Semiconductor substrate plasma cleaning equipment

Abstract

The semiconductor substrate plasma cleaning equipment relates to the field of plasma cleaning and comprises a box body, the box body is provided with a vacuum cavity, a radio frequency electrode plate and a grounding electrode plate are arranged at the top and the bottom of the vacuum cavity respectively, a box opening is formed in one side of the box body, an outer box door is rotationally installed on the outer side of the box body, and the outer box door is used for sealing the box opening from the outside through a door lock. An outer box door and an inner box door are mounted on the outer side of the box body, a positioning frame is mounted on the inner side of the outer box door, an inner box door is rotatably mounted at the bottom of the vacuum cavity, an air cylinder is rotatably connected between the side edge of the inner box door and the box body, and the air cylinder is used for driving the inner box door to horizontally press the upper portion of the grounding electrode plate or vertically seal a box opening from the inside. The box opening is alternately sealed through the outer box door and the inner box door, the semiconductor substrate on the surface of the positioning frame can be replaced without releasing the pressure in the box body, the continuous cleaning work efficiency is improved, and the operation energy consumption of equipment is reduced.

Description

Technical Field

[0001] The present invention relates to the field of plasma cleaning, and in particular to a semiconductor substrate plasma cleaning device. Background Art

[0002] Radio frequency vacuum plasma cleaning equipment is widely used for high-precision cleaning of semiconductor substrates. The cleaning equipment has a sealed chamber that creates vacuum or sub-vacuum conditions for cleaning. The plasma generated by ionizing the gas around the electrode using high frequency and high voltage is evenly distributed in the vacuum state, achieving high cleaning accuracy for semiconductor substrates. Since the cleaning work needs to maintain a vacuum or sub-vacuum state, each time the semiconductor substrate is replaced for cleaning, the chamber needs to be depressurized first, then the cabin door is opened to replace the semiconductor substrate, and then the air is pumped out to restore the chamber to a vacuum state, resulting in low efficiency of continuous cleaning work, and the frequent driving of cabin pressure changes makes the equipment consume high energy. Summary of the Invention

[0003] In order to make up for the deficiencies of the existing technical problems, the purpose of the present invention is to provide a semiconductor substrate plasma cleaning device for solving the problems of low efficiency and high energy consumption in continuous cleaning of semiconductor substrates by radio frequency vacuum plasma cleaning equipment.

[0004] In order to solve the problems of the prior art, the technical solutions of the present invention are as follows: A semiconductor substrate plasma cleaning device comprises: a box body, the box body having a vacuum chamber, a radio frequency electrode plate and a grounding electrode plate being respectively arranged at the top and bottom of the vacuum chamber, a box opening being arranged on one side of the box body, an outer box door being rotatably mounted on the outside of the box body, the outer box door being used to close the box opening from the outside via a door lock, an inner box door being rotatably mounted on the bottom of the vacuum chamber, a cylinder being rotatably connected between the side of the inner box door and the box body, the cylinder being used to drive the inner box door to press horizontally above the grounding electrode plate or to close the box opening vertically from the inside, a positioning frame being provided on the surface of the inner box door for clamping the semiconductor substrate, and the positioning frame being oriented toward the outside of the box opening when the inner box body closes the box opening.

[0005] Preferably, the door lock includes a base plate fixed to the edge of the box opening, a hook plate fixed on the surface of the seat plate, and a lock cavity is formed between the hook plate and the seat plate. A handle is rotatably installed on the surface of the outer box door, and a lock plate is coaxially fixed to the handle. The handle is rotated to make the lock plate engage in or disengage from the lock cavity.

[0006] Preferably, the inner top of the outer box door is elastically rotated to install a bevel lock tooth through a torsion spring, and a lock groove is provided on the top of the box opening. When the outer box door closes the box opening, the bevel lock tooth is inserted into the lock groove. A touch plate is provided on the top of the outer surface of the inner box door. When the inner box door closes the box opening, the touch plate contacts the bevel lock tooth and disengages from the lock groove.

[0007] Preferably, a stud is threadedly installed from the outside of the outer box door to the inside, the stud is aligned with the upper part of the bevel lock tooth, and the stud is rotated to resist the deflection of the bevel lock tooth and disengage from the lock groove.

[0008] Preferably, a push switch is provided at the bottom of the vacuum chamber, and the push switch is connected to the circuit of the RF electrode plate. When the inner box door is in a horizontal state, pressing the push switch makes the RF electrode plate circuit conductive, and when the inner box door is in a vertical state and does not contact the push switch, the RF electrode plate circuit is disconnected.

