Miniature heat dissipation structure for computer chip

Abstract

The invention relates to the technical field of chip heat dissipation, and discloses a miniature heat dissipation structure for a computer chip, the miniature heat dissipation structure comprises a base, the top of the base is fixedly connected with a cavity, and one end, far away from the base, of the cavity is fixedly provided with a partition plate. A voltage instrument and a rubber film are arranged in the equipment, when the voltage instrument generates adsorption force or repulsive force, the rubber film slides up and down, the rubber film moving upwards extracts air in a cavity, the air enters a sealed space, then the rubber film moves downwards again, gas in the sealed space is extruded, high pressure is formed, and finally the high pressure is exhausted outwards. Through the application of the components, the equipment meets the bladeless flat design, and meanwhile, the influence of electric ions on the chip is avoided while effective heat dissipation is realized through the design of extruding air by extruding the rubber film.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation equipment, and in particular to a micro heat dissipation structure for computer chips. Background Art

[0002] Computer system integrated chips are core components in computers. During use, computer system integrated chips require the use of micro-heat dissipation devices. The micro-heat dissipation device has a fanless structure and a chip-type active heat dissipation structure. It is mainly composed of a grid and a wire. A high voltage but very low current power supply is required. After power is turned on, the power supply applies a high voltage to the wire, forming a high-voltage electric field between the two metal electrodes. At this time, the oxygen molecules in the air will be ionized into positively charged cations. Driven by the electric field, the surrounding air forms a stable airflow. However, the above method uses the piezoelectric effect to blow air, which results in the air containing ions during blowing, causing dust to accumulate in the air and the internal ions to damage the chip. To address the above problems, the following solution is proposed. Summary of the Invention

[0003] To solve the above technical problems, the present invention provides a micro heat dissipation structure for computer chips, comprising a base, a cavity fixedly connected to the top of the base, a partition fixedly connected to the end of the cavity away from the base, and further comprising: The supporting mechanism is fixedly connected to the inner wall of the cavity, and pressurizes and discharges the air inside the cavity, thereby completing the air discharge; The pressure mechanism is fixedly connected to the inner wall of the support mechanism and draws air from outside the cavity into the interior of the cavity; A blocking mechanism is provided on the inner wall of the supporting mechanism and is used to adaptively seal the supporting mechanism; Before use, the device is fixed in the desired position by the base. The support mechanism forces the pressure mechanism to operate and causes the gas inside the cavity to eject outward. During this sliding process, the blocking mechanism will adaptively block the inside of the support mechanism. A voltage instrument is fixedly connected to the inner wall of the partition.

[0004] Preferably, the support mechanism includes: Flow components, the flow components are opened on both sides of the cavity through flow parts; The flow part includes an air inlet opened on the side wall of the cavity, and a fixing frame is opened at one end of the cavity away from the air inlet; A pressure-applying assembly, the pressure-applying assembly being fixedly connected to the inner wall of the cavity via a sealing member; The sealing member includes a sealing plate 1 fixedly connected to the inner wall of the cavity, and a sealing plate 2 fixedly connected to the inner wall of the cavity; When the pressure mechanism and the support mechanism are in operation, external air enters the inner wall of the cavity through the air inlet, and the pressure mechanism squeezes the air inside the cavity and is finally discharged outward from the air outlet.

[0005] Preferably, the pressure mechanism comprises: A pressure-bearing component, the pressure-bearing component is fixedly connected to the side wall of the sealing plate 1 through a compression member; The compression member includes a rubber membrane fixedly connected to one side wall of the sealing plate, the side wall of the rubber membrane is fixedly connected to the side wall of the second sealing plate, and the side wall of the rubber membrane is fixedly connected to the inner wall of the cavity; An air intake assembly, the air intake assembly is fixedly connected to the side wall of the pressure-bearing assembly; The rubber membrane and surrounding accessories are in a sealed and fixed state. When the rubber membrane slides up and down, the air between the sealing plate 1 and the sealing plate 2 can be compressed.

