Interconnection quality detection method, device and equipment of gold bonding pad and storage medium

Abstract

The embodiment of the invention discloses a gold bonding pad interconnection quality detection method, device and equipment and a storage medium. The interconnection quality detection method comprises the following steps: acquiring a first potential of the surface of a to-be-detected gold bonding pad and a second potential of the surface of a reference gold bonding pad; and determining a work function of the to-be-tested gold pad according to the first potential and the second potential, wherein the work function is in negative correlation with the interconnection quality of the to-be-tested gold pad. According to the technical scheme, the interconnection quality of the gold bonding pad is represented through the work function, quantitative evaluation of the interconnection quality of the gold bonding pad is achieved, the detection difficulty of the interconnection quality of the gold bonding pad is reduced, and the detection efficiency of the interconnection quality of the gold bonding pad is improved. And on the other hand, related detection data of the reference gold bonding pad is introduced as a consideration factor for determining the work function of the to-be-detected gold bonding pad, interference of environmental factors on the work function detection result of the to-be-detected gold bonding pad can be eliminated, and the accuracy of gold bonding pad interconnection quality detection is improved.

Description

Technical Field

[0001] The present invention relates to the field of material detection, and in particular to a method, device, equipment and storage medium for detecting the interconnection quality of a gold pad. Background Art

[0002] Integrated circuit chips require interconnections to integrate materials with different functions to achieve the designed functionality. In the field of high-performance optoelectronic chips, gold pads are commonly used to implement solid-state diffusion of metal materials due to gold's excellent conductivity, strong heat resistance, strong oxidation resistance, and low resistance, making it suitable for high-frequency signal transmission. Although the comprehensive performance of gold pads is suitable for the signal transmission and reliability requirements of optoelectronic chips, their resistance to oxidation and corrosion also brings about another characteristic of the material itself: the pure gold surface is hydrophobic and has a high surface energy, making it easily adsorbed by short-chain organic molecules in the environment / air. These pollutants from the environment / air form a layer on the gold surface, changing the gold surface's wettability and hydrophobicity. Therefore, in the industry, plasma ion bombardment technology is often required to remove these surface contaminants to ensure the quality of the bonding interconnection.

[0003] While the aforementioned technologies have generally been effective in improving the quality of gold pad interconnects, poor bonding and delamination between the gold wire and pad still frequently occur during production. The core issue is the inability to quantitatively characterize the surface condition of the gold pads. Without this, the size and effectiveness of the process window cannot be determined. Furthermore, organic contaminants on the gold pad surface are too thin to be identified using existing mass spectrometry or imaging techniques, making this a major technical challenge in gold pad interconnect technology. Summary of the Invention

[0004] The embodiments of the present invention provide a method, device, equipment and storage medium for detecting the interconnection quality of gold pads, which realize the evaluation of the interconnection quality of gold pads and improve the efficiency and accuracy of the gold pad interconnection quality detection.

[0005] In a first aspect, an embodiment of the present invention provides a method for detecting the interconnection quality of a gold pad, comprising:

[0006] Obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad;

[0007] The work function of the gold pad to be tested is determined according to the first potential and the second potential, and the work function is negatively correlated with the interconnection quality of the gold pad to be tested.

[0008] Optionally, determining the work function of the gold pad to be tested according to the first potential and the second potential includes:

[0009] Determining the work function of the gold pad to be tested according to the first potential, the second potential and a preset corresponding relationship;

[0010] The preset corresponding relationship is:

[0011]

[0012] in, represents the work function of the gold pad to be tested; represents the work function of the reference gold pad; e represents the elementary charge; V1 represents the first potential; and V2 represents the second potential.

[0013] Optionally, obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad includes:

[0014] The first electric potential of the surface of the gold pad to be tested and the second electric potential of the surface of the reference gold pad are respectively obtained by a Kelvin probe force microscope.

[0015] Optionally, obtaining a first electric potential on the surface of the gold pad to be tested by using a Kelvin probe force microscope includes:

[0016] Applying a preset voltage between the probe of the Kelvin probe force microscope and the gold pad to be tested, and acquiring a vibration signal of the probe;

[0017] Applying a first compensation voltage between the probe and the gold pad to be tested through a feedback circuit so that the vibration signal of the probe is smaller than the vibration signal of the probe under any other compensation voltage;

[0018] The first compensation voltage is determined as the first potential.

