Chip packaging assembly
The combined structure of the packaging substrate, packaging shell, heat-dissipating shell and phase change energy storage material solves the problems of chip heat accumulation and uneven heat dissipation, achieves effective heat dissipation and thermal uniformity in a limited space, and improves the reliability of the chip.
Patent Information
- Application Number
- CN202510865130.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-09-26
AI Technical Summary
As chip integration increases, heat accumulation and uneven heat dissipation cause local chip temperatures to be too high. Differences in material thermal expansion coefficients generate thermomechanical stress, reducing reliability. Existing technologies require heat sinks or radiators that occupy external space, making system design difficult.
The combined structure of a packaging substrate, a packaging shell, a heat-saturating shell and a phase-change energy storage material is adopted. Heat is diffused through the heat-saturating shell, and the phase-change energy storage material absorbs and releases heat, avoiding heat accumulation and achieving effective heat dissipation without the need for an external radiator.
Effectively dissipate heat in a limited space, avoid excessive chip temperature, improve thermal uniformity, reduce thermal mechanical stress, and save external space of the package component.
Smart Images
Figure CN120709236A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip technology, and in particular to a chip packaging assembly. Background Art
[0002] As chip manufacturing processes evolve, chip integration becomes increasingly dense, generating greater power and heat flux. This can lead to heat accumulation and uneven heat dissipation within the chip, resulting in localized overheating. Furthermore, because chip packaging components are made of varying materials and have varying coefficients of thermal expansion, these materials deform differently at high temperatures, generating thermomechanical stresses that reduce chip reliability.
[0003] Therefore, improving the heat dissipation capacity of chip packaging components and improving the thermal uniformity of chip packaging components will become an increasingly urgent need in the development of semiconductor technology.
[0004] In the prior art, in order to achieve a better heat dissipation effect of the chip, a heat sink or radiator is generally provided outside the chip package assembly. In this way, the heat sink or radiator needs to occupy space outside the chip package assembly. Summary of the Invention
[0005] The present application provides a chip packaging assembly, which is used to avoid the space outside the chip packaging assembly being occupied while effectively dissipating heat for the chip.
[0006] To achieve the above objectives, the present application provides a chip packaging assembly comprising a packaging substrate, a packaging shell, a heat-saturating shell, and a phase-change energy storage material, wherein the packaging substrate has a carrying surface for carrying the chip. The packaging shell has an open end. The open end is connected to the packaging substrate, and the packaging shell and the carrying surface enclose a closed first cavity, in which the chip is located. The heat-saturating shell is disposed on a side of the packaging shell away from the packaging substrate, and the heat-saturating shell has a second cavity. The phase-change energy storage material is accommodated in the second cavity.
[0007] When the above technical solution is adopted, when the chip is working, the chip will generate heat. The heat generated by the chip can be transferred to the packaging shell, and the heat of the packaging shell can be transferred to the heat-saturating shell.
[0008] On the one hand, after absorbing heat, the heat can be diffused along the heat soaking shell. The heat soaking shell is in contact with the external environment, and the heat soaking shell can exchange heat with the external environment, transferring the heat from the heat soaking shell to the external environment, thereby reducing the temperature of the heat soaking shell. Furthermore, heat accumulation in the packaging shell and chip is prevented, thereby reducing the temperature of the packaging shell and chip.
[0009] On the other hand, when heat is transferred to the heat soaking shell, the phase-change energy storage material contained in the second cavity absorbs the heat from the heat soaking shell. After absorbing a certain amount of heat, the phase-change energy storage material undergoes a phase change, causing the temperature of the heat soaking shell to drop. When the chip stops working or consumes less power, the chip temperature is low, and the phase-change energy storage material releases heat, undergoing a reverse phase change and returning to a state where it can absorb heat.
[0010] The phase-change energy storage material arranged in the second cavity can absorb the heat of the heat-saturating shell and undergo phase change, so as to absorb the heat generated by the storage chip when the chip is working. This can reduce the heat dissipation load of the heat-saturating shell at the peak power consumption of the chip, reduce the temperature of the heat-saturating shell, and further ensure that the temperature of the chip is within a certain range.
[0011] In this application, the arrangement of the heat-saturating shell and phase-change energy storage material can simultaneously store heat while dissipating heat, absorbing the heat generated by the chip to prevent the chip from overheating. The chip packaging assembly effectively dissipates heat from the chip through the heat-saturating shell and phase-change energy storage material it includes. The chip packaging assembly itself can play a role in preventing the chip from overheating, eliminating the need for additional heat sinks or radiators outside the chip packaging assembly. This saves space outside the chip packaging assembly, allows heat dissipation of the chip in a limited space, and avoids occupying space outside the chip packaging assembly.
