Quartz shaft polishing device for semiconductor

Abstract

The invention relates to the technical field of quartz shaft machining, in particular to a semiconductor quartz shaft polishing device which comprises a polishing machine table, an electric sliding rail is fixedly connected to the top of the polishing machine table, a bottom frame is movably connected to the front side of the electric sliding rail, an auxiliary frame is arranged at the top of the bottom frame, and a guide rail is fixedly connected to the top of the auxiliary frame. The top of the front side of the auxiliary frame is fixedly connected with a supporting piece, the inner side of the guide rail is movably connected with a suspension, and the bottom of the suspension is provided with an upper handcuff ring and a lower handcuff ring. The quartz shaft polishing device for the semiconductor has the advantages that an ultra-long quartz shaft can be flexibly supported, the fracture risk of a shaft body is reduced, the upper handcuff ring, the lower handcuff ring and the internal structure are adaptively attached to the shaft body during polishing liquid treatment, polishing liquid is effectively erased, meanwhile, accumulated liquid residues are avoided, and in the structural design, the service life of the quartz shaft is prolonged. Friction and surface damage are reduced through the contact pads, the balls and the like, and the universality and adaptability of the device to quartz shafts of different sizes are improved.

Description

Technical Field

[0001] The invention relates to the technical field of quartz shaft processing, in particular to a quartz shaft polishing device for semiconductors. Background Art

[0002] As we all know, semiconductor quartz shafts are shaft components made of quartz material used in the semiconductor processing process. Quartz is a crystalline form of high-purity silicon with good thermal stability, chemical stability and mechanical strength. Therefore, it is widely used in the semiconductor industry. The polishing of semiconductor quartz shafts is a key process in its precision processing, which directly affects the surface quality and accuracy of the quartz shaft and the stability of the semiconductor process.

[0003] The existing technology has the following problems: when polishing a quartz shaft, especially a large-diameter and excessively long quartz shaft, it is sometimes difficult to support the extra-long portion of the quartz shaft when it is driven to rotate by a rotating component such as a chuck to cooperate with the polishing disk for processing. Most polishing machines in the existing technology are clamped at both ends, and the adjustable range is limited, making it difficult to polish according to actual conditions. In addition, the polishing liquid adheres to the surface of the quartz shaft during polishing, which can easily cause scratches and roughness on the surface, or require additional cleaning later, making it inconvenient to use. Based on the above-mentioned situation, we found that it is difficult for the existing quartz shaft polishing device to avoid the above problems at the same time. Therefore, we proposed a quartz shaft polishing device for semiconductors that can reasonably support and process over-long quartz shaft materials, reduce the probability of breakage, and wipe off the polishing liquid. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the present invention provides a quartz shaft polishing device for semiconductors, which has the advantages of being able to reasonably support and process over-long quartz shaft materials, while reducing the probability of breakage and being able to wipe off the polishing liquid.

[0005] The above technical purpose of the present invention is achieved through the following technical solutions: a quartz shaft polishing device for semiconductors, comprising a polishing machine table, the top of the polishing machine table is fixedly connected with an electric slide rail, the front side of the electric slide rail is movably connected with a base frame, the top of the base frame is provided with an auxiliary frame, the top of the auxiliary frame is fixedly connected with a guide rail, the top of the front side of the auxiliary frame is fixedly connected with a support member, the inner side of the guide rail is movably connected with a suspension, the bottom of the suspension is provided with an upper cuff ring and a lower cuff ring, the inner sides of the upper cuff ring and the lower cuff ring are both fixedly connected with a plurality of short shafts, the outer side of the short shaft is rotatably connected with an oblique brace, the side of the oblique brace away from the short shaft is rotatably connected with a sleeve frame, the top of the sleeve frame is rotatably connected with a rotating shaft, the side of the rotating shaft away from the sleeve frame is rotatably connected with a cross plate, and the side of the cross plate away from the rotating shaft is connected to a soft pad by bolts; The support member includes a lower clamping frame and an upper clamping frame, the inner side of the lower clamping frame is rotatably connected to a connecting pin, the outer side of the connecting pin is rotatably connected to the upper clamping frame, the inner sides of the lower clamping frame and the upper clamping frame are fixedly connected to contact pieces, the inner sides of the contact pieces are movably connected to balls, the inner side of the lower clamping frame is rotatably connected to a movable block, the rear side of the movable block is fixedly connected to an electric cylinder, the telescopic end of the electric cylinder passes through the movable block and is installed with a push-pull block, the outer side of the push-pull block is rotatably connected to the inner side of the upper clamping frame.