[0019] Optionally, obtaining a second electric potential on the surface of the reference gold pad by using a Kelvin probe force microscope includes:

[0020] applying a preset voltage between a probe of the Kelvin probe force microscope and the reference gold pad, and acquiring a vibration signal of the probe;

[0021] applying a second compensation voltage between the probe and the reference gold pad through a feedback circuit so that the vibration signal of the probe is smaller than the vibration signal of the probe under any other compensation voltage;

[0022] The second compensation voltage is determined as the second potential.

[0023] Optionally, obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad includes:

[0024] Obtaining at least two first reference potentials of the surface of the gold pad to be tested and at least two second reference potentials of the surface of the reference gold pad;

[0025] The first potential is determined based on at least two of the first reference potentials, and the second potential is determined based on at least two of the second reference potentials.

[0026] Optionally, obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad includes:

[0027] A first electric potential on the surface of the gold pad to be tested and a second electric potential on the surface of the reference gold pad are respectively obtained within a preset time.

[0028] In a second aspect, an embodiment of the present invention further provides a device for detecting the interconnection quality of a gold pad, comprising:

[0029] An acquisition module, configured to acquire a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad;

[0030] A determination module is configured to determine a work function of the gold pad to be tested according to the first potential and the second potential, wherein the work function is negatively correlated with the interconnection quality of the gold pad to be tested.

[0031] In a third aspect, an embodiment of the present invention further provides a gold pad interconnect quality inspection device, comprising:

[0032] one or more processors;

[0033] a storage device for storing one or more programs,

[0034] When the one or more programs are executed by the one or more processors, the one or more processors implement the method for detecting the interconnection quality of gold pads according to any embodiment of the present invention.

[0035] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method for detecting the interconnection quality of the gold pads described in any embodiment of the present invention.

[0036] This embodiment obtains a first potential on the surface of a gold pad to be tested and a second potential on the surface of a reference gold pad, and determines the work function of the gold pad to be tested based on the first and second potentials. Because the work function is negatively correlated with the interconnect quality of the gold pad to be tested, the work function can be used to characterize the interconnect quality of the gold pad. This embodiment only requires non-contact or weak-contact detection of the first potential on the surface of the gold pad to be tested and the second potential on the surface of the reference gold pad to quantitatively assess the quality of the gold pad interconnection. This avoids physical damage to the gold pad to be tested, reduces the difficulty of testing the quality of the gold pad interconnection, and improves the efficiency of testing the quality of the gold pad interconnection. Furthermore, compared to solely determining the work function of the gold pad to be tested based on its own data, incorporating relevant test data of the reference gold pad as a factor in determining the work function of the gold pad to be tested can eliminate environmental factors from interfering with the work function test results of the gold pad to be tested, thereby improving the accuracy of gold pad interconnection quality testing.

[0037] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 This is a flow chart of a method for detecting the interconnection quality of a gold pad provided by an embodiment of the present invention;

[0040] Figure 2 This is a flow chart of another method for detecting the interconnection quality of gold pads provided by an embodiment of the present invention;

[0041] Figure 3 This is a flow chart of another method for detecting the interconnection quality of gold pads provided by an embodiment of the present invention;

[0042] Figure 4 This is a flow chart of another method for detecting the interconnection quality of gold pads provided by an embodiment of the present invention;

[0043] Figure 5 This is a flow chart of another method for detecting the interconnection quality of a gold pad provided by an embodiment of the present invention;

[0044] Figure 6 1 is a schematic structural diagram of a gold pad interconnection quality inspection device provided by an embodiment of the present invention;

[0045] Figure 7 The figure is a schematic structural diagram of a gold pad interconnection quality inspection device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0046] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0047] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0048] Integrated circuit chips require interconnects to integrate materials with different functions to achieve the designed functionality. From a materials perspective, interconnect technology is essentially achieved through 1) solid-state diffusion of metal materials (such as wire bonding, sintering bonding, etc.); 2) liquid-solid fusion of metal materials (such as solder balls, flip-chip reflow soldering); 3) metal deposition (such as through-silicon via interconnect technology, etc.); and 4) bonding technology based on organic adhesives (such as conductive adhesive interconnect technology, etc.). For interconnect technology based on solid-state diffusion of metal materials, gold pads are often used instead of aluminum or silver pads to prevent the soldering quality from being affected by oxides on the pad surface. However, gold pads are hydrophobic and have a high surface energy, making them easily adsorbed by short-chain organic molecules in the ambient air. These airborne pollutants form a layer on the gold pad surface, affecting the interconnect quality of the gold pad. The existing technology is unable to quantitatively characterize the surface condition of the gold pad, resulting in an inability to determine the size and effectiveness of the process window. As a result, when manufacturers use integrated circuit chips with gold pads with poor surface conditions (i.e., poor interconnection quality), poor welding between the gold wire and the gold pad frequently occurs, resulting in low product yield.

