Temperature control method, device and equipment and computer readable storage medium

Abstract

The invention discloses a temperature control method, device and equipment and a computer readable storage medium. The method comprises the steps that an instantaneous current value of a key current path corresponding to a power management integrated circuit (PMIC) is collected regularly through a current detection circuit; determining an estimated temperature corresponding to the PMIC based on the instantaneous current value; and adjusting a reference voltage REF corresponding to the PMIC based on the estimated temperature so as to reduce the working temperature corresponding to the PMIC. According to the application, the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC is collected, and temperature estimation is carried out through the instantaneous current value to replace a temperature sensor or a thermistor circuit in the related technology, so that the extra circuit overhead and power consumption of the temperature sensor can be avoided, and the system reliability is not influenced. The chip area corresponding to the PMIC is obviously saved, and the BOM cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a temperature control method, device, equipment, and computer-readable storage medium. Background Art

[0002] A Power Management Integrated Circuit (PMIC) is an integrated circuit that integrates multiple power management functions. It is used to provide power management and power conversion functions.

[0003] Currently, to monitor the operating temperature of the corresponding chip during PMIC operation, related technologies integrate temperature sensors into the circuit. These sensors collect the chip's operating temperature and dynamically adjust key parameters such as the chip's reference voltage (REF) based on the temperature changes, thereby achieving temperature control. However, the use of temperature sensors incurs additional circuit overhead and power consumption, increasing the chip area of ​​the corresponding PMIC and resulting in a high bill of materials (BOM) cost.

[0004] Therefore, how to save the chip area corresponding to PMIC and reduce BOM cost is a problem that needs to be solved urgently. Summary of the Invention

[0005] The main purpose of this application is to provide a temperature control method, device, equipment and computer-readable storage medium, aiming to solve the technical problem of how to save the chip area corresponding to PMIC and reduce BOM cost.

[0006] To achieve the above objectives, the present application provides a temperature control method, which comprises the following steps: Regularly collect the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit; determining an estimated temperature corresponding to the PMIC based on the instantaneous current value; A reference voltage REF corresponding to the PMIC is adjusted based on the estimated temperature to reduce an operating temperature corresponding to the PMIC.

[0007] In one embodiment, the step of adjusting the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC includes: Determining whether the estimated temperature is greater than a temperature threshold corresponding to the PMIC; If the estimated temperature is greater than the temperature threshold, the reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC.

[0008] In one embodiment, the step of determining the estimated temperature corresponding to the PMIC based on the instantaneous current value includes: The instantaneous current value is input into a temperature estimation model to obtain an estimated temperature corresponding to the PMIC.

[0009] In one embodiment, the step of determining the estimated temperature corresponding to the PMIC based on the instantaneous current value includes: Obtaining a temperature lookup table corresponding to a preset instantaneous current value and a preset temperature; Based on the instantaneous current value, an estimated temperature corresponding to the PMIC is obtained from the temperature lookup table.

[0010] In one embodiment, the step of adjusting the reference voltage REF corresponding to the PMIC to reduce the operating temperature corresponding to the PMIC includes: By controlling the digital-to-analog converter of the PMIC, a reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC; or, By controlling the bias current of the PMIC, a reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC; or, By controlling the output power state of the PMIC, a reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC.

[0011] In one embodiment, the step of collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit includes: The instantaneous current value of the key current path in the PMIC is obtained based on current mirror or resistor sensing.

[0012] In one embodiment, after the step of adjusting the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC, the temperature control method further includes: The cumulative duration of adjusting the reference voltage REF corresponding to the PMIC; If the duration reaches the preset duration, the process returns to the step of periodically collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit.

[0013] In addition, to achieve the above-mentioned purpose, the present application also provides a temperature control device, which includes: The acquisition module is used to regularly acquire the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit; an estimating module, configured to determine an estimated temperature corresponding to the PMIC based on the instantaneous current value; The regulating module is configured to regulate a reference voltage REF corresponding to the PMIC based on the estimated temperature, so as to reduce an operating temperature corresponding to the PMIC.

[0014] In addition, to achieve the above-mentioned purpose, the present application also provides a temperature control device, which includes: a memory, a processor, and a temperature control program stored on the memory and runnable on the processor. When the temperature control program is executed by the processor, the steps of the aforementioned temperature control method are implemented.