[0006] The above technical solution is adopted, by setting up a polishing machine for normal clamping, driving and polishing operations, the quartz shaft material can be directly clamped in the chuck of the polishing machine during use, and the unclamped part is auxiliary supported by the support member. After the clamping and fixing of the polishing machine and the quartz shaft material are completed, the auxiliary frame is moved upward so that the inner side of the lower clamping frame contacts the quartz shaft material, and then the electric cylinder is extended, and the push-pull block and the upper clamping frame connected thereto are pushed to rotate along the connecting pin and be stuck on the surface of the quartz shaft material. The upper clamping frame and the lower clamping frame both support the quartz shaft through the balls on the inner side of the contact piece. Even if the quartz shaft material is too long, the position of the base frame can be moved by the electric slide rail to move the entire auxiliary frame away from the chuck of the polishing machine to support the position of the quartz shaft material away from the chuck. The balls roll during movement, so there will be no large friction with the quartz shaft material. When the chuck drives the quartz shaft to rotate, the quartz shaft will also move between the balls. Then, the upper and lower cuff rings are moved along the guide rail and the suspension to follow the polishing path to wipe off all the polishing liquid attached during the polishing process, so as to avoid the polishing liquid adhering to the surface of the quartz shaft for a long time and drying, which will cause subsequent difficulty in handling.

[0007] The present invention is further configured as follows: a first torsion spring is sleeved on the outer side of the rotating shaft, the two ends of the first torsion spring are fixedly connected to the sleeve frame and the cross plate respectively, the inner side of the sleeve frame is fixedly connected to a second torsion spring, and the side of the second torsion spring away from the sleeve frame is fixedly connected to the diagonal support.

[0008] By adopting the above technical solution, by setting a first torsion spring in combination with a second torsion spring, when the horizontal plate and the soft pad are not in contact with the quartz shaft material and are under stress, the second torsion spring puts the sleeve and the diagonal support in a reset state, and deforms and stores force when under stress, while the first torsion spring is always in a state of storing force and stretching outward, so as to press the horizontal plate and the soft pad against the other soft pads at all times, reduce the spacing distance, and avoid the gap being too large to achieve a good erasing effect.

[0009] The present invention is further configured as follows: the inner sides of the upper handcuff ring and the lower handcuff ring are fixedly connected with a third torsion spring, the side of the third torsion spring close to the diagonal support is fixedly connected to the diagonal support, and the third torsion spring is sleeved on the outer side of the short shaft.

[0010] By adopting the above technical solution, by setting a third torsion spring, the supporting brace is always in an inclined state, and when the soft pad presses against the quartz shaft material, it receives force and rotates along the short axis. At this time, the third torsion spring deforms and stores force to facilitate reset after stopping contact.

[0011] The present invention is further configured as follows: the left side of the upper handcuff ring is rotatably connected to a rotating part, the inner side of the rotating part is rotatably connected to the lower handcuff ring, the right side of the upper handcuff ring is rotatably connected to a side sleeve, the bottom of the side sleeve is fixedly connected to a telescopic rod, the bottom of the telescopic rod is fixedly connected to a clamping plate, and the clamping plate is arranged at the bottom of the lower handcuff ring.