[0049] Figure 1This is a flow chart of a method for detecting the interconnection quality of a gold pad provided by an embodiment of the present invention. This embodiment is applicable to the case where the interconnection quality of the gold pad is detected, such as Figure 1 As shown, an embodiment of the present invention provides a method for detecting the interconnection quality of a gold pad, comprising:

[0050] S110 , obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad.

[0051] Specifically, the gold pad to be tested is a gold pad whose interconnection quality needs to be tested. In integrated circuits or microelectronic devices, the gold pad to be tested is usually used for electrical connection between the chip and the package. Whether there are contaminants on its surface directly affects the quality of the electrical connection. The reference gold pad can be a gold pad with known good interconnection quality or capable of achieving good electrical connection, which serves as a comparison benchmark for detecting the interconnection quality of the gold pad to be tested. By using a high-impedance voltmeter (such as an electrometer) or other precision potential measuring equipment, the first potential on the surface of the gold pad to be tested and the second potential on the surface of the reference gold pad are measured respectively. The surface potential of the gold pad is closely related to its surface electronic state. If there is contamination, damage or other defects on the surface of the gold pad, the surface potential will change. Therefore, the potential is a reflection of the electronic state of the material surface, and can sensitively capture small changes in the surface of the gold pad. By obtaining the first potential on the surface of the gold pad to be tested, the actual physical and chemical state information of the surface of the gold pad to be tested can be obtained, and by obtaining the second potential on the surface of the reference gold pad, the standard physical and chemical state information of the surface of the reference gold pad can be obtained.

[0052] S120 , determining a work function of the gold pad to be tested according to the first potential and the second potential, where the work function is negatively correlated with the interconnection quality of the gold pad.

[0053] Specifically, the work function refers to the minimum energy required to move an electron from the interior of a solid to the vacuum level (i.e., the free space outside the solid surface). Its physical meaning is the energy required for an electron to escape from the solid surface. The work function of the gold pad under test is calculated based on the first potential of the surface of the gold pad under test and the second potential of the surface of the reference gold pad. Since the magnitude of the work function reflects the ability of electrons to escape from the material surface, and the ability of electrons to escape from the material surface is directly related to the conductivity of the soldering interface of the gold pad under test, the work function of the gold pad under test can be used to characterize the interconnection quality of the gold pad under test.

[0054] It is understandable that the potential measurement of the material surface is greatly affected by environmental factors (such as temperature, humidity, electromagnetic field, etc.). Therefore, the first potential of the gold pad to be tested and the second potential of the reference gold pad are combined to determine the work function of the gold pad to be tested. Compared with directly determining the work function of the gold pad to be tested by the first potential of the gold pad to be tested, the introduction of relevant data of the reference gold pad can eliminate the interference of environmental factors on the work function test results, ensure the reliability of the work function, and improve the accuracy of the gold pad interconnection quality detection.

[0055] Furthermore, since most organic contaminants have relatively poor conductivity, when organic contaminants are present on the surface of the gold pad to be tested, its surface state will change, the resistance to electron escape will increase, and the transition of electrons will become more difficult, resulting in a larger minimum energy required for an electron to move from the inside of the gold pad to the vacuum level. In other words, the larger the work function, the higher the contact resistance between the gold pad to be tested and other devices when connected, resulting in a decrease in interconnection quality. Therefore, the larger the work function of the gold pad to be tested, the more contaminants there are on the surface of the gold pad to be tested, the worse the surface state, and the less ideal the interconnection quality. Conversely, the smaller the work function of the gold pad to be tested, the fewer contaminants there are on the surface of the gold pad to be tested, the better the surface state, and the better the interconnection quality. In other words, the work function is negatively correlated with the interconnection quality of the gold pad. This negative correlation provides a theoretical basis for evaluating the interconnection quality of the gold pad to be tested using the work function.