[0015] In addition, to achieve the above-mentioned purpose, the present application also provides a computer-readable storage medium, on which a temperature control program is stored. When the temperature control program is executed by a processor, the steps of the aforementioned temperature control method are implemented.

[0016] This application periodically collects the instantaneous current value of the key current path corresponding to a power management integrated circuit (PMIC) through a current detection circuit; then determines an estimated temperature corresponding to the PMIC based on the instantaneous current value; and then adjusts the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC. By collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit (PMIC) and estimating the temperature based on the instantaneous current value, this system replaces the temperature sensor or thermistor circuits used in related technologies. This avoids the additional circuit overhead and power consumption of the temperature sensor or thermistor circuit, significantly saving the chip area corresponding to the PMIC and reducing the bill of materials (BOM) cost without compromising system reliability. Furthermore, by dynamically adjusting the reference voltage (REF) or bias parameters based on the estimated temperature, the PMIC chip operates in a relatively low-heat state, effectively preventing overheating, thermal runaway, or thermal shutdown, thereby improving the long-term reliability and stability of the chip. This system is particularly suitable for PMIC applications under heavy loads or high-temperature environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1A schematic diagram of a flow chart of the first embodiment of the temperature control method of the present application; Figure 2 This is a schematic diagram of the module structure of the temperature control device according to an embodiment of the present application; Figure 3 This is a schematic diagram of the module structure of the temperature control device according to an embodiment of the present application.

[0020] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0022] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0023] The main solution of this application is: collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through a current detection circuit; determining the estimated temperature corresponding to the PMIC based on the instantaneous current value; and adjusting the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC.

[0024] Currently, a PMIC (Power Management Integrated Circuit) is an integrated circuit that integrates multiple power management functions. The PMIC is used to provide power management and power conversion functions.

[0025] The main functions of a PMIC include power management, battery charge management, programmable logic control, and energy conservation and power optimization. Power management refers to the PMIC's ability to receive an external power source or battery voltage and convert it to the appropriate voltage or current required by the device. A PMIC typically includes multiple voltage regulators to adjust the input voltage to a stable output voltage for various components. Battery charge management refers to the PMIC's responsibility for managing the battery charging process in battery-powered devices such as mobile devices. The PMIC can control charging current, monitor battery status, and implement charging protection functions to ensure safe charging and extend battery life. Programmable logic control refers to the PMIC's typically built-in programmable logic controller (PLC) for automatic power management based on device requirements. The PMIC can monitor, adjust, and optimize system power consumption, improving energy efficiency and battery life. Energy conservation and power optimization refer to the PMIC's ability to implement power management strategies to reduce power consumption and extend battery life. The PMIC can dynamically adjust the supply voltage and frequency and control the device's sleep and wake states to achieve energy conservation without sacrificing performance.

[0026] Currently, to monitor the operating temperature of the corresponding chip during PMIC operation, related technologies integrate temperature sensors into the circuit. These sensors collect the chip's operating temperature and dynamically adjust key parameters such as the chip's reference voltage (REF) based on temperature fluctuations, thereby achieving temperature control. However, the use of temperature sensors incurs additional circuit overhead and power consumption, increasing the chip area of ​​the corresponding PMIC and resulting in a high bill of materials (BOM) cost. Therefore, reducing the chip area and BOM cost of the corresponding PMIC is a pressing issue.

[0027] This application collects instantaneous current values ​​from the critical current paths of a power management integrated circuit (PMIC) and uses these values ​​to estimate temperature, replacing the temperature sensors or thermistor circuits used in related technologies. This eliminates the additional circuit overhead and power consumption of these circuits, significantly reducing the PMIC chip area and bill of materials (BOM) cost without compromising system reliability. Furthermore, the reference voltage (REF) or bias parameters are dynamically adjusted based on the estimated temperature, allowing the PMIC chip to operate in a relatively low-heat state. This effectively prevents overheating, thermal runaway, or thermal shutdown, thereby improving the chip's long-term reliability and stability. This is particularly suitable for PMIC applications under heavy loads or high-temperature environments.

[0028] It should be noted that the execution subject of this embodiment may be a temperature control device, or a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, mobile phone, or a temperature control device capable of performing the above functions, and this embodiment does not specifically limit this. The following describes this embodiment and the following embodiments using a temperature control device as the execution subject.

