A PCB pre-alignment adjustment structure punching machine

Abstract

The present invention relates to the technical field of punching machines and discloses a punching machine with a PCB pre-alignment adjustment structure, comprising a processing platform, the top surface of the processing platform is fixedly connected to a lifting plate, the rear side of the processing platform is fixedly connected to the lifting platform, and a punching mechanism is arranged inside the lifting platform; the punching mechanism comprises a lifting frame, the left side of the lifting frame is threadedly connected to a threaded rod, the end of the threaded rod is rotatably connected to a pushing groove block, the upper and lower sides of the pushing groove block are slidably connected to an inclined groove guide plate, the side of the inclined groove guide plate away from the threaded rod is fixedly connected to a card groove bar, and a punching template is arranged on the inner side of the lifting frame. The present invention, through a modular slot design, can quickly replace or adjust the position and quantity of the cutter head, and can adapt to PCB boards of different models, sizes or hole position requirements without customizing special molds, greatly reducing the cost and time of production change, and is particularly suitable for small batch and multi-variety production scenarios.

Description

Technical Field

[0001] This invention relates to the field of punching machine technology, specifically to a PCB pre-alignment adjustment structure punching machine. Background Technology

[0002] In traditional PCB punching processes, the fixing of cutting tools typically relies on customized designs of dedicated molds, resulting in insufficient equipment flexibility. Since PCBs of different models, sizes, or hole positions often require specific mold structures, frequent mold changes and adjustments significantly increase production changeover costs and extend delivery times due to customization cycles, especially in high-precision scenarios. The fixed cutting head design in existing technologies struggles to quickly adapt to diverse hole layouts, and repeated mold processing and adjustments further exacerbate production costs and time losses. Furthermore, the non-standardized cutting head arrangement in traditional punching processes is prone to vibration or displacement due to uneven force distribution. Coupled with a lack of rigid support, the dimensional accuracy and relative positional tolerance of the holes are difficult to control stably, ultimately leading to accumulated errors in subsequent PCB assembly. These problems are particularly prominent in the production of multilayer boards or high-density interconnect boards, hindering companies' ability to respond quickly to market demands and improve production efficiency. Therefore, a modular punching solution that combines flexibility and high precision is urgently needed to overcome the limitations of existing technologies in small-batch, multi-variety production scenarios.

[0003] Patent CN208246938U discloses a PCB board punching machine, belonging to the field of PCB board processing equipment. It aims to provide a PCB board punching machine with high punching quality. The key technical points are: a PCB board punching machine includes a frame and a hydraulic punch mounted on the frame. A work platform is positioned directly below the hydraulic punch, and a mold corresponding to the hydraulic punch is mounted on the work platform. A control box is located outside the work platform. The mold is clamped and fixed to the work platform by a fixture. A pre-drilled hole is vertically opened at the top of the mold, and a chip discharge port vertically communicating with the pre-drilled hole is opened at the bottom of the mold. A positioning mechanism for fixing the PCB board is also provided at the top of the mold. This patent is applicable to the field of PCB board processing equipment, but it suffers from the problem that the punching mold needs to be customized, which is too costly for small-volume motherboard production. Therefore, a PCB pre-alignment adjustment structure punching machine is proposed to solve the above-mentioned problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a PCB pre-alignment adjustment structure punching machine to address the shortcomings of the prior art.

[0005] To solve the above technical problems, the technical solution adopted by the present invention is: a PCB pre-alignment adjustment structure punching machine, including a processing table, a lifting plate fixedly connected to the top surface of the processing table, a lifting table fixedly connected to the rear side of the processing table, and a punching mechanism provided inside the lifting table;

[0006] The stamping mechanism includes a lifting frame, a threaded rod threadedly connected to the left side of the lifting frame, a pusher block rotatably connected to the end of the threaded rod, inclined guide plates slidably connected to both the upper and lower sides of the pusher block, a slot strip fixedly connected to the side of the inclined guide plate away from the threaded rod, a punching template provided on the inner side of the lifting frame, a clamping strip fixedly connected to the rear side of the slot strip, a positioning plate provided on the bottom surface of the punching template, screws provided at the four corners of the positioning plate, multiple tool structures provided between the punching template and the positioning plate, each tool structure including a slot rod, a stamping cutter head fixedly connected to the bottom of the slot rod, a top plate ring fixedly connected to the outer surface of the stamping cutter head, and multiple equidistant alignment slots opened on the bottom surface of the punching template.

[0007] According to the above technical solution, a sliding rod frame is provided above the lifting plate, a material changing and positioning mechanism is provided at the bottom of the lifting plate, a material collection mechanism is provided below the material changing and positioning mechanism, a drive motor is installed on the rear side and the top right side of the lifting platform, a lead screw is fixedly connected to the end of the output shaft of the drive motor, and two guide frames are threadedly connected to the outer side of the lead screw. A guide rail is slidably connected to the side of the guide frame near the lifting platform.

