Automatic laser degumming device and method

Abstract

The invention relates to the field of automatic control, in particular to an automatic laser glue removing device and method. In the degumming process, the camera obtains a first image of the workpiece to be processed in real time and sends the first image to the controller; the controller re-determines a colloid area in the to-be-processed workpiece according to the first image and a standard image of the to-be-processed workpiece after the execution of each round of colloid removing operation is completed, and generates a corresponding colloid removing control instruction; and the laser assembly generates laser based on the glue removing control instruction to remove glue in a glue area in the to-be-processed workpiece. By comparing the actual image of the workpiece to be processed with the standard image in real time, the degumming area can be automatically updated, and the laser is generated to carry out degumming operation on the degumming area, so that the degumming operation efficiency and accuracy are improved.

Description

Technical Field

[0001] The present application relates to the field of automatic control, and in particular to an automated laser glue removal device and method. Background Art

[0002] After disassembling terminal products like smartphones, various structural components, such as screens, midframes, brackets, and battery covers, need to be reused. These components retain a significant amount of adhesive residue. Current production lines utilize a significant amount of manpower, using tools like adhesive removers to aggressively remove the adhesive. This is labor-intensive and inefficient. While physical methods (such as electric adhesive removal) and chemical methods (such as strong adhesive removers) have been tried, these methods have proven ineffective and unsafe, hindering their widespread adoption and meeting the demands of industrial production lines. Summary of the Invention

[0003] In light of this, the present application provides an automated laser degumming device and method. By comparing the actual image of the workpiece to be processed with a standard image, the device can automatically determine the colloid area of ​​the workpiece to be processed, and then perform degumming operations on the colloid area through laser scanning. During the degumming process, the actual image and the standard image are continuously compared, and the degumming area is corrected to achieve precise cleaning of the colloid area.

[0004] In a first aspect, embodiments of the present application provide an automated laser degumming device, comprising a camera, a controller, and a laser assembly. During the degumming process, the camera captures a first image of the workpiece to be processed in real time and transmits the first image to the controller. After each round of degumming, the controller redefines the colloid area in the workpiece based on the first image and a standard image of the workpiece to be processed, and generates corresponding degumming control instructions. The laser assembly generates a laser based on the degumming control instructions to perform degumming on the colloid area in the workpiece to be processed.

[0005] In an embodiment of the present application, based on the feedback control principle, the camera continuously obtains the first image of the workpiece to be processed during the degumming process, the controller continuously compares the first image with the standard image, and periodically updates the degumming area to realize automatic cleaning of residual glue on the workpiece, thereby improving the efficiency and accuracy of degumming workpieces on the production line.

[0006] In one optional embodiment, the specific step of determining the colloid region in the workpiece to be processed based on the first image and the standard image of the workpiece to be processed may include comparing each pixel in the first image with the corresponding pixel in the standard image, and determining the first colloid region based on the difference between the corresponding pixels. In another optional embodiment, after determining the first colloid region, the first colloid region may be adjusted based on the reflectivity of each pixel in the first image to obtain a second colloid region.

[0007] In the embodiments of the present application, there is a significant difference in pixels between the colloid region and the non-colloid region of the workpiece being processed. Based on this difference in pixels, the colloid region of the workpiece being processed can be precisely located. Furthermore, there is also a significant difference in reflectivity between the colloid region and the non-colloid region. After determining the colloid region using pixels, the reflectivity can be further adjusted to improve accuracy.

[0008] In an optional embodiment, the device also includes: a thermometer for acquiring temperature data of the colloid area in real time and sending the temperature data to the controller; the controller is also used to determine whether the temperature of the colloid area is within the safe temperature range corresponding to the work to be processed based on the temperature data after re-determining the colloid area in the workpiece to be processed. If so, a degumming control instruction is generated to perform a degumming operation; otherwise, a cooling operation is performed on the colloid area until the temperature of the colloid area returns to the safe temperature range.

[0009] In this embodiment, feedback control is performed on the temperature of the workpiece being processed. When the temperature of the colloid region is detected to be too high, a cooling operation is first performed. The next round of debonding is then performed after the temperature of the colloid region returns to a corresponding safe temperature range. This method protects the workpiece being processed from damage and improves the safety of laser debonding.

[0010] In an optional embodiment, the device further includes: a blowing and suction component; performing a cooling operation on the colloid area until the temperature of the colloid area returns to the safe temperature range. The process may specifically include: the controller re-determines whether the temperature of the colloid area is still beyond the safe temperature range after each round of cooling operation is completed, and if so, generates corresponding blowing and suction control instructions; the blowing and suction component performs blowing and / or suction operations on the colloid area based on the blowing and suction control instructions to reduce the temperature of the colloid area.