[0009] Preferably, two cylinders are symmetrically installed on both sides of the inner box door.

[0010] Preferably, the surface of the inner door has an embedding groove, the positioning frame is embedded in the embedding groove, both sides of the embedding groove have clamping grooves, both sides of the positioning frame have elastic clamping plates, and the elastic clamping plates are clamped with the clamping grooves.

[0011] Preferably, the positioning frame includes a square frame, and the surface of the square frame is provided with slide grooves extending in four directions, each slide groove is slidably connected to a positioning piece, and a spring is connected between the positioning piece and the square frame to apply elastic force toward the center of the square frame to the positioning piece so that the positioning piece can gather and clamp the semiconductor substrate. A winding wheel is rotatably installed at one corner of the square frame, and the winding wheel winds up four groups of soft steel wires. The soft steel wires are guided by guide wheels and connected to each positioning piece along the edge of the square frame. The winding wheel is rotated to wind up the soft steel wire to cause the four positioning pieces to expand and move synchronously.

[0012] Preferably, the positioning member includes a slider, the surface of the slider has a clamp seat, the surface of the clamp seat is provided with a spring piece and a clamp in turn, a screw is passed through the clamp, and the spring piece is threadedly connected to the clamp seat to fix the spring piece, and both ends of the spring piece are bent toward the center of the square frame, and both ends of the spring piece are fixed with a clamping column.

[0013] Preferably, the end of the clamping column is provided with a pad, and the center position of the square frame is provided with a pad, and the pad and the pad are located at the same height plane.

[0014] Compared with the prior art, the advantages of the present invention are as follows: 1. The present invention can seal the box opening from the outside and the inside through the outer box door and the inner box door. The positioning frame is loaded on the surface of the inner box door. The outer box door and the inner box door are used to alternately seal the box opening. The semiconductor substrate on the surface of the positioning frame can be replaced without releasing the pressure in the box, thereby improving the efficiency of continuous cleaning work and reducing the operating energy consumption of the equipment.

[0015] 2. The present invention locks the outer door by engaging the beveled lock teeth with the lock groove. Only when the inner door is completely closed from the inside, the touch plate abuts against the beveled lock teeth and disengages the lock groove, and the outer door can be opened normally, thereby ensuring that no pressure relief occurs during the replacement of the semiconductor substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the cleaning state of the present invention.

[0018] Figure 3 It is a schematic diagram of the internal closed state structure of the present invention.

[0019] Figure 4 It is a schematic structural diagram of the material replacement state of the present invention.

[0020] Figure 5 for Figure 2 A magnified schematic diagram of part A.

[0021] Figure 6 for Figure 3 An enlarged schematic diagram of part B.

[0022] Figure 7 It is a schematic diagram of the connection structure between the positioning frame and the inner box door of the present invention.

[0023] Figure 8 It is a schematic diagram of the connection structure between the elastic card plate and the card slot of the present invention.

[0024] Figure 9 This is one of the schematic diagrams of the positioning frame structure of the present invention.

[0025] Figure 10 This is the second schematic diagram of the positioning frame structure of the present invention.

[0026] Figure 11 It is a schematic diagram of the positioning member structure of the present invention.

[0027] Figure 12 It is a schematic diagram of the door lock structure of the present invention.

[0028] Figure numerals: 1. Box body; 11. RF electrode plate; 12. Ground electrode plate; 2. Outer box door; 21. Bevel lock tooth; 22. Lock groove; 23. Stud; 3. Inner box door; 31. Touch plate; 32. Embedded groove; 33. Card slot; 4. Positioning frame; 41. Square frame; 42. Slide; 43. Pad; 44. Winding wheel; 45. Soft steel wire; 5. Cylinder; 6. Push switch; 7. Door lock; 71. Base plate; 72. Hook plate; 73. Lock chamber; 74. Handle; 75. Lock plate; 8. Elastic card plate; 9. Positioning piece; 91. Slider; 92. Clamp seat; 93. Ear plate; 94. Spring piece; 95. Clip; 96. Card column; 97. Pad. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0030] like Figure 1-4 As shown, the semiconductor substrate plasma cleaning equipment has a box body 1, which is equipped with conventional components such as gas inlet and outlet, temperature and pressure detection sensors, etc. The interior of the box body 1 has a vacuum chamber, and the top and bottom of the vacuum chamber are installed with aligned radio frequency electrode plates 11 and ground electrode plates 12. The surfaces of the radio frequency electrode plates 11 and the ground electrode plates 12 are insulated, and a box opening is opened on the front side of the box body 1.

