FPC micro-optical module packaging system and method for AI glasses

Abstract

The invention relates to the technical field of AI glasses packaging, in particular to an FPC micro-optical module packaging system and method for AI glasses, and the system comprises at least one first optical element, at least one second optical element, an optical tweezers array generation system, an in-situ monitoring and feedback system and a curing system. The invention aims to solve the problems of low alignment precision and poor yield of optical module packaging in the prior art, and provides a micro-optical module precise packaging system and method capable of realizing active, real-time feedback and in-situ self-alignment.

Description

Technical Field

[0001] The present invention relates to the technical field of AI glasses packaging, and in particular to an FPC micro-optical module packaging system and method for AI glasses. Background Art

[0002] Currently, the core of AI glasses is the optical waveguide display module. Its imaging quality is highly dependent on the relative positional accuracy of the internal FPC and optical components (such as the Micro-LED display, collimating lens, coupling grating, waveguide, etc.), which is usually required to reach the sub-micron level. Existing technology mainly uses high-precision robotic arms for blind alignment and bonding, relying on the positioning accuracy of the equipment itself to complete the pressing and glue curing in one go. However, this method has the following drawbacks: Manufacturing tolerances of individual components and positioning errors of the robotic arm accumulate, resulting in poor final alignment accuracy; Shrinkage stress and thermal stress during the glue curing process can cause micro-displacement of components, destroying the aligned position; The above factors lead to low finished product yield and high production costs, which become the key bottleneck restricting the popularization of AI glasses.

[0003] Therefore, the industry urgently needs a precision packaging technology that can overcome the above-mentioned defects and achieve dynamic closed-loop alignment. Summary of the Invention

[0004] In order to overcome the shortcomings and deficiencies in the prior art, the present invention aims to solve the problems of low alignment accuracy and poor yield in optical module packaging in the prior art, and to provide a micro-optical module precision packaging system and method that can achieve active, real-time feedback, and in-situ self-alignment.

[0005] The present invention is achieved through the following technical solutions: In a first aspect, the present invention discloses an FPC micro-optical module packaging system for AI glasses, comprising: At least one first optical element and at least one second optical element, wherein at least one of the first optical element or the second optical element is pre-set with a plurality of dielectric microspheres for non-contact manipulation; an optical tweezers array generation system, configured to generate an independently addressable optical tweezers array to capture and manipulate the dielectric microspheres, respectively, and adjust the relative position and posture of the first optical element and the second optical element in three-dimensional space; an in-situ monitoring and feedback system for collecting, in real time during the alignment process, an output image of the optical system composed of the first optical element and the second optical element, analyzing a quality parameter of the image, and generating a control signal based on a difference between the quality parameter and a preset target, outputting the control signal to the optical tweezers array generation system; A curing system is used to cure the liquid medium between the first optical element and the second optical element to permanently lock their relative positions when the in-situ monitoring and feedback system determines that the image quality parameter of the optical system reaches a preset target.

[0006] In combination with the first aspect, further, the optical tweezers array generation system includes a laser source and a spatial light modulator, and the spatial light modulator is used to receive the control signal and phase-modulate the light beam emitted by the laser source to generate the independently addressable optical tweezers array.

[0007] In combination with the first aspect, further, the on-site monitoring and feedback system is used to quantify the quality parameters of the image by calculating at least one of the modulation transfer function value, brightness uniformity or distortion coefficient of the output image.

[0008] In combination with the first aspect, further, the first optical element is a micro display module, which is electrically connected to the in-situ monitoring and feedback system through a flexible circuit board, and is used to receive instructions during the alignment process and display a test image as a test light source.

[0009] In combination with the first aspect, further, it also includes a micro-dispensing device, which uses a non-contact piezoelectric injection valve to inject liquid optical glue as the liquid medium between the first optical element and the second optical element in a preset glue amount and path.

[0010] In a second aspect, the present invention discloses a method for packaging an FPC micro-optical module for AI glasses, comprising the following steps: S100 provides the first optical element and the second optical element, and injects liquid optical glue therebetween; S200 starts the optical tweezers array generation system, captures the dielectric microspheres, and starts the in-situ monitoring and feedback system to collect the initial output image and calculate the initial quality parameters; S300. The in-situ monitoring and feedback system continuously generates a control signal to drive the optical tweezers array generation system based on the difference between the quality parameter and the preset target, iteratively adjusting the relative position of the first optical element and the second optical element until the quality parameter reaches the preset target. S400. Start the curing system to cure the liquid optical adhesive.

[0011] In combination with the second aspect, further, the optical tweezers array is generated by a laser in the near-infrared band, and the liquid optical glue has a high transmittance to the laser in the near-infrared band.

[0012] In combination with the second aspect, further, the curing in step S400 is completed by starting an ultraviolet light source to irradiate the liquid optical adhesive.

[0013] In combination with the second aspect, further in steps S200 and S300, power is supplied to the first optical element and a signal for generating the test image is transmitted via a flexible circuit board connected to the first optical element.

[0014] In combination with the second aspect, further, in step S100, the liquid optical adhesive is sprayed in the form of micro-droplets to a designated area between the first optical element and the second optical element by a non-contact piezoelectric jet dispensing device.

[0015] In a third aspect, the present invention further discloses a computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the FPC micro-optical module packaging method as described above.