[0012] In one possible implementation, a third cavity is further disposed within the heat-saturating housing, the third cavity being disposed outside the second cavity. The chip package assembly further includes a capillary structure component and a gas-liquid phase change material, the capillary structure component being disposed within the third cavity. The gas-liquid phase change material is contained within the third cavity, and the capillary structure component is configured to provide a capillary force for the gas-liquid phase change material to reflow.
[0013] When the above technical solution is adopted, the capillary structure component can provide capillary force for the reflux of the gas-liquid phase change material, which helps to improve the thermal conductivity of the heat-equalizing shell, makes the heat transfer more efficient, and greatly improves the heat diffusion speed of the chip.
[0014] In one possible implementation, the capillary structure component is a plate-shaped structure. The capillary structure component has two first surfaces and two second surfaces disposed opposite each other, wherein the area of the first surface is larger than the area of the second surface. The first surface is disposed on the cavity wall of the third cavity, or the second surface is disposed on the cavity wall of the third cavity.
[0015] When the above technical solution is adopted, the first surface or the second surface is arranged on the cavity wall of the third cavity, which enriches the arrangement of the capillary structure components and facilitates selection and arrangement according to actual conditions.
[0016] In a possible implementation, when the second surface is disposed on the cavity wall of the third cavity, a multi-layer capillary structure component is disposed in the third cavity, and the multi-layer capillary structure component is arranged along a direction from the packaging substrate to the heat-saturating housing.
[0017] When the above technical solution is adopted, a greater capillary force can be provided for the gas-liquid phase change material, the thermal conductivity of the heat-equalizing shell is improved, and the heat generated by the chip can be better diffused.
[0018] In a possible implementation, capillary structure components are continuously arranged on the flow path of the gas-liquid phase change material.
[0019] In this way, capillary structure components are provided on the reciprocating flow path of the gas-liquid phase change material. The capillary structure components can provide reflux capillary force for the gas-liquid phase change material, improve heat conduction efficiency, and better diffuse the heat generated by the chip.
[0020] In a possible implementation, the chip packaging assembly further includes heat dissipation teeth disposed on a side of the heat-spreading housing away from the packaging substrate.
[0021] When using this technical solution, under natural heat dissipation conditions, the heat exchange area between the chip package and the external environment is increased, improving heat dissipation efficiency. Under forced air cooling conditions, the increased convection heat exchange area between the chip package and the air also enhances heat dissipation through turbulence, further improving heat dissipation efficiency and reducing the thermal resistance of the chip package.
[0022] In a possible implementation, there are multiple heat dissipation teeth, and the multiple heat dissipation teeth are arranged in an array on the heat-dissipating shell.
[0023] The above technical solution increases the area for convective heat exchange between the chip package and the air. Furthermore, the heat dissipation teeth create turbulent airflow, enhancing heat dissipation and increasing the convective heat transfer coefficient between the chip package and the air, improving heat exchange between the chip package and the air.
[0024] In a possible implementation, the heat dissipation teeth, the packaging shell, and the heat-dissipating shell are integrally formed.
[0025] When the above technical solution is adopted, on the one hand, during actual installation, there is no need to position and match the heat dissipation teeth, the packaging shell and the heat-saturating shell, which can improve the production efficiency of the chip packaging assembly.
[0026] Furthermore, the heat sink, encapsulating housing, and heat spreader are integrally formed, eliminating the need for additional components to connect them. There is also no need for a thermal interface layer between the heat sink and heat spreader, or between the encapsulating housing and heat spreader, to reduce contact thermal resistance.
[0027] In a possible implementation, the gas-liquid phase change material is one of water, methanol, acetone, ammonia, or mercury.
[0028] When the above technical solution is adopted, the types of gas-liquid phase change materials are diversified, which is convenient for selection and setting according to actual conditions.
[0029] In a possible implementation, the capillary structure component is a micro-channel type, a sintered powder type, or a sintered wire mesh type.
[0030] When the above technical solution is adopted, the diversity of the capillary structure components is enriched, making it easier to select and set them according to actual conditions.
[0031] In a possible implementation, the heat soaking shell is made of one of gold, copper, copper alloy, titanium, titanium alloy, or stainless steel.
[0032] When the above technical solution is adopted, the material types of the heat-saturating shell are enriched, making it easier to select and set according to actual conditions. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] Figure 1 This is a schematic diagram of the positional relationship between a chip packaging assembly and a chip in an example provided in an embodiment of the present application.