[0006] Preferably, the blocking mechanism includes: A blocking component is slidably disposed on an inner wall of the sealing plate; An exhaust assembly is slidably arranged on the inner wall of the second sealing plate; Among them, after the voltage instrument is connected to the power supply, electrostatic adsorption and electrostatic repulsion will be generated back and forth, forcing the pressurized component to drive the rubber membrane to swing up and down.

[0007] Preferably, the circulation assembly includes a fixing frame fixedly connected to the inner wall of the air outlet; The gas ejected outward from the air outlet will pass through the fixing frame and then be ejected outward.

[0008] Preferably, the pressure-applying assembly includes a receiving plate fixedly connected to the side wall of the fixing frame, and a plurality of arc-shaped plates are fixedly connected to the outer wall of the receiving plate; The airflow outside the air outlet will come into contact with the curved surfaces of several curved plates and eventually flow to a position above the receiving plate.

[0009] Preferably, the pressure component includes a metal sheet fixedly connected to the center of the rubber membrane, and a fixing rod is fixedly connected to the bottom of the metal sheet; When the voltage instrument is in operation, it will quickly generate repulsive force or adsorption force, and quickly switch between adsorption force and repulsive force, causing the metal sheet to move up and down with the rubber membrane.

[0010] Preferably, the air intake assembly includes a support rod fixedly connected to the outer wall of the fixed rod, an air intake hole is opened on the side wall of the sealing plate 1, and a sliding groove 1 is opened on the inner wall of the air intake hole; Among them, when the blocking component moves to the lowest point along the sealing plate, it will completely block the outer wall of the air intake hole, and when the blocking component reaches the highest position, the lowest position of the blocking component and the bottom position of the air intake hole will form an air intake gap.

[0011] Preferably, the blocking assembly includes a sliding baffle plate 1 slidably connected to the inner wall of the sealing plate 1, a protruding baffle plate is fixedly connected to the bottom of the sliding baffle plate 1, and a side wall of the support rod is fixedly connected to the side wall of the sliding baffle plate 1; When the sliding baffle moves upward to the highest position, a gap is formed between the protruding baffle and the air intake hole.

[0012] The present invention has the following beneficial effects: (1) The present invention addresses the problem that ions can easily damage the chip. A voltage instrument and a rubber membrane are provided inside the device. When the voltage instrument generates adsorption force or repulsion force, the rubber membrane will slide up and down, and the upward-moving rubber membrane will extract the air inside the cavity into the sealed space. Then the rubber membrane moves down again, squeezing the gas in the sealed space to form high pressure, and finally discharges it outward to complete the blowing process. Through the application of the above components, the device can meet the requirements of a flat design without fan blades. By squeezing the rubber membrane to squeeze the air, the device can effectively dissipate heat while avoiding the influence of ions on the chip.

[0013] (2) The present invention utilizes the characteristics of the rubber membrane sliding up and down, and sets a pressure mechanism and a sealing mechanism inside the device. After the support rod moves to the highest position, a gap appears between the protruding baffle and the air inlet hole, and the gas flows in. At this time, the sliding baffle 2 will completely block the outer wall of the air outlet hole. Through the design of the above components, when air is taken into the sealed space, the heat emitted by the chip enters the sealed space through the gap between the sliding baffle 2 and the air outlet hole, sucking in the hot air emitted by the chip, causing the phenomenon of hot air reflux, affecting the heat dissipation effect.

[0014] (3) The present invention utilizes the characteristics of the above-mentioned sliding baffle 2 and sliding baffle 1 moving up and down, wherein an air intake gap will appear between the protruding baffle and the air intake hole only when the sliding baffle 1 reaches the highest upward position, and the sliding baffle 1 will block the air intake hole at other times; and an exhaust gap will appear between the sliding baffle 2 and the air outlet hole only when the sliding baffle 2 moves down to the lowest position. Through the application of the above-mentioned components, when the rubber membrane has not reached the lowest position, the rubber membrane will squeeze the air inside the sealed space, so that the speed of air ejection outward is accelerated, thereby improving the heat dissipation efficiency.