[0016] In a fourth aspect, the present invention further discloses a computer-readable storage medium having a computer program stored thereon, wherein the program is executed by a processor to implement the FPC micro-optical module packaging method as described above.

[0017] Beneficial effects of the present invention: The present invention relates to an FPC micro-optical module packaging system, method, computer device, and storage medium for AI glasses. By pre-setting microscopic handles that can be manipulated by non-contact force on the optical elements to be stacked, a closed-loop feedback system monitors the imaging quality in real time after the elements are stacked and injected with uncured optical glue. Optical tweezers array technology is used to manipulate the handles to fine-tune the elements until the optimal position is reached. The glue is then instantaneously cured to complete the packaging. This effectively addresses the problems of low yield and high production costs caused by tolerance accumulation and stress effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described with reference to the accompanying drawings. However, the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative effort.

[0019] Figure 1 FIG. 1 is a module diagram of a database system according to an embodiment of the present invention.

[0020] Figure 2 This is a flowchart of a method for packaging an FPC micro-optical module according to an embodiment of the present invention.

[0021] Figure 3 The figure is a schematic structural diagram of an electronic device provided by one embodiment of the present invention.

[0022] Figure 4 Schematic diagram of a storage medium provided by an embodiment of the present invention DETAILED DESCRIPTION To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Example 1 like Figure 1 As shown, this embodiment discloses an FPC micro-optical module packaging system for AI glasses, which includes: At least one first optical element 104 and at least one second optical element 105, wherein at least one of the first optical element 104 or the second optical element 105 is pre-set with a plurality of dielectric microspheres for contactless manipulation; An optical tweezers array generation system 103 is used to generate an independently addressable optical tweezers array to capture and manipulate the dielectric microspheres, and adjust the relative position and posture of the first optical element 104 and the second optical element 105 in three-dimensional space; An in-situ monitoring and feedback system 102 is used to collect an output image of the optical system composed of the first optical element 104 and the second optical element 105 in real time during the alignment process, analyze the quality parameters of the image, and generate a control signal based on the difference between the quality parameters and a preset target, and output it to the optical tweezers array generation system 103; The curing system 101 is used to cure the liquid medium between the first optical element 104 and the second optical element 105 to permanently lock their relative positions when the in-situ monitoring and feedback system 102 determines that the image quality parameters of the optical system reach a preset target.

[0024] In this embodiment, several small, high-refractive-index, transparent spheres (such as silica microspheres) with diameters as small as microns are pre-fixed using a semiconductor process to the non-functional edge of an optical component (such as the substrate of a Micro-LED display) that requires alignment. Because the component itself cannot be directly grasped, these microspheres serve as handles that can be manipulated without contact. When a highly focused laser beam strikes the microspheres, the light field gradient generates an "optical gradient force" that firmly attaches the microspheres to the center of the beam's focal point. By moving the laser focus, the microspheres can be precisely dragged in a contactless and non-destructive manner, thereby driving the entire optical component.

[0025] The optical tweezers array generation system 103 consists of core components such as a laser and a spatial light modulator (SLM). The SLM acts like a programmable dynamic diffraction grating. By loading a specific grayscale image onto the SLM, the light beam can be spatially decomposed and reshaped into hundreds or thousands of independently controllable laser focal points. In this embodiment, optical tweezers focal points corresponding to the number of dielectric microspheres are generated, forming an optical tweezers array. By changing the grayscale image loaded onto the SLM, the control system can independently move the position of each optical tweezer in real time, thereby achieving nanometer-level precision control of the optical element's six degrees of freedom (X / Y / Z translation and rotation around three axes).

[0026] The on-site monitoring and feedback system 102 is to set up a high-resolution industrial camera array at the finished product light output position of the optical module to capture the test image being generated inside the module in real time. The image data is sent to a high-performance image processing computer.

[0027] The camera captures the image emitted by the microdisplay in real time, after it passes through the entire optical system. This process occurs in situ. A computer performs objective quantitative analysis of the captured image, calculating key performance indicators such as the MTF (Modulation Transfer Function). The computer compares the measured value with the ideal target value in a database and calculates the deviation. This deviation is then converted into specific control instructions for the optical tweezers array, forming a closed-loop feedback loop for the entire system. For example, the display can be moved 0.2 microns in the positive direction along the X-axis and rotated 0.01 degrees clockwise.

[0028] After a series of iterative optimizations, the in-situ monitoring and feedback system 102 finally determines that the optical component has been adjusted to the global optimal position (i.e., the image quality parameter has reached its peak). It then issues two coordinated commands: 1) It instructs the optical tweezers system to maintain a strong clamping force to ensure the component remains stationary; 2) It instructs the curing system 101 to instantly activate. The intense ultraviolet light emitted completely polymerizes and cures the liquid optical adhesive between the components within a few hundred milliseconds. This process is fast enough to prevent any displacement caused by curing stress, thus achieving precise alignment.

[0029] The implementation of this embodiment will bring about the following: Revolutionary improvement in yield, extreme and highly consistent product performance, and significant reduction in production costs.