[0031] The outer box door 2 is rotatably installed on the outside of the box body 1 through a hinge. The outer box door 2 rotates laterally to close the box opening from the outside. The outer box door 2 and the box body 1 are locked by a door lock 7. The inner box door 3 is arranged in the vacuum chamber. One end of the inner box door 3 is rotatably connected to the side of the vacuum chamber close to the box opening. Two cylinders 5 are symmetrically rotatably installed on both sides of the vacuum chamber. The telescopic ends of the cylinders 5 are rotatably connected to the sides of the inner box door 3. A positioning frame 4 is installed on the surface of the inner box door 3. Rubber sealing layers are provided at the fitting parts of the inner box door 3, the outer box door 2 and the box opening.

[0032] In the cleaning state, the outer box door 2 closes the box opening, the inner box door 3 is pressed horizontally above the ground electrode plate 12, the semiconductor substrate is assembled on the surface of the positioning frame 4, the vacuum chamber is evacuated to form a vacuum environment, and the process gas is introduced between the RF electrode plate 11 and the ground electrode plate 12. The RF electrode plate 11 is energized to ionize the process gas to form plasma to clean the semiconductor substrate. After the cleaning work is completed, there is no need to release the pressure in the vacuum chamber. The cylinder 5 is opened to extend and push the inner box door 3 to flip to a vertical state, so that the inner box door 3 blocks the box opening from the inside, and then the outer box door 2 is opened to expose the semiconductor substrate at the box opening, the semiconductor substrate on the surface of the positioning frame 4 is replaced, and then the outer box door 2 is closed to block the box opening from the outside, and then the cylinder 5 is opened to contract, so that the inner box door 3 is rotated to a horizontal state for cleaning work.

[0033] like Figure 12 As shown, the outer door 2 is sealed by a double locking method of a door lock 7 and a bevel lock tooth 21. The door lock 7 includes a base plate 71 fixed to the edge of the box opening. A hook plate 72 is fixed on the surface of the base plate 71. A lock cavity 73 is formed between the hook plate 72 and the base plate 71. A handle 74 is rotatably installed on the surface of the outer door 2. The handle 74 is coaxially fixed to a lock plate 75. The edge of the lock plate 75 and the end of the hook plate 72 are both chamfered. like Figure 5 、 Figure 6As shown, the bevel lock tooth 21 is L-shaped as a whole. One end of the bevel lock tooth 21 is elastically rotatably mounted on the top of the inner side of the outer box door 2 through a torsion spring. The other end of the bevel lock tooth 21 is beveled. A lock groove 22 is provided at the top of the box opening. A touch plate 31 is fixedly mounted on the top of the outer surface of the inner box door 3. The end of the touch plate 31 is arc-shaped. When the cam 74 is in the closed position, the latch 76 is in the locked state, and the latch 78 is in the locked state, so that the cam 76 is locked and the latch 78 is in the locked state.

[0034] like Figure 5 、 Figure 6 As shown, the stud 23 is threaded through the outside of the outer door 2 from the inside. The inner end of the stud 23 is spherical. The inner end of the stud 23 is aligned with the upper part of the inclined lock tooth 21. When cleaning or repairing the vacuum chamber, it is necessary to ensure that the inner door 3 is in a horizontal state. At this time, the inclined lock tooth 21 is engaged with the lock groove 22, resulting in the outer door 2 cannot be opened. By rotating the stud 23 to push the inclined lock tooth 21 inward to rotate, the inclined lock tooth 21 is disengaged from the lock groove 22, and the outer door 2 can be opened to carry out cleaning or repair work on the vacuum chamber.

[0035] like Figure 2-4 As shown, a push switch 6 is provided at the bottom of the vacuum chamber, and the push switch 6 is connected to the circuit of the RF electrode plate 11. When the inner box door 3 is in a horizontal state, the push switch 6 is pressed downward to connect the circuit of the RF electrode plate 11. When the inner box door 3 is in a vertical state and does not contact the push switch 6, the circuit of the RF electrode plate 11 is disconnected, thereby ensuring that no ionization work is performed during the replacement of the semiconductor substrate.

[0036] The push switch 6 and the cylinder 5 are both located at the edge, staggered with the radio frequency electrode plate 11 and the ground electrode plate 12, and the surfaces of the push switch 6 and the cylinder 5 are treated with shielding isolation materials.