[0015] (4) The present invention utilizes the above-mentioned high-pressure gas to flow along the inner wall of the receiving plate after being ejected outward from the air outlet. In this process, the wind flow will contact the arc surface of several arc plates and make the wind flow along the outer wall of the voltage instrument to the chip position. The wind flow is affected by the differentiation of multiple arc plates and will be directly in front of the chip. Through the application of the above-mentioned components, it is avoided that the conventional air outlet and the equipment are at the same horizontal height, which causes the gas ejected from the air outlet to first contact the hot air outside the chip, and then the wind flow carries the heat to the other end. In this process, the temperature of the air is close to the temperature emitted by the chip, which makes it difficult for the wind flow to dissipate heat to the subsequent areas of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a schematic cross-sectional view of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall structure of the present invention; Figure 3 is a schematic diagram of the circulation component of the present invention; Figure 4 This is a schematic diagram of the pressure-applying assembly of the present invention; Figure 5 For the present invention Figure 4 A magnified schematic diagram of point A in the middle; Figure 6 It is a cross-sectional schematic diagram of the air intake assembly of the present invention; Figure 7 For the present invention Figure 6 A magnified schematic diagram of point B in the middle; Figure 8 For the present invention Figure 6 Enlarged schematic diagram of point C in the middle.

[0018] In the accompanying drawings, the components represented by the reference numerals are as follows: In the figure: 1. Support mechanism; 11. Circulation component; 12. Pressure component; 13. Base; 14. Cavity; 15. Partition; 111. Air inlet; 112. Air outlet; 113. Fixing frame; 121. Sealing plate 1; 122. Sealing plate 2; 123. Receiver plate; 124. Arc plate; 125. Voltage instrument; 2. Pressure mechanism; 21. Pressure component; 22. Air intake component; 211. Rubber membrane; 212. Metal sheet; 213. Fixing rod; 221. Support rod; 222. Air intake hole; 223. Sliding groove 1; 3. Blocking mechanism; 31. Blocking component; 32. Exhaust component; 311. Sliding baffle 1; 312. Protruding baffle; 321. Air outlet hole; 322. Sliding baffle 2; 323. Sliding groove 2. DETAILED DESCRIPTION

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] For example 1, please refer to Figures 1-6 The present invention is a micro heat dissipation structure for computer chips, comprising a base 13, a cavity 14 fixedly connected to the top of the base 13, a partition 15 fixedly connected to the end of the cavity 14 away from the base 13, and further comprising: The support mechanism 1 is fixedly connected to the inner wall of the cavity 14, and pressurizes and discharges the air inside the cavity 14, thereby completing the air discharge; The pressure mechanism 2 is fixedly connected to the inner wall of the support mechanism 1, and draws air from the outside of the cavity 14 into the interior of the cavity 14; The blocking mechanism 3 is provided on the inner wall of the supporting mechanism 1 and is used to adaptively seal the supporting mechanism 1; Before use, the device is fixed in the desired position by the base 13. The support mechanism 1 forces the pressure mechanism 2 to operate and causes the gas inside the cavity 14 to be ejected outward. During this sliding process, the blocking mechanism 3 will adaptively block the inside of the support mechanism 1. A voltage instrument 125 is fixedly connected to the inner wall of the partition 15; Before use, the base 13 is first fixed directly above the chip, and then the power of the voltage instrument 125 is turned on, so that the voltage instrument 125 can quickly switch between generating an adsorption force and a repulsive force. The specific model of the voltage instrument 125 is: EMCO Q series micro high voltage generator, such as Q50-5.