[0030] By actively compensating for component tolerances and equipment errors, and overcoming the effects of curing stress, this system can boost the optical module packaging yield from the traditional rate of below 70% to 98% or even higher, minimizing waste. This yield increase translates directly into a significant reduction in material, energy, and labor costs. Because the system possesses powerful self-correction capabilities, it reduces reliance on the absolute precision of the initial mechanical positioning platform, enabling manufacturers to use lower-cost equipment and thus reducing capital investment.

[0031] In addition, optical engineers can be more bold in designing and experimenting with more complex and higher-performance optical structures because they know that this intelligent packaging system can accurately turn design drawings into reality, thereby accelerating the technological iteration of the entire AI glasses industry.

[0032] In the above embodiment, it is defined that an optical tweezers array generation system 103 is required to act as a robotic arm in the microscopic world. Furthermore, the optical tweezers array generation system 103 includes a laser source and a spatial light modulator. The spatial light modulator is used to receive the control signal and phase-modulate the light beam emitted by the laser source to generate the independently addressable optical tweezers array.

[0033] In this embodiment, the laser source is preferably a near-infrared high-power laser (e.g., 1064 nm wavelength). This wavelength is chosen because it is transparent to most optical components and uncured UV adhesive, preventing damage or premature curing. Furthermore, high power is essential for generating a sufficiently strong optical gradient force, ensuring the gripping force of the optical tweezers.

[0034] SLM modulates not the color or brightness of light, but its phase. Its surface is composed of millions of tiny liquid crystal pixels, each of which can be independently programmed to produce a precise phase delay between 0 and 2π on the light wavefront passing through it.

[0035] At any time, the on-site monitoring and feedback system 102 will issue instructions to clearly indicate at which three-dimensional spatial coordinate points the optical tweezers trap needs to be generated. The iterative Fourier transform algorithm will perform reverse calculations, using the target light field as input, and reversely deduce the formation of a complex two-dimensional phase map, that is, a computer-generated hologram.

[0036] This phase map is loaded onto the SLM in the form of a grayscale image. When a uniform, flat laser wavefront emitted by a laser source strikes the SLM, each component is assigned a different phase delay based on the grayscale value of the corresponding pixel. After the laser beam carrying the holographic information passes through a Fourier lens, it automatically reconstructs a precisely arranged optical tweezers array consisting of multiple high-intensity light spots on the lens' back focal plane according to the principle of diffraction.

[0037] It should be noted that in this embodiment, to move a particular optical tweezer, the operator does not need to adjust any mechanical components. The control system simply calculates a new hologram and updates it to the SLM within a few milliseconds, instantly changing the shape of the optical tweezer array. This enables purely software-defined, inertia-free, ultra-high-precision real-time light field manipulation.

[0038] Furthermore, the on-site monitoring and feedback system 102 calculates at least one of a modulation transfer function (MTF) value, brightness uniformity, or distortion coefficient of the output image to quantify the quality parameters of the image.

[0039] In this embodiment, MTF is the ultimate indicator for measuring the ability of an optical system to transmit object details (ie, contrast at different spatial frequencies).

[0040] The control system commands the microdisplay to display a specific test pattern, most commonly a high-contrast, bright white line (used to generate the Line Spread Function (LSF)) or a sharp black-white boundary (used to generate the Edge Spread Function (ESF)). This pattern captures an image of the line or boundary, blurred after passing through the entire optical system. The image processing unit performs a Fourier transform on the collected LSF or ESF data. The MTF (Mean Time Transfer Function) is mathematically the modulus of the normalized system's optical transfer function (OTF). The result is a curve representing contrast transfer at different spatial frequencies (units: line pairs / mm, lp / mm). The system can output the MTF value at a key frequency point (such as 50 lp / mm) or the integrated area under the entire curve as a core KPI (Key Performance Indicator). During optimization, the algorithm aims to maximize this KPI.

[0041] Brightness uniformity measures the uniformity of brightness across the entire field of view. In AI glasses, due to issues like uneven waveguide coupling efficiency or stray light, the center of the display is often bright, the surroundings are dark, or there are localized bright spots, severely impacting the sense of immersion. The control system instructs the microdisplay to display a full-screen, uniformly bright gray or white image. The camera captures the actual image of this uniform image after it passes through the system. The computer divides the captured image into an N×M grid. The average pixel brightness value within each grid is then calculated.

[0042] By comparing the maximum brightness in all grids and minimum brightness , the uniformity can be calculated (usually expressed as ), or calculate the standard deviation of all grid brightness values. During optimization, the goal of the algorithm is to maximize the uniformity ratio (approaching 100%) or minimize the standard deviation.

[0043] The distortion coefficient refers to the degree of distortion of the image relative to the object. Common distortions include barrel distortion (the image bulges outward) and pincushion distortion (the image sinks inward).

[0044] To address this issue, the control system commands the microdisplay to display a grid of precise horizontal and vertical lines, or an array of dots. The camera captures images of these supposedly straight lines that have become curved or the dot positions shifted after passing through the system. Image processing algorithms (such as the Hough transform or corner detection) accurately identify the positions of the lines or dots in the captured image and mathematically compare them to their ideal positions in the original test image. The positional deviations of all feature points are calculated, and a single distortion coefficient value is defined as the maximum deviation or the root mean square (RMS) value of all deviations. During optimization, the algorithm's goal is to minimize this distortion coefficient value (approaching 0).

