Probe cleaning mechanism and probe cleaning method

Abstract

The invention discloses a probe cleaning mechanism and a probe cleaning method, which are applied to the technical field of square resistance measurement and are characterized in that a probe grinding pad mounting disc and a probe cleaning mud mounting disc rotate relatively in the circumferential direction during working; a needle grinding pad is arranged on the surface of the side, facing the needle cleaning mud mounting disc, of the needle grinding pad mounting disc, a through hole is formed in a mounting plate of the needle cleaning mud mounting disc, first needle cleaning mud is arranged on the surface of the side, facing the needle grinding pad mounting disc, of the mounting plate, and second needle cleaning mud is arranged on the surface of the side, back to the needle grinding pad mounting disc, of the mounting plate; the first needle cleaning mud and the through hole are sequentially arranged in the circumferential direction. The first probe cleaning mud can clean residual particles on the probe grinding pad along with rotation, and meanwhile, the cleaned probe grinding pad can be exposed along with rotation of the through hole, so that the probe can penetrate through the through hole to be in contact with the probe grinding pad to be cleaned. And then the probe can be further cleaned by using the second probe cleaning mud so as to keep the probe clean at any time.

Description

Technical Field

[0001] The present invention relates to the technical field of sheet resistance measurement, and in particular to a probe cleaning mechanism and a probe cleaning method. Background Art

[0002] Currently, measuring sheet resistance typically requires a four-probe meter with four probes. The principle is: two outer probes apply a constant current, creating an electric field inside the material. The inner two probes measure the voltage between the two probe points to calculate the resistance.

[0003] However, during the measurement process, the probe will absorb particles, which will cause the contact resistance of the probe to change at the microscopic level and affect the measurement results. Therefore, the probe needs to be cleaned before measuring the square resistance.

[0004] In the prior art, a grinding pad with a rough surface is specifically used to clean the probe, and the probe is cleaned by controlling the probe to contact the rough surface of the grinding pad. However, the shortcoming of this solution is that the particles on the surface of the probe, the particles formed by the shedding of the material of the probe itself, and the particles formed by the shedding of the material of the grinding pad will remain on the grinding pad, resulting in poor cleaning effect using the grinding pad, and then leading to unstable measurement effect. In the prior art, after determining that the measurement effect is unstable, needle cleaning mud is used to absorb the particles of the probe and the grinding pad to achieve a cleaning effect. However, this method cannot guarantee the surface state of the probe in real time due to different operating techniques and its timeliness. Therefore, how to provide a probe cleaning mechanism that can keep the probe clean at all times is a problem that technicians in this field urgently need to solve. Summary of the Invention

[0005] The purpose of the present invention is to provide a probe cleaning mechanism and a probe cleaning method, which can keep the probe clean at all times.

[0006] In order to solve the above technical problems, the present invention provides a probe cleaning mechanism, comprising a needle grinding pad mounting plate and a needle cleaning mud mounting plate arranged opposite to each other; during operation, the needle grinding pad mounting plate and the needle cleaning mud mounting plate rotate relative to each other along the circumferential direction;

[0007] A needle grinding pad is provided on the surface of the needle grinding pad mounting disk facing the needle cleaning mud mounting disk, a through-hole is provided on the mounting plate of the needle cleaning mud mounting disk, a first needle cleaning mud is provided on the surface of the mounting plate facing the needle grinding pad mounting disk, and a second needle cleaning mud is provided on the surface of the mounting plate facing away from the needle grinding pad mounting disk; the first needle cleaning mud and the through-hole are sequentially arranged along the circumferential direction;

[0008] When the needle grinding pad mounting plate and the needle cleaning mud mounting plate rotate relative to each other in the circumferential direction, the first needle cleaning mud is used to clean the needle grinding pad, and the through hole is used to expose the cleaned needle grinding pad.

[0009] Optionally, the second needle cleaning mud and the through hole are arranged in sequence along the circumferential direction.

[0010] Optionally, it further includes a probe driving mechanism, wherein the probe driving mechanism is connected to the probe;

[0011] The probe driving mechanism is used for:

[0012] When the through hole rotates to below the probe, the probe is driven to pass through the through hole and contact the grinding pad for cleaning, and after the probe is cleaned by the grinding pad, the probe is driven to separate from the through hole;

[0013] When the second needle cleaning mud rotates to below the probe, the probe is driven to contact the second needle cleaning mud for cleaning.

