Ultra-thin vapor chamber production assembly and ultra-thin vapor chamber manufacturing method

Abstract

The invention provides an ultrathin vapor chamber production assembly and an ultrathin vapor chamber manufacturing method. The ultrathin vapor chamber production assembly comprises a vapor chamber sintering mold and a supporting piece sintering mold. A vapor chamber limiting groove matched with a stamping flange of a lower cover plate of the ultrathin vapor chamber is formed in the vapor chamber sintering mold, and the vapor chamber limiting groove is used for containing and limiting the stamping flange; the supporting piece sintering mold is used for sintering and manufacturing a supporting piece, sintering shaping grooves are formed in the supporting piece sintering mold, the end, provided with the sintering shaping grooves, of the supporting piece sintering mold is used for being matched with a stamping groove of a lower cover plate, the number of the sintering shaping grooves is multiple, and each sintering shaping groove is formed in the preset position of the supporting piece sintering mold. And the multiple sintering shaping grooves are uniformly formed in the supporting piece sintering mold. The ultrathin vapor chamber production assembly not only can improve the production quality of the ultrathin vapor chamber, but also can reduce the production cost of the ultrathin vapor chamber.

Description

Technical Field

[0001] The present disclosure relates to the technical field of ultra-thin vapor chamber production technology, and in particular to an ultra-thin vapor chamber production component and an ultra-thin vapor chamber manufacturing method. Background Art

[0002] A VC vapor chamber, also known as a vacuum chamber, is typically made of copper or stainless steel and is a highly efficient heat dissipation device based on the principle of heat transfer. The vapor chamber consists of a sealed upper and lower cover, with a capillary layer within the sealed inner chamber filled with a working medium. High-power vapor chambers commonly use a sintered layer of copper powder on the lower cover as a capillary carrier. This sintered copper powder structure has a high thermal capacity and can meet the high-power requirements of electronic products. The traditional manufacturing process of a vapor chamber is as follows: first, a plurality of copper powder support columns are sintered separately; then, the sintered copper powder support columns are placed one by one at the preset positions in the stamping groove of the lower cover according to the design requirements, so that the copper powder columns can be evenly arranged in the stamping groove of the lower cover; then, the upper cover is closed so that the two ends of the copper powder support columns are respectively supported on the upper cover and the lower cover, so that the outer periphery of the upper cover is in contact with the outer periphery of the lower cover; finally, the outer periphery of the upper cover and the outer periphery of the lower cover are sealed and sintered to form a vacuum cavity together, and the two ends of the copper powder support columns are respectively sintered and fixed to the upper cover and the lower cover to form the capillary of the vapor chamber. However, the above-mentioned vapor chamber manufacturing process steps are cumbersome and complicated, which not only greatly increases the manufacturing difficulty of the vapor chamber, but also greatly increases the production cost of the vapor chamber.

[0003] The prior art patent CN220761003U proposes a heat spreader copper powder sintering jig, which discloses an upper cover plate and a lower cover plate that cover each other. An upper mold and a lower mold are respectively provided on the inner side of the upper cover plate and the lower cover plate. The lower mold is used to install the heat spreader cover plate. Between the upper mold and the lower mold is a cavity filled with copper powder. By injecting powder into the powder injection channel, a flat copper powder layer can be formed in the cavity. The surface of the upper mold is arranged with holes for forming copper powder support columns. In an embodiment, the upper mold is convexly provided on the inner side of the upper cover plate, and the lower mold is concavely provided on the inner side of the lower cover plate. The upper mold and the lower mold cooperate to form a powder injection cavity. The above-mentioned sintering jig has a simple structure and can complete the sintering and forming of the copper powder support column and the sintering and fixing of the copper powder support column to the upper and lower cover plates in one go, thereby greatly reducing the manufacturing steps of the heat spreader, not only greatly reducing the production difficulty of the heat spreader, but also greatly reducing the production cost of the heat spreader.

[0004] However, when the above-mentioned sintering jig is used to manufacture ultra-thin VC heat spreaders, since the thickness of the ultra-thin VC heat spreaders is much thinner than that of ordinary heat spreaders (the thickness of ultra-thin VC heat spreaders is generally less than 0.3mm, while the thickness of ordinary heat spreaders is generally above 0.8mm), when the above-mentioned sintering jig completes the sintering and forming of the copper powder support columns and the sintering and fixing of the copper powder support columns to the upper and lower cover plates at one time, the lower cover plate is prone to deformation or even melting damage due to excessively high heating temperature and excessively long heating time. At the same time, if the heating temperature or heating time does not reach the preset requirement range when sintering the copper powder support columns, the structural strength of the copper powder support columns is easily greatly reduced, making the copper powder support columns unable to effectively support the ultra-thin VC heat spreaders. As a result, the traditional heat spreader manufacturing process is still used when manufacturing the ultra-thin VC heat spreaders, which not only greatly increases the manufacturing difficulty of the heat spreader, but also greatly increases the production cost of the heat spreader. Summary of the Invention

[0005] The purpose of the present disclosure is to overcome the shortcomings of the existing technology and provide an ultra-thin heat sink production assembly and an ultra-thin heat sink manufacturing method that can not only improve the production quality of ultra-thin heat sinks but also reduce the production cost of ultra-thin heat sinks.

[0006] The purpose of this disclosure is achieved through the following technical solutions:

[0007] An ultra-thin vapor chamber production assembly, the ultra-thin vapor chamber production assembly is used to manufacture ultra-thin vapor chambers, the ultra-thin vapor chamber production mold includes a vapor chamber sintering mold and a support member sintering mold;

[0008] The vapor chamber sintering mold is formed with a vapor chamber limiting groove adapted to fit with the stamping flange of the lower cover plate of the ultra-thin vapor chamber, and the vapor chamber limiting groove is used to accommodate and limit the stamping flange;

[0009] The support part sintering mold is used to sinter and manufacture the support part. The support part sintering mold is formed with a sintering shaping groove, and the sintering shaping groove is used to perform shaping operations on the support part. The support part sintering mold is formed with one end of the sintering shaping groove for adapting to the stamping groove of the lower cover plate. The number of the sintering shaping grooves is multiple, and each of the sintering shaping grooves is respectively arranged at a preset position of the support part sintering mold, so that the multiple sintering shaping grooves are evenly arranged on the support part sintering mold.

[0010] In one embodiment, the bottom of the heat spreader limit groove is also formed with a stepped positioning groove for adapting to the stepped stamping flange of the lower cover plate. The stepped positioning groove is formed at the bottom of the heat spreader limit groove and is connected to the heat spreader limit groove.

[0011] In one embodiment, a side surface of the support member sintering mold on which the sintering shaping groove is formed is formed with a positioning flange for matching with the stepped stamping groove of the lower cover plate.

[0012] In one embodiment, the sintering forming groove includes a support column forming groove and a support bar forming groove. There are multiple support column forming grooves and multiple support bar forming grooves. The multiple support column forming grooves and the multiple support bar forming grooves are evenly arranged on a side of the support part sintering mold where the sintering forming groove is formed, and the multiple support bars are arranged parallel to each other and spaced apart.