[0011] In an optional embodiment, after redetermining the colloid region in the workpiece to be processed, the controller will also determine whether the colloid region contains molten colloid based on the first image. If so, the molten colloid is cooled until the molten colloid in the colloid region is converted back into a solid colloid. The process of cooling the molten colloid until the molten colloid in the colloid region is converted back into a solid colloid may specifically include: after each round of cooling operation, the controller redetermines whether the colloid region still contains molten colloid. If so, a corresponding blowing and suction control instruction is generated; the blowing and suction component performs blowing and / or suction operations on the colloid region based on the blowing and suction control instructions to reduce the temperature of the molten colloid. Whether the colloid region contains molten colloid is determined based on the brightness value of each pixel in the first image.

[0012] In the present embodiment, the presence of molten colloid in the colloid region can affect colloid removal. The brightness value of each pixel in the first image is used to determine whether the colloid region contains molten colloid. If the colloid region is confirmed to contain molten colloid, the temperature of the colloid region is lowered by blowing and sucking air until the temperature drops below the melting point of the colloid before laser debonding is performed, thereby improving laser debonding efficiency and protecting the workpiece being processed.

[0013] In an optional embodiment, the blowing and suction components include: a blowing piece, a suction piece and an air pump; the blowing piece is combined with the air pump to perform a blowing operation on the colloid area, and the suction piece is combined with the air pump to perform a suction operation on the colloid area.

[0014] In an optional embodiment, the laser assembly includes:

[0015] a laser generator for producing the initial beam;

[0016] a laser modulator, configured to modulate optical characteristics of the initial light beam, wherein the optical characteristics include focal depth, energy uniformity, or spot shape;

[0017] The laser scanner is used to adjust the direction of the initial light beam to form a laser.

[0018] In a second aspect, an embodiment of the present application provides an automated laser adhesive removal method, which is applied to the automated laser adhesive removal device provided in the first aspect, and the method includes:

[0019] The camera acquires a first image of the workpiece to be processed in real time and sends the first image to the controller;

[0020] After each round of glue removal operation is completed, the controller re-determines the glue area in the workpiece to be processed according to the first image and the standard image of the workpiece to be processed, and generates a corresponding glue removal control instruction;

[0021] The laser component generates a laser based on the degumming control instruction to perform a degumming operation on the colloid area in the workpiece to be processed.

[0022] In the embodiment of the present application, during the degumming process, a camera captures a first image of the workpiece in real time and transmits the first image to a controller. After each round of degumming, the controller re-determines the degumming area in the workpiece based on the first image and a standard image of the workpiece, and generates corresponding degumming control instructions. Based on the degumming control instructions, the laser assembly generates a laser to perform degumming on the degumming area in the workpiece. By comparing the actual image of the workpiece with the standard image in real time, the degumming area is automatically updated, and the laser is generated to perform degumming on the degumming area, thereby improving the efficiency and accuracy of the degumming operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 A schematic structural diagram of an automated laser glue removal device provided in an embodiment of the present application;

[0025] Figure 2 A schematic structural diagram of another automated laser adhesive removal device provided in an embodiment of the present application;

[0026] Figure 3 An example schematic diagram of an automated laser glue removal method provided in an embodiment of the present application;

[0027] Figure 4 An exemplary schematic diagram of another automated laser adhesive removal method provided in an embodiment of the present application;

[0028] Figure 5 A schematic structural diagram of another automated laser adhesive removal device provided in an embodiment of the present application;

[0029] Figure 6 A schematic diagram of a process for an automated laser adhesive removal method provided in an embodiment of the present application;

[0030] Figure 7 An exemplary schematic diagram of another automated laser adhesive removal method provided in an embodiment of the present application;

[0031] Figure 8 An exemplary schematic diagram of another automated laser adhesive removal method provided in an embodiment of the present application;

[0032] Figure 9 An exemplary schematic diagram of another automated laser adhesive removal method provided in an embodiment of the present application;

[0033] Figure 10 An exemplary schematic diagram of another automated laser adhesive removal method provided in an embodiment of the present application;

[0034] Figure 11 A schematic diagram of a process for another automated laser adhesive removal method provided in an embodiment of the present application;

[0035] Figure 12 An exemplary schematic diagram of another automated laser adhesive removal method provided in an embodiment of the present application;

[0036] Figure 13A schematic diagram of a process for another automated laser adhesive removal method provided in an embodiment of the present application;

[0037] Figure 14 A schematic diagram of a process for another automated laser adhesive removal method provided in an embodiment of the present application;

[0038] Figure 15 A schematic diagram of a process for another automated laser adhesive removal method provided in an embodiment of the present application;

[0039] Figure 16 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0041] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0042] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0043] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0044] Figure 1 This is a schematic diagram of the structure of an automated laser glue removal device provided in an embodiment of the present application. Figure 1 As shown, the device may include: a laser assembly, a controller, a camera, a temperature sensor, a blowing and suction assembly, and a stage. Specifically, the laser assembly includes: a laser generator, a laser modulator, and a laser scanner; and the blowing and suction assembly includes: a blowing element, a suction element, an air pump 1, and an air pump 2.

