Method for producing nickel foil by nickel aminosulfonate process

Abstract

The invention relates to a method for producing nickel foil through a nickel aminosulfonate process, and belongs to the technical field of metal foil production. According to the nickel aminosulfonate process provided by the invention for producing the nickel foil, the nickel foil with better surface quality and more excellent mechanical property and electrical property can be obtained by optimizing a plating solution formula and process parameters, the plating solution is circularly circulated by adopting a solution supply circulating device in the electroplating process, and ions in the plating solution can be more uniformly distributed through circular circulation; nickel ions consumed on the surface of the cathode are supplemented, meanwhile, escape of gas such as hydrogen is facilitated, defects such as pinholes are reduced, and the uniformity of the quality of a plating layer is improved.

Description

Technical Field

[0001] The invention relates to a method for producing nickel foil using a nickel sulfamate process, belonging to the technical field of metal foil production. Background Art

[0002] At present, nickel foil is widely used in many fields such as electronics, batteries, aerospace, etc. For example, in lithium-ion batteries, nickel foil acts as a current collector and has an important impact on the performance of the battery. At present, there are many methods for producing nickel foil, among which electroplating is widely used because of its advantages such as precise control of the coating thickness and the ability to deposit on complex-shaped substrates. Among the electroplating methods, the nickel sulfamate system has become a common process for producing nickel foil due to its many advantages, such as the ability to obtain high-purity, low-stress nickel coatings. However, the existing nickel sulfamate process still has some problems in the production of nickel foil. For example, the crystallization quality of the coating needs to be further improved, resulting in the mechanical and electrical properties of the nickel foil not fully meeting the requirements of high-end applications; the current efficiency in the production process is not high enough, resulting in energy waste; and the stability of the plating solution also needs to be further enhanced to reduce fluctuations in the production process and improve the consistency of product quality.

[0003] In view of the above-mentioned defects, the present invention aims to create a method for producing nickel foil using a nickel sulfamate process, so as to make it more valuable for industrial use. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a method for producing nickel foil using a nickel sulfamate process.

[0005] A nickel sulfamate plating solution of the present invention comprises the following components:

[0006] Nickel sulfamate, concentration 300-500 g / L;

[0007] Nickel chloride, concentration 5-15g / L;

[0008] Boric acid, concentration 30-45 g / L;

[0009] Saccharin, concentration 0.5-1.5 g / L;

[0010] Butyl ether salt, concentration is 0.002~0.01g / L;

[0011] Sodium succinate, concentration is 0.05-0.2g / L.

[0012] A method for producing nickel foil using a nickel sulfamate plating solution, the specific production steps are:

[0013] (1) Preparation of plating solution:

[0014] The method comprises the following steps: using nickel sulfamate as a main salt, maintaining a concentration of 300-500 g / L in the plating solution, adding nickel chloride, maintaining a concentration of 5-15 g / L in the plating solution, and adding boric acid as a buffer, maintaining a concentration of 30-45 g / L; adding composite additives to the plating solution, including saccharin, maintaining a concentration of 0.5-1.5 g / L in the plating solution, monobutyl ether sodium salt (MOSS), maintaining a concentration of 0.002-0.01 g / L in the plating solution, and sodium succinate (MT-80), maintaining a concentration of 0.05-0.2 g / L in the plating solution; and stirring and mixing the mixture to obtain a plating solution.

[0015] (2) Pre-plating treatment

[0016] The cathode substrate is sequentially subjected to degreasing, pickling and water washing treatments;

[0017] (3) Electroplating process

[0018] The treated cathode substrate is placed in the plating solution, and the nickel plate is used as the anode; the area ratio of the anode to the cathode is controlled; the electroplating reaction is carried out, and the plating solution is circulated by a liquid circulation device during the electroplating process;

[0019] (4) Nickel foil peeling and post-processing

[0020] After the electroplating is completed, the cathode substrate is taken out from the plating solution, the nickel foil is separated from the cathode substrate, and the peeled nickel foil is washed with water and dried.

[0021] Furthermore, in step (2), an alkaline degreasing agent is used for degreasing at 60-70° C. for 10-15 minutes.

[0022] Furthermore, in step (2), the pickling is performed using a sulfuric acid solution with a mass fraction of 10% to 15% at room temperature for 3 to 5 minutes.

[0023] Furthermore, in step (3), the area ratio of the anode to the cathode is controlled within a range of 1:1 to 1.5:1.

