Intelligent test platform for fault self-diagnosis and repair of super-large-scale integrated circuit burn-in board

Abstract

The invention discloses an intelligent test platform for fault self-diagnosis and repair of a super-large-scale integrated circuit burn-in board, and relates to the technical field of circuit board test platform equipment.The intelligent test platform comprises a bottom mounting box, and a supporting table is mounted at the top of the bottom mounting box. A display lamp carries out on-site early warning in a light flickering mode, a top mounting transverse plate and a corresponding supporting column are positioned and mounted through a fifth positioning bolt, so that the stability of an electric telescopic rod during operation is improved, a storage battery is mounted on one side of one second limiting plate, and the storage battery is arranged on the other side of the other second limiting plate; the storage battery is used for providing power resources required by operation of part of power equipment; the bottom supporting mechanism and the auxiliary heat dissipation mechanism are arranged, after angle adjustment of the control panel is completed, a first limiting plate and the control panel are positioned through a first positioning bolt, and the flexibility of the control panel in use is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board testing platform equipment, in particular to an intelligent testing platform for self-diagnosis and repair of faults of aging ultra-large-scale integrated circuit boards. Background Art

[0002] Very large-scale integrated circuits (VLSIs) integrate thousands or even millions of logic gates and components on a single chip, and are typically used in processors, memory, communications equipment, and other fields. Due to their large scale and complexity, traditional integrated circuit testing methods often struggle to meet the demands for efficient and high-precision testing.

[0003] Integrated circuit aging refers to the gradual decline in performance, increased failure rates, and even hardware damage caused by environmental factors such as current and temperature over long periods of operation. This aging issue poses a significant challenge to chip reliability, especially in high-performance, long-life applications. Therefore, regular fault diagnosis and testing of circuit boards are essential, typically requiring specialized platforms.

[0004] Although there are some intelligent platforms and tools for VLSI fault diagnosis and repair in existing technologies, most of them still have the following shortcomings: The repair process is not flexible and often relies on manual intervention; The support stability of the fault diagnosis equipment is poor, resulting in varying degrees of shaking during operation, thus affecting the test accuracy during actual operation; Due to the long-term operation of the repair equipment, the working environment will be kept in a high temperature state for a long time, thus affecting the service life of the equipment.

[0005] Therefore, the present invention needs to design an intelligent test platform for self-diagnosis and repair of faults of ultra-large-scale integrated circuit aging boards to solve the above-mentioned problems. Summary of the Invention

[0006] The purpose of the present invention is to provide an intelligent test platform for self-diagnosis and repair of faults of aging boards of very large-scale integrated circuits, so as to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solution: an intelligent test platform for self-diagnosis and repair of VLSI aging board faults, comprising a bottom mounting box: A support table is installed on the top of the bottom mounting box, a test platform is installed on the top of the support table, a placement table is installed on the top of the test platform, and test circuit boards distributed evenly are installed inside the placement table. Support columns are fixedly connected on all sides of the placement table, and a top mounting cross plate is installed at one end of the top of the four support columns. The top of the top mounting cross plate is fixedly connected to an electric telescopic rod, and the output end of the electric telescopic rod is fixedly connected to a push rod extending to the inside of the top mounting cross plate. The bottom of the push rod is fixedly connected to a push plate, and the bottom of the push plate is installed with test modules distributed evenly, and the test modules are all located on the test circuit board. Above the board, the bottom of the placement table is fixedly connected with supporting feet on all sides, and one end of the bottom of the supporting feet is connected to the test platform. The placement table is supported by multiple supporting feet. During operation, the test circuit board that needs to be self-diagnosed for faults is placed inside the placement table and on top of the test pen. A test is performed once, and the electric telescopic rod is operated to drive the push rod to move downward, driving the push plate to move downward, so that multiple test modules all move downward until the test circuit board inside the placement table is subjected to a second test. The test module can be replaced with equipment corresponding to the inspection item as needed, thereby improving the flexibility of the equipment. An auxiliary heat dissipation mechanism is installed inside the bottom installation box, and temperature sensors are installed inside the bottom installation box and on both sides of the installation partition; The auxiliary heat dissipation mechanism includes a mounting baffle, a semiconductor refrigeration end is mounted on the top of the mounting baffle, and the top of the semiconductor refrigeration end is fixedly connected with equidistantly distributed temperature-conducting iron sheets, an upper mounting cover is mounted on the outside of the temperature-conducting iron sheets, and two first fans extending to the inside of the support platform are mounted on the top of the upper mounting cover, and a lower mounting cover is mounted on the bottom of the mounting baffle, and a semiconductor heating end is mounted inside the lower mounting cover. The temperature change inside the bottom mounting box is monitored and processed by a temperature sensor. When the heat dissipation is normal, the two first fans are operated to perform normal heat dissipation for the test. When rapid heat dissipation is required, both the mounting baffle and the first fan are operated to perform rapid cooling and accelerate the heat dissipation efficiency. The equidistantly distributed temperature-conducting iron sheets assist in the conduction of the refrigerant gas. The heat generated when the mounting baffle is in operation is discharged through the semiconductor refrigeration end. The semiconductor refrigeration end and the semiconductor heating end are separated by the mounting baffle to avoid confusion of hot and cold gases during operation. Bottom support mechanisms are installed around the bottom of the bottom installation box, and the bottom support mechanisms are used to support the entire equipment.