[0045] The stage is used to hold the workpiece to be processed. The laser assembly generates laser light to process the workpiece on the stage to meet various needs, such as glue removal, rust removal, or etching. A thermometer is used to detect the temperature of the workpiece, and a camera is used to capture images of the workpiece. Both the thermometer and camera are connected to a controller, which uses the thermometer to obtain the temperature of the workpiece and the camera to obtain images of the workpiece. The air blowing and suction assembly generates positive and negative pressure airflow to reduce the temperature of the workpiece.

[0046] The connection structure between the various parts of the device can refer to Figure 2 ,like Figure 2 As shown, the stage is arranged below the device and close to the middle position, and the workpiece to be processed is placed on the stage with the side to be processed facing upward, so that the colloid in the workpiece to be processed is located below the laser scanner.

[0047] The laser assembly is arranged above the stage. Specifically, the laser generator serves as a light source for generating laser light, the laser modulator is used to modulate the optical characteristics of the laser generated by the laser generator, and the laser scanner is used to change the emission direction of the modulated laser light, thereby changing the position of the laser spot formed on the workpiece.

[0048] The temperature sensor and camera can be placed on the upper left or upper right of the stage, respectively, or they can be placed together on the upper left or upper right. The temperature sensor should face the stage to measure the temperature of the workpiece being processed in real time. The camera lens should face the stage to capture images of the workpiece being processed.

[0049] The air blowing part and the air suction part are respectively arranged on both sides of the stage. Figure 2 In the embodiment, the blowing element and air pump 1 are arranged on the left side of the loading platform, and the suction element and air pump 2 are arranged on the right side of the loading platform. In another optional embodiment, the blowing element and air pump 1 can also be arranged on the right side of the loading platform, and the suction element and air pump 2 can also be arranged on the left side of the loading platform. Based on different needs, they can also be arranged in other reasonable positions.

[0050] In an optional embodiment, the laser generator can be a carbon dioxide laser, which can generate laser light with a wavelength of 10.6 μm. Of course, the laser generator can also be a continuous / pulsed laser with other wavelengths, such as a laser with a wavelength of 1064 nm, 532 nm, or 355 nm.

[0051] In an optional embodiment, the laser modulator can modulate optical characteristics such as focal depth, uniformity and shape of the laser. Figure 3As shown, if the laser is unmodulated, the laser's focal depth (also known as the Rayleigh length) is small. Furthermore, the energy within the laser spot formed on the surface of the workpiece to be processed is Gaussian (with higher energy in the center and lower energy at the edges). Furthermore, the spot is circular in shape. The image indicated by arrow 31 is a three-dimensional representation of the laser energy intensity, while the image indicated by arrow 32 is a two-dimensional representation of the laser energy intensity. Both images show that the laser energy is cone-shaped, with higher energy in the center and lower energy around the edges, resulting in an uneven distribution. This situation results in poor laser processing results or efficiency, and therefore, a laser modulator is required to modulate the laser.

[0052] The modulated laser can be Figure 4 As shown, the laser modulator can modulate the focal depth of the laser to a value greater than or equal to 3 mm, so that the laser energy density value within the range of ±3 mm from the focal plane along the direction of the laser optical axis is ≥ 1 / 2 of the energy density at the focal plane, thereby meeting the need to effectively remove colloids located at different heights. The optical axis is defined as the centerline of the laser beam, and the focal plane is defined as the plane perpendicular to the optical axis where the laser focus is located. The laser modulator can also improve the uniformity of the energy distribution within the spot, so that the difference between the energy level in the central area and the energy level in the edge area within the spot is small. The laser modulator can also modulate the shape of the spot to a rectangle, so that when the spot moves on the surface of the workpiece, the overlapping area of ​​the spot at two adjacent moments is more uniform and controllable. According to the three-dimensional effect diagram of the laser energy intensity indicated by arrow 41 and the three-dimensional effect diagram of the laser energy intensity indicated by arrow 42, it can be seen that the modulated laser energy distribution is more uniform and more suitable for glue removal operations.