[0013] In one embodiment, a length limiting groove is formed at the bottom of each support bar shaping groove, and the length limiting groove is used to limit the length of the support bar of the support member.

[0014] In one embodiment, a first abutment surface is formed on a side surface of the support member sintering mold for abutting against the bottom of the stamping groove, a second abutment surface is formed on a side surface of the support member sintering mold for abutting against the bottom of the step stamping groove, and the second abutment surface is formed on the positioning flange, the sintering forming groove includes a first sintering forming groove and a second sintering forming groove, the first sintering forming groove is formed on the first abutment surface, the second sintering forming groove is formed on the second abutment surface, the vertical height from the first abutment surface to the bottom of the first sintering forming groove is a first height, the vertical height from the second abutment surface to the bottom of the second sintering forming groove is a second height, the vertical height from the second abutment surface to the first abutment surface is a third height, and the second height is equal to the sum of the first height and the third height.

[0015] In one embodiment, a folding limit groove is formed on the outer peripheral edge of the notch of the heat spreader limit groove of the heat spreader sintering mold, and the heat spreader limit groove is connected to the folding limit groove. The folding limit groove is used to adapt to the folding of the lower cover plate, and the folding limit groove is used to accommodate and limit the folding of the lower cover plate.

[0016] In one embodiment, the folding limit groove is used to adapt to the upper cover plate of the ultra-thin heat spreader, and the folding limit groove is used to limit the upper cover plate.

[0017] A method for manufacturing an ultra-thin vapor chamber, wherein the ultra-thin vapor chamber production assembly described in any of the above embodiments is used to manufacture the ultra-thin vapor chamber, and the method for manufacturing the ultra-thin vapor chamber comprises:

[0018] Placing the lower cover plate at a preset position of the vapor chamber sintering mold so that the stamping flange is contained and limited in the vapor chamber limiting groove;

[0019] Pour copper powder into the sintering shaping groove of the support sintering mold until the copper powder is flush with the horizontal surface of the notch of the sintering shaping groove;

[0020] performing a sintering operation on the copper powder in the support member sintering mold so that the copper powder in the sintering shaping tank is sintered and shaped into the support member;

[0021] The end of the sintering mold of the support member after sintering, on which the sintering shaping groove is formed, is invertedly buckled into the stamping groove of the lower cover plate, and the heat spreader sintering mold is vibrated to cause the sintered support member to fall out of the sintering shaping groove and drop to a preset position on the lower cover plate;

[0022] After all the support members fall off from the support member sintering mold, the support member sintering mold is removed from the stamping groove, and the upper cover plate of the ultra-thin heat spreader is placed on the lower cover plate so that the outer periphery of the lower cover plate and the outer periphery of the upper cover plate abut against each other, and at the same time, the two ends of the support member respectively abut and support the upper cover plate and the lower cover plate to form a semi-finished ultra-thin heat spreader;

[0023] The ultra-thin heat spreader semi-finished product in the heat spreader sintering mold is sintered so that the outer periphery of the lower cover plate is sintered and sealed to the outer periphery of the upper cover plate, so that the lower cover plate and the upper cover plate jointly form a vacuum cavity, and at the same time, the two ends of the support member are sintered and fixed to the upper cover plate and the lower cover plate respectively.

[0024] In one embodiment, before the end of the sintered support member sintering mold having the sintering shaping groove formed therein is inverted into the stamping groove of the lower cover plate, the method for manufacturing the ultra-thin vapor chamber further comprises:

[0025] The first copper mesh is welded to the upper cover plate to cover one side surface of the lower cover plate, and the second copper mesh is welded to the bottom of the stamping groove of the lower cover plate.

[0026] Compared with the prior art, the present disclosure has at least the following advantages:

[0027] 1. The above-mentioned ultra-thin heat spreader production assembly has a heat spreader limiting groove formed on the heat spreader sintering mold for matching with the stamping flange of the lower cover plate of the ultra-thin heat spreader. The heat spreader limiting groove is used to accommodate the limiting stamping flange, so that the lower cover plate can be firmly limited in the heat spreader sintering mold by the stamping flange, avoiding the phenomenon of shaking or displacement of the lower cover plate relative to the heat spreader sintering mold during the manufacturing process of the ultra-thin heat spreader, thereby greatly improving the manufacturing stability of the ultra-thin heat spreader production assembly, thereby greatly improving the production quality of the ultra-thin heat spreader.

[0028] 2. Since the support sintering mold is used to sinter and manufacture the support, the support sintering mold is formed with a sintering shaping groove, which is used to shape the support. One end of the support sintering mold is formed with a sintering shaping groove for matching with the stamping groove of the lower cover. There are multiple sintering shaping grooves, and each sintering shaping groove is respectively arranged at a preset position of the support sintering mold, so that multiple sintering shaping grooves are evenly arranged on the support sintering mold. When the support needs to be evenly arranged in the grooves of the stamping groove, When the heat spreader is at the bottom, the production worker only needs to turn the end of the support part sintering mold with the sintering forming groove formed after the sintering operation into the stamping groove and vibrate the heat spreader sintering mold, so that the support part can fall off from the sintering forming groove and fall to the preset position at the bottom of the stamping groove, thereby making the support part evenly arranged at the bottom of the stamping groove, thereby greatly reducing the manufacturing steps of the ultra-thin heat spreader, not only greatly reducing the production difficulty of the ultra-thin heat spreader, but also greatly reducing the production cost of the ultra-thin heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 This is a schematic structural diagram of an ultra-thin vapor chamber production assembly according to one embodiment;

[0031] Figure 2 for Figure 1 The schematic diagram of the partial structure of the ultra-thin heat sink production assembly shown;

[0032] Figure 3 for Figure 2 A partially enlarged schematic diagram of the ultra-thin vapor chamber production assembly;

[0033] Figure 4 for Figure 1 Another partial structural diagram of the ultra-thin vapor chamber production assembly shown;

[0034] Figure 5 for Figure 4 A partially enlarged schematic diagram of the ultra-thin vapor chamber production assembly shown;

[0035] Figure 6 for Figure 4 The CC cross-sectional diagram of the ultra-thin vapor chamber production assembly shown;

[0036] Figure 7 for Figure 6A partially enlarged schematic diagram of the ultra-thin vapor chamber production assembly shown;

[0037] Figure 8 for Figure 4 A schematic diagram of the ultra-thin vapor chamber production assembly from another perspective;

[0038] Figure 9 This is a physical schematic diagram of an ultra-thin vapor chamber;

[0039] Figure 10 Schematic diagram of the local structure of the ultra-thin heat sink;

[0040] Figure 11 for Figure 10 Another perspective diagram of the ultra-thin heat sink shown;

[0041] Figure 12 This is a physical schematic diagram of the support part sintering mold;

[0042] Figure 13 This is a physical schematic diagram of the support part sintering mold being inverted on the stamping groove of the lower cover plate;

[0043] Figure 14 A schematic diagram of a support member arranged in a stamping groove of a lower cover plate;

[0044] Figure 15 This is a physical schematic diagram of a support member and a sintering mold for the support member;

[0045] Figure 16 This is another physical schematic diagram of the ultra-thin vapor chamber;

[0046] Figure 17 Schematic diagram of the manufacturing steps of the ultra-thin heat sink.

