Sectional type packaging device for MOS (Metal Oxide Semiconductor) tube

Abstract

The invention discloses a segmented packaging device for an MOS tube, and relates to the technical field of MOS tube packaging, the segmented packaging device comprises an MOS tube main body, an upper packaging component and a lower packaging component, the top of the MOS tube main body is provided with the upper packaging component, the lower packaging component is arranged at the bottom of the MOS tube main body, and a pin component is inserted in the front side surface of the lower packaging component. According to the segmented packaging device for the MOS transistor, when the upper packaging component and the lower packaging component are arranged on the upper side and the lower side of the MOS transistor body respectively, on one hand, good structural protection can be provided for the MOS transistor body so as to guarantee the service life of the MOS transistor body, on the other hand, the segmented packaging device can be used in cooperation with the pin component of a pluggable structure, packaging of a multi-segment structure can be achieved, and the service life of the MOS transistor body is prolonged. And meanwhile, the fixing nail, the first sealing piece and the second sealing piece are matched for use, so that the sealing performance and the firmness of connection between the upper packaging component and the lower packaging component can be guaranteed, and the service life of the whole structure is further prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of MOS tube packaging, and in particular to a segmented packaging device for a MOS tube. Background Art

[0002] MOS transistor, the full name of which is Metal Oxide Semiconductor Field Effect Transistor, is a widely used electronic device. MOS transistor belongs to the insulated gate type among field effect transistors, so it is sometimes also called insulated gate field effect transistor. MOS transistor controls the electric field on or inside the semiconductor by controlling the gate voltage, thereby controlling the current between the source and drain. When the gate voltage reaches a certain value, a conductive channel is formed on the surface of the semiconductor, allowing current to flow from the source to the drain;

[0003] A MOS tube package is a device that adds a housing to a MOS tube chip after it's fabricated. This housing primarily supports, protects, and cools the chip, while also providing electrical connections and isolation for the chip, thereby integrating the MOS tube device with other components into a complete circuit. The design and type of the housing affect the MOS tube's dimensions, electrical parameters, and function within the circuit.

[0004] Conventional MOS tube packaging devices have a relatively integrated structure, so when the device structure is damaged, it can only be maintained by replacing the entire device, which increases the structural maintenance cost of the device and also provides relatively limited structural protection for the MOS tube.

[0005] Therefore, in view of this, the existing structure and defects are studied and improved, and a segmented packaging device for MOS tube is proposed. Summary of the Invention

[0006] The object of the present invention is to provide a segmented packaging device for a MOS transistor to solve the problems raised in the above background technology.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a segmented MOS tube packaging device, comprising a MOS tube body, an upper packaging member, and a lower packaging member, wherein the upper packaging member is provided on the top of the MOS tube body, the lower packaging member is provided on the bottom of the MOS tube body, and a pin member is inserted into the front surface of the lower packaging member, the upper packaging member comprises an upper packaging body, an upper protective cavity, an upper heat conducting member, an upper sealing groove, and a combination hole, the upper protective cavity is provided in the middle of the bottom surface of the upper packaging body, the upper heat conducting member is provided at the top end of the upper protective cavity, two sets of upper sealing grooves are provided around the upper protective cavity, and combination holes are vertically provided at the four diagonal corners of the upper packaging body.

[0008] Furthermore, a first seal and a second seal are respectively provided between the upper packaging component and the lower packaging component, and fixing nails are vertically installed at the four diagonal positions of the upper packaging component and the lower packaging component, and sealing blocks are provided on the tops of the fixing nails.

[0009] Furthermore, the lower packaging component includes a lower packaging body, a lower protective cavity, a lower heat conductive part, a lower sealing groove, a combination pile and a docking socket. The lower protective cavity is opened in the middle of the top of the lower packaging body, and the lower heat conductive part is arranged on the bottom side of the lower protective cavity, and a lower sealing groove is opened around the lower protective cavity. Combination piles are vertically arranged at the four diagonals of the top of the lower packaging body, and docking sockets are arranged equidistantly on the front surface of the lower packaging body.

