High-rigidity pressing and releasing device suitable for phased-array antenna

Abstract

The invention provides a high-rigidity pressing and releasing device suitable for a phased-array antenna. The high-rigidity pressing and releasing device comprises a base assembly, a daughter board connecting and supporting frame assembly and a pressing assembly. The base assembly is installed on a star platform, the top of the base assembly is connected with the bottom of the daughter board connecting and supporting frame assembly through a contact face, the pressing assembly is connected with the daughter board connecting and supporting frame assembly, the pressing assembly is connected with the base assembly, the base assembly is fixedly connected with the body-mounted subarray, and the daughter board connecting and supporting frame assembly is fixedly connected with the body-mounted subarray. And the daughter board connecting support frame assembly is fixedly connected with the inner unfolding sub-array and the outer unfolding sub-array respectively. The method has the beneficial effects that the manufacturing cost and the power supply complexity are not additionally increased on the basis that the number of pressing points is increased, the pressing rigidity is improved, and the universality is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of phased array antennas, and in particular relates to a high-rigidity compression and release device suitable for phased array antennas. Background Art

[0002] The SAR antenna is usually stowed in a π-type or an encircling stowage mode. The π-type is that the body-mounted subarray is directly fixed to the +Z (ground-facing) panel of the satellite, and the two deployed subarrays are stowed on the ±X side panels of the middle subarray. In the orbital state, the two deployed subarrays are deployed around the sides of the middle subarray in sequence. The encircling stowage mode is that the middle subarray is directly fixed to the +Z (ground-facing) panel of the satellite, and the two deployed subarrays are stowed above the middle subarray in an encircling manner. In the orbital state, the outer subarray is deployed first, and the inner subarray continues to deploy after the outer subarray is fully deployed. The three subarray antennas eventually form a coplanar surface.

[0003] The SAR antenna accounts for approximately 20% to 40% of the satellite's mass. As the most important component on a satellite, the SAR's compression and release mechanism plays a crucial role during launch. The compression and release mechanism provides sufficient compression and fixation for the antenna subarray during launch, resisting external loads from all directions and ensuring the safety of the SAR antenna during launch.

[0004] SAR antenna subarrays typically use four clamping locations, each of which can be simplified to a single clamping point. Dynamic analysis is used to appropriately adjust the spacing between these four clamping points to ensure high clamping stiffness when the antenna is stowed. When the SAR antenna subarray is long, even with four clamping points optimally located through dynamic analysis, this may not be sufficient to maintain high clamping stiffness when the antenna is stowed. This requires increasing the number of clamping points, but this increases manufacturing costs and power supply complexity. Summary of the Invention

[0005] In view of this, the present invention aims to propose a high-rigidity compression and release device suitable for phased array antennas to solve the problem that the process and manufacturing cost of the existing technology cannot meet the requirement of high compression stiffness of the antenna in the overall folded state.

[0006] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0007] A high-rigidity compression and release device suitable for a phased array antenna, comprising a base assembly, a sub-board connection support frame assembly, and a compression assembly;

[0008] The base assembly is mounted on the satellite platform, and the top of the base assembly is connected to the bottom of the sub-board connection support frame assembly through a contact surface, the clamping assembly is connected to the sub-board connection support frame assembly, and the clamping assembly is connected to the base assembly, the base assembly is fixedly connected to the body-mounted sub-array, and the sub-board connection support frame assembly is fixedly connected to the inner expansion sub-array and the outer expansion sub-array respectively;

[0009] The base assembly includes a support seat, a support seat insulation pad, two clamping frames, a memory alloy expander and a body-mounted sub-array insulation pad. The support seat is fixedly connected to the star platform through the mounting interface of the lower mounting surface, and a support seat insulation pad is provided between the support seat and the star platform. The support seat is installed with a memory alloy expander and two clamping frames through the mounting interface of the upper mounting surface. The memory alloy expander is installed to the middle of the upper mounting surface, and the two clamping frames are installed to both sides of the memory alloy expander, and the positions of the two are symmetrical. A shear-resistant cone sleeve is provided at one end of the clamping frame. The support seat is fixedly connected to the body-mounted sub-array through a right-angle mounting surface, and a body-mounted sub-array insulation pad is provided between the support seat and the body-mounted sub-array.