[0053] In an optional embodiment, as Figure 5 As shown, the laser scanner includes a galvanometer (reflector) and a lens. The galvanometer is used to reflect the modulated laser. The galvanometer is also used to rotate around a preset axis (for example, the preset rotation angle is α) so that the galvanometer can change the direction of the modulated laser. The laser scanner can include one, two or more galvanometers. The number of galvanometers is set according to the actual needs of the user. If the number of galvanometers is two or more, the rotation axes of each galvanometer are cross-distributed at any viewing angle. Taking two galvanometers as an example, the rotation axes of the two galvanometers can be distributed vertically.

[0054] The lens is used to allow the reflected laser light to pass through and emit the laser light that has passed through the lens in a direction parallel to the optical axis of the lens.

[0055] The working process of the automated laser degumming device in the embodiment of the present application can be referred to Figure 6 , specifically including the following steps:

[0056] (1) Comparing the actual image of the workpiece to be processed with the standard image to determine the colloid area of ​​the workpiece to be processed;

[0057] Actual Image 1 (the workpiece without colloid) can be captured in real time by a camera. Standard images of different workpieces can be stored before the degumming process begins. During actual comparison, the operator simply inputs the workpiece model. The controller compares Actual Image 1 of the workpiece being processed with the standard image to determine the colloid area within the workpiece.

[0058] (2) Identify the colloid contour;

[0059] (3) Generate laser processing path

[0060] The controller can further identify the colloid contour based on the identified colloid area. Then, the controller can generate a laser processing path located within the colloid contour using a path generation algorithm based on the colloid contour. Furthermore, the controller controls the laser scanner based on the laser processing path so that the light spot scans the colloid along the laser processing path. Under the irradiation of the laser, at least part of the colloid is vaporized due to the laser energy and is removed. Optionally, the laser processing path can refer to Figure 7 , including: bow filling, two-way filling, one-way filling and circular filling.

[0061] (4) Real-time observation of the temperature of the colloid area during processing;

[0062] During laser processing, the controller also controls the blower and suction components to generate positive and negative pressure airflows. These two airflows are used to cool the workpiece, minimizing the risk of thermal damage. The negative pressure airflow is also used to recover impurities such as debris, dust, and smoke generated during the laser processing process.

[0063] In addition, during the laser processing process, if the temperature detector detects that the temperature of the workpiece exceeds the preset value, the controller controls the laser component to stop laser processing and increase the air flow intensity of the blowing and suction component to quickly cool the workpiece.

[0064] (5) Recapture the actual image of the workpiece to be processed and detect whether there is still residual glue;

[0065] After the laser spot moves from the starting position of the laser processing path to the end position along the laser processing path, the laser assembly stops irradiating the laser. The workpiece after laser processing may have two possible conditions: Condition 1: Colloid still remains on the workpiece surface; Condition 2: No colloid remains on the workpiece surface.

[0066] For any of the above conditions, the camera needs to repeatedly capture the actual image of the workpiece to generate the actual image 2 corresponding to condition 1 or the actual image 3 corresponding to condition 2.

[0067] If the controller does not identify a residual colloid area after comparing actual image 3 with the reference image, it determines that the workpiece in actual image 3 does not need to be laser processed. If the controller identifies a residual colloid area after comparing actual image 2 with the reference image, it determines that the workpiece in actual image 2 still needs to be laser processed. It then repeats the colloid contour identification and laser processing path generation for actual image 2 in preparation for subsequent repeated laser processing.

[0068] In an optional embodiment, before repeating the laser processing, if the temperature of the workpiece exceeds a preset temperature, the workpiece is cooled using a blower / suction assembly. Before repeating the laser processing, the residual colloid region in the actual image 2 is also identified. If the residual colloid is molten, the blower / suction assembly is used to cool the residual colloid, causing it to solidify. This reduces the likelihood of the residual colloid from colloid splashing during subsequent laser processing, thereby reducing the workload of the laser processing. Laser processing can only be resumed after the workpiece has cooled to the set temperature and the residual colloid has solidified.

[0069] In the embodiment of the present application, the above-mentioned automated laser degumming device is not only suitable for degumming at fixed positions, but also for random colloid residues formed during the disassembly of components. It only scans the area with colloid, thereby improving processing efficiency and reducing damage to the substrate material. And after each scan, the image of the processing area is captured to re-determine the colloid area for the next round of scanning, so as to realize closed-loop control of laser cleaning and improve the accuracy of degumming. In addition, for substrate materials with a low damage threshold such as plastics and PCBs, if open-loop laser scanning is performed, the substrate material is easily burned. The automated laser degumming device of the present application adds a damage control function, which can set the maximum allowable cleaning temperature according to the damage threshold of the substrate material, and through colloid state identification, ensure that the material has been cooled to a temperature below the melting point of the colloid before each cleaning, thereby ensuring that the workpiece is not damaged.