[0010] Furthermore, the bottom surface structure of the upper heat conducting member matches the top surface structure of the MOS tube body, and the top surface structure of the lower heat conducting member matches the bottom surface structure of the MOS tube body.

[0011] Furthermore, the inner surface structure of the upper sealing groove matches the upper end surface structure of the first sealing member and the second sealing member, and the inner surface structure of the lower sealing groove matches the lower end surface structure of the first sealing member and the second sealing member.

[0012] Furthermore, the pin component includes a pin body, a conductive post, a sealing ring and a protective coating. A conductive post is provided at one end of the pin body close to the lower packaging component, and a sealing ring is provided on the surface of the conductive post. The surface of the pin body is covered with a protective coating.

[0013] Furthermore, the inner surface structure of the docking jack matches the surface structure of one end of the pin body provided with the conductive pile and the sealing ring.

[0014] Furthermore, the fixing nails are threadedly connected to the combination hole and the combination pile, and the sealing block is arranged on the top surface of the combination hole using an insert structure, and the bottom surface structure of the sealing block matches the top surface structure of the fixing nail.

[0015] Furthermore, the operation method is as follows: the MOS tube body is embedded in the lower protective cavity with a lower heat conducting member provided on the top thereof, and then the upper packaging body is buckled onto the top of the MOS tube body using the upper protective cavity with the upper heat conducting member provided therein. During this process, the first sealing member and the second sealing member installed in the lower sealing groove are docked and inserted into the upper sealing groove, and the assembly pile is inserted into the assembly hole, so that the upper packaging member and the lower packaging member can be respectively sandwiched and assembled on the upper and lower sides of the MOS tube body.

[0016] Then, screw the four sets of fixing nails into the combined hole and the interior of the combined pile after docking one by one, so as to combine and fix the upper packaging component and the lower packaging component. Then, insert the four sets of sealing blocks into the inner top of the combination hole one by one, so as to seal the fixing nails inside the combination hole. Finally, insert one end of the pin body of the conductive pile with a sealing ring on one end surface into the interior of the docking jack on one side of the lower packaging body, so as to quickly complete the connection and combination of the pin component and the lower packaging component.

[0017] The present invention provides a segmented packaging device for MOS tubes, which has the following beneficial effects:

[0018] 1. The present invention provides an upper packaging member and a lower packaging member on the upper and lower sides of a MOS tube body, respectively. An upper protective cavity and a lower protective cavity are respectively defined in the upper packaging body and the lower packaging body, respectively. An upper heat conducting member and a lower heat conducting member are respectively provided inside the upper and lower protective cavities, thereby limiting the MOS tube body to the center of the interior of the upper and lower packaging members. The use of this structure not only provides effective structural protection for the MOS tube body, thereby ensuring its stable operation as much as possible and ensuring good structural heat dissipation, but also cooperates with the structural pluggability between the docking hole on one side of the lower packaging body and the pin member, so that the upper packaging member, the lower packaging member, and the pin member have a segmented structural design. The use of this structure can effectively ensure good structural disassembly and assembly between the device structures, which is both flexible and practical, and can also achieve a good structural modular design between the structural members, thereby facilitating structural maintenance and minimizing production and maintenance costs.