[0021] The supporting mechanism 1 comprises: The circulation component 11 is opened on both sides of the cavity 14 through the flow parts; The flow part includes an air inlet 111 provided on the side wall of the cavity 14 , and a fixing frame 113 is provided on one end of the cavity 14 away from the air inlet 111 ; A pressure-applying assembly 12 , the pressure-applying assembly 12 being fixedly connected to the inner wall of the cavity 14 via a seal; The sealing member includes a sealing plate 121 fixedly connected to the inner wall of the cavity 14, and a sealing plate 2 122 fixedly connected to the inner wall of the cavity 14; When the pressure mechanism 2 and the support mechanism 1 are in operation, external air enters the inner wall of the cavity 14 through the air inlet 111 , and the pressure mechanism 2 squeezes the air inside the cavity 14 and is finally discharged outward from the air outlet 112 .

[0022] The pressure mechanism 2 includes: The pressure component 21 is fixedly connected to the side wall of the sealing plate 121 through a compression member; The compression member includes a rubber membrane 211 fixedly connected to the side wall of the sealing plate 121, the side wall of the rubber membrane 211 is fixedly connected to the side wall of the sealing plate 2 122, and the side wall of the rubber membrane 211 is fixedly connected to the inner wall of the cavity 14; To address the problem that ions can easily damage the chip, a voltage instrument 125 and a rubber membrane 211 are provided inside the device. When the voltage instrument 125 generates an adsorption force or a repulsive force, the rubber membrane 211 will slide up and down. The upwardly moving rubber membrane 211 will extract the air inside the cavity 14 into the sealed space. Then the rubber membrane 211 moves down again, squeezing the gas in the sealed space to form high pressure, which is finally discharged to the outside, completing the blowing process. Through the application of the above components, the device can meet the requirements of a flat design without fan blades. By squeezing the air through the rubber membrane 211, the device can effectively dissipate heat while avoiding the influence of ions on the chip. An air intake assembly 22, the air intake assembly 22 is fixedly connected to the side wall of the pressure-bearing assembly 21; The rubber membrane 211 and surrounding accessories are in a sealed and fixed state. When the rubber membrane 211 slides up and down, the air between the sealing plate 1 121 and the sealing plate 2 122 can be compressed.

[0023] The blocking mechanism 3 includes: The plugging component 31 is slidably disposed on the inner wall of the sealing plate 121; The exhaust assembly 32 is slidably disposed on the inner wall of the second sealing plate 122; When the voltage instrument 125 is powered on, electrostatic attraction and electrostatic repulsion are generated back and forth, forcing the pressure component 21 to drive the rubber membrane 211 to swing up and down.

[0024] For example 2, please refer to Figure 2-Figure 8 , the present invention is a micro heat dissipation structure for computer chips. Based on Example 1, the circulation component 11 includes a fixing frame 113 fixedly connected to the inner wall of the air outlet 112; The gas ejected outward from the air outlet 112 passes through the fixing frame 113 and then ejected outward.

[0025] The pressure assembly 12 includes a receiving plate 123 fixedly connected to the side wall of the fixing frame 113, and a plurality of arc-shaped plates 124 are fixedly connected to the outer wall of the receiving plate 123; The airflow outside the air outlet 112 will contact the curved surfaces of the plurality of curved plates 124 and eventually flow to a position above the receiving plate 123; After the above-mentioned high-pressure gas is ejected outward from the air outlet 112, it will flow along the inner wall of the receiving plate 123. In this process, the wind flow will contact the curved surfaces of several curved plates 124, and make the wind flow along the outer wall of the voltage instrument 125 toward the chip position. The wind flow is affected by the differentiation of multiple curved plates 124 and will be directly in front of the chip. Through the application of the above-mentioned components, the conventional air outlet 112 is avoided from being at the same horizontal height as the equipment. This causes the gas ejected from the air outlet 112 to first contact the hot air outside the chip, and then the wind flow carries the heat to the other end. In this process, the temperature of the air is close to the temperature emitted by the chip, which makes it difficult for the wind flow to dissipate heat to the subsequent areas of the chip.