[0047] Reference numerals: ultra-thin vapor chamber production assembly 10; vapor chamber sintering mold 101; vapor chamber limiting groove 1011; stepped positioning groove 1012; folding limiting groove 1013; supporting abutment surface 10131; support member sintering mold 102; sintering shaping groove 1021; support column shaping groove 10211; support bar shaping groove 10212; length limiting groove 102121; first sintering shaping groove 10213; second sintering shaping groove 10214; positioning flange 1 022; first abutting surface 1023; second abutting surface 1024; first height H1; second height H2; third height H3; ultra-thin heat spreader 20; upper cover plate 201; lower cover plate 202; stamped flange 2021; stamped groove 2022; stepped stamped flange 2023; stepped stamped groove 2024; folded edge 2025; support member 203; support bar 2031; support column 2032; guide channel 204; first copper mesh 205; second copper mesh 206. DETAILED DESCRIPTION

[0048] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. The terms used herein in the specification of this disclosure are intended only to describe specific embodiments and are not intended to limit this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] In order to better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure is further described in detail below with reference to specific embodiments:

[0052] like Figures 1 to 16 As shown, an ultra-thin heat spreader production assembly 10 of an embodiment is used to manufacture an ultra-thin heat spreader 20, and the ultra-thin heat spreader 20 production mold includes a heat spreader sintering mold 101 and a support sintering mold 102; the heat spreader sintering mold 101 is formed with a heat spreader limiting groove 1011 for matching with the stamping flange 2021 of the lower cover plate 202 of the ultra-thin heat spreader 20, and the heat spreader limiting groove 1011 is used to accommodate the limiting stamping flange 2021, so that the lower cover plate 202 can be firmly limited in the heat spreader sintering mold 101 through the stamping flange 2021, avoiding the phenomenon of shaking or displacement of the lower cover plate 202 relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, so that the manufacturing stability of the ultra-thin heat spreader production assembly 10 is greatly improved, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0053] like Figures 1 to 16As shown, further, the support part sintering mold 102 is used to sinter and manufacture the support part 203, and the support part sintering mold 102 is formed with a sintering shaping groove 1021, and the sintering shaping groove 1021 is used to perform a shaping operation on the support part 203. The support part sintering mold 102 is formed with one end of the sintering shaping groove 1021 for adapting to the stamping groove 2022 of the lower cover plate 202. The number of the sintering shaping grooves 1021 is multiple, and each sintering shaping groove 1021 is respectively arranged at a preset position of the support part sintering mold 102, so that the multiple sintering shaping grooves 1021 are evenly arranged on the support part sintering mold 102. When the support part 203 needs to be evenly sintered, the support part 203 can be formed. When the support part 203 is evenly arranged at the bottom of the stamping groove 2022, the production worker only needs to turn the end of the support part sintering mold 102 with the sintering forming groove 1021 formed after the sintering operation into the stamping groove 2022 and vibrate the heat spreader sintering mold 101, so that the support part 203 can fall off from the sintering forming groove 1021 and fall to the preset position at the bottom of the stamping groove 2022, thereby making the support part 203 evenly arranged at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat spreader 20, not only greatly reducing the production difficulty of the ultra-thin heat spreader 20, but also greatly reducing the production cost of the ultra-thin heat spreader 20.

[0054] The above-mentioned ultra-thin heat spreader production assembly 10, since the heat spreader sintering mold 101 is formed with a heat spreader limiting groove 1011 for matching with the stamping flange 2021 of the lower cover plate 202 of the ultra-thin heat spreader 20, the heat spreader limiting groove 1011 is used to accommodate the limiting stamping flange 2021, so that the lower cover plate 202 can be firmly limited in the heat spreader sintering mold 101 through the stamping flange 2021, avoiding the phenomenon of the lower cover plate 202 shaking or displacing relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, thereby greatly improving the manufacturing stability of the ultra-thin heat spreader production assembly 10, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0055] Since the support sintering mold 102 is used to sinter and manufacture the support 203, the support sintering mold 102 is formed with a sintering shaping groove 1021, and the sintering shaping groove 1021 is used to perform shaping operation on the support 203. The support sintering mold 102 is formed with one end of the sintering shaping groove 1021 for matching with the stamping groove 2022 of the lower cover 202. The number of the sintering shaping grooves 1021 is multiple, and each sintering shaping groove 1021 is respectively arranged at a preset position of the support sintering mold 102, so that the multiple sintering shaping grooves 1021 are evenly arranged on the support sintering mold 102. When the support 203 needs to be evenly arranged When at the bottom of the stamping groove 2022, the production worker only needs to turn the end of the support part sintering mold 102 with the sintering forming groove 1021 formed after the sintering operation into the stamping groove 2022 and vibrate the heat spreader sintering mold 101, so that the support part 203 can fall off from the sintering forming groove 1021 and fall to the preset position at the bottom of the stamping groove 2022, thereby making the support part 203 evenly arranged at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat spreader 20, not only greatly reducing the production difficulty of the ultra-thin heat spreader 20, but also greatly reducing the production cost of the ultra-thin heat spreader 20.

[0056] like Figure 1 As shown, in this embodiment, the heat spreader sintering mold 101 is a graphite sintering jig, so that the heat spreader sintering mold 101 can have good high temperature resistance, corrosion resistance, wear resistance and thermal conductivity, and at the same time can reduce the difficulty of demolding the ultra-thin heat spreader 20, which not only greatly improves the use stability and service life of the heat spreader sintering mold 101, but also can greatly reduce the production difficulty of the ultra-thin heat spreader 20.

[0057] like Figure 1 As shown, in this embodiment, the support part sintering mold 102 is a graphite sintering jig, so that the support part sintering mold 102 can have good high temperature resistance, corrosion resistance, wear resistance and thermal conductivity, and at the same time can reduce the difficulty of demolding the support part 203, which not only greatly improves the use stability and service life of the support part sintering mold 102, but also can greatly reduce the production difficulty of the ultra-thin heat spreader 20.

[0058] like Figures 4 to 7 As shown, in one embodiment, the bottom of the sintering forming groove 1021 is a horizontal abutment surface to increase the abutment area between the support member 203 and the upper cover plate 201 and the lower cover plate 202, thereby avoiding the phenomenon of puncturing and damaging the upper cover plate 201 or the lower cover plate 202 due to the end of the support member 203 being too sharp, thereby greatly improving the production quality of the ultra-thin heat sink 20.