[0056] This embodiment obtains a first potential on the surface of a gold pad to be tested and a second potential on the surface of a reference gold pad, and determines the work function of the gold pad to be tested based on the first and second potentials. Because the work function is negatively correlated with the interconnect quality of the gold pad to be tested, the work function can be used to characterize the interconnect quality of the gold pad. This embodiment only requires non-contact or weak-contact detection of the first potential on the surface of the gold pad to be tested and the second potential on the surface of the reference gold pad to quantitatively assess the quality of the gold pad interconnection. This avoids physical damage to the gold pad to be tested, reduces the difficulty of testing the quality of the gold pad interconnection, and improves the efficiency of testing the quality of the gold pad interconnection. Furthermore, compared to solely determining the work function of the gold pad to be tested based on its own data, incorporating relevant test data of the reference gold pad as a factor in determining the work function of the gold pad to be tested can eliminate environmental factors from interfering with the work function test results of the gold pad to be tested, thereby improving the accuracy of gold pad interconnection quality testing.

[0057] Based on the above embodiments, Figure 2 This is a flow chart of another method for detecting the interconnection quality of gold pads provided by an embodiment of the present invention. Figure 2 The interconnect quality detection method of the gold pad shown in the figure further explains how to determine the work function of the gold pad to be tested based on the first potential and the second potential. Figure 2 As shown, the interconnection quality inspection method of the gold pad includes the following steps:

[0058] S210 , obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad.

[0059] S220 , determining the work function of the gold pad to be tested according to the first potential, the second potential, and a preset corresponding relationship.

[0060] Among them, the preset corresponding relationship is:

[0061]

[0062] in, represents the work function of the gold pad to be tested; represents the work function of the reference gold pad; e represents the elementary charge; V1 represents the first potential; V2 represents the second potential.

[0063] Specifically, The work function of the gold pad to be tested is negatively correlated with the interconnection quality of the gold pad. The value of the work function characterizes the interconnection quality of the gold pad to be tested. represents the work function of a reference gold pad, which is a gold pad with known good interconnect quality or capable of achieving good electrical connection. Its value can be 5.1 eV, which is the ideal work function when there is no organic contaminant on the gold pad surface. e represents the elementary charge, which is 1.602×10 -19 C; V1 represents the first potential, which reflects the electronic state of the surface of the gold pad to be tested; V2 represents the second potential, which reflects the electronic state of the surface of the reference gold pad.

[0064] Furthermore, based on the principle that organic contaminants on the surface of the gold pad will increase the resistance to electron escape, when there are organic contaminants on the surface of the gold pad to be tested, the work function of the gold pad to be tested is Should be the work function of the reference gold pad The sum of the extra energy E required to cause electrons to escape due to organic contaminants, where the reference gold pad is a gold pad with no organic contaminants on its surface. Organic contaminants usually form an insulating or weakly conductive film on the surface of the gold pad. This film will hinder the migration of electrons on the surface of the gold pad, causing changes in the surface charge distribution, thereby increasing the potential. Therefore, the difference (V1-V2) between the first potential on the surface of the gold pad to be tested and the second potential on the surface of the reference gold pad is the extra voltage required for the gold pad to be tested to cause electrons to escape compared to the reference gold pad. The extra voltage (V1-V2) multiplied by the elementary charge e can be used to obtain the extra energy E required for the gold pad to be tested to cause electrons to escape compared to the reference gold pad. The extra energy E is the work function of the gold pad to be tested caused by organic contaminants. Work function compared to the reference gold pad The relative change By referring to the work function of the gold pad Add relative change Calculate the work function of the gold pad to be tested That is, according to the first potential, the second potential and the preset corresponding relationship To realize the calculation of the work function of the gold pad to be tested.

[0065] This embodiment determines the work function of the gold pad under test based on the first potential, the second potential, and a preset correspondence. Simply by measuring the surface potential of the gold pad under test and a reference gold pad, the work function of the gold pad under test can be determined, and the interconnection quality of the gold pad can be characterized by the work function. This eliminates the need for complex experiments or equipment, reduces the difficulty of testing the interconnection quality of the gold pad, and improves the efficiency of testing the interconnection quality of the gold pad. Using the reference gold pad as the basis for calculating the work function of the gold pad under test eliminates the influence of environmental factors on the test results, thereby improving the accuracy of testing the interconnection quality of the gold pad.

[0066] Based on the above embodiments, Figure 3 This is a flow chart of another method for detecting the interconnection quality of gold pads provided by an embodiment of the present invention. Figure 3 The interconnect quality inspection method of the gold pad further explains how to obtain the first potential of the surface of the gold pad to be tested and the second potential of the surface of the reference gold pad. Figure 3 As shown, the interconnection quality inspection method of the gold pad includes the following steps:

[0067] S310 , respectively obtaining a first electric potential of the surface of the gold pad to be tested and a second electric potential of the surface of the reference gold pad using a Kelvin probe force microscope.