[0008] According to the above technical solution, the side of the punching template is provided with a groove, and the groove respectively fits into the slot strip, the clamping strip and the lifting frame. The screw is threaded to the bottom surface of the punching template. The bottom surface of the positioning plate is provided with multiple holes distributed in an equidistant array. The slot rod fits into the positioning plate. The alignment slot is inserted into the slot rod. The punching head slides through the bottom surface of the positioning plate from the top surface. The lifting frame is fixedly connected to the guide frame located above. When working, the drive motor rotates, driving the connected lead screw to rotate, so that the lead screw drives the guide frame to move downward along the guide rail. The movement of the guide rail drives the connected lifting frame downward together. The configuration is adjusted according to different motherboard models. When positioning the punching holes, multiple tool structures need to be inserted into the corresponding alignment slots on the punching template, ensuring that the positions of the tool structures correspond to the punching positions on the PCB board. Insert the slot rod into the alignment slot, then place the positioning plate on the bottom of the punching template, allowing the punching head to pass through the pre-drilled holes on the positioning plate. Secure the four corners of the positioning plate with screws. Then, install the punching template onto the lifting frame. By rotating the threaded rod, the threaded rod pushes the pusher block to slide along the inclined guide plate, causing the inclined guide plate to push the connection between the clamping strip and the slot strip to fit against the surface of the punching template. This allows the clamping strip and the slot strip to engage with the grooves on the side of the punching template, thus achieving rapid fixing of the punching template.

[0009] According to the above technical solution, the material changing and positioning mechanism includes a rotating plate frame. An outer shaft is fixedly connected to the center of the top of the rotating plate frame. An inner shaft is rotatably connected to the inner side of the outer shaft. A clamping plate is fixedly connected to the top of the inner shaft. A clamping strip is fixedly connected to the outer edge of the clamping plate. A clamping groove is provided on the side of the clamping strip. A telescopic arc frame is slidably connected to the bottom surface of the outer shaft. A guide groove ring is fixedly connected to the side of the telescopic arc frame. An elastic rod is slidably connected to the bottom surface of the telescopic arc frame. A ring is rotatably connected to the outer side of the outer shaft. A hydraulic rod is fixedly connected to the outer surface of the ring. A clamping block is fixedly connected to the bottom surface of the hydraulic rod. A grooved plate is provided below the ring. A guide groove is provided on the bottom surface of the grooved plate. A fixing block is fixedly connected to the bottom surface of the lifting plate. A folding rod is hinged to one side of the fixing block.

[0010] According to the above technical solution, the lifting plate is rotatably connected to the rotating plate frame, the outer side of the top end of the outer shaft is provided with a sliding groove for the sliding of the plate disc, the guide groove ring is slidably connected to the inner shaft, the outer surface of the inner shaft is provided with a spiral groove, the telescopic arc frame is provided with a spring on the outer side of the elastic rod, and the two ends of the spring are fixedly connected to the elastic rod and the telescopic arc frame respectively.

[0011] According to the above technical solution, a compression spring is provided on the outer side of the inner shaft, and the two ends of the compression spring are fixedly connected to the guide groove ring and the outer shaft, respectively. The grooved plate is fixedly connected to the outer shaft. A spring plate is provided between the folding rod and the fixed block, and the two ends of the spring plate are fixedly connected to the fixed block and the folding rod, respectively. When the rotating plate frame is divided into four grids, the grid located directly below the punching template is in the processing position, the grid located to the left of the lifting platform is in the feeding position, the grid located directly in front of the lifting platform is in the unloading position, and the grid located diagonally opposite the punching template is in the cleaning position. When the rotating plate frame needs to rotate, the hydraulic rod extends and pushes the end ring, causing the ring to push the outer shaft to slide a certain distance along the oblique groove opened on the lifting plate. When the grooved plate on the outer side of the outer shaft contacts it, the folding rod provides resistance to make the guide groove on the grooved plate slide with the folding rod, guiding the grooved plate to rotate around the ring through the outer shaft. At this time, the grooved plate rotates ninety degrees, and then the hydraulic rod pulls again. The ring causes the slotted plate to slide in the opposite direction along the inclined slot on the lifting plate. Due to the damping between the slotted plate and the ring through the outer shaft, the slotted plate then pushes the folding rod through the guide groove, which squeezes the flexible spring sheet to rotate around the fixed block. This causes the slotted plate to pass over the folding rod and engage with the locking block on the hydraulic rod, guiding the slotted plate to return to its original position after rotation. At the same time, when the elastic rod is compressed, it pushes the telescopic arc frame to move, causing the telescopic arc frame to slide along the thread on the outer side of the inner shaft through the guide groove ring. The telescopic arc frame extends and retracts into the outer shaft, causing the inner shaft to rotate and drive the clamping plate and clamping strip to deflect. This causes the clamping strip to deflect out from the side of the turntable. The clamping groove on the side of the clamping strip pushes the edge of the main board to fit against the inner frame of the turntable to correct its position. The clamping groove also holds a corner of the PCB board, positioning the PCB board against the inner frame of the turntable. The PCB board is moved to the processing area by rotation, and then the processed PCB board is transferred out by rotation, while simultaneously performing positioning calibration during processing.