[0014] Optionally, a mounting groove is further provided on the side of the needle grinding pad mounting disk facing the needle cleaning mud mounting disk, and the outline size of the mounting groove is not less than the outline size of the first needle cleaning mud.

[0015] Optionally, the depth of the assembly groove is not less than the height of the first needle cleaning putty protruding from the needle cleaning putty mounting plate.

[0016] Optionally, a vacant slot is further provided on the side of the needle grinding pad mounting disk facing the needle cleaning mud mounting disk.

[0017] Optionally, the outline size of the vacant groove corresponds to the outline size of the grinding pad.

[0018] Optionally, a mounting disk driving mechanism is further included, and the mounting disk driving mechanism is used to drive the needle mud cleaning mounting disk to rotate along the circumferential direction.

[0019] The present invention also provides a probe cleaning method, which is applied to the probe cleaning mechanism according to claim 1, comprising:

[0020] The needle grinding pad mounting plate and the needle cleaning mud mounting plate are caused to rotate relative to each other in the circumferential direction;

[0021] Controlling the probe to pass through the through hole and contact the grinding pad for cleaning;

[0022] After the probe is cleaned by the needle grinding pad, the probe is controlled to contact the second needle cleaning mud for cleaning.

[0023] Optionally, the second needle cleaning mud and the through hole are arranged along the circumferential direction;

[0024] The control probe passes through the through hole and contacts the grinding pad for cleaning, comprising:

[0025] driving the through hole to rotate to below the probe, then driving the probe to pass through the through hole to contact the grinding pad for cleaning, and after the probe is cleaned by the grinding pad, driving the probe to separate from the through hole;

[0026] The controlling the probe to contact the second needle cleaning mud for cleaning comprises:

[0027] The second needle cleaning mud is driven to rotate to below the probe, and then the probe is driven to contact the second needle cleaning mud for cleaning.

[0028] A probe cleaning mechanism provided by the present invention comprises a needle grinding pad mounting disk and a needle cleaning mud mounting disk which are arranged opposite to each other; during operation, the needle grinding pad mounting disk and the needle cleaning mud mounting disk rotate relative to each other in the circumferential direction; a needle grinding pad is provided on the surface of the needle grinding pad mounting disk facing the needle cleaning mud mounting disk, and a mounting plate of the needle cleaning mud mounting disk is provided with a through hole, a first needle cleaning mud is provided on the surface of the mounting plate facing the needle grinding pad mounting disk, and a second needle cleaning mud is provided on the surface of the mounting plate facing away from the needle grinding pad mounting disk; the first needle cleaning mud and the through hole are arranged in sequence along the circumferential direction; when the needle grinding pad mounting disk and the needle cleaning mud mounting disk rotate relative to each other in the circumferential direction, the first needle cleaning mud is used to clean the needle grinding pad, and the through hole is used to expose the cleaned needle grinding pad.

[0029] When the grinding pad mounting plate and the needle cleaning mud mounting plate are rotated in the circumferential direction, the first needle cleaning mud can clean the particles remaining on the grinding pad as it rotates. At the same time, the through hole can expose the cleaned grinding pad as it rotates, so that the probe can pass through the through hole and contact the grinding pad to clean the probe. Because the second needle cleaning mud is arranged on the surface of the needle cleaning mud mounting plate facing away from the grinding pad mounting plate, after cleaning the probe with the grinding pad, the second needle cleaning mud can be used to further clean the probe, thereby ensuring the cleaning effect of the probe and keeping the probe clean at all times.

[0030] The present invention also provides a probe cleaning method, which also has the above-mentioned beneficial effects and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 A schematic structural diagram of a probe cleaning mechanism provided by an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of a split top view of a specific probe cleaning mechanism provided by an embodiment of the present invention;

[0034] Figure 3 A flow chart of a probe cleaning method provided by an embodiment of the present invention;

[0035] Figure 4 This is a specific state diagram of a probe cleaning provided by an embodiment of the present invention.

