Connector

By rotating the connector as a whole 90 degrees and increasing the contact area between the shell side and the heat sink, the heat dissipation problem of the QSFP-DD module at high transmission rates is solved, achieving effective heat dissipation and performance improvement.

CN120686423APending Publication Date: 2025-09-23TYCO ELECTRONICS HOLDINGS (BERMUDA) NO 7 LTD
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Patent Information

Application Number
CN202511075674.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2019-05-31
Publication Date
2025-09-23

AI Technical Summary

Technical Problem

The existing QSFP-DD module has difficulty in effectively solving the heat dissipation problem at high transmission rates, resulting in excessively high temperatures, which affects the performance and life of optical components.

Method used

By rotating the connector as a whole at a 90-degree angle, the two side surfaces of the housing are connected to the heat sink, increasing the contact area between the heat sink base and the optical module, and fixing the heat sink to the housing through a fixing device to increase the heat dissipation area.

Benefits of technology

Effectively reduce connector temperature, improve heat dissipation, meet the temperature requirements of optical modules at high transmission rates, extend the life of optical components and improve transceiver performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a connector, which is arranged on a circuit board, and comprises a shell which is provided with a contact surface electrically connected with the circuit board, and a first outer side surface and a second outer side surface which are arranged on the two sides of the contact surface; the heat dissipation device is arranged on the first outer side face and / or the second outer side face and protrudes out of the shell; and the fixing device is used for fixing the heat dissipation device on the shell. According to the connector, the contact area between the cooling fin base of the connector and the optical module can be increased, and therefore the cooling effect is improved.
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Description

[0001] This application is a divisional application with application number 201910475003.3, application date May 31, 2019, and subject matter “CONNECTOR”. Technical Field

[0002] The present invention relates to a connector, in particular to a connector which is applied to a small pluggable module and increases the heat dissipation area. Background Art

[0003] With the development of network information, the amount of network processing and management data traffic continues to increase. Therefore, it is necessary to continuously develop more and newer communication transmission technologies to provide faster transmission speeds, longer transmission distances, and efficient and secure data transmission. In order to increase the port density when interconnecting with network devices, the development of miniaturized modules is usually the main focus. Therefore, the industry has developed a double-density Quad Small Form-factor Pluggable Double-Density (QSFP-DD) module to meet the above needs.

[0004] However, as transmission rates continue to increase, the energy used to transmit signals also increases, generating more and more heat. Generally, QSFP optical modules can operate normally at a maximum temperature of 70 degrees Celsius. If the temperature exceeds 70 degrees Celsius, the performance of the optical components will degrade and the lifespan will be shortened. QSFP-DD has a higher transmission rate and relatively lower temperature requirements. Therefore, to solve the heat dissipation problem, the roughness and flatness between the connector and the heat sink base are generally improved. A common solution is to open holes in the connector shell, but the current structural configuration cannot increase the number of holes. Therefore, the only option is to increase the contact area between the connector heat sink base and the optical module. How to increase the contact area between the connector heat sink base and the optical module to accelerate the heat dissipation effect is an urgent problem that the industry needs to solve. Summary of the Invention

[0005] An object of the present invention is to provide a connector which increases the contact area between the heat sink base of the connector and the optical module to improve the heat dissipation effect.

[0006] According to one aspect of the present invention, a connector is provided, which is arranged on a circuit board, and includes: a shell, the shell having a contact surface electrically connected to the circuit board, and a first outer side surface and a second outer side surface arranged on both sides of the contact surface; a heat dissipation device, the heat dissipation device is arranged on the first outer side surface and / or the second outer side surface and protrudes from the shell; and a fixing device, the fixing device fixes the heat dissipation device to the shell.

[0007] According to an exemplary embodiment of the present invention, the housing further has a top surface opposite to the contact surface, and a first buckling portion is respectively provided on the contact surface and the top surface.

[0008] According to another exemplary embodiment of the present invention, the fixing device is further provided with a second buckling portion, and the second buckling portion corresponds to the contact surface of the shell and the first buckling portion of the top surface.