[0068] Specifically, Kelvin Probe Force Microscopy (KPFM) is a non-contact scanning probe microscopy technique based on electrostatic force. It combines the topography characterization capabilities of an atomic force microscope (AFM) with the potential measurement function, and can detect the potential distribution on the surface of a material with nanometer-scale spatial resolution. Its working principle is to scan a conductive probe over the sample surface, utilizing the capacitive coupling effect between the probe and the sample to detect probe vibrations or current changes caused by the electrostatic force. By applying a compensation voltage to eliminate the potential difference, the surface potential information can be directly obtained. The first potential of the surface of the gold pad to be tested and the second potential of the surface of the reference gold pad are obtained respectively through the Kelvin probe force microscope. The first potential and the second potential can be measured without contacting the sample, which improves the detection efficiency and avoids physical damage to the gold pad. On the other hand, the Kelvin probe force microscope can detect potential changes at the millivolt or even microvolt level, and is extremely sensitive to surface states (such as oxidation, contamination, adsorption, etc.). It can capture the slight potential difference on the surface of the gold pad, ensuring the data reliability of the first potential and the second potential, and improving the accuracy of the gold pad interconnection quality.

[0069] Optionally, obtaining a first electric potential on the surface of the gold pad to be measured by using a Kelvin probe force microscope includes:

[0070] Apply a preset voltage between the probe of the Kelvin probe force microscope and the gold pad to be tested, and obtain the vibration signal of the probe;

[0071] Applying a first compensation voltage between the probe and the gold pad to be tested through a feedback circuit so that the vibration signal of the probe is smaller than the vibration signal of the probe under any other compensation voltage;

[0072] The first compensation voltage is determined as a first potential.

[0073] Specifically, the gold pad to be tested is fixed on the sample stage of the Kelvin probe force microscope, and conductive tape or metal clamps are usually used to ensure good electrical contact between the gold pad to be tested and the sample stage. Then a preset DC bias (i.e., preset voltage) is applied between the probe of the Kelvin probe force microscope and the gold pad to be tested to initialize the potential difference between the probe and the gold pad to be tested. When the probe scans the surface of the gold pad to be tested, the electrostatic force generated by the potential difference causes the probe to vibrate slightly. This vibration signal is captured by the detection system of the Kelvin probe force microscope and converted into an electrical signal. By applying a preset voltage between the probe of the Kelvin probe force microscope and the gold pad to be tested, it can be ensured that a clear potential difference is formed between the probe and the gold pad to be tested, thereby stimulating a detectable electrostatic force. The acquisition of the vibration signal provides basic data for the subsequent adjustment of the compensation voltage, which is the key first step in achieving the first potential measurement. In addition, the application of the preset voltage helps to eliminate the influence of environmental noise on the measurement and improve the signal-to-noise ratio of the signal.

[0074] Furthermore, the feedback circuit of the Kelvin probe force microscope dynamically adjusts the compensation voltage between the probe and the gold pad to be tested based on the probe's vibration signal. As the compensation voltage gradually approaches the actual potential of the gold pad's surface, the potential difference between the probe and the pad decreases, the electrostatic force weakens, and the vibration amplitude of the probe also decreases. The compensation voltage at this time is used as the first compensation voltage. When the feedback circuit applies the first compensation voltage between the probe and the gold pad to be tested, the vibration signal of the probe is smaller than the vibration signal of the probe at any other compensation voltage. By applying the first compensation voltage through the feedback circuit, the potential difference between the probe and the gold pad to be tested can be accurately compensated, ensuring the accuracy of the first potential measurement result of the gold pad's surface to be tested. The minimization of the probe vibration signal corresponding to the first compensation voltage means that the potential difference between the probe and the gold pad to be measured is close to zero. At this time, the first compensation voltage is equal to the actual potential of the surface of the gold pad to be measured, and the first compensation voltage is then determined as the first potential of the surface of the gold pad to be measured. The first potential is determined based on the physical principle of electrostatic force and has high accuracy. At the same time, this method avoids the error of manual adjustment and improves the efficiency and accuracy of the first potential measurement.

