Machining method for reinforcing double-mainboard micro-channel heat dissipation component and automobile radiator

Abstract

The invention belongs to the technical field of die-casting forming and subsequent shaping machining of aluminum alloy parts for automobiles, and particularly relates to a machining method for reinforcing a double-mainboard micro-channel heat dissipation component and an automobile radiator. The machining method comprises the steps that main board piece machining is carried out, and the main board piece machining comprises the steps that S1, a main board piece die-casting blank with the wall thickness being 4-5 mm is cast through an aluminum alloy die-casting technology; s2, the die-casting blank in the step S1 is subjected to shape correction treatment through a shaping process die subjected to shape correction treatment, a shape correction piece is obtained, and the shaping process die subjected to shape correction is a stamping die used for the shaping process of the same kind of main plate pieces with the wall thickness smaller than 4 mm; and S3, a high-energy cutting technology is adopted for machining the shape correction piece in the step S2, and a hole / groove structure which is not prone to forming through a die casting technology is machined. Based on the thickness change of the main board, the aluminum alloy die-casting process is adopted for producing the board blank, the production cost is controlled through the means of waste die transformation, micro-structure step-by-step machining and the like, and the die-casting die structure is simplified.

Description

Technical Field

[0001] The invention belongs to the technical field of die-casting and subsequent shaping of aluminum alloy parts for automobiles, and particularly relates to a method for processing a reinforced dual-mainboard microchannel heat dissipation component and an automobile radiator. Background Art

[0002] The dual-mainboard microchannel heat pipe is a commonly used heat pipe structure in automotive radiators. This heat pipe forms a bidirectional reinforced support structure because both ends are connected to independent mainboards. Originally, mainboard panels with a thickness of 3mm or less were easily formed on a 1000T press with the help of stamping dies and had a high forming rate. However, the upgraded reinforced dual-mainboard microchannel heat pipe mainboard panel thickness has reached 4.5mm. The forming rate is too low using the original equipment and molds to organize mass production.

[0003] Die casting is a widely used production process for aluminum alloy parts. It has good forming capabilities for parts with a wall thickness of more than 4mm. However, the main board used to manufacture automobile radiators has not been reported in the industry. Among the problems it faces, in addition to the fact that some local features or fine structures of the main board are limited by the filling capacity of the aluminum alloy liquid in the die-casting mold and are not suitable for die casting, the overall deformation of the die-cast blank is large, which also increases the correction cost. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a method for processing a reinforced dual-mainboard microchannel heat dissipation component and an automobile radiator.

[0005] The technical solutions of the present invention are as follows: A method for processing a reinforced dual-mainboard microchannel heat dissipation component includes processing a mainboard panel, wherein the processing of the mainboard panel includes the following steps: S1, using aluminum alloy die-casting process to cast the main board blank with a wall thickness of 4 to 5 mm; S2, using a trimmed forming process mold to perform shape correction processing on the die-cast blank of step S1 to obtain a trimmed part, wherein the trimmed forming process mold is a stamping die used for forming the same main plate with a wall thickness of less than 4 mm; S3, using a high-energy cutting process to process the shaped piece in step S2, and processing a hole / groove structure that is difficult to form by a die-casting process.

[0006] Furthermore, according to the above processing method, the main board panel is a main board inner panel or a main board outer panel.

[0007] Furthermore, according to the above processing method, in step S1, the wall thickness is 4.5 mm; in step S2, the modified forming process mold refers to a stamping mold used for forming the same main board panel with a wall thickness of 3 mm.

[0008] Furthermore, according to the above processing method, in step S2, the shaping is performed by cutting and / or electric spark machining.

[0009] Furthermore, according to the above processing method, in step S3, the high-energy cutting process is at least one of plasma cutting, arc cutting, and laser cutting.

[0010] Furthermore, according to the above processing method, in step S2, the shape correction process is accompanied by secondary forming of the local structure.

[0011] Furthermore, according to the above processing method, in step S2, the local structure is a flanging, a bend or a boss.

[0012] Furthermore, according to the above processing method, after the main board is processed, the following steps are further included: S4, assembling the mainboard inner plate, mainboard outer plate, heat dissipation pipes and other connectors and joints to obtain an assembly part.

[0013] Furthermore, according to the above processing method, step S4 further includes the following steps: S5, brazing the assembly parts.

[0014] The present invention also provides an automobile radiator having a reinforced dual-mainboard micro-channel heat dissipation component obtained by the above processing method.