[0012] By adopting the above technical solution, a rotating part is provided to connect the upper cuff ring and the lower cuff ring so that they can be opened or closed relative to each other, so that the upper cuff ring and the lower cuff ring can be clamped on the surface of the quartz shaft material. By providing a side sleeve in conjunction with the telescopic rod to connect the clamping plate, the chuck is clamped on the bottom of the lower cuff ring to prevent the upper cuff ring and the lower cuff ring from opening when there is no external force.

[0013] The present invention is further configured as follows: grooves are provided on the right sides of the upper handcuff ring and the lower handcuff ring, the side sleeve is rotatably connected to the inner side of the groove, the outer sleeve of the telescopic rod is provided with a tension spring, and the top and bottom of the tension spring are fixedly connected to the side sleeve and the clamping plate respectively.

[0014] By adopting the above technical solution, a tension spring is set to limit the card plate to always be stuck at the bottom of the lower copy ring and it is not easy to loosen. The telescopic rod is used to limit the side sleeve and the card plate to avoid tilting of the card plate. The groove provides space for the telescopic rod and the tension spring to move.

[0015] The present invention is further configured as follows: the top of the upper handcuff ring is fixedly connected with a displacement sleeve, the inner side of the displacement sleeve is slidably connected with a vertical rod, the top of the vertical rod is fixedly connected to the suspension, and the bottom of the vertical rod is provided with a limiting protrusion.

[0016] By adopting the above technical solution, a displacement sleeve is set in conjunction with the vertical rod to adjust the vertical height of the upper cuff ring and the lower cuff ring so that they can fit the size of the quartz axis for use. The set limit protrusion can prevent the upper open ring from slipping along the bottom of the vertical rod.

[0017] The present invention is further configured as follows: a screw rod is rotatably connected to the inner side of the guide rail, a control motor is externally connected to the left side of the guide rail, an output end of the control motor is fixedly connected to the screw rod, and an outer side of the screw rod is threadedly connected to the suspension.

[0018] By adopting the above technical solution, a screw rod is set up, and the external control motor drives the screw rod to rotate forward or reverse when it rotates forward or reverse, so as to control the horizontal movement of the suspension and the structure connected to it, so as to adjust the position of the upper handcuff ring, or make it move to follow the polishing sheet.

[0019] The present invention is further configured as follows: a telescopic cylinder is fixedly connected to the top of the base frame, and a telescopic end of the telescopic cylinder is fixedly connected to the auxiliary frame.

[0020] By adopting the above technical solution, a telescopic cylinder is provided to lift or lower the auxiliary frame so as to adaptively adjust the structure to fit the size of the quartz axis.

[0021] The present invention is further configured such that: the inner sides of the lower clamping frame and the upper clamping frame are fixedly connected with contact pads, and the contact pads are made of sponge material.

[0022] By adopting the above technical solution and setting contact pads, when the upper clamping frame and the lower clamping frame come into contact with the quartz shaft material, they can first come into contact with the contact pads to avoid damage to the surface of the quartz shaft material caused by excessive force between the rigid structures.

[0023] The present invention is further configured as follows: the bottom of the lower clamping frame is fixedly connected to the auxiliary frame, and the inner sides of the upper cuff ring and the lower cuff ring are both provided with flow grooves.

[0024] By adopting the above technical solution and setting a circulation groove, the polishing liquid can be discharged through the circulation groove when it flows into the interior of the lower handcuff ring, avoiding accumulation that makes it difficult to clean up later.