[0019] 2. The present invention provides two sets of upper sealing grooves and two sets of lower sealing grooves on the surfaces of opposite sides of the upper and lower packaging bodies, respectively, and cooperates with the first sealing member, the second sealing member and the structure embedded therebetween, so that after the upper and lower packaging components are structurally docked and assembled, they can maintain sufficient internal structural sealing. At the same time, by screwing the fixing pins into the combined holes and the interior of the combined piles after docking, the stability and firmness of the assembly between the upper and lower packaging components can be guaranteed to the greatest extent. At the same time, a sealing block is inserted into the top of the inner top of the combined hole to provide structural sealing for the interior of the combined hole, which can not only avoid structural damage to the fixing pins due to external factors as much as possible, but also avoid the problem of moisture and liquid ingress between the combined hole and the combined pile, thereby maximizing the integrity and structural sealing protection of the device structure. In addition, the sealing rings arranged on the surface of the conductive piles can ensure that after one end of the pin body provided with the conductive pile is inserted into the interior of the docking jack, the sealing of the structural connection between the lower packaging component and the pin component can be maximized, thereby avoiding unnecessary structural damage to the connection due to moisture and liquid ingress, thereby ensuring the service life of the device structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the main body axial side structure of a segmented packaging device for a MOS tube according to the present invention;

[0021] Figure 2 This is a schematic diagram of the exploded structure of a MOS tube segmented packaging device according to the present invention;

[0022] Figure 3 This is a schematic diagram of the three-dimensional structure of an upper packaging component of a segmented packaging device for a MOS tube according to the present invention;

[0023] Figure 4 This is a schematic diagram of the three-dimensional structure of the lower packaging component of a segmented packaging device for a MOS tube according to the present invention;

[0024] Figure 5 The figure is a schematic diagram of the three-dimensional structure of the pin components of a segmented packaging device for a MOS tube according to the present invention.

[0025] In the figure: 1. MOS tube body; 2. upper packaging component; 201. upper packaging body; 202. upper protective cavity; 203. upper heat conducting member; 204. upper sealing groove; 205. combination hole; 3. lower packaging component; 301. lower packaging body; 302. lower protective cavity; 303. lower heat conducting member; 304. lower sealing groove; 305. combination pile; 306. docking jack; 4. pin component; 401. pin body; 402. conductive pile; 403. sealing ring; 404. protective coating; 5. first sealing member; 6. second sealing member; 7. fixing pin; 8. sealing block. DETAILED DESCRIPTION

[0026] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0027] like Figures 1 to 5As shown, a MOS transistor segmented packaging device includes a MOS transistor body 1, an upper packaging component 2, and a lower packaging component 3. The upper packaging component 2 is provided on the top of the MOS transistor body 1, and the lower packaging component 3 is provided on the bottom of the MOS transistor body 1. A pin component 4 is inserted into the front surface of the lower packaging component 3. The upper packaging component 2 includes an upper packaging body 201, an upper protective cavity 202, an upper heat conducting member 203, an upper sealing groove 204, and a combination hole 205. The upper protective cavity 202 is opened in the middle of the bottom surface of the upper packaging body 201. The top of the upper protective cavity 202 is provided with an upper heat conducting member 203, and two sets of upper sealing grooves 204 are opened around the upper protective cavity 202. The four diagonal points of the upper package body 201 are vertically provided with combination holes 205. The lower package component 3 includes a lower package body 301, a lower protective cavity 302, a lower heat conducting member 303, a lower sealing groove 304, a combination pile 305 and a docking jack 306. The lower package body 301 is provided with a lower protective cavity 302 in the middle of the top of the lower package body 301, and the inner bottom side of the lower protective cavity 302 is provided with a combination hole 205. There is a lower heat conducting member 303, and a lower sealing groove 304 is opened around the lower protective cavity 302. Combination piles 305 are vertically set at the four diagonal positions on the top of the lower package body 301, and docking sockets 306 are evenly arranged on the front surface of the lower package body 301. The bottom surface structure of the upper heat conducting member 203 matches the top surface structure of the MOS tube body 1, and the top surface structure of the lower heat conducting member 303 matches the bottom surface structure of the MOS tube body 1. The inner surface structure of the upper sealing groove 204 matches the first sealing member. 5. The upper surface structures of the second sealing member 6 match each other, and the inner surface structure of the lower sealing groove 304 matches the lower surface structures of the first sealing member 5 and the second sealing member 6. An upper protective cavity 202 and a lower protective cavity 302 are respectively opened in the upper packaging body 201 and the lower packaging body 301, and an upper heat conducting member 203 and a lower heat conducting member 303 are respectively provided inside the upper protective cavity 202 and the lower protective cavity 302, thereby limiting the MOS tube body 1 to the middle of the interior of the upper packaging member 2 and the lower packaging member 3.