[0008] As a preferred embodiment of the present invention, the bottom support mechanism includes a bottom support block and an anti-slip mounting block. The bottom of the bottom mounting box is fixedly connected to a bottom moisture-proof plate. The bottom of the bottom moisture-proof plate is fixedly connected to four equally distributed bottom support blocks. The structure of the bottom support blocks is a concave structure. The bottom outer side of the bottom support blocks is covered with an anti-slip mounting block. The interior of the bottom support blocks is threadedly connected with a third positioning bolt that passes through the anti-slip mounting block. The bottom support mechanism and the installation position are positioned by the third positioning bolt, thereby realizing the positioning operation of the entire equipment and the installation position, thereby improving the overall stability of the equipment during operation.

[0009] As a preferred embodiment of the present invention, the interior of the anti-slip mounting block is provided with a limit groove for cooperating with the installation of the bottom support block, the outer side of the anti-slip mounting block is threadedly connected with a second positioning bolt extending to the interior of the corresponding bottom support block, and the interior of the anti-slip mounting block is provided with a mounting hole, and a counterweight block can be placed inside the mounting hole to reinforce the overall equipment. The bottom support block and the anti-slip mounting block are positioned and installed by the second positioning bolt, which improves the stability of the connection of the bottom support mechanism and facilitates the rapid disassembly and assembly of the above-mentioned equipment during maintenance.

[0010] As a preferred embodiment of the present invention, the interior of the placement table is equipped with test pens that are evenly distributed and extend into the interior of the test platform, the test pens are all located below the corresponding test circuit boards, a detection circuit box is installed inside the test platform, the bottom ends of the test pens extend into the interior of the detection circuit box, the top of the test platform is equipped with wire connectors extending into the interior of the detection circuit box, the top of the wire connectors are equipped with display lights, the top of the top-mounted horizontal plate is threadedly connected with fifth positioning bolts used to limit the corresponding support columns, the display lights provide on-site warnings by flashing lights, the top-mounted horizontal plate and the corresponding support columns are positioned and installed by the fifth positioning bolts, thereby improving the stability of the electric telescopic rod during operation.

[0011] As a preferred embodiment of the present invention, auxiliary heat sinks distributed equally are installed at the bottom of the semiconductor heating end and inside the lower mounting cover, and two first mounting brackets are installed on the top of the upper mounting cover. The two first fans are both located inside the corresponding first mounting brackets, and the tops of the two first mounting brackets are threaded with sixth positioning bolts on all four sides. The two first mounting brackets extend to the inside of the support platform, and the top of the support platform is provided with an air outlet cavity for use with the first mounting bracket. The first mounting bracket and the upper mounting cover are positioned and installed by multiple sixth positioning bolts, and the auxiliary heat sinks are used to assist temperature conduction and accelerate heat dissipation efficiency.

[0012] As a preferred embodiment of the present invention, two second mounting brackets are installed at the bottom of the bottom mounting box, and second fans are installed inside the two second mounting brackets. The bottoms of the two second mounting brackets are threadedly connected with seventh positioning bolts that are evenly distributed and extend to the bottom of the bottom mounting box. The second mounting brackets and the bottom of the bottom mounting box are positioned and installed by multiple seventh positioning bolts, which improves the installation stability of the equipment. The second fan is a bidirectional fan. When the second fan is operated, the heat generated by the semiconductor heating end is discharged in time, thereby quickly dissipating the heat inside the bottom mounting box and extending the service life of the equipment.

