Heat dissipation structure and electronic equipment

Abstract

The embodiment of the invention provides a heat dissipation structure and electronic equipment, relates to the technical field of heat dissipation, and is used for solving the problem of serious local heating of the electronic equipment in related technologies. The heat dissipation structure comprises a first cover plate, a second cover plate and a liquid absorption structure. The first cover plate and the second cover plate are connected with each other to define a containing cavity. The liquid absorption structure is located in the containing cavity. The first cover plate comprises a first sealing layer, a first material layer and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate is provided with a plurality of buffer grooves arranged at intervals, and the positions, corresponding to the buffer grooves, in the first material layer comprise elastic deformation. The heat dissipation structure can be applied to the electronic equipment, the problem that local heating of the electronic equipment is serious is solved, and a screen can be protected.

Description

Heat dissipation structure and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on March 16, 2023, with application number 202310280857.2 and application name “A heat dissipation structure and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic equipment. Background Art

[0003] Electronic devices such as mobile phones, tablets, and laptops generate heat during operation. If this heat is not dissipated promptly and accumulates in localized areas within the device, it can cause the temperature to rise in that area, impacting the device's performance and user experience. In severe cases, it can even cause the device to malfunction and even damage. Therefore, a heat dissipation solution is urgently needed to address this heat dissipation issue in electronic devices.

[0004] Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a heat dissipation structure and an electronic device, so as to solve the problem of serious local heating of electronic devices in the related art.

[0006] In order to achieve the above objectives, the present invention provides the following solutions:

[0007] On the one hand, a heat dissipation structure is provided, comprising a first cover plate, a second cover plate, and a liquid absorption structure. The first cover plate and the second cover plate are interconnected to enclose a storage cavity. The liquid absorption structure is located within the storage cavity. The heat dissipation structure has a first area and a second area; the liquid absorption structure extends from the first area to the second area. The storage cavity also has a steam channel, which extends from the second area to the first area. The first cover plate comprises a first sealing layer, a first material layer, and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate has a plurality of buffer grooves arranged at intervals, and the positions of the first material layer corresponding to the buffer grooves include elastic deformation.

[0008] In the heat dissipation structure provided in the embodiment of the present application, the heat of the heating device can be dissipated in a timely manner, so that the electronic device is less likely to have serious local heating problems, and can improve the performance degradation and life shortening of each device in the area caused by overheating in the local area, as well as the problem of screen burn-in and display effect. In addition, since there are multiple buffer grooves on the first cover plate, and the multiple buffer grooves are arranged at intervals, the first cover plate has a good buffering and supporting effect. Since the first cover plate includes a first sealing layer, a first material layer and a second sealing layer, the first material layer is sandwiched between the first sealing layer and the second sealing layer, and the position of the corresponding buffer groove in the first material layer includes elastic deformation, the buffer groove of the first cover plate has better stress absorption and release capabilities, thereby further improving the compressive deformation and recovery capabilities of the first cover plate. For example, when the heat dissipation structure is applied to the aforementioned electronic device, for example, when the heat dissipation structure is squeezed by the aforementioned screen, since the first cover plate has excellent buffering and supporting effects, the buffer groove has better stress absorption and release capabilities, so that the first cover plate has better flexibility, and since the first material layer constrained by the first sealing layer and the second sealing layer will not have excessive rebound force, that is, the screen will not have failure problems such as light and shadow, black spots, molds, bright spots, green lines, and fragmentation due to the excessive rebound force of the first cover plate.

[0009] Furthermore, the presence of the first and second sealing layers on opposite sides of the first material layer effectively seals and protects the first material layer, thereby extending the lifespan and reliability of the first cover plate. Furthermore, the resulting relatively symmetrical structure improves the flatness of the first cover plate. For example, due to the more symmetrical mechanical parameters such as the modulus of the material along the thickness of the first cover plate, the first cover plate is less susceptible to curling. Furthermore, the unit weight of the first material layer can be less than that of the first sealing layer and less than that of the second sealing layer. This reduces the overall weight of the first cover plate compared to a first cover plate of the same thickness without the first material layer, achieving a lightweight design.

[0010] In some embodiments, the yield point strain of the first material layer is greater than the yield point strain of the first sealing layer and greater than the yield point strain of the second sealing layer; the first and second sealing layers corresponding to the buffer groove undergo plastic deformation. The plastic deformation of the first and second sealing layers can constrain the shape of the first material layer. In this case, the buffer groove can be manufactured by compression molding. This arrangement also simplifies the process and reduces production costs.

[0011] In some embodiments, at least a portion of the top opening of the buffer groove faces the side of the first cover plate away from the second cover plate. This configuration is beneficial to improving the buffer support effect of the first cover plate.

[0012] In some embodiments, the shape of any buffer groove includes any one of a circle, a polygon, a straight bar, and a wavy bar. Such a configuration can make the buffer groove play a better buffering and protective role.

[0013] In some embodiments, the first cover plate further includes a first filler located in at least one buffer groove, wherein the first filler is made of an organic polymer material. This configuration further enhances the buffering and protection capabilities of the first cover plate.

[0014] In some embodiments, the first cover plate further includes a second filler located in at least one buffer groove, wherein the second filler comprises a phase change energy storage material. This configuration further enhances the thermal conductivity of the first cover plate.

[0015] In some embodiments, the ratio of the thickness of the first material layer to the total thickness of the first cover plate is greater than or equal to 20%. This configuration allows the first cover plate to achieve significant lightweight benefits. Furthermore, when the multiple protruding structures are formed on the first cover plate by compression molding, wrinkles or even breakage are less likely to occur.

[0016] In some embodiments, the thickness of the first material layer is greater than or equal to 5 μm. This configuration allows the first cover plate to achieve significant lightweight benefits. Furthermore, when the plurality of protruding structures are formed on the first cover plate by compression molding, wrinkles or even breakage are less likely to occur.

[0017] In some embodiments, the thickness of the first sealing layer is equal to or substantially equal to the thickness of the second sealing layer. "Substantially equal" means that there can be a small deviation between the two. This small deviation can, for example, mean that the difference in thickness between the two is less than 5% of the thickness of the smaller one, or less than 10% of the thickness of the smaller one. This example also helps to maintain symmetry in the mechanical parameters of the first cover plate in the thickness direction, thereby reducing the risk of curling.

[0018] In some embodiments, the first sealing layer and the second sealing layer are made of the same material. This configuration helps to make the mechanical parameters of the first cover plate symmetrical in the thickness direction, thereby preventing the first cover plate from curling.

[0019] In some embodiments, the material of the first material layer includes an organic polymer material. Organic polymer materials include polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc. In this example, the first material layer can have good plasticity and higher elongation, so that the first cover plate formed is easy to perform shaping processes such as stamping or hot pressing and is not prone to cracking.

[0020] In some embodiments, the material of at least one of the first and second sealing layers includes at least one of metal and ceramic. The metal includes copper, such as pure copper or a copper alloy. In this example, the first and / or second sealing layers have relatively high structural strength and exhibit good sealing and toughness. This helps improve the structural strength of the first cover plate and increases its service life.

[0021] In some embodiments, the second cover plate includes a third sealing layer and a second material layer; the second material layer is located on a side of the third sealing layer away from the first cover plate; and the yield point strain of the second material layer is greater than the yield point strain of the third sealing layer.

[0022] In this embodiment, by providing the second cover plate with a second material layer, and by having a yield point strain greater than the yield point strain of the third sealing layer, the structural strength of the second cover plate is enhanced. For example, when etching structures such as micropillars and / or support pillars on the surface of the third sealing layer facing away from the second material layer, the base material thickness of the third sealing layer can be etched to less than or equal to 0.03 mm without wrinkling or cracking. Furthermore, the unit weight of the second material layer can be less than that of the third sealing layer, thereby reducing the overall weight of the second cover plate compared to a second cover plate of the same thickness that does not contain the second material layer, thereby achieving a lightweight design.

[0023] In some embodiments, the ratio of the thickness of the second material layer to the total thickness of the second cover plate is greater than or equal to 50%. This configuration allows the second cover plate to achieve significant lightweight benefits. Furthermore, when etching micropillars and / or support pillars, and other structures, or when the second cover plate is bent multiple times, wrinkles or even breaks are less likely to occur.

[0024] In some embodiments, the material of the second material layer includes an organic polymer material, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc. In this example, the second material layer can have good toughness, so that the second cover plate is not prone to wrinkling or even breaking.

[0025] In some embodiments, the material of the third sealing layer includes at least one of a metal and a ceramic. The metal includes copper, such as pure copper or a copper alloy. In this example, the third sealing layer has relatively high structural strength and good sealing and toughness. This helps improve the structural strength of the second cover plate and increases its service life.

[0026] In some embodiments, the second sealing layer is closer to the third sealing layer than the first sealing layer; the third sealing layer is made of the same material as the second sealing layer. This arrangement facilitates welding and sealing the third sealing layer and the second sealing layer, and thus facilitates welding and securing the first cover plate to the second cover plate.

[0027] In some embodiments, the second cover plate has a molded placement groove on the side closest to the first cover plate, and the liquid wicking structure is placed in the placement groove. Because in some examples, the second cover plate has a second material layer with greater toughness, and the placement groove formed by molding on the side of the second cover plate closest to the first cover plate is larger in area, the second cover plate still has high structural strength and is less likely to wrinkle or even break.