[0070] In an optional embodiment, when determining the colloid area, the controller may compare the actual image of the workpiece to be processed with the standard image by pixel comparison, and determine the colloid area based on the difference between the corresponding pixels. Figure 8 Each small square in the standard image and the actual image represents a pixel. The gray-filled small squares in the actual image represent pixels in the colloid area, and the white-filled small squares represent pixels in the non-colloid area. The controller compares each pixel in the actual image with the pixel at the corresponding position in the standard image and calculates the pixel value difference. Pixels whose pixel value difference exceeds a preset threshold are determined to be pixels in the colloid area. After all pixels are compared, the controller can determine the colloid area. Furthermore, in order to generate a laser processing path for the colloid area, the colloid outline can be determined based on the outermost pixels in the colloid area.

[0071] In an optional embodiment, the colloid region may be ring-shaped, referring to Figure 9 The colloid contour identified by the controller includes an inner contour and an outer contour. The area outside the outer contour is the non-colloidal area 1, the area between the inner contour and the outer contour is the colloid area, and the area inside the inner contour is the non-colloidal area 2.

[0072] In an optional embodiment, after the controller determines the colloid area according to the pixel value difference, it can further determine the colloid area and the colloid outline according to the reflectivity of each pixel point in the colloid area. Figure 10 When the controller uses pixel value difference to determine the colloid area, both gray-filled and black-filled pixels in the actual image are determined to be pixels in the colloid area. The controller then calculates the reflectivity of each pixel in the colloid area, deletes pixels that do not meet the conditions (gray-filled pixels), and ultimately determines the black-filled pixels as pixels in the colloid area, thereby determining the new colloid outline. The pixel value difference can quickly determine the general outline of the colloid area, while the reflectivity can more accurately determine the colloid area. The combination of the two can improve the recognition effect and accuracy of the colloid area.

[0073] In an optional embodiment, the reflectivity of the pixel point can be expressed by a brightness value. Before performing image comparison, the user can input (calibrate) the brightness value range A of the pixel points presented in the image of the workpiece to be processed and the brightness value range B of the pixel points presented in the image of the colloid to the controller. After identifying the preliminary determined colloid contour, the controller can use the brightness value range A of the workpiece as a reference to compare the brightness values ​​of the pixels within the colloid contour one by one. If the brightness value of the compared pixel point is within the brightness value range A, it is determined that the pixel point is not a pixel point in the colloid area. Alternatively, after identifying the preliminary determined colloid contour, the controller can use the brightness value range B of the colloid as a reference to compare the brightness value of the pixel points within the colloid contour one by one. If the brightness value of the compared pixel point is outside the brightness value range B, it is determined that the pixel point is not a pixel point in the colloid area. After excluding the pixel points that are not in the colloid area, the controller reconfirms the outermost pixel points in the colloid area and regenerates the image as shown in FIG. Figure 10 Colloid profile shown.

[0074] In this application, a standard image is first used as a comparison benchmark. Since the computational effort required to determine whether the brightness values ​​are the same or different is relatively small, the difference area can be quickly extracted. The brightness values ​​of the pixels in the difference area are then compared with a pre-calibrated brightness range (involving the workpiece and colloid), which results in a relatively small computational effort and a high recognition rate.

[0075] Figure 11 This is a flow chart of another automated laser glue removal method provided in the embodiment of the present application. Figure 11 As shown, the method may include:

[0076] Step 1101: Input information about the workpiece to be processed;

[0077] Step 1102: placing the workpiece to be processed on the stage;

[0078] Step 1103: Using a camera to capture an actual image of the workpiece to be processed;

[0079] Step 1104: Start the blowing and suction components;

[0080] Step 1105: The controller compares the actual image with the standard image to identify the colloid area;

[0081] Step 1106: Is the colloid identified?

[0082] Step 1107: Identify the colloid contour;

[0083] Step 1108: The controller generates a laser processing path;

[0084] Step 1109: Is this the first laser processing?

[0085] Step 1110: The temperature of the colloid region exceeds a temperature threshold, or the colloid region contains molten colloid;

[0086] Step 1111: Adjust the blowing and suction components to the strong mode and execute T1 seconds;

[0087] Step 1101: Control the laser assembly to scan the colloid along the laser processing path.

[0088] In the embodiment of the present application, the controller can pre-store standard images of various workpieces. When a worker removes glue from any workpiece, they only need to input the identification information of the workpiece to be processed into the controller. The controller can then extract the standard image corresponding to the current workpiece to be processed based on the identification information.

[0089] After the worker places the workpiece on the stage, the camera captures the actual image of the workpiece. Simultaneously, the worker activates the air blower and suction unit to cool the workpiece and remove any colloid debris during the degumming process.