[0029] Based on this, this application proposes a temperature control method of the first embodiment, please refer to Figure 1 , the temperature control method includes steps S101 to S103: Step S101, regularly collecting instantaneous current values ​​of key current paths corresponding to the power management integrated circuit PMIC through a current detection circuit; It should be noted that when starting the PMIC, the corresponding reference voltage REF is set to a default value, which can be a factory calibration value. At the same time, the temperature estimation model or the preset instantaneous current value and the temperature lookup table corresponding to the preset temperature are loaded, and the sampling period of the instantaneous current value is set. For example, the periodic sampling of the instantaneous current value is started by starting the periodic sampling logic, and the sampling period can be 1ms or 10ms, etc., wherein the temperature estimation model can be a linear fitting function, and the temperature lookup table LUT is a temperature lookup table obtained based on a large amount of experimental data of the instantaneous current value and the corresponding operating temperature of the PMIC. The operating temperature corresponding to the current PMIC can be accurately found in the temperature lookup table according to the instantaneous current value.

[0030] After the PMIC is started, the current detection circuit periodically collects the instantaneous current value I_RD of the key current path corresponding to the power management integrated circuit PMIC. The key current path is the circuit path with the highest correlation with the operating temperature of the PMIC. The time interval for regularly collecting the instantaneous current value is the aforementioned sampling period. The instantaneous current value is the operating current of the PMIC, such as the RD current.

[0031] In a feasible implementation, step S101 may include step a: Step a: Obtain the instantaneous current value of the key current path in the PMIC based on a current mirror or resistance sensing method.

[0032] Among them, the current mirror is a standard component that is commonly found in analog integrated circuits, and it also appears in some digital circuits. In the design of traditional voltage-mode operational amplifiers, current mirrors are used to generate bias currents and serve as active loads. In the design of new current-mode analog integrated circuits, in addition to generating bias currents, current mirrors are also widely used to replicate or multiply current signals. Polarity-complementary current mirrors can also achieve the conversion of differential to single-ended current signals. Furthermore, the embodiments of the present application can obtain the instantaneous current value of the key current path in the PMIC through the current mirror method in the related art, so as to accurately obtain the instantaneous current value and improve the accuracy of temperature control of the PMIC.

[0033] Resistance sensing methods include using an inductance tester, forming an oscillation loop, measuring series resistance, using a multimeter, visual inspection, insulation inspection, bridge measurement, resonance measurement, and AC bridge measurement. The present embodiment uses any of these resistance sensing methods to obtain the instantaneous current value of a key current path in a PMIC, thereby accurately obtaining the instantaneous current value and improving the accuracy of PMIC temperature control.

[0034] Step S102, determining an estimated temperature corresponding to the PMIC based on the instantaneous current value; In this embodiment, after obtaining the instantaneous current value, the current estimated temperature of the PMIC is estimated by the estimation module. Specifically, the instantaneous current value is first converted into a digital signal, and the current value is transmitted to the estimation module in the form of a digital signal. The estimation module estimates the estimated temperature corresponding to the instantaneous current value.

[0035] In a feasible implementation, step S102 may include step b1: Step b1: input the instantaneous current value into a temperature estimation model to obtain an estimated temperature corresponding to the PMIC.

[0036] In this embodiment, if a temperature estimation model is loaded when the PMIC is started, the estimation module estimates the estimated temperature corresponding to the instantaneous current value using the temperature estimation model. Specifically, the estimation module inputs the instantaneous current value into the temperature estimation model and obtains the estimated temperature corresponding to the PMIC through the output of the temperature estimation model. When the temperature estimation model is a linear fitting function, the estimation module directly substitutes the instantaneous current value (digital signal) into the linear fitting function of the temperature estimation model to obtain the estimated temperature. For example, the linear fitting function is T_estimate=A×I_RD+B, where T_estimate is the estimated temperature, A is a scaling factor (unit may be °C / mA), I_RD is the instantaneous current value (digital signal), and B is an offset (unit may be °C). The temperature estimation model can then be used to accurately obtain the corresponding estimated temperature, thereby improving the accuracy of temperature control of the PMIC based on the estimated temperature.

[0037] In a feasible implementation, step S102 may include steps b2 to b3: Step b2, obtaining a temperature lookup table corresponding to a preset instantaneous current value and a preset temperature; Step b3: Based on the instantaneous current value, obtain the estimated temperature corresponding to the PMIC in the temperature lookup table.