[0010] Furthermore, the sub-plate connection support frame assembly includes two lower clamping columns, a lower support frame and two inner expansion plate clamping nuts, one end of the lower clamping column is provided with an internal thread, and the other end of the lower clamping column is provided with a shear cone sleeve, one end of the inner expansion plate clamping nut is provided with an external thread, and the other end of the inner expansion plate clamping nut is provided with a shear cone sleeve, the two lower clamping columns are respectively located on both sides of the bottom of the lower support frame, the two inner expansion plate clamping nuts are respectively located on both sides of the top of the lower support frame, the lower clamping columns and the inner expansion plate clamping nuts are respectively inserted into the reserved holes of the lower support frame, and the two are threadedly connected inside the lower support frame, and the lower clamping columns and the inner expansion plate clamping nuts are fastened to the lower support frame.

[0011] Furthermore, the sub-plate connection support frame assembly also includes two upper clamping columns, an upper support frame and two outward expansion plate clamping nuts, one end of the upper clamping column is provided with an internal thread, and the other end of the upper clamping column is provided with a shear-resistant cone sleeve, the two upper clamping columns are respectively located on both sides of the bottom of the upper support frame, the two outward expansion plate clamping nuts are respectively located on both sides of the top of the upper support frame, one end of the outward expansion plate clamping nut is provided with an external thread, the upper clamping column and the outward expansion plate clamping nut are respectively inserted into the reserved holes of the upper support frame, and the two are threadedly connected inside the upper support frame, and the upper clamping column and the outward expansion plate clamping nut are fastened to the upper support frame.

[0012] Furthermore, the sub-board connection support frame assembly also includes two sub-board thermal insulation pads, one of which is arranged between the upper support frame and the outward-expanded sub-array, and the other is arranged between the lower support frame and the outward-expanded sub-array.

[0013] Furthermore, the upper compression column and the inner expansion plate pressure nut thereunder are connected via a shear-resistant cone sleeve, and the lower compression column and the compression frame thereunder are connected via a shear-resistant cone sleeve.

[0014] Furthermore, the clamping assembly includes a clamping rod, a clamping plate, an adjusting ball pad, a separation spring, a spring sleeve, a locking nut and a capture cap. External threads are respectively provided at both ends of the clamping rod. The clamping rod passes through the clamping plate, the adjusting ball pad, the separation spring and the spring sleeve. A spherical groove is opened in the middle of the clamping rod, and the adjusting ball pad is placed in the spherical groove. The top of the adjusting ball pad is connected to the bottom of the separation spring, and the top of the separation spring is connected to the spring sleeve boss. The spring sleeve base is inserted into the separation spring, and the top of the spring sleeve is connected to the locking nut. The locking nut is threadedly sleeved on one end of the clamping rod, and a capture cap is installed on the outside of the spherical groove of the clamping plate. The capture cap base is an inverted cylindrical cover, and the top of the cylindrical cover of the capture cap is located directly above the locking nut.

[0015] Furthermore, the contact surface of the shear-resistant cone sleeve is sprayed with a tungsten carbide high-friction coating.

[0016] Furthermore, the sub-plate connecting support frame assembly's expanded plate pressing nut is connected to the pressing plate bolt of the pressing assembly above it.

[0017] Furthermore, the clamping rod passes through the sub-plate to connect the support frame assembly, and the clamping rod is bolted to the memory alloy expander of the base assembly.

[0018] Compared with the prior art, the high-rigidity compression and release device for phased array antennas described in the present invention has the following beneficial effects:

[0019] (1) The single-point clamping force provided by the slotted bolt in the memory alloy expander is divided into two clamping points with a certain distance, so that each clamping release device can provide a pair of clamping forces.