[0012] According to the above technical solution, the material collection mechanism includes a material trough, which is opened on the top surface of the front half of the lifting plate. A flipping plate is hinged to the inner side of the material trough. Two flipping frames are fixedly connected to the bottom surface of the flipping plate. A seat plate is slidably connected between the two flipping frames. A lifting plate is provided inside the processing table. A collection box is fixedly connected to the upper surface of the lifting plate. A cavity rubber pad is provided inside the collection box.

[0013] According to the above technical solution, the base plate is fixedly connected to the lifting plate, the lead screw is a bidirectional thread, and the guide frame located below is fixedly connected to the lifting plate. When the lead screw rotates, the guide frame located below drives the lifting plate to rise, and the lifting plate pushes the elastic rod to be compressed. After the elastic rod is compressed, it pushes the telescopic arc frame to retract into the outer shaft. When the clamping strip contacts the PCB board, the clamping plate no longer deflects. At this time, the lifting plate continues to apply pressure, and the telescopic arc frame no longer extends into the outer shaft. The telescopic arc frame drives the elastic rod to slide and compress the elastic spring. During the rotation of the rotating plate frame, the waste material generated by punching will be passed through the lifting plate. The inclined groove on the surface falls onto the lifting plate, while another part of the processed PCB board moves along the tilted flipping plate to the cavity pad above the collection box. The lighter waste material falls onto the lifting plate, which collects the waste and prevents it from remaining on the lifting plate and affecting the placement of the bare printed circuit board. When the lifting plate moves down, it slides along the flipping frame via the connected seat plate, causing the flipping frame to tilt the flipping plate downwards, thus unloading the PCB board. The PCB board falling onto the cavity pad is cushioned and facilitates subsequent transfer by other devices.

[0014] The present invention, by adopting the above technical solution, can bring the following beneficial effects:

[0015] This PCB pre-alignment adjustment structure punching machine, through its modular slot design, allows for quick replacement or adjustment of the cutter head position and quantity. It can adapt to PCB boards of different models, sizes, or hole positions without the need for customized special molds, significantly reducing changeover costs and time. It is especially suitable for small-batch, multi-variety production scenarios. Secondly, the equidistant array layout ensures the standardization and consistency of cutter head positioning. Combined with the rigid support of the mold, it can effectively reduce offset or vibration during the punching process, ensuring the dimensional accuracy and relative position tolerance of the holes, and avoiding PCB assembly problems caused by cumulative errors.

[0016] This PCB pre-alignment adjustment structure punching machine moves the placed PCB board to the processing area by rotation, and then transfers the processed PCB board out by rotation. Combined with positioning calibration during processing, it can significantly improve production efficiency and processing accuracy. The rotary transfer mechanism can realize continuous material flow, reduce idle waiting time in traditional linear handling, and make loading and unloading and processing seamlessly connected, thereby improving overall production efficiency. Positioning calibration during processing can ensure the positional accuracy of the PCB board in the processing area, avoid positioning deviations caused by cumulative errors or mechanical vibration, and ensure the accuracy of processes such as drilling, surface mount, or soldering.

[0017] This PCB pre-alignment adjustment structure punching machine realizes the unloading of PCB boards. The PCB boards falling on the cavity pad are buffered and facilitate subsequent transfer by other devices. The design of collecting stamping waste and guiding the unloading of the main board by rotating the structure can significantly optimize the production process and improve the overall performance of the equipment. The waste is concentrated and thrown to a specific collection area by centrifugal force or directional motion, avoiding the accumulation of waste in the mold or processing area, reducing the frequency of downtime for cleaning, and reducing the risk of waste scratching the workpiece. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall frontal three-dimensional structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the overall rear-view three-dimensional structure of the present invention;

[0020] Figure 3 This is a schematic diagram of the stamping mechanism of the present invention;

[0021] Figure 4 This is a schematic diagram of the grooving template of the present invention;

[0022] Figure 5 For the present invention Figure 4 A magnified structural diagram of A in the middle;

[0023] Figure 6 This is a schematic diagram of the material changing and positioning mechanism of the present invention;

[0024] Figure 7 For the present invention Figure 6 Schematic diagram of the enlarged structure of B;

[0025] Figure 8 This is a schematic diagram of the bottom structure of the lifting plate of the present invention;

[0026] Figure 9 For the present invention Figure 8 A magnified structural diagram of C;

[0027] Figure 10 This is a schematic diagram of the material collection mechanism of the present invention.