[0013] As a preferred embodiment of the present invention, positioning plates are installed on the top of the bottom mounting box and on both sides of the support platform, and the two sides of the positioning plates that are close to each other are rotatably connected to the second limit plate, and the outer sides of the two positioning plates are installed with fourth positioning bolts that cooperate with the corresponding second limit plates to limit the positions. The positioning plates and the second limit plates are used to limit the two sides during actual testing, and the setting angle of the second limit plate can be manually adjusted. The interior of the positioning plates and the second limit plates are both provided with sound-absorbing cotton, which has a certain degree of noise reduction effect. A battery is installed on one side of one of the second limit plates, and the battery is used to provide the power resources required for the operation of some electrical equipment.

[0014] As a preferred embodiment of the present invention, a lighting lamp is fixedly connected to one side of the bottom mounting box, a handle is installed on the side of the bottom mounting box adjacent to the lighting lamp, and a sealed storage box is installed on the side of the bottom mounting box opposite to the lighting lamp. A placement cavity is provided inside the sealed storage box, and equidistantly distributed viewing windows are provided on the outside of the sealed storage box. Some required equipment is sealed and stored through the sealed storage box and the placement cavity, and the items and equipment stored inside the sealed storage box can be conveniently viewed through the viewing window, and the entire equipment can be conveniently moved through the handle.

[0015] As a preferred embodiment of the present invention, two first limit plates are fixedly connected to the top of the bottom mounting box and on the side of the support platform adjacent to the battery. The interiors of the two first limit plates are rotatably connected to the control panel, and the outer sides of the two first limit plates are installed with first positioning bolts that cooperate with the control panel to limit the position. After the angle adjustment of the control panel is completed, the first limiting plate and the control panel are positioned by the first positioning bolts, thereby improving the flexibility of the control panel when used.

[0016] As a preferred embodiment of the present invention, the battery, electric telescopic rod, test module, test pen, wire connector, display light, detection circuit box, semiconductor refrigeration end, semiconductor heating end, first fan, second fan and temperature sensor are all electrically connected to the control panel. The control panel is used to control the operation of the battery, electric telescopic rod, test module, test pen, wire connector, display light, detection circuit box, semiconductor refrigeration end, semiconductor heating end, first fan, second fan and temperature sensor, thereby realizing unified management of power equipment.

[0017] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention is provided with a bottom mounting box, a test platform and a positioning plate, thereby improving the flexibility of the equipment. The display light flashes to provide on-site warning. The top mounting horizontal plate and the corresponding support column are positioned and installed by the fifth positioning bolt, thereby improving the stability of the electric telescopic rod during operation. The positioning plate and the second limit plate are used to limit the two sides during actual testing. At the same time, the setting angle of the second limit plate can be manually adjusted. The positioning plate and the second limit plate are both provided with silencer cotton, which also has a certain degree of noise reduction effect. A battery is installed on one side of one of the second limit plates, and the battery is used to provide the power resources required for the operation of some power equipment. 2. The present invention is provided with a bottom support mechanism and an auxiliary heat dissipation mechanism, which is convenient for quick disassembly and assembly of the above-mentioned equipment during maintenance. The first mounting frame and the upper mounting cover are positioned and installed by multiple sixth positioning bolts. The auxiliary heat sink is used to assist temperature conduction and accelerate heat dissipation efficiency. The second mounting frame and the bottom of the bottom mounting box are positioned and installed by multiple seventh positioning bolts, which improves the installation stability of the equipment. The second fan is a bidirectional fan. Through the operation of the second fan, the heat generated by the semiconductor heating end is discharged in time, thereby quickly dissipating the heat inside the bottom mounting box and extending the service life of the equipment. Some required equipment is sealed and stored by the sealed storage box and the placement cavity. The items and equipment stored in the sealed storage box are conveniently viewed through the visual window. The entire equipment is conveniently moved by the handle. After the angle adjustment of the control panel is completed, the first limit plate and the control panel are positioned by the first positioning bolt, which improves the flexibility of the control panel when used. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The overall structure of the intelligent test platform for self-diagnosis and repair of VLSI aging board faults of the present invention is shown in FIG. Figure 1 ; Figure 2 The overall structure of the intelligent test platform for self-diagnosis and repair of VLSI aging board faults of the present invention is shown in FIG. Figure 2 ; Figure 3This is a schematic diagram of the overall internal structure of the intelligent test platform for self-diagnosis and repair of VLSI aging board faults of the present invention; Figure 4 This is a schematic diagram of the exploded structure of the auxiliary heat dissipation mechanism of the intelligent test platform for self-diagnosis and repair of VLSI aging board faults of the present invention; Figure 5 An enlarged schematic diagram of the bottom support mechanism of the intelligent test platform for self-diagnosis and repair of VLSI aging board faults of the present invention; Figure 6 This is an attachment to the intelligent test platform for self-diagnosis and repair of VLSI aging board faults of the present invention. Figure 3 A schematic diagram of the structure at point A in the figure.