[0020] (2) Adjust the relative position of the clamping and releasing device, change the structure of the clamping and releasing device, and adjust the spacing between the internal pairs of clamping points to provide a higher clamping stiffness while keeping the number of clamping and releasing devices unchanged (such as using 4), thereby being applicable to a wider range of antenna lengths.

[0021] (3) On the basis of increasing the clamping points and improving the clamping stiffness, the manufacturing cost and power supply complexity are not increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which constitute part of the present invention, are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0023] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the components of the overall structure according to an embodiment of the present invention in a separated state;

[0025] Figure 3 This is a schematic diagram of the components of the base assembly according to an embodiment of the present invention in a separated state;

[0026] Figure 4 This is a schematic diagram of a support base according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the separated components of the daughterboard connection support frame assembly according to an embodiment of the present invention;

[0028] Figure 6 This is a cross-sectional schematic diagram of the contact state of the shear-resistant cone sleeve according to an embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the components of the compression assembly according to an embodiment of the present invention in a separated state;

[0030] Figure 8 This is a cross-sectional schematic diagram of a compression assembly according to an embodiment of the present invention;

[0031] Figure 9 This is a schematic cross-sectional view of the overall structure in a compressed state according to an embodiment of the present invention;

[0032] Figure 10 This is a schematic cross-sectional diagram of the overall structure of the release process according to an embodiment of the present invention;

[0033] Figure 11 This is a schematic cross-sectional diagram of the overall structure in the released state according to an embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 1. Base assembly; 11. Support seat; 111. Lower mounting surface; 112. Upper mounting surface; 113. Right-angle mounting surface; 12. Support seat insulation pad; 13. Compression frame; 14. Memory alloy expander; 15. Body-mounted sub-array insulation pad; 2. Sub-board connection support frame assembly; 21. Lower compression column; 22. Lower support frame; 23. Inner expansion plate compression nut; 24. Upper compression column; 25. Sub-board insulation pad; 26. Upper support frame; 27. Outer expansion plate compression nut; 3. Compression assembly; 31. Compression rod; 32. Compression plate; 33. Adjustment ball pad; 34. Separation spring; 35. Spring bushing; 36. Locking nut; 37. Capture cap; 4. Star platform; 5. Body-mounted sub-array; 6. Inner expansion sub-array; 7. Outer expansion sub-array. DETAILED DESCRIPTION

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0038] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0039] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0040] like Figures 1 to 11 As shown, a high-rigidity compression and release device suitable for phased array antennas includes a base assembly 1, a daughterboard connection support frame assembly 2, and a compression assembly 3;

[0041] The base assembly 1 is mounted on the satellite platform 4, and the top of the base assembly 1 is connected to the bottom of the sub-board connection support frame assembly 2 through a contact surface, the clamping assembly 3 is connected to the sub-board connection support frame assembly 2, and the clamping assembly 3 is connected to the base assembly 1, the base assembly 1 is fixedly connected to the body-mounted sub-array 5, and the sub-board connection support frame assembly 2 is fixedly connected to the inner expansion sub-array 6 and the outer expansion sub-array 7 respectively.

[0042] The specific implementation is as follows:

[0043] In a preferred embodiment of the present invention, the base assembly 1 includes a support seat 11, a support seat 11 insulation pad, two clamping frames 13, a memory alloy expander 14 and a body-mounted sub-array 5 insulation pad 15. The support seat 11 is fixedly connected to the star platform 4 through the mounting interface of the lower mounting surface 111, and a support seat 11 insulation pad is provided between the support seat 11 and the star platform 4. The support seat 11 is installed with a memory alloy expander 14 and two clamping frames 13 through the mounting interface of the upper mounting surface 112. The memory alloy expander 14 is installed to the middle of the upper mounting surface 112, and the two clamping frames 13 are installed to both sides of the memory alloy expander 14, and the positions of the two are symmetrical. A shear-resistant cone sleeve is provided at one end of the clamping frame 13. The support seat 11 is fixedly connected to the body-mounted sub-array 5 through the right-angle mounting surface 113, and a body-mounted sub-array 5 insulation pad 15 is provided between the support seat 11 and the body-mounted sub-array 5. In this embodiment, as Figure 3 and Figure 4 As shown, the distance between the two pressing frames 13 can be adjusted by changing the mounting interface of the upper mounting surface 112 , and the thermal insulation pad 15 of the support base 11 and the body-mounted sub-array 5 play a role in thermal insulation protection.