[0036] In the figure: 1. Grinding pad mounting plate, 11. Grinding pad, 12. Assembly slot, 13. Vacant slot;

[0037] 2. Needle cleaning putty mounting plate, 21. Through hole, 22. First needle cleaning putty, 23. Second needle cleaning putty. DETAILED DESCRIPTION

[0038] The core of the present invention is to provide a probe cleaning mechanism. In the prior art, a grinding pad with a rough surface is specifically used to clean the probe, and the probe is cleaned by controlling the probe to contact the rough surface of the grinding pad. However, the deficiency of this solution is that the particles on the surface of the probe, the particles formed by the shedding of the material of the probe itself, and the particles formed by the shedding of the material of the grinding pad will remain on the grinding pad, resulting in poor cleaning effect of the grinding pad, and then leading to unstable measurement effect. In the prior art, after determining that the measurement effect is unstable, needle cleaning mud is used to absorb the particles of the probe and the grinding pad to achieve a cleaning effect. However, this method cannot guarantee the surface state of the probe in real time due to different operating techniques and its timeliness.

[0039] The present invention provides a probe cleaning mechanism, comprising a needle grinding pad mounting plate and a needle cleaning mud mounting plate which are arranged opposite to each other; during operation, the needle grinding pad mounting plate and the needle cleaning mud mounting plate rotate relative to each other in the circumferential direction; a needle grinding pad is provided on the surface of the needle grinding pad mounting plate facing the needle cleaning mud mounting plate, and a mounting plate of the needle cleaning mud mounting plate is provided with a through hole, a first needle cleaning mud is provided on the surface of the mounting plate facing the needle grinding pad mounting plate, and a second needle cleaning mud is provided on the surface of the mounting plate facing away from the needle grinding pad mounting plate; the first needle cleaning mud and the through hole are arranged in sequence along the circumferential direction; when the needle grinding pad mounting plate and the needle cleaning mud mounting plate rotate relative to each other in the circumferential direction, the first needle cleaning mud is used to clean the needle grinding pad, and the through hole is used to expose the cleaned needle grinding pad.

[0040] When the grinding pad mounting plate and the needle cleaning mud mounting plate are rotated in the circumferential direction, the first needle cleaning mud can clean the particles remaining on the grinding pad as it rotates. At the same time, the through hole can expose the cleaned grinding pad as it rotates, so that the probe can pass through the through hole and contact the grinding pad to clean the probe. Because the second needle cleaning mud is arranged on the surface of the needle cleaning mud mounting plate facing away from the grinding pad mounting plate, after cleaning the probe with the grinding pad, the second needle cleaning mud can be used to further clean the probe, thereby ensuring the cleaning effect of the probe and keeping the probe clean at all times.

[0041] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0042] Example 1

[0043] Please refer to Figure 1 , Figure 1 This is a structural schematic diagram of a probe cleaning mechanism provided by an embodiment of the present invention.

[0044] See also Figure 1 In this embodiment, the probe cleaning mechanism includes a needle grinding pad mounting disk 1 and a needle cleaning mud mounting disk 2 which are arranged opposite to each other; during operation, the needle grinding pad mounting disk 1 and the needle cleaning mud mounting disk 2 rotate relative to each other in the circumferential direction; a needle grinding pad 11 is provided on the surface of the needle grinding pad mounting disk 1 facing the needle cleaning mud mounting disk 2, and a through hole 21 is provided on the mounting plate of the needle cleaning mud mounting disk 2; a first needle cleaning mud 22 is provided on the surface of the mounting plate facing the needle grinding pad mounting disk 1, and a second needle cleaning mud 23 is provided on the surface of the mounting plate facing away from the needle grinding pad mounting disk 1; the first needle cleaning mud 22 and the through hole 21 are arranged in sequence along the circumferential direction; when the needle grinding pad mounting disk 1 and the needle cleaning mud mounting disk 2 rotate relative to each other in the circumferential direction, the first needle cleaning mud 22 is used to clean the needle grinding pad 11, and the through hole 21 is used to expose the cleaned needle grinding pad 11.

[0045] The above-mentioned grinding needle pad mounting plate 1 is mainly used for mounting the grinding needle pad 11. The surface of the grinding needle pad 11 can be a rough surface, and the surface of the probe is cleaned by contacting with the probe; the needle cleaning mud mounting plate 2 is mainly used for mounting the needle cleaning mud, and the needle cleaning mud can remove particles on the probe surface and the particles on the surface of the grinding needle pad 11 by adsorption. In this embodiment, the grinding needle pad mounting plate 1 and the needle cleaning mud mounting plate 2 need to be arranged relative to each other. At this time, the grinding needle pad mounting plate 1 has a surface facing the side of the needle cleaning mud mounting plate 2, and the bottom plate of the needle cleaning mud mounting plate 2 is a mounting plate in this embodiment. The mounting plate has a surface facing the side of the grinding needle pad mounting plate 1 and a surface facing away from the side of the grinding needle pad mounting plate 1. It should be noted that the projections of the above-mentioned grinding needle pad mounting plate 1 and the needle cleaning mud mounting plate 2 in the relative direction can be circular or in any other shape, and are not specifically limited here. During operation, the grinding needle pad mounting plate 1 and the needle cleaning mud mounting plate 2 need to be able to rotate relative to each other in the circumferential direction.