[0028] In some embodiments, the third sealing layer has a groove on one side close to the first cover plate, and the groove includes a first groove portion and a second groove portion, and the first groove portion is close to the bottom wall of the groove relative to the second groove portion. The second cover plate also includes a plurality of columnar structures located in the first groove portion, and the plurality of columnar structures are connected to the bottom wall. The liquid absorption structure includes a liquid absorption core, which is placed in the second groove portion; the plurality of columnar structures support the liquid absorption core. In this embodiment, since the second cover plate has a second material layer with greater toughness, the groove located in the third sealing layer can be formed by molding or etching. Regardless of the method, the structural strength of the second cover plate formed is still relatively high. In addition, when etching is used to form the groove, the plurality of columnar structures in the groove can also be directly etched. When molding is used to form the groove, the plurality of columnar structures in the groove can be formed by dispensing. Such a configuration is conducive to ensuring that the second cover plate has sufficient structural strength.

[0029] In some embodiments, the second cover plate includes at least two stacked metal layers, which is beneficial for improving the structural strength of the second cover plate, thereby improving the reliability of the entire heat dissipation structure.

[0030] In some embodiments, the at least two metal layers include any one of copper-steel, copper-titanium, copper-steel-copper, copper-titanium-copper, copper-aluminum-copper, copper-magnesium-copper, and copper (magnesium-aluminum alloy)-copper. The selected composite material has a high strength, which can significantly improve the overall mechanical performance of the heat dissipation structure, prevent deformation of the heat dissipation structure when squeezed, and improve the manufacturing yield of the heat dissipation structure and the reliability of the entire device.

[0031] On the other hand, another heat dissipation structure is provided, including a fourth sealing layer, a third material layer and a fifth sealing layer; along the first direction, the third material layer is located between the fourth sealing layer and the fifth sealing layer; the material of the third material layer includes at least one of a graphite material and a graphene material; the heat dissipation structure has a plurality of buffer grooves arranged at intervals; the position of the corresponding buffer groove in the third material layer includes elastic deformation and / or plastic deformation.

[0032] In another heat dissipation structure provided by an embodiment of the present application, since the third material layer comprises at least one of a graphite material and a graphene material, and the location of the third material layer corresponding to the buffer groove includes elastic deformation and / or plastic deformation, the heat dissipation structure has a good heat dissipation and temperature uniformity effect. In particular, heat accumulation is less likely to occur at the location of the heat dissipation structure corresponding to the buffer groove. In addition, since the fourth and fifth sealing layers are respectively provided on opposite sides of the third material layer, the third material layer can be effectively sealed and protected, making it less likely to collapse. This not only provides a good buffering and support function for the screen, preventing screen failure issues such as light and shadow, black spots, mold marks, bright spots, green lines, and cracks, but also prevents the heat dissipation structure's temperature uniformity from being weakened due to the collapse of the third material layer, thereby improving the life of the heat dissipation structure and enhancing the reliability of the first cover plate. Furthermore, since a relatively symmetrical structure can be formed, the flatness of the first cover plate can be improved. For example, due to the more symmetrical mechanical material parameters such as the modulus of the material along the thickness direction of the first cover plate, the heat dissipation structure is less likely to curl. In addition, the third material layer is lighter, which helps reduce the total weight of the heat dissipation structure and achieve a lightweight design.

[0033] In some embodiments, the thermal conductivity of the third material layer is greater than or equal to 400 W / (m·K). This configuration allows the heat dissipation structure to have a higher thermal conductivity efficiency.

[0034] In some embodiments, the material of at least one of the fourth sealing layer and the fifth sealing layer includes copper. This configuration can provide better sealing and protection for the third material layer and has higher heat dissipation efficiency.

[0035] In another aspect, an electronic device is provided, comprising: a screen and a heating device; and a heat dissipation structure as described in any of the above embodiments. The heat dissipation structure is located between the screen and the heating device.

[0036] The electronic device provided in the embodiment of the present application has a good heat dissipation effect due to the heat dissipation structure of any of the aforementioned embodiments, is less likely to have serious local heating problems, and can protect the screen to achieve a lightweight design.

[0037] In some embodiments, the electronic device further includes an adhesive layer positioned between the heat dissipation structure and the screen. The adhesive layer allows the heat dissipation structure to be bonded and secured to the screen. Furthermore, the buffer grooves provided on the heat dissipation structure prevent debonding and failure of the adhesive layer between the screen and the heat dissipation structure due to shear stress when the heat dissipation structure and the screen are bonded and secured. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0039] FIG2 is a schematic structural diagram of a heat dissipation structure provided in an embodiment of the present application;

[0040] FIG3 is a schematic cross-sectional view of the heat dissipation structure in FIG2 along the AA direction;

[0041] FIG4 is a schematic diagram of the operating principle and gas-liquid phase working medium flow of the heat dissipation structure provided in an embodiment of the present application;

[0042] FIG5 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application;

[0043] FIG6 is a schematic cross-sectional view of an electronic device provided by an embodiment of the present application when the screen is deformed;

[0044] FIG7 is a schematic structural diagram of a first cover plate provided in an embodiment of the present application when a buffer groove is not formed;

[0045] FIG8 is a stress-strain curve diagram of a first sealing layer (or second sealing layer) and a first material layer provided in an embodiment of the present application;

[0046] FIG9 is a schematic structural diagram of a jig and a first cover plate for molding a buffer groove according to an embodiment of the present application;

[0047] FIG10 is a schematic structural diagram of a first cover plate provided in an embodiment of the present application;

[0048] FIG11 is a schematic cross-sectional view of the first cover plate in FIG10 along the BB direction;

[0049] FIG12 is a schematic structural diagram of another first cover plate provided in an embodiment of the present application;

[0050] FIG13 is a structural diagram of another first cover plate provided in an embodiment of the present application;

[0051] FIG14 is a schematic structural diagram of another first cover plate provided in an embodiment of the present application;

[0052] FIG15 is a schematic diagram of a structure of a first cover plate and a screen in cooperation with each other provided in an embodiment of the present application;

[0053] FIG16 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present application;

[0054] FIG17 is a schematic structural diagram of another heat dissipation structure in an embodiment of the present application;

[0055] FIG18 is a schematic structural diagram of another heat dissipation structure in an embodiment of the present application;

[0056] FIG19 is a schematic structural diagram of another heat dissipation structure in an embodiment of the present application;

[0057] FIG20 is a schematic structural diagram of another heat dissipation structure in an embodiment of the present application;

[0058] FIG21 is a schematic diagram of the structure of a heat dissipation structure provided by an embodiment of the present application in conjunction with a screen and a heating device;

[0059] FIG22 is a schematic diagram of a combination of a first cover plate and a second wick provided in an embodiment of the present application;

[0060] FIG23 is a schematic structural diagram of another heat dissipation structure provided in an embodiment of the present application;

[0061] FIG24 is a schematic structural diagram of a heat dissipation structure and a screen provided in an embodiment of the present application. DETAILED DESCRIPTION

[0062] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0063] In the following, the terms "first," "second," etc., are used for descriptive convenience only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0064] In the embodiments of the present application, unless otherwise clearly specified or limited, the term "electrical connection" may refer to a direct electrical connection or an indirect electrical connection through an intermediate medium.

[0065] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0066] In the embodiments of the present application, "and / or" describes the association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0067] In the embodiments of the present application, directional indications such as up, down, left, right, front, and back, used to explain the structure and movement of various components of the present application are relative. These indications are appropriate when the components are in the positions shown in the figures. However, if the description of the component positions changes, these directional indications will also change accordingly.

[0068] An embodiment of the present application provides an electronic device, which may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a wearable device, a watch, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet. Exemplarily, the electronic device may be a portable electronic device. Exemplarily, the electronic device may be any electronic device with heat dissipation requirements.

[0069] Please refer to Figure 1, which is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of the present application. For ease of description, the width direction of electronic device 1000 is defined as the X1 axis; the length direction of electronic device 1000 is defined as the Y1 axis; and the thickness direction of electronic device 1000 is defined as the Z1 axis. It will be understood that the coordinate system of electronic device 1000 can be flexibly configured according to specific practical needs.

[0070] In the embodiment of FIG1 , electronic device 1000 is a mobile phone. For example, electronic device 1000 may include a screen 1001, a back cover 1002, and a heating element 1003. It should be understood that FIG1 and FIG2 merely schematically illustrate some components of electronic device 1000, and the actual shape, size, position, and configuration of these components are not limited by FIG1 and FIG2 or the accompanying figures. For example, in other examples, electronic device 1000 may not include screen 1001.

[0071] Screen 1001 is used to display images, videos, etc. Screen 1001 can be a flexible display screen or a rigid display screen. Exemplarily, screen 1001 can be any one of an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, and a liquid crystal display (LCD).

[0072] The back shell 1002 is used to protect the internal electronic components (such as the heating device 1003) of the electronic device 1000. Among them, the back shell 1002 may include a back cover and a middle frame, and the middle frame is fixed to the back cover. Exemplarily, the middle frame can be fixed to the back cover by adhesive. The middle frame can also be an integrally molded structure with the back cover, that is, the middle frame and the back cover are an integral structure. The screen 1001 can be connected to the middle frame. The space between the screen, the middle frame and the back cover can have components such as circuit boards and batteries. The circuit board can include a flexible circuit board and a rigid circuit board. Power devices such as chips can be provided on the circuit board.