[0028] In the diagram: 1. Machining table; 2. Lifting plate; 3. Lifting table; 4. Slide bar frame; 5. Stamping mechanism; 51. Lifting frame; 52. Threaded rod; 53. Pushing block; 54. Inclined guide plate; 55. Clamping bar; 56. Slot bar; 57. Stamping template; 58. Positioning plate; 59. Tool structure; 591. Stamping cutter head; 592. Slot rod; 593. Top plate ring; 510. Screw; 511. Alignment slot; 6. Material changing and positioning mechanism; 61. Turntable frame; 62. Clamping plate; 63. Clamping plate. 64. Slats; 65. Inner shaft; 66. Outer shaft; 67. Locking slot; 68. Hydraulic rod; 69. Locking block; 60. Groove plate; 610. Guide groove; 611. Guide groove ring; 612. Telescopic arc frame; 613. Elastic rod; 614. Folding rod; 615. Fixing block; 7. Material collection mechanism; 71. Material chute; 72. Lifting plate; 73. Tilting plate; 74. Tilting frame; 75. Seat plate; 76. Cavity rubber pad; 77. Collection box; 8. Drive motor; 9. Lead screw; 10. Guide frame; 11. Guide rail. Detailed Implementation

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Please see Figures 1-10 An embodiment of the present invention is: a PCB pre-alignment adjustment structure punching machine, including a processing table 1, a lifting plate 2 fixedly connected to the top surface of the processing table 1, a lifting table 3 fixedly connected to the rear side of the processing table 1, and a punching mechanism 5 provided inside the lifting table 3.

[0031] The stamping mechanism 5 includes a lifting frame 51. A threaded rod 52 is threadedly connected to the left side of the lifting frame 51. A pusher block 53 is rotatably connected to the end of the threaded rod 52. Inclined guide plates 54 are slidably connected to both the upper and lower sides of the pusher block 53. A slotting strip 56 is fixedly connected to the side of the inclined guide plate 54 away from the threaded rod 52. A punching template 57 is provided on the inner side of the lifting frame 51. A clamping strip 55 is fixedly connected to the rear side of the slotting strip 56. A positioning plate 58 is provided on the bottom surface of the punching template 57. Screws 510 are provided at the four corners of the positioning plate 58. Multiple tool structures 59 are provided between the punching template 57 and the positioning plate 58. Each tool structure 59 includes a slotting rod 592. A stamping cutter head 591 is fixedly connected to the bottom of the slotting rod 592. A top plate ring 593 is fixedly connected to the outer surface of the cutter head 591. Multiple equidistant alignment slots 511 are provided on the bottom surface of the punching template 57. A slide bar frame 4 is provided above the lifting plate 2. A material changing and positioning mechanism 6 is provided at the bottom of the lifting plate 2. A material collection mechanism 7 is provided below the material changing and positioning mechanism 6. Drive motors 8 are installed on the rear side and the top right side of the lifting platform 3. A lead screw 9 is fixedly connected to the end of the output shaft of the drive motor 8. Two guide frames 10 are threadedly connected to the outer side of the lead screw 9. A guide rail 11 is slidably connected to the side of the guide frame 10 closest to the lifting platform 3. A groove is provided on the side of the punching template 57, and the groove respectively engages with the slot strip 56, the clamping strip 55, and the lifting frame 51. Screws 510 are connected to the punching template 57. The bottom surface is threaded, and the positioning plate 58 has multiple equally spaced holes on its bottom surface. The slot rod 592 fits into the positioning plate 58, and the alignment slot 511 is inserted into the slot rod 592. The punching head 591 slides through the bottom surface of the positioning plate 58 from the top surface. The lifting frame 51 is fixedly connected to the guide frame 10 located above. When starting work, the drive motor 8 rotates, driving the connected lead screw 9 to rotate, causing the lead screw 9 to drive the guide frame 10 to move downward along the guide rail 11. The movement of the guide rail 11 drives the connected lifting frame 51 to move downward together. When adjusting the matching punching position according to different motherboard models, multiple tool structures 59 need to be inserted into the corresponding alignment slots 511 on the punching template 57 so that the position of the tool structure 59 is aligned with the punching position of the PCB board. To align the punching template 57, insert the slot rod 592 into the alignment slot 511, then cover the bottom of the punching template 57 with the positioning plate 58, allowing the punching head 591 to pass through the pre-drilled hole in the positioning plate 58. Secure the positioning plate 58 at its four corners with screws 510. Next, install the punching template 57 onto the lifting frame 51. By rotating the threaded rod 52, push the pusher block 53 to slide along the inclined guide plate 54, causing the inclined guide plate 54 to push the clamping strip 55 and the slot strip 56 to fit against the surface of the punching template 57. This allows the clamping strip 55 and the slot strip 56 to engage with the grooves on the side of the punching template 57, thus achieving rapid fixing of the punching template 57. The modular slot design allows for quick replacement or adjustment of the position and number of punch heads.It can adapt to PCBs of different models, sizes, or hole positions without the need for customized molds, significantly reducing changeover costs and time. This is especially suitable for small-batch, multi-variety production scenarios. Secondly, the equidistant array layout ensures standardized and consistent tool head positioning. Combined with the rigid support of the mold, it effectively reduces offset or vibration during punching, guaranteeing the dimensional accuracy and relative positional tolerance of the holes, and avoiding PCB assembly problems caused by accumulated errors.