[0034] Figure 2 A schematic diagram of the positional relationship between a chip packaging assembly and a chip in another example provided in an embodiment of the present application.
[0035] Figure 3 Schematic diagram of the heat-sparing shell provided in the embodiment of the present application Figure 1 .
[0036] Figure 4 Schematic diagram of the heat-sparing shell provided in the embodiment of the present application Figure 2 .
[0037] Figure 5 Schematic diagram of the heat-sparing shell provided in the embodiment of the present application Figure 3 .
[0038] Description of reference numerals:
[0039] 1- packaging substrate, 2- packaging shell, 21- first cavity, 3- heat-saturating shell, 31- second cavity, 32- third cavity,
[0040] 33-inner shell, 34-outer shell, 4-phase change energy storage material, 5-capillary structure component, 6-heat dissipation teeth,
[0041] 10- chip, 11- silicon wafer, 12- conductor. DETAILED DESCRIPTION
[0042] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification, claims and drawings of this application are intended to cover non-exclusive inclusions.
[0044] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it necessarily refer to independent or alternative embodiments that are mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0045] The directional words appearing in the following description are all directions shown in the drawings and do not limit the specific structure of this application. For example, in the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., which indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting this application.
[0046] In addition, the terms "first", "second", etc. in the description and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order, and may explicitly or implicitly include one or more such features.
[0047] In the description of this application, unless otherwise specified, "plurality" means more than two (including two), and similarly, "multiple groups" means more than two (including two).
[0048] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, the "connection" or "connection" of a mechanical structure can refer to a physical connection. For example, the physical connection can be a fixed connection, such as a fixed connection through a connector, such as a screw, bolt, or other connector; the physical connection can also be a detachable connection, such as a mutual snap-fit connection or a snap-fit connection; the physical connection can also be an integral connection, such as a connection formed by welding, bonding, or integral molding. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0049] Chip packaging is the process of sealing the chip with a specific packaging component and electrically connecting the chip to the external system, which plays a role in fixing, sealing and protecting the chip.
[0050] As chip manufacturing processes evolve, chip integration becomes increasingly dense, generating greater power and heat flux. This can lead to heat accumulation and uneven heat dissipation within the chip, resulting in localized overheating. Furthermore, because chip packaging components are made of varying materials and have varying coefficients of thermal expansion, these materials deform differently at high temperatures, generating thermomechanical stresses that reduce chip reliability.
[0051] Therefore, improving the heat dissipation capacity of chip packaging components and improving the thermal uniformity of chip packaging components will become an increasingly urgent need in the development of semiconductor technology.
[0052] In the prior art, in order to achieve a better heat dissipation effect of the chip, a heat sink or radiator is generally installed outside the chip package assembly using bolts, and the heat on the chip package assembly is dissipated through the heat sink or radiator.
[0053] Thus, the heat sink or radiator needs to occupy space outside the chip package assembly, which brings certain difficulties to system design as electronic systems become increasingly compact.
[0054] In order to solve the technical problems existing in the above-mentioned prior art, see Figure 1 and Figure 2 As shown, an embodiment of the present application provides a chip package assembly, including a package substrate 1, a package housing 2, a heat-saturating housing 3, and a phase-change energy storage material 4. The package substrate 1 has a carrying surface for carrying a chip 10. The package substrate 1 provides mechanical support, protects the carrier chip 10, and provides electrical connections, signal transmission, and heat dissipation.
[0055] In actual situations, a packaging frame can also be used to carry the chip 10. In this way, the weight of the chip packaging assembly can be reduced. In specific implementation, the actual situation shall prevail and no specific limitation is given here.
[0056] The package substrate 1 is a physical structure for supporting and fixing the chip 10, and is generally made of epoxy resin and metal. The package frame is generally made of metal. Of course, this is only an example and is not intended to be a specific limitation.
[0057] The package shell 2 has an open end. In addition, the package shell 2 also has a closed end opposite to the open end, so that the package shell 2 forms a cavity with one end open. The chip 10 is located in the cavity of the package shell 2 .
[0058] In a specific implementation, the packaging shell 2 can be a hollow rectangular parallelepiped structure, a hollow cylindrical structure, or a hollow polygonal column structure, etc., which is not specifically limited here.
[0059] Accordingly, the structure of the cavity of the packaging shell 2 can be a rectangular parallelepiped structure, a cylindrical structure, or a polygonal column structure, etc. Of course, the present invention is not limited thereto.
[0060] In addition, it should be pointed out that the structure of the cavity of the packaging shell 2 may be consistent with the structure of the packaging shell 2 , or may be different.