[0073] Exemplarily, the heating device 1003 may be a chip on a circuit board, and the chip may be, for example, a processing chip, a memory chip, or the like. Of course, in some other embodiments, the heating device 1003 may also be other power devices in the electronic device 1000. Exemplarily, any device that generates heat when the electronic device 1000 is running may be the heating device 1003. In addition, the number of heating devices 1003 in the electronic device 1000 may be one, or two or more. When the number of heating devices 1003 is two or more, at least some of the heating devices 1003 may be of the same type, such as two processing chips, or two memory chips.

[0074] The inventors of this application have discovered that the presence of the heating element 1003 in the electronic device 1000 can cause severe local heating in the electronic device 1000. For example, in the embodiment of FIG1 , because the heating element 1003 is located in the upper half of the electronic device 1000, the heat of the heating element 1003 cannot be dissipated from the upper half to the lower half in a timely manner. This can cause the performance of various components in the upper half of the electronic device 1000 to decline, shortening their lifespans. Furthermore, it can easily burn the portion of the screen facing the heating element, affecting the display quality.

[0075] Based on this, some embodiments of the present application provide a heat dissipation structure 100. The heat dissipation structure 100 can be connected to the middle frame. Please refer to Figures 2 to 4. Figure 2 is a structural schematic diagram of the heat dissipation structure 100 provided in an embodiment of the present application, Figure 3 is a cross-sectional schematic diagram of the heat dissipation structure 100 along the AA direction in Figure 2, and Figure 4 is a schematic diagram of the operating principle and gas-liquid phase working medium flow of the heat dissipation structure 100 provided in an embodiment of the present application. The heat dissipation structure 100 provided in an embodiment of the present application includes a first cover plate 10, a second cover plate 20, and a liquid absorption structure 30.

[0076] The first cover plate 10 and the second cover plate 20 are connected to each other to enclose the accommodating cavity 50. For example, the edge 41 of the first cover plate 10 and the edge 42 of the second cover plate 20 can be welded together (for example, including the weld point T in FIG. 3 ). The welding method can use a low-temperature welding process such as brazing, cold welding, pressure welding, diffusion welding, ultrasonic welding, and electromagnetic pulse welding. The welding temperature is less than 320 degrees Celsius. Furthermore, solder can be used without solder or with an additional solder layer.

[0077] For ease of description, the width direction of the heat dissipation structure 100 is defined as the X2 axis, which can be parallel to the aforementioned X1 axis; the length direction of the heat dissipation structure 100 is defined as the Y2 axis, which can be parallel to the aforementioned Y1 axis; and the thickness direction of the heat dissipation structure 100 is defined as the Z2 axis, which can be parallel to the aforementioned Z1 axis. It is understood that the coordinate system setting of the heat dissipation structure 100 can be flexibly set according to specific actual needs.

[0078] The heat dissipation structure 100 includes a first region 01 and a second region 02. The first region 01 and the second region 02 can be arranged along the Y2 axis. It is understood that the first region 01 and the second region 02 can be adjacent (as shown in Figures 2 and 3) or not (as shown in Figure 4, located at opposite ends of the heat dissipation structure along the Y2 axis).

[0079] The liquid wicking structure 30 is located within the accommodating chamber 50. The liquid wicking structure can extend from the first region 01 to the second region 02. For example, there can be one or more liquid wicking structures 30. When there are multiple liquid wicking structures, the multiple structures can be arranged in parallel and spaced apart. In this case, each liquid wicking structure 30 can extend from the first region 01 to the second region 02. Furthermore, the accommodating chamber 50 also includes a steam channel 51, which extends from the second region 02 to the first region 01, thereby forming a circulation loop for the working medium (e.g., pure water, propanol, alcohol, etc.).

[0080] Exemplarily, the liquid wick structure 30 may include a wick 31. The wick 31 may be a mesh structure with dense through holes, such as a woven mesh or an etched mesh, such as a copper mesh, a stainless steel mesh, or an organic material woven mesh. The copper mesh may be sintered from copper powder or woven from copper wire. The wick 31 may have a capillary structure.

[0081] As another example, the liquid wicking structure 30 may include a plurality of micropillars 32 disposed on the first cover plate 10 and / or the second cover plate 20. For example, in the embodiment of FIG3 , a plurality of micropillars 32 are disposed on the inner wall surface of the second cover plate 20. Microgrooves 52 (e.g., a groove depth of less than or equal to 0.1 mm and a groove width of less than or equal to 1 mm) are defined between the plurality of micropillars 32, thus forming a capillary structure.

[0082] As another example, as shown in FIG3 , the wicking structure 30 can include both a wick 31 and a plurality of micropillars 32 located on the first cover plate 10 and / or the second cover plate 20, thereby forming a double-layer or triple-layer composite capillary structure. FIG3 illustrates a double-layer composite capillary structure including a wick and a plurality of micropillars 32 located on the second cover plate 20.

[0083] A capillary structure refers to the concave surface of a liquid in a capillary pore due to surface tension. This surface exerts a pulling force on the liquid below, causing it to move upward along the pore walls. This triggers the capillary phenomenon. A capillary structure can include multiple capillaries or microscopic grooves similar to capillaries. Once a liquid enters a capillary pore or microscopic groove within the capillary structure, it flows to the other end of the pore through capillary action, completing the transfer and return of the liquid.

[0084] Exemplarily, the heat dissipation structure 100 can be a vapor chamber (VC). A vapor chamber, also known as a temperature plate, is a vacuum cavity with a microstructure (capillary structure) on the inner wall and injected with a working fluid. The working principle of the vapor chamber is roughly the same as that of a heat pipe, which specifically includes four main steps: conduction, evaporation, convection, and condensation. The material of the vapor chamber can be copper, and the working fluid inside it can be pure water.

[0085] In some embodiments, multiple support columns 43 may be provided on the first cover plate 10 and / or the second cover plate 20. For example, in the embodiment of FIG4 , multiple support columns 43 are provided on the inner wall surface of the first cover plate 10. The support columns 43 are used to prevent the heat dissipation structure 100 from collapsing. Steam channels 51 may be formed between the multiple support columns. The steam channels 51 may have a depth greater than 0.1 mm and a width greater than 1 mm.

[0086] For example, the center distance between two adjacent support columns 43 may be greater than 2 mm. In this case, the heat dissipation structure 100 is less likely to collapse.

[0087] For example, in the first cover plate 10 and the second cover plate 20: when a plurality of support columns 43 are provided on the inner wall surface of one and a plurality of micro columns 32 are provided on the inner wall surface of the other, the plurality of support columns 43 can be designed to be opposite to the plurality of micro columns 32 (for example, one support column 43 is opposite to one micro column 32, or one support column 43 is opposite to two or more micro columns 32), so that the heat dissipation structure 100 has higher structural strength, the heat dissipation structure 100 is not easy to collapse and block the steam channel 51, and thus is not easy to fail and has higher reliability.

[0088] On this basis, for example, a wick 31 can be set between multiple support columns 43 and multiple micro columns 32. At this time, multiple support columns 43 can abut against the first surface of the wick 31, and multiple micro columns 32 can abut against the second surface of the wick 31, and the second surface is opposite to the first surface.

[0089] It can be understood that the above is only an example of the setting position of the support column 43 and the micro column 32. In other embodiments of the present application, the support column 43 can also be set on the second cover plate 20, and the micro column 32 can be set on the first cover plate 10; or, the support column 43 can also be set on the first cover plate 10 and the second cover plate 20 at the same time; or, the micro column 32 can also be set on the first cover plate 10 and the second cover plate 20 at the same time.

[0090] When the heat dissipation structure 100 provided in the embodiment of the present application is applied to an electronic device 1000, the heat dissipation structure 100 can be located between the screen 1001 and the heating device 1003. In this case, the first cover plate 10 can be closer to the screen 1001 and the second cover plate 20 can be closer to the heating device 1003; alternatively, the second cover plate 20 can be closer to the screen 1001 and the first cover plate 10 can be closer to the heating device 1003. This application does not impose any restrictions on this.

[0091] For example, as shown in FIG4 , the portion of the second cover plate 20 located in the first region 01 can be used to contact the heating device 1003 in the heat source region. When the heat generated by the heating device 1003 is conducted into the heat dissipation structure 200 through the portion of the second cover plate 20 in the first region 01, the liquid working medium in the heat dissipation structure 100 near the heating device 1003 absorbs the heat and rapidly vaporizes, simultaneously carrying away a large amount of heat. Utilizing the latent heat of steam, when the steam in the heat dissipation structure 100 diffuses from the high-pressure region (such as the first region 01, which is the high-temperature region) to the low-pressure region (such as the second region 02, which is the low-temperature region) through the steam channel 51, the steam rapidly condenses into a liquid and releases heat energy when it contacts the inner wall with a lower temperature. The condensed liquid working medium returns to the first region 01 through the capillary force of the liquid absorption structure (i.e., the capillary structure), thereby completing a heat conduction cycle and forming a two-way circulation system in which the working medium coexists in both vapor and liquid phases.