[0075] Optionally, a second potential of the reference gold pad surface is obtained by Kelvin probe force microscopy, including:

[0076] Apply a preset voltage between the probe of the Kelvin probe force microscope and a reference gold pad, and obtain the vibration signal of the probe;

[0077] Applying a second compensation voltage between the probe and the reference gold pad through a feedback circuit so that the vibration signal of the probe is smaller than the vibration signal of the probe under any other compensation voltage;

[0078] The second compensation voltage is determined as the second potential.

[0079] Specifically, the reference gold pad is fixed on the sample stage of the Kelvin probe force microscope, and conductive tape or metal clamps are usually used to ensure good electrical contact between the reference gold pad and the sample stage. Then a preset DC bias (i.e., preset voltage) is applied between the probe of the Kelvin probe force microscope and the reference gold pad to initialize the potential difference between the probe and the reference gold pad. When the probe scans the surface of the reference gold pad, the electrostatic force generated by the potential difference causes the probe to vibrate slightly. This vibration signal is captured by the detection system of the Kelvin probe force microscope and converted into an electrical signal. By applying a preset voltage between the probe of the Kelvin probe force microscope and the reference gold pad, it can be ensured that a clear potential difference is formed between the probe and the reference gold pad, thereby stimulating a detectable electrostatic force. The acquisition of the vibration signal provides basic data for the subsequent adjustment of the compensation voltage, which is the key first step in realizing the second potential measurement. In addition, the application of the preset voltage helps to eliminate the influence of environmental noise on the measurement and improve the signal-to-noise ratio of the signal.

[0080] Furthermore, the feedback circuit of the Kelvin probe force microscope dynamically adjusts the compensation voltage between the probe and the reference gold pad based on the probe's vibration signal. When the compensation voltage gradually approaches the actual potential of the reference gold pad surface, the potential difference between the probe and the reference gold pad decreases, the electrostatic force weakens, and the vibration amplitude of the probe also decreases. The compensation voltage at this time is used as the second compensation voltage. When the feedback circuit applies the second compensation voltage between the probe and the reference gold pad, the vibration signal of the probe is smaller than the vibration signal of the probe at any other compensation voltage. By applying the second compensation voltage by the feedback circuit, the potential difference between the probe and the reference gold pad can be accurately compensated, ensuring the accuracy of the second potential measurement result of the reference gold pad surface. The minimization of the probe vibration signal corresponding to the second compensation voltage means that the potential difference between the probe and the reference gold pad is close to zero. At this time, the second compensation voltage is equal to the actual potential of the reference gold pad surface. The second compensation voltage is then determined as the second potential of the reference gold pad surface. The second potential is determined based on the physical principle of electrostatic force and has high accuracy. At the same time, this method avoids the error of manual adjustment and improves the efficiency and accuracy of the second potential measurement.

[0081] S320 , determining a work function of the gold pad to be tested according to the first potential and the second potential, where the work function is negatively correlated with the interconnection quality of the gold pad.

[0082] In this embodiment, a Kelvin probe force microscope is used to obtain a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad. No physical treatment is required on the surface of the gold pad to be tested and the surface of the reference gold pad, thereby avoiding mechanical damage or the introduction of new contamination, ensuring that the test results reflect the true surface state, and improving the efficiency and accuracy of gold pad interconnection quality inspection.

[0083] Based on the above embodiments, Figure 4 This is a flow chart of another method for detecting the interconnection quality of gold pads provided by an embodiment of the present invention. Figure 4 The interconnect quality inspection method of the gold pad further explains how to obtain the first potential of the surface of the gold pad to be tested and the second potential of the surface of the reference gold pad. Figure 4 As shown, the interconnection quality inspection method of the gold pad includes the following steps:

[0084] S410 , obtaining at least two first reference potentials of the surface of the gold pad to be tested and at least two second reference potentials of the surface of the reference gold pad.

[0085] Specifically, the surface potential of the gold pad to be tested and the reference gold pad is measured multiple times using a Kelvin probe force microscope or other potential measurement equipment to obtain the potential values ​​of at least two gold pads to be tested and at least two reference gold pads, respectively. The at least two first reference potential collection areas can cover different areas of the gold pad to be tested, and the at least two second reference potential collection areas can cover different areas of the reference gold pad. This reduces the impact of local defects or accidental errors on the results, more comprehensively reflects the overall potential distribution of the gold pad to be tested and the reference gold pad, avoids data deviations caused by anomalies in a single collection area, improves the universality of the test data, and provides a more reliable data foundation for the subsequent determination of the first potential and the second potential.

