Mounting substrate and electronic device

Abstract

The invention relates to a mounting substrate and an electronic device. The mounting substrate includes a substrate, a surface mount connector having a connector connection hole, and a receptacle connector having a relay connector. The surface mount connector has: a first contact provided on a first inner surface on one side in the height direction of the connector connection hole; and a second contact provided on the second inner surface on the other side in the height direction. The relay connector has a plate piece inserted into the connector connection hole, a first terminal provided on one surface of the plate piece and connected to the first contact, and a second terminal provided on the other surface of the plate piece and connected to the second contact. In the depth direction of the connector connection hole, the first contact is disposed so as to be offset from the second contact toward the opening side. The first terminal has a first ground pin and a first signal pin, and the front end of the first ground pin protrudes further toward the front end side of the sheet than the front end of the first signal pin.

Description

Technical Field

[0001] The present invention relates to a mounting substrate including a socket connector and an electronic device including the mounting substrate. Background Art

[0002] Electronic devices such as notebook PCs and tablet PCs include a receptacle connector as an I / O connector on the side of a flat housing. The receptacle connector is often mounted on the edge of a main board (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-36484.

[0004] In recent years, from the perspective of ESG (Environmental Social Governance), electronic devices such as those described above have been required to be easily maintainable. This has led to a desire for receptacle connectors that are easily replaceable. This is particularly true for receptacle connectors conforming to the frequently used USB Type-C standard, which experience a high rate of failures and thus further demands easy replacement.

[0005] Furthermore, when replacing a socket connector, if the connector is charged and assembled into the system, the static electricity will be discharged. This will cause a large current to flow from the internal circuit to the electronic components, causing electrostatic discharge (ESD) damage to the electronic components. Summary of the Invention

[0006] The present invention has been made in consideration of the above-mentioned problems in the conventional technology, and an object of the present invention is to provide a mounting substrate and an electronic device capable of suppressing electrostatic damage when mounting a receptacle connector.

[0007] 14. The mounting substrate according to claim 13, wherein the first embodiment of the present invention comprises: a substrate having a mounting surface; a surface mount connector having a connector connection hole opened along the surface direction of the substrate and mounted on the mounting surface of the substrate; and a socket connector having a plug connection port for connecting a plug and a relay connector detachably connected to the connector connection hole, the surface mount connector comprising: a first contact provided on a first inner surface on one side in a height direction of the connector connection hole; and a second contact provided on a second inner surface on the other side in the height direction, the relay connector comprising: a plate inserted into the connector connection hole; a first terminal provided on one side of the plate and connected to the first contact; and a second terminal provided on the other side of the plate and connected to the second contact, the first contact being arranged with a position offset toward the opening side relative to the second contact in a depth direction of the connector connection hole, the first terminal comprising a first ground pin and a first signal pin, and the front end of the first ground pin protruding toward the front end side of the plate relative to the front end of the first signal pin.

[0008] An electronic device according to a second embodiment of the present invention is an electronic device comprising a housing and a mounting substrate supported by the housing, the mounting substrate comprising: a substrate having a mounting surface; a surface mount connector mounted on the mounting surface of the substrate and having a connector connection hole open along the surface direction of the substrate; and a receptacle connector having a plug connection port for connecting a plug, and a relay connector detachably connected to the connector connection hole, the surface mount connector comprising: a first contact provided on a first inner surface on one side in a height direction of the connector connection hole; and a second contact provided on a second inner surface on the other side in the height direction, the relay connector comprising: a plate inserted into the connector connection hole; a first terminal provided on one side of the plate and connected to the first contact; and a second terminal provided on the other side of the plate and connected to the second contact, the first contact being arranged with a position offset toward the opening side relative to the second contact in a depth direction of the connector connection hole, the first terminal comprising a first ground pin and a first signal pin, and the front end of the first ground pin protruding toward the front end side of the plate relative to the front end of the first signal pin.

[0009] According to the above aspect of the present invention, electrostatic damage during mounting of the receptacle connector can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a perspective view of an electronic device according to an embodiment.

[0011] Figure 2 This is a perspective view of the receptacle connector and surface mount connector viewed from the outside and diagonally above.

[0012] Figure 3 This is a cross-sectional perspective view of the receptacle connector and surface mount connector viewed diagonally from below.

[0013] Figure 4 It is a schematic side cross-sectional view of the receptacle connector and its surrounding frame.

[0014] Figure 5A This is a schematic bottom view of the receptacle connector as viewed from one surface side.

[0015] Figure 5B This is a schematic top view of the receptacle connector as viewed from the other side.

[0016] Figure 6A This is an explanatory diagram showing a state before the relay connector is connected to the surface mount connector.

[0017] Figure 6B Yes Figure 6A FIG. 1 is an explanatory diagram showing a state where the ground pin is in contact with the first contact.

[0018] Figure 7 It is a schematic side cross-sectional view showing the operation of connecting the receptacle connector to the surface mount connector.