[0032] The material changing and positioning mechanism 6 includes a rotating plate frame 61. An outer shaft 65 is fixedly connected to the center of the top of the rotating plate frame 61. An inner shaft 64 is rotatably connected to the inner side of the outer shaft 65. A clamping plate 62 is fixedly connected to the top of the inner shaft 64. A clamping strip 63 is fixedly connected to the outer edge of the clamping plate 62. A clamping groove 66 is provided on the side of the clamping strip 63. A telescopic arc frame 612 is slidably connected to the bottom surface of the outer shaft 65. A guide groove ring 611 is fixedly connected to the side of the telescopic arc frame 612. An elastic rod 613 is slidably connected to the bottom surface of the telescopic arc frame 612. A ring is rotatably connected to the outer side of the outer shaft 65. A hydraulic rod 67 is fixedly connected to the outer surface of the ring. A clamping block 68 is fixedly connected to the bottom surface of the hydraulic rod 67. A grooved plate 69 is provided below the ring. A guide groove is provided on the bottom surface of the grooved plate 69. A fixed block 615 is fixedly connected to the bottom surface of the lifting plate 2 in the groove 610. A folding rod 614 is hinged to one side of the fixed block 615. The lifting plate 2 is rotatably connected to the rotating plate frame 61. A sliding groove for sliding the clamping plate 62 is opened on the outer side of the top of the outer shaft 65. The guide ring 611 is slidably connected to the inner shaft 64. A spiral groove is opened on the outer surface of the inner shaft 64. A spring spring is provided on the outer side of the elastic rod 613 of the telescopic arc frame 612, and the two ends of the spring spring are fixedly connected to the elastic rod 613 and the telescopic arc frame 612 respectively. A compression spring is provided on the outer side of the inner shaft 64, and the two ends of the compression spring are fixedly connected to the guide ring 611 and the outer shaft 65 respectively. The groove plate 69 is fixedly connected to the outer shaft 65. A spring plate is provided between the folding rod 614 and the fixed block 615. The two ends of the spring sheet are fixedly connected to the fixed block 615 and the folding rod 614 respectively. When the rotating plate frame 61 is divided into four grids, the grid located directly below the punching template 57 is in the processing position, the grid located to the left of the lifting platform 3 is in the feeding position, the grid located directly in front of the lifting platform 3 is in the unloading position, and the grid located diagonally opposite the punching template 57 is in the cleaning position. When the rotating plate frame 61 needs to rotate, the hydraulic rod 67 extends and pushes the end ring, causing the ring to push the outer shaft 65 to slide along the inclined groove on the lifting plate 2 for a certain distance. When the grooved plate 69 on the outside of the outer shaft 65 contacts it, the folding rod 614 provides resistance, causing the guide groove 610 on the grooved plate 69 to slide with the folding rod 614, guiding the grooved plate 69 to rotate around the ring via the outer shaft 65. At this time, the slotted plate 69 rotates 90 degrees. Then, the hydraulic rod 67 pulls the ring to make the slotted plate 69 slide in the opposite direction along the inclined groove on the lifting plate 2. Since there is damping between the slotted plate 69 and the ring through the outer shaft 65, the slotted plate 69 pushes the folding rod 614 through the guide groove 610, which squeezes the flexible spring sheet to flip around the fixed block 615. After the slotted plate 69 passes the folding rod 614, it engages with the locking block 68 on the hydraulic rod 67, guiding the slotted plate 69 to return to its original position after rotation. At the same time, when the elastic rod 613 is compressed, it pushes the telescopic arc frame 612 to move. The telescopic arc frame 612 slides along the thread on the outside of the inner shaft 64 through the guide groove ring 611. The telescopic arc frame 612 extends and retracts into the outer shaft 65, causing the inner shaft 64 to rotate and drive the locking plate 62 and locking plate strip 63 to deflect.The clamping strip 63 is deflected from the side of the transfer frame 61. The clamping groove 66 on the side of the clamping strip 63 pushes the corner of the motherboard to fit against the inner frame of the transfer frame 61 to correct its position. The clamping groove 66 also holds one corner of the PCB board, positioning it against the inner frame of the transfer frame 61. Rotation moves the loaded PCB board to the processing area, and rotation again transfers the processed PCB board out. Combined with positioning calibration during processing, this significantly improves production efficiency and processing accuracy. The rotary transfer mechanism enables continuous material flow, reducing idle time in traditional linear transport and seamlessly connecting loading / unloading with the processing process, thereby improving overall production efficiency. Positioning calibration during processing ensures the positional accuracy of the PCB board in the processing area, avoiding positioning deviations caused by accumulated errors or mechanical vibration, and guaranteeing the accuracy of processes such as drilling, surface mount technology (SMT), or soldering.