[0025] Compared with the prior art, the present invention provides a quartz shaft polishing device for semiconductors, which has the following beneficial effects: The quartz shaft polishing device for semiconductors is provided with a polishing machine table for normal clamping, driving and polishing operations. When in use, the quartz shaft material can be directly clamped in the chuck of the polishing machine table, and the unclamped part is auxiliary supported by the support member. After the clamping and fixing of the polishing machine table and the quartz shaft material are completed, the auxiliary frame is moved upward so that the inner side of the lower clamping frame contacts the quartz shaft material. Then, the electric cylinder is extended and the push-pull block and the upper clamping frame connected thereto are pushed to rotate along the connecting pin and clamped on the surface of the quartz shaft material. The upper clamping frame and the lower clamping frame both support the quartz shaft through the balls on the inner side of the contact piece. Even if the quartz shaft material is too long, the position of the base frame can be moved by the electric slide rail so that the entire auxiliary frame is away from the chuck of the polishing machine table to support the position of the quartz shaft material away from the chuck. The balls roll during movement, so there will be no large friction with the quartz shaft material. When the chuck drives the quartz shaft to rotate, the quartz shaft will also roll Then, the upper and lower cuff rings are moved along the guide rail and the suspension to follow the polishing path to wipe off all the polishing liquid attached during the polishing process, so as to avoid the polishing liquid adhering to the surface of the quartz shaft for a long time and drying, which will cause subsequent difficulties in handling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the structure of the present invention; Figure 2 It is a schematic diagram of the position of the main structure of the present invention; Figure 3 Schematic diagram of the connection of the lower copy ring in the present invention; Figure 4 Schematic diagram of the structure of the lower copy ring in the present invention; Figure 5 Schematic diagram of the structure of the support member in the present invention; Figure 6 It is a side view of the lower clamping frame of the present invention; Figure 7 Schematic diagram of the quartz shaft polishing process of the present invention.

[0027] In the figure: 1. Polishing machine; 2. Electric slide rail; 3. Base frame; 4. Auxiliary frame; 5. Guide rail; 6. Suspension; 7. Support member; 71. Lower clamping frame; 72. Upper clamping frame; 73. Connecting pin; 74. Contact piece; 75. Ball bearing; 76. Movable block; 77. Electric cylinder; 78. Push-pull block; 8. Upper handcuff ring; 9. Lower handcuff ring; 10. Short shaft; 11. Diagonal support; 12. Sleeve; 13. Rotating shaft; 14. Cross plate; 15. Cushion; 16. First torsion spring; 17. Second torsion spring; 18. Third torsion spring; 19. Rotating member; 20. Side sleeve; 21. Telescopic rod; 22. Card plate; 23. Tension spring; 24. Displacement sleeve; 25. Vertical rod; 26. Screw rod; 27. Telescopic cylinder; 28. Contact pad; 29. ​​Circulation slot. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] Example 1 See also Figure 1-7 A quartz shaft polishing device for semiconductors comprises a polishing machine 1, the top of the polishing machine 1 is fixedly connected to an electric slide rail 2, the front side of the electric slide rail 2 is movably connected to a base frame 3, the top of the base frame 3 is provided with an auxiliary frame 4, the top of the auxiliary frame 4 is fixedly connected to a guide rail 5, the top of the front side of the auxiliary frame 4 is fixedly connected to a support member 7, the inner side of the guide rail 5 is movably connected to a suspension 6, the bottom of the suspension 6 is provided with an upper cuff ring 8 and a lower cuff ring 9, the inner sides of the upper cuff ring 8 and the lower cuff ring 9 are fixedly connected to a plurality of short shafts 10, the outer side of the short shaft 10 is rotatably connected to an oblique support 11, the side of the oblique support 11 away from the short shaft 10 is rotatably connected to a sleeve frame 12, the top of the sleeve frame 12 is rotatably connected to a rotating shaft 13, the side of the rotating shaft 13 away from the sleeve frame 12 is rotatably connected to a cross plate 14, and the side of the cross plate 14 away from the rotating shaft 13 is connected to a soft pad 15 by bolts; The upper handcuff ring 8 that is provided cooperates with the lower handcuff ring 9, and polishing liquid is attached to the surface of the quartz shaft during normal polishing. The upper handcuff ring 8 and the lower handcuff ring 9 will clamp the quartz shaft material on the inner side of the annular shape formed. At this time, the diagonal support 11 is tilted because the sleeve frame 12 and the cross plate 14 and the soft pad 15 are pressed against the quartz shaft material. At the same time, the sleeve frame 12 rotates along the diagonal support 11, so that the cross plate 14 and the soft pad 15 are fitted on the surface of the quartz shaft material. The soft pad 15 is deformed after contact to increase the contact area between itself and the quartz shaft material. The inclined cross plate 14 rotates along the rotating shaft 13, and multiple soft pads 15 contact each other to be wrapped around the surface of the quartz shaft to further fit on the outside of the quartz shaft so that there is no gap between them. Subsequently, the upper handcuff ring 8 and the lower handcuff ring 9 can be moved along the guide rail 5 and the suspension 6 to follow the polishing path to wipe out all the polishing liquid attached to the polishing process and drip, so as to avoid the subsequent difficult processing caused by the polishing liquid adhering to the quartz shaft surface drying for a long time.