[0046] Specifically, in this embodiment, a grinding pad 11 is provided on the surface of the needle grinding pad mounting disk 1 facing the needle cleaning mud mounting disk 2. During operation, the probe to be cleaned will come into contact with the grinding pad 11, thereby cleaning the probe based on the grinding pad 11. The mounting plate of the needle cleaning mud mounting disk 2 must first have a through hole 21. The through hole 21 must expose the grinding pad 11 when the needle cleaning mud mounting disk 2 rotates relative to the needle cleaning mud mounting disk 2 at least to a specific angle, and allow the probe to contact the grinding pad 11 through the through hole 21.

[0047] A first needle cleaning mud 22 is provided on the surface of the mounting plate facing the needle grinding pad mounting disk 1, and a second needle cleaning mud 23 is provided on the surface of the mounting plate facing away from the needle grinding pad mounting disk 1. The structure of the first needle cleaning mud 22 is generally the same as that of the second needle cleaning mud 23, and the main difference lies in the different positions of the mounting plates. The first needle cleaning mud 22 is provided on the surface of the mounting plate facing the needle grinding pad mounting disk 1, so that the first needle cleaning mud 22 can contact the surface of the needle grinding pad 11 during operation, and the first needle cleaning mud 22 can be swept onto the surface of the needle grinding pad 11 during rotation to clean the needle grinding pad 11 through the first needle cleaning mud 22. And the first needle cleaning mud 22 needs to be arranged in the circumferential direction with the above-mentioned through hole 21, that is, when the needle cleaning mud mounting disk 2 rotates, the through hole 21 can expose the portion of the needle grinding pad 11 that has been cleaned by the first needle cleaning mud 22. Of course, with the center of the needle cleaning mud mounting disk 2 rotating as the center of the circle, the center of the above-mentioned through hole 21 and the center of the first needle cleaning mud 22 may not be strictly located at the same radius, as long as the through hole 21 can expose the part of the needle grinding pad 11 cleaned by the first needle cleaning mud 22 during rotation.

[0048] The above-mentioned second needle cleaning mud 23 is specifically arranged on the surface of the side of the mounting plate facing away from the grinding needle pad mounting disk 1, and is mainly used to clean the probe. Preferably, in this embodiment, the second needle cleaning mud 23 and the through hole 21 are arranged along the circumferential direction, so that after the probe is cleaned by the grinding needle pad 11, there is no need to control the probe to move in the horizontal direction. It is only necessary to wait for the needle cleaning mud mounting disk 2 to rotate and then rotate the second needle cleaning mud 23 to the bottom of the probe, and then control the probe to move vertically downward to use the needle cleaning mud to clean the probe, thereby avoiding complicated driving of the probe and facilitating the execution of the cleaning operation. Of course, with the center of the needle cleaning mud mounting disk 2 when it rotates as the center of the circle, the center of the above-mentioned through hole 21 and the center of the second needle cleaning mud 23 may not be strictly located at the same radius, as long as the above-mentioned effect is achieved.

[0049] Of course, in this embodiment, the second needle cleaning mud 23 may not be arranged along the circumferential direction with the through hole 21. In this case, when using the second needle cleaning mud 23 to clean the probe, it is necessary to control the probe to move in the horizontal direction so that the probe can contact the second needle cleaning mud 23 for cleaning.

[0050] Correspondingly, in this embodiment, the probe cleaning mechanism may further include a probe driving mechanism, which is connected to the probe; the probe driving mechanism is used to: when the through hole 21 rotates to the bottom of the probe, drive the probe through the through hole 21 to contact the grinding pad 11 for cleaning, and after the probe is cleaned by the grinding pad 11, drive the probe out of the through hole 21; when the second needle cleaning mud 23 rotates to the bottom of the probe, drive the probe to contact the second needle cleaning mud 23 for cleaning.