[0019] In the picture: 1. Bottom mounting box; 11. Lighting lamp; 12. Support platform; 13. Handle; 14. Sealed storage box; 15. Viewing window; 16. Battery; 17. First limit plate; 18. Control panel; 19. First positioning bolt; 2. Test platform; 21. Top mounting horizontal plate; 22. Push plate; 23. Electric telescopic rod; 24. Test module; 25. Placement table; 26. Test pen; 27. Test circuit board; 28. Support column; 29. ​​Push rod; 3. Bottom support mechanism; 31. Bottom support block; 32. Anti-slip mounting block; 33. Mounting hole; 34. Second positioning bolt; 35. Third positioning bolt; 36. Bottom moisture-proof plate; 4. Positioning plate; 41. Second limiting plate; 42. Fourth positioning bolt; 43. Fifth positioning bolt; 44. Support foot; 45. Plug connector; 46. Display light; 47. Detection circuit box; 5. Auxiliary heat dissipation mechanism; 51. Mounting partition; 52. Upper mounting cover; 53. Lower mounting cover; 54. Semiconductor cooling end; 55. Temperature conduction iron sheet; 56. Semiconductor heating end; 57. Auxiliary heat sink; 58. First fan; 59. Second fan; 6. Temperature sensor; 61. First mounting bracket; 62. Sixth positioning bolt; 63. Second mounting bracket; 64. Seventh positioning bolt. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figures 1-6 The present invention provides a technical solution: an intelligent test platform for self-diagnosis and repair of aging board faults of ultra-large-scale integrated circuits, comprising a bottom mounting box 1, a support platform 12 being mounted on the top of the bottom mounting box 1, a test platform 2 being mounted on the top of the support platform 12, a placement platform 25 being mounted on the top of the test platform 2, and test circuit boards 27 being mounted equidistantly inside the placement platform 25, support columns 28 being fixedly connected to the sides of the placement platform 25, a top mounting cross plate 21 being mounted on one end of the top of the four support columns 28, an electric telescopic rod 23 being fixedly connected to the top of the top mounting cross plate 21, a push rod 29 being fixedly connected to the output end of the electric telescopic rod 23 extending to the inside of the top mounting cross plate 21, a push plate 22 being fixedly connected to the bottom of the push rod 29, and a test circuit board 27 being mounted equidistantly on the bottom of the push plate 22. The test module group 24 and the test modules 24 are all located above the test circuit board 27. The bottom of the placement table 25 is fixedly connected with support feet 44 on all sides. One end of the bottom of the support feet 44 is connected to the test platform 2. The placement table 25 is supported by multiple support feet 44. During operation, the test circuit board 27 that needs to be self-diagnosed for faults is placed inside the placement table 25 and on top of the test pen 26. A test is performed. The electric telescopic rod 23 is operated to drive the push rod 29 to move downward, and the push plate 22 is driven to move downward, so that multiple test modules 24 are all moved downward until the test circuit board 27 inside the placement table 25 is subjected to a secondary test. The test module 24 can be replaced with a device corresponding to the inspection item as needed, thereby improving the flexibility of the equipment. An auxiliary heat dissipation mechanism 5 is installed inside the bottom installation box 1, and temperature sensors 6 are installed inside the bottom installation box 1 and on both sides of the installation partition 51; The auxiliary heat dissipation mechanism 5 includes a mounting baffle 51, a semiconductor cooling end 54 is mounted on the top of the mounting baffle 51, and the top of the semiconductor cooling end 54 is fixedly connected to an equidistantly distributed temperature conductive iron sheet 55, an upper mounting cover 52 is mounted on the outer side of the temperature conductive iron sheet 55, and two first fans 58 extending to the inside of the support platform 12 are mounted on the top of the upper mounting cover 52, a lower mounting cover 53 is mounted on the bottom of the mounting baffle 51, and a semiconductor heating end 56 is mounted inside the lower mounting cover 53. The temperature change inside the bottom mounting box 1 is monitored and processed by the temperature sensor 6. When the heat dissipation is normal, the two first fans 58 are operated to perform normal heat dissipation for the test. When rapid heat dissipation is required, the mounting baffle 51 and the first fans 58 are both operated to perform rapid cooling and accelerate the heat dissipation efficiency. The equidistantly distributed temperature conductive iron sheets 55 assist in the conduction of the refrigerant gas. The heat generated when the mounting baffle 51 is in operation is discharged through the semiconductor cooling end 54. The semiconductor cooling end 54 and the semiconductor heating end 56 are separated by the mounting baffle 51 to avoid confusion of hot and cold gases during operation. The bottom of the bottom installation box 1 is equipped with a bottom support mechanism 3 on all sides, and the bottom support mechanism 3 is used to support the entire equipment.