[0038] In this embodiment, if a temperature lookup table corresponding to a preset instantaneous current value and a preset temperature is loaded when the PMIC is started, the estimation module estimates the estimated temperature corresponding to the instantaneous current value using the temperature lookup table. Specifically, the estimation module obtains the temperature lookup table corresponding to the preset instantaneous current value and the preset temperature, simultaneously obtains the instantaneous current value (digital signal), and searches the temperature lookup table based on the instantaneous current value (digital signal). The temperature lookup table then finds the preset temperature corresponding to the instantaneous current value (digital signal) as the estimated temperature corresponding to the PMIC. The temperature lookup table can then be used to accurately determine the corresponding estimated temperature, thereby improving the accuracy of temperature control of the PMIC based on the estimated temperature.

[0039] Step S103 : adjusting a reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce an operating temperature corresponding to the PMIC.

[0040] In this embodiment, after obtaining an estimated temperature, the reference voltage REF corresponding to the PMIC is adjusted based on the estimated temperature to reduce the operating temperature of the PMIC. Specifically, the reference voltage REF corresponding to the PMIC is increased by adjusting the operating parameters of the PMIC. After adjusting the reference voltage REF, the output voltage, current, or efficiency characteristics of the PMIC change, thereby reducing the heat generated by the PMIC and, in turn, the operating temperature of the PMIC, thereby achieving temperature control of the PMIC. Furthermore, using instantaneous current values ​​to estimate temperature replaces the temperature sensor or thermistor circuit in related technologies, eliminating the additional circuit overhead and power consumption of the temperature sensor. This significantly saves the chip area corresponding to the PMIC and reduces the bill of materials (BOM) cost without compromising system reliability. This is particularly suitable for cost- and area-sensitive SoCs or PMIC chips. Furthermore, by dynamically adjusting the reference voltage (REF) or bias parameters based on the estimated temperature, the PMIC chip operates in a relatively low-heat state, effectively preventing overheating, thermal runaway, or thermal shutdown, thereby improving the long-term reliability and stability of the chip. This is particularly suitable for PMIC applications under heavy loads or high-temperature environments, thereby enhancing the reliability of the corresponding PMIC system.

[0041] In a feasible implementation, step S103 may include steps c1 to c2: Step c1, determining whether the estimated temperature is greater than a temperature threshold corresponding to the PMIC; Step c2: If the estimated temperature is greater than the temperature threshold, adjusting the reference voltage REF corresponding to the PMIC to reduce the operating temperature corresponding to the PMIC.

[0042] In this embodiment, after the estimated temperature is obtained, a temperature threshold corresponding to the PMIC is obtained, and it is determined whether the estimated temperature is greater than the temperature threshold corresponding to the PMIC. The preset threshold can be reasonably set according to the working environment of the PMIC.

[0043] If the estimated temperature is less than or equal to the temperature threshold corresponding to the PMIC, the current operating temperature of the PMIC is determined to be normal. The PMIC maintains the current reference voltage REF and returns to the step of periodically sampling the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit to control the temperature of the PMIC at the same sampling period interval.

[0044] If the estimated temperature is greater than the temperature threshold, the reference voltage REF corresponding to the PMIC is adjusted. Specifically, the reference voltage REF corresponding to the PMIC is increased by adjusting the operating parameters corresponding to the PMIC, thereby reducing the operating temperature corresponding to the PMIC to achieve temperature control of the PMIC.

[0045] In a feasible implementation, step S103 may include steps c3 and c4: Step c3, adjusting the reference voltage REF corresponding to the PMIC by controlling the digital-to-analog converter of the PMIC to reduce the operating temperature corresponding to the PMIC; or Step c4, adjusting the reference voltage REF corresponding to the PMIC by controlling the bias current of the PMIC to reduce the operating temperature corresponding to the PMIC; or, Step c5: adjusting a reference voltage REF corresponding to the PMIC by controlling the output power state of the PMIC to reduce an operating temperature corresponding to the PMIC.

[0046] In this embodiment, when adjusting the reference voltage REF corresponding to the PMIC, various REF control logics can be used to adjust the REF value. For example, the reference voltage REF value can be increased by ΔV so that the adjusted reference voltage REF equals the current reference voltage REF + ΔV. After adjusting the reference voltage REF, the output voltage, current, or efficiency characteristics of the PMIC change, thereby reducing heat generation of the PMIC. It should be noted that whether the reference voltage REF value is increased or decreased is determined based on the circuit structure of the PMIC. In other embodiments, the reference voltage REF value can also be decreased by ΔV based on the circuit structure of the PMIC so that the adjusted reference voltage REF equals the current reference voltage REF - ΔV. After adjusting the reference voltage REF, the output voltage, current, or efficiency characteristics of the PMIC change, thereby reducing heat generation of the PMIC.