[0090] After the controller obtains the actual image of the workpiece to be processed, it compares the actual image with the standard image. If a colloid area is detected, it enters step 1107 and performs the glue removal operation. If no colloid area is detected, the entire glue removal process ends. Optionally, the workpiece to be processed may contain multiple colloid areas. Figure 12 The workpiece to be processed includes common structures such as grooves, bottom walls and bosses, which respectively contain colloid 1, colloid 2, colloid 3 and other colloids.

[0091] For the determined colloid area, the controller identifies the colloid contour and generates a laser processing path. If this round is the first laser processing, the laser component is controlled to scan the colloid directly according to the laser processing path. If this round is not the first laser processing, corresponding condition judgment is required. Specifically, the controller needs to determine whether the current colloid area contains molten colloid after the previous round of laser processing, or whether the temperature of the colloid area exceeds the temperature threshold. If one of the conditions is met, laser processing cannot be performed directly, and the workpiece to be processed needs to be blown and sucked by the blowing and suction component to reduce the temperature of the colloid area. When the temperature of the colloid area drops below the temperature threshold and the colloid area does not contain molten colloid, the laser processing operation can continue. Optionally, there is a difference in brightness value between the molten colloid and the solid colloid, and the controller can determine whether the colloid area contains molten colloid by the brightness value.

[0092] The degumming of any workpiece to be processed usually includes multiple rounds of degumming operations. Each round of degumming operation requires re-collecting the actual image of the workpiece to be processed, and then re-determining the colloid area. The entire process ends when the colloid area cannot be identified in the actual image of the workpiece to be processed.

[0093] In the embodiment of the present application, based on the feedback control principle, the temperature of the colloid area and the colloid area during the degumming process are used as control variables respectively. The relevant parameters are continuously adjusted during each round of degumming process, so as to achieve accurate degumming of the workpiece to be processed and protect the workpiece to be processed from being damaged by high temperature.

[0094] The following describes the working process of the automatic laser degumming device of the present application through a specific embodiment. The process of cleaning the residual glue on the surface of the device of the metal / ceramic substrate can be as follows: Figure 13 As shown, specifically including:

[0095] Step 1301: The staff inputs the model of the adhesive removal device, and the controller obtains a standard image of the device;

[0096] Step 1302: The staff places the device on the stage;

[0097] Step 1303: The staff opens the blowing and suction assembly;

[0098] Step 1304: the camera captures the actual image, and the controller identifies the colloid area based on the standard image and the actual image;

[0099] Step 1305 , the controller generates a glue removal track and controls the laser assembly to perform a glue removal operation;

[0100] Step 1306: The controller determines whether there is any residual adhesive in the device;

[0101] Step 1307: The controller determines whether the temperature of the colloid region exceeds a temperature threshold or whether molten colloid exists;

[0102] Step 1308: Blow and inhale forcefully for 0.5 seconds.

[0103] For debonding midframes and battery compartments in terminal products, the device can utilize a 10.6µm wavelength CO2 laser. Because metals, glass, and ceramics have very low absorption rates for 10.6µm wavelength lasers, laser power densities exceeding twice the colloidal ablation threshold can be selected for processing.

[0104] First, the controller enters the model of the device to be debonded. The system automatically retrieves an initial reference image of the device. After placing the device on the stage, the air intake and exhaust components on both sides of the device are activated. The automated debonding process begins. A camera captures a real-time image of the device surface and obtains the residual adhesive outline. The control system automatically imports this residual adhesive outline into the laser galvanometer control software, generating a laser debonding trajectory. After each scan of the debonding trajectory, the system checks whether any residual adhesive remains. If no residual adhesive is present, the entire process ends. If residual adhesive is present, the next round of debonding begins.

[0105] Between each round of degumming, the temperature sensor determines whether the device surface temperature exceeds the set temperature. If the temperature is too high, the strong blowing and suction mode (wind speed ≥ 20m / s) is activated, and the device is cooled for 0.5s each time until the judgment condition is met. Then, based on the camera taking a photo of the device surface and comparing it with the standard image to identify the residual glue area, the brightness value information of each pixel is used to determine whether the colloid is in a molten state (increased reflectivity). If the colloid is in a molten state, the strong blowing and suction mode (wind speed ≥ 20m / s) is activated, and the device is cooled for 0.5s each time until the judgment condition is met. After the above conditions are met, the next round of laser degumming can be executed until the automated degumming work is completed. Optionally, the controller can also first determine whether there is molten colloid, and then determine whether the colloid temperature exceeds the threshold, or both can be determined in parallel. Optionally, the wind speed of the blowing and suction component and the time of each air cooling can be set by the staff.

[0106] Since the damage threshold of metals and ceramics is relatively high and there is a large difference between it and the colloid vaporization threshold, no additional cleaning is required on the surface of the substrate material after high-power density laser scanning.