[0086] S420 : Determine a first potential according to at least two first reference potentials, and determine a second potential according to at least two second reference potentials.

[0087] Specifically, at least two values ​​are selected from the first reference potentials of multiple gold pads to be tested, and a final first potential is determined through data processing methods such as taking the average, median, or eliminating outliers. Similarly, at least two values ​​are selected from the second reference potentials of multiple reference gold pads, and a final second potential is determined through data processing methods such as taking the average, median, or eliminating outliers. Determining the first potential based on the at least two first reference potentials and determining the second potential based on the at least two second reference potentials can reduce the impact of single measurement errors or local defects on the detection of the first and second potentials, thereby improving the robustness of the test results.

[0088] S430 , determining a work function of the gold pad to be tested according to the first potential and the second potential, where the work function is negatively correlated with the interconnection quality of the gold pad.

[0089] This embodiment obtains at least two first reference potentials of the surface of the gold pad to be tested and at least two second reference potentials of the surface of the reference gold pad, determines the first potential based on the at least two first reference potentials, and determines the second potential based on the at least two second reference potentials. This can reduce the impact of single measurement errors or local defects on the detection of the first potential and the second potential, thereby improving the robustness of the detection results.

[0090] Based on the above embodiments, Figure 5 This is a flow chart of another method for detecting the interconnection quality of a gold pad provided by an embodiment of the present invention. Figure 5 The interconnect quality inspection method of the gold pad further explains how to obtain the first potential of the surface of the gold pad to be tested and the second potential of the surface of the reference gold pad. Figure 5 As shown, the interconnection quality inspection method of the gold pad includes the following steps:

[0091] S510 , obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad within a preset time.

[0092] Specifically, within a preset time, the surface potentials of the gold pad to be tested and the reference gold pad are rapidly measured using a Kelvin probe force microscope to obtain a first potential of the gold pad to be tested and a second potential of the reference gold pad, respectively. The preset time limit ensures the efficiency of the measurement process, avoids changes in the surface state of the gold pad to be tested and the reference gold pad, reduces the impact of environmental factors (such as temperature and humidity fluctuations, and electromagnetic field changes) on the potential data, ensures that the potential data of the gold pad to be tested and the reference gold pad are under the same environmental conditions, and improves the accuracy of subsequent work function calculations. Exemplarily, the preset time can be 1 hour.

[0093] S520 , determining a work function of the gold pad to be tested according to the first potential and the second potential, where the work function is negatively correlated with the interconnection quality of the gold pad.

[0094] This embodiment ensures that the first potential and the second potential are measured under the same environmental conditions by obtaining the first potential of the surface of the gold pad to be tested and the second potential of the surface of the reference gold pad within a preset time, eliminating errors introduced by instrument drift, reducing the impact of environmental factors on potential data, and improving the accuracy of interconnect quality detection.

[0095] Based on the same inventive concept, Figure 6 FIG. 1 is a schematic diagram of a structure of a gold pad interconnection quality detection device provided by an embodiment of the present invention. Figure 6 As shown, the interconnect quality detection device of the gold pad includes:

[0096] An acquisition module 610 is configured to acquire a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad;

[0097] The determination module 620 is configured to determine the work function of the gold pad to be tested according to the first potential and the second potential, where the work function is negatively correlated with the interconnection quality of the gold pad.

[0098] The film bonding strength detection device provided in the embodiment of the present invention can execute the film bonding strength detection method provided in any embodiment of the present invention, and has corresponding functional modules and beneficial effects of the execution method, which will not be described in detail here.

[0099] Figure 7 A schematic diagram of a gold pad interconnect quality inspection device 80 that can be used to implement an embodiment of the present invention is shown. The gold pad interconnect quality inspection device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The gold pad interconnect quality inspection device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0100] like Figure 7 As shown, the gold pad interconnect quality inspection device 80 includes at least one processor 81 and a memory, such as a read-only memory (ROM) 82 and a random access memory (RAM) 83, communicatively connected to the at least one processor 81. The memory stores a computer program executable by the at least one processor. The processor 81 can perform various appropriate actions and processes based on the computer program stored in the read-only memory (ROM) 82 or loaded from a storage unit 88 into the random access memory (RAM) 83. RAM 83 can also store various programs and data required for the operation of the gold pad interconnect quality inspection device 80. The processor 81, ROM 82, and RAM 83 are interconnected via a bus 84. An input / output (I / O) interface 85 is also connected to the bus 84.