[0047] Specifically, in one possible implementation, the digital-to-analog converter DAC of the PMIC can be controlled, and the reference voltage REF corresponding to the PMIC can be adjusted through the REF control logic corresponding to the DAC. For example, the PMIC voltage can be adjusted through the DAC, or the "current" that generates the voltage in the PMIC chip can be reduced, thereby enabling the PMIC to lower its own output voltage and reduce its own output current, or the PMIC can switch to a more power-saving working mode, thereby changing the output voltage, current or efficiency characteristics of the PMIC, thereby reducing the heat generation of the PMIC.

[0048] In one possible implementation, the bias current of the PMIC can be controlled, and the reference voltage REF corresponding to the PMIC can be adjusted through the REF control logic corresponding to the bias current, so that the PMIC can lower its own output voltage and reduce its own output current, or the PMIC can switch to a more power-saving working mode, so that the output voltage, current or efficiency characteristics of the PMIC are changed, thereby reducing the heat generation of the PMIC.

[0049] In one possible implementation, the output power state of the PMIC can be controlled, and the reference voltage REF corresponding to the PMIC can be adjusted through the REF control logic corresponding to the output power state, so that the PMIC can lower its own output voltage and reduce its own output current, or the PMIC can be switched to a more power-saving working mode, so that the output voltage, current or efficiency characteristics of the PMIC are changed, thereby reducing the heat generation of the PMIC.

[0050] In a feasible implementation, after step S103, the temperature control method may further include steps d1 to d2: Step d1, accumulating the duration of adjusting the reference voltage REF corresponding to the PMIC; Step d2: If the duration reaches the preset duration, return to the step of periodically collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit.

[0051] It should be noted that a preset time length can also be pre-set, wherein the preset time length can be an integer multiple of the sampling period corresponding to the instantaneous current value, that is, the preset time length is a delay control period, through which the reference voltage is prohibited from being adjusted again within several sampling periods, or the preset time length is a reasonably set hysteresis threshold (Hysteresis threshold).

[0052] In this embodiment, the duration is accumulated when adjusting the reference voltage REF corresponding to the PMIC. For example, when controlling the digital-to-analog converter of the PMIC, the duration is the duration after controlling the digital-to-analog converter; when controlling the bias current of the PMIC, the duration is the duration after controlling the bias current; when controlling the output power state of the PMIC, the duration is the duration after controlling the output power state.

[0053] When the duration is accumulated, it is determined in real time whether the duration reaches the preset duration. If the duration reaches the preset duration, the process returns to the step of regularly collecting the instantaneous current value I_RD of the key current path in the PMIC through the current detection circuit, so as to implement the cyclic execution of the PMIC temperature control logic and realize dynamic closed-loop temperature control of the PMIC.

[0054] Compared with the problems of large response delay and poor linearity of traditional thermistors, the embodiments of the present application use instantaneous current values ​​for temperature estimation, which can achieve higher sampling frequency and temperature judgment accuracy, and can quickly adjust and respond to thermal conditions, reducing the risk of thermal overshoot of PMIC.

[0055] This embodiment of the present application utilizes the operating current (e.g., RD) in the PMIC to indirectly estimate chip temperature, eliminating the need for a traditional temperature sensor. When the estimated temperature exceeds a threshold, the REF value is automatically adjusted through control logic to minimize power consumption or suppress heat sources. This complete closed-loop system, combining current sensing with a LUT / linear model, REF control, and delay logic, eliminates the need for a temperature sensor, reduces system complexity, enables faster response, and simplifies digital integration, reducing chip area and manufacturing costs. This approach is particularly suitable for small, high-density PMIC designs.

[0056] The embodiments of the present application are applicable to PMICs with different architectures, such as LDO (Low Dropout Regulator), Buck Converter (step-down DC-DC converter), and Switched Capacitor (capacitor switching converter). They can also be used for various voltage reference circuits such as Bias block (bias circuit module), ADC reference (analog-to-digital converter reference voltage), and PLL LDO (phase-locked loop regulator) inside chip modules to achieve a wider range of temperature protection and dynamic adjustment strategies. The control principle and circuit structure have no strong dependence and strong adaptability. A set of general mechanisms can be deployed in multiple power modules, enhancing the consistent design of the chip platform and having good versatility.