[0045] Furthermore, the first optical element 104 is a micro display module, which is electrically connected to the in-situ monitoring and feedback system 102 via a flexible circuit board, and is used to receive instructions during the alignment process and display a test image as a test light source.

[0046] Since the micro display module is connected to one or more thin flexible circuit boards (FPCs) at its tail through a high-density binding process when it leaves the factory as an independent component, after entering the packaging system of this embodiment, before the module is glued and packaged, the end connector of its FPC will be temporarily connected to a specially designed test adapter board. This adapter board is the I / O interface of the entire system. One end of it is connected to the FPC of the display module, and the other end is connected to the central control computer of the packaging system via a standard cable, which is part of the in-situ monitoring and feedback system 102.

[0047] Once the connection is established, the central control computer provides two core elements to the micro display module's driver chip through the FPC: Driver power supply and video / control signal. The driver power supply provides the necessary voltage and current to light up the display; the video / control signal transmits a specific image signal generated by the computer for testing.

[0048] At this point, the unpackaged display module is in the alignment process: When the clarity needs to be evaluated, the computer sends a command through the FPC, and a precise bright line is immediately displayed on the screen; When the geometric fidelity needs to be evaluated, the instructions are changed and the screen instantly switches to a standard checkerboard or dot matrix.

[0049] After the entire alignment and curing process is completed, the display module has been permanently fixed in the optimal position. At this time, its FPC will be disconnected from the test adapter board. In the subsequent assembly of the entire machine, this identical FPC will be carefully routed and connected to the main logic board of the AI ​​glasses to achieve the final packaging of the AI ​​glasses.

[0050] Furthermore, the packaging system of this embodiment also includes a micro-dispensing device, which uses a non-contact piezoelectric injection valve to inject liquid optical glue as the liquid medium between the first optical element 104 and the second optical element 105 in a preset glue amount and path.

[0051] In this embodiment, the micro-dispensing device is usually composed of three parts: a high-precision three-axis or five-axis motion platform, a fluid temperature control and pressure control unit, and the core piezoelectric injection valve head. The motion platform is responsible for driving the valve head to move along a preset path above the workpiece.

[0052] The piezoelectric jet valve's body houses a piezoelectric crystal stack connected to a tiny striker, or piston, whose tip seals the valve seat leading to the nozzle. When no voltage is applied, the piezoelectric crystal stack is at its original length, and the striker, under spring force, holds the valve seat tightly closed, preventing the glue from flowing out. When the controller applies a reverse voltage pulse, the piezoelectric crystal stack instantly contracts, rapidly retracting the striker, opening the valve seat. Under negative pressure, a precisely measured drop of glue is drawn into the chamber in front of the striker.

[0053] The controller then immediately applies a positive high-voltage pulse, and the piezoelectric crystal stack generates an impact force at microsecond speeds, creating a strong pressure wave in the glue within the chamber, forcing the glue out of a nozzle with a diameter of only tens of microns at high speed. Due to the extremely high speed and concentrated energy, the squeezed glue overcomes surface tension and separates from the nozzle, forming a single, spherical droplet with a regular shape and uniform volume. This droplet travels a short distance (typically 1-3 mm) at a certain initial velocity before finally landing precisely on the surface of the target component, completing the dispensing process.

[0054] Before dispensing, the system will calculate the optimal glue amount based on the shape of the component and claim 11 , automatically planning an optimal dispensing path. The controller sets the piezoelectric valve's drive voltage, pulse width, and other parameters based on the glue's viscosity, surface tension, and other characteristics to ensure a constant and known volume for each ejected droplet. The motion platform drives the piezoelectric valve head, moving it at high speed along the planned path while maintaining a safe distance from the component surface. Simultaneously, the piezoelectric valve continuously ejects tiny droplets at an extremely high frequency, creating a designed glue distribution pattern on the component surface. The entire process is fast, quiet, and extremely precise.

[0055] Example 2 like Figure 2 As shown, this embodiment discloses a FPC micro-optical module packaging method for AI glasses, which includes the following steps: S100 provides the first optical element 104 and the second optical element 105, and injects liquid optical glue therebetween; S200 starts the optical tweezers array generation system 103, captures the dielectric microspheres, and starts the in-situ monitoring and feedback system 102, collects the initial output image and calculates the initial quality parameters; S300. The in-situ monitoring and feedback system 102 continuously generates control signals to drive the optical tweezers array generation system 103 based on the difference between the quality parameter and the preset target, iteratively adjusting the relative position of the first optical element 104 and the second optical element 105 until the quality parameter reaches the preset target. S400. Start the curing system 101 to cure the liquid optical adhesive.

[0056] In this embodiment, step S100 is the preparatory stage. First, a robotic arm places the first optical element 104 (e.g., a Micro-LED module) and the second optical element 105 (e.g., an optical waveguide lens) on the workbench of the packaging system, maintaining an initial micrometer-level gap between them. Subsequently, the non-contact piezoelectric injection valve defined in the process is activated, calculates the precise amount of adhesive required to encompass all surface microtopography, and injects this volume of liquid optical adhesive into the gap between the components via a specific path.

[0057] At the end of this step, an ideal initial state is achieved: the two optical components are suspended in a volumetrically precise, bubble-free, and contamination-free liquid optical adhesive environment, fully prepared for subsequent resistance-free, high-precision movement.