[0051] The above-mentioned probe driving mechanism needs to be connected to the probe and drive the probe to move vertically up and down at the appropriate time, without driving the probe to move in the horizontal direction. Specifically, when the through hole 21 rotates to the bottom of the probe, the probe driving mechanism will drive the probe to move vertically downward to pass through the through hole 21 and contact the grinding pad 11 for cleaning, and after the grinding pad 11 has cleaned the probe, the probe will be driven to move vertically upward to disengage from the through hole 21. When the second needle cleaning mud 23 rotates to the bottom of the probe, the probe is driven to move vertically downward to contact the second needle cleaning mud 23 for cleaning, and then the probe can be driven to move vertically upward to get rid of the contact with the second needle cleaning mud 23. This driving method is very simple, and the probe driving mechanism only needs to move in one direction, that is, the vertical direction, thereby simplifying the structure of the probe driving mechanism.

[0052] It should be noted that, in this embodiment, since the first needle cleaning mud 22 and the second needle cleaning mud 23 are arranged on different surfaces of the mounting plate, their projections in relative directions may or may not overlap, depending on the specific situation and are not specifically limited here.

[0053] In this embodiment, a mounting plate drive mechanism may also be included, configured to drive the needle cleaning pad mounting plate 2 to rotate circumferentially. In this embodiment, the needle grinding pad mounting plate 1 is typically fixed, and the mounting plate drive mechanism drives the needle cleaning pad mounting plate 2 to rotate circumferentially. This eliminates the need for rotating the probe and probe drive mechanism, reducing the structural complexity of the probe cleaning mechanism. The mounting plate drive mechanism primarily drives the needle cleaning pad mounting plate 2 to rotate along its center, and its specific structure is not specifically defined herein.

[0054] The present embodiment provides a probe cleaning mechanism, in which, when the grinding needle pad mounting disk 1 and the needle cleaning mud mounting disk 2 are rotated in the circumferential direction, the first needle cleaning mud 22 can rotate to clean the particles remaining on the grinding needle pad 11. At the same time, as the relative rotation proceeds, the through hole 21 provided in the needle cleaning mud mounting disk 2 can expose the cleaned grinding needle pad 11, so that the probe can pass through the through hole 21 and contact the grinding needle pad 11 to clean the probe. Since the second needle cleaning mud 23 is provided on the surface of the needle cleaning mud mounting disk 2 facing away from the grinding needle pad mounting disk 1, after using the grinding needle pad 11 to clean the probe, the second needle cleaning mud 23 can be used to further clean the probe to ensure the cleaning effect of the probe, so that the probe can be kept clean at all times.

[0055] The specific structure of a probe cleaning mechanism provided in this application will be described in detail in the following embodiments.

[0056] Example 2

[0057] Please refer to Figure 2 , Figure 2 A schematic diagram of a split top view of a specific probe cleaning mechanism provided by an embodiment of the present invention.

[0058] Different from the above embodiment, this embodiment further defines the structure of the probe cleaning mechanism based on the above embodiment. The rest of the contents have been described in detail in the above embodiment and will not be repeated here.

[0059] See also Figure 2 In this embodiment, the needle grinding pad mounting plate 1 is further provided with an assembly groove 12 on the side facing the needle cleaning mud mounting plate 2 , and the outline dimension of the assembly groove 12 is not less than the outline dimension of the first needle cleaning mud 22 .

[0060] The assembly groove 12 is mainly used to at least partially accommodate the first needle cleaning mud 22, so as to facilitate the combined installation between the needle grinding pad mounting plate 1 and the needle cleaning mud mounting plate 2 during non-working hours. Since the first needle cleaning mud 22 is used to clean the needle grinding pad 11 in this embodiment, the first needle cleaning mud 22 usually protrudes from the needle cleaning mud mounting plate 2 and contacts the needle grinding pad 11 during working hours. In order to ensure that the needle grinding pad mounting plate 1 and the needle cleaning mud mounting plate 2 can be interlocked with each other during non-working hours, it is necessary to set an assembly groove 12 for accommodating, at least partially accommodating the first needle cleaning mud 22 on the side of the needle grinding pad mounting plate 1 facing the needle cleaning mud mounting plate 2, so as to reduce the gap width when the needle grinding pad mounting plate 1 and the needle cleaning mud mounting plate 2 are interlocked during non-working hours. Based on this, the outline size of the assembly groove 12 needs to be no smaller than the outline size of the first needle cleaning mud 22, that is, the projected size of the assembly groove 12 in the relative direction needs to be no smaller than the projected size of the first needle cleaning mud 22, so as to ensure that the assembly groove 12 can at least partially accommodate the first needle cleaning mud 22, so as to at least reduce the distance between the needle grinding pad mounting plate 1 and the needle cleaning mud mounting plate 2 when not in operation.