[0024] Furthermore, the electroplating temperature of the electroplating reaction in step (3) is controlled at 45-55°C, and the current density is adjusted to 20-30A / dm 2 .

[0025] Furthermore, the circulating flow rate of the liquid in step (3) is 5m 3 / h.

[0026] Furthermore, deionized water is used for washing in step (4).

[0027] Furthermore, the drying in step (4) is carried out in an oven at 60-80° C. for 10-20 minutes.

[0028] By means of the above solution, the present invention has at least the following advantages:

[0029] The nickel sulfamate process provided by the present invention produces nickel foil. By optimizing the plating solution formula and process parameters, nickel foil with better surface quality and superior mechanical and electrical properties can be obtained. A higher concentration of nickel sulfamate can increase the supply of nickel ions in the plating solution, which is beneficial to increasing the deposition rate. However, too high a concentration may affect the stability of the plating solution. Only within this concentration range can a better deposition effect be achieved while ensuring the stability of the plating solution.

[0030] The chloride ions in nickel chloride can activate the anode and promote the dissolution of the nickel anode. At the same time, they can improve the crystal quality of the coating. An appropriate amount of chloride ions can refine the grains and improve the density of the coating.

[0031] Boric acid stabilizes the pH of the plating solution, preventing rapid pH increases caused by hydrogen evolution at the cathode during the electroplating process, which can affect the quality of the coating. A stable pH environment helps ensure a stable discharge process for nickel ions.

[0032] Saccharin can be adsorbed on the cathode surface, changing the deposition mode of nickel ions and refining the coating crystals, thereby improving the brightness and surface smoothness of nickel foil.

[0033] Butyl ether salt is preferentially adsorbed on the microscopic depressions on the surface of the plated part, inhibiting the metal deposition rate in these areas and accelerating the deposition on the raised areas, thereby leveling the surface of the plated layer and effectively reducing scratches and defects on the surface of the nickel foil.

[0034] Sodium succinate can reduce the internal stress of the coating, prevent the nickel foil from cracking due to stress concentration during subsequent processing or use, and improve the flexibility and reliability of the nickel foil.

[0035] Alkaline degreasing agent is used to completely remove the oil stains on the substrate surface to ensure good bonding between the coating and the substrate. Pickling removes the oxide layer on the substrate surface and activates the substrate surface, which is conducive to the deposition of nickel ions.

[0036] A suitable anode-cathode area ratio helps ensure uniform current distribution, allowing nickel ions in the plating solution to be evenly deposited on the cathode surface.

[0037] Temperature significantly impacts the electroplating process. The temperature range of the present invention achieves a good balance between the ion diffusion rate in the plating solution and the electrode reaction rate, which is beneficial for obtaining high-quality nickel coatings. Excessively low temperatures slow ion diffusion and reduce deposition rates; excessively high temperatures can cause decomposition of additives in the plating solution, affecting coating quality.

[0038] Current density is a key factor affecting nickel foil quality and deposition rate. Within the current density range of the present invention, a suitable reduction rate of nickel ions on the cathode surface is ensured, ensuring both a certain deposition rate and fine crystallization of the coating, avoiding scorching of the coating due to excessive current density or slow deposition due to too low a current density.

[0039] During the electroplating process, a liquid circulation device is used to circulate the plating solution. The circulation can make the ion distribution in the plating solution more uniform, replenish the nickel ions consumed by the cathode surface, and at the same time facilitate the escape of gases such as hydrogen, reduce the generation of defects such as pinholes, and improve the uniformity of the coating quality.

[0040] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate a certain embodiment of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0042] Figure 1 The present invention is a schematic diagram of the process of producing nickel foil using the nickel sulfamate process. DETAILED DESCRIPTION

[0043] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0044] The method for producing nickel foil using a nickel sulfamate process provided by the present invention comprises the following steps:

[0045] 1. Preparation of plating solution:

[0046] Nickel sulfamate is the main salt, with a concentration of 300-500g / L. A higher concentration of nickel sulfamate can increase the supply of nickel ions in the plating solution, which is beneficial to increasing the deposition rate. However, too high a concentration may affect the stability of the plating solution. Only within this concentration range can a good deposition effect be achieved while ensuring the stability of the plating solution.

[0047] Add nickel chloride at a concentration of 5-15g / L. The chloride ions in nickel chloride can activate the anode, promote the dissolution of the nickel anode, and improve the crystal quality of the coating. An appropriate amount of chloride ions can refine the grains and improve the density of the coating.