[0058] Step S200 is the initialization and benchmarking phase. After the optical tweezers array generation system 103 is activated, multiple optical tweezers traps are generated to capture and stably clamp the dielectric microspheres on the component. At this point, while the component is firmly controlled, it can still be driven by the optical tweezers to move slightly. Subsequently, the microdisplay module is illuminated via the FPC, causing it to display a preset test pattern. Simultaneously, the in-situ monitoring system begins operating, capturing the first blurred image of the misaligned state that has passed through the entire optical system. The feedback system analyzes this initial image and calculates various initial quality parameters according to the standards defined in Example 1.

[0059] Step S300 is the closed-loop iterative optimization phase. Based on the initial quality parameters obtained in step S200, the system calculates the first movement plan that is most likely to improve quality. The optical tweezers system then precisely executes this movement. After the movement is completed, the monitoring system immediately captures images of the new position and calculates new quality parameters. Based on the new and old sets of pose-quality data, the system updates its understanding of the entire quality space and calculates the next optimal movement plan. This "decision-execution-evaluation" cycle is repeated continuously at an extremely high rate, ranging from several to dozens of times per second.

[0060] After hundreds or even thousands of fine-tuning cycles, the quality parameters no longer show significant improvement and stabilize at a peak. At this point, the system determines that the global optimal alignment has been found. At the end of this step, the optical component is being stably held in the optimal position by the optical tweezers with sub-nanometer precision.

[0061] Step S400 is the permanent locking phase. Once the optimal position is determined in step S300, the optimization cycle ceases, but the optical tweezers system maintains a strong clamping force to ensure the absolute stability of the component's position. At this point, the control system immediately triggers the curing system 101 defined in Example 1 to rapidly and evenly irradiate the liquid optical adhesive.

[0062] At the end of this step, the liquid optical adhesive completely cures within a few hundred milliseconds, transforming into a strong, transparent solid, bonding the two optical components and the FPC connecting them together. At this point, the package is complete, and the optical tweezers system can be released and await its next task.

[0063] In this embodiment, the optical tweezers array is generated by a near-infrared laser, and the liquid optical adhesive has a high transmittance to the near-infrared laser. The curing in step S400 is completed by activating an ultraviolet light source to irradiate the liquid optical adhesive.

[0064] The implementation of this embodiment relies on laser physics and materials science, which is specifically reflected in the following two aspects: 1. Laser source selection: near-infrared band The system utilizes a highly mature, stable, and high-power 1064nm Nd:YAG laser. Located in the near-infrared spectral region, 1064nm delivers only about one-third the energy of a single photon of ultraviolet light (365nm). This energy level is well below the excitation threshold of chemical bonds in most UV-curing adhesives (such as acrylates and epoxies). Therefore, no matter how powerful the laser is, it cannot chemically initiate polymerization, completely eliminating the risk of accidental curing.

[0065] Furthermore, materials such as water, most organic polymers, and optical glass typically have a high transmittance window in the visible and near-infrared regions. The wavelength of 1064 nm lies precisely in the center of this window, meaning that these materials have extremely low absorption. This fundamentally avoids thermal effects caused by light absorption, ensuring that neither the glue nor the component is significantly heated.

[0066] 2. Matching requirements of liquid optical adhesive: high transmittance in a specific wavelength band When selecting a matching liquid optical adhesive, its spectral transmission curve becomes a key screening indicator. This embodiment requires that the selected adhesive must meet the following requirements: The system has extremely high transmittance for 1064nm near-infrared light and extremely high absorptivity for 365nm ultraviolet light (or other specific curing wavelengths). For example, the theoretical transmittance is required to be greater than 99.5%. This means that when the optical tweezers laser passes through the adhesive layer, almost all of the energy passes through unimpeded, with only a negligible amount of energy being absorbed. When irradiated with 365nm ultraviolet light from curing system 101, the adhesive efficiently absorbs the energy and cures quickly and completely.

[0067] Furthermore, in steps S200 and S300 , power is supplied to the first optical element 104 and a signal for generating the test image is transmitted via the flexible circuit board connected to the first optical element 104 .

[0068] Since the packaging process is in steps S200 and S300 , at this time, the first optical element 104 has been clamped by the optical tweezers and suspended in the uncured optical adhesive, and its own FPC has been connected to the test adapter board.

[0069] The in-situ monitoring and feedback system 102 determines, based on its optimization algorithm, that it needs to acquire optical data at the current position, for example, first measuring the system's resolution (MTF).

[0070] The computer's internal signal generator immediately generates the digital video signals needed to display high-contrast bright lines. These signals, along with the stable DC power required to drive the display, are then loaded onto a test adapter board. Energy and signals pass through the adapter board and into the thin wiring of the FPC. Current and data signals are then precisely transmitted along the FPC's traces to the driver control chip of the micro-display module connected at the other end. The display module's driver chip receives and decodes the signals from the FPC, then precisely controls the lighting of a specific row or column of its millions of Micro-LED pixels, creating a bright, sharp test line on the screen.

[0071] The light emitted by the bright line passes through the entire optical system and is captured by the camera at the back end, completing an MTF data acquisition. If the algorithm needs to evaluate geometric distortion, the central computer immediately stops sending the bright line signal and instead generates a video signal of a standard grid.