[0101] Multiple components in the gold pad interconnection quality inspection device 80 are connected to an I / O interface 85, including an input unit 86, such as a keyboard, a mouse, etc.; an output unit 87, such as various types of displays, speakers, etc.; a storage unit 88, such as a magnetic disk, an optical disk, etc.; and a communication unit 89, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 89 allows the gold pad interconnection quality inspection device 80 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0102] The processor 81 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the processor 81 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 81 executes the various methods and processes described above, such as the vehicle runaway detection method.

[0103] In some embodiments, the gold pad interconnection quality inspection method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 88. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 80 via the ROM 82 and / or the communication unit 89. When the computer program is loaded into the RAM 83 and executed by the processor 81, one or more steps of the gold pad interconnection quality inspection method described above can be performed. Alternatively, in other embodiments, the processor 81 can be configured to execute the gold pad interconnection quality inspection method in any other appropriate manner (for example, by means of firmware).

[0104] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0105] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0106] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0107] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0108] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0109] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0110] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0111] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for detecting the interconnection quality of a gold pad, characterized in that: include: Obtaining a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad; The work function of the gold pad to be tested is determined according to the first potential and the second potential, and the work function is negatively correlated with the interconnection quality of the gold pad to be tested.

2. The method for detecting interconnection quality of gold pads according to claim 1, wherein: Determining the work function of the gold pad to be tested according to the first potential and the second potential includes: Determining the work function of the gold pad to be tested according to the first potential, the second potential and a preset corresponding relationship; The preset corresponding relationship is: in, represents the work function of the gold pad to be tested; represents the work function of the reference gold pad; e represents the elementary charge; V1 represents the first potential; and V2 represents the second potential.

3. The method for detecting interconnection quality of gold pads according to claim 1, wherein: Obtaining a first potential on the surface of a gold pad to be tested and a second potential on the surface of a reference gold pad, comprising: The first electric potential of the surface of the gold pad to be tested and the second electric potential of the surface of the reference gold pad are respectively obtained by a Kelvin probe force microscope.

4. The method for detecting interconnection quality of gold pads according to claim 3, wherein: Acquiring a first electric potential on the surface of the gold pad to be tested by a Kelvin probe force microscope includes: Applying a preset voltage between the probe of the Kelvin probe force microscope and the gold pad to be tested, and acquiring a vibration signal of the probe; Applying a first compensation voltage between the probe and the gold pad to be tested through a feedback circuit so that the vibration signal of the probe is smaller than the vibration signal of the probe under any other compensation voltage; The first compensation voltage is determined as the first potential.

5. The method for detecting interconnection quality of gold pads according to claim 3, wherein: Acquiring a second electric potential on the surface of the reference gold pad by using a Kelvin probe force microscope, comprising: applying a preset voltage between a probe of the Kelvin probe force microscope and the reference gold pad, and acquiring a vibration signal of the probe; applying a second compensation voltage between the probe and the reference gold pad through a feedback circuit so that the vibration signal of the probe is smaller than the vibration signal of the probe under any other compensation voltage; The second compensation voltage is determined as the second potential.

6. The method for detecting interconnection quality of gold pads according to claim 1, wherein: Obtaining a first potential on the surface of a gold pad to be tested and a second potential on the surface of a reference gold pad, comprising: Obtaining at least two first reference potentials of the surface of the gold pad to be tested and at least two second reference potentials of the surface of the reference gold pad; The first potential is determined based on at least two of the first reference potentials, and the second potential is determined based on at least two of the second reference potentials.

7. The method for detecting interconnection quality of gold pads according to claim 1, wherein: Obtaining a first potential on the surface of a gold pad to be tested and a second potential on the surface of a reference gold pad, comprising: A first electric potential on the surface of the gold pad to be tested and a second electric potential on the surface of the reference gold pad are respectively obtained within a preset time.

8. A gold pad interconnection quality detection device, characterized in that: include: An acquisition module, configured to acquire a first potential on the surface of the gold pad to be tested and a second potential on the surface of the reference gold pad; A determination module is configured to determine a work function of the gold pad to be tested according to the first potential and the second potential, wherein the work function is negatively correlated with the interconnection quality of the gold pad to be tested.

9. A gold pad interconnect quality inspection device, characterized in that: include: one or more processors; a storage device for storing one or more programs, When the one or more programs are executed by the one or more processors, the one or more processors implement the method for detecting the interconnection quality of the gold pad according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method for detecting the interconnection quality of the gold pad according to any one of claims 1 to 7 is implemented.

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