[0092] It can be seen that the heat dissipation structure 100 provided in the embodiment of the present application can dissipate the heat of the heating device 1003 in a timely manner. For example, it can dissipate the heat from the upper half of the electronic device 1000 in the embodiment of Figure 1 (in contact with the part of the heat dissipation structure 100 located in the first area 01) to the lower half (in contact with the part of the heat dissipation structure 100 located in the second area 02). This makes it less likely that the electronic device 1000 will have severe local heating problems, and can improve the performance degradation and shortened life of various devices in the area caused by overheating in the local area, as well as the problem of screen burn-in and affected display effect.

[0093] In addition, in other implementations, the heat dissipation structure 100 can be replaced with a graphite sheet and / or a graphene film. It is understandable that when both a graphite sheet and a graphene film are included, the two can be stacked along the Z1 axis. Among them, the graphite sheet and the graphene film have good thermal conductivity. In this case, the heat of the heating device 1003 can be effectively dissipated through the graphite sheet and / or the graphene film.

[0094] Refer to Figure 5, which is a cross-sectional schematic diagram of an electronic device 1000 provided in an embodiment of the present application. The electronic device 1000 includes a middle frame 81, a back cover 82, a screen 1001, a battery 83, a chip 84, a mainboard 85, and a heat sink 86. Among them, the middle frame 81 includes a frame 811 and a middle plate 812. One end of the frame 811 along the Z1 axis is connected to the screen 1001, and the other end is connected to the back cover 82. The middle plate 812 is connected and fixed to the inner side of the frame. The chip 84, the mainboard 85, and the battery 83 are located between the middle plate 812 and the back cover 82. The chip 84 is located on the mainboard 85, and the chip 84 is in contact with the middle plate 812. The battery 83 and the mainboard 85 are arranged along a set direction (such as the Y1 axis direction). The heat sink 86 is located between the middle plate 812 and the screen 1001. The heat sink 86 can be connected to the middle frame (for example, by bonding, lap welding, screw locking, etc.). For example, the heat sink 86 can be at least one of the aforementioned heat dissipation structure 100, a graphite sheet, and a graphene film. The heat of the chip 84 can be dissipated in the direction of the arrow.

[0095] Refer to Figure 6, which is a cross-sectional schematic diagram of an electronic device 1000 provided in an embodiment of the present application when the screen 1001 is deformed. The inventors of the present application further studied and found in combination with Figures 5 and 6 that when a heat sink 86 is not provided, due to the large air gap between the screen and the middle plate, the screen is prone to deformation when subjected to external force (such as extrusion force), resulting in a lack of support for the screen and easy to break. In some embodiments of the present application, a heat sink 86 is provided, which can have a certain buffering and supporting effect, and improve the above-mentioned problem to a certain extent. However, when graphite sheets and graphene films are used as heat sinks 86, since the graphite sheets and graphene films are very soft, when the screen is deformed and squeezed, the buffering and supporting capabilities are very weak, and there is still a great risk of screen breakage. When the heat dissipation structure 100 is used as the heat dissipation element 86, since the outer shell of the heat dissipation structure (the first cover plate and the second cover plate) is made of a metal material with a high elastic modulus, high hardness and low elongation (such as copper, copper alloy, stainless steel), when the screen is subjected to external impact and contacts the outer shell of the heat dissipation structure, the outer shell will generate a large rebound force on the screen, which makes the screen prone to failure problems such as light and shadow, black spots, stenciling, bright spots, green lines, and fragmentation.

[0096] Based on this, please refer to Figures 7, 8 and 9. Figure 7 is a schematic structural diagram of a first cover plate 10 provided in an embodiment of the present application when a buffer groove 70 is not formed. Figure 8 is a stress-strain curve diagram of a first sealing layer 11 (or second sealing layer 13) and a first material layer 12 provided in an embodiment of the present application. Figure 9 is a schematic structural diagram of a jig and a first cover plate 10 with a buffer groove 70 molded therein provided in some embodiments of the present application. In some embodiments of the present application, the first cover plate 10 includes a first sealing layer 11, a first material layer 12 and a second sealing layer 13, and the first material layer 12 is located between the first sealing layer 11 and the second sealing layer 13. The first cover plate 10 has a plurality of buffer grooves 70 on the surface facing away from the second cover plate 20, and the plurality of buffer grooves 70 are arranged at intervals. The position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation. It can be understood that the position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation here, which does not completely exclude the situation where the position corresponding to the buffer groove 70 in the first material layer 12 also includes local plastic deformation. The elastic deformation here can be determined by whether the first material layer 12 rebounds after removing the first sealing layer 11 and the second sealing layer 13. The rebound here does not require the first material layer 12 to rebound completely to a flat state.

[0097] In some examples, the yield point strain of the first material layer 12 is greater than the yield point strain of the first sealing layer 11, and greater than the yield point strain of the second sealing layer 13. The positions of the first sealing layer 11 and the second sealing layer 13 corresponding to the buffer groove include plastic deformation. Among them, the plastically deformed first sealing layer 11 and the second sealing layer 13 can constrain the shape of the first material layer 12. The strain may include surface strain ε = (area change / initial total area) * 100%, and the yield point strain refers to the strain corresponding to the yield point position, that is, the horizontal coordinate value corresponding to the yield point position as shown in Figure 8. It can also be understood as the dividing point between elastic deformation and plastic deformation. At this time, the buffer groove 70 can be made by compression molding. For example, as shown in FIG9 , the jig includes an upper pressing plate 91 and a lower pressing plate 92 . The upper pressing plate 91 includes a protrusion 911 , and the lower pressing plate 92 includes a recess 921 . When the upper pressing plate 91 and the lower pressing plate 92 are brought close to each other, the protrusion 911 and the recess 921 cooperate with each other to mold the buffer groove 70 on the first cover plate 10 . For example, as shown in FIG8 , after the protrusion 911 contacts the first cover plate 10 , it can go through three stages. In stage A, the first cover plate 10 does not undergo significant deformation; in stage B, the first sealing layer 11, the first material layer 12, and the second sealing layer 13 in the first cover plate 10 all undergo elastic deformation; and in stage C, the first material layer 12 in the first cover plate 10 still undergoes elastic deformation, while the first sealing layer 11 and the second sealing layer 13 undergo plastic deformation. Thus, the first sealing layer 11 and the second sealing layer 13 can be used to constrain the deformation state of the first material layer 12.

[0098] It should be noted that FIG9 and some subsequent figures are merely schematic diagrams of the buffer groove formed by compression molding. Of course, in other embodiments, other process methods may also be used (for example, of the two opposite surfaces of the first material layer 12 that undergoes elastic deformation, one surface is electroplated with a first sealing layer 11, and the other surface is electroplated with a second sealing layer 13, thereby limiting the first material layer 12 from returning to its original state) to form the buffer groove 70. Therefore, in some embodiments of the present application, there is no restriction on the formation method of the buffer groove 70. It is only necessary to ensure that the position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation, and the buffer groove 70 can absorb stress when the first cover plate 10 is deformed. In addition, the shape and size of any two buffer grooves 70 may be the same or different.

[0099] In the heat dissipation structure 100 provided in the embodiment of the present application, the first cover plate 10 has a plurality of buffer grooves 70, and the plurality of buffer grooves 70 are arranged at intervals, thereby providing the first cover plate 10 with a good buffering and supporting function. In addition, since the first cover plate 10 includes a first sealing layer 11, a first material layer 12, and a second sealing layer 13, and the first material layer 12 is sandwiched between the first sealing layer 11 and the second sealing layer 13, the positions of the first material layer 12 corresponding to the buffer grooves 70 include elastic deformation. Therefore, the buffer grooves 70 of the first cover plate 10 have better stress absorption and release capabilities, thereby further improving the compressive deformation and recovery capabilities of the first cover plate 10. Illustratively, when the heat dissipation structure 100 is applied to the aforementioned electronic device 1000, for example, when the heat dissipation structure 100 is squeezed by the aforementioned screen 1001, since the first cover plate 10 has excellent buffering and supporting effects, the buffer groove 70 has better stress absorption and release capabilities, making the first cover plate 10 more flexible, and since the first material layer 12 constrained by the first sealing layer 11 and the second sealing layer 13 will not have excessive rebound force, that is, the screen 1001 will not have failure problems such as light and shadow, black spots, molds, bright spots, green lines, and fragmentation due to the excessive rebound force of the first cover plate 10.

[0100] Furthermore, the presence of the first sealing layer 11 and the second sealing layer 13 on opposite sides of the first material layer 12 provides excellent sealing and protection for the first material layer 12, thereby extending the lifespan and reliability of the first cover plate 10. Furthermore, the resulting relatively symmetrical structure improves the flatness of the first cover plate 10. For example, due to the more symmetrical mechanical parameters such as the modulus of the material along the thickness direction of the first cover plate 10, the first cover plate 10 is less susceptible to curling. Furthermore, the unit weight of the first material layer 12 can be less than that of the first sealing layer 11 and less than that of the second sealing layer 13. This reduces the overall weight of the first cover plate 10 compared to a first cover plate 10 of the same thickness without the first material layer 12, achieving a lightweight design.