[0072] Within milliseconds, a new signal is transmitted to the display module through the same FPC, and the image on the screen instantly switches from a bright line to a grid, and the camera then captures the new image.

[0073] The operation of using the FPC for power supply and dynamic content transmission is repeated at high speed during the alignment cycle of steps S200 and S300 until the system finds the optimal solution.

[0074] Furthermore, in step S100 , the liquid optical adhesive is sprayed in the form of micro-droplets to a designated area between the first optical element 104 and the second optical element 105 by a non-contact piezoelectric jet dispensing device.

[0075] The packaging process begins at step S100 of this embodiment. The optical component has been placed on the workbench, and the control system calculates the optimal total amount of glue required. And the optimal dispensing path diagram.

[0076] Specifically, the control system first converts the total glue volume into the volume of the liquid droplet according to the calibration parameters of the piezoelectric injection valve (i.e., the precise volume of each micro-droplet ejected, such as 2.1 nanoliters / drop). Converted to the total number of droplets required ( / single drop volume).

[0077] At the same time, the system converts the optimal dispensing path map into the G code (a machine tool control language) of the motion platform, which specifies the precise movement trajectory and speed of the injection valve head in the XY plane.

[0078] The high-precision motion platform then drives the piezoelectric injection valve head to the starting point of the path. The valve head's nozzle maintains a preset, safe height above the component surface below, typically between 1 and 3 mm. The motion platform then begins to drive the valve head in strict accordance with the G-code. Simultaneously, the central controller sends a series of high-frequency electronic pulses to the piezoelectric injection valve, executing the non-contact injection action.

[0079] In the subsequent process, with each pulse, the piezoelectric stack inside the piezoelectric valve completes a contraction-expansion motion, ejecting a micro-droplet of constant volume from the nozzle. These micro-droplets, at extremely high speeds and precise angles, cross the safety gap and land precisely at the designated location on the component surface. Because of the non-contact ejection process, the droplet shape is extremely regular, perfectly spherical or hemispherical, without any tailing or stringing.

[0080] The valve head moves at high speed, continuously spraying droplets at frequencies of up to several thousand hertz. When the total number of sprayed droplets reaches the preset value N, the system stops spraying. At this point, a perfectly distributed glue array with a precise total amount of glue and reserved exhaust channels is perfectly presented on the component surface.

[0081] Example 3 In Example 2, the step S100 of providing an optical element and injecting liquid optical adhesive therein further includes a sub-step of precise adhesive injection based on surface topography integration. The specific process is as follows: Before glue injection, a high-precision three-dimensional topography scan of the surfaces to be bonded of the first optical element 104 and the second optical element 105 is performed using a white light interferometer or a confocal microscope to obtain the surface height function. and ; Based on the surveying and mapping data, the algorithm calculates the ideal fitting distance The theoretical space volume between the two elements is ; Comprehensively consider the curing shrinkage of the glue and dynamic extrusion compensation coefficient , calculate the optimal injection amount ; Control the micro dispensing device to accurately inject volume Liquid optical adhesive.

[0082] In this embodiment, the optimal injection amount optimization algorithm is:

[0083] in, It is the overlapping bonding area of ​​two optical elements; The double integral of the height difference between the two surfaces over the fitted area A is used to calculate the exact spatial volume of the area; is the average roughness of the two surfaces; is the perimeter of the fitted area.

[0084] This step abandons volume estimation based on an ideal plane and instead accurately accounts for the component surface's microscopic roughness, curvature, and manufacturing tolerances. By precalculating the actual amount of glue required, precise control of the glue injection process is achieved.

[0085] This greatly avoids excessive glue overflow that contaminates the optical surface, or packaging defects such as bubbles and voids caused by insufficient glue. It ensures the uniformity and stress distribution of the bond layer after curing, laying the foundation for subsequent precision alignment and long-term reliability.

[0086] Example 4 In Example 2, the step S200 acquires the initial output image and calculates the initial quality parameter, and further includes a modulation transfer function (MTF) characterization sub-step based on Fourier transform. The specific process is as follows: The micro display module is controlled to display a high-contrast bright line, and the on-site monitoring system captures the image of the line after it passes through the entire optical system to obtain the line spread function (LSF). Perform noise reduction and background light correction on the collected LSF image data; After treatment Perform one-dimensional fast Fourier transform FFT; The modulus of the transformation result is normalized to obtain the initial MTF curve representing the contrast transfer capability of the system at different spatial frequencies.

[0087] In this embodiment, the calculation formula of the modulation transfer function is:

[0088] in, The spatial frequency is The modulation transfer function value when ; The line spread function is obtained from experimental measurements after preprocessing such as noise reduction; is a theoretically infinitely narrow ideal line pulse function, whose modulus of Fourier transform is a constant and is used for normalization; is the Fourier transform operator, which converts the LSF in the spatial domain to the frequency domain; To take the modulus of a complex number.

[0089] MTF is one of the most objective and comprehensive metrics for evaluating the imaging quality of an optical system. It describes the system's ability to capture the finest details of an object. By leveraging the core principles of Fourier optics, a simple line image can be used to fully analyze the system's performance across the entire frequency domain.