[0033] The material collection mechanism 7 includes a material trough 71, which is located on the top surface of the front half of the lifting plate 2. A tilting plate 73 is hinged to the inner side of the material trough 71. Two tilting frames 74 are fixedly connected to the bottom surface of the tilting plate 73. A seat plate 75 is slidably connected between the two tilting frames 74. A lifting plate 72 is installed inside the processing table 1. A collection box 77 is fixedly connected to the upper surface of the lifting plate 72. A hollow rubber pad 76 is installed inside the collection box 77. The seat plate 75 is fixedly connected to the lifting plate 72. The lead screw 9 has a bidirectional thread. The lower guide 10 is fixedly connected to the lifting plate 72. When the lead screw 9 rotates, the lower guide 10 drives the lifting plate 72 to rise. The lifting plate 72 pushes the elastic rod 613 to be compressed, causing the elastic rod 613 to push the telescopic arc frame 612 to retract into the outer shaft 65. When the clamping strip 63 contacts the PCB board, the clamping plate 62 no longer deflects. At this time, the lifting plate 72 continues to apply pressure, and the telescopic arc frame 612 no longer extends into the outer shaft 65. The telescopic arc frame 612 drives the elastic rod 613 to slide and compress the elastic spring. During the rotation of the turntable 61, the waste generated from punching falls through the inclined groove on the surface of the lifting plate 2 into the space above the lifting plate 72. Another portion, along with the processed PCB board, moves along the tilted flip plate 73 to the cavity pad 76 above the collection box 77. The lighter waste falls onto the lifting plate 72, thus collecting the waste and preventing it from remaining on the lifting plate 2 and affecting the placement of the bare printed circuit board. When the lifting plate 72 moves downwards, it follows the flip plate 75 through the connected base plate 75. The sliding mechanism 74 causes the flipping frame 74 to tilt the flipping plate 73 downwards, thus unloading the PCB board. The PCB board falling onto the cavity pad 76 is cushioned and facilitates subsequent transfer by other devices. The design of collecting stamping waste and guiding the unloading of the main board by rotating the structure can significantly optimize the production process and improve the overall performance of the equipment. By using centrifugal force or directional motion, the waste is concentrated and thrown to a specific collection area, avoiding the accumulation of waste in the mold or processing area, reducing the frequency of downtime for cleaning, and reducing the risk of waste scratching the workpiece.

[0034] Working principle: At the start of operation, the drive motor 8 rotates, driving the connected lead screw 9 to rotate. The lead screw 9 drives the guide frame 10 to move downwards along the guide rail 11. The movement of the guide rail 11 drives the connected lifting frame 51 downwards as well. When adjusting the matching punching position according to different motherboard models, multiple tool structures 59 need to be inserted into the corresponding alignment slots 511 on the punching template 57, so that the position of the tool structure 59 corresponds to the punching position on the PCB board. Insert the slot rod 592 into the alignment slot 511, and then cover the bottom of the punching template 57 with the positioning plate 58, so that the punching head 591 passes through the reserved hole on the positioning plate 58. Then fix the four corners of the positioning plate 58 with screws 510. After that, install the punching template 57 onto the lifting frame 51, and push the push block by rotating the threaded rod 52. 53 slides along the inclined guide plate 54, and the inclined guide plate 54 pushes the connection of the clamping strip 55 and the slot strip 56 to fit against the surface of the punching template 57, and the clamping strip 55 and the slot strip 56 fit into the groove on the side of the punching template 57, thereby realizing the quick fixation of the punching template 57. Through the modular slot design, the position and number of the cutter head can be quickly changed or adjusted. It can adapt to PCB boards of different models, sizes or hole positions without the need for customized special molds, which greatly reduces the cost and time of changeover. It is especially suitable for small-batch, multi-variety production scenarios. Secondly, the equidistant array layout ensures the standardization and consistency of the cutter head positioning. With the rigid support of the mold, it can effectively reduce the offset or vibration during the punching process, ensure the dimensional accuracy and relative position tolerance of the hole position, and avoid PCB assembly problems caused by cumulative errors.