[0059] like Figures 2 to 11As shown, in one embodiment, the bottom of the heat spreader limit groove 1011 is further formed with a stepped positioning groove 1012 for matching with the stepped stamping flange 2023 of the lower cover plate 202. The stepped positioning groove 1012 is formed at the bottom of the heat spreader limit groove 1011 and is connected to the heat spreader limit groove 1011 to reduce the difficulty of aligning the lower cover plate 202 with the heat spreader limit groove 1011, so that the lower cover plate 202 can be quickly and accurately installed at the preset position of the heat spreader sintering mold 101 through the stepped stamping flange 2023, thereby greatly reducing the difficulty of the lower cover plate 202. 02 is installed at the preset position of the heat spreader limit groove 1011, which not only greatly reduces the production cost of the ultra-thin heat spreader 20, but also greatly improves the production efficiency of the ultra-thin heat spreader 20; at the same time, the heat spreader sintering mold 101 can also more firmly limit the lower cover plate 202 in the heat spreader limit groove 1011 through the stepped positioning groove 1012, further avoiding the phenomenon of shaking or displacement of the lower cover plate 202 relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0060] like Figures 4 to 13 As shown, in one embodiment, a side surface of the support member sintering mold 102 having a sintering shaping groove 1021 is formed with a positioning flange 1022 for matching with the stepped stamping groove 2024 of the lower cover plate 202, so as to reduce the difficulty of aligning the support member sintering mold 102 with the stamping groove 2022 of the lower cover plate 202, so that the support member sintering mold 102 can be quickly and accurately installed at the preset position of the lower cover plate 202 through the positioning flange 1022, thereby greatly reducing the difficulty of installing the lower support member sintering mold 102 at the preset position of the stamping groove 2022 of the lower cover plate 202, not only greatly reducing the production cost of the ultra-thin heat sink 20 , and also greatly improves the production efficiency of the ultra-thin heat spreader 20; at the same time, the support part sintering mold 102 can be more firmly positioned in the stamping groove 2022 of the lower cover plate 202 through the positioning flange 1022, so that in the process of separating the support part 203 and the support part 203 sintering mold by vibrating the heat spreader sintering mold 101, the support part sintering mold 102 is effectively avoided from shaking or displacing relative to the lower cover plate 202, so that each support part 203 can be accurately placed at the preset position of the lower cover plate 202 after falling off from the support part sintering mold 102, thereby further improving the production quality of the ultra-thin heat spreader 200.

[0061] like Figures 14 to 16As shown, in one embodiment, the support member 203 includes a support bar 2031 and a support column 2032, and both ends of the support bar 2031 and the support column 2032 are respectively used to abut and support the upper cover plate 201 and the lower cover plate 202, and the supporting area of ​​the support bar 2031 is larger than that of the support column 2032, so that the two ends of the support member 203 can better support the upper cover plate 201 and the lower cover plate 202, so that the structural strength of the ultra-thin heat spreader 20 is greatly improved, thereby greatly improving the use stability and service life of the ultra-thin heat spreader 20.

[0062] like Figures 14 to 16 As shown, in one embodiment, the support bars 2031 are copper powder support bars, and the support columns 2032 are copper powder support columns, so that the support members 203 have better structural strength and thermal conductivity.

[0063] like Figures 4 to 11 As shown, in one embodiment, the sintering shaping groove 1021 includes a support column shaping groove 10211 and a support bar shaping groove 10212, and the number of the support column shaping groove 10211 and the support bar shaping groove 10212 is multiple, and the multiple support column shaping grooves 10211 and the multiple support bar shaping grooves 10212 are evenly arranged on the side of the support part sintering mold 102 where the sintering shaping groove 1021 is formed, so that when the support part sintering mold 102 is inverted at the preset position of the lower cover plate 202 and all the support columns 2032 and the support bars 2031 are separated from the support part sintering mold 102 by vibration, the multiple support columns 2032 and the multiple support bars 2031 can be evenly arranged at the bottom of the stamping groove 2022 of the lower cover plate 202, not only when the ultra-thin heat spreader 20 is subjected to external pressure or impact, the evenly distributed support columns 2032 and support bars 2031 031 can better disperse stress, effectively preventing the upper cover plate 201 and the lower cover plate 202 from being deformed or even damaged due to excessive local force, thereby further improving the service life and stability of the ultra-thin heat spreader 20, and can also reduce the flow resistance of steam in the ultra-thin heat spreader 20, improve the flow efficiency of steam, and ensure that steam can flow evenly in the ultra-thin heat spreader 20, thereby greatly improving the heat dissipation efficiency and heat dissipation uniformity of the ultra-thin heat spreader 20; and multiple support bars 2031 are arranged in parallel with each other at intervals, so that the support bars 2031, the upper cover plate 201 and the lower cover plate 202 can jointly form a guide channel 204, so that the steam flows inside the ultra-thin heat spreader 20 along the guide channel 204, further reducing the flow resistance of steam in the ultra-thin heat spreader 20, improving the flow efficiency of steam, thereby greatly improving the heat dissipation efficiency of the ultra-thin heat spreader 20.

[0064] It can be understood that when the copper powder is sintered into the support member 203, its volume will shrink, especially the support bar 2031. If the length of the support bar 2031 is too short, the length of the guide channel 204 will be greatly shortened, so that the guiding effect of the guide channel 204 will be greatly reduced, thereby reducing the flow efficiency of the steam inside the ultra-thin heat spreader 20, thereby greatly reducing the heat dissipation efficiency of the ultra-thin heat spreader 20.

[0065] like Figures 4 and 5 As shown, in one embodiment, a length limiting groove 102121 is formed at the bottom of each support bar forming groove 10212, and the length limiting groove 102121 is used to limit the length of the support bar 2031, so that when the support bar 2031 shrinks during sintering, the length limiting groove 102121 can limit the support bar 2031 to a preset length range, and avoid the phenomenon that the flow efficiency of steam inside the ultra-thin heat spreader 20 is reduced due to the support bar 2031 being too short, thereby greatly improving the heat dissipation efficiency of the ultra-thin heat spreader 20.

[0066] like Figures 4 and 5 As shown, in one embodiment, there are multiple length limiting grooves 102121, and the multiple length limiting grooves 102121 are evenly arranged at the bottom of the support bar shaping groove 10212, so as to avoid the support bar 2031 from cracking or even breaking due to uneven force when the length limiting groove 102121 limits the length of the support bar 2031, thereby ensuring that the ultra-thin heat spreader 20 can have better production quality and heat dissipation efficiency.

[0067] like Figures 4 to 8As shown, in one embodiment, the support member sintering mold 102 is used to form a first abutting surface 1023 on one side thereof abutting against the bottom of the stamping groove 2022, and the support member sintering mold 102 is used to form a second abutting surface 1024 on one side thereof abutting against the bottom of the stepped stamping groove 2024, and the second abutting surface 1024 is formed on the positioning flange 1022, and the sintering shaping groove 1021 includes a first sintering shaping groove 10213 and a second sintering shaping groove 10214, the first sintering shaping groove 10213 is formed on the first abutting surface 1023, the second sintering shaping groove 10214 is formed on the second abutting surface 1024, and the groove bottom of the first sintering shaping groove 10213 is formed from the first abutting surface 1023 to the first sintering shaping groove 10213. The vertical height of the second abutting surface 1024 to the bottom of the second sintering shaping groove 10214 is the second height H2, and the vertical height of the second abutting surface 1024 to the first abutting surface 1023 is the third height H3, and the second height H2 is equal to the sum of the first height H1 and the third height H3, so that when the support member 203 is separated from the support member sintering mold 102 and arranged at the preset position of the lower cover plate 202, the ends of all the support members 203 facing away from the lower cover plate 202 can be in the same horizontal plane, ensuring that both ends of all the support members 203 can be respectively abutted and supported on the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat sink 20.