[0048] Boric acid acts as a buffer, maintaining a concentration of 30-45g / L. Boric acid stabilizes the pH of the plating solution, preventing rapid pH increases caused by hydrogen evolution at the cathode during the electroplating process, which can affect the quality of the coating. A stable pH environment helps ensure a steady discharge of nickel ions.

[0049] Adding compound additives to the plating bath includes:

[0050] Saccharin, concentration is 0.5-1.5g / L. Saccharin can be adsorbed on the cathode surface, changing the deposition mode of nickel ions and making the coating crystallized and refined, thereby improving the brightness and surface smoothness of nickel foil.

[0051] MOSS, with a concentration of 0.002-0.01 g / L, preferentially adsorbs onto microscopic depressions on the plated surface, inhibiting metal deposition there and accelerating deposition on raised areas. This smoothes the plated surface and effectively reduces scratches and defects on the nickel foil.

[0052] Sodium succinate (MT-80), concentration is 0.05-0.2g / L. As a surfactant, sodium succinate can significantly reduce the surface tension of the cathode / solution interface, promoting the uniform spreading of the plating solution on the cathode surface. At the same time, sodium succinate adsorbs on the surface of the cathode titanium plate, forming an adsorption film. This film can hinder the rapid discharge of copper ions, reduce the electrode reaction rate, and make the deposition of copper ions slower and more uniform, thereby reducing internal stress and preventing the nickel foil from cracking due to stress concentration during subsequent processing or use. It also improves the flexibility and reliability of the nickel foil.

[0053] 2. Pre-plating treatment:

[0054] The cathode substrate (such as a titanium plate) is sequentially degreased, pickled, and washed. Degreasing is performed using an alkaline degreaser at 60-70°C for 10-15 minutes to thoroughly remove oil stains on the substrate surface and ensure good adhesion between the coating and the substrate. Pickling is performed using a 10%-15% sulfuric acid solution at room temperature for 3-5 minutes to remove the oxide layer on the substrate surface and activate the substrate surface, which is conducive to the deposition of nickel ions.

[0055] 3. Electroplating process:

[0056] Place the treated cathode substrate in the plating solution, using the nickel plate as the anode. The anode to cathode area ratio is controlled between 1:1 and 1.5:1. This appropriate anode-cathode area ratio helps ensure uniform current distribution, allowing nickel ions in the plating solution to be evenly deposited on the cathode surface.

[0057] The electroplating temperature is controlled between 45 and 55°C. Temperature has a significant impact on the electroplating process. This temperature range allows the ion diffusion rate in the plating solution and the electrode reaction rate to achieve a good balance, which is conducive to obtaining high-quality nickel plating. If the temperature is too low, the ion diffusion is slow and the deposition rate is reduced; if the temperature is too high, it may cause the decomposition of the additives in the plating solution, affecting the quality of the plating layer.

[0058] Adjust the current density to 20~30A / dm 2 Current density is one of the key factors affecting nickel foil quality and deposition rate. Within this current density range, the appropriate reduction rate of nickel ions on the cathode surface can be guaranteed, which can not only ensure a certain deposition rate but also make the coating crystallize finely, avoiding the coating burning caused by excessive current density or the slow deposition rate caused by too low current density.

[0059] During the electroplating process, a liquid circulation device is used to circulate the plating solution, and the liquid flow rate is 5m 3 / h. Circulation can make the ion distribution in the plating solution more uniform, replenish the nickel ions consumed on the cathode surface, and at the same time facilitate the escape of gases such as hydrogen, reduce the generation of defects such as pinholes, and improve the uniformity of the coating quality.

[0060] 4. Nickel foil peeling and post-processing:

[0061] After electroplating is complete, the cathode substrate is removed from the plating solution and the nickel foil is separated from the cathode substrate by mechanical or chemical stripping. Mechanical stripping can be performed using specialized stripping equipment, with care being taken to avoid damaging the nickel foil. Chemical stripping can be performed using a suitable stripping solution to separate the nickel foil from the substrate without affecting the performance of the nickel foil.

[0062] The stripped nickel foil is then washed and dried. Deionized water is used for washing to remove any residual plating solution from the surface of the nickel foil and prevent impurities from affecting its performance. Drying is performed in an oven at 60-80°C for 10-20 minutes to ensure a dry surface for subsequent storage and use.