[0026] The pressure component 21 includes a metal sheet 212 fixedly connected to the center of the rubber membrane 211, and a fixing rod 213 is fixedly connected to the bottom of the metal sheet 212; When the voltage instrument 125 is in operation, it will quickly generate a repulsive force or an adsorption force, and quickly switch between the adsorption force and the repulsive force, so that the metal sheet 212 carries the rubber membrane 211 to move up and down.

[0027] The air intake assembly 22 includes a support rod 221 fixedly connected to the outer wall of the fixed rod 213, an air intake hole 222 is opened on the side wall of the sealing plate 121, and a sliding groove 223 is opened on the inner wall of the air intake hole 222; Among them, when the blocking component 31 moves down to the lowest point along the sealing plate 121, the outer wall of the air intake hole 222 will be completely blocked, and when the blocking component 31 reaches the highest position, the lowest position of the blocking component 31 and the bottom position of the air intake hole 222 will form an air intake gap.

[0028] The blocking assembly 31 includes a sliding baffle 311 slidably connected to the inner wall of the sealing plate 121. The bottom of the sliding baffle 311 is fixedly connected to a protruding baffle 312. The side wall of the support rod 221 is fixedly connected to the side wall of the sliding baffle 311. When the sliding baffle 311 moves upward to the highest position, a gap is formed between the protruding baffle 312 and the air inlet hole 222 .

[0029] The exhaust assembly 32 includes an air outlet hole 321 formed on the side wall of the second sealing plate 122. A second sliding baffle 322 is slidably connected to the inner wall of the second sealing plate 122. A second sliding groove 323 is formed on the inner wall of the air outlet hole 321. The end of the support rod 221 away from the first sliding baffle 311 is fixedly connected to the side wall of the second sliding baffle 322. When the voltage instrument 125 generates an adsorption force, it will force the metal sheet 212 to drive the center part of the rubber membrane 211 to move upward synchronously. Since a sealed space is formed between the rubber membrane 211 and the sealing plate 1 121 and the sealing plate 2 122, the rubber membrane 211 drives the support rod 221 to move upward synchronously through the fixing rod 213. At this time, the support rod 221 will drive the sliding baffle 1 311 and the sliding baffle 2 322 to move upward synchronously. When the sliding baffle 1 311 reaches the highest position, the air entering the cavity 14 from the air inlet 111 enters the bottom of the rubber membrane 211 through the gap between the protruding baffle 312 and the air inlet hole 222, presenting the following Figure 7 The status shown; When the rubber membrane 211 slides up and down, the support rod 221 drives the sliding baffle 2 322 and the sliding baffle 1 311 to slide up and down synchronously. The voltage instrument 125 will generate a repulsive force again, causing the metal sheet 212 to drive the metal sheet 212 to slide downward again. At this time, the rubber membrane 211 will squeeze the air inside the sealed space, and after the support rod 221 slides downward a short distance, the protruding baffle 312 will first block the air inlet hole 222, and the sliding baffle 2 322 has not yet left the range of the air outlet hole 321. At this time, the air in the sealed space moves downward with the rubber membrane 211, and the assembly turns to the high-pressure direction. When the rubber membrane 211 reaches the lowest position, the top of the sliding baffle 2 322 and the top of the air outlet hole 321 will form an exhaust gap, and the high-pressure air in the sealed space will be discharged outward through the exhaust gap.

