinfection device. The temperature sensor is used to obtain the temperature of the serpentine wire 4. Based on the temperature of the serpentine wire 4 obtained by the temperature sensor, the control device 10 performs PID control on the heating of the serpentine wire 4.

[0082] In one embodiment, Joule heating is dynamically controlled by a PCB board 11 with a temperature sensor, such as Figure 11A shown.

[0083] Figure 7 A schematic diagram showing a comparison between a disinfection device according to an embodiment of the present disclosure and an existing heating method. The disinfection device in this embodiment is highly efficient. The disinfection device can be quickly heated from room temperature to 90°C within 5 seconds. Figure 7 a; the heating rate is about 27 degrees Celsius / second, as shown in Figure 7 As shown in Figure b; Due to the dynamic control of real-time temperature feedback control, the disinfection device can reach and stabilize at the target operating temperature within 15 seconds, and maintain an operating temperature of 90°C in the subsequent 15 minutes. Figure 7 c. The device can maintain a stable operating temperature with a fluctuation of less than 1°C for a long time. Figure 7 As shown in d.

[0084] The heating efficiency of the disinfection device according to this embodiment far exceeds the heating speed of other devices, such as air fryers, ovens, electric stoves, constant current devices (CC), and constant pressure devices (CV).

[0085] Figure 8Figure 3 shows the temperature change of a disinfection device according to an embodiment of the present disclosure when disinfecting a multi-layer object. The disinfection device of the present disclosure can disinfect one or more layers of objects, for example, one or more fully unfolded banknotes (or masks) or a folded banknote (or mask). When the disinfection device of the present disclosure uses two serpentine wires to clamp the object to be disinfected, similar to a sandwich structure, when disinfecting a multi-layer object, the temperature of the serpentine wire decreases linearly as the number of layers of the disinfected object increases.

[0086] Figure 9 FIG. 2 shows a ring bending test that a disinfection device according to one embodiment of the present disclosure undergoes. Figure 8 As shown, the disinfection device of this embodiment showed no damage under the 10,000 bending cycle test. Therefore, the present invention is flexible, strong and durable, and is thus compatible with soft and flexible items such as cash.

[0087] Figure 10 The antibacterial experiment and antibacterial test results of the disinfection device according to one embodiment of the present disclosure are shown. Figure 10 As shown, the present disinfection device demonstrated effective antibacterial properties in tests against Escherichia coli and Staphylococcus aureus. Specifically, sterilization tests confirmed that the present device, at an operating temperature of 90°C, inactivated over 98% of Staphylococcus aureus within 30 seconds of heating. The device, at an operating temperature of 90°C, inactivated 100% of E. coli within 5 seconds, and at a lower operating temperature of 65°C, inactivated over 99% of E. coli within 30 seconds. Compared to steam sterilization, commonly used within the guidelines recommended by the Centers for Disease Control and Prevention, the disinfection device demonstrated a 360-fold acceleration, demonstrating that short periods of high temperature can effectively eliminate microorganisms. The present disinfection device does not generate chemical waste during use and does not pose an environmental burden. The heat generated by the disinfection device can penetrate deep into the fibers and layers of paper products, thereby performing better than UV sterilization methods that only work on the surface.

[0088] Figure 11A and Figure 11B The present invention shows a disinfection device including a disinfection device according to an embodiment of the present invention. The disinfection device can be used for disinfecting cash, coins, masks or the like. Figure 11A and Figure 11B As shown, the disinfection device includes an upper cover 12 (i.e., a first housing), a base 13 (hole, a second housing), and a third housing 14 containing an operation panel and a controller. One edge of the upper cover 12 is hinged to one edge of the base 13 via a hinge axis II, which is parallel to the first direction X, so that the upper cover 12 can be opened from the base 13 by flipping along the hinge axis II, as shown in FIG. Figure 11A As shown, or by turning and closing the upper cover 12 to the base 13 position along the hinge axis II, as shown Figure 11B As shown. The first disinfection device 15 (i.e., the disinfection device according to any one of the above embodiments) is arranged on the upper cover 12, and the multiple wire portions of the serpentine wire 4 of the first disinfection device 15 intersect or are perpendicular to the hinge axis II. The terminal 6 of the first disinfection device 15 is located on the side of the serpentine wire 4 close to the hinge axis II. The second disinfection device 16 (i.e., the disinfection device according to any one of the above embodiments) is arranged on the base 13, and the multiple wire portions of the serpentine wire 4 of the second disinfection device 16 intersect or are perpendicular to the hinge axis II. The terminal 6 of the second disinfection device 16 is located on the side of the serpentine wire 4 close to the hinge axis II.

[0089] When the upper cover 12 can be opened from the base 13, the heated cash can be placed on the base 13 to wait for disinfection. When the upper cover 12 is closed to the base 13, the heated cash is sandwiched between the first disinfection device 15 of the upper cover 12 and the second disinfection device 16 of the base 13, so that the cash is disinfected by heating. Figure 11B When the upper cover 12 is closed to the base 13, the orthographic projection of the connection terminal 6 of the first disinfection device 15 on the base 13 overlaps with the orthographic projection of the connection terminal 6 of the second disinfection device 16 on the base 13, and the orthographic projection of the serpentine wire 4 of the first disinfection device 15 on the base 13 overlaps with the orthographic projection of the serpentine wire 4 of the second disinfection device 16 on the base 13.