[0068] like Figures 6 to 8 As shown, in one embodiment, the first abutment surface 1023 is a horizontal abutment surface, so that the production worker can scrape off the copper powder overflowing from the sintering forming groove 1021, which greatly reduces the manufacturing difficulty of the support member 203 and greatly improves the production efficiency of the ultra-thin heat sink 20.

[0069] like Figures 6 to 8 As shown, in one embodiment, the second abutment surface 1024 is a horizontal abutment surface, so that the production worker can scrape off the copper powder overflowing from the sintering forming groove 1021, which greatly reduces the manufacturing difficulty of the support member 203 and greatly improves the production efficiency of the ultra-thin heat sink 20.

[0070] like Figure 3 and Figure 10As shown, in one of the embodiments, a folding limit groove 1013 is formed on the outer peripheral edge of the notch of the heat spreader limit groove 1011 of the heat spreader sintering mold 101, and the heat spreader limit groove 1011 is connected to the folding limit groove 1013, and the folding limit groove 1013 is used to adapt to the folding edge 2025 of the lower cover plate 202, and the folding limit groove 1013 is used to accommodate the folding edge 2025 that limits the lower cover plate 202, so that the lower cover plate 202 can be more firmly limited in the heat spreader limit groove 1011 of the heat spreader sintering mold 101, further avoiding the phenomenon of shaking or displacement of the lower cover plate 202 relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, so that the manufacturing stability of the ultra-thin heat spreader production assembly 10 is greatly improved, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0071] like Figure 3 and Figure 10 As shown, in one embodiment, a supporting abutment surface 10131 is formed at the bottom of the folding limit groove 1013, and the supporting abutment surface 10131 is used to abut against the folding edge 2025 of the lower cover plate 202 to avoid deformation of the folding edge 2025 of the lower cover plate 202 due to the large pressure applied when the upper cover plate 201 is covered on the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0072] like Figure 3 and Figure 10 As shown, in one embodiment, the supporting abutment surface 10131 is a horizontal abutment surface, so that the supporting abutment surface 10131 can better abut against the folded edge 2025 of the supporting lower cover plate 202, thereby greatly improving the bearing capacity of the folded edge 2025.

[0073] like Figure 3 and Figure 16 As shown, in one of the embodiments, the folding limit groove 1013 is also used to adapt to the upper cover plate 201 of the ultra-thin heat spreader 20, and the folding limit groove 1013 is used to limit the upper cover plate 201 so that the upper cover plate 201 can be accurately covered at the preset position of the lower cover plate 202 through the folding limit groove 1013. At the same time, the upper cover plate 201 can also be firmly limited at the preset position of the lower cover plate 202 through the folding limit groove 1013, effectively avoiding the upper cover plate 201 from shaking or displacing relative to the lower cover plate 202 when the upper cover plate 201 and the lower cover plate 202 are sintered and fixed, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0074] like Figure 3 and Figure 9As shown, in one embodiment, the vertical height from the bottom of the folding limit groove 1013 to the notch of the folding limit groove 1013 is used to be less than the sum of the thickness of the upper cover plate 201 and the thickness of the folding edge 2025 of the lower cover plate 202, so that the upper cover plate 201 partially protrudes from the horizontal plane where the notch of the heat spreader limit groove 1011 is located, so that when multiple heat spreader sintering molds 101 are stacked, the side of the heat spreader sintering mold 101 facing away from the heat spreader limit groove 1011 is pressed against the top of the upper cover plate 201, and then the upper cover plate 201 can be more firmly abutted and limited to the preset position of the lower cover plate 202, further avoiding the upper cover plate 201 from shaking or displacing relative to the lower cover plate 202 when the upper cover plate 201 and the lower cover plate 202 are sintered and fixed, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0075] like Figure 7 and Figure 10 As shown, in one embodiment, the first height H1 is used to be equal to the vertical height from the horizontal plane where the notch of the stamping groove 2022 of the lower cover plate 202 is located to the bottom of the stamping groove 2022, and the second height H2 is used to be equal to the vertical height from the horizontal plane where the notch of the stepped stamping groove 2024 is located to the bottom of the stepped stamping groove 2024 of the lower cover plate 202, so that when the support member 203 is arranged at the preset position of the lower cover plate 202, the two ends of the support member 203 can respectively abut and support the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat sink 20.

[0076] like Figure 17 As shown, the present disclosure further provides a method for manufacturing an ultra-thin vapor chamber, wherein the ultra-thin vapor chamber production assembly 10 described in any of the above embodiments is used to manufacture an ultra-thin vapor chamber 20. The method for manufacturing an ultra-thin vapor chamber includes some or all of the following steps:

[0077] S101, placing the lower cover plate 202 at a preset position on the vapor chamber sintering mold 101, so that the stamping flange 2021 is accommodated and limited in the vapor chamber limiting groove 1011;

[0078] In this embodiment, the lower cover plate 202 is placed at a preset position of the heat spreader sintering mold 101, so that the stamping flange 2021 is limited in the heat spreader limiting groove 1011, so that the lower cover plate 202 can be firmly limited in the heat spreader sintering mold 101 by the stamping flange 2021, thereby avoiding the phenomenon of the lower cover plate 202 shaking or displacing relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, thereby greatly improving the manufacturing stability of the ultra-thin heat spreader production assembly 10, and thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0079] S103, pouring copper powder into the sintering shaping groove 1021 of the support sintering mold 102 until the copper powder is flush with the horizontal surface of the notch of the sintering shaping groove 1021;

[0080] In this embodiment, copper powder is poured into the sintering shaping groove 1021 of the support part sintering mold 102 until the copper powder is flush with the horizontal plane of the notch of the sintering shaping groove 1021, so that the height of the support part 203 after sintering can reach a preset range, so that when the upper cover plate 201 is covered on the lower cover plate 202, the two ends of the support part 203 can respectively abut and support the upper cover plate 201 and the lower cover plate 202, thereby improving the structural strength of the ultra-thin heat sink 20.

[0081] S105, performing a sintering operation on the copper powder in the support member sintering mold 102, so that the copper powder in the sintering shaping groove 1021 is sintered and shaped into the support member 203;

[0082] In this embodiment, the copper powder in the support part sintering mold 102 is sintered to shape the copper powder in the sintering shaping groove 1021 into the support part 203, so that the production staff can perform the sintering operation on the copper powder in the support part sintering mold 102 according to the sintering time and sintering temperature required for the support part 203. Compared with the sintering jig in the above-mentioned related technology in which the sintering forming of the copper powder support column 2032 and the sintering and fixing of the copper powder support column 2032 with the upper and lower cover plates 202 are completed at the same time, the present application can separately control the sintering temperature and sintering time of the support part 203 when sintering the support part 203, thereby avoiding the deformation or even melting damage of the lower cover plate 202 due to excessively high heating temperature and excessively long heating time, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0083] S107: The end of the sintered support member sintering mold 102 having the sintering shaping groove 1021 formed therein is invertedly buckled into the stamping groove 2022 of the lower cover plate 202, and the vapor chamber sintering mold 101 is vibrated to cause the sintered support member 203 to fall out of the sintering shaping groove 1021 and drop to a preset position on the lower cover plate 202.