[0057] The temperature control logic of the embodiment of the present application can be implemented by a simple digital control circuit (such as FSM or MCU), without the need for a complex analog temperature control loop, making it easy to integrate and implement in a SoC or digital PMIC, and supporting subsequent OTA or software updates, with good configurability and scalability.

[0058] The temperature control method proposed in this embodiment periodically collects the instantaneous current value of the key current path corresponding to the power management integrated circuit (PMIC) through a current detection circuit; then determines the estimated temperature of the PMIC based on the instantaneous current value; and then adjusts the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature of the PMIC. By collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit (PMIC) and estimating the temperature based on the instantaneous current value, this method replaces the temperature sensor or thermistor circuit used in related technologies. This method avoids the additional circuit overhead and power consumption of the temperature sensor or thermistor circuit, significantly saving the chip area corresponding to the PMIC and reducing the bill of materials (BOM) cost without compromising system reliability. Furthermore, by dynamically adjusting the reference voltage (REF) or bias parameters based on the estimated temperature, the PMIC chip operates in a relatively low-heat state, effectively preventing overheating, thermal runaway, or thermal shutdown, thereby improving the long-term reliability and stability of the chip. This method is particularly suitable for PMIC applications under heavy loads or high-temperature environments.

[0059] The present application also provides a temperature control device, please refer to Figure 2 , the temperature control device comprises: The acquisition module 10 is used to regularly acquire the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit; an estimating module 20, configured to determine an estimated temperature corresponding to the PMIC based on the instantaneous current value; The regulating module 30 is configured to regulate a reference voltage REF corresponding to the PMIC based on the estimated temperature, so as to reduce an operating temperature corresponding to the PMIC.

[0060] The temperature control device provided in the embodiments of the present application, employing the temperature control method described in the above embodiments, can address the technical issues of saving PMIC chip area and reducing BOM costs. Compared to the prior art, the temperature control device provided in the embodiments of the present application achieves the same beneficial effects as the temperature control method described in the above embodiments. Other technical features of the temperature control device are the same as those disclosed in the above embodiments and are not further detailed here.

[0061] The present application provides a temperature control device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the temperature control method in the above-mentioned embodiment one.

[0062] Reference below Figure 3 , which shows a schematic diagram of the structure of a temperature control device suitable for implementing the embodiments of the present application. The temperature control device in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (such as in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 3 The temperature control device shown is merely an example and should not limit the functions and scope of use of the embodiments of the present application.

[0063] like Figure 3As shown, the temperature control device may include a processing device 1001 (e.g., a central processing unit, graphics processing unit, etc.), which can perform various appropriate actions and processes based on programs stored in ROM (Read Only Memory) 1002 or programs loaded from storage device 1003 into RAM (Random Access Memory) 1004. RAM 1004 also stores various programs and data required for the operation of the temperature control device. Processing device 1001, ROM 1002, and RAM 1004 are interconnected via bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to I / O interface 1006: input devices 1007, such as a touch screen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices 1008, such as an LCD (Liquid Crystal Display), speaker, vibrator, etc.; storage device 1003, such as a magnetic tape or hard disk; and communication device 1009. Communication device 1009 can allow the temperature control device to communicate with other devices wirelessly or wired to exchange data. Although the figure shows a temperature control device with various systems, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or have instead.

[0064] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program comprising program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0065] The temperature control device provided in this application, employing the temperature control method described in the aforementioned embodiment, can address the technical issues of saving PMIC chip area and reducing bill of materials (BOM) costs. Compared to the prior art, the temperature control device provided in this application achieves the same beneficial effects as the temperature control method described in the aforementioned embodiment. Other technical features of this temperature control device are the same as those disclosed in the aforementioned embodiment and are not further elaborated here.

[0066] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0067] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

[0068] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer program) stored thereon, wherein the computer-readable program instructions are used to execute the temperature control method in the above embodiment.