[0101] In some embodiments, the shape of any buffer groove 70 includes any one of a circle, a polygon, a straight bar and a wavy bar. Here, the shape of the buffer groove 70 can be understood as the shape of the positive projection of the buffer groove 70 on the X2-Y2 plane. Referring to Figures 10 to 13, Figure 10 is a structural schematic diagram of a first cover plate 10 provided in an embodiment of the present application, Figure 11 is a cross-sectional schematic diagram of the first cover plate 10 in Figure 10 along the BB direction, Figure 12 is a structural schematic diagram of another first cover plate provided in an embodiment of the present application, and Figure 13 is a structural schematic diagram of another first cover plate 10 provided in an embodiment of the present application. Among them, Figures 10 and 11 illustrate the shape of the buffer groove 70 as a circle, Figure 12 illustrates the shape of the buffer groove 70 as a hexagon, and Figure 13 illustrates the shape of the buffer groove 70 as a straight bar. The wavy bar can be formed into a wavy shape along the Y2 axis direction and / or the Z2 axis direction on the basis of the straight bar.

[0102] For example, referring to FIG11 , a rounded corner R1 can be provided at the bottom of the buffer groove 70, and a rounded corner R2 can be provided at the top. This configuration prevents the first cover plate 10 from breaking at the location where the buffer groove 70 is provided when the cover plate 10 bends. The circular shape of the buffer groove 70 in FIG11 is used as an example for illustration. The embodiments of FIG12 and FIG13 can also have structures similar to the rounded corners R1 and R2 described above.

[0103] In addition, in the embodiments of Figures 10 to 13 , all buffer grooves 70 in the first cover plate 10 are illustrated as having the same shape and size. However, this application is not limited to this. For example, the same first cover plate 10 may also have buffer grooves 70 of different shapes and sizes.

[0104] In some embodiments, the top openings of at least some of the buffer grooves 70 (e.g., one, two, or more buffer grooves 70) are oriented toward the side of the first cover plate 10 that faces away from the second cover plate 20. For example, in the embodiments of Figures 10, 12, and 13, the top openings of the buffer grooves 70 face the direction indicated by the Z2 axis. This arrangement can fully utilize the buffering effect of the buffer grooves 70. For example, at this time, the second cover plate 20 can be set to contact the screen 1001, and the first cover plate 10 is located on the side of the second cover plate 20 that faces away from the screen 1001. This helps to improve the screen imprint problem caused by the buffer grooves 70.

[0105] In other embodiments, the top openings of at least some of the buffer grooves 70 (e.g., one, two, or more buffer grooves 70) are oriented toward the side of the first cover plate 10 that is closest to the second cover plate 20. For example, the top openings of the buffer grooves 70 may be oriented in the direction indicated by the -Z2 axis. This configuration prevents screen stenciling while the first cover plate 10 contacts the screen 1001.

[0106] Please refer to FIG. 14 , which is a schematic structural diagram of another first cover plate 10 provided in an embodiment of the present application.

[0107] In some embodiments, the first cover plate 10 further includes: a first filler 44, which is located in at least one buffer groove 70. The material of the first filler 44 includes an organic polymer material. Such a configuration is conducive to further improving the buffer protection capability of the first cover plate 10. Among them, the organic polymer material includes at least one of polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), and polyamide (PA).

[0108] In some embodiments, the first cover plate 10 further includes a second filler 45 located in at least one buffer tank 70. The second filler 45 comprises a phase-change energy storage material. This configuration further enhances the thermal conductivity of the first cover plate 10. Phase-change energy storage materials refer to materials that change to different states (e.g., liquid to gas, liquid to solid, or solid to gas) at different temperatures. A capping layer may also be provided to confine the phase-change energy storage material within the buffer tank 70.

[0109] It is understood that FIG14 illustrates an example in which the first filler 44 is disposed in a portion of the buffer slots 70 of the first cover plate 10, and the second filler 45 is disposed in another portion of the buffer slots 70. However, in other embodiments, the first filler 44 may be disposed in all of the buffer slots 70, or the second filler 45 may be disposed in all of the buffer slots 70; or, the first filler 44 and the second filler 45 may be simultaneously disposed in the same buffer slot 70.

[0110] In some embodiments, refer to Figure 15, which is a structural diagram of a first cover plate 10 and a screen 1001 provided in an embodiment of the present application. The electronic device 1000 may further include an adhesive layer 14, which is located between the heat dissipation structure 100 and the screen 1001. Exemplarily, the adhesive layer 14 may be located on the side of the first cover plate 10 facing away from the second cover plate 20 (i.e., as shown in Figure 15), or located on the side of the second cover plate 20 facing away from the first cover plate 10 (not shown). By providing the adhesive layer 14, the first cover plate 10 (or the second cover plate 20) can be bonded and fixed to the screen 1001. In addition, when the adhesive layer 14 is located on the side of the first cover plate 10 facing away from the second cover plate 20, since the first cover plate 10 has a buffer groove 70, the buffer groove 70 can also be used to prevent the adhesive layer 14 between the screen 1001 and the first cover plate 10 from failing due to debonding due to shear stress. At the same time, when a phase change energy storage material is provided in the buffer groove 70 , the adhesive layer 14 may also be equivalent to the aforementioned capping layer, confining the phase change energy storage material within the buffer groove 70 .

[0111] In some embodiments, referring to Figures 9, 14 and 15, a plurality of protruding structures 71 are further provided on the first cover plate 10, wherein any protruding structure 71 protrudes in a direction close to the second cover plate 20. The protruding structure 71 here can serve as the aforementioned support column 43, or as the aforementioned microcolumn 32, or can also be a structure with other uses. The present application does not limit the specific size and use of the protruding structure 71. Exemplarily, the protruding structure 71 can be formed by compression molding (such as stamping, hot pressing and other shaping processes), and protrudes in a direction close to the second cover plate 20 (such as the -Z2 axis direction). Exemplarily, the protruding structure 71 can be molded by the jig in the embodiment of Figure 9. At this time, the protruding structure 71 can be formed together with the buffer groove 70, which is simple in process and lower in cost.

[0112] In addition, it should be noted that when the second sealing layer 13 is closer to the second cover plate than the first sealing layer 11, if it is necessary to etch support columns 43 on the surface of the first cover plate 10 on the side close to the second cover plate 20 and form a sufficient steam channel height, the second sealing layer 13 needs to be sufficiently thick, for example, greater than 0.15 mm, which will significantly increase the weight of the first cover plate 10. For the first cover plate 10 provided in some embodiments of the present application, a shaping process such as stamping or hot pressing can be used to form the buffer groove 70 and the protruding structure 71 (such as the support columns 43 or micro-pillars 32, etc.), making the first cover plate 10 more lightweight and reducing production costs.

[0113] For example, the material of the first sealing layer 11 may include metal or ceramic. The metal may be pure copper, a copper alloy, or the like. In this example, the first sealing layer 11 has relatively high structural strength and good sealing and toughness. This helps improve the structural strength of the first cover plate 10 and extends its service life.

[0114] Exemplarily, the material of the second sealing layer 13 may include metal or ceramic. The metal may be pure copper, a copper alloy, or the like. In this example, the second sealing layer 13 has relatively high structural strength and exhibits good sealing properties and toughness. This helps improve the structural strength of the first cover plate 10 and thus increases its service life.

[0115] Exemplarily, the first sealing layer 11 and the second sealing layer 13 are made of the same material. This configuration is conducive to making the mechanical parameters of the first cover plate 10 symmetrical in the thickness direction (Z2 axis), thereby preventing the first cover plate 10 from curling.

[0116] For example, the thickness of the first sealing layer 11 is equal to or substantially equal to the thickness of the second sealing layer 13. Here, "substantially equal" means that there may be a small deviation between the two. The small deviation may, for example, mean that the difference in thickness between the two is less than 5% of the thickness of the smaller one, or may also mean that the difference in thickness between the two is less than 10% of the thickness of the smaller one.

[0117] In this example, it is also beneficial to make the mechanical parameters of the first cover plate 10 in the thickness direction (Z2 axis) symmetrical, so that the first cover plate 10 is not prone to curling.

[0118] For example, the thermal conductivity of the first material layer 12 is greater than or equal to 400 W / (m·k). For example, the thermal conductivity of the first material layer 12 may be 400 W / (m·k), 500 W / (m·k), 600 W / (m·k), 800 W / (m·k), etc. This configuration allows the first cover plate 10 to have a higher thermal conductivity.

[0119] In some embodiments, the material of the first material layer 12 may include an organic polymer material, for example, the organic polymer material includes polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0120] In this example, the first material layer 12 can have better plasticity and higher elongation, so that the formed first cover plate 10 can be easily subjected to shaping processes such as stamping or hot pressing.

[0121] It is worth noting that the inventors of the present application have found that if the first cover plate 10 is directly provided to include only the first material layer 12, the material of the first material layer 12 includes an organic polymer material. Although the weight can be reduced, the organic polymer material is composed of organic macromolecules and the material itself has large pores. Therefore, the first cover plate 10 made directly of an organic polymer material cannot guarantee long-term airtightness and will have the problem of steam leakage. In addition, the organic polymer material is in direct contact with the working medium (such as water) inside the accommodating cavity 50, and is prone to chemical reactions to produce non-condensable gases. Non-condensable gases may accumulate in the cold area of ​​the accommodating cavity 50, thereby reducing its uniform temperature and heat dissipation performance. In the embodiment of the present application, the first material layer 12 is sandwiched between the first sealing layer 11 and the second sealing layer 13. On the one hand, it can effectively reduce the total weight of the first cover plate 10 and achieve a lightweight design; on the other hand, it can also play a good sealing and protective role for the first material layer 12, thereby improving the life of the first cover plate 10 and enhancing the reliability of the first cover plate 10.

