Cutting force measuring method for atomic precision machining

Abstract

The invention discloses a cutting force measuring method for atomic precision machining, which belongs to the field of atomic precision machining and comprises the following steps of: 1, determining the elastic rigidity of an atomic force microscope probe; step 2, preprocessing an atomic force microscope probe; step 3, preparing a cut sample; fourthly, the atomic-scale sharp diamond cutter is prepared; step 5, installing the sheet sample on an X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod; 6, measuring the cutting force by using an X-Nano multi-degree-of-freedom nano control technology; and 7, calculating the displacement of the diamond cutter and the sheet sample in the x direction under different frames, and drawing a relation curve of the cutting stroke and the cutting force. According to the invention, the cutting force measurement of atomic precision processing is realized under the TEM based on the AFM probe, the cutting force measurement range can be flexibly adjusted according to the amplification factor of the TEM and the elastic rigidity of the AFM probe, and the method is suitable for the cutting force measurement of various materials.

Description

Technical Field

[0001] The present invention relates to the technical field of atomic precision machining, and in particular to a cutting force measurement method for atomic precision machining. Background Art

[0002] In atomic precision machining, the characteristic size of the mechanical interaction between the tool and the workpiece is at the atomic scale. It uses atomically sharp diamond tools to apply cutting force to the atomic-scale workpiece, achieving controllable removal of atomic workpiece materials with a thickness of several nanometers or tens of nanometers, thereby achieving atomic-level form and position tolerances and surface roughness. The mechanical interaction mechanism between atomic-scale tools and workpiece materials under complex stress states and high strain rates in the atomic precision machining process is a key scientific issue that needs to be urgently addressed in atomic precision machining. Therefore, the simultaneous realization of cutting, measurement and characterization in the atomic precision machining process will contribute to the research on the basic theory and process equipment of atomic precision cutting and machining, and promote my country's voice in the field of manufacturing science.

[0003] An atomic force microscope (AFM) probe is a microcantilever beam that is extremely sensitive to weak forces. The deformation of its tiny tip when interacting with a sample can be used to measure contact forces. Previous experimental studies have shown that using AFM probes can measure interaction forces with samples under transmission electron microscopy (TEM).

[0004] However, there is currently a lack of a method that can integrate atomic-resolution dynamic observation and atomic force probes to achieve the perception and measurement of information such as the evolution of workpiece surface quality, tool wear behavior, chip formation mechanism, and cutting force changes during atomic precision machining. Summary of the Invention

[0005] The purpose of the present invention is to provide a cutting force measurement method for atomic precision machining, which realizes cutting force measurement for atomic precision machining under TEM based on an AFM probe. The cutting force measurement range can be flexibly adjusted according to the magnification of the TEM and the elastic stiffness of the AFM probe, and is suitable for cutting force measurement of various materials.

[0006] To achieve the above object, the present invention provides a cutting force measurement method for atomic precision machining, comprising the following steps: Step 1: Determine the elastic stiffness of the atomic force microscope probe: determine the maximum bending displacement of the atomic force microscope probe based on the field of view of the transmission electron microscope at the experimental observation magnification, and determine the elastic stiffness of the atomic force microscope probe based on the range of the cutting force and the maximum bending displacement; Step 2: Pre-treat the AFM probe: Select a gold wire and fold it into a paper clip-shaped platform, with the tail of the gold wire perpendicular to the paper clip-shaped platform, and stick the AFM probe to the platform; Step 3: Prepare the sample to be cut: Use focused ion beam (FIB) micro-nano cutting technology to machine a micron slice on the surface of the sample to be cut, transfer the micron slice to the atomic force microscope probe, and machine a thin slice on top of the micron slice; Step 4: Prepare atomically sharp diamond tools: Use focused ion beam micro-nanocutting technology to process diamond micro-sheets and transfer them to semi-copper mesh stylus fingers. Process diamond nano-needle tips on the diamond micro-sheets and polish them. Use multi-degree-of-freedom nanomanipulation technology to cleave and fracture the diamond nano-needle tips. Step 5: Install the thin slice sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder: install the diamond tool and thin slice sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder respectively; Step 6: Use X-Nano multi-degree-of-freedom nanomanipulation technology to measure cutting forces: adjust the relative position and height of the thin slice sample and the diamond tool, and use the atomically sharp edge formed by the intersection of the diamond tool's nanotip cleavage surface and the surface to cut the thin slice sample; Step 7: Calculate the cutting force based on the transmission electron microscope video: Based on the images of each frame in the high-resolution video, calculate the displacement of the diamond tool and thin slice sample along the x-direction in different frames, and draw a curve showing the relationship between the cutting stroke and the cutting force.