[0022] See also Figure 1-Figure 3 、 Figure 5 In this solution, the bottom support mechanism 3 includes a bottom support block 31 and an anti-slip mounting block 32. The bottom of the bottom mounting box 1 is fixedly connected to a bottom moisture-proof plate 36. The bottom of the bottom moisture-proof plate 36 is fixedly connected to four equally distributed bottom support blocks 31. The structure of the bottom support blocks 31 is a concave structure. The bottom outer side of the bottom support block 31 is covered with an anti-slip mounting block 32. The interior of the bottom support block 31 is threadedly connected with a third positioning bolt 35 that passes through the anti-slip mounting block 32. The bottom support mechanism 3 and the installation position are positioned by the third positioning bolt 35, thereby realizing the positioning operation of the entire equipment and the installation position, thereby improving the overall stability of the equipment during operation.

[0023] In this solution, the interior of the anti-slip mounting block 32 is provided with a limiting groove for cooperating with the bottom support block 31, and the outer side of the anti-slip mounting block 32 is threadedly connected with a second positioning bolt 34 extending to the interior of the corresponding bottom support block 31. The interior of the anti-slip mounting block 32 is provided with a mounting hole 33, and a counterweight block can be placed inside the mounting hole 33 to reinforce the overall equipment. The bottom support block 31 and the anti-slip mounting block 32 are positioned and installed by the second positioning bolt 34, which improves the stability of the connection of the bottom support mechanism 3 and facilitates the rapid disassembly and assembly of the above-mentioned equipment during maintenance.

[0024] See also Figure 1-Figure 3 、 Figure 6 In this solution, the interior of the placement table 25 is equipped with test pens 26 that are evenly distributed and extend into the interior of the test platform 2. The test pens 26 are all located below the corresponding test circuit boards 27. A detection circuit box 47 is installed inside the test platform 2. The bottom ends of the test pens 26 extend into the interior of the detection circuit box 47. Plug connectors 45 extending into the interior of the detection circuit box 47 are installed on all four sides of the top of the test platform 2. Display lights 46 are installed on the top of the plug connectors 45. The top of the top-mounted horizontal plate 21 is threadedly connected with fifth positioning bolts 43 that are used to limit the corresponding support columns 28. The display lights 46 provide on-site warnings by flashing lights. The top-mounted horizontal plate 21 and the corresponding support columns 28 are positioned and installed by the fifth positioning bolts 43, thereby improving the stability of the electric telescopic rod 23 during operation.

[0025] See also Figures 1-4In this solution, auxiliary heat sinks 57 are installed at equal intervals at the bottom of the semiconductor heating end 56 and inside the lower mounting cover 53. Two first mounting brackets 61 are installed on the top of the upper mounting cover 52. The two first fans 58 are both located inside the corresponding first mounting brackets 61. Sixth positioning bolts 62 are threadedly connected around the tops of the two first mounting brackets 61. The two first mounting brackets 61 extend into the interior of the support platform 12. An air outlet cavity is provided on the top of the support platform 12 to cooperate with the first mounting bracket 61. The first mounting bracket 61 and the upper mounting cover 52 are positioned and installed by multiple sixth positioning bolts 62. The auxiliary heat sinks 57 are used to assist temperature conduction and accelerate heat dissipation efficiency.