[0107] Through the above process, the colloid on the surface of the device can be cleaned efficiently and safely.

[0108] The automatic laser degumming device of the present application can also clean the residual glue on the surface of the device of the plastic substrate. The overall process is as follows: Figure 14 Specifically, it may include:

[0109] Step 1401: The staff inputs the model of the adhesive removal device, and the controller obtains a standard image of the device;

[0110] Step 1402: The staff places the device on the stage;

[0111] Step 1403: The staff opens the blowing and suction components;

[0112] Step 1404: The camera captures the actual image, and the controller identifies the colloid area based on the standard image and the actual image;

[0113] Step 1405 , the controller generates a glue removal track and controls the laser assembly to perform the glue removal operation;

[0114] Step 1406 , the controller determines whether there is any residual adhesive in the device;

[0115] Step 1407 , the controller determines whether the temperature of the colloid region exceeds a temperature threshold or whether molten colloid exists;

[0116] Step 1408: Spray and wipe the device surface with alcohol;

[0117] Step 1409: blow and inhale forcefully for 0.5 seconds.

[0118] For debonding components like motherboard brackets in terminal products, laser sources with pulse widths below nanoseconds are selected. Because plastics have a certain absorption rate for various wavelengths of laser light and their inherent melting point is relatively low, the laser power density for debonding plastic substrates should be kept as low as possible, typically 1.1 to 1.3 times the colloidal ablation threshold.

[0119] For plastic substrate devices with low thresholds, the energy density of the degumming laser is strictly limited. At the same time, the vaporization thresholds of plastics and most colloids are close. Therefore, after laser scanning, the surface of the substrate material must be wiped according to the image before the next cycle action is executed.

[0120] Figure 15 A flow chart of another automated laser adhesive removal method provided in an embodiment of the present application is shown in FIG. Figure 15 Specifically, it may include:

[0121] Step 1501: a camera acquires a first image of a workpiece to be processed in real time and sends the first image to a controller;

[0122] Step 1502 : After each round of glue removal operation is completed, the controller re-determines the glue area in the workpiece to be processed based on the first image and the standard image of the workpiece to be processed, and generates a corresponding glue removal control instruction;

[0123] In step 1503 , the laser assembly generates a laser based on the debonding control instruction to perform a debonding operation on the colloid area in the workpiece to be processed.

[0124] For other details between the steps, please refer to the description of other flowcharts above.

[0125] Corresponding to the above embodiment, the present application also provides an electronic device, which can be used to implement the controller of the above-mentioned automatic laser glue removal device. Figure 16 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device 1600 may include: a processor 1601, a memory 1602, and a communication unit 1603. These components communicate via one or more buses. Those skilled in the art will understand that the structure of the electronic device shown in the figure does not constitute a limitation on the embodiments of the present application. It can be a bus structure or a star structure, and can also include more or fewer components than shown, or combine certain components, or arrange the components differently.

[0126] The communication unit 1603 is configured to establish a communication channel so that the electronic device can communicate with other devices, receive user data sent by other devices, or send user data to other devices.

[0127] The processor 1601 is the control center of the electronic device. It uses various interfaces and lines to connect various parts of the entire electronic device. It runs or executes software programs, instructions, and / or modules stored in the memory 1602, and calls data stored in the memory to perform various functions of the electronic device and / or process data. The processor can be composed of an integrated circuit (IC), for example, it can be composed of a single packaged IC, or it can be composed of multiple packaged ICs with the same or different functions. For example, the processor 1601 can only include a central processing unit (CPU). In the embodiment of the present application, the CPU can be a single computing core or multiple computing cores.

[0128] The memory 1602 is used to store the execution instructions of the processor 1601. The memory 1602 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0129] When the execution instructions in the memory 1602 are executed by the processor 1601, the electronic device 1600 can execute Figure 1 Some or all of the steps in the illustrated embodiments.

[0130] In a specific implementation, the present application further provides a computer storage medium, wherein the computer storage medium may store a program, and when the program is executed, the program may include some or all of the steps of each embodiment of the power consumption control method provided in the present application. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0131] In a specific implementation, the present application also provides a computer program product, wherein the computer program product includes executable instructions, and when the executable instructions are executed on a computer, the computer executes some or all of the steps in each embodiment of the automated laser glue removal method provided in the present application.

[0132] An embodiment of the present application also provides a non-temporary computer-readable storage medium, which stores computer instructions. The computer instructions enable the computer to execute the automated laser glue removal method provided in the embodiment of the present application.

[0133] The above-mentioned non-transitory computer-readable storage medium can adopt any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination thereof. More specific examples (non-exhaustive list) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (Read On ly Memory; hereinafter referred to as: ROM), an erasable programmable read-only memory (Erasab leProgrammab le Read On ly Memory; hereinafter referred to as: EPROM) or flash memory, optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or device.