[0019] Figure 8 Yes Figure 7 FIG. 1 shows a state in which the ground pin of the first terminal is in contact with the first contact of the surface mount connector.

[0020] Figure 9 Yes Figure 8 Figure showing the receptacle connector tilted downward.

[0021] Description of Reference Numerals

[0022] 10…electronic device; 12…mounting substrate; 14…housing; 26…socket connector; 27…surface-mount connector; 28…substrate; 28a…mounting surface; 30…plug retaining cylinder; 30a…plug connection port; 32…relay connector; 41…first terminal; 42…second terminal; 48…first inner surface; 48a…first edge portion; 49…second inner surface; 49a…second edge portion; 49b…inclined surface; 46…connector connection hole; 51…first contact; 52…second contact; 54…plate portion; 55…vertical wall; 55a…through hole; S1…open space; S2…expanded space. DETAILED DESCRIPTION

[0023] Hereinafter, preferred embodiments will be listed and the mounting substrate and electronic device according to the present invention will be described in detail with reference to the accompanying drawings.

[0024] Figure 1 This is a perspective view of an electronic device 10 according to one embodiment. Electronic device 10 is equipped with a mounting substrate 12 according to one embodiment. Mounting substrate 12 is assembled within a housing 14 of electronic device 10. The following describes an embodiment of the present invention using electronic device 10 as an example, exemplified by a notebook PC. The present invention is also applicable to electronic devices other than notebook PCs, such as desktop PCs or tablet PCs (tablet terminals).

[0025] The electronic device 10 includes a housing 14, a cover 16, and a hinge 18. The housing 14 and the cover 16 are connected by the hinge 18 so as to be rotatable relative to each other.

[0026] The housing 14 is provided with a keyboard device 20 and a touchpad 22. In addition to the mounting substrate 12, various electronic components such as a battery device, a storage device, a speaker, and an antenna can be mounted inside the housing 14. A display device 24, occupying the majority of the front surface of the cover 16, is provided. The display device 24 can be comprised of, for example, a liquid crystal display or an organic EL display. The cover 16 can also be provided with a speaker and a camera.

[0027] The mounting substrate 12 is supported inside the housing 14. The mounting substrate 12 can include a receptacle connector 26, a surface mount connector 27, and a substrate 28. The mounting substrate 12 is a connector and substrate assembly in which the receptacle connector 26 is mounted on the substrate 28 via the surface mount connector 27.

[0028] Substrate 28 is the main substrate (motherboard) in electronic device 10. Substrate 28 is a printed circuit board (PCB). Substrate 28 extends substantially across the left and right ends of housing 14. CPU 29, which controls the entire electronic device 10, is mounted on substrate 28. Surface mount connector 27 is mounted on substrate 28. Receptacle connector 26 is mounted to substrate 28 via surface mount connector 27. Substrate 28, on which surface mount connector 27 is mounted, may be a sub-substrate separate from the main substrate.

[0029] For the sake of convenience, the side of the housing 14 is defined as the outside around the receptacle connector 26, and the inside of the housing 14 is defined as the inside. In addition, with the substrate 28 as a reference, the mounting surface 28a side on which the surface mount connector 27 is mounted is defined as the top, and the opposite side is defined as the bottom. Figure 1The case shown is where the top and bottom of the housing 14 are reversed. That is, if the top and bottom relative to the substrate 28 are applied to the housing 14, the surface on which the keyboard device 20 is located may be the bottom. Regarding the receptacle connector 26 and the surface mount connector 27, the direction perpendicular to the inward-outward direction and the up-down direction is referred to as the width direction. These directions are designated for ease of explanation and are not intended to limit the use of the electronic device 10.

[0030] Figure 2 This is a perspective view of the receptacle connector 26 and the surface mount connector 27 as viewed obliquely from above and outside. Figure 3 This is a cross-sectional perspective view of the receptacle connector 26 and the surface mount connector 27 as viewed obliquely from below and outside. Figure 4 1 is a schematic side cross-sectional view of the receptacle connector 26 and the surrounding portion of the housing 14 .

[0031] First, a configuration example of the receptacle connector 26 will be described.

[0032] like Figures 2 to 4 As shown, receptacle connector 26 is, for example, a connector compliant with the USB Type C standard. Receptacle connector 26 can be used for data transmission and charging. Receptacle connector 26 may also be a connector compliant with the HDMI (registered trademark) standard, for example. Receptacle connector 26 is mounted to substrate 28 via surface mount connector 27. This allows receptacle connector 26 to be attached and detached without being soldered to substrate 28.

[0033] The receptacle connector 26 includes a plug holding cylinder 30 , an intermediate connector 32 , and a housing 34 .

[0034] The intermediate connector 32 of the receptacle connector 26 is connected to the surface mount connector 27 mounted on the mounting surface 28a. Thus, the plug retaining cylinder 30 is arranged so as to fit into the notch 28c formed in the substrate 28. This allows the receptacle connector 26 to be mounted on the mounting surface 28a of the substrate 28 using a so-called center mount method.