[0026] In this solution, two second mounting brackets 63 are installed at the bottom of the bottom mounting box 1, and a second fan 59 is installed inside the two second mounting brackets 63. The bottoms of the two second mounting brackets 63 are threadedly connected with seventh positioning bolts 64 that are evenly distributed and extend to the bottom of the bottom mounting box 1. The second mounting brackets 63 and the bottom of the bottom mounting box 1 are positioned and installed by multiple seventh positioning bolts 64, which improves the installation stability of the equipment. The second fan 59 is a bidirectional fan. When the second fan 59 is operated, the heat generated by the semiconductor heating end 56 is discharged in time, thereby quickly dissipating the heat inside the bottom mounting box 1 and extending the service life of the equipment.

[0027] See also Figure 1-Figure 3 、 Figure 6 In this solution, positioning plates 4 are installed on the top of the bottom mounting box 1 and on both sides of the support platform 12. The two positioning plates 4 are rotatably connected to the side close to each other with a second limit plate 41. The outer sides of the two positioning plates 4 are installed with fourth positioning bolts 42 that cooperate with the corresponding second limit plates 41 to limit the position. The positioning plates 4 and the second limit plates 41 are used to limit the two sides during actual testing. At the same time, the setting angle of the second limit plates 41 can be manually adjusted. The interior of the positioning plates 4 and the second limit plates 41 are both provided with silencer cotton, which also has a certain degree of noise reduction effect. A battery 16 is installed on one side of one of the second limit plates 41. The battery 16 is used to provide the power resources required for the operation of some electrical equipment.

[0028] See also Figure 1-Figure 3 In this solution, a lighting lamp 11 is fixedly connected to one side of the bottom mounting box 1, a handle 13 is installed on the side of the bottom mounting box 1 adjacent to the lighting lamp 11, and a sealed storage box 14 is installed on the side of the bottom mounting box 1 opposite to the lighting lamp 11. A placement cavity is provided inside the sealed storage box 14, and equidistantly distributed viewing windows 15 are provided on the outside of the sealed storage box 14. Some required equipment is sealed and stored through the sealed storage box 14 and the placement cavity. The viewing windows 15 facilitate viewing of items and equipment stored in the sealed storage box 14, and the handle 13 facilitates convenient movement of the entire equipment.

[0029] In this solution, two first limit plates 17 are fixedly connected to the top of the bottom mounting box 1 and on the side of the support platform 12 adjacent to the battery 16. The interior of the two first limit plates 17 is rotatably connected to the control panel 18. The outer sides of the two first limit plates 17 are installed with first positioning bolts 19 that cooperate with the control panel 18 to limit the position. When the angle adjustment of the control panel 18 is completed, the first limiting plates 17 and the control panel 18 are positioned by the first positioning bolts 19, which improves the flexibility of the control panel 18 when used.

[0030] See also Figures 1-6 In this solution, the battery 16, the electric telescopic rod 23, the test module 24, the test pen 26, the plug-in connector 45, the display light 46, the detection circuit box 47, the semiconductor cooling end 54, the semiconductor heating end 56, the first fan 58, the second fan 59 and the temperature sensor 6 are all electrically connected to the control panel 18. The control panel 18 is used to control the operation of the battery 16, the electric telescopic rod 23, the test module 24, the test pen 26, the plug-in connector 45, the display light 46, the detection circuit box 47, the semiconductor cooling end 54, the semiconductor heating end 56, the first fan 58, the second fan 59 and the temperature sensor 6, thereby realizing unified management of power equipment. The temperature sensor 6 measures environmental parameters, converts them into signals and sends them to the control panel 18. The control panel 18 receives and processes the signals and generates corresponding control signals according to a preset control algorithm.

[0031] See also Figures 1-6 , the working principle of the present invention: The present invention is provided with a bottom installation box 1, a test platform 2 and a positioning plate 4. When in use, the control panel 18 is opened, and the placement table 25 is supported by multiple supporting feet 44. During operation, the test circuit board 27 that needs to be self-diagnosed for faults is placed inside the placement table 25 and on top of the test pen 26. A test is performed. The electric telescopic rod 23 is operated to drive the push rod 29 to move downward, and the push plate 22 is driven to move downward, so that multiple test modules 24 all move downward until the test circuit board 27 inside the placement table 25 is subjected to a secondary test.

[0032] The test module 24 can be replaced with equipment corresponding to the inspection item as needed, thereby improving the flexibility of the equipment. The display light 46 provides on-site warning by flashing the light. The top mounting cross plate 21 and the corresponding support column 28 are positioned and installed by the fifth positioning bolt 43, thereby improving the stability of the electric telescopic rod 23 during operation.