[0084] In this embodiment, one end of the sintered support member sintering mold 102 with the sintering shaping groove 1021 is inverted in the stamping groove 2022 of the lower cover plate 202, and the heat plate sintering mold 101 is vibrated to make the sintered support member 203 fall off from the sintering shaping groove 1021 and fall to the preset position of the lower cover plate 202. When the support member 203 needs to be evenly arranged at the bottom of the stamping groove 2022, the production worker only needs to form the support member sintering mold 102 after the sintering operation. When one end of the sintering forming groove 1021 is inverted in the stamping groove 2022 and the heat spreader sintering mold 101 is vibrated, the support part 203 can fall off from the sintering forming groove 1021 and fall to the preset position at the bottom of the stamping groove 2022, thereby making the support part 203 evenly arranged at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat spreader 20, not only greatly reducing the production difficulty of the ultra-thin heat spreader 20, but also greatly reducing the production cost of the ultra-thin heat spreader 20.

[0085] S109: After all the support members 203 fall off from the support member sintering mold 102, the support member sintering mold 102 is removed from the stamping groove 2022, and the upper cover plate 201 of the ultra-thin heat spreader 20 is placed on the lower cover plate 202, so that the outer periphery of the lower cover plate 202 and the outer periphery of the upper cover plate 201 abut against each other, and at the same time, the two ends of the support members 203 abut against the upper cover plate 201 and the lower cover plate 202, respectively, to form the semi-finished ultra-thin heat spreader 20;

[0086] In this embodiment, after all the support members 203 fall off from the support member sintering mold 102, the support member sintering mold 102 is taken out from the stamping groove 2022, and the upper cover plate 201 of the ultra-thin heat spreader 20 is covered on the lower cover plate 202, so that the outer periphery of the lower cover plate 202 and the outer periphery of the upper cover plate 201 abut against each other, and at the same time, the two ends of the support member 203 respectively abut against the upper cover plate 201 and the lower cover plate 202 to form a semi-finished product of the ultra-thin heat spreader 20, which is convenient for the subsequent steps.

[0087] S111, a sintering operation is performed on the semi-finished ultra-thin heat spreader 20 in the heat spreader sintering mold 101, so that the outer periphery of the lower cover plate 202 is sintered and sealed to the outer periphery of the upper cover plate 201, so that the lower cover plate 202 and the upper cover plate 201 form a vacuum cavity together, and at the same time, the two ends of the support member 203 are sintered and fixed to the upper cover plate 201 and the lower cover plate 202 respectively.

[0088] In this embodiment, a sintering operation is performed on the semi-finished ultra-thin heat spreader 20 in the heat spreader sintering mold 101, so that the outer periphery of the lower cover plate 202 is sintered and sealed to the outer periphery of the upper cover plate 201, so that the lower cover plate 202 and the upper cover plate 201 jointly form a vacuum cavity, and at the same time, the two ends of the support member 203 are sintered and fixed to the upper cover plate 201 and the lower cover plate 202 respectively. Compared with the sintering jig in the above-mentioned related technology in which the sintering and forming of the copper powder support column 2032 and the sintering and fixing of the copper powder support column 2032 to the upper and lower cover plates 202 are completed at the same time, the present application can separately control the sintering temperature and sintering time when sintering and fixing the support member 203 to the upper cover plate 201 and the lower cover plate 202, thereby avoiding deformation or even melting damage of the lower cover plate 202 due to excessively high heating temperature and excessively long heating time, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0089] In this embodiment, first, the lower cover plate 202 is placed at the preset position of the heat spreader sintering mold 101 so that the stamping flange 2021 is accommodated and limited in the heat spreader limiting groove 1011; then, copper powder is poured into the sintering shaping groove 1021 of the support sintering mold 102 until the copper powder is flush with the sintering shaping groove 1021; then, the copper powder in the support sintering mold 102 is sintered to shape the copper powder in the sintering shaping groove 1021 into the support 203; thereafter, the end of the sintered support sintering mold 102 with the sintering shaping groove 1021 formed thereon is inverted in the stamping groove 2022 of the lower cover plate 202, and the heat spreader sintering mold 101 is vibrated to make the sintered support 203 fall off from the sintering shaping groove 1021 and fall to the preset position of the lower cover plate 202; then, wait for After all the support members 203 fall off from the support member sintering mold 102, the support member sintering mold 102 is taken out from the stamping groove 2022, and the upper cover plate 201 of the ultra-thin heat spreader 20 is covered on the lower cover plate 202, so that the outer periphery of the lower cover plate 202 and the outer periphery of the upper cover plate 201 abut against each other, and at the same time, the two ends of the support member 203 respectively abut against the upper cover plate 201 and the lower cover plate 202 to form a semi-finished product of the ultra-thin heat spreader 20; finally, the semi-finished ultra-thin heat spreader 20 in the heat spreader sintering mold 101 is sintered so that the outer periphery of the lower cover plate 202 is sintered and sealed to the outer periphery of the upper cover plate 201, so that the lower cover plate 202 and the upper cover plate 201 form a vacuum cavity together, and at the same time, the two ends of the support member 203 are respectively sintered and fixed to the upper cover plate 201 and the lower cover plate 202 to complete the manufacture of the ultra-thin heat spreader 20.

[0090] It can be understood that in order to ensure that the support member 203 can be firmly limited to the preset position of the ultra-thin heat spreader 20, it is necessary to sprinkle copper powder on the contact surfaces of the lower cover plate 202 and the upper cover plate 201 with the support member 203 when manufacturing the lower cover plate 202 and the upper cover plate 201 and sinter them separately to increase the friction between the lower cover plate 202 and the upper cover plate 201 and the support member 203. However, this also makes the manufacture of the ultra-thin heat spreader 20 more cumbersome and complicated, and also greatly increases the production cost of the ultra-thin heat spreader 20.

[0091] In one embodiment, before step S107 of inverting one end of the sintered support member sintering mold 102 having the sintering shaping groove 1021 formed therein into the stamping groove 2022 of the lower cover plate 202, the method for manufacturing an ultra-thin vapor chamber further includes some or all of the following steps:

[0092] S99 , welding the first copper mesh 205 to one side of the upper cover plate 201 covering the lower cover plate 202 , and welding the second copper mesh 206 to the bottom of the punching groove 2022 of the lower cover plate 202 .