[0069] The computer-readable storage medium provided herein may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems, or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to, an electrical connection having one or more wires, a portable computer disk, a hard disk, RAM (Random Access Memory), ROM (Read Only Memory), EPROM or flash memory (Erasable Programmable Read Only Memory), optical fiber, CD-ROM (CD-Read Only Memory), optical storage device, magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including, but not limited to, wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0070] The computer-readable storage medium may be included in the temperature control device, or may exist independently without being assembled into the temperature control device.

[0071] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by a temperature control device, the temperature control device: regularly collects instantaneous current values ​​of a critical current path corresponding to a power management integrated circuit (PMIC) through a current detection circuit; determines an estimated temperature corresponding to the PMIC based on the instantaneous current values; and adjusts a reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC.

[0072] The computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a LAN (Local Area Network) or a WAN (Wide Area Network), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0073] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0074] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0075] The computer-readable storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned temperature control method. This computer-readable storage medium addresses the technical challenges of reducing PMIC chip area and bill of materials (BOM) costs. Compared to existing technologies, the computer-readable storage medium provided in this application offers the same benefits as the temperature control method provided in the aforementioned embodiments, and will not be further elaborated upon here.

[0076] An embodiment of the present application provides a computer program product, including a computer program, which implements the steps of the temperature control method described above when executed by a processor.

[0077] The computer program product provided in this application can solve the technical problem of how to save the chip area corresponding to the PMIC and reduce the bill of materials (BOM) cost. Compared with the prior art, the beneficial effects of the computer program product provided in the embodiments of this application are the same as the beneficial effects of the temperature control method provided in the above embodiments, and will not be repeated here.

[0078] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A temperature control method, characterized in that: The temperature control method comprises the following steps: Regularly collect the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit; determining an estimated temperature corresponding to the PMIC based on the instantaneous current value; A reference voltage REF corresponding to the PMIC is adjusted based on the estimated temperature to reduce an operating temperature corresponding to the PMIC.

2. The temperature control method according to claim 1, wherein: The step of adjusting the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC includes: Determining whether the estimated temperature is greater than a temperature threshold corresponding to the PMIC; If the estimated temperature is greater than the temperature threshold, the reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC.

3. The temperature control method according to claim 1, wherein: The step of determining the estimated temperature corresponding to the PMIC based on the instantaneous current value includes: The instantaneous current value is input into a temperature estimation model to obtain an estimated temperature corresponding to the PMIC.

4. The temperature control method according to claim 1, wherein: The step of determining the estimated temperature corresponding to the PMIC based on the instantaneous current value includes: Obtaining a temperature lookup table corresponding to a preset instantaneous current value and a preset temperature; Based on the instantaneous current value, an estimated temperature corresponding to the PMIC is obtained from the temperature lookup table.

5. The temperature control method according to claim 1, wherein: The step of adjusting the reference voltage REF corresponding to the PMIC to reduce the operating temperature corresponding to the PMIC includes: By controlling the digital-to-analog converter of the PMIC, a reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC; or, By controlling the bias current of the PMIC, a reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC; or, By controlling the output power state of the PMIC, a reference voltage REF corresponding to the PMIC is adjusted to reduce the operating temperature corresponding to the PMIC.

6. The temperature control method according to claim 1, wherein: The step of collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit includes: The instantaneous current value of the key current path in the PMIC is obtained based on current mirror or resistor sensing.

7. The temperature control method according to any one of claims 1 to 6, characterized in that: After the step of adjusting the reference voltage REF corresponding to the PMIC based on the estimated temperature to reduce the operating temperature corresponding to the PMIC, the temperature control method further includes: The cumulative duration of adjusting the reference voltage REF corresponding to the PMIC; If the duration reaches the preset duration, the process returns to the step of periodically collecting the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit.

8. A temperature control device, characterized in that: The temperature control device comprises: The acquisition module is used to regularly acquire the instantaneous current value of the key current path corresponding to the power management integrated circuit PMIC through the current detection circuit; an estimating module, configured to determine an estimated temperature corresponding to the PMIC based on the instantaneous current value; The regulating module is configured to regulate a reference voltage REF corresponding to the PMIC based on the estimated temperature, so as to reduce an operating temperature corresponding to the PMIC.

9. A temperature control device, characterized in that: The temperature control device includes: a memory, a processor, and a temperature control program stored in the memory and executable on the processor. When the temperature control program is executed by the processor, the steps of the temperature control method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a temperature control program, which, when executed by a processor, implements the steps of the temperature control method according to any one of claims 1 to 7.

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