[0030] Among them, the outer side of the rotating shaft 13 is provided with a first torsion spring 16, and the two ends of the first torsion spring 16 are fixedly connected to the sleeve frame 12 and the cross plate 14 respectively. The inner side of the sleeve frame 12 is fixedly connected with a second torsion spring 17, and the second torsion spring 17 is fixedly connected to the side of the sleeve frame 12 away from the diagonal support 11. By arranging the first torsion spring 16 to cooperate with the second torsion spring 17, when the cross plate 14 and the soft pad 15 are not in contact with the quartz shaft material and are under stress, the second torsion spring 17 makes the sleeve frame 12 and the diagonal support 11 in a reset state, and deforms and stores force when under stress, and the first torsion spring 16 is always in a state of storing force and stretching outward, so as to press the cross plate 14 and the soft pad 15 against the other soft pads 15 at all times, reduce the spacing distance, and avoid the gap being too large to achieve a good erasing effect, the upper handcuff ring 8 and the lower handcuff The inner side of the ring 9 is all fixedly connected with the third torsion spring 18, and the third torsion spring 18 is fixedly connected with the diagonal strut 11 on one side near the diagonal strut 11, and the third torsion spring 18 is sleeved on the outside of the minor axis 10. By arranging the third torsion spring 18, the support diagonal strut 11 is always in an inclined state, and the receiving force rotates along the minor axis 10 when the cushion 15 presses the quartz shaft material. At this moment, the third torsion spring 18 is deformed and stored, so that it can be reset after stopping contact. The left side of the upper handcuff ring 8 is rotatably connected with a rotating member 19, and the inner side of the rotating member 19 is rotatably connected with the lower handcuff ring 9. The right side of the upper handcuff ring 8 is rotatably connected with a side cover 20, and the bottom of the side cover 20 is fixedly connected with a telescopic rod 21, and the bottom of the telescopic rod 21 is fixedly connected with a clamping plate 22. The clamping plate 22 is located at the bottom of the lower handcuff ring 9. By arranging the rotating member The movable member 19 is used to connect the upper handcuff ring 8 and the lower handcuff ring 9 so that they can be relatively opened or closed, so that the upper handcuff ring 8 and the lower handcuff ring 9 are stuck on the surface of the quartz shaft material. By arranging the side sleeve 20 and cooperating with the telescopic rod 21 to connect the card plate 22, the chuck is stuck in the bottom of the lower handcuff ring 9 to avoid the upper handcuff ring 8 and the lower handcuff ring 9 from opening when there is no external force. The right side of the upper handcuff ring 8 and the lower handcuff ring 9 is provided with a groove, and the side sleeve 20 is rotatably connected to the inner side of the groove. The outer sleeve of the telescopic rod 21 is provided with a tension spring 23, and the top and bottom of the tension spring 23 are fixedly connected with the side sleeve 20 and the card plate 22 respectively. By arranging the tension spring 23, the card plate 22 is always stuck in the bottom of the lower handcuff ring 9, and is not easy to loosen. The side sleeve 20 and the card plate 22 are limited by the telescopic rod 21 to avoid The free card plate 22 is tilted, and the groove provides the telescopic rod 21 and the tension spring 23 with space for movement. The top of the upper handcuff ring 8 is fixedly connected with a displacement sleeve 24, and the inner side of the displacement sleeve 24 is slidably connected with a vertical rod 25. The top of the vertical rod 25 is fixedly connected to the suspension 6, and the bottom of the vertical rod 25 is provided with a limiting protrusion. By arranging the displacement sleeve 24 and cooperating with the vertical rod 25, it is used to adjust the vertical height of the upper handcuff ring 8 and the lower handcuff ring 9, so that the size of the quartz axis is fitted for use. The limiting protrusion provided can avoid the upper open ring from slipping off along the bottom of the vertical rod 25. The inner side of the guide rail 5 is rotatably connected with a screw rod 26, and the left side of the guide rail 5 is externally connected to a control motor. The output end of the control motor is fixedly connected to the screw rod 26, and the outside of the screw rod 26 is threadedly connected to the suspension 6. By arranging the screw rod 26,When the external control motor rotates forward or reverse, it drives the screw rod 26 to rotate forward or reverse to control the horizontal movement of the suspension 6 and the structure connected thereto to adjust the position of the upper handcuff ring 8 or make it move to follow the polishing sheet. The top of the base frame 3 is fixedly connected to a telescopic cylinder 27. The telescopic end of the telescopic cylinder 27 is fixedly connected to the auxiliary frame 4. By setting the telescopic cylinder 27, the auxiliary frame 4 is lifted or lowered so that the structure can be adaptively adjusted to fit the size of the quartz axis. The bottom of the lower clamping frame 71 is fixedly connected to the auxiliary frame 4. The inner sides of the upper handcuff ring 8 and the lower handcuff ring 9 are both provided with a circulation groove 29. By setting the circulation groove 29, when the polishing liquid flows into the interior of the lower handcuff ring 9, it can be discharged through the circulation groove 29 to avoid accumulation and difficulty in cleaning later.