[0090] Converting the fuzzy and difficult-to-quantify initial image quality into an accurate MTF curve that can be analyzed by the algorithm provides a clear and reliable quantitative input and optimization target for subsequent closed-loop optimization steps, avoiding the subjectivity and inaccuracy of human eye or simple brightness assessment.

[0091] Example 5 In Example 2, the step S300 of iteratively adjusting the relative position further includes a six-degree-of-freedom pose search sub-step based on Bayesian optimization. The specific process is as follows: Establish a Gaussian process model as the prior probability distribution describing the relationship between "pose and image quality"; The upper confidence bound is selected as the acquisition function to balance between areas with high uncertainty and areas with high expected values; At each iteration, the next most promising test pose is selected by maximizing the acquisition function ; Command the optical tweezers system to drive the element to a certain position , measuring the corresponding image quality , and the new data points Used to update the posterior distribution of the Gaussian process model; Repeat steps 3 and 4 until the acquisition function gain is lower than the threshold or the maximum number of iterations is reached. At this time, the maximum point of the GP model mean function is the best pose found. .

[0092] In this embodiment, the calculation formula of the next test pose point selection algorithm is:

[0093] in, For the next iteration, the algorithm selects a target pose to move to; is a six-dimensional pose vector , representing the six degrees of freedom of the component; The feasible domain of all possible and safe poses; In the feasible region Find the parameters that maximize the objective function ; For a Gaussian process that has After iterations, the pose The predicted mean of the image quality at ; is the Gaussian process in pose The predicted standard deviation of the image quality at ; is an adjustable hyperparameter used to balance the weights of areas with high uncertainty and areas with high expected values.

[0094] Bayesian optimization is an efficient global optimization strategy for time-consuming physical measurements. It builds a probabilistic proxy model to learn the shape of the objective function and intelligently selects the next sampling point, thereby finding the global optimal solution with the fewest iterations possible, avoiding the pitfalls of traditional gradient descent methods that often fall into local optima.

[0095] Compared with grid search or random search, it can converge to the global optimal alignment position faster, significantly shorten the packaging time of a single module, and increase the probability of finding the optimal solution, greatly improving the alignment efficiency and success rate.

[0096] Example 6 In Example 2, the step S400 of curing the liquid optical adhesive further includes a sub-step of controlling the spatiotemporal energy dose based on photochemical kinetics. The specific process is as follows: Establish a method to describe the conversion rate of glue monomer Partial differential equation models that vary in time and space; The solidification area is meshed and based on the model, the solidification conversion rate of all the meshes is calculated in reverse. The target value is achieved with the minimum variance, and each grid point has the best performance during the entire curing time. The cumulative energy dose required to be received ; The output intensity of the UV curing light source (assuming it is a UV-DLP or LED array with independently controllable pixels) is modulated in time and space so that at any time , which is at point Light intensity Ability to optimally approach the preset dose target; The curing process is carried out according to the planned spatiotemporal light intensity distribution.

[0097] In this embodiment, the calculation formula of the monomer conversion kinetic control model is:

[0098] Optimization goal:

[0099] in, For the location ,time The monomer conversion rate; are the photochemical reaction kinetic parameters determined experimentally, representing the reaction rate constant and reaction order respectively; For UV light in position ,time Light intensity; is the variance operator used to measure the uniformity of the final curing degree; is the total curing time; It is the average degree of curing of the entire area after curing is completed; The minimum acceptable average degree of cure target is set.

[0100] Traditional uniform exposure methods can cause uneven energy reception in different areas of the adhesive layer due to focusing effects or shadowing in the optical system. This can lead to uneven shrinkage, internal stress, and micron-level shifts in aligned components. This method achieves pixel-level control of the curing process through active compensation.

[0101] This embodiment ensures that the entire adhesive layer is cured uniformly and synchronously, minimizes alignment failure caused by curing stress, significantly improves the long-term dimensional stability and reliability of the finished packaged product, and ensures that the optical performance of the AI ​​glasses remains stable after experiencing environmental changes such as temperature cycling and vibration.

[0102] Example 7 Please refer to Figure 3 , which shows a structural schematic diagram of a computer device provided in some embodiments of the present application, the electronic device 20 includes: a processor 200, a memory 201, a bus 202 and a communication interface 203, the processor 200, the communication interface 203 and the memory 201 are connected via the bus 202; the memory 201 stores a computer program that can be run on the processor 200, and the processor 200 is used to operate according to the instructions to execute the steps of the method described in any one of Examples 2-6.

[0103] Memory 201 may include high-speed random access memory (RAM) and may also include non-volatile memory, such as at least one disk storage device. Communication between the system network element and at least one other network element is achieved through at least one communication interface 203 (which may be wired or wireless), and may utilize the Internet, a wide area network, a local area network, a metropolitan area network, or the like.

[0104] Bus 202 may be an ISA bus, a PCI bus, or an EISA bus. The bus may be divided into an address bus, a data bus, a control bus, and the like. Memory 201 is used to store programs, and processor 200 executes the programs upon receiving execution instructions. The FPC micro-optical module packaging method disclosed in any of the aforementioned embodiments of the present application may be applied to or implemented by processor 200.

[0105] The processor 200 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by hardware integrated logic circuits in the processor 200 or by software instructions. The above processor 200 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in conjunction with the embodiments of this application can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium mature in the art, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, etc. The storage medium is located in the memory 201 , and the processor 200 reads the information in the memory 201 and completes the steps of the above method in combination with its hardware.