[0033] The positioning plate 4 and the second limiting plate 41 are used to limit the two sides during actual testing. At the same time, the setting angle of the second limiting plate 41 can be manually adjusted. The interior of the positioning plate 4 and the second limiting plate 41 are both provided with sound-absorbing cotton, which has a certain degree of noise reduction effect.

[0034] The battery 16 is used to provide the power resources required for the operation of some power equipment. The control panel 18 is used to control the operation of the battery 16, the electric telescopic rod 23, the test module 24, the test pen 26, the wire connector 45, the display light 46, the detection circuit box 47, the semiconductor refrigeration end 54, the semiconductor heating end 56, the first fan 58, the second fan 59 and the temperature sensor 6, thereby realizing the unified management of the power equipment. The temperature sensor 6 measures the environmental parameters, converts them into signals and sends them to the control panel 18. The control panel 18 receives and processes the signals and generates corresponding control signals according to the preset control algorithm.

[0035] The present invention is provided with a bottom support mechanism 3 and an auxiliary heat dissipation mechanism 5, and the temperature change inside the bottom installation box 1 is monitored and processed by the temperature sensor 6. During normal heat dissipation, the two first fans 58 are in operation to perform normal heat dissipation for testing. When rapid heat dissipation is required, the partition 51 and the first fan 58 are both in operation to perform rapid cooling and accelerate the heat dissipation efficiency. The equidistantly distributed temperature conduction iron sheets 55 assist in the conduction of the refrigerant gas. The heat generated when the partition 51 is in operation is discharged through the semiconductor refrigeration end 54. The partition 51 is installed to separate the semiconductor refrigeration end 54 and the semiconductor heating end 56 to avoid confusion of hot and cold gases during operation.

[0036] The bottom support mechanism 3 and the installation position are positioned by the third positioning bolt 35, thereby realizing the positioning operation of the entire equipment and the installation position, improving the overall stability of the equipment during operation, and a counterweight block can be placed inside the mounting hole 33 to reinforce the entire equipment, and the bottom support block 31 and the anti-slip mounting block 32 are positioned and installed by the second positioning bolt 34, thereby improving the stability of the connection of the bottom support mechanism 3 and facilitating the rapid disassembly and assembly of the above-mentioned equipment during maintenance.

[0037] The first mounting bracket 61 and the upper mounting cover 52 are positioned and installed by multiple sixth positioning bolts 62, the auxiliary heat sink 57 is used to assist temperature conduction and accelerate the heat dissipation efficiency, and the second mounting bracket 63 and the bottom of the bottom mounting box 1 are positioned and installed by multiple seventh positioning bolts 64, thereby improving the installation stability of the equipment. The second fan 59 is a bidirectional fan. When the second fan 59 is operated, the heat generated by the semiconductor heating end 56 is discharged in time, thereby quickly dissipating the heat inside the bottom mounting box 1 and extending the service life of the equipment.

[0038] Some required equipment is sealed and stored through the sealed storage box 14 and the placement cavity, and the items and equipment stored inside the sealed storage box 14 can be easily viewed through the visual window 15. The handle 13 facilitates the convenient movement of the entire equipment. After the angle adjustment of the control panel 18 is completed, the first limiting plate 17 and the control panel 18 are positioned by the first positioning bolt 19, thereby improving the flexibility of the control panel 18 when in use.

[0039] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent test platform for self-diagnosis and repair of faults of aging boards of ultra-large-scale integrated circuits, comprising a bottom mounting box (1), characterized in that: A support platform (12) is installed on the top of the bottom mounting box (1), a test platform (2) is installed on the top of the support platform (12), a placement platform (25) is installed on the top of the test platform (2), and test circuit boards (27) are installed in the interior of the placement platform (25) at equal intervals. Support columns (28) are fixedly connected to the four sides of the placement platform (25), and a top mounting cross plate (21) is installed at one end of the top of the four support columns (28). The top of the top mounting cross plate (21) is fixedly connected to an electric telescopic rod (23), and the output end of the electric telescopic rod (23) is fixedly connected to a push rod (29) extending to the interior of the top mounting cross plate (21). The bottom of the push rod (29) is fixedly connected to a push plate (22), and the bottom of the push plate (22) is installed with test modules (24) at equal intervals. An auxiliary heat dissipation mechanism (5) is installed inside the bottom installation box (1), and temperature sensors (6) are installed inside the bottom installation box (1) and on both sides of the installation partition (51); The auxiliary heat dissipation mechanism (5) comprises a mounting baffle (51), a semiconductor cooling end (54) and an upper mounting cover (52) are mounted on the top of the mounting baffle (51), two first fans (58) extending into the interior of the support platform (12) are mounted on the top of the upper mounting cover (52), and a lower mounting cover (53) and a semiconductor heating end (56) are mounted on the bottom of the mounting baffle (51); Bottom support mechanisms (3) are installed around the bottom of the bottom installation box (1).