[0007] Preferably, in step 1, under a given cutting force, the greater the elastic stiffness of the atomic force microscope probe, the smaller the bending displacement, and the elastic stiffness of the atomic force microscope probe is calculated according to the following formula: ; In the formula is the elastic stiffness of the AFM probe, is the maximum bending displacement allowed by the AFM probe within the field of view at the experimental observation magnification, is the cutting stroke, is the cutting force.

[0008] Preferably, in step 2, a gold wire of suitable diameter is selected, and one end is folded into a paper clip-shaped platform using tweezers and pliers. The tail of the gold wire is retained and bent so that it is perpendicular to the paper clip-shaped platform. The AFM probe is glued to the top of the platform using conductive silver paste. One end of the atomic force microscope probe is a cantilever beam, and the free end of the cantilever beam is facing the bending direction of the gold wire tail, and the atomic force microscope probe is perpendicular to the gold wire tail.

[0009] Preferably, in step three, the pretreated atomic force microscope probe and the gold wire are integrally glued to the FIB micro-nano cutting sample stage, and the atomic force microscope probe is made vertical, the cut sample is glued to the nail-type sample stage and placed on the sample stage simultaneously, and the focused ion beam micro-nano processing technology is used to flatten the free end of the cantilever on the atomic force microscope probe, and a micron sheet is processed on the surface of the cut sample, and the micron sheet is vertically transferred to the free end of the cantilever that has been flattened, and a number of thin slices are processed on the top of the micron sheet by using the focused ion beam.

[0010] Preferably, in step 4, a diamond micron sheet is prepared using {111} oriented diamond as the base material by using focused ion beam micro-nano processing technology and is vertically transferred to the stylus of the semi-copper mesh. A diamond nanotip is processed on the diamond micron sheet by using a focused ion beam. The diamond nanotip is polished using an ion thinning instrument. The semi-copper mesh with the diamond nanotip is mounted on the sample rod of an X-Nano multi-degree-of-freedom in-situ transmission electron microscope. Based on the sub-nanometer displacement control capability, the diamond nanotip is bent until cleavage fracture is achieved, thereby obtaining an atomically sharp diamond tool.

[0011] Preferably, in step five, the half-copper mesh with the diamond tool is mounted on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod, and the atomic force microscope probe with the thin slice sample and the gold wire are integrally mounted on the external frame of the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod, the free end of the cantilever beam faces the diamond tool on the half-copper mesh, and the half-copper mesh, the external frame and the thin slice sample are coplanar.

[0012] Preferably, in step six, under a transmission electron microscope, an X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod is used for displacement control, and the relative position and relative height of the thin slice sample and the diamond tool are adjusted so that the diamond tool is aligned with the thin slice sample and contacts one side of the thin slice being cut. Through the X-Nano control program, the nano-tip of the diamond tool is controlled to move at a uniform speed along the x-axis, and the atomic-level sharp edge formed by the intersection of the nano-tip cleavage surface and the surface of the diamond tool is used to cut the thin slice sample, thereby achieving atomic precision processing at the nanometer cutting depth.

[0013] Preferably, in step seven, the displacement of the diamond tool along the x direction in different frames is recorded as Calculate the displacement of the thin-film sample along the x direction under different frames and record it as , Cutting stroke The calculation is based on the displacement difference between the tool and the sample being cut at the same time. The formula is as follows: ; cutting force According to the displacement of the thin sample and the elastic stiffness of the cantilever beam The product calculation formula is as follows: ; Calculate cutting stroke at different times and cutting force , draw the relationship curve between cutting stroke and cutting force.

[0014] Therefore, the present invention adopts the above-mentioned cutting force measurement method for atomic precision machining, which has the following beneficial effects: 1. This invention integrates atomic-resolution dynamic observation and atomic force probe to achieve the perception and measurement of workpiece surface quality evolution, tool wear behavior, chip formation mechanism, and cutting force variation during atomic precision machining; 2. The present invention proposes a cutting force measurement method based on an AFM probe adapted to the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder to achieve atomic precision processing under TEM. The cutting force measurement range can be flexibly adjusted according to the magnification of the TEM and the elastic stiffness of the AFM probe, and is suitable for cutting force measurement of a variety of materials.