[0122] In addition, in some examples, the material of the first material layer 12 in the first cover plate 10 is an organic polymer material (such as PI), and the materials of the first sealing layer 11 and the second sealing layer 13 are both metals (such as copper). Among them, the organic polymer material has a small elastic modulus, a large elongation, and good toughness, but has weak structural strength after plastic deformation and is prone to deformation. The metal has a large elastic modulus and a small elongation. It still has a high structural strength after plastic deformation, and has high hardness and is not easy to deform. The embodiment of the present application can form a composite material of the first sealing layer 11, the first material layer 12 and the second sealing layer 13 into a first cover plate 10 including a buffer groove 70 and a protruding structure 71 through a plastic forming process (including cold pressing or hot pressing, etc.). The first cover plate 10 combines the advantages of large elongation and good toughness of organic polymer materials and high strength of metals, has a good buffering effect, and can protect the screen 1001.

[0123] For example, the ratio of the thickness of the first material layer 12 (dimension along the Z2 axis) to the total thickness of the first cover plate 10 (dimension along the Z2 axis) is greater than or equal to 20%. This configuration allows the first cover plate 10 to achieve significant lightweighting benefits. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 through compression molding, wrinkles and even breakage are less likely to occur.

[0124] For example, the ratio of the thickness of the first material layer 12 (dimension along the Z2 axis) to the total thickness of the first cover plate 10 (dimension along the Z2 axis) is greater than or equal to 24%. This configuration further significantly reduces the weight of the first cover plate 10. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 through compression molding, wrinkles and even breakage are less likely to occur.

[0125] For example, the ratio of the thickness of the first material layer 12 (dimension along the Z2 axis) to the total thickness of the first cover plate 10 (dimension along the Z2 axis) is greater than or equal to 33%. This configuration further significantly reduces the weight of the first cover plate 10. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 through compression molding, wrinkles and even breakage are less likely to occur.

[0126] For example, the thickness of the first material layer 12 (dimension along the Z2 axis) is greater than or equal to 5 μm. This configuration allows the first cover plate 10 to achieve significant lightweight benefits. Furthermore, when the plurality of protruding structures 71 are formed on the first cover plate 10 through compression molding, wrinkles and even breakage are less likely to occur.

[0127] Exemplarily, the thickness of the first material layer 12 is greater than or equal to 15 μm. This configuration further enhances the lightweight benefits of the first cover plate 10. Furthermore, when the buffer groove 70 and the protruding structure 71 are formed on the first cover plate 10 by compression molding, wrinkles and even breakage are less likely to occur.

[0128] It should be noted that the existing three-layer composite flexible copper clad laminate (FCCL) includes a middle substrate (such as PI) and copper layers on both sides, and the thickness of the copper layer does not exceed 0.05 mm. In some examples, the existing three-layer composite flexible copper clad laminate can be directly used to form the buffer groove 70 and the protruding structure 71 by compression molding, thereby forming the first cover plate 10, without the need to customize raw materials with special thickness specifications. This will be more conducive to reducing the cost of raw materials, thereby providing a low-cost, easy-to-mass-produce, and lightweight first cover plate 10. For example, in the three-layer composite flexible copper clad laminate, the thickness of the upper and lower copper layers can be 12 μm, and the thickness of the middle layer can be 25 μm.

[0129] Table 1 shows the density values ​​of several raw materials used to make the first cover plate (or the second cover plate) in the embodiments of the present application.

[0130] Table 1

[0131] As can be seen from Table 1, when the present application adopts a three-layer composite flexible copper clad laminate (FCCL) to form the first cover plate 10, the average density of the first cover plate 10 is smaller (ie, 3000-6000), so it is easier to achieve a lightweight design.

[0132] Next, the second cover plate 20 provided in some embodiments of the present application is described.

[0133] Please refer to Figures 16 and 17. Figure 16 is a schematic diagram of one heat dissipation structure in an embodiment of the present application, and Figure 17 is a schematic diagram of another heat dissipation structure in an embodiment of the present application. The difference between Figures 16 and 17 lies in the structure of the second cover plate. In some embodiments, the second cover plate 20 includes a third sealing layer 21 and a second material layer 22. The second material layer 22 is located on the side of the third sealing layer 21 facing away from the first cover plate 10. The yield point strain of the second material layer 22 is greater than the yield point strain of the third sealing layer 21.

[0134] In this embodiment, by setting the yield point strain of the second material layer 22 to be greater than the yield point strain of the third sealing layer 21, the structural strength of the second cover plate 20 is improved, making the second cover plate 20 less prone to cracking. For example, when etching structures such as micropillars 32 and / or support pillars 43 on the surface of the third sealing layer 21 facing away from the second material layer 22, the base material thickness of the third sealing layer 21 can be etched to less than or equal to 0.03 mm without wrinkling or cracking. In addition, the unit weight of the second material layer 22 can be less than the unit weight of the third sealing layer 21. In this way, the total weight of the second cover plate 20 can be reduced compared to a second cover plate of the same thickness and without the second material layer 22, thereby achieving a lightweight design.

[0135] For example, in some embodiments of the present application, the heat dissipation structure 100 provided by the first cover plate 10 can have a design thickness of no less than 0.03 mm, the design thickness of the wick 31 can be no less than 0.14 mm, and the design thickness of the second cover plate 20 can be no less than 0.03 mm. In this case, the total thickness of the heat dissipation structure 100 can be 0.2 mm or greater, which is very thin. In some examples, the design thickness of the first cover plate 10 is 0.05 mm, the design thickness of the wick 31 is 0.15 mm, and the design thickness of the second cover plate 20 is 0.05 mm. In this case, the total thickness of the heat dissipation structure is 0.25 mm. In this example, the heat dissipation structure 100 is relatively thin, and the lightweight benefits are significant. It can be understood that in the embodiments of Figures 16 and 17, since the wick 31 is located within the second cover plate 20, the actual thickness of the second cover plate 20 is the design thickness of the second cover plate plus the design thickness of the wick 31. The total thickness of the heat dissipation structure 100 is the actual thickness of the second cover plate 20 plus the design thickness of the first cover plate 10. The "thickness" herein refers to the dimension along the Z2 axis.

[0136] Exemplarily, the material of the third sealing layer 21 may include metal or ceramic. The metal may be pure copper, a copper alloy, or the like. In this example, the third sealing layer 21 has relatively high structural strength and exhibits good sealing properties and toughness. This helps improve the structural strength of the second cover plate 20 and thus increases its service life.

[0137] For example, the second sealing layer 13 is closer to the third sealing layer 21 than the first sealing layer 11; the material of the third sealing layer 21 is the same as that of the second sealing layer 13. This configuration facilitates welding and sealing between the third sealing layer 21 and the second sealing layer 13, and also facilitates welding and fixing the first cover plate 10 and the second cover plate 20.

[0138] Exemplarily, the material of the second material layer 22 includes an organic polymer material, such as polyimide (PI), polypropylene (PP), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), polyethylene (PE), polypropylene carbonate (PPC), polyviny chloride (PVC), polyvinylidene chloride (PVdC), polystyrene (PS), polyamide (PA), etc.

[0139] In this example, the second material layer 22 can be made to have good toughness, so that the second cover plate 20 formed has a high structural strength and is less likely to wrinkle or even break.

[0140] For example, the ratio of the thickness of the second material layer 22 (dimension along the Z2 axis) to the total thickness of the second cover plate 20 (dimension along the Z2 axis) is greater than or equal to 50%. This configuration allows the second cover plate 20 to achieve significant lightweighting benefits. Furthermore, when etching structures such as the micropillars 32 and / or support pillars 43 on the second cover plate 20, wrinkles or even breakage are less likely to occur.

[0141] In some examples, as shown in FIG16 , the second cover plate 20 has a placement groove 72 formed by molding on one side thereof close to the first cover plate 10 , and the wick 31 is placed in the placement groove 72 . In this case, the second cover plate 20 may not be provided with micropillars 32 .

[0142] In this example, since the second cover plate 20 has a second material layer 22 with better toughness, and the placement groove 72 formed by molding on the side of the second cover plate 20 close to the first cover plate 10 has a larger area, the structural strength of the second cover plate 20 is still relatively high, and it is not easy to wrinkle or even break.

[0143] It should be noted that the existing two-layer composite flexible copper clad laminate (FCCL) includes a substrate (such as PI) and a copper layer on one side of the substrate, and the thickness of the copper layer does not exceed 0.05 mm. In some examples, the placement groove 72 can be directly formed by molding the existing two-layer composite flexible copper clad laminate to form the second cover plate 20, without the need to customize raw materials with special thickness specifications. This will further help reduce raw material costs, thereby providing a low-cost, easily mass-produced, and lightweight second cover plate 20.

[0144] As can be seen from Table 2 above, when the present application uses two layers of composite flexible copper clad laminate (FCCL) to form the second cover plate 20, the average density of the second cover plate 20 is smaller (eg, 3000 to 6000), making it easier to achieve a lightweight design.

[0145] In other examples, as shown in FIG17 , the third sealing layer 21 has a groove 74 on a side adjacent to the first cover plate 10. The groove 74 includes a first groove portion 741 and a second groove portion 742. The first groove portion 741 is closer to the bottom wall of the groove 74 than the second groove portion 742. The second cover plate 20 further includes a plurality of columnar structures 73 located in the first groove portion 741 and connected to the bottom wall. The wick 31 is placed in the second groove portion 742. The plurality of columnar structures 73 support the wick 31.