[0031] The working principle of this embodiment is as follows: first, one end of the quartz shaft is fixed on the chuck of the polishing machine table 1, and the base frame 3 is adjusted by the electric slide rail 2 to make the auxiliary frame 4 below the part to be supported, and the upper cuff ring 8 and the lower cuff ring 9 are opened and sleeved on the outside of the quartz shaft and locked. The displacement sleeve 24 adjusts the height so that the soft pad 15 touches the shaft body. During polishing, the quartz shaft rotates, and the motor drives the screw rod 26 to make the suspension 6 drive the upper cuff ring 8 and the lower cuff ring 9 to move. The polishing liquid soft pad 15 attached to the surface of the quartz shaft is scraped off by contact. The diagonal support 11, the sleeve 12, and the rotating shaft 13 structure are elastically deformed by the first torsion spring 16, the second torsion spring 17 and the third torsion spring 18 under the pressure so that the soft pad 15 adaptively fits the curved surface of the shaft body, squeezes each other without gaps to wipe off the polishing liquid, and the wiped liquid is discharged through the circulation groove 29.

[0032] Example 2 Based on Example 1, Figure 1-6 A quartz shaft polishing device for semiconductors also includes a support member 7, wherein the support member 7 includes a lower clamping frame 71 and an upper clamping frame 72, the inner side of the lower clamping frame 71 is rotatably connected to a connecting pin 73, the outer side of the connecting pin 73 is rotatably connected to the upper clamping frame 72, the inner sides of the lower clamping frame 71 and the upper clamping frame 72 are fixedly connected to contact pieces 74, the inner sides of the contact pieces 74 are movably connected to balls 75, the inner side of the lower clamping frame 71 is rotatably connected to a movable block 76, the rear side of the movable block 76 is fixedly connected to an electric cylinder 77, the telescopic end of the electric cylinder 77 passes through the movable block 76 and is installed with a push-pull block 78, the outer side of the push-pull block 78 is rotatably connected to the inner side of the upper clamping frame 72; By setting the polishing machine 1 for normal clamping, driving and polishing operations, the quartz shaft material can be directly clamped in the chuck of the polishing machine 1 during use, and the unclamped part can be auxiliary supported by the support member 7. After the polishing machine 1 and the quartz shaft material are clamped and fixed, the auxiliary frame 4 is moved upward to make the inner side of the lower clamping frame 71 contact with the quartz shaft material, and then the electric cylinder 77 is extended and the push-pull block 78 and the upper clamping frame 72 connected thereto are pushed to rotate along the connecting pin 73 and be clamped on the surface of the quartz shaft material. The upper clamping frame 72 and the lower clamping frame 71 are in contact with the quartz shaft material. The clamping frame 71 supports the quartz shaft through the balls 75 on the inner side of the contact piece 74. Even if the quartz shaft material is too long, the position of the base frame 3 can be moved by the electric slide rail 2 to make the entire auxiliary frame 4 away from the chuck of the polishing machine table 1 to support the position of the quartz shaft material away from the chuck. The balls 75 roll during movement, so there will be no large friction with the quartz shaft material. When the chuck drives the quartz shaft to rotate, the quartz shaft will also roll between the balls 75, and the balls 75 themselves will also rotate, so it will not affect the normal movement of the quartz shaft.