[0015] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the cutting force measurement principle of an embodiment of a cutting force measurement method for atomic precision machining according to the present invention; Figure 2 This is a schematic diagram of a gold wire bending structure according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of an AFM probe adhered to a gold wire platform according to an embodiment of the present invention; Figure 4 Schematic diagram of transferring a micrometer sheet to the top of the free end of an AFM cantilever according to an embodiment of the present invention; Figure 5 This is a schematic diagram of etching several thin slices on the top of a micron sheet according to an embodiment of the present invention; Figure 6 This is an SEM image of a diamond tool nanotip according to an embodiment of the present invention; Figure 7 This is a schematic diagram of a diamond tool nanotip after polishing according to an embodiment of the present invention; Figure 8 Schematic diagram of the process of forming a dissociation surface at the tip of a diamond tool nanotip according to an embodiment of the present invention, wherein a is a schematic diagram before formation, b is a diagram of the nanotip bending process, c is a diagram of the nanotip breaking process; d is a schematic diagram after the dissociation surface is formed; Figure 9 This is a schematic diagram of the structure after the thin slice sample and diamond tool are installed according to an embodiment of the present invention; Figure 10 Figure 1 is a continuous cutting process diagram of an embodiment of the present invention, wherein a is a sample diagram at the start time, b is a sample diagram at 32 seconds, c is a sample diagram at 53 seconds, d is a sample diagram at 65 seconds, e is a sample diagram at 77 seconds, and f is a sample diagram at 103 seconds; Figure 11 This is a cutting force-cutting stroke curve diagram of an embodiment of the present invention.

[0017] Reference numerals 1. External frame; 2. AFM probe; 3. Gold wire; 4. Half copper mesh; 5. Copper mesh fixture; 6. Movable end of the sample rod. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solutions and advantages disclosed in the embodiments of the present invention clearer, the embodiments of the present invention are further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the embodiments of the present invention and are not intended to limit the embodiments of the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. Examples of the embodiments are shown in the accompanying drawings, where the same or similar numbers throughout represent the same or similar elements or elements with the same or similar functions.

[0019] It should be noted that the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products or devices.

[0020] Like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not require further definition or explanation in subsequent drawings.

[0021] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting the present invention.

[0022] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0023] Example like Figure 1 As shown, the cutting force measurement method for atomic precision machining according to the present invention comprises the following steps: Step 1: Determine the elastic stiffness of the AFM probe 2. Limited by the field of view of the transmission electron microscope at a specific magnification, the bending deflection of the AFM probe 2 must be controlled within a certain range. Under a given cutting force, the greater the elastic stiffness of the AFM probe 2, the smaller the bending displacement. The AFM elastic stiffness is estimated using the following formula: ; In the formula To estimate the elastic stiffness of the AFM probe, is the maximum bending displacement allowed by AFM probe 2 within the field of view under the experimental observation magnification, is the estimated cutting stroke, To estimate the cutting force, the cutting force is mainly affected by the cutting depth, sample thickness, sample material properties, etc.

[0024] Step 2: Pre-treat the AFM probe 2. Figure 2 As shown, select a gold wire 3 with a diameter of 0.25mm, use tweezers and pliers to bend one end into a paper clip-shaped platform, the entire platform is 3.5mm long. Keep 15mm at the end of the gold wire 3, and bend the tail so that it is perpendicular to the paper clip-shaped platform. Figure 3 As shown, use conductive silver paste to adhere AFM probe 2 (PPP-NCST model) to the platform of gold wire 3. One end of AFM probe 2 is a cantilever beam. Note that the free end of the cantilever beam should face the platform and tail of gold wire 3, and ensure that AFM probe 2 and the tail of gold wire 3 are perpendicular.

[0025] Step 3: Prepare the sample to be cut. Glue the pre-treated AFM probe 2-gold wire 3 to the FIB micro-nano cutting sample stage, ensuring that the AFM probe 2 is vertical. Glue the sample to be cut to the nail-shaped sample stage and simultaneously place it on the FIB micro-nano cutting sample stage. Use the focused ion beam micro-nano processing technology to flatten the free end of the cantilever on the AFM probe 2, and process a micron sheet with a thickness of 1μm, a height of 5μm, and a length of 15μm on the surface of the cut sample. Transfer the micron sheet vertically to the free end of the flattened cantilever, as shown in the following figure. Figure 4 As shown. Subsequently, a series of thin slices with a height of 1 μm, a length of 2 μm, and a thickness of 100 nm were processed on the top of the micron slice by using a focused ion beam, as shown Figure 5 As shown. At a voltage of 5kV, the thin slice is blown by a focused ion beam to further reduce the thickness of the top of the micron slice to 30nm. It is necessary to ensure the flatness and uniform thickness of the top of the cut sample to reduce the change of cutting depth and cutting thickness with cutting stroke. The FIB micro-nano cutting sample stage and the nail-type sample stage are commonly used structures of FIB. The cut sample is a non-magnetic solid material that can be processed by FIB, such as metal materials such as gold, silver, copper, high entropy alloys, etc., and covalent materials such as silicon, silicon carbide, etc. The demonstration material in this embodiment is single crystal gold.