[0146] For example, the columnar structure 73 here may be the aforementioned support column 43 or microcolumn 32 .

[0147] For example, the columnar structure 73 can be formed by processes such as stamping, hot pressing, etching or electroplating.

[0148] In this embodiment, because the second cover plate 20 includes the more resilient second material layer 22, the groove 74 in the third sealing layer 21 can be formed by either compression molding or etching. Regardless of the method, the resulting second cover plate 20 maintains a high structural strength. Furthermore, when etching is used to form the groove 74, the multiple columnar structures 73 within the groove 74 can also be directly etched. Alternatively, when compression molding is used, the multiple columnar structures 73 within the groove 74 can be formed by dispensing glue. This arrangement helps ensure sufficient structural strength for the second cover plate 20.

[0149] In other embodiments, see Figure 18, which is a schematic diagram of another heat dissipation structure 100 in an embodiment of the present application. The second cover plate 20 in this heat dissipation structure 100 is etched from a metal material such as pure copper or a copper alloy. In this case, the base material thickness can be greater than 0.03 mm. This configuration is less likely to cause wrinkling, cracking, or deformation.

[0150] On this basis, for example, as shown in Figure 18, a groove 74 including a first groove portion 741 and a second groove portion 742 can be provided on the second cover plate 20, and a plurality of columnar structures 73 and a liquid absorbent core 31 can be provided in the groove 74. The specific setting method can be found in the above content and will not be repeated here.

[0151] In some other embodiments, the second cover plate 20 may be arranged in the same manner as the first cover plate 10, which will not be repeated here, as shown in FIG19 , which is a structural diagram of another heat dissipation structure 100 in an embodiment of the present application.

[0152] In some other embodiments, please refer to Figure 20, which is a structural schematic diagram of another heat dissipation structure 100 in the embodiment of the present application. The material of the second cover plate 20 of the heat dissipation structure 100 can use a double-layer / triple-layer metal composite (such as a first metal layer 201, a second metal layer 202 and a third metal layer 203), such as copper-steel, copper-titanium, copper-steel-copper, copper-titanium-copper, copper-aluminum-copper, copper-magnesium-copper, copper (magnesium-aluminum alloy)-copper, etc. The composite material has a large strength and can greatly improve the overall mechanical structural performance of the heat dissipation structure 100, avoid deformation of the heat dissipation structure 100 when it is squeezed, and improve the manufacturing yield of the heat dissipation structure 100 and the reliability of the whole machine. In addition, it is worth noting that the double-layer / triple-layer metal composite provided in the embodiment of the present application is more suitable for the low-temperature process (such as 300-400 degrees Celsius) used by the first cover plate 10, that is, after the second cover plate 20 is formed, the second cover plate 20 is not easy to soften and can have a higher structural strength.

[0153] On this basis, for example, a plurality of columnar structures 73 can be pressed out on the second cover plate 20 through a shaping process such as stamping or hot pressing. At this time, the columnar structure 73 is equivalent to the support column 43, and a steam channel is formed between the plurality of columnar structures 73. The columnar structure 73 can make the heat dissipation structure 100 have a higher structural strength, so that the heat dissipation structure 100 is not easy to collapse and block the steam channel, and is therefore not easy to fail and has higher reliability.

[0154] In the above, the first cover plate 10, the second cover plate 20 and the absorbent core 31 (hereinafter referred to as the first absorbent core) are introduced, and the second absorbent core and the third absorbent core will be introduced below.

[0155] In some embodiments, referring to Figures 21 and 22, Figure 21 is a schematic diagram of the structure of a heat dissipation structure 100 provided in an embodiment of the present application in conjunction with a screen 1001 and a heating device 1003, and Figure 22 is a schematic diagram of the combination of a first cover plate 10 and a second wick 33 provided in an embodiment of the present application. The adhesive layer 14 can be located on the side of the second cover plate 20 facing away from the first cover plate 10, i.e., the adhesive layer 14 is bonded between the second cover plate 20 and the screen 1001. Micropillars 32 and a first wick (i.e., wick 31) are disposed within the second cover plate 20. Furthermore, a second wick 33 is disposed within the vapor channel 51 between the second cover plate 20 and the first cover plate 10. One surface of the second wick 33 contacts the first cover plate 10, and the other surface contacts the first wick. The orthographic projection of the heating element 1003 in the X2-Y2 plane at least partially overlaps with the orthographic projection of the second wick 33 in the X2-Y2 plane. For example, the orthographic projection of the heating element 1003 in the X2-Y2 plane can be located within the orthographic projection of the second wick 33 in the X2-Y2 plane. This arrangement allows heat from the heating element 1003 to be directly transferred to the second wick 33 through the first cover plate 10, and then from the second wick 33 to the first wick. Compared to heat transfer to the first wick through the steam channel 51, this reduces thermal resistance and improves temperature uniformity.

[0156] 22 , the second absorbent core 33 may expose the support column 43 on the first cover plate 10 , that is, the second absorbent core 33 may have a through hole extending along the Z2 direction, and the through hole is used to pass the support column 43 .

[0157] In some embodiments, referring to FIG. 23 , FIG. 23 is a schematic diagram of the structure of another heat dissipation structure 100 provided in an embodiment of the present application. FIG. 23 differs from FIG. 19 in that the first wicks arranged in series are replaced with third wicks 34 arranged in parallel. The aforementioned first wicks can be considered a serial capillary solution. In the embodiment of FIG. 23 , multiple third wicks 34 can be provided, wherein each third wick 34 has two opposing surfaces along the Z2 axis in contact with the first cover plate 10 and the second cover plate 20, respectively. Multiple third wicks can be arranged in intervals along the X2 direction.

[0158] The material and structure of the second absorbent core 33 and the third absorbent core 34 may be the same as those of the aforementioned absorbent core 31 , and will not be described in detail herein.

[0159] The embodiment of the present application also provides a method for preparing a heat dissipation structure 100, specifically, S1, selecting a suitable cover plate raw material; S2, performing stamping, cutting, etching, and other processes on the cover plate raw material to form the first cover plate 10 and the second cover plate 20 as described above; S3, welding and fixing the wick 31 to the second cover plate 20 (exemplarily, the welding temperature is less than 300 degrees); S4, welding or gluing a conduit (not shown) between the first cover plate 10 and the second cover plate 20, and welding and fixing the edge of the first cover plate 10 and the edge of the second cover plate 20 (exemplarily, the edge of the second sealing layer 13 and the edge of the third sealing layer 21 as described above can be welded and fixed). S5. Detect whether there is leakage between the first cover plate 10 and the second cover plate 20 after welding; S6. Change the hydrophobic surface of the liquid wick 31 and the microcolumn 32 to a hydrophilic surface through a reduction reaction (such as a high-temperature reduction reaction, such as about 300 degrees), for example, change the material from copper oxide to copper, so that it has capillary water absorption; S7. Inject the working fluid into the accommodating cavity through the catheter and evacuate; S8. Cut the catheter and seal it to form a closed accommodating cavity; S9. Perform an aging test, such as placing it in a high-temperature box for a predetermined period of time; S10. Perform a sealing test on the heat dissipation structure (such as a helium test); S11. Other performance experiments, such as testing the thermal conductivity of the heat dissipation structure.

[0160] For example, the glass transition temperature Td of the first material layer 12 and the second material layer 22 is ≥ 320 degrees. In this way, during the preparation of the first cover plate 10 and the second cover plate 20, the first material layer 12 and the second material layer 22 can maintain good physical properties.

[0161] The embodiment of the present application also provides another heat dissipation structure 100. Refer to Figure 24, which is a structural schematic diagram of another heat dissipation structure 100 provided by the embodiment of the present application and the screen 1001. Among them, the heat dissipation structure 100 includes a fourth sealing layer 101, a third material layer 102 and a fifth sealing layer 103; along the first direction (Z2 axis direction), the third material layer 102 is located between the fourth sealing layer 101 and the fifth sealing layer 103; the material of the third material layer 102 includes at least one of a graphite material and a graphene material; the heat dissipation structure 100 has a plurality of buffer grooves 70 arranged at intervals; the position corresponding to the buffer groove 70 in the third material layer 102 includes elastic deformation and / or plastic deformation.

[0162] In another heat dissipation structure provided in an embodiment of the present application, since the material of the third material layer 102 includes at least one of graphite material and graphene material, and the position corresponding to the buffer groove 70 in the third material layer 102 includes elastic deformation and / or plastic deformation, the heat dissipation structure 100 has a good heat dissipation and temperature equalization effect, especially at the position of the heat dissipation structure 100 corresponding to the buffer groove 70, heat accumulation is not likely to occur. Furthermore, the presence of the fourth sealing layer 101 and the fifth sealing layer 103 on opposite sides of the third material layer 102 effectively seals and protects the third material layer 102, preventing it from collapsing. This provides excellent cushioning and support for the screen 1001, preventing screen 1001 from experiencing issues such as light and shadow, black spots, stenciling, bright spots, green lines, and cracking. Furthermore, the collapse of the third material layer 102 prevents the heat dissipation structure 100 from weakening its uniform heat dissipation capabilities, thereby increasing its lifespan and reliability. Furthermore, the resulting symmetrical structure improves the planarity of the heat dissipation structure 100. For example, due to the more symmetrical mechanical parameters, such as the modulus, along the thickness of the heat dissipation structure 100, the heat dissipation structure 100 is less likely to curl. Furthermore, the lighter weight of the third material layer 102 helps reduce the overall weight of the heat dissipation structure 100, achieving a lightweight design.