[0063] Nickel foil production process diagram:

[0064] Plating solution preparation (plating solution preparation and addition of additives) → titanium plate purification → electroplating → nickel foil stripping and post-processing,

[0065] Example

[0066] Example 1

[0067] 1. Preparation of plating solution:

[0068] The concentration of nickel sulfamate is 300 g / L.

[0069] The nickel chloride concentration is 5 g / L.

[0070] The boric acid concentration was 30 g / L.

[0071] Composite additives: saccharin 0.5g / L, dibutyl ether salt 0.002g / L, sodium succinate 0.05g / L.

[0072] 2. Pre-plating treatment:

[0073] The cathode substrate (titanium plate) was treated in an alkaline degreasing agent at 60° C. for 10 minutes, then pickled in a 10% by mass sulfuric acid solution at room temperature for 3 minutes, and finally rinsed with deionized water.

[0074] 3. Electroplating process:

[0075] The anode and cathode area ratio is 1.1:1.

[0076] The electroplating temperature is 45°C.

[0077] The current density is 20A / dm 2 .

[0078] Circulation flow rate is 5m 3 / h.

[0079] The electroplating time is determined according to the required nickel foil thickness. This time, a nickel foil with a thickness of 50 μm is obtained.

[0080] 4. Nickel foil peeling and post-processing:

[0081] The nickel foil was separated from the cathode substrate using a mechanical stripping method.

[0082] Rinse the nickel foil with deionized water and then dry it in an oven at 60 °C for 10 min.

[0083] Performance tests on the obtained nickel foil showed that the surface of the nickel foil was bright and smooth without obvious scratches and defects. Its hardness was HV210, resistivity was 7.6μΩ·cm, and internal stress was 13MPa.

[0084] Example 2

[0085] 1. Preparation of plating solution:

[0086] The concentration of nickel sulfamate is 350 g / L.

[0087] The nickel chloride concentration is 8 g / L.

[0088] The boric acid concentration was 35 g / L.

[0089] Composite additives: saccharin 1g / L, dibutyl ether salt 0.008g / L, sodium succinate 0.1g / L.

[0090] 2. Pre-plating treatment:

[0091] The cathode substrate (titanium plate) was treated in an alkaline degreasing agent at 65° C. for 12 minutes, then pickled in a 12% by mass sulfuric acid solution at room temperature for 4 minutes, and finally rinsed with deionized water.

[0092] 3. Electroplating process:

[0093] The anode and cathode area ratio is 1.2:1.

[0094] The electroplating temperature is 50°C.

[0095] The current density is 20A / dm2.

[0096] The circulation flow rate is 5m3 / h.

[0097] The electroplating time is determined according to the required nickel foil thickness. This time, a nickel foil with a thickness of 50 μm is obtained.

[0098] 4. Nickel foil peeling and post-processing:

[0099] The nickel foil was separated from the cathode substrate using a mechanical stripping method.

[0100] Rinse the nickel foil with deionized water and then dry it in an oven at 70 °C for 15 min.

[0101] Performance tests on the obtained nickel foil showed that the surface of the nickel foil was bright and smooth without obvious scratches and defects. Its hardness was HV200, resistivity was 7.8μΩ·cm, and internal stress was 15MPa.

[0102] Example 3

[0103] 1. Preparation of plating solution:

[0104] The concentration of nickel sulfamate is 400g / L.

[0105] The nickel chloride concentration is 10 g / L.

[0106] The boric acid concentration was 40 g / L.

[0107] Composite additives: saccharin 1.5g / L, dibutyl ether salt 0.01g / L, sodium succinate 0.15g / LL.

[0108] 2. Pre-plating treatment:

[0109] The cathode substrate (titanium plate) was treated in an alkaline degreasing agent at 60° C. for 15 minutes, then pickled in a 15% by mass sulfuric acid solution at room temperature for 3 minutes, and finally rinsed with deionized water.

[0110] 3. Electroplating process:

[0111] The area ratio of anode to cathode is 1:1.

[0112] The electroplating temperature is 48°C.

[0113] The current density is 25A / dm 2 .

[0114] The circulation flow rate is 5m3 / h.

[0115] The electroplating time is determined according to the required nickel foil thickness. This time, a nickel foil with a thickness of 60 μm is obtained.

[0116] 4. Nickel foil peeling and post-processing:

[0117] Chemical stripping was used to separate the nickel foil from the cathode substrate.