[0030] A specific application of this embodiment is: before use, the base 13 is first fixed directly above the chip, and then the power of the voltage instrument 125 is turned on. The voltage instrument 125 is made to quickly switch between generating an adsorption force and a repulsion force. The specific model of the voltage instrument 125 is: EMCO Q series micro high voltage generator, such as Q50-5; When the voltage instrument 125 generates an adsorption force, it will force the metal sheet 212 to drive the center part of the rubber membrane 211 to move upward synchronously. Since a sealed space is formed between the rubber membrane 211 and the sealing plate 1 121 and the sealing plate 2 122, the rubber membrane 211 drives the support rod 221 to move upward synchronously through the fixing rod 213. At this time, the support rod 221 will drive the sliding baffle 1 311 and the sliding baffle 2 322 to move upward synchronously. When the sliding baffle 1 311 reaches the highest position, the air entering the cavity 14 from the air inlet 111 enters the bottom of the rubber membrane 211 through the gap between the protruding baffle 312 and the air inlet hole 222, presenting the following Figure 7 The state shown; then the voltage instrument 125 will generate a repulsive force again, causing the metal sheet 212 to drive the metal sheet 212 to slide downward again. At this time, the rubber membrane 211 will squeeze the air inside the sealed space, and after the support rod 221 slides downward a short distance, the protruding baffle 312 will first block the air inlet hole 222, and the second sliding baffle 322 has not yet left the range of the air outlet hole 321. At this time, the air in the sealed space moves downward with the rubber membrane 211, and the assembly turns to the high-pressure direction. When the rubber membrane 211 reaches the lowest position, the top of the second sliding baffle 322 and the top of the air outlet hole 321 will form an exhaust gap, and the high-pressure air in the sealed space will be discharged outward through the exhaust gap; The air discharged outward will flow along the inner wall of the receiving plate 123 , and in this process, the airflow will contact the curved surfaces of the plurality of curved plates 124 and flow along the outer wall of the voltage instrument 125 toward the chip position.

[0031] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A micro heat dissipation structure for a computer chip, comprising a base (13), a cavity (14) fixedly connected to the top of the base (13), and a partition (15) fixedly connected to the end of the cavity (14) away from the base (13); characterized in that: Also includes: A support mechanism (1), wherein the support mechanism (1) is fixedly connected to the inner wall of the cavity (14), and pressurizes and discharges the air inside the cavity (14), thereby completing air discharge; A pressure mechanism (2), wherein the pressure mechanism (2) is fixedly connected to the inner wall of the support mechanism (1) and draws air from outside the cavity (14) into the interior of the cavity (14); A blocking mechanism (3), the blocking mechanism (3) being arranged on the inner wall of the support mechanism (1) and being used to adaptively block the support mechanism (1); Before use, the device is first fixed at a desired position by the base (13), and the support mechanism (1) forces the pressure mechanism (2) to operate, causing the gas inside the cavity (14) to be ejected outwards. During this sliding process, the blocking mechanism (3) will adaptively block the inside of the support mechanism (1); A voltage instrument (125) is fixedly connected to the inner wall of the partition (15).

2. A micro heat dissipation structure for a computer chip according to claim 1, characterized in that: The supporting mechanism (1) comprises: A circulation component (11), wherein the circulation component (11) is opened on both sides of the cavity (14) through a flow member; The flow member comprises an air inlet (111) provided on a side wall of the cavity (14); a fixing frame (113) is provided at one end of the cavity (14) away from the air inlet (111); A pressure-applying assembly (12), the pressure-applying assembly (12) being fixedly connected to the inner wall of the cavity (14) via a sealing member; The sealing member comprises a first sealing plate (121) fixedly connected to the inner wall of the cavity (14), and a second sealing plate (122) fixedly connected to the inner wall of the cavity (14); When the pressure mechanism (2) and the support mechanism (1) are in operation, external air enters the inner wall of the cavity (14) through the air inlet (111), and the pressure mechanism (2) squeezes the air inside the cavity (14), and finally discharges the air outward from the air outlet (112).