[0028] like Figures 1 to 5As shown, a first seal 5 and a second seal 6 are respectively provided between the upper packaging component 2 and the lower packaging component 3, and fixing nails 7 are vertically installed at the four diagonal positions of the upper packaging component 2 and the lower packaging component 3, and a sealing block 8 is provided on the top of the fixing nail 7. The pin member 4 includes a pin body 401, a conductive pile 402, a sealing ring 403 and a protective coating 404. The conductive pile 402 is provided at one end of the pin body 401 close to the lower packaging component 3, and the surface of the conductive pile 402 is provided with a sealing ring 403. The surface of the pin body 401 is covered with a protective coating 404. The inner surface structure of the docking jack 306 is the same as that of the pin body 401 with the conductive pile 402 and the sealing ring 403. 3, the surface structures of one end of the pin body 401 match each other, the fixing pins 7 are threadedly connected to the combination hole 205 and the combination pile 305, and the sealing block 8 is arranged on the top surface of the combination hole 205 using an insertion structure, and the bottom surface structure of the sealing block 8 matches the top surface structure of the fixing pin 7. By respectively opening two groups of upper sealing grooves 204 and two groups of lower sealing grooves 304 on the opposite side surfaces of the upper packaging body 201 and the lower packaging body 301, and cooperating with the first sealing member 5 and the second sealing member 6 to be embedded in the structure therebetween, the upper packaging member 2 and the lower packaging member 3 can maintain sufficient internal structural sealing after the structural docking and assembly.

[0029] In summary, if Figures 1 to 5 As shown, when using the MOS tube segmented packaging device, the MOS tube body 1 is first embedded in the lower protective cavity 302 with the lower heat conducting member 303 provided on the top. Then, the upper packaging body 201 is fastened to the top of the MOS tube body 1 using the upper protective cavity 202 with the upper heat conducting member 203 provided therein. During this process, the first sealing member 5 and the second sealing member 6 installed in the lower sealing groove 304 are docked and inserted into the upper sealing groove 204, and the assembly pile 305 is inserted into the assembly hole 205. In this way, the upper packaging member 2 and the lower packaging member 3 can be respectively sandwiched and assembled on the upper and lower sides of the MOS tube body 1.

[0030] Afterwards, the four groups of fixing nails 7 are screwed one by one into the combined hole 205 and the combined pile 305 after docking, so as to combine and fix the upper packaging component 2 and the lower packaging component 3, and then the four groups of sealing blocks 8 are inserted one by one into the inner top of the combination hole 205 to seal the fixing nails 7 with the interior of the combination hole 205. Finally, one end of the pin body 401 of the conductive pile 402 with a sealing ring 403 on one end surface is inserted into the docking socket 306 on one side of the lower packaging body 301, so as to quickly complete the connection and combination of the pin component 4 and the lower packaging component 3, and then complete the combination of the entire device structure.

[0031] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. A MOS tube segmented packaging device, comprising a MOS tube body (1), an upper packaging component (2) and a lower packaging component (3), characterized in that: An upper packaging component (2) is provided on the top of the MOS tube body (1), the lower packaging component (3) is provided on the bottom of the MOS tube body (1), and a pin component (4) is inserted on the front side surface of the lower packaging component (3), the upper packaging component (2) comprises an upper packaging body (201), an upper protective cavity (202), an upper heat conducting member (203), an upper sealing groove (204) and a combination hole (205), an upper protective cavity (202) is provided in the middle of the bottom surface of the upper packaging body (201), an upper heat conducting member (203) is provided at the top end of the upper protective cavity (202), and two groups of upper sealing grooves (204) are provided around the upper protective cavity (202), and combination holes (205) are vertically provided at four diagonal positions of the upper packaging body (201).