[0061] In actual situations, the open end is closer to the packaging substrate 1 than the closed end, and the direction from the open end to the closed end is consistent with the direction from the packaging substrate 1 to the packaging shell 2 .
[0062] The open end is connected to the package substrate 1, and the package shell 2 and the carrying surface enclose a first cavity 21. The carrying surface and the cavity wall of the package shell 2 together enclose a closed first cavity 21.
[0063] The open end of the packaging shell 2 is arranged toward the packaging substrate 1 , and the open end is connected to the packaging substrate 1 , so that a first cavity 21 is formed between the packaging substrate 1 and the packaging shell 2 .
[0064] The connection method between the packaging shell 2 and the packaging substrate 1 is not specifically limited here. For example, the connection method between the packaging shell 2 and the packaging substrate 1 can be bonding, welding, etc., of course, it is not limited thereto.
[0065] The chip 10 is located in the first cavity 21, and the chip 10 is actually installed on the packaging substrate 1. The packaging shell 2 and the packaging substrate 1 can accommodate the chip 10, provide a stable space for the chip 10, and ensure that the chip 10 can work normally without external interference. At the same time, the packaging substrate 1 can provide positioning and support for the chip 10 to prevent the chip 10 from being displaced or damaged during operation. The packaging shell 2 can also withstand a certain amount of external pressure to protect the chip 10 from damage. In addition, the packaging shell 2 and the packaging substrate 1 have a protective and protective function, which can prevent external moisture, dust, dirt and other impurities from entering the first cavity 21, thereby preventing the chip 10 installed inside the first cavity 21 from being corroded or damaged.
[0066] For specific implementation, see Figure 1 and Figure 2 As shown, the chip 10 includes a silicon chip 11 and a conductor 12 , and the conductor 12 electrically connects the silicon chip 11 to the package substrate 1 .
[0067] The number of chips 10 disposed in the first cavity 21 may be one, two, three or more, which is not specifically limited herein. When there are multiple chips 10, the multiple chips 10 may be arranged in an array.
[0068] The side of the silicon wafer 11 close to the closed end may be in close contact with the closed end, or may have a gap therebetween, depending on the actual situation.
[0069] like Figure 1 and Figure 2 As shown, the heat-saturating housing 3 is arranged on the side of the packaging housing 2 away from the packaging substrate 1. Figures 3 to 5 The heat-sparing shell 3 has a second cavity 31 . The phase-change energy storage material 4 is accommodated in the second cavity 31 .
[0070] The heat-saturating shell 3 is a structure used to improve heat distribution uniformity and is widely used in electronic cooling, industrial heating, energy systems, aerospace, and other fields. The main function of the heat-saturating shell 3 is to quickly diffuse heat, reduce temperature gradients, reduce thermal stress concentration, and achieve uniform temperature distribution.
[0071] In the embodiment provided herein, when chip 10 is operating, it generates heat, which can be transferred to package housing 2. Heat-scaling housing 3 is disposed on the side of package housing 2 away from package substrate 1, and heat from package housing 2 can be transferred to heat-scaling housing 3. Heat-scaling housing 3 can diffuse the absorbed heat away from package substrate 1, thereby ensuring a uniform temperature distribution within heat-scaling housing 3.
[0072] The heat-saturating shell 3 is connected to the packaging shell 2. The connection between the heat-saturating shell 3 and the packaging shell 2 can be welding, bonding, etc. Of course, this is just an example and is not a specific limitation.
[0073] The heat-saturating shell 3 may be a rectangular parallelepiped structure, a cylindrical structure, or a polygonal prism structure, etc., but is not limited thereto. The structure of the heat-saturating shell 3 may be the same as that of the packaging shell 2 .
[0074] Accordingly, the structure of the second cavity 31 can be a rectangular parallelepiped structure, a cylindrical structure, a polygonal column structure, or the like.
[0075] The structure of the second cavity 31 may be consistent with that of the heat-equalizing shell 3 , or may be different.
[0076] The chip packaging assembly provided in the embodiment of the present application further includes a phase change energy storage material 4 (PCM for short), which is disposed in the second cavity 31 .
[0077] Phase change energy storage materials 4 have the ability to change their physical state within a certain temperature range. Phase change energy storage materials 4 can be divided into organic and inorganic phase change energy storage materials. They can also be divided into hydrated salt phase change energy storage materials and paraffin wax phase change energy storage materials.
[0078] The phase change energy storage material 4 can be a solid-liquid phase change energy storage material or a gas-liquid phase change energy storage material.