[0090] In one embodiment, either the first disinfection device 15 or the second disinfection device 16 (e.g., the second disinfection device 16) is provided with a thermocouple 9 for detecting the temperature of the serpentine wire 4. The third housing 14 houses a controller 11 and an operation panel. The controller 11 performs PID control of the heating of the serpentine wire based on the temperature of the serpentine wire 4 detected by the temperature sensor (i.e., the thermocouple 9). A staff member operates the disinfection device by operating the operation panel.

[0091] In one embodiment, the first disinfection device 15 includes a thermocouple 9 for obtaining the temperature of the serpentine wire 4 of the first disinfection device 15, and the second disinfection device 16 includes a thermocouple 9 for obtaining the temperature of the serpentine wire 4 of the second disinfection device 16. The controller 11 performs PID control on the heating of the serpentine wire 4 of the first disinfection device 15 based on the temperature of the serpentine wire 4 obtained by the thermocouple 9 provided on the first disinfection device 15, and performs PID control on the heating of the serpentine wire 4 of the first disinfection device 16 based on the temperature of the serpentine wire 4 obtained by the thermocouple 9 provided on the second disinfection device 16.

[0092] Figure 12A wallet including a disinfection device according to one embodiment of the present disclosure is shown. The wallet includes a first portion and a second portion that can be folded in half, wherein the disinfection device of this embodiment is provided in at least one of the first portion and the second portion, for example, in the first portion or the second portion, or in both the first portion and the second portion. The disinfection device can be integrated into a layer of the wallet and powered by a mobile power supply or PD charger via a USB-C interface, thereby disinfecting and sterilizing the cash in the wallet by heating. The structure and arrangement of the disinfection device in the wallet in this embodiment are the same as those of the disinfection device in any of the above embodiments, so they will not be repeated here.

[0093] In summary, the disinfection device disclosed herein can sterilize ultra-fast and efficiently and can be used to disinfect cash, coins, masks, or the like. The device can be portable for personalized use or designed for large-scale disinfection purposes for public health.

[0094] In one embodiment, Figure 1 As shown, a method for manufacturing a disinfection device is provided, comprising: providing a base substrate 1, such as a glass substrate; forming a heat-conducting layer 2 on one side of the base substrate 1; forming a heating layer 3 on a side of the heat-conducting layer 2 away from the base substrate 1, the heating layer 3 being configured to generate heat; wherein the heat-conducting layer 2 is configured to conduct the heat generated by the heating layer. The heat-conducting layer 2 is a polyimide layer.

[0095] In one embodiment, a heating layer 3 is formed on a side of the heat-conducting layer 2 away from the base substrate 1, including: forming a metal material layer 3, such as a copper layer, on the polyimide layer 2; and laser-scribing the metal material layer 3 to simultaneously form a metal pattern including both the serpentine metal wire 4 and the two connection terminals 6. Specifically, a 1064 nm pulsed laser is used in this application to ablate the metal material layer 3 deposited on the polyimide layer 2.

[0096] The method further comprises: forming a packaging layer 8 on a side of the serpentine metal wire 4 away from the polyimide layer 2. The packaging layer 8 may be a polyimide tape comprising a polyimide film and a polyimide adhesive on the polyimide film.

[0097] Finally, the method further comprises: removing the base substrate 1 .

[0098] The disclosed manufacturing method is compatible with scalability and industrial production.Laser scribing is performed using an industrial laser marking machine with precisely tuned laser parameters including power, scan speed, and frequency.

[0099] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A disinfection device comprising: a heat conductive layer having a first edge and a second edge extending in a first direction and opposite to each other, and a third edge and a fourth edge extending in a second direction intersecting the first direction and opposite to each other; as well as a heating layer located on one side of the heat-conducting layer and configured to generate heat, wherein the heat-conducting layer is configured to conduct the heat generated by the heating layer, and wherein The heating layer includes a serpentine metal wire having multiple metal wire portions, each of which extends along the second direction to the second edge of the heat-conducting layer. The multiple metal portion wires are arranged along the first direction from the third edge of the heat-conducting layer to the fourth edge of the heat-conducting layer. The multiple metal wire portions are sequentially connected end to end to form the serpentine metal wire.

2. The disinfection device according to claim 1, wherein Each wire part is straight, The line spacing and line width between the plurality of metal wire sections are continuously modulated according to a modulation function, wherein the modulation function is: f(x) = (xa) × (xb) × (xc) × (xd) × (xe) × (xf), where a = 0.1, b = 0.13, c = 0.49, d = 1–c, e = 1–b, and f = 1–a. The value of position x ranges from 0 to 1. f(x) represents the ratio of the wire spacing offset at position x to the unmodulated wire spacing. Normalize f(x) to get F(x), Line spacing offset = F(x) × k × unmodulated line spacing, where k is a scaling factor, k = 0.4, and the unmodulated line spacing is a constant. The modulated line spacing between the wire sections at position x = the unmodulated line spacing - the line spacing offset × 2, The modulated line width of the metal wire portion at position x = unmodulated line width + line spacing offset × 2.