[0061] Furthermore, the depth of the assembly groove 12 is not less than the height of the first needle cleaning paste 22 protruding from the needle cleaning paste mounting plate 2. At this time, the assembly groove 12 can completely accommodate the first needle cleaning paste 22 protruding from the needle cleaning paste mounting plate 2. During the non-working period, when the needle grinding pad mounting plate 1 and the needle cleaning paste mounting plate 2 are fastened together, the first needle cleaning paste 22 can be completely accommodated in the assembly groove 12, thereby ensuring that there is no gap when the needle grinding pad mounting plate 1 and the needle cleaning paste mounting plate 2 are fastened together. In actual situations, the shape of the above-mentioned assembly groove 12 needs to correspond to the shape of the first needle cleaning paste 2 to ensure that the needle grinding pad mounting plate 1 and the needle cleaning paste mounting plate 2 are completely fastened together without leaving any gap.

[0062] In this embodiment, the grinding pad mounting plate 1 is further provided with a vacant slot 13 on the side facing the needle cleaning pad mounting plate 2. This vacant slot 13 can be used as a backup space. For example, it can accommodate components with other functions, such as another grinding pad 11 with a different surface roughness than the grinding pad 11, to meet the cleaning needs of different types or materials of probes. The specific function of the vacant slot 13 can be customized according to actual circumstances and is not specifically limited here.

[0063] Specifically, the outline dimensions of the vacant groove 13 can correspond to the outline dimensions of the grinding pad 11. In this case, the vacant groove 13 can be used as a temporary space for the grinding pad 11 when it is replaced. Of course, the specific function of the vacant groove 13 is not specifically limited in this embodiment and depends on the specific situation. Typically, the vacant groove 13, the assembly groove 12, and the grinding pad 11 are arranged in sequence along the circumference of the grinding pad mounting plate 1, and each component or groove occupies approximately one-third of the space on the grinding pad mounting plate 1.

[0064] Correspondingly, on the needle cleaning mud mounting plate 2, the first needle cleaning mud 22, the second needle cleaning mud 23, and the through hole 21 can also be arranged sequentially along the circumference of the needle cleaning mud mounting plate 2, and each component or through hole 21 will occupy about one-third of the space of the needle cleaning mud mounting plate 2, wherein the projections of the first needle cleaning mud 22 and the second needle cleaning mud 23 in relative directions do not overlap, thereby facilitating the automated cleaning of the probe. The specific process of probe cleaning will be described in detail in the following embodiments and will not be repeated here.

[0065] The probe cleaning mechanism provided in this embodiment can ensure that the grinding pad mounting plate 1 and the cleaning mud mounting plate 2 are interlocked with each other without leaving any gaps during non-working hours by providing the assembly slot 12. The vacant slot 13 can facilitate the replacement operation of the grinding pad 11.

[0066] Example 3

[0067] A probe cleaning method provided in this embodiment is introduced below. The probe cleaning method described below and the probe cleaning mechanism described above can be referenced to each other.

[0068] Please refer to Figure 3 , Figure 3 The present invention provides a flow chart of a probe cleaning method.

[0069] See also Figure 3 In this embodiment, the probe cleaning method is applied to the probe cleaning mechanism described in the above embodiment, and the probe cleaning method includes:

[0070] S101: The needle grinding pad mounting plate and the needle cleaning mud mounting plate are caused to rotate relative to each other in the circumferential direction.

[0071] The specific contents of the probe cleaning mechanism have been described in detail in the above embodiments and will not be repeated here.

[0072] In this step, the cleaning mud mounting disk 2 can be driven to rotate circumferentially by the mounting disk drive mechanism. This rotation process can be either stepwise or linear, with no specific limitation. It should be noted that during this rotation process, the first cleaning mud 22 can sweep across the surface of the needle grinding pad 11 to clean it.

[0073] S102: Control the probe to pass through the through hole and contact the grinding pad for cleaning.