2. The intelligent testing platform for self-diagnosis and repair of VLSI aging board faults according to claim 1, characterized in that: The bottom support mechanism (3) comprises a bottom support block (31) and an anti-slip mounting block (32); the bottom of the bottom mounting box (1) is fixedly connected to a bottom moisture-proof plate (36); the bottom of the bottom moisture-proof plate (36) is fixedly connected to four bottom support blocks (31) distributed at equal intervals; the structure of each bottom support block (31) is a concave structure; the bottom outer side of each bottom support block (31) is sleeved with an anti-slip mounting block (32); the interior of each bottom support block (31) is threadedly connected to a third positioning bolt (35) that passes through the anti-slip mounting block (32).

3. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 2, characterized in that: The interior of the anti-slip mounting block (32) is provided with a limiting groove for matching the installation of the bottom support block (31), and the outer side of the anti-slip mounting block (32) is threadedly connected to a second positioning bolt (34) extending into the interior of the corresponding bottom support block (31).

4. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 1, characterized in that: The interior of the placement table (25) is installed with test pens (26) that are evenly distributed and extend into the interior of the test platform (2), and the interior of the test platform (2) is installed with a detection circuit box (47). The bottom ends of the test pens (26) extend into the interior of the detection circuit box (47), and the top of the test platform (2) is installed with plug connectors (45) that extend into the interior of the detection circuit box (47). The top of the plug connector (45) is installed with a display light (46), and the top of the top mounting cross plate (21) is threadedly connected with a fifth positioning bolt (43) used for limiting the corresponding support column (28).

5. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 4, characterized in that: Auxiliary heat sinks (57) are installed at equal intervals at the bottom of the semiconductor heating end (56) and inside the lower mounting cover (53). Two first mounting frames (61) are installed on the top of the upper mounting cover (52). The two first fans (58) are located inside the corresponding first mounting frames (61). Sixth positioning bolts (62) are threadedly connected around the tops of the two first mounting frames (61). The two first mounting frames (61) extend to the inside of the support platform (12).

6. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 5, characterized in that: Two second mounting frames (63) are installed at the bottom of the bottom mounting box (1), a second fan (59) is installed inside the two second mounting frames (63), and the bottoms of the two second mounting frames (63) are threadedly connected with seventh positioning bolts (64) that are equidistantly distributed and extend to the bottom of the bottom mounting box (1).

7. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 6, characterized in that: Positioning plates (4) are installed on the top of the bottom mounting box (1) and on both sides of the support platform (12), and the sides of the two positioning plates (4) close to each other are rotatably connected to the second limiting plates (41), and the outer sides of the two positioning plates (4) are installed with fourth positioning bolts (42) that cooperate with the corresponding second limiting plates (41) to limit the position.

8. The intelligent testing platform for self-diagnosis and repair of VLSI aging board faults according to claim 7, characterized in that: A lighting lamp (11) is fixedly connected to one side of the bottom mounting box (1), a handle (13) is installed on the side of the bottom mounting box (1) adjacent to the lighting lamp (11), and a sealed storage box (14) is installed on the side of the bottom mounting box (1) opposite to the lighting lamp (11).

9. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 7, characterized in that: Two first limiting plates (17) are fixedly connected to the top of the bottom mounting box (1) and located on one side of the support platform (12) adjacent to the battery (16), and the interiors of the two first limiting plates (17) are both rotatably connected to a control panel (18).

10. The intelligent test platform for self-diagnosis and repair of VLSI aging board faults according to claim 8, characterized in that: The battery (16), the electric telescopic rod (23), the test module (24), the test pen (26), the plug connector (45), the display light (46), the detection circuit box (47), the semiconductor cooling end (54), the semiconductor heating end (56), the first fan (58), the second fan (59) and the temperature sensor (6) are all electrically connected to the control panel (18).

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