[0079] Take the phase change energy storage material 4 as a solid-liquid phase change energy storage material as an example. Initially, the phase change energy storage material 4 is in a solid state. When the chip 10 generates heat during operation, the heat will be conducted to the side of the packaging shell 2 close to the heat-equalizing shell 3, and further conducted to the side of the heat-equalizing shell 3 close to the packaging shell 2, and then conducted to the phase change energy storage material 4. As the heat generated by the chip 10 increases, the heat absorbed by the phase change energy storage material 4 increases and the temperature rises. When the phase change energy storage material 4 is heated to the melting temperature, the phase change energy storage material 4 will undergo a phase change from solid to liquid. During the melting process, the phase change energy storage material 4 absorbs and stores heat.
[0080] When the chip stops working or consumes low power, the amount of heat transferred to the phase-change energy storage material 4 through the packaging shell 2 and the heat-saturating shell 3 decreases, causing the temperature of the phase-change energy storage material 4 to drop, and the phase-change energy storage material 4 to cool. As the phase-change energy storage material 4 cools, the latent heat absorbed and stored in the phase-change energy storage material 4 is dissipated within a certain temperature range, undergoing a reverse phase transition from liquid to solid.
[0081] In the embodiment provided in the present application, the phase change energy storage material 4 may be paraffin, acetic acid, etc., and the specific material of the phase change energy storage material 4 is not specifically limited here.
[0082] The chip packaging assembly provided in the embodiment of the present application is used to package the chip. When the chip 10 is working, the chip 10 generates heat. The heat generated by the chip can be conducted to the packaging shell 2 , and the heat of the packaging shell 2 can be conducted to the heat-spreading shell 3 .
[0083] On the one hand, after absorbing heat, the heat can be diffused along the heat soaking shell 3. The heat soaking shell 3 is in contact with the external environment, and the heat soaking shell 3 can exchange heat with the external environment, transferring the heat from the heat soaking shell 3 to the external environment to reduce the temperature of the heat soaking shell 3. Furthermore, heat is prevented from accumulating in the packaging shell 2 and the chip, thereby reducing the temperature of the packaging shell 2 and the chip.
[0084] On the other hand, when the heat generated by the chip 10 is transferred to the heat-saturating housing 3, the phase-change energy storage material 4 contained in the second cavity 31 absorbs the heat from the heat-saturating housing 3. After absorbing a certain amount of heat, the phase-change energy storage material 4 undergoes a phase change, causing the temperature of the heat-saturating housing 3 to drop. When the chip 10 stops working or the power consumption is low, the chip 10 temperature is low, and the phase-change energy storage material 4 no longer absorbs heat. Instead, it releases heat, undergoes a reverse phase change, and returns to a state where it can absorb heat.
[0085] The phase change energy storage material 4 arranged in the second cavity 31 can absorb the heat of the heat-equalizing shell 3 and undergo phase change, so as to absorb the heat generated by the storage chip when the chip is working. It can reduce the heat dissipation load of the heat-equalizing shell 3 at the peak power consumption of the chip, reduce the temperature of the heat-equalizing shell 3, and further ensure that the temperature of the chip is within a certain range.
[0086] In the present application, the heat-equalizing shell 3 can diffuse the absorbed heat in a direction away from the packaging substrate 1, so that the temperature distribution of the heat-equalizing shell 3 is uniform, and the phase-change energy storage material 4 can absorb and store heat. The setting of the heat-equalizing shell 3 and the phase-change energy storage material 4 can store heat while equalizing heat, and absorb the heat generated by the chip to avoid the temperature of the chip being too high. The chip packaging assembly achieves effective heat dissipation of the chip through the heat-equalizing shell 3 and the phase-change energy storage material 4 it includes. The chip packaging assembly itself can play a role in preventing the chip temperature from being too high. There is no need to set up an additional heat sink or radiator outside the chip packaging assembly, which saves space outside the chip packaging assembly and can achieve heat dissipation of the chip in a limited space, avoiding the space outside the chip packaging assembly being occupied.
[0087] In one possible implementation, see Figure 4 and Figure 5 As shown, a third cavity 32 is further provided in the heat-sparing shell 3 , and the third cavity 32 is arranged outside the second cavity 31 .
[0088] When implementing it specifically, Figure 1 、 Figure 4 and Figure 5 As shown, the heat-sparging shell 3 may include an inner shell 33 and an outer shell 34 .
[0089] In one example, the outer shell 34 may be disposed outside the inner shell 33. The inner wall of the inner shell 33 forms the second cavity 31, and the inner wall of the outer shell 34 and the outer wall of the inner shell 33 form the third cavity 32.
[0090] Of course, in actual situations, in this example, a support structure may be connected between the inner shell 33 and the outer shell 34 to connect the inner shell 33 and the outer shell 34. At the same time, the support structure supports the inner shell 33 to prevent the inner shell 33 from being suspended in the air.