[0118] Rinse the nickel foil with deionized water and then dry it in an oven at 80 °C for 10 min.

[0119] Performance tests on the obtained nickel foil showed that the surface of the nickel foil was bright and smooth without obvious scratches and defects. Its hardness was HV220, resistivity was 7.5μΩ·cm, and internal stress was 12MPa.

[0120] Example 4

[0121] 1. Preparation of plating solution:

[0122] The concentration of nickel sulfamate is 500 g / L.

[0123] The nickel chloride concentration is 15 g / L.

[0124] The boric acid concentration was 45 g / L.

[0125] Composite additives: saccharin 1.5g / L, dibutyl ether salt 0.01g / L, sodium succinate 0.2g / L.

[0126] 2. Pre-plating treatment:

[0127] The cathode substrate (titanium plate) was treated in an alkaline degreasing agent at 70° C. for 15 minutes, then pickled in a 15% by mass sulfuric acid solution at room temperature for 5 minutes, and finally rinsed with deionized water.

[0128] 3. Electroplating process:

[0129] The anode and cathode area ratio is 1.5:1.

[0130] The electroplating temperature is 55°C.

[0131] Current density is 30A / dm 2 .

[0132] Circulation flow rate is 5m 3 / h.

[0133] The electroplating time is determined according to the required nickel foil thickness. This time, a nickel foil with a thickness of 60 μm is obtained.

[0134] 4. Nickel foil peeling and post-processing:

[0135] Chemical stripping was used to separate the nickel foil from the cathode substrate.

[0136] Rinse the nickel foil with deionized water and then dry it in an oven at 80 °C for 10 min.

[0137] Performance tests on the obtained nickel foil showed that the surface of the nickel foil was bright and smooth without obvious scratches and defects. Its hardness was HV215, resistivity was 7.4μΩ·cm, and internal stress was 14MPa.

[0138] Comparative Example 1

[0139] The preparation method of this comparative example is basically the same as that of Example 3, except that the concentration of nickel sulfamate in the electroplating solution is 250 g / L. Other proportions and preparation methods remain unchanged, and nickel foil is also prepared.

[0140] Comparative Example 2

[0141] The preparation method of this comparative example is basically the same as that of Example 3, except that the nickel chloride concentration in the electroplating solution is 3 g / L. Other proportions and preparation methods remain unchanged, and nickel foil is also prepared.

[0142] Comparative Example 3

[0143] The preparation method of this comparative example is basically the same as that of Example 3, except that the boric acid concentration in the electroplating solution is 25 g / L. Other proportions and preparation methods remain unchanged, and nickel foil is also prepared.

[0144] Comparative Example 4

[0145] The preparation method of this comparative example is basically the same as that of Example 3, except that the boric acid concentration in the electroplating solution is 25 g / L. Other proportions and preparation methods remain unchanged, and nickel foil is also prepared.

[0146] Comparative Example 5

[0147] The preparation method of this comparative example is basically the same as that of Example 3, except that only saccharin is added as a brightener at a concentration of 0.3 g / L, and no displacement agent or stress reliever is added. Other proportions and preparation methods remain unchanged, and nickel foil is also prepared.

[0148] Comparative Example 6

[0149] The preparation method of this comparative example is basically the same as that of Example 3, except that the cathode substrate (titanium plate) is treated in an alkaline degreaser at 55°C for 8 minutes, then pickled in an 8% by mass sulfuric acid solution at room temperature for 6 minutes, and finally rinsed with deionized water. Other proportions and preparation methods remain unchanged, and nickel foil is also produced.

[0150] Comparative Example 7

[0151] The preparation method of this comparative example is basically the same as that of Example 3, except that the anode and cathode area ratio is 2:1. Other ratios and preparation methods remain unchanged, and nickel foil is also prepared.

[0152] Comparative Example 8

[0153] The preparation method of this comparative example is basically the same as that of Example 3, except that the electroplating temperature is 40° C. Other proportions and preparation methods remain unchanged, and nickel foil is also prepared.

[0154] Comparative Example 9

[0155] The preparation method of this comparative example is basically the same as that of Example 3, except that the current density is 20A / dm 2 , other proportions and preparation methods remain unchanged, and nickel foil is also produced.

[0156] Comparative Example 10

[0157] The preparation method of this comparative example is basically the same as that of Example 3, except that a liquid circulation device is not used to circulate the plating solution during the electroplating process. Other proportions and preparation methods remain unchanged, and nickel foil is also produced.