[0093] In this embodiment, the first copper mesh 205 is welded to one side of the upper cover 201 covering the lower cover 202, and the second copper mesh 206 is welded to the bottom of the stamping groove 2022 of the lower cover 202, so that the two ends of the support member 203 can be respectively supported by the first copper mesh 205 and the second copper mesh 206, which not only greatly improves the friction between the support member 203 and the upper cover 201 and the lower cover 202, but also enables the support member 203 to be more firmly limited to the preset position of the ultra-thin heat spreader 20, effectively avoiding the support member 203 from shaking or displacing relative to the lower cover 202 and the upper cover 201 due to external factors, and can also stabilize the support member 203 and the upper cover 201. The size of the gap between the upper cover plate 201 and the lower cover plate 202 is compensated, so that the support member 203 can be more stably supported on the upper cover plate 201 and the lower cover plate 202, thereby greatly improving the production quality of the ultra-thin heat spreader 20; at the same time, when the support member 203 is sintered and fixed to the upper cover plate 201 and the lower cover plate 202, the two side surfaces of the first copper mesh 205 can be sintered and fixed to the support member 203 and the upper cover plate 201 respectively, and the second copper mesh 206 can also be sintered and fixed to the support member 203 and the lower cover plate 202 respectively, so that the first copper mesh 205 and the second copper mesh 206 do not need to be sintered and fixed to the upper cover plate 201 and the lower cover plate 202 first, thereby greatly reducing the manufacturing and production costs of the ultra-thin heat spreader 20.

[0094] like Figure 16As shown, in one embodiment, the first copper mesh 205 is formed with a first welding area (not shown), and the second copper mesh 206 is formed with a second welding area (not shown), so that the first copper mesh 205 and the second copper mesh 206 can be welded to the preset positions of the upper cover plate 201 and the lower cover plate 202 respectively, thereby reducing the manufacturing difficulty of the ultra-thin heat sink 20.

[0095] In one embodiment, the bottom of the limiting groove is further formed with a stepped positioning groove 1012 for adapting to the stepped stamping flange 2023 of the lower cover plate 202. The stepped positioning groove 1012 is formed at the bottom of the heat spreader limiting groove 1011 and is connected to the heat spreader limiting groove 1011. The specific step S101 of placing the lower cover plate 202 at a preset position of the heat spreader sintering mold 101 so that the stamping flange 2021 is accommodated and limited in the heat spreader limiting groove 1011 includes some or all of the following steps:

[0096] S1011, aligning the stepped stamping flange 2023 of the lower cover plate 202 with the stepped positioning groove 1012 of the vapor chamber sintering mold 101, so that the stamping flange 2021 of the lower cover plate 202 is aligned with the vapor chamber limiting groove 1011 of the vapor chamber sintering mold 101;

[0097] In this embodiment, the stepped stamping flange 2023 of the lower cover plate 202 is aligned with the stepped positioning groove 1012 of the heat spreader sintering mold 101, so that the stamping flange 2021 of the lower cover plate 202 is aligned with the heat spreader limiting groove 1011 of the heat spreader sintering mold 101, so as to reduce the difficulty of aligning the lower cover plate 202 with the heat spreader limiting groove 1011, so that the lower cover plate 202 can be quickly and accurately installed at the preset position of the heat spreader sintering mold 101 through the stepped stamping flange 2023, thereby greatly reducing the difficulty of installing the lower cover plate 202 at the preset position of the heat spreader limiting groove 1011, which not only greatly reduces the production cost of the ultra-thin heat spreader 20, but also greatly improves the production efficiency of the ultra-thin heat spreader 20.

[0098] S1013 , placing and confining the stepped stamping flange 2023 in the stepped positioning groove 1012 , so that the stamping flange 2021 is confined in the vapor chamber limiting groove 1011 .

[0099] In this embodiment, the stepped stamping flange 2023 is placed and limited in the stepped positioning groove 1012, so that the stamping flange 2021 is limited in the heat spreader limiting groove 1011, so that the heat spreader sintering mold 101 can more firmly limit the lower cover plate 202 in the heat spreader limiting groove 1011 through the stepped positioning groove 1012, further avoiding the phenomenon of the lower cover plate 202 shaking or displacing relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0100] In one embodiment, a side surface of the support member sintering mold 102 having the sintering shaping groove 1021 formed thereon is formed with a positioning flange 1022 adapted to fit with the stepped stamping groove 2024 of the lower cover plate 202; the specific steps of buckling the end of the sintered support member sintering mold 102 having the sintering shaping groove 1021 formed thereon into the stamping groove 2022 of the lower cover plate 202 include some or all of the following steps:

[0101] S1071, aligning the positioning flange 1022 of the support member sintering mold 102 with the stepped stamping groove 2024 of the lower cover plate 202;

[0102] In this embodiment, the positioning flange 1022 of the support part sintering mold 102 is aligned with the stepped stamping groove 2024 of the lower cover plate 202 to reduce the difficulty of aligning the support part sintering mold 102 with the stamping groove 2022 of the lower cover plate 202, so that the support part sintering mold 102 can be quickly and accurately installed at the preset position of the lower cover plate 202 through the positioning flange 1022, thereby greatly reducing the difficulty of installing the lower support part sintering mold 102 at the preset position of the stamping groove 2022 of the lower cover plate 202, which not only greatly reduces the production cost of the ultra-thin heat spreader 20, but also greatly improves the production efficiency of the ultra-thin heat spreader 20.

[0103] S1073 , placing the positioning flange 1022 into and confining it in the stepped stamping groove 2024 , so that one end of the support member sintering mold 102 formed with the sintering shaping groove 1021 is confined in the stamping groove 2022 .

[0104] In this embodiment, the positioning flange 1022 is placed in and limited in the stepped stamping groove 2024, so that the end of the support part sintering mold 102 formed with the sintering forming groove 1021 is limited in the stamping groove 2022, so that the support part sintering mold 102 can be more firmly positioned in the stamping groove 2022 of the lower cover plate 202 through the positioning flange 1022, so that in the process of separating the support part 203 and the support part 203 sintering mold by vibrating the heat spreader sintering mold 101, the support part sintering mold 102 is effectively avoided from shaking or displacing relative to the lower cover plate 202, so that each support part 203 can be accurately placed at the preset position of the lower cover plate 202 after falling off from the support part sintering mold 102, thereby further improving the production quality of the ultra-thin heat spreader 20.

[0105] Compared with the prior art, the present disclosure has at least the following advantages:

[0106] The above-mentioned method for manufacturing an ultra-thin heat spreader, since the heat spreader sintering mold 101 is formed with a heat spreader limiting groove 1011 for matching with the stamping flange 2021 of the lower cover plate 202 of the ultra-thin heat spreader 20, the heat spreader limiting groove 1011 is used to accommodate the limiting stamping flange 2021, so that the lower cover plate 202 can be firmly limited in the heat spreader sintering mold 101 through the stamping flange 2021, avoiding the phenomenon of shaking or displacement of the lower cover plate 202 relative to the heat spreader sintering mold 101 during the manufacturing process of the ultra-thin heat spreader 20, thereby greatly improving the manufacturing stability of the ultra-thin heat spreader production assembly 10, thereby greatly improving the production quality of the ultra-thin heat spreader 20.