[0091] In a specific implementation, the support structure may be a support column, one end of which may be connected to the outer wall of the inner shell 33 , and the other end of which may be connected to the inner wall of the outer shell 34 .
[0092] In another example, the inner shell 33 may be a structure with openings at both ends in the first direction (not shown).
[0093] The first direction is perpendicular to the direction from the open end to the closed end of the packaging shell 2. Figure 1 、 Figure 3 and Figure 5 As shown, the second direction is also perpendicular to the direction from the open end to the closed end of the packaging shell 2. In the embodiment provided in this application, the first direction, the second direction and the direction from the open end to the closed end are perpendicular to each other.
[0094] It should be noted that, in the embodiments provided in the present application, the first direction and the second direction are only used to facilitate the representation of the positional relationship between the components included in the chip packaging assembly, and are not specific limitations of the present application.
[0095] When the inner shell 33 is a structure with both ends in the first direction opened, both ends of the inner shell 33 along the first direction are respectively connected to both inner walls of the outer shell 34 along the first direction.
[0096] The inner wall of the inner shell 33 and the two ends of the outer shell 34 along the first direction form a second cavity 31 , and the inner wall of the outer shell 34 and the outer wall of the inner shell 33 form a third cavity 32 .
[0097] Furthermore, the chip package assembly provided by the present application further includes a capillary structure component 5 and a gas-liquid phase change material, wherein the capillary structure component 5 is disposed in the third cavity 32. The gas-liquid phase change material is contained in the third cavity 32, and the capillary structure component 5 is used to provide a capillary force for the gas-liquid phase change material to flow back.
[0098] It should be noted that a capillary structure component refers to a material structure with tiny pores or channels. Its typical characteristic is that the pore size is small enough (usually at the micrometer or nanometer level) to spontaneously guide liquid penetration or rise through capillary action (capillary phenomenon). This phenomenon is due to the interaction between liquid surface tension, solid surface energy, and pore size. The capillary structure component 5 can guide the flow of gas-liquid phase change materials.
[0099] For ease of explanation, the side of the third cavity 32 close to the heat source, ie, the chip 10 , may be referred to as an evaporation section, and the side away from the package substrate 1 may be referred to as a condensation section because its temperature is lower than that of the evaporation section.
[0100] Initially, the gas-liquid phase change material is in liquid state and is initially located in the evaporation section.
[0101] In practice, when chip 10 generates heat during operation, the heat is transferred to the side of the package housing 2 near the heat-saturating housing 3, further to the side of the heat-saturating housing 3 near the package housing 2, and finally to the gas-liquid phase-change material. The gas-liquid phase-change material absorbs heat energy. As the heat generated by chip 10 increases, the gas-liquid phase-change material absorbs more heat, its temperature rises, and its volume expands rapidly.
[0102] As the temperature of the gas-liquid phase change material increases, part of the liquid gas-liquid phase change material is vaporized. The vaporized gas-liquid phase change material can diffuse along the capillary structure component 5 away from the heat source, namely the chip 10, and flow to the condensation section.
[0103] The condensation section is at a lower temperature, allowing the gas-liquid phase change material to release heat and condense into liquid form. The liquid gas-liquid phase change material then flows back to the evaporation section, driven by the capillary force provided by the capillary structure 5. This cycle completes the phase transition between the gas and liquid phases of the gas-liquid phase change material.
[0104] The capillary structure component 5 can provide capillary force for the gas-liquid phase change material to reflux, which helps to improve the thermal conductivity of the heat-equalizing shell 3, making the heat transfer more efficient and greatly improving the heat diffusion speed of the chip.
[0105] In a specific implementation, the capillary structure component 5 may occupy the entire space of the third cavity 32 , but this is not limited thereto.
[0106] As an example, Figure 4 and Figure 5As shown, the capillary structure component 5 is a plate-like structure having two first surfaces and two second surfaces arranged opposite to each other, wherein the area of the first surface is larger than the area of the second surface. The first surface is arranged on the wall of the third cavity, as shown in FIG. Figure 4 Alternatively, the second surface is provided on the wall of the third cavity 32, as shown in FIG. Figure 5 shown.
[0107] In specific implementation, the first surface with a larger area can be selected to be set on the cavity wall of the third cavity 32, or the second surface with a smaller area can be selected to be set on the cavity wall of the third cavity 32. In this way, the arrangement of the capillary structure component 5 is enriched, so that it is easy to select and arrange according to actual conditions.