[0044] In a preferred embodiment of the present invention, the sub-board connection support frame assembly 2 includes two lower clamping columns 21, a lower support frame 22 and two inner expansion plate clamping nuts 23, one end of the lower clamping column 21 is provided with an internal thread, and the other end of the lower clamping column 21 is provided with a shear cone sleeve, one end of the inner expansion plate clamping nut 23 is provided with an external thread, and the other end of the inner expansion plate clamping nut 23 is provided with a shear cone sleeve, the two lower clamping columns 21 are respectively located on both sides of the bottom of the lower support frame 22, and the two inner The expansion plate pressing nuts 23 are respectively located on both sides of the top of the lower support frame 22, and the lower clamping column 21 and the inner expansion plate pressing nut 23 are respectively inserted into the reserved holes of the lower support frame 22, and the two are connected by threads inside the lower support frame 22, and the lower clamping column 21 and the inner expansion plate pressing nut 23 are fastened to the lower support frame 22; the sub-board connection support frame assembly 2 also includes two upper clamping columns 24, an upper support frame 26 and two outer expansion plate pressing nuts 27, one end of the upper clamping column 24 is provided with an internal thread, and The other end of the upper clamping column 24 is provided with a shear cone sleeve, the two upper clamping columns 24 are respectively located on both sides of the bottom of the upper support frame 26, and the two outward expansion plate pressure nuts 27 are respectively located on both sides of the top of the upper support frame 26. One end of the outward expansion plate pressure nut 27 is provided with an external thread, and the upper clamping column 24 and the outward expansion plate pressure nut 27 are respectively inserted into the reserved holes of the upper support frame 26, and the two are connected by threads inside the upper support frame 26. The upper clamping column 24 and the outward expansion plate pressure nut 27 are fastened to The upper support frame 26; the sub-board connection support frame assembly 2 also includes two sub-board thermal insulation pads 25, one of which is located between the upper support frame 26 and the outward expansion sub-array 7, and the other sub-board thermal insulation pad 25 is located between the lower support frame 22 and the outward expansion sub-array 7; the upper clamping column 24 is connected to the inner expansion plate pressure nut 23 below it through a shear cone sleeve, and the lower clamping column 21 is connected to the clamping frame 13 below it through a shear cone sleeve; the contact surface of the shear cone sleeve is sprayed with a tungsten carbide high friction coating. In this embodiment, if Figure 5 and Figure 6 As shown, the lower clamping column 21, the upper clamping column 24 and one end of the inner expansion plate pressure nut 23 are provided with concave and convex shear-resistant cone sleeves to form adjacent fitting surfaces. The load in the normal direction of the contact surface can be borne along the axis of the two. The tangential friction force generated by the positive pressure on the contact surface is used to resist the tangential force of the contact surface. A tungsten carbide high-friction coating is sprayed on the adjacent fitting surfaces to increase the shear resistance. At the same time, a shear-resistant cone sleeve with a gap is introduced as the second line of defense against shear. Even if lateral displacement occurs due to insufficient friction, the displacement will be limited to a certain range to avoid damage to other components such as hinges. The sub-board thermal insulation pad 25 plays the role of thermal insulation protection.