[0015] The beneficial effects of the present invention are: The enhanced dual-mainboard microchannel heat dissipation component processing method disclosed in the present invention attempts to adopt an aluminum alloy die-casting process to produce plate blanks based on the thickness changes of the mainboard plates, and makes full use of the original abandoned or withdrawn from production and circulation and no longer used forming process stamping dies for forming small-walled similar mainboard plates to perform profiling, and transforms them into dies suitable for shape correction of large-walled die-cast blanks, and performs secondary shaping of the die-cast blanks and local structures at low cost, and finally combines a simple high-energy cutting process to process fine holes and groove structures that are difficult to form by the die-casting process, thereby making up for the process deficiencies of the die-cast aluminum alloy itself, and achieving a certain degree of mass production on the basis of controlling production costs and simplifying the die-casting mold structure. DETAILED DESCRIPTION

[0016] Example 1 A method for processing a reinforced dual-mainboard microchannel heat dissipation component includes processing a mainboard panel, wherein the processing of the mainboard panel includes the following steps: S1, adopts aluminum alloy die-casting process to cast the mainboard blank with a wall thickness of 4.5mm.

[0017] The aluminum alloy liquid used in the die-casting process of the present invention has a mass content of 1.15-1.20% Mn, 0.05-0.07% Cu, and 0.18-0.25% Mo. Other components are controlled within the ranges of Fe < 0.70%, Si ≤ 0.60%, and Zn ≤ 0.10%. Furthermore, Al and impurities are controlled within the range of < 0.05% for each individual impurity and < 0.15% for the total impurities. Other aluminum alloy compositions or grades may also be used, provided they meet general strength requirements while also meeting corrosion resistance requirements for automotive radiator components.

[0018] S2, using the trimmed forming process mold to perform shape correction processing on the die-cast blank of step S1 to obtain a shaped part. The trimmed forming process mold refers to a stamping mold used in the forming process to form the same main board plate with a wall thickness of 3mm.

[0019] In this step, it is only necessary to determine the reshaping plan by comparing the product and mold drawings. By using mechanical milling, grinding and EDM to reshape the stamping mold that is discarded or no longer in circulation and is used to form the same small-walled motherboard panels, the reshaping mold used to correct the die-cast blank in step S1 can be obtained. The reshaping methods used include but are not limited to overall thinning of the cavity, local thinning of the dimensions, and removal of local structural features, such as removing protrusions or gaps that are originally used to form the fine structures already obtained in the die-casting. When performing the reshaping, the above reshaping methods of overall thinning of the cavity, local thinning of the dimensions, and removal of local structural features are basically used simultaneously.

[0020] It should be noted that the advantage of the trimmed forming process mold used in this embodiment is not only that it can perform overall shape correction on the die-cast blank. Another outstanding advantage is that it can also reduce the design difficulty of the die-casting mold by accompanying the shape correction process with secondary forming of the local structure. For example, some flanges or bends and bosses can be temporarily lowered in height in the die-casting mold and further formed in the shape correction process.

[0021] S3, using a high-energy cutting process to process the shaped piece in step S2, and processing a hole / groove structure that is difficult to form by a die-casting process.

[0022] The die-casting process is not easy to form hole / groove structures with too fine dimensions because these structures require the aluminum alloy liquid to fully fill the cavity and cool to form, but the filling capacity of the aluminum alloy liquid in the die-casting mold is limited by the cavity size. Therefore, instead of trimming the fine holes / grooves that fail the die-casting, it is better to use low-cost high-energy cutting technology to directly process them, which can also greatly simplify the structure of the die-casting mold.

[0023] The high-energy cutting equipment used in this embodiment is a plasma cutting equipment, but laser, arc and other cutting equipment can also be used, which will not be described in detail.

[0024] According to the above method provided in this embodiment, based on the change of the thickness of the main board plate from 3mm to 4.5mm, the industry has tried to study the use of aluminum alloy die-casting process to produce plate blanks for the first time, and fully utilize the original abandoned or withdrawn from production and circulation and no longer used forming process stamping dies for forming the same main board plate with a wall thickness to perform modification, and transform it into a mold suitable for shaping the 4.5 wall thickness die-cast blanks, and perform secondary shaping of the die-cast blanks at a low cost. Finally, a simple high-energy cutting process is combined to process fine holes and groove structures that are not easy to form by the die-casting process, which makes up for the shortcomings of the processability of the die-cast aluminum alloy itself and achieves a certain degree of mass production. This method can not only produce the inner panels of the main board, but also the outer panels of the main board.