[0134] A computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries computer-readable program code. Such a propagated data signal may take a variety of forms, including, but not limited to, electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0135] Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0136] Those skilled in the art can clearly understand that the technology in the embodiments of the present application can be implemented by means of software plus the necessary general hardware platform. Based on this understanding, the technical solutions in the embodiments of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product, which can be stored in a storage medium such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application or certain parts of the embodiments.

[0137] In this specification, reference can be made to the same or similar parts between the various embodiments. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

Claims

1. An automated laser glue removal device, characterized in that: include: A camera, configured to acquire a first image of the workpiece to be processed in real time and send the first image to a controller; a controller, configured to, after each round of glue removal operation is completed, redetermine the glue area in the workpiece to be processed based on the first image and the standard image of the workpiece to be processed, and generate corresponding glue removal control instructions; The laser component is used to generate laser light based on the degumming control instruction to perform degumming operation on the colloid area in the workpiece to be processed.

2. The device according to claim 1, characterized in that The determining of the colloid region in the workpiece to be processed according to the first image and the standard image of the workpiece to be processed includes: Each pixel in the first image is compared with a corresponding pixel in the standard image, and a first colloid region is determined based on a difference between the corresponding pixels.

3. The device according to claim 1, characterized in that The determining of the colloid region in the workpiece to be processed according to the first image and the standard image of the workpiece to be processed includes: comparing each pixel in the first image with a corresponding pixel in the standard image, and determining a first colloid region based on a difference between the corresponding pixels; The first colloid region is adjusted according to the reflectivity of each pixel in the first image to obtain a second colloid region.

4. The device according to claim 1, characterized in that The device further comprises: a temperature detector, for acquiring temperature data of the colloid region in real time and sending the temperature data to the controller; The controller is further used to determine whether the temperature of the colloid area in the workpiece to be processed is within the safe temperature range corresponding to the workpiece to be processed based on the temperature data after re-determining the colloid area in the workpiece to be processed. If so, the degumming control instruction is generated to perform the degumming operation; otherwise, a cooling operation is performed on the colloid area until the temperature of the colloid area returns to the safe temperature range.

5. The device according to claim 4, characterized in that The device further comprises: a blowing and suction component; The step of performing a cooling operation on the colloid region until the temperature of the colloid region returns to within the safe temperature range includes: The controller re-determines whether the temperature of the colloid area is still beyond the safe temperature range after each round of cooling operation is completed, and if so, generates corresponding blowing and suction control instructions; The air blowing and suction component performs air blowing and / or air suction operations on the colloid area based on the air blowing and suction control instruction to reduce the temperature of the colloid area.

6. The device according to claim 5, characterized in that The controller is further configured to, after redetermining the colloid region in the workpiece to be processed, determine based on the first image whether the colloid region contains molten colloid; if so, perform a cooling operation on the molten colloid until the molten colloid in the colloid region turns back into solid colloid.

7. The device according to claim 6, characterized in that The step of cooling the molten colloid until the molten colloid in the colloid region turns back into a solid colloid comprises: The controller re-determines whether the colloid region still contains molten colloid after each round of cooling operation is completed, and if so, generates corresponding blowing and suction control instructions; The blowing and suction component performs blowing and / or suction operations on the colloid area based on the blowing and suction control instructions to reduce the temperature of the molten colloid.

8. The device according to any one of claims 5 to 7, characterized in that The blowing and suction components include: a blowing part, a suction part and an air pump; The blowing member is combined with the air pump to perform a blowing operation on the colloid area, and the suction member is combined with the air pump to perform a suction operation on the colloid area.

9. The device according to claim 5, characterized in that The determining, based on the first image, whether the colloid region contains molten colloid includes: Whether the colloid region contains molten colloid is determined according to the brightness value of each pixel in the first image.

10. The device according to claim 1, characterized in that The laser assembly comprises: a laser generator for producing the initial beam; a laser modulator, configured to modulate optical characteristics of the initial light beam, wherein the optical characteristics include focal depth, energy uniformity, or spot shape; The laser scanner is used to adjust the direction of the initial light beam to form a laser.

11. An automated laser glue removal method, characterized in that: The method is applied to the automated laser glue removal device according to any one of claims 1 to 10, and the method comprises: The camera acquires a first image of the workpiece to be processed in real time and sends the first image to the controller; After each round of glue removal operation is completed, the controller re-determines the glue area in the workpiece to be processed according to the first image and the standard image of the workpiece to be processed, and generates a corresponding glue removal control instruction; The laser component generates a laser based on the degumming control instruction to perform a degumming operation on the colloid area in the workpiece to be processed.

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