[0108] In a specific implementation, the capillary structure component 5 may be a plate-like structure, wherein the first surface may be parallel to the first direction and the second direction, and the second surface may be perpendicular to the second direction.
[0109] When the first surface is disposed on the wall of the third cavity 32 , the contact area between the capillary structure component 5 and the wall of the third cavity 32 is larger, which can improve the stability of the capillary structure component 5 disposed in the third cavity 32 .
[0110] When the second surface is arranged on the wall of the third cavity 32, the capillary structure component 5 is arranged on the wall of the third cavity 32. Both second surfaces can be connected to the inner wall of the outer shell 34, such as Figure 5 Of course, among the two second surfaces, one of the second surfaces can be connected to the inner wall of the outer shell 34, and the other second surface can be connected to the outer wall of the inner shell 33. This is just an example and is not intended to be a specific limitation.
[0111] In some embodiments, combined Figure 1 、 Figure 2 and Figure 5 As shown, when the second surface is provided on the cavity wall of the third cavity, a multi-layer capillary structure component 5 is provided in the third cavity 32 , and the multi-layer capillary structure component 5 is arranged along the direction from the packaging substrate 1 to the heat-saturating housing 3 .
[0112] In a specific implementation, the number of layers of the capillary structure component 5 can be two layers, three layers, four layers or more layers, which is not specifically limited here.
[0113] When the capillary structure component 5 is multi-layered, it can provide a greater capillary force for the gas-liquid phase change material, improve the thermal conductivity of the heat-averaging shell 3, and better diffuse the heat generated by the chip.
[0114] It should be noted that when multiple layers of capillary structure components 5 are provided in the third cavity 32, at least one layer of capillary structure component 5 is located in the evaporation section, and at least one layer of capillary structure component 5 is located in the condensation section, so as to better provide capillary force for reflux of the gas-liquid phase change material and guide the circulation of the gas-liquid phase change material.
[0115] Furthermore, the capillary structure components 5 are continuously arranged on the flow path of the gas-liquid phase change material, such as Figure 4 shown.
[0116] In this way, capillary structure components 5 are provided on the path where the gas-liquid phase change material flows back and forth from the evaporation section to the condensation section. The capillary structure components 5 can provide reflux capillary force for the gas-liquid phase change material, improve heat conduction efficiency, and better diffuse the heat generated by the chip.
[0117] In the examples provided in this application, Figure 4 As shown, the first surface is provided on the wall of the third cavity 32. Each wall of the third cavity is covered with a capillary structure component 5, and the capillary structure components 5 provided on adjacent walls are connected, so that the capillary structure components 5 are continuously provided along the flow path of the gas-liquid phase change material. In this case, the capillary structure components 5 are provided on the outer wall of the inner shell 33 and the inner wall of the outer shell 34.
[0118] As an alternative, see Figure 2 The chip packaging assembly provided in the embodiment of the present application further includes heat dissipation teeth 6 , which are arranged on a side of the heat-saturating housing 3 away from the packaging substrate 1 .
[0119] This increases the heat exchange area between the chip package and the external environment under natural heat dissipation conditions, improving heat dissipation efficiency. Under forced air cooling, increasing the convection heat exchange area between the chip package and the air also enhances heat dissipation through turbulence, further improving heat dissipation efficiency and reducing the thermal resistance of the chip package.
[0120] The heat dissipation teeth 6 may be needle-shaped, rib-shaped, rectangular, cylindrical, or polygonal, etc., but are not limited thereto.
[0121] The heat dissipation teeth 6 may be arranged on the heat-saturating shell 3 by welding, bonding, etc. Of course, this is only an example and is not a specific limitation.
[0122] In one possible approach, please continue to refer to Figure 2 The number of the heat dissipation teeth 6 is multiple, and the multiple heat dissipation teeth 6 are arranged in an array on the heat-sparing shell 3. The number of the heat dissipation teeth 6 is not specifically limited here.
[0123] When there are multiple heat dissipation teeth 6 , the heat exchange area between the chip package assembly and the external environment can be increased, thereby improving the heat dissipation efficiency.
[0124] At the same time, the array of heat dissipation teeth 6 increases the area for convective heat exchange between the chip package and the air. Furthermore, the heat dissipation teeth 6 enhance heat dissipation by creating turbulent airflow, thereby increasing the convective heat transfer coefficient between the chip package and the air and improving heat exchange between the chip package and the air.
[0125] In an optional manner, the heat dissipation teeth 6 , the packaging shell 2 and the heat-dissipating shell 3 are integrally formed.
[0126] During actual processing, the heat dissipation teeth 6 , the packaging shell 2 and the heat-saturating shell 3 can be integrally formed.