[0035] When the rotating plate frame 61 is divided into four compartments, the compartment directly below the punching template 57 is in the processing position, the compartment to the left of the lifting platform 3 is in the feeding position, the compartment directly in front of the lifting platform 3 is in the unloading position, and the compartment diagonally opposite the punching template 57 is in the cleaning position. When the rotating plate frame 61 needs to rotate, the hydraulic rod 67 extends and pushes the end ring, causing the ring to push the outer shaft 65 to slide a certain distance along the inclined groove on the lifting plate 2. When the grooved plate 69 on the outer side of the outer shaft 65 contacts it, the folding rod 614 provides resistance to guide the guide groove 61 on the grooved plate 69. 0 slides with the folding rod 614, guiding the slotted plate 69 to rotate around the ring via the outer shaft 65. At this time, the slotted plate 69 rotates ninety degrees. Then, the hydraulic rod 67 pulls the ring to make the slotted plate 69 slide in the opposite direction along the inclined groove on the lifting plate 2. Due to the damping between the slotted plate 69 and the ring via the outer shaft 65, the slotted plate 69 pushes the folding rod 614 through the guide groove 610, which will squeeze the flexible spring sheet to flip around the fixed block 615. This causes the slotted plate 69 to pass over the folding rod 614 and engage with the locking block 68 on the hydraulic rod 67, guiding the slotted plate 69 to return to its original position after rotation. At the same time, when the elastic rod 6... When 13 is under pressure, it pushes the telescopic arc frame 612 to move, causing the telescopic arc frame 612 to slide along the thread on the outer side of the inner shaft 64 through the guide groove ring 611. The telescopic arc frame 612 extends and retracts into the inner shaft 65, causing the inner shaft 64 to rotate and drive the clamping plate 62 and clamping strip 63 to deflect. The clamping strip 63 deflects out from the side of the turntable 61, and pushes the edge of the main board to fit against the inner frame of the turntable 61 through the clamping groove 66 on the side of the clamping strip 63 to correct its position. It also holds a corner of the PCB board through the clamping groove 66, positioning the PCB board against the inner frame of the turntable 61. By rotating, the deployed P is placed... The CB board is moved to the processing area, and then the processed PCB board is transferred out by rotation. Combined with positioning calibration during processing, production efficiency and processing accuracy can be significantly improved. The rotary transfer mechanism can realize continuous material flow, reduce idle waiting time in traditional linear handling, and make loading and unloading and processing seamlessly connected, thereby improving overall production efficiency. Positioning calibration during processing can ensure the positional accuracy of the PCB board in the processing area, avoid positioning deviations caused by cumulative errors or mechanical vibration, and ensure the accuracy of processes such as drilling, surface mount, or soldering.

[0036] When the lead screw 9 rotates, the guide frame 10 below drives the lifting plate 72 to rise. The lifting plate 72 pushes the elastic rod 613 to be compressed, causing the elastic rod 613 to push the telescopic arc frame 612 to retract into the outer shaft 65. When the clamping strip 63 contacts the PCB board, the clamping plate 62 no longer deflects. At this time, the lifting plate 72 continues to apply pressure, and the telescopic arc frame 612 no longer extends into the outer shaft 65. The telescopic arc frame 612 drives the elastic rod 613 to slide and compress the elastic spring. During the rotation of the rotating plate frame 61, the waste generated by punching will fall into the lifting plate 72 through the inclined groove on the surface of the lifting plate 2. Another part will move along the tilted flip plate 73 to the cavity pad 76 above the collection box 77 with the processed PCB board. The lighter waste will fall into the cavity pad 76. Above the lifting plate 72, waste can be collected, preventing waste residue from affecting the placement of bare printed circuit boards. When the lifting plate 72 moves down, it slides along the flipping frame 74 via the connected seat plate 75, causing the flipping frame 74 to drive the flipping plate 73 to tilt downwards, thus unloading the PCB board. The PCB board falling on the cavity pad 76 is buffered and facilitates subsequent transfer by other devices. The design of collecting stamping waste and guiding the unloading of the main board by rotating the structure can significantly optimize the production process and improve the overall performance of the equipment. By using centrifugal force or directional motion, the waste is concentrated and thrown to a specific collection area, avoiding the accumulation of waste in the mold or processing area, reducing the frequency of downtime for cleaning, and reducing the risk of waste scratching the workpiece.

[0037] This invention provides a punching machine for a PCB pre-alignment adjustment structure. Many methods and approaches exist for implementing this technical solution; the above description is merely a preferred embodiment of the invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this invention, and these improvements and modifications should also be considered within the scope of protection of this invention. All components not explicitly stated in this embodiment can be implemented using existing technologies.