2. The MOS tube segmented packaging device according to claim 1, characterized in that: A first sealing member (5) and a second sealing member (6) are respectively provided between the upper packaging member (2) and the lower packaging member (3), and fixing nails (7) are vertically installed at the four diagonal positions of the upper packaging member (2) and the lower packaging member (3), and a sealing block (8) is provided on the top of the fixing nail (7).

3. The MOS tube segmented packaging device according to claim 2, characterized in that: The lower packaging component (3) comprises a lower packaging body (301), a lower protective cavity (302), a lower heat conducting member (303), a lower sealing groove (304), a combination pile (305) and a docking jack (306); a lower protective cavity (302) is provided in the middle of the top of the lower packaging body (301), a lower heat conducting member (303) is provided on the inner bottom side of the lower protective cavity (302), and a lower sealing groove (304) is provided around the lower protective cavity (302); combination piles (305) are vertically provided at four diagonal positions on the top of the lower packaging body (301), and docking jacks (306) are equidistantly arranged on the front surface of the lower packaging body (301).

4. The MOS tube segmented packaging device according to claim 3, characterized in that: The bottom surface structure of the upper heat conducting member (203) matches the top surface structure of the MOS tube body (1), and the top surface structure of the lower heat conducting member (303) matches the bottom surface structure of the MOS tube body (1).

5. The MOS tube segmented packaging device according to claim 4, characterized in that: The inner surface structure of the upper sealing groove (204) matches the upper end surface structure of the first sealing member (5) and the second sealing member (6), and the inner surface structure of the lower sealing groove (304) matches the lower end surface structure of the first sealing member (5) and the second sealing member (6).

6. The MOS tube segmented packaging device according to claim 5, characterized in that: The pin component (4) comprises a pin body (401), a conductive post (402), a sealing ring (403) and a protective coating (404); the conductive post (402) is provided at one end of the pin body (401) close to the lower packaging component (3); the sealing ring (403) is provided on the surface of the conductive post (402); and the surface of the pin body (401) is covered with the protective coating (404).

7. The MOS tube segmented packaging device according to claim 6, characterized in that: The inner surface structure of the docking jack (306) matches the surface structure of one end of the pin body (401) provided with the conductive pile (402) and the sealing ring (403).

8. The MOS tube segmented packaging device according to claim 7, characterized in that: The fixing nails (7) are all threadedly connected to the combination hole (205) and the combination pile (305), and the sealing block (8) is arranged on the top surface of the combination hole (205) in an inserting structure, and the bottom surface structure of the sealing block (8) matches the top surface structure of the fixing nail (7).

9. The MOS tube segmented packaging device according to claim 8, characterized in that: The operation method is as follows: the MOS tube body (1) is embedded in the lower protection cavity (302) with a lower heat conducting member (303) provided at the top thereof, and then the upper packaging body (201) is buckled on the top of the MOS tube body (1) by using the upper protection cavity (202) with the upper heat conducting member (203) provided therein. During this process, the first sealing member (5) and the second sealing member (6) installed in the lower sealing groove (304) are docked and inserted into the upper sealing groove (204), and at the same time, the combination pile (305) is inserted into the combination hole (205), so that the upper packaging component (2) and the lower packaging component (3) can be respectively sandwiched and assembled on the upper and lower sides of the MOS tube body (1); Then, the four groups of fixing nails (7) are screwed into the interior of the combined hole (205) and the combined pile (305) after docking, thereby combining and fixing the upper packaging component (2) and the lower packaging component (3). Then, the four groups of sealing blocks (8) are inserted into the top end of the inner part of the combined hole (205), thereby sealing the fixing nails (7) in the interior of the combined hole (205). Finally, one end of the pin body (401) of the conductive pile (402) with a sealing ring (403) on one end surface is inserted into the interior of the docking socket (306) on one side of the lower packaging body (301), thereby quickly completing the connection and combination of the pin component (4) and the lower packaging component (3).

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