3. The disinfection device according to claim 2, wherein The unmodulated line spacing is 200 microns, and the unmodulated line width is 300 microns or 150 microns.

4. The disinfection device according to claim 1, further comprising: Two contact terminals are located on one side of the serpentine metal wire close to the first edge and are respectively connected to the first metal wire at the third edge and the second metal wire at the fourth edge of the serpentine metal wire, respectively. The orthographic projections of the two contact terminals on the heat-conducting layer do not overlap with the orthographic projection of the serpentine metal wire on the heat-conducting layer.

5. The disinfection device according to claim 4, wherein The plurality of metal wire portions are distributed on the heat conducting layer in an axisymmetric manner relative to a symmetry axis of the heat conducting layer, and the symmetry axis extends along the second direction. The two contact terminals are located on both sides of the symmetry axis of the heat-conducting layer and are distributed on the heat-conducting layer in an axisymmetric manner relative to the symmetry axis of the heat-conducting layer.

6. The disinfection device according to claim 1, wherein The plurality of metal wire portions are arranged along the first direction to form a row of serpentine metal wires, and the outer contour of the serpentine metal wires matches the shape of the object to be sterilized.

7. The disinfection device according to claim 6, wherein The lengths of the plurality of wire portions are the same and are 10 to 11 centimeters, and the outer contour of the serpentine wire is a rectangle with a length of 10 to 11 centimeters and a width of 10 to 11 centimeters.

8. The disinfection device according to claim 4, wherein The current input to the contact terminals is less than 2.1 amps, causing the serpentine wire to be heated to a target temperature of 89.5 to 90.5 degrees Celsius.

9. The disinfection device according to claim 1, further comprising: The packaging layer is located on a side of the serpentine metal wire away from the heat conducting layer.

10. The disinfection device according to claim 9, wherein: The heat conductive layer comprises polyimide, The serpentine wire comprises copper, The packaging layer includes a polyimide tape, and the polyimide tape includes a polyimide film and a polyimide glue located on the polyimide film.

11. The disinfection device according to claim 1, further comprising: a temperature sensor, disposed on the serpentine metal wire and configured to obtain a temperature of the serpentine metal wire; A controller is configured to perform PID control on the heating of the serpentine wire according to the temperature of the serpentine wire obtained by the temperature sensor.

12. A disinfection device comprising: a first housing on which the disinfection device according to claim 1 is provided as a first disinfection device; a second housing on which the disinfection device according to claim 1 is mounted as a second disinfection device, wherein a side edge of the first housing and a side edge of the second housing are hingedly connected so that an object to be disinfected can be sandwiched between the first disinfection device and the second disinfection device for disinfection; a temperature sensor, disposed on at least one of the first sterilizing device or the second sterilizing device, and configured to obtain a temperature of the serpentine wire in the at least one sterilizing device; A controller is configured to perform PID control on the heating of the serpentine wire in the at least one sterilizing device according to the temperature obtained by the temperature sensor.

13. A wallet comprising a first part and a second part that can be folded in half, wherein the disinfection device according to claim 1 is provided in at least one of the first part and the second part.

14. A method for manufacturing a disinfection device, comprising: Providing a stack of a heat-conducting layer and a metal material layer, wherein the heat-conducting layer has a first edge and a second edge extending along a first direction and opposite to each other, and a third edge and a fourth edge extending along a second direction intersecting the first direction and opposite to each other; and The metal material layer is laser-scribed to form a heating layer, wherein the heating layer is formed as a serpentine metal wire having multiple metal wire portions, each of which extends along the second direction to the second edge of the heat-conducting layer, and the multiple metal wire portions are arranged along the first direction from the third edge of the heat-conducting layer to the fourth edge of the heat-conducting layer, and the multiple metal wire portions are sequentially connected end to end to form the serpentine metal wire.

15. The manufacturing method according to claim 14, wherein: Laser scribing the metal material layer to form a heating layer, comprising: Each metal wire portion is formed into a straight line shape so that the line spacing and line width between the plurality of metal wire portions are continuously modulated according to a modulation function, wherein the modulation function is: f(x) = (xa) × (xb) × (xc) × (xd) × (xe) × (xf), where a = 0.1, b = 0.13, c = 0.49, d = 1–c, e = 1–b, and f = 1–a. The value of position x ranges from 0 to 1. f(x) represents the ratio of the wire spacing offset at position x to the unmodulated wire spacing. Normalize f(x) to get F(x), Line spacing offset = F(x) × k × unmodulated line spacing, where k is a scaling factor, k = 0.4, and the unmodulated line spacing is a constant. The modulated line spacing between the wire sections at position x = the unmodulated line spacing - the line spacing offset × 2, The modulated line width of the metal wire portion at position x = unmodulated line width + line spacing offset × 2.

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