[0009] According to another exemplary embodiment of the present invention, the first buckling portion is a protrusion, and the second buckling portion is a button hole.

[0010] According to yet another exemplary embodiment of the present invention, the contact surface is provided with a plurality of plug pins, and the plug pins are suitable for being electrically connected to the circuit board to fix the housing on the circuit board.

[0011] According to another exemplary embodiment of the present invention, the heat dissipation device has a base and a plurality of fish slices, wherein the plurality of fish slices are disposed on the base.

[0012] According to yet another exemplary embodiment of the present invention, the connector is further provided with a light guide pipe, and the light guide pipe is provided on the top surface of the housing.

[0013] According to yet another exemplary embodiment of the present invention, the connector is further provided with a plug-in interface, and the plug-in interface is suitable for plugging an optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is an exploded perspective view showing a connector according to an exemplary embodiment of the present invention;

[0015] Figure 2 is a combined perspective view showing a connector according to an exemplary embodiment of the present invention; and

[0016] Figure 3 FIG. 1 is a schematic diagram showing a connector placed on a circuit board according to an exemplary embodiment of the present invention.

[0017] Reference Signs List

[0018] 100 --- Connector

[0019] 10 --- Housing

[0020] 11 --- Contact surface

[0021] 12--- First outer side

[0022] 13 --- Second outer side

[0023] 14 --- Top surface

[0024] 15 --- First fastening part

[0025] 16 --- Connector pin

[0026] 17 --- Plug interface

[0027] 20 --- Heat dissipation device

[0028] 21 --- Heat sink base

[0029] 22 --- Fish

[0030] 30 --- Fixtures

[0031] 31 --- Second buckle

[0032] 40 --- Light guide

[0033] 50 --- Circuit board

[0034] 60 --- Optical module DETAILED DESCRIPTION

[0035] refer to Figure 1 , which shows an exploded perspective view of a connector according to an exemplary embodiment of the present invention. The connector 100 is provided on a circuit board 50 (see Figure 3 ), comprising: a shell 10, the shell having a contact surface 11 electrically connected to the circuit board 50, and a first outer side surface 12 and a second outer side surface 13 arranged on both sides of the contact surface 11; a heat dissipation device 20, the heat dissipation device is arranged on the first outer side surface 12 and / or the second outer side surface 13 and protrudes from the shell 10; a fixing device 30, the fixing device is suitable for fixing the heat dissipation device 20 to the shell 10.

[0036] Continue to refer Figure 1 In the illustrated embodiment, the housing 10 further has a top surface 14 opposite to the contact surface 11, and a first buckling portion 15 is provided on each of the contact surface 11 and the top surface 14. In addition, the fixing device 30 is provided with a second buckling portion 31 corresponding to the first buckling portion 15. The first buckling portion 15 is buckled to the second buckling portion 31 to buckle the heat sink 20 to the housing 10. In an exemplary embodiment of the present invention, the first buckling portion 15 is a protrusion, and the second buckling portion 31 is a buckling hole. The contact surface 11 is provided with a plurality of plug pins 16, which are suitable for electrically connecting to the circuit board 50 to fix the housing 10 to the circuit board 50. In addition, in the illustrated embodiment, the heat sink 20 includes a base 21 and a plurality of braids 22, and the plurality of braids 22 are provided on the base 21.

[0037] Figure 2 Shows a combined perspective view of a connector according to an exemplary embodiment of the present invention. Figure 1 and Figure 2 As shown, when assembling the connector 100 of the present invention, the shell 10 is first placed upright, at which time the contact surface 11 is located at the bottom of the shell 10, and the multiple plug pins 16 extend downward from the bottom of the shell 10, and then the heat sink 20 is placed on the left and right sides of the shell 10, that is, the heat sink base 21 of the heat sink 20 is set on the first outer side surface 12 and the second outer side surface 13, and the multiple tabs 22 extend to both sides and outward, and then the buckle hole of the second buckle portion 31 of the fixing device 30 is buckled with the protrusion of the first buckle portion 15 of the shell 10 to fix the heat sink 30 to the first outer side surface 12 and the second outer side surface 13 on the shell 10, thereby completing the assembly of the connector 100 of the present invention.