[0033] Among them, the inner sides of the lower clamping frame 71 and the upper clamping frame 72 are fixedly connected with contact pads 28, and the contact pads 28 are made of sponge material. By setting the contact pads 28, when the upper clamping frame 72 and the lower clamping frame 71 contact the quartz shaft material, they can first contact the contact pads 28 to avoid damage to the surface of the quartz shaft material caused by excessive force between the rigid structures.

[0034] The working principle of this embodiment is as follows: First, the telescopic cylinder 27 lifts the auxiliary frame 4 to allow the lower clamping frame 71 to contact the quartz shaft, and the sponge contact pad 28 cushions to avoid rigid collision. Then the electric cylinder 77 extends to push the push-pull block 78 to drive the upper clamping frame 72 to rotate around the connecting pin 73 to fit the surface of the quartz shaft. The upper clamping frame 72 and the lower clamping frame 71 are supported by the inner ball bearings 75 of the contact piece 74. If the quartz shaft is too long, the support position can be adjusted by the electric slide rail 2. During polishing, the quartz shaft rotates, and the ball bearings 75 roll synchronously to reduce friction. The support member 7 drives the upper clamping frame 72 to open and close through the electric cylinder 77, and the lower clamping frame 71 forms a stable base. The embedded ball bearings 75 use rolling friction instead of sliding friction to ensure smooth rotation of the shaft. The sponge contact pad 28 disperses stress to protect the surface of the shaft. The ball bearings 75 can also adjust the contact point as the shaft vibrates, and cooperate with the electric slide rail 2 to achieve dynamic and stable support for the extra-long shaft.

[0035] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed. Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A quartz shaft polishing device for semiconductors, comprising a polishing machine (1), characterized in that: The top of the polishing machine (1) is fixedly connected to an electric slide rail (2), the front side of the electric slide rail (2) is movably connected to a base frame (3), the top of the base frame (3) is provided with an auxiliary frame (4), the top of the auxiliary frame (4) is fixedly connected to a guide rail (5), the top of the front side of the auxiliary frame (4) is fixedly connected to a support member (7), the inner side of the guide rail (5) is movably connected to a suspension (6), the bottom of the suspension (6) is provided with an upper handcuff ring (8) and a lower handcuff ring (9), the upper handcuff ring (8) and the inner side of the lower handcuff ring (9) are fixedly connected to a plurality of short shafts (10), the outer side of the short shaft (10) is rotatably connected to a diagonal support (11), the side of the diagonal support (11) away from the short shaft (10) is rotatably connected to a sleeve (12), the top of the sleeve (12) is rotatably connected to a rotating shaft (13), the side of the rotating shaft (13) away from the sleeve (12) is rotatably connected to a transverse plate (14), and the side of the transverse plate (14) away from the rotating shaft (13) is connected to a soft pad (15) through bolts; The support member (7) includes a lower clamping frame (71) and an upper clamping frame (72), the inner side of the lower clamping frame (71) is rotatably connected to a connecting pin (73), the outer side of the connecting pin (73) is rotatably connected to the upper clamping frame (72), the inner sides of the lower clamping frame (71) and the upper clamping frame (72) are fixedly connected to a contact piece (74), the inner side of the contact piece (74) is movably connected to a ball (75), the inner side of the lower clamping frame (71) is rotatably connected to a movable block (76), the rear side of the movable block (76) is fixedly connected to an electric cylinder (77), the telescopic end of the electric cylinder (77) passes through the movable block (76) and is installed with a push-pull block (78), the outer side of the push-pull block (78) is rotatably connected to the inner side of the upper clamping frame (72).