[0037] like Figure 7 、 Figure 8 As shown, the surface of the inner door 3 is recessed inward to form a square embedding groove 32. The positioning frame 4 includes a square frame 41. The square frame 41 is adapted to the contour of the embedding groove 32 so that the square frame 41 can be embedded in the embedding groove 32. The embedding groove 33 begins on both sides of the embedding groove 32. The elastic clips 8 are fixed on both sides of the square frame 41. The elastic clips 8 are U-shaped so that the elastic clips 8 can be deformed and embedded in the embedding grooves 33, thereby fixing the square frame 41 to the inner door 3. like Figure 9 、 Figure 10 As shown, the surface of the square frame 41 is provided with slide grooves 42 extending in four directions, and each slide groove 42 is slidably connected to a positioning member 9. A spring is connected between the positioning member 9 and the square frame 41 to apply elastic force to the positioning member 9 toward the center of the square frame 41, so that the positioning member 9 can gather and clamp the semiconductor substrate. A winding wheel 44 is rotatably installed at a corner of the square frame 41. The winding wheel 44 winds up four groups of soft steel wires 45. The soft steel wires 45 are guided by a guide wheel along the edge of the square frame 41 to connect to each positioning member 9. The guide wheel is concave in the middle, which can limit the position of the soft steel wire 45 and ensure that the soft steel wire 45 will not be dislocated or detached when it is relaxed.

[0038] There are two ways to replace the semiconductor substrate: Method 1: Use at least two sets of positioning frames 4, one set is loaded on the surface of the inner box door 3 to position the semiconductor substrate for cleaning, and the other set of spare positioning frames 4 is loaded with the semiconductor substrate waiting to be cleaned. When replacing the semiconductor substrate, the elastic clamping plate 8 is released from the clamping slot 33, and the entire positioning frame 4 is replaced on the surface of the inner box door 3 to realize the replacement of the semiconductor substrate.

[0039] Method 2: Only one set of positioning frames 4 is used. When replacing the semiconductor substrate, the winding wheel 44 is rotated to wind up the soft steel wire 45. The soft steel wire 45 pulls each positioning member 9 to spread and move. The cleaned semiconductor substrate is removed and the replaced semiconductor substrate is placed on the surface of the square frame 41. The winding wheel 44 is released and the four positioning members 9 clamp and fix the semiconductor substrate through elastic force to complete the replacement of the semiconductor substrate.

[0040] The four sets of elastically slidably mounted positioning members 9 can adapt to clamp semiconductor substrates of different sizes and shapes and have high versatility.

[0041] like Figure 11 As shown, the positioning member 9 includes a slider 91, which is used to linearly slide and connect the slide groove 42. The bottom of the slider 91 is fixed with an ear plate 93, and the ear plate 93 is used to connect the spring and the soft steel wire 45. The upper surface of the slider 91 is fixed with a clamping seat 92, and the spring piece 94 is flat against the clamping seat 92, and then the clamping piece 95 is attached to the outside of the spring piece 94. A screw is used to penetrate the clamping piece 95, and the spring piece 94 is threadedly connected to the clamping seat 92 to fix the spring piece 94. The spring piece 94 is made of memory steel sheet. The two ends of the spring piece 94 are bent toward the center of the square frame 41. Rubber clamping columns 96 are fixed at both ends of the spring piece 94. The two clamping columns 96 are used to resist the edge of the semiconductor substrate for centering the semiconductor substrate. The clamping column 96 flexibly contacts the semiconductor substrate to achieve clamping protection. The elastic force of the spring piece 94 makes the clamping column 96 elastically resist the semiconductor substrate, further improving the non-hard extrusion protection of the semiconductor substrate.

[0042] A pad 97 is integrally fixed at the end of the clamping column 96, and the edge of the pad 97 has a chamfer. A pad 43 is provided at the center of the square frame 41, and the pad 43 and the pad 97 are located at the same height plane. The center position of the semiconductor substrate is supported by the pad 43, and the clamping column 96 clamps the edge of the semiconductor substrate. The pad 97 can support the back edge of the semiconductor substrate, thereby achieving stable horizontal positioning of the semiconductor substrate and reducing the risk of scratching the surface of the semiconductor substrate.

[0043] While the embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that various changes, modifications, substitutions, and alterations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A semiconductor substrate plasma cleaning device, comprising: A box body (1), wherein the box body (1) has a vacuum chamber, and a radio frequency electrode plate (11) and a grounding electrode plate (12) are respectively arranged on the top and bottom of the vacuum chamber; a box opening is arranged on one side of the box body (1); an outer box door (2) is rotatably installed on the outer side of the box body (1); the outer box door (2) is used to close the box opening from the outside through a door lock (7); and the character is characterized in that an inner box door (3) is rotatably installed on the bottom of the vacuum chamber, a cylinder (5) is rotatably connected between the side of the inner box door (3) and the box body (1), and the cylinder (5) is used to drive the inner box door (3) to press horizontally above the grounding electrode plate (12) or vertically close the box opening from the inside; a positioning frame (4) for clamping a semiconductor substrate is provided on the surface of the inner box door (3); when the inner box body (1) closes the box opening, the positioning frame (4) faces the outside of the box opening.