[0107] 2. Since the support sintering mold 102 is used to sinter and manufacture the support 203, the support sintering mold 102 is formed with a sintering shaping groove 1021, and the sintering shaping groove 1021 is used to perform shaping operation on the support 203. The support sintering mold 102 is formed with one end of the sintering shaping groove 1021 for matching with the stamping groove 2022 of the lower cover 202. The number of the sintering shaping grooves 1021 is multiple, and each sintering shaping groove 1021 is respectively set at a preset position of the support sintering mold 102, so that the multiple sintering shaping grooves 1021 are evenly arranged on the support sintering mold 102. When the support 203 needs to be evenly distributed, When placed at the bottom of the stamping groove 2022, the production worker only needs to turn the end of the support part sintering mold 102 with the sintering forming groove 1021 formed after the sintering operation into the stamping groove 2022 and vibrate the heat spreader sintering mold 101, so that the support part 203 can fall off from the sintering forming groove 1021 and fall to the preset position at the bottom of the stamping groove 2022, thereby making the support part 203 evenly arranged at the bottom of the stamping groove 2022, thereby greatly reducing the manufacturing steps of the ultra-thin heat spreader 20, not only greatly reducing the production difficulty of the ultra-thin heat spreader 20, but also greatly reducing the production cost of the ultra-thin heat spreader 20.

[0108] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosed patent shall be determined by the appended claims.

Claims

1. An ultra-thin vapor chamber production assembly, characterized in that: The ultra-thin vapor chamber production assembly is used to manufacture ultra-thin vapor chambers, and the ultra-thin vapor chamber production mold includes a vapor chamber sintering mold and a support member sintering mold; The vapor chamber sintering mold is formed with a vapor chamber limiting groove adapted to fit with the stamping flange of the lower cover plate of the ultra-thin vapor chamber, and the vapor chamber limiting groove is used to accommodate and limit the stamping flange; The support part sintering mold is used to sinter and manufacture the support part. The support part sintering mold is formed with a sintering shaping groove, and the sintering shaping groove is used to perform shaping operations on the support part. The support part sintering mold is formed with one end of the sintering shaping groove for adapting to the stamping groove of the lower cover plate. The number of the sintering shaping grooves is multiple, and each of the sintering shaping grooves is respectively arranged at a preset position of the support part sintering mold, so that the multiple sintering shaping grooves are evenly arranged on the support part sintering mold.

2. The ultra-thin vapor chamber production assembly according to claim 1, characterized in that: The bottom of the heat spreader limit groove is also formed with a stepped positioning groove for matching with the stepped stamping flange of the lower cover plate. The stepped positioning groove is formed at the bottom of the heat spreader limit groove and is connected to the heat spreader limit groove.

3. The ultra-thin vapor chamber production assembly according to claim 2, characterized in that: A side surface of the support member sintering mold on which the sintering shaping groove is formed is formed with a positioning flange for matching with the stepped stamping groove of the lower cover plate.

4. The ultra-thin vapor chamber production assembly according to claim 1, characterized in that: The sintering forming groove includes a support column forming groove and a support bar forming groove. There are multiple support column forming grooves and multiple support bar forming grooves. The multiple support column forming grooves and the multiple support bar forming grooves are evenly arranged on a side of the support part sintering mold where the sintering forming groove is formed, and the multiple support bars are arranged parallel to each other and spaced apart.

5. The ultra-thin vapor chamber production assembly according to claim 4, characterized in that: A length limiting groove is formed at the bottom of each support bar shaping groove, and the length limiting groove is used to limit the length of the support bar of the support member.

6. The ultra-thin vapor chamber production assembly according to claim 3, characterized in that: The support member sintering mold is used to form a first abutment surface on one side surface abutting against the bottom of the stamping groove, and the support member sintering mold is used to form a second abutment surface on one side surface abutting against the bottom of the stepped stamping groove, and the second abutment surface is formed on the positioning flange, and the sintering forming groove includes a first sintering forming groove and a second sintering forming groove, the first sintering forming groove is formed on the first abutment surface, and the second sintering forming groove is formed on the second abutment surface, the vertical height from the first abutment surface to the bottom of the first sintering forming groove is a first height, the vertical height from the second abutment surface to the bottom of the second sintering forming groove is a second height, the vertical height from the second abutment surface to the first abutment surface is a third height, and the second height is equal to the sum of the first height and the third height.

7. The ultra-thin vapor chamber production assembly according to claim 1, characterized in that: A folding limit groove is formed on the outer periphery of the notch of the heat spreader limit groove of the heat spreader sintering mold, and the heat spreader limit groove is connected to the folding limit groove. The folding limit groove is used to adapt to the folding of the lower cover plate, and the folding limit groove is used to accommodate and limit the folding of the lower cover plate.

8. The ultra-thin vapor chamber production assembly according to claim 7, characterized in that: The folding limit groove is used to adapt to the upper cover plate of the ultra-thin heat spreader, and the folding limit groove is used to limit the upper cover plate.

9. A method for manufacturing an ultra-thin vapor chamber, characterized in that: The ultra-thin vapor chamber is manufactured using the ultra-thin vapor chamber production assembly according to any one of claims 1 to 8, and the ultra-thin vapor chamber manufacturing method comprises: Placing the lower cover plate at a preset position of the vapor chamber sintering mold so that the stamping flange is contained and limited in the vapor chamber limiting groove; Pour copper powder into the sintering shaping groove of the support sintering mold until the copper powder is flush with the horizontal surface of the notch of the sintering shaping groove; performing a sintering operation on the copper powder in the support member sintering mold so that the copper powder in the sintering shaping tank is sintered and shaped into the support member; The end of the sintering mold of the support member after sintering, on which the sintering shaping groove is formed, is invertedly buckled into the stamping groove of the lower cover plate, and the heat spreader sintering mold is vibrated to cause the sintered support member to fall out of the sintering shaping groove and drop to a preset position on the lower cover plate; After all the support members fall off from the support member sintering mold, the support member sintering mold is removed from the stamping groove, and the upper cover plate of the ultra-thin heat spreader is placed on the lower cover plate so that the outer periphery of the lower cover plate and the outer periphery of the upper cover plate abut against each other, and at the same time, the two ends of the support member respectively abut and support the upper cover plate and the lower cover plate to form a semi-finished ultra-thin heat spreader; The ultra-thin heat spreader semi-finished product in the heat spreader sintering mold is sintered so that the outer periphery of the lower cover plate is sintered and sealed to the outer periphery of the upper cover plate, so that the lower cover plate and the upper cover plate jointly form a vacuum cavity, and at the same time, the two ends of the support member are sintered and fixed to the upper cover plate and the lower cover plate respectively.

10. The method for manufacturing an ultra-thin vapor chamber according to claim 9, wherein: Before the end of the sintered support member sintering mold having the sintering shaping groove formed thereon is invertedly buckled into the stamping groove of the lower cover plate, the method for manufacturing the ultra-thin vapor chamber further comprises: The first copper mesh is welded to the upper cover plate to cover one side surface of the lower cover plate, and the second copper mesh is welded to the bottom of the stamping groove of the lower cover plate.

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