[0025] Example 2 As a complete process for manufacturing the reinforced dual-motherboard micro-channel heat sink, after the motherboard processing steps in Example 1, the following steps are further included: S4, assembling the mainboard inner plate, mainboard outer plate, heat dissipation pipes and other connectors and joints to obtain an assembly part.

[0026] S5, brazing the assembly parts.

[0027] Due to the change in the thickness of the mainboard, the brazing process of the dual-mainboard microchannel heat dissipation components also needs to be adjusted synchronously. According to synchronous verification, under the conditions of 0.16±0.01mm assembly gap between the mainboard and the heat pipe and 86±5μm thickness of the aluminum-silicon brazing filler metal coating, the welding parameter range can be adjusted to a brazing temperature of 606~618℃, a preheating time of 5~7min, and a post-weld cooling rate of 4~6℃ / s. In addition, the present invention also sets up a LIBS system on the side of the heat pipe conveyor line in the assembly process. Before the heat pipe is assembled to the motherboard, the chemical composition of the heat pipe's brazing coating is detected using an online interval detection method. The LIBS system communicates data with the brazing control system. The brazing control system receives the detection results of the LIBS system and dynamically optimizes the brazing temperature, preheating time, or both within the adjusted range mentioned above after the heat pipe assembled with the motherboard enters the brazing furnace based on the detection results. During this process, the LIBS system obtains the detection value M of the silicon-magnesium ratio based on the online detection results. The brazing control system stores more accurate brazing temperature and preheating time parameters corresponding to the subdivided intervals of the detection value M. When the detection value M is detected to change across the interval during production, the corresponding parameters are also optimized synchronously. Through the above approach, the brazing pass rate of less than 90% in the initial stage of changing the motherboard plate thickness from 3mm to 4.5mm was increased to more than 99%.

[0028] In summary, the embodiment of the present invention is based on the change of the thickness of the mainboard plate from 3mm to 4.5mm. It is the first time in the industry to attempt to study the use of aluminum alloy die-casting process to produce plate blanks. On this basis, it controls production costs and simplifies the die-casting mold structure through means such as waste mold modification and micro-structure step-by-step processing, thereby making up for the shortcomings of the processability of the die-casting aluminum alloy itself. In conjunction with subsequent assembly and brazing process control, it realizes the enhanced mass production of dual-mainboard micro-channel radiator components and achieves good industrial benefits.

[0029] The above are only preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed by the present invention should be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the claims.

Claims

1. A method for processing a reinforced dual-mainboard microchannel heat dissipation component, comprising processing a mainboard plate, characterized in that: Mainboard processing includes the following steps: S1, using aluminum alloy die-casting process to cast the main board blank with a wall thickness of 4 to 5 mm; S2, using a trimmed forming process mold to perform shape correction processing on the die-cast blank of step S1 to obtain a trimmed part, wherein the trimmed forming process mold is a stamping die used for forming the same main plate with a wall thickness of less than 4 mm; S3, using a high-energy cutting process to process the shaped piece in step S2, and processing a hole / groove structure that is difficult to form by a die-casting process.

2. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 1, characterized in that: The main board component is a main board inner board or a main board outer board.

3. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 2, characterized in that: In step S1, the wall thickness is 4.5 mm; in step S2, the modified forming process mold refers to a stamping mold used for forming the same main board panel with a wall thickness of 3 mm.

4. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 1, characterized in that: In step S2, the shaping is performed by cutting and / or electric spark machining.

5. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 1, characterized in that: In step S3, the high-energy cutting process is at least one of plasma cutting, arc cutting, and laser cutting.

6. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 1, characterized in that: In step S2, the shape correction process is accompanied by secondary shaping of the local structure.

7. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 6, characterized in that: In step S2, the local structure is a flange, a bend or a boss.

8. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 2, characterized in that: The mainboard processing also includes the following steps: S4, assembling the mainboard inner plate, mainboard outer plate, heat dissipation pipes and other connectors and joints to obtain an assembly part.

9. A method for processing a reinforced dual-mainboard microchannel heat dissipation component according to claim 8, characterized in that: Step S4 is followed by the following steps: S5, brazing the assembly parts.

10. An automobile radiator, characterized in that: The invention relates to a reinforced dual-mainboard microchannel heat dissipation component obtained by adopting the processing method described in any one of claims 1 to 9.