[0074] In this embodiment, as the grinding pad mounting plate 1 and the cleaning mud mounting plate 2 rotate relative to each other, the through hole 21 can expose the grinding pad 11 cleaned by the first cleaning mud 22. Accordingly, in this step, it is necessary to control the probe to pass through the through hole 21 and contact the cleaned grinding pad 11 to clean the probe.

[0075] Specifically, in this embodiment, the second needle cleaning mud 23 and the through hole 21 can be arranged in the circumferential direction, so when the needle cleaning mud mounting disk 2 rotates, the through hole 21 and the second needle cleaning mud 23 can be rotated to the bottom of the probe in turn, thereby facilitating the driving of the probe. The corresponding step can specifically include: driving the through hole 21 to rotate to the bottom of the probe, then driving the probe through the through hole 21 to contact the grinding pad 11 for cleaning, and after cleaning the probe through the grinding pad 11, driving the probe out of the through hole 21. This driving method only needs to drive the probe to move vertically up and down, which can simplify the structure of the probe driving structure. The method of driving the through hole 21 to rotate to the bottom of the probe can be to drive it to rotate by setting the angle of rotation of the needle cleaning mud mounting disk 2, or to drive it to rotate based on the result of image recognition, or to adopt any other method, which is not specifically limited here.

[0076] S103: After the probe is cleaned by the needle grinding pad, the probe is controlled to contact the second needle cleaning mud for cleaning.

[0077] In this embodiment, the probe is usually cleaned first with the needle grinding pad 11 and then with the second needle cleaning mud 23 to ensure that the particles on the probe surface can be adsorbed and removed.

[0078] Specifically, when the second needle cleaning mud 23 and the through hole 21 are arranged along the circumferential direction, this step may specifically include: driving the second needle cleaning mud 23 to rotate to the bottom of the probe, then driving the probe to contact the second needle cleaning mud 23 for cleaning, and then driving the probe to separate from the second needle cleaning mud 23 after the probe is cleaned by the second needle cleaning mud 23. This driving method only needs to drive the probe to move vertically up and down, which can simplify the structure of the probe driving structure. The method of driving the second needle cleaning mud 23 to rotate to the bottom of the probe can be to drive it to rotate by setting the rotation angle of the needle cleaning mud mounting disk 2, or to drive it to rotate according to the result of image recognition, or to adopt any other method, which is not specifically limited here.

[0079] The present embodiment provides a probe cleaning method. When the grinding needle pad mounting disk 1 and the needle cleaning mud mounting disk 2 are rotated in the circumferential direction, the first needle cleaning mud 22 can clean the particles remaining on the grinding needle pad 11 as the rotation proceeds. At the same time, as the rotation proceeds, the needle cleaning mud mounting disk 2 can expose the cleaned grinding needle pad 11, so that the probe can pass through the through hole 21 and contact the cleaned grinding needle pad 11 to clean the probe. Since the second needle cleaning mud 23 is arranged on the surface of the needle cleaning mud mounting disk 2 on the side facing away from the grinding needle pad mounting disk 1, after using the grinding needle pad 11 to clean the probe, the second needle cleaning mud 23 can be used to further clean the probe to ensure the cleaning effect of the probe and keep the probe clean at all times.

[0080] Example 4

[0081] Please refer to Figure 4 , Figure 4 This is a specific state diagram of a probe cleaning provided by an embodiment of the present invention.

[0082] This embodiment takes the arrangement of the grinding needle pad 11, the assembly groove 12, and the vacant groove 13 in three equal parts on the grinding needle pad mounting plate 1; and the arrangement of the first needle cleaning mud 22, the second needle cleaning mud 23, and the through hole 21 in three equal parts on the needle cleaning mud mounting plate 2 as an example, and specifically introduces the specific contents of the coordination between its probe cleaning mechanism and the probe cleaning method.

[0083] See also Figure 4 In this embodiment, when the needle cleaning tool is not in operation and is at rest, the first needle cleaning mud 22 is arranged relative to the assembly groove 12 and is engaged in the assembly groove 12. The projection of the second needle cleaning mud 23 in the opposite direction can overlap with the needle grinding pad 11.

[0084] The first step is to rotate the first cleaning mud 22 toward the position of the grinding pad 11 during operation, and control the connection between the first cleaning mud 22 and the grinding pad 11 during rotation, so as to clean the grinding pad 11.