2. A quartz shaft polishing device for semiconductors according to claim 1, characterized in that: A first torsion spring (16) is sleeved on the outer side of the rotating shaft (13), and two ends of the first torsion spring (16) are fixedly connected to the sleeve frame (12) and the transverse plate (14) respectively. A second torsion spring (17) is fixedly connected to the inner side of the sleeve frame (12), and the side of the second torsion spring (17) away from the sleeve frame (12) is fixedly connected to the diagonal support (11).

3. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: The inner sides of the upper handcuff ring (8) and the lower handcuff ring (9) are both fixedly connected to a third torsion spring (18); a side of the third torsion spring (18) close to the diagonal brace (11) is fixedly connected to the diagonal brace (11); and the third torsion spring (18) is sleeved on the outer side of the short shaft (10).

4. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: The left side of the upper handcuff ring (8) is rotatably connected to a rotating member (19), the inner side of the rotating member (19) is rotatably connected to the lower handcuff ring (9), the right side of the upper handcuff ring (8) is rotatably connected to a side sleeve (20), the bottom of the side sleeve (20) is fixedly connected to a telescopic rod (21), the bottom of the telescopic rod (21) is fixedly connected to a clamping plate (22), and the clamping plate (22) is arranged at the bottom of the lower handcuff ring (9).

5. A semiconductor quartz shaft polishing device according to claim 4, characterized in that: The right sides of the upper handcuff ring (8) and the lower handcuff ring (9) are both provided with grooves, the side sleeve (20) is rotatably connected to the inner side of the groove, the outer sleeve of the telescopic rod (21) is provided with a tension spring (23), and the top and bottom of the tension spring (23) are fixedly connected to the side sleeve (20) and the clamping plate (22) respectively.

6. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: The top of the upper handcuff ring (8) is fixedly connected to a displacement sleeve (24), the inner side of the displacement sleeve (24) is slidably connected to a vertical rod (25), the top of the vertical rod (25) is fixedly connected to the suspension (6), and the bottom of the vertical rod (25) is provided with a limiting protrusion.

7. A quartz shaft polishing device for semiconductors according to claim 1, characterized in that: The inner side of the guide rail (5) is rotatably connected to a screw rod (26), the left side of the guide rail (5) is externally connected to a control motor, the output end of the control motor is fixedly connected to the screw rod (26), and the outer side of the screw rod (26) is threadedly connected to the suspension (6).

8. The semiconductor quartz shaft polishing device according to claim 1, characterized in that: A telescopic cylinder (27) is fixedly connected to the top of the base frame (3), and a telescopic end of the telescopic cylinder (27) is fixedly connected to the auxiliary frame (4).

9. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: The inner sides of the lower clamping frame (71) and the upper clamping frame (72) are both fixedly connected with a contact pad (28), and the contact pad (28) is made of sponge material.

10. The semiconductor quartz shaft polishing device according to claim 1, characterized in that: The bottom of the lower clamping frame (71) is fixedly connected to the auxiliary frame (4), and the inner sides of the upper cuff ring (8) and the lower cuff ring (9) are both provided with a flow groove (29).

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