Claims

1. A PCB pre-alignment adjustment structure punching machine, comprising a processing table (1), characterized in that: The top surface of the processing table (1) is fixedly connected to a lifting plate (2), and the rear side of the processing table (1) is fixedly connected to a lifting table (3). The interior of the lifting table (3) is provided with a stamping mechanism (5). The stamping mechanism (5) includes a lifting frame (51), a threaded rod (52) is threadedly connected to the left side of the lifting frame (51), a pusher block (53) is rotatably connected to the end of the threaded rod (52), and inclined guide plates (54) are slidably connected to both the upper and lower sides of the pusher block (53). A slot strip (56) is fixedly connected to the side of the inclined guide plate (54) away from the threaded rod (52). A punching template (57) is provided on the inner side of the lifting frame (51), and a clamping strip (55) is fixedly connected to the rear side of the slot strip (56). A positioning plate (58) is provided on the bottom surface of the slot template (57). Screws (510) are provided at the four corners of the positioning plate (58). Multiple tool structures (59) are provided between the slot template (57) and the positioning plate (58). The tool structure (59) includes a slot rod (592). A stamping head (591) is fixedly connected to the bottom of the slot rod (592). A top plate ring (593) is fixedly connected to the outer surface of the stamping head (591). Multiple equidistant alignment slots (511) are opened on the bottom surface of the slot template (57). A sliding rod frame (4) is provided above the lifting plate (2), and a material changing positioning mechanism (6) is provided at the bottom of the lifting plate (2). The side of the punching template (57) is provided with a groove, and the groove is respectively engaged with the slot strip (56), the clamping strip (55) and the lifting frame (51). The screw (510) is threaded to the bottom surface of the punching template (57). The bottom surface of the positioning plate (58) is provided with a plurality of equally spaced holes. The slot rod (592) is engaged with the positioning plate (58). The alignment slot (511) is inserted into the slot rod (592). The punching cutter head (591) slides through the bottom surface of the positioning plate (58) from the top surface. The material changing and positioning mechanism (6) includes a rotating plate frame (61). An outer shaft (65) is fixedly connected to the center of the top of the rotating plate frame (61). An inner shaft (64) is rotatably connected to the inner side of the outer shaft (65). A clamping plate disk (62) is fixedly connected to the top of the inner shaft (64). A clamping plate strip (63) is fixedly connected to the outer edge of the clamping plate disk (62). A clamping groove (66) is provided on the side of the clamping plate strip (63). A telescopic arc frame (612) is slidably connected to the bottom surface of the outer shaft (65). A telescopic arc frame (612) is fixedly connected to the side of the telescopic arc frame (612). The bottom surface of the telescopic arc frame (612) is slidably connected to the guide groove ring (611), the outer side of the outer shaft (65) is rotatably connected to the ring, and the outer surface of the ring is fixedly connected to the hydraulic rod (67). The bottom surface of the hydraulic rod (67) is fixedly connected to the locking block (68). The bottom of the ring is provided with a grooved plate (69), the bottom surface of the grooved plate (69) is provided with a guide groove (610), the bottom surface of the lifting plate (2) is fixedly connected to the fixing block (615), and one side of the fixing block (615) is hinged to the folding rod (614).

2. The PCB pre-alignment adjustment structure punching machine according to claim 1, characterized in that: Below the material changing positioning mechanism (6) is a material collection mechanism (7). The rear side and the top right side of the lifting platform (3) are equipped with drive motors (8). The output shaft of the drive motor (8) is fixedly connected to a lead screw (9). The outer side of the lead screw (9) is threadedly connected to two guide frames (10). The side of the guide frame (10) near the lifting platform (3) is slidably connected to a guide rail (11). The lifting frame (51) is fixedly connected to the guide frame (10) located above.

3. A PCB pre-alignment adjustment structure punching machine according to claim 2, characterized in that: The lifting plate (2) is rotatably connected to the rotating plate frame (61). The outer side of the top of the outer shaft (65) is provided with a sliding groove for the sliding of the card plate (62). The guide groove ring (611) is slidably connected to the inner shaft (64). The outer surface of the inner shaft (64) is provided with a spiral groove. The telescopic arc frame (612) is provided with a spring on the outer side of the elastic rod (613). The two ends of the spring are fixedly connected to the elastic rod (613) and the telescopic arc frame (612) respectively.

4. A PCB pre-alignment adjustment structure punching machine according to claim 3, characterized in that: A compression spring is provided on the outer side of the inner shaft (64), and the two ends of the compression spring are fixedly connected to the guide groove ring (611) and the outer shaft (65) respectively. The groove plate (69) is fixedly connected to the outer shaft (65). A spring sheet is provided between the folding rod (614) and the fixing block (615), and the two ends of the spring sheet are fixedly connected to the fixing block (615) and the folding rod (614) respectively.

5. A PCB pre-alignment adjustment structure punching machine according to claim 2, characterized in that: The material collection mechanism (7) includes a material trough (71), which is located on the top surface of the front half of the lifting plate (2). A flip plate (73) is hinged to the inner side of the material trough (71). Two flip frames (74) are fixedly connected to the bottom surface of the flip plate (73). A seat plate (75) is slidably connected between the two flip frames (74). A lifting plate (72) is provided inside the processing table (1). A collection box (77) is fixedly connected to the upper surface of the lifting plate (72). A cavity gasket (76) is provided inside the collection box (77).

6. A PCB pre-alignment adjustment structure punching machine according to claim 5, characterized in that: The seat plate (75) is fixedly connected to the lifting plate (72), the lead screw (9) is a two-way thread, and the guide frame (10) located below is fixedly connected to the lifting plate (72).

Images