[0038] Continue to refer Figure 1 and Figure 2 The connector 100 further includes a light guide 40 disposed on the top surface 14 of the housing 10 for guiding the light source. In an exemplary embodiment of the present invention, the light guide 40 can be a single-lamp or dual-lamp type, and is not limited thereto.

[0039] refer to Figure 3 , which shows a schematic diagram of a connector placed on a circuit board according to an exemplary embodiment of the present invention. In this embodiment, the connector 100 is an optical transceiver module, and the connector 100 is a 1×1 small pluggable connector structure, so that when the connector 100 is in an upright position, it can meet the requirements of the specification. Figure 3 As shown, the connector 100 is further provided with a plug-in interface 17 , and the plug-in interface 17 is suitable for plugging an optical module 60 .

[0040] Continue to refer Figure 3In the present invention, the typically horizontal connector is rotated 90 degrees to create an upright position for connector 100. This shortens the width of the connector while increasing its height and increasing the contact area between connector 100 and the heat sink. This position adjustment conforms to the structural dimensions of a 1×1 small form factor pluggable connector while increasing the contact area between the connector and the heat sink, achieving effective heat dissipation. Therefore, in this embodiment, the connector 100 is positioned on the circuit board 50 through the electrical connection between the plug pins 16 and the circuit board 50. The first outer side surface 12 and the second outer side surface 13 of the housing 10 respectively contact and connect with the heat sink 20. The second latching portion 31 of the fixing device 30 latches with the first latching portion 15 of the housing 10 to secure the heat sink 20 to the housing 10. This increases the contact area between the connector 100 and the heat sink 20, while also increasing the heat dissipation area. This lowers the overall temperature of the connector 100 to a desired temperature and improves the transceiver performance of the connector 100.

[0041] The connector of the present invention is arranged upright by rotating the entire connector 90 degrees, so that the first outer side surface and the second outer side surface of the shell can be connected to the heat dissipation device, thereby increasing the contact area between the heat sink base of the connector and the optical module, and at the same time increasing the heat dissipation area, achieving an effective heat dissipation effect and improving the transmitting and receiving efficiency of the connector.

Claims

1. A connector, the connector being uprightly arranged on a circuit board, the connector comprising: a housing, the housing comprising a contact surface electrically connected to the circuit board, a top surface opposite to the contact surface, and a first outer side surface and a second outer side surface provided on both sides of the contact surface, the contact surface and the top surface both being provided with at least one first buckling portion; two heat sinks, the heat sinks being respectively provided on the first outer side surface and the second outer side surface and protruding from the housing, the heat sinks being in surface contact with the entire side surfaces of the first outer side surface and the second outer side surface; as well as A pair of fixing devices, each of the pair of fixing devices is provided with at least one second buckling portion, the pair of fixing devices fixes two heat dissipating devices to the housing from the first outer side and the second outer side, respectively, the second buckling portion corresponds to the contact surface of the housing and the first buckling portion of the top surface, The heat dissipation device can be fixed only by snap-fitting the first and second snap-fitting portions, and the fixing of the first and second snap-fitting portions does not affect the electrical connection between the contact surface and the circuit board.

2. The connector according to claim 1, wherein The first buckle portion is a protrusion, and the second buckle portion is a buckle hole. 3 . The connector according to claim 1 , further comprising a light guide, wherein the light guide is disposed on the top surface of the housing.

4. The connector according to claim 1, wherein The contact surface is provided with a plurality of plug pins, and the plug pins are suitable for being electrically connected to the circuit board so as to fix the housing on the circuit board.

5. The connector according to claim 1, wherein The heat dissipation device has a base and a plurality of fins, wherein the plurality of fins are formed on the base.

6. The connector according to claim 1, further comprising a plug-in interface, wherein the plug-in interface is suitable for plugging an optical module.