[0106] Example 8 This embodiment also provides a computer-readable storage medium corresponding to the FPC micro-optical module packaging method provided in the above embodiment. Figure 4 The computer-readable storage medium shown is a CD, which stores a computer program (i.e., program product 30). When the computer program is run by the processor, it will execute the FPC micro-optical module packaging method provided by any of the aforementioned embodiments.

[0107] It should be noted that examples of the computer-readable storage medium may also include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical or magnetic storage media, which are not listed here one by one.

[0108] The computer-readable storage medium provided in the above-mentioned embodiments of the present application and the FPC micro-optical module packaging method provided in the embodiments of the present application are based on the same application concept and have the same beneficial effects as the methods adopted, run or implemented by the application programs stored therein.

[0109] It should be noted that: in the above text, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0110] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a more preferred embodiment. Based on this understanding, the technical solution of this application, or the part that contributes to the existing technology, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of this application.

[0111] In summary, the present invention provides an FPC micro-optical module packaging system, method, computer equipment, and storage medium for AI glasses. By pre-setting microscopic handles that can be controlled by non-contact force on the optical elements to be stacked, after the elements are stacked and uncured optical glue is injected, a closed-loop feedback system is used to monitor the imaging quality in real time, and optical tweezers array technology is used to manipulate the handles to fine-tune the elements until the optimal position is reached. The glue is then instantaneously cured to complete the packaging, which can effectively solve the problems of low yield and high production cost caused by tolerance accumulation and stress influence.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. An FPC micro-optical module packaging system for AI glasses, characterized in that: include: At least one first optical element and at least one second optical element, wherein at least one of the first optical element or the second optical element is pre-set with a plurality of dielectric microspheres for non-contact manipulation; an optical tweezers array generation system, configured to generate an independently addressable optical tweezers array to capture and manipulate the dielectric microspheres, respectively, and adjust the relative position and posture of the first optical element and the second optical element in three-dimensional space; an in-situ monitoring and feedback system for collecting, in real time during the alignment process, an output image of the optical system composed of the first optical element and the second optical element, analyzing a quality parameter of the image, and generating a control signal based on a difference between the quality parameter and a preset target, outputting the control signal to the optical tweezers array generation system; A curing system is used to cure the liquid medium between the first optical element and the second optical element to permanently lock their relative positions when the in-situ monitoring and feedback system determines that the image quality parameter of the optical system reaches a preset target.

2. The FPC micro-optical module packaging system for AI glasses according to claim 1, characterized in that: The optical tweezers array generation system includes a laser source and a spatial light modulator. The spatial light modulator is used to receive the control signal and perform phase modulation on the light beam emitted by the laser source to generate the independently addressable optical tweezers array.

3. The FPC micro-optical module packaging system for AI glasses according to claim 1 or 2, characterized in that: The on-site monitoring and feedback system is used to quantify the quality parameters of the image by calculating at least one of the modulation transfer function value, brightness uniformity or distortion coefficient of the output image.

4. The FPC micro-optical module packaging system for AI glasses according to any one of claims 1 to 3, characterized in that: The first optical element is a micro display module, which is electrically connected to the in-situ monitoring and feedback system via a flexible circuit board, and is used to receive instructions during the alignment process and display a test image as a test light source.

5. An FPC micro-optical module packaging system for AI glasses according to any one of claims 1 to 4, characterized in that: It also includes a micro-dispensing device, which uses a non-contact piezoelectric injection valve to inject liquid optical glue as the liquid medium between the first optical element and the second optical element in a preset glue amount and path.

6. A method for packaging an FPC micro-optical module for AI glasses, characterized in that: The following steps are involved: S100 provides the first optical element and the second optical element, and injects liquid optical glue therebetween; S200 starts the optical tweezers array generation system, captures the dielectric microspheres, and starts the in-situ monitoring and feedback system to collect the initial output image and calculate the initial quality parameters; S300. The in-situ monitoring and feedback system continuously generates a control signal to drive the optical tweezers array generation system based on the difference between the quality parameter and the preset target, iteratively adjusting the relative position of the first optical element and the second optical element until the quality parameter reaches the preset target. S400. Start the curing system to cure the liquid optical adhesive.

7. The FPC micro-optical module packaging method for AI glasses according to claim 6, characterized in that: The optical tweezers array is generated by laser light in the near-infrared band, and the liquid optical glue has a high transmittance to the laser light in the near-infrared band.

8. The FPC micro-optical module packaging method for AI glasses according to claim 6 or 7 is characterized in that: The curing in step S400 is completed by activating an ultraviolet light source to irradiate the liquid optical adhesive.

9. A method for packaging an FPC micro-optical module for AI glasses according to any one of claims 6 to 8, characterized in that: In steps S200 and S300 , power is supplied to the first optical element and a signal for generating the test image is transmitted via a flexible circuit board connected to the first optical element.

10. A method for packaging an FPC micro-optical module for AI glasses according to any one of claims 6 to 9, characterized in that: In step S100 , the liquid optical adhesive is sprayed in the form of micro-droplets to a designated area between the first optical element and the second optical element by a non-contact piezoelectric jet dispensing device.

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