3. A micro heat dissipation structure for a computer chip according to claim 2, characterized in that: The pressure mechanism (2) comprises: A pressure-bearing component (21), wherein the pressure-bearing component (21) is fixedly connected to the side wall of the sealing plate 1 (121) via a compression member; The compression member comprises a rubber membrane (211) fixedly connected to the side wall of the first sealing plate (121), the side wall of the rubber membrane (211) being fixedly connected to the side wall of the second sealing plate (122), and the side wall of the rubber membrane (211) being fixedly connected to the inner wall of the cavity (14); An air intake assembly (22), the air intake assembly (22) being fixedly connected to a side wall of the pressure-bearing assembly (21); The rubber membrane (211) and surrounding accessories are in a sealed fixed state. When the rubber membrane (211) slides up and down, the air between the sealing plate 1 (121) and the sealing plate 2 (122) can be compressed.

4. A micro heat dissipation structure for a computer chip according to claim 3, characterized in that: The blocking mechanism (3) comprises: A blocking component (31), wherein the blocking component (31) is slidably disposed on the inner wall of the sealing plate (121); An exhaust assembly (32), the exhaust assembly (32) being slidably disposed on the inner wall of the second sealing plate (122); When the voltage instrument (125) is powered on, electrostatic adsorption and electrostatic repulsion are generated back and forth, forcing the pressure component (21) to drive the rubber membrane (211) to swing up and down.

5. The micro heat dissipation structure for a computer chip according to claim 4, characterized in that: The circulation assembly (11) comprises a fixing frame (113) fixedly connected to the inner wall of the air outlet (112); The gas ejected outward from the air outlet (112) passes through the fixing frame (113) and then ejected outward.

6. The micro heat dissipation structure for a computer chip according to claim 5, characterized in that: The pressure-applying assembly (12) comprises a receiving plate (123) fixedly connected to the side wall of the fixing frame (113), and a plurality of arc-shaped plates (124) are fixedly connected to the outer wall of the receiving plate (123); The airflow outside the air outlet (112) will contact the curved surfaces of the plurality of curved plates (124) and eventually flow to a position above the receiving plate (123).

7. A micro heat dissipation structure for a computer chip according to claim 6, characterized in that: The pressure component (21) comprises a metal sheet (212) fixedly connected to the center of the rubber membrane (211), and a fixing rod (213) is fixedly connected to the bottom of the metal sheet (212); When the voltage instrument (125) is in operation, it will quickly generate a repulsive force or an adsorption force, and quickly switch between the adsorption force and the repulsive force, so that the metal sheet (212) carries the rubber membrane (211) to move up and down.

8. The micro heat dissipation structure for a computer chip according to claim 7, characterized in that: The air intake assembly (22) includes a support rod (221) fixedly connected to the outer wall of the fixed rod (213); an air intake hole (222) is provided on the side wall of the sealing plate (121); and a sliding groove (223) is provided on the inner wall of the air intake hole (222); When the blocking component (31) moves down to the lowest point along the sealing plate (121), the outer wall of the air intake hole (222) will be completely blocked, and when the blocking component (31) reaches the highest position, the lowest position of the blocking component (31) and the bottom position of the air intake hole (222) will form an air intake gap.

9. The micro heat dissipation structure for a computer chip according to claim 8, characterized in that: The blocking assembly (31) includes a sliding baffle plate (311) slidably connected to the inner wall of the sealing plate (121), a protruding baffle plate (312) being fixedly connected to the bottom of the sliding baffle plate (311), and a side wall of the support rod (221) being fixedly connected to the side wall of the sliding baffle plate (311); When the sliding baffle (311) moves upward to the highest position, a gap is formed between the protruding baffle (312) and the air inlet hole (222).

10. The micro heat dissipation structure for a computer chip according to claim 9, characterized in that: The exhaust assembly (32) includes an air outlet hole (321) provided on the side wall of the second sealing plate (122), a second sliding baffle (322) is slidably connected to the inner wall of the second sealing plate (122), a second sliding groove (323) is provided on the inner wall of the air outlet hole (321), and one end of the support rod (221) away from the first sliding baffle (311) is fixedly connected to the side wall of the second sliding baffle (322); When the rubber membrane (211) slides up and down, the support rod (221) drives the second sliding baffle (322) and the first sliding baffle (311) to slide up and down synchronously.

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