[0045] In a preferred embodiment of the present invention, the clamping assembly 3 includes a clamping rod 31, a clamping plate 32, an adjusting ball pad 33, a separation spring 34, a spring sleeve 35, a locking nut 36 and a capture cap 37. The two ends of the clamping rod 31 are respectively provided with external threads. The clamping rod 31 passes through the clamping plate 32, the adjusting ball pad 33, the separation spring 34 and the spring sleeve 35. A spherical groove is provided in the middle of the clamping rod 31, and the spherical groove is used to place the adjusting ball pad 33. The top of the adjusting ball pad 33 is connected to the bottom of the separation spring 34, and the top of the separation spring 34 is connected to the spring sleeve 35 boss. The base of the spring sleeve 35 is provided with a plurality of screw threads. The body is penetrated by the separation spring 34, the top of the spring sleeve 35 is connected to the locking nut 36, the locking nut 36 is threadedly sleeved on one end of the clamping rod 31, and the capture cap 37 is installed on the outside of the spherical groove of the clamping plate 32. The base of the capture cap 37 is an inverted cylindrical cover, and the top of the cylindrical cover of the capture cap 37 is located directly above the locking nut 36. The clamping rod 31 passes through the sub-plate connected to the support frame assembly 2, and the clamping rod 31 is bolted to the memory alloy expander 14 of the base assembly 1; the sub-plate connected to the support frame assembly 2 is bolted to the expansion plate pressure nut 27 and the clamping plate 32 of the clamping assembly 3 above it. In this embodiment, as Figure 7 and Figure 8As shown, in the clamping state, the external thread at the lower part of the clamping rod 31 cooperates with the slotted bolt inside the memory alloy expander 14, the external thread at the upper part of the clamping rod 31 cooperates with the locking nut 36, and the adjusting ball pad 33 cooperates with the spherical groove feature reserved inside the clamping plate 32 to play a role of fine-tuning. The separation spring 34 is located between the adjusting ball pad 33 and the spring sleeve 35, which can provide the upward separation elastic force of the spring sleeve 35. The distance from the locking nut 36 to the contact surface of the adjusting ball pad 33 and the clamping plate 32 is large, and there is a spring in the middle. The sleeve 35, when the clamping rod 31 and the memory alloy expander 14 are tightened, a large restoring torque will be generated on the adjustment ball pad 33 to ensure that the clamping rod 31 can be perpendicular to the expanded sub-array. The capture cap 37 can limit the pop-up distance of the clamping rod 31, and the clamping rod 31 is pushed against the upper part of the capture cap 37 by the separation spring 34. If it is not limited, the clamping rod 31 will be quickly popped out by the separation spring 34 until the lower end of the clamping rod 31 contacts the clamping plate 32, and then it will quickly rebound due to inertia. The whole movement process is The risk of scratching the surrounding structure is that according to the thickness of the different expanded sub-arrays that need to be compressed, the pop-up distance of the clamping rod 31 can be controlled by adjusting the height of the capture cap 37 to ensure that it can be popped out and deployed smoothly. The pre-tightening force of the clamping rod 31 is used to bear the load in the normal direction of the installation surface. The external load perpendicular to the direction of the clamping rod 31 is mainly resisted by the tangential friction force generated by the positive pressure applied by the clamping rod 31 on the support between each plate. The memory alloy expander 14 is used for compression and release. Its core expander assembly consists of 363 parts: a memory alloy metal tube (unlocking column), a slotted bolt, and a locking nut. The slotted bolt passes through the metal tube to compress the plate to be separated, and is finally screwed into the locking nut 36, and a certain pre-tightening torque is applied to press the entire plate to be separated onto the support structure. This is a compressed state. When release is required, the memory alloy metal tube power supply cable is energized, and the memory alloy tube inside it is heated and stretched, pressing the slotted bolt until the slotted bolt breaks from its weak point (notch), thereby realizing the release and separation of the separation plate.

[0046] Example 1:

[0047] like Figure 9 As shown, when clamping, the connection and cooperation between the clamping rod 31, the memory alloy expander 14 and the locking nut 36 provide an overall downward pre-tightening force, and the pre-tightening force is transmitted to the clamping plate 32 through the spring sleeve 35 and the adjusting ball pad 33, and further through the external expansion plate clamping nut 27 in contact with both sides of the clamping plate 32, the clamping column screwed to the external expansion plate clamping nut 27, the internal expansion plate clamping nut 23 in contact with the clamping column, the clamping column screwed to the internal expansion plate clamping nut 23, the clamping frame 13 in contact with the clamping column, and the support seat 11 screwed to the clamping frame 13, the force is finally transmitted to the star platform 4, thereby improving the overall clamping stiffness.