[0085] In the second step, when the through hole 21 rotates to the position of the grinding pad 11, the probe is controlled to pass through the through hole 21 and contact the grinding pad 11 to clean the probe.

[0086] In the third step, when the second cleaning mud 23 rotates again to the position of the grinding pad 11, the probe is controlled to contact the second cleaning mud 23 for cleaning the probe again. At this time, the relative position of the grinding pad mounting plate 1 and the cleaning mud mounting plate 2 is the same as the relative position when it was not in operation, so as to facilitate a new round of probe cleaning operation.

[0087] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0088] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

[0089] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0090] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0091] The above is a detailed introduction to a probe cleaning mechanism and a probe cleaning method provided by the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present invention, the present invention can also be improved and modified in several ways, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A probe cleaning mechanism, characterized in that: It comprises a needle grinding pad mounting plate and a needle cleaning mud mounting plate which are arranged opposite to each other; during operation, the needle grinding pad mounting plate and the needle cleaning mud mounting plate rotate relative to each other along the circumferential direction; A needle grinding pad is provided on the surface of the needle grinding pad mounting disk facing the needle cleaning mud mounting disk, a through-hole is provided on the mounting plate of the needle cleaning mud mounting disk, a first needle cleaning mud is provided on the surface of the mounting plate facing the needle grinding pad mounting disk, and a second needle cleaning mud is provided on the surface of the mounting plate facing away from the needle grinding pad mounting disk; the first needle cleaning mud and the through-hole are sequentially arranged along the circumferential direction; When the needle grinding pad mounting plate and the needle cleaning mud mounting plate rotate relative to each other in the circumferential direction, the first needle cleaning mud is used to clean the needle grinding pad, and the through hole is used to expose the cleaned needle grinding pad.

2. The probe cleaning mechanism according to claim 1, characterized in that: The second needle cleaning mud and the through hole are arranged in sequence along the circumferential direction.

3. The probe cleaning mechanism according to claim 2, characterized in that: Also included is a probe driving mechanism, wherein the probe driving mechanism is connected to the probe; The probe driving mechanism is used for: When the through hole rotates to below the probe, the probe is driven to pass through the through hole and contact the grinding pad for cleaning, and after the probe is cleaned by the grinding pad, the probe is driven to separate from the through hole; When the second needle cleaning mud rotates to below the probe, the probe is driven to contact the second needle cleaning mud for cleaning.

4. The probe cleaning mechanism according to claim 1, characterized in that: The needle grinding pad mounting plate is further provided with an assembly groove on one side facing the needle cleaning mud mounting plate, and the outline size of the assembly groove is not less than the outline size of the first needle cleaning mud.

5. The probe cleaning mechanism according to claim 4, characterized in that: The depth of the assembly groove is not less than the height of the first needle cleaning putty protruding from the needle cleaning putty mounting plate.

6. The probe cleaning mechanism according to claim 1, characterized in that: An empty groove is further provided on the side of the needle grinding pad mounting disc facing the needle cleaning mud mounting disc.

7. The probe cleaning mechanism according to claim 6, characterized in that: The outline size of the vacant groove corresponds to the outline size of the grinding pad.

8. The probe cleaning mechanism according to claim 1, characterized in that: It also includes a mounting disk driving mechanism, which is used to drive the needle mud cleaning mounting disk to rotate along the circumferential direction.

9. A probe cleaning method, characterized in that: The probe cleaning mechanism according to claim 1 comprises: The needle grinding pad mounting plate and the needle cleaning mud mounting plate are caused to rotate relative to each other in the circumferential direction; Controlling the probe to pass through the through hole and contact the grinding pad for cleaning; After the probe is cleaned by the needle grinding pad, the probe is controlled to contact the second needle cleaning mud for cleaning.

10. The method according to claim 9, characterized in that The second needle cleaning mud and the through hole are arranged along the circumferential direction; The control probe passes through the through hole and contacts the grinding pad for cleaning, comprising: driving the through hole to rotate to below the probe, then driving the probe to pass through the through hole to contact the grinding pad for cleaning, and after the probe is cleaned by the grinding pad, driving the probe to separate from the through hole; The controlling the probe to contact the second needle cleaning mud for cleaning comprises: The second needle cleaning mud is driven to rotate to below the probe, and then the probe is driven to contact the second needle cleaning mud for cleaning.

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