[0158] The above examples 1-3 and comparative examples 1-10 were tested for performance, and the test results are shown in Table 1:

[0159] Detection method

[0160] 1. Surface quality inspection

[0161] Inspection method: Use an optical microscope (magnification 50-500 times) to observe the surface morphology of the nickel foil and record defects such as scratches, holes, and pits. Use a surface roughness tester (such as Taylor Hobson Surtronic series) to measure the surface roughness (Ra value). Take 5 different positions on each sample and take the average value.

[0162] Standard: The surface should be smooth and bright, without obvious defects; the lower the Ra value, the smoother the surface.

[0163] 2. Mechanical properties testing

[0164] Hardness: Use a Vickers hardness tester (such as Struers Durascan series), test load 100g, hold time 15s, test 3 points on each sample and take the average value.

[0165] Internal stress: measured using an X-ray stress analyzer (such as Proto iXRD) and calculated using the Bragg equation.

[0166] Flexibility: A bending test is used to repeatedly bend the nickel foil around a cylinder of a specific radius, and the number of bends until cracks appear is recorded.

[0167] 3. Electrical performance testing

[0168] Resistivity: Use a four-probe resistivity tester (such as RTS-9) to measure at room temperature, and measure each sample three times to take the average value.

[0169] Table 1 Performance test results

[0170]

[0171] The test data for Examples 1-3 and Comparative Examples 1-10 in the table above demonstrate that the nickel sulfamate process provided by the present invention, by optimizing the plating solution formulation and process parameters, can produce nickel foil with improved surface quality and superior mechanical and electrical properties. This method improves the quality and production efficiency of nickel foil and has promising application prospects.

[0172] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A nickel sulfamate plating solution, characterized in that The plating solution components include: Nickel sulfamate, concentration 300-500 g / L; Nickel chloride, concentration 5-15g / L; Boric acid, concentration 30-45 g / L; Saccharin, concentration 0.5-1.5 g / L; Butyl ether salt, concentration is 0.002~0.01g / L; Sodium succinate, concentration is 0.05-0.2g / L.

2. A method for producing nickel foil using the nickel sulfamate plating solution according to claim 1, characterized in that: The specific production steps are: (1) Preparation of plating solution: The method comprises the following steps: using nickel sulfamate as a main salt, maintaining a concentration of 300-500 g / L in the plating solution, adding nickel chloride, maintaining a concentration of 5-15 g / L in the plating solution, and adding boric acid as a buffer, maintaining a concentration of 30-45 g / L; adding composite additives to the plating solution, including saccharin, maintaining a concentration of 0.5-1.5 g / L in the plating solution, monobutyl ether sodium salt (MOSS), maintaining a concentration of 0.002-0.01 g / L in the plating solution, and sodium succinate (MT-80), maintaining a concentration of 0.05-0.2 g / L in the plating solution; and stirring and mixing the mixture to obtain a plating solution. (2) Pre-plating treatment The cathode substrate is sequentially subjected to degreasing, pickling and water washing treatments; (3) Electroplating process The treated cathode substrate is placed in the plating solution, and the nickel plate is used as the anode; the area ratio of the anode to the cathode is controlled; the electroplating reaction is carried out, and the plating solution is circulated by a liquid circulation device during the electroplating process; (4) Nickel foil peeling and post-processing After the electroplating is completed, the cathode substrate is taken out from the plating solution, the nickel foil is separated from the cathode substrate, and the peeled nickel foil is washed with water and dried.

3. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: In the step (2), an alkaline degreasing agent is used for degreasing at 60-70° C. for 10-15 minutes.

4. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: In the step (2), the pickling is performed using a sulfuric acid solution with a mass fraction of 10% to 15% at room temperature for 3 to 5 minutes.

5. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: In the step (3), the area ratio of the anode to the cathode is controlled within a range of 1:1 to 1.5:

1.

6. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: The electroplating temperature of the electroplating reaction in step (3) is controlled at 45-55°C, and the current density is adjusted to 20-30A / dm 2 .

7. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: The circulating flow rate of the liquid in step (3) is 5m 3 / h.

8. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: Deionized water is used for washing in step (4).

9. The method for producing nickel foil using the nickel sulfamate plating solution according to claim 2, wherein: The drying in step (4) is carried out in an oven at 60-80° C. for 10-20 minutes.

Images