[0048] like Figure 10 and Figure 11 As shown, when released, the first step is to energize the power supply cable of the memory alloy expander 14, and the memory alloy tube inside it is heated and elongated, pressing the slotted bolt until the slotted bolt breaks from its weak point (notch). At this time, the clamping rod 31, under the elastic force of the upper separation spring 34, carries the upper spring sleeve 35, the locking nut 36 and the broken end of the slotted bolt at the lower part and pops up together. At this time, the clamping rod 31 no longer provides the overall preload force, and further the inner expansion sub-array 6 and the outer expansion sub-array 7, under the action of the root torsion spring, carry the sub-plate connection support frame assembly 2 installed thereon and separate from the adjacent fitting surface, thereby realizing the release and expansion of the inner expansion sub-array 6 and the outer expansion sub-array 7.

[0049] The advantages and beneficial effects of the present invention are as follows:

[0050] (1) The single-point clamping force provided by the slotted bolt in the memory alloy expander is divided into two clamping points with a certain distance, so that each clamping release device can provide a pair of clamping forces.

[0051] (2) Adjust the relative position of the clamping and releasing device, change the structure of the clamping and releasing device, and adjust the spacing between the internal pairs of clamping points to provide a higher clamping stiffness while keeping the number of clamping and releasing devices unchanged (such as using 4), thereby being applicable to a wider range of antenna lengths.

[0052] (3) On the basis of increasing the clamping points and improving the clamping stiffness, the manufacturing cost and power supply complexity are not increased.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-rigidity compression and release device suitable for phased array antennas, characterized by: It comprises a base assembly (1), a sub-board connecting support frame assembly (2) and a pressing assembly (3); The base assembly (1) is mounted on the star platform (4), and the top of the base assembly (1) is connected to the bottom of the sub-board connection support frame assembly (2) through a contact surface, the pressing assembly (3) is connected to the sub-board connection support frame assembly (2), and the pressing assembly (3) is connected to the base assembly (1), the base assembly (1) is fixedly connected to the body-mounted sub-array (5), and the sub-board connection support frame assembly (2) is respectively fixedly connected to the inner expansion sub-array (6) and the outer expansion sub-array (7); The base assembly (1) comprises a support seat (11), a support seat (11) heat insulation pad, two pressing frames (13), a memory alloy expander (14) and a body-mounted sub-array (5) heat insulation pad (15); the support seat (11) is fixedly connected to the star platform (4) via a mounting interface of a lower mounting surface (111), and a support seat (11) heat insulation pad is provided between the support seat (11) and the star platform (4); the support seat (11) is mounted with a memory alloy through a mounting interface of an upper mounting surface (112). An expander (14) and two pressing frames (13), the memory alloy expander (14) is installed to the middle of the upper mounting surface (112), the two pressing frames (13) are installed to both sides of the memory alloy expander (14), and the two are symmetrically positioned, one end of the pressing frame (13) is provided with a shear-resistant cone sleeve, the support seat (11) is fixedly connected to the body-mounted sub-array (5) through the right-angle mounting surface (113), and a body-mounted sub-array (5) heat insulation pad (15) is provided between the support seat (11) and the body-mounted sub-array (5).

2. The high-rigidity compression and release device suitable for a phased array antenna according to claim 1, characterized in that: The sub-board connection support frame assembly (2) includes two lower clamping columns (21), a lower support frame (22) and two inner expansion plate clamping nuts (23), one end of the lower clamping column (21) is provided with an internal thread, and the other end of the lower clamping column (21) is provided with a shear cone sleeve, one end of the inner expansion plate clamping nut (23) is provided with an external thread, and the other end of the inner expansion plate clamping nut (23) is provided with a shear cone sleeve, the two lower clamping columns (21) are respectively located on both sides of the bottom of the lower support frame (22), and the two inner expansion plate clamping nuts (23) are respectively located on both sides of the top of the lower support frame (22), the lower clamping columns (21) and the inner expansion plate clamping nuts (23) are respectively inserted into the reserved holes of the lower support frame (22), and the two are connected by internal threads of the lower support frame (22), and the lower clamping columns (21) and the inner expansion plate clamping nuts (23) are fastened to the lower support frame (22).