[0163] In some embodiments, the thermal conductivity of the third material layer 102 is greater than or equal to 400 W / (m·K). This configuration allows the heat dissipation structure 100 to have a higher thermal conductivity efficiency.

[0164] In some embodiments, the material of at least one of the fourth sealing layer 101 and the fifth sealing layer 103 includes copper. This configuration can provide better sealing and protection for the third material layer 102 and has higher heat dissipation efficiency.

[0165] Continuing with FIG. 24 , an adhesive layer 14 may be added between the heat dissipation structure 100 and the screen 1001. The adhesive layer 14 allows the heat dissipation structure 100 to be bonded and fixed to the screen 1001. Furthermore, since the heat dissipation structure 100 has a buffer groove 70 , the buffer groove 70 can be used to prevent debonding and failure of the adhesive layer between the screen and the heat dissipation structure 100 due to shear stress when the heat dissipation structure 100 and the screen 1001 are bonded and fixed.

[0166] In addition, the configuration of the buffer groove 70 in the heat dissipation structure 100 in the embodiment of FIG24 can be referred to the description of the buffer groove 70 on the first cover plate 10, and will not be repeated here. Moreover, the buffer groove 70 here can also be filled with the first filler 44 and / or the second filler 45 described above.

[0167] In summary, the heat dissipation structure provided by the embodiments of the present application has at least the following advantages:

[0168] 1. Since a buffer groove 70 is provided on the first cover plate 10, the position corresponding to the buffer groove 70 in the first material layer 12 includes elastic deformation. The buffer groove 70 can absorb stress, making the first cover plate 10 more flexible and not having excessive rebound force, that is, the screen 1001 will not have failure problems such as light and shadow, black spots, mold printing, bright spots, green lines, and fragmentation due to excessive rebound force.

[0169] Second, because the third material layer 102 includes at least one of a graphite material and a graphene material, and the locations of the third material layer 102 corresponding to the buffer grooves 70 undergo elastic and / or plastic deformation, the resulting heat dissipation structure 100 exhibits excellent heat dissipation and temperature uniformity. In particular, heat accumulation is less likely to occur at the locations of the heat dissipation structure 100 corresponding to the buffer grooves 70. Furthermore, the screen can be protected and lightweight.

[0170] 3. By disposing the first filler 44 and / or the second filler 45 in the buffer groove, the heat conduction capacity and buffer protection capacity of the first cover plate 10 can be further improved.

[0171] Fourth, when the first cover plate 10 includes the first material layer 12, the average density of the first cover plate 10 is low, which is conducive to reducing the weight of the first cover plate 10. When the second cover plate 20 includes the second material layer 22, the average density of the second cover plate 20 is low, which is conducive to reducing the weight of the second cover plate 20.

[0172] Fifth, the first cover plate 10 can be directly molded from a three-layer composite flexible copper clad laminate FCCL, and the second cover plate 20 can be directly molded from a two-layer composite flexible copper clad laminate FCCL. This can reduce the cost of raw materials and make it easier to mass produce.

[0173] 6. The heat dissipation structure shell made of copper alloy, the heat dissipation structure shell made of stainless steel, and the heat dissipation structure shell made of titanium alloy have a maximum process temperature of about 800°C (annealing, sintering), while the heat dissipation structure 100 containing the first material layer 12 and / or the second material layer 22 in the embodiment of the present application has a maximum process temperature of about 300°C. This can protect the copper layer and other metal layer materials to have good yield strength and fracture strength, so that the heat dissipation structure 100 is not prone to wrinkling, deformation, or cracking after being squeezed or collided.

[0174] 7. Since the first cover plate 10 in the heat dissipation structure 100 can include an insulating first material layer 12 (such as PI), and the second cover plate 20 can include an insulating second material layer 22 (such as PI), the heat dissipation structure 100 can be fully or partially insulated on the side facing the middle frame, thereby avoiding the problem of radiated spurious emission (RSE) of heat in the heat dissipation structure 100.

[0175] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation structure, characterized in that: It comprises a first cover plate, a second cover plate and a liquid absorbing structure; the first cover plate and the second cover plate are connected to each other to enclose a receiving cavity; the liquid absorbing structure is located in the receiving cavity; The heat dissipation structure has a first area and a second area; the liquid absorption structure extends from the first area to the second area; the accommodating cavity also has a steam channel, and the steam channel extends from the second area to the first area; The first cover plate includes a first sealing layer, a first material layer and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate is provided with a plurality of buffer grooves arranged at intervals; the position of the first material layer corresponding to the buffer groove includes elastic deformation.

2. The heat dissipation structure according to claim 1, characterized in that: The yield point strain of the first material layer is greater than the yield point strain of the first sealing layer, and greater than the yield point strain of the second sealing layer; positions of the first sealing layer and the second sealing layer corresponding to the buffer groove include plastic deformation.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: At least a portion of the buffer groove has a top opening facing toward a side of the first cover plate away from the second cover plate.

4. The heat dissipation structure according to any one of claims 1 to 3, characterized in that: The shape of any of the buffer grooves includes any one of a circle, a polygon, a straight bar and a wavy bar.

5. The heat dissipation structure according to any one of claims 1 to 4, characterized in that: The first cover plate further comprises: A first filler is located in at least one of the buffer grooves; the material of the first filler includes an organic polymer material.

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The first cover plate further comprises: A second filler is located in at least one of the buffer slots; the material of the second filler includes a phase change energy storage material.

7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: A ratio of the thickness of the first material layer to the total thickness of the first cover plate is greater than or equal to 20%.

8. The heat dissipation structure according to any one of claims 1 to 7, characterized in that: The thickness of the first sealing layer is equal to or substantially equal to the thickness of the second sealing layer.

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that: The material of the first material layer includes an organic polymer material; The material of at least one of the first sealing layer and the second sealing layer includes at least one of metal and ceramic.

10. The heat dissipation structure according to any one of claims 1 to 9, characterized in that: The second cover plate includes a third sealing layer and a second material layer; the second material layer is located on a side of the third sealing layer away from the first cover plate; and the yield point strain of the second material layer is greater than the yield point strain of the third sealing layer.

11. The heat dissipation structure according to claim 10, characterized in that: The material of the second material layer includes an organic polymer material; The material of the third sealing layer includes at least one of metal and ceramic.

12. The heat dissipation structure according to claim 10 or 11, characterized in that: The second sealing layer is closer to the third sealing layer than the first sealing layer; The material of the third sealing layer is the same as that of the second sealing layer.

13. The heat dissipation structure according to any one of claims 10 to 12, characterized in that: The third sealing layer has a groove on one side close to the first cover plate, the groove includes a first groove portion and a second groove portion, the first groove portion is close to the bottom wall of the groove relative to the second groove portion; The second cover plate further comprises a plurality of columnar structures located in the first groove portion, wherein the plurality of columnar structures are connected to the bottom wall; the liquid absorbing structure comprises a liquid absorbing core, and the liquid absorbing core is placed in the second groove portion; The plurality of columnar structures supports the wick.

14. The heat dissipation structure according to claim 9 or 11, characterized in that: The organic polymer material includes at least one of PI, PP, PTFE, PET, PEN, PDMS, PE, PPC, PVC, PVdC, PS, and PA; The metal includes copper.

15. The heat dissipation structure according to any one of claims 1 to 14, characterized in that: A side of the second cover plate close to the first cover plate is provided with a molded placement groove, and the liquid absorbing structure comprises a liquid absorbing core, and the liquid absorbing core is placed in the placement groove.

16. The heat dissipation structure according to any one of claims 1 to 9, characterized in that: The second cover plate includes at least two stacked metal layers.

17. The heat dissipation structure according to claim 16, characterized in that: The at least two metal layers include any one of copper-steel, copper-titanium, copper-steel-copper, copper-titanium-copper, copper-aluminum-copper, copper-magnesium-copper, and copper (magnesium-aluminum alloy)-copper.

18. A heat dissipation structure, characterized in that: It includes a fourth sealing layer, a third material layer and a fifth sealing layer; along the first direction, the third material layer is located between the fourth sealing layer and the fifth sealing layer; the material of the third material layer includes at least one of a graphite material and a graphene material; the heat dissipation structure is provided with a plurality of buffer grooves arranged at intervals; the position of the third material layer corresponding to the buffer groove includes elastic deformation and / or plastic deformation.

19. The heat dissipation structure according to claim 18, characterized in that: The thermal conductivity of the third material layer is greater than or equal to 400 W / (m·k).

20. The heat dissipation structure according to claim 18 or 19, characterized in that: A material of at least one of the fourth sealing layer and the fifth sealing layer includes copper.

21. An electronic device, characterized in that: include: Screen and heating components; as well as, The heat dissipation structure according to any one of claims 1 to 20 is located between the screen and the heat generating device.

22. The electronic device according to claim 21, characterized in that: include: The adhesive layer is located between the heat dissipation structure and the screen.

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