[0127] In this way, on the one hand, during actual installation, there is no need to position and match the heat dissipation teeth 6 , the packaging shell 2 and the heat-saturating shell 3 , which can improve the production efficiency of the chip packaging assembly.
[0128] Furthermore, the heat sink teeth 6, the encapsulating housing 2, and the heat-saturating housing 3 are integrally formed, eliminating the need for additional components to connect the heat sink teeth 6, the encapsulating housing 2, and the heat-saturating housing 3. There is also no need to add a thermal interface layer between the heat sink teeth 6 and the heat-saturating housing 3, or between the encapsulating housing 2 and the heat-saturating housing 3, to reduce contact thermal resistance.
[0129] In one example, the gas-liquid phase change material may be one of water, methanol, acetone, ammonia, or mercury.
[0130] In this way, the types of gas-liquid phase change materials are diversified, making it easy to select and set according to actual conditions.
[0131] The capillary structure component 5 may be of a micro-channel type, a sintered powder type, or a sintered wire mesh type.
[0132] In this way, the capillary structure component 5 is diversified and can be easily selected and configured according to actual conditions.
[0133] It should be noted that two or three types of capillary structure components 5 can be arranged in the same heat-saturating shell 3 .
[0134] For example, combining Figure 1 、 Figure 2 and Figure 5 As shown, when the number of the capillary structure components 5 is two, two layers of capillary structure components 5 of different forms can be provided.
[0135] Exemplarily, the capillary structure component 5 close to the package substrate 1 may be of a micro-channel type, and the capillary structure component 5 far from the package substrate 1 may be of a sintered powder type or a sintered wire mesh type.
[0136] In addition, in order to ensure that the heat-saturating shell 3 has efficient heat exchange performance, the heat-saturating shell 3 can usually be made of a metal material with high thermal conductivity.
[0137] Exemplarily, the material of the heat-saturating shell 3 is one of gold, copper, copper alloy, titanium, titanium alloy or stainless steel.
[0138] In this case, the material types of the heat-saturating shell 3 are enriched, which facilitates selection and setting according to actual conditions.
Claims
1. A chip packaging assembly, characterized in that: include: A packaging substrate having a carrying surface for carrying a chip; A packaging shell having an open end; the open end is connected to the packaging substrate, the packaging shell and the carrying surface are surrounded to form a closed first cavity, and the chip is located in the first cavity; A heat-sparing shell is provided on a side of the packaging shell away from the packaging substrate; the heat-sparing shell has a second cavity; The phase-change energy storage material is contained in the second cavity.
2. The chip package assembly according to claim 1, wherein: A third cavity is further provided in the heat-sparing housing, and the third cavity is arranged outside the second cavity; the chip packaging assembly further includes: A capillary structure component is disposed in the third cavity; A gas-liquid phase change material is contained in the third cavity; Wherein, the capillary structure component is used to provide a capillary force for the gas-liquid phase change material to flow back.
3. The chip package assembly according to claim 2, wherein: The capillary structure component is a plate-shaped structure; the capillary structure component has two first surfaces and two second surfaces that are oppositely arranged, wherein the area of the first surface is larger than the area of the second surface; the first surface is arranged on the cavity wall of the third cavity; or, the second surface is arranged on the cavity wall of the third cavity.
4. The chip package assembly according to claim 3, wherein: When the second surface is disposed on the cavity wall of the third cavity, multiple layers of the capillary structure components are disposed in the third cavity, and the multiple layers of the capillary structure components are arranged along a direction from the packaging substrate to the heat-saturating housing.
5. The chip package assembly according to claim 2, wherein: The capillary structure components are continuously arranged on the flow path of the gas-liquid phase change material.
6. The chip package assembly according to any one of claims 1 to 5, characterized in that: The chip packaging assembly further includes heat dissipation teeth, which are arranged on a side of the heat-spreading housing away from the packaging substrate.
7. The chip package assembly according to claim 6, wherein: There are multiple heat dissipation teeth, and the multiple heat dissipation teeth are arranged in an array on the heat-dissipating shell.
8. The chip package assembly according to claim 6, wherein: The heat dissipation teeth, the packaging shell and the heat-dissipating shell are integrally formed.
9. The chip package assembly according to any one of claims 2 to 5, characterized in that: The gas-liquid phase change material is one of water, methanol, acetone, ammonia or mercury; and / or the capillary structure component is a micro-channel type, a sintered powder type or a sintered wire mesh type.
10. The chip package assembly according to any one of claims 1 to 5, characterized in that: The material of the heat soaking shell is one of gold, copper, copper alloy, titanium, titanium alloy or stainless steel.