3. The high-rigidity compression and release device suitable for a phased array antenna according to claim 2, characterized in that: The sub-board connection support frame assembly (2) also includes two upper clamping columns (24), an upper support frame (26) and two external expansion plate clamping nuts (27), one end of the upper clamping column (24) is provided with an internal thread, and the other end of the upper clamping column (24) is provided with a shear cone sleeve, the two upper clamping columns (24) are respectively located on both sides of the bottom of the upper support frame (26), the two external expansion plate clamping nuts (27) are respectively located on both sides of the top of the upper support frame (26), one end of the external expansion plate clamping nut (27) is provided with an external thread, the upper clamping column (24) and the external expansion plate clamping nut (27) are respectively inserted into the reserved holes of the upper support frame (26), and the two are connected by internal threads of the upper support frame (26), and the upper clamping column (24) and the external expansion plate clamping nut (27) are fastened to the upper support frame (26).

4. The high-rigidity compression and release device suitable for a phased array antenna according to claim 3, characterized in that: The sub-board connection support frame assembly (2) further comprises two sub-board thermal insulation pads (25), wherein one sub-board thermal insulation pad (25) is arranged between the upper support frame (26) and the outward-expanded sub-array (7), and the other sub-board thermal insulation pad (25) is arranged between the lower support frame (22) and the outward-expanded sub-array (7).

5. The high-rigidity compression and release device suitable for a phased array antenna according to claim 3, characterized in that: The upper compression column (24) is connected to the inner expansion plate compression nut (23) below it through a shear-resistant cone sleeve, and the lower compression column (21) is connected to the compression frame (13) below it through a shear-resistant cone sleeve.

6. The high-rigidity compression and release device suitable for a phased array antenna according to claim 1, characterized in that: The clamping assembly (3) includes a clamping rod (31), a clamping plate (32), an adjusting ball pad (33), a separation spring (34), a spring sleeve (35), a locking nut (36) and a capture cap (37). External threads are provided at both ends of the clamping rod (31). The clamping rod (31) passes through the clamping plate (32), the adjusting ball pad (33), the separation spring (34) and the spring sleeve (35). A spherical groove is provided in the middle of the clamping rod (31). The adjusting ball pad (33) is placed in the spherical groove. The top of the adjusting ball pad (33) The bottom of the separation spring (34) is connected, the top of the separation spring (34) is connected to the boss of the spring sleeve (35), the base of the spring sleeve (35) is inserted into the separation spring (34), the top of the spring sleeve (35) is connected to the locking nut (36), the locking nut (36) is threadedly sleeved on one end of the clamping rod (31), and a capture cap (37) is installed outside the spherical groove of the clamping plate (32), the base of the capture cap (37) is an inverted cylindrical cover, and the top of the cylindrical cover of the capture cap (37) is located directly above the locking nut (36).

7. The high-rigidity compression and release device suitable for a phased array antenna according to claim 5, characterized in that: The contact surface of the shear-resistant cone sleeve is sprayed with a tungsten carbide high-friction coating.

8. A high-rigidity compression and release device suitable for a phased array antenna according to claim 3 or 6, characterized in that: The outward expansion plate pressing nut (27) of the sub-plate connection support frame assembly (2) is bolted to the pressing plate (32) of the pressing assembly (3) above it.

9. The high-rigidity compression and release device suitable for a phased array antenna according to claim 6, characterized in that: The pressing rod (31) passes through the sub-plate connection support frame assembly (2), and the pressing rod (31) is bolted to the memory alloy expander (14) of the base assembly (1).

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