2. The semiconductor substrate plasma cleaning equipment according to claim 1, characterized in that: The door lock (7) comprises a base plate (71) fixed to the edge of the box opening, a hook plate (72) fixed to the surface of the base plate (71), a lock cavity (73) formed between the hook plate (72) and the base plate (71), a handle (74) rotatably mounted on the surface of the outer box door (2), a lock plate (75) coaxially fixed to the handle (74), and the lock plate (75) is engaged in or disengaged from the lock cavity (73) by rotating the handle (74).

3. The semiconductor substrate plasma cleaning equipment according to claim 1, wherein: The top of the inner side of the outer box door (2) is elastically rotated to install an inclined lock tooth (21) through a torsion spring, and a lock groove (22) is provided at the top of the box opening. When the outer box door (2) closes the box opening, the inclined lock tooth (21) is locked into the lock groove (22). A touch plate (31) is provided at the top of the outer surface of the inner box door (3). When the inner box door (3) closes the box opening, the touch plate (31) contacts the inclined lock tooth (21) and is disengaged from the lock groove (22).

4. The semiconductor substrate plasma cleaning equipment according to claim 3, characterized in that: A stud (23) is threadedly installed from the outside of the outer box door (2) to the inside, and the stud (23) is aligned with the upper part of the bevel lock tooth (21). The stud (23) is rotated to resist the bevel lock tooth (21) and deflect to disengage from the lock groove (22).

5. The semiconductor substrate plasma cleaning equipment according to claim 1, wherein: A push switch (6) is provided at the bottom of the vacuum chamber. The push switch (6) is connected to the circuit of the radio frequency electrode plate (11). When the inner box door (3) is in a horizontal state, the push switch (6) is pressed downward to connect the circuit of the radio frequency electrode plate (11). When the inner box door (3) is in a vertical state and does not contact the push switch (6), the circuit of the radio frequency electrode plate (11) is disconnected.

6. The semiconductor substrate plasma cleaning equipment according to claim 1, wherein: Two cylinders (5) are symmetrically mounted on both sides of the inner box door (3).

7. The semiconductor substrate plasma cleaning equipment according to claim 1, wherein: The surface of the inner box door (3) has an embedding groove (32), the positioning frame (4) is embedded in the embedding groove (32), both sides of the embedding groove (32) have clamping grooves (33), and both sides of the positioning frame (4) have elastic clamping plates (8), and the elastic clamping plates (8) are clamped with the clamping grooves (33).

8. The semiconductor substrate plasma cleaning equipment according to claim 1, wherein: The positioning frame (4) includes a square frame (41), and the surface of the square frame (41) is provided with a slide groove (42) extending in four directions. Each slide groove (42) is slidably connected to a positioning member (9). A spring is connected between the positioning member (9) and the square frame (41), and an elastic force is applied to the positioning member (9) toward the center of the square frame (41), so that the positioning member (9) can gather and clamp the semiconductor substrate. A reel (44) is rotatably installed at a corner of the square frame (41). The reel (44) reels four groups of soft steel wires (45). The soft steel wires (45) are guided by a guide wheel along the edge of the square frame (41) to connect to each positioning member (9). The reel (44) is rotated to reel in the soft steel wires (45) so that the four positioning members (9) expand and move synchronously.

9. The semiconductor substrate plasma cleaning equipment according to claim 8, characterized in that: The positioning member (9) includes a slider (91), the surface of the slider (91) has a clamping seat (92), the surface of the clamping seat (92) is provided with a spring piece (94) and a clamping piece (95) in sequence, a screw is passed through the clamping piece (95), and the spring piece (94) is threadedly connected to the clamping seat (92) for fixing the spring piece (94), and both ends of the spring piece (94) are bent toward the center of the square frame (41), and both ends of the spring piece (94) are fixed with a clamping column (96).

10. The semiconductor substrate plasma cleaning equipment according to claim 9, wherein: The end of the clamping column (96) is provided with a pad (97), and the center of the square frame (41) is provided with a pad (43), and the pad (43) and the pad (97) are located at the same height plane.

Images