[0026] Step 4: Prepare atomically sharp diamond tools. Using {111} oriented diamond as the substrate material, a diamond micron sheet with a height of 5 μm, a width of 1 μm, and a thickness of 1 μm was prepared using focused ion beam micro-nano processing technology and vertically transferred to the stylus of the half-copper mesh 4. Then, a diamond nano-needle tip with a height of 1 μm and a diameter of 100 nm was processed on the diamond micron sheet using the focused ion beam, as shown in FIG. Figure 6 As shown. Using an ion thinning instrument, the diamond nano-needle tip is polished to a diameter of 30nm, as shown Figure 7 As shown. The semi-copper mesh 4 with diamond nano-needle tip is mounted on the sample rod of X-Nano multi-degree-of-freedom in-situ transmission electron microscope. Based on the sub-nanometer displacement control capability, the diamond nano-needle tip is bent until cleavage fracture, and an atomic-level sharp diamond tool can be obtained. The process of forming a dissociation surface at the tip of the diamond tool nano-needle tip is shown in the figure. Figure 8 As shown in the figure, the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder is used to support the sample. It adopts the existing structure and is used in conjunction with the transmission electron microscope.

[0027] Step five, install the thin slice sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. Install the half-copper mesh 4 with the diamond tool on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. The half-copper mesh 4 is connected to the active end 6 of the sample rod through the copper mesh clamp 5. Install the AFM probe 2-gold wire 3 with the thin slice sample on the external frame 1 of the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod. The installation requires that the free end of the cantilever beam must face the diamond tool on the half-copper mesh 4, and the half-copper mesh 4, the external frame 1 and the thin slice sample must be coplanar. After the installation is completed, the schematic diagram is as follows Figure 9 shown.

[0028] Step 6: Use X-Nano multi-degree-of-freedom nanomanipulation technology to measure cutting force. Figure 10 As shown in the figure, under a transmission electron microscope, an X-Nano multi-degree-of-freedom in-situ transmission electron microscope (TEM) sample holder is used for displacement control to adjust the relative position and height of the thin slice sample and diamond tool, ensuring that the diamond tool and the thin slice sample are aligned and in contact on one side of the slice being cut. The X-Nano control program controls the movement of the nanotip along the x-axis, maintaining a slow and uniform speed. The atomically sharp edge formed by the intersection of the nanotip cleavage surface and the surface is used to cut the sample, achieving atomic precision machining with cutting depths ranging from a few nanometers to tens of nanometers. Note that the X-Nano multi-degree-of-freedom in-situ TEM goniometer stage must not be moved at this time.

[0029] Step 7: Calculate the cutting force based on the transmission electron microscope video. According to the pictures of each frame in the high-resolution video, calculate the displacement of the tool and the sample in the x direction in different frames, which are recorded as and . Cutting stroke The calculation is based on the displacement difference between the tool and the sample being cut at the same time. The formula is as follows: ; cutting force According to the displacement of the cut sample and the elastic stiffness of the cantilever beam The product calculation formula is as follows: ; According to this method, the cutting stroke at different times is calculated and cutting force , and the “cutting stroke-cutting force” curve can be drawn, such as Figure 11 shown.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the same. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solutions of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A cutting force measurement method for atomic precision machining, characterized in that: The following steps are involved: Step 1: Determine the elastic stiffness of the atomic force microscope probe: determine the maximum bending displacement of the atomic force microscope probe based on the field of view of the transmission electron microscope at the experimental observation magnification, and determine the elastic stiffness of the atomic force microscope probe based on the range of the cutting force and the maximum bending displacement; Step 2: Pre-treat the AFM probe: Select a gold wire and fold it into a paper clip-shaped platform, with the tail of the gold wire perpendicular to the paper clip-shaped platform, and stick the AFM probe to the platform; Step 3: Prepare the sample to be cut: Use focused ion beam micro-nano cutting technology to machine a micron slice on the surface of the cut sample, transfer the micron slice to the atomic force microscope probe, and machine a thin slice on top of the micron slice; Step 4: Prepare atomically sharp diamond tools: Use focused ion beam micro-nanocutting technology to process diamond micro-sheets and transfer them to semi-copper mesh stylus fingers. Process diamond nano-needle tips on the diamond micro-sheets and polish them. Use multi-degree-of-freedom nanomanipulation technology to cleave and fracture the diamond nano-needle tips. Step 5: Install the thin slice sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder: install the diamond tool and thin slice sample on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder respectively; Step 6: Use X-Nano multi-degree-of-freedom nanomanipulation technology to measure cutting forces: adjust the relative position and height of the thin slice sample and the diamond tool, and use the atomically sharp edge formed by the intersection of the diamond tool's nanotip cleavage surface and the surface to cut the thin slice sample; Step 7: Calculate the cutting force based on the transmission electron microscope video: Based on the images of each frame in the high-resolution video, calculate the displacement of the diamond tool and thin slice sample along the x-direction in different frames, and draw a curve showing the relationship between the cutting stroke and the cutting force.

2. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step 1, under a given cutting force, the greater the elastic stiffness of the AFM probe, the smaller the bending displacement. The elastic stiffness of the AFM probe is calculated according to the following formula: ； In the formula is the elastic stiffness of the AFM probe, is the maximum bending displacement allowed by the AFM probe within the field of view at the experimental observation magnification, is the cutting stroke, is the cutting force.

3. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step 2, select a gold wire of appropriate diameter, use tweezers and pliers to fold one end into a paper clip-shaped platform, retain the tail of the gold wire, and bend the tail so that it is perpendicular to the paper clip-shaped platform, use conductive silver paste to stick the atomic force microscope probe to the top of the platform, one end of the atomic force microscope probe is a cantilever beam, the free end of the cantilever beam faces the bending direction of the gold wire tail, and the atomic force microscope probe is perpendicular to the gold wire tail.

4. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step three, the pretreated atomic force microscope probe and the gold wire are glued as a whole to the focused ion beam micro-nano cutting sample stage, and the atomic force microscope probe is made vertical, the cut sample is glued to the nail-shaped sample stage and simultaneously placed in the focused ion beam micro-nano cutting sample stage, and the focused ion beam micro-nano processing technology is used to flatten the free end of the cantilever on the atomic force microscope probe, and a micron sheet is processed on the surface of the cut sample, and the micron sheet is vertically transferred to the free end of the cantilever, and a number of thin slices are processed on the top of the micron sheet by the focused ion beam.

5. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step 4, a diamond micron sheet is prepared using {111} oriented diamond as the substrate material using focused ion beam micro-nano processing technology and vertically transferred to the stylus of the semi-copper mesh. A diamond nanotip is processed on the diamond micron sheet using a focused ion beam. The diamond nanotip is polished using an ion thinning instrument, and the semi-copper mesh with the diamond nanotip is mounted on the sample rod of an X-Nano multi-degree-of-freedom in-situ transmission electron microscope. Based on the sub-nanometer displacement control capability, the diamond nanotip is bent until cleavage fracture is achieved, resulting in an atomically sharp diamond tool.

6. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step five, the half-copper mesh with the diamond tool is mounted on the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder, and the atomic force microscope probe with the thin slice sample and the gold wire are mounted as a whole on the external frame of the X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample holder, with the free end of the cantilever beam facing the diamond tool on the half-copper mesh, and the half-copper mesh, the external frame and the thin slice sample are coplanar.

7. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step six, under a transmission electron microscope, an X-Nano multi-degree-of-freedom in-situ transmission electron microscope sample rod is used for displacement control to adjust the relative position and relative height of the thin slice sample and the diamond tool, so that the diamond tool is aligned with the thin slice sample and contacts one side of the thin slice being cut. Through the X-Nano control program, the nano-tip of the diamond tool is controlled to move at a uniform speed along the x-axis, and the atomic-level sharp edge formed by the intersection of the nano-tip cleavage surface and the surface of the diamond tool is used to cut the thin slice sample, achieving atomic precision processing at the nanometer cutting depth.

8. The cutting force measurement method for atomic precision machining according to claim 1, characterized in that: In step 7, the displacement of the diamond tool along the x direction in different frames is recorded as Calculate the displacement of the thin-film sample along the x direction under different frames and record it as , Cutting stroke The calculation is based on the displacement difference between the tool and the sample being cut at the same time. The formula is as follows: ； cutting force According to the displacement of the thin sample and the elastic stiffness of the cantilever beam The product calculation formula is as follows: ； Calculate cutting stroke at different times and cutting force , draw the relationship curve between cutting stroke and cutting force.

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