[0035] The plug holding cylinder 30 is a metal cylindrical body. The plug holding cylinder 30 has a flat oval shape with rounded corners. The plug holding cylinder 30 is located at the outermost side of the receptacle connector 26 and is positioned below the relay connector 32.

[0036] A through hole (connector hole) 55a is formed in the upright wall 55 forming the side surface of the frame 14 (see also Figure 1 ). The plug holding cylinder 30 is arranged opposite to the through hole 55a. Thus, the plug connection port 30a of the plug holding cylinder 30 is exposed to the outside of the frame 14 through the through hole 55a. The plug connection port 30a can be inserted and connected to the plug 36 (see Figure 4Plug 36 is a plug connector mounted on a cable or device. The connection standard between plug connector 30a and plug 36 complies with, for example, the USB Type C standard. Plug 36 can be inserted into and connected to plug connector 30a regardless of its vertical orientation.

[0037] A tongue-shaped plate 38 is disposed within the plug retaining cylinder 30. Contacts 38a and 38b are provided on the lower and upper surfaces of the plate 38, respectively. Each contact 38a and 38b contacts the terminals of the plug 36. Each contact 38a and 38b is composed of a plurality of metal pins arranged in parallel across the width of the plate 38. Each contact 38a and 38b is connected to a respective terminal 41 and 42 of the relay connector 32 using an electrode wire. For example, each of the contacts 38a and 38b and the terminals 41 and 42 has 24 metal pins.

[0038] The relay connector 32 is located at the innermost side of the receptacle connector 26. The relay connector 32 is located on the mounting surface 28a. The relay connector 32 may have a plug structure. The relay connector 32 can be detachably connected to the connector connection hole 46 of the surface mount connector 27.

[0039] The relay connector 32 can include a tongue-shaped plate 40, a first terminal 41 provided on the lower surface (one surface 40a) of the plate 40, and a second terminal 42 provided on the upper surface (the other surface 40b) of the plate 40. The terminals 41 and 42 are composed of, for example, a plurality of metal pins arranged in parallel in the width direction of the plate 40. For example, each of the terminals 41 and 42 has 12 metal pins.

[0040] The shell 34 is a thin metal plate component. The shell 34 covers the outer peripheral surface of the plug holding cylinder 30 except the plug connection port 30a, the upper surface and the side surface of the relay connector 32. The shell 34 has a pair of fixing pieces 34a, 34a and fixing pieces 34b, 34b in the width direction. Each fixing piece 34a protrudes in opposite directions from the side of the plug holding cylinder 30. Each fixing piece 34b protrudes in opposite directions from the side of the relay connector 32. The fixing pieces 34a, 34b can be used to fix the socket connector 26 to the substrate 28. A screw insertion hole is formed in each fixing piece 34a, 34b. In the substrate 28, a screw insertion hole 28d is formed at a position corresponding to each fixing piece 34a, 34b (see Figure 2 ) The fixing piece 34b can also be omitted.

[0041] The stud 60 is formed upright on the plate portion 54 forming the inner surface of the frame 14 (see Figure 4An internal thread is formed in the top surface (upper end) of the stud 60. The top surface of the stud 60 contacts the back surface 28b of the mounting surface 28a of the substrate 28. A screw passing through the screw insertion holes of the fixing plates 34a and 34b and the screw insertion hole 28d of the substrate 28 is screwed into the internal thread of the stud 60. Thus, the housing 34 is fastened to the substrate 28, and the receptacle connector 26 is fixed to the substrate 28. Simultaneously, the periphery of the receptacle connector 26 on the substrate 28 is also supported by the frame 14.

[0042] Next, a configuration example of the surface mount connector 27 will be described.

[0043] like Figures 2 to 4 As shown, the surface mount connector 27 can be mounted by fixing its connection surface 27a to the mounting surface 28a of the substrate 28 by soldering. The surface mount connector 27 can be detachably connected to the relay connector 32 of the receptacle connector 26. In this embodiment, the relay connector 32 has a plug structure, and the surface mount connector 27 has a socket structure. The surface mount connector 27 and the relay connector 32 can be configured as board-to-board connectors.

[0044] The surface mount connector 27 has a connector connection hole 46. The connector connection hole 46 extends along the surface of the substrate 28 and opens outward. The opening edge of the connector connection hole 46 includes a first edge 48a and a second edge 49a. The first edge 48a is the edge on the mounting surface 28a side (the lower side). The second edge 49a is the edge on the side opposite to the mounting surface 28a side (the upper side). The edges 48a and 49a extend along the width of the connector connection hole 46.

[0045] Contacts 51 and 52 are provided on the inner surface of the connector connection hole 46. The contacts 51 and 52 are in contact with the terminals 41 and 42 of the relay connector 32, respectively, and are electrically connected to each other.

[0046] The inner surface of connector connection hole 46 includes a first inner surface 48 and a second inner surface 49. First inner surface 48 is the bottom surface located on one side (lower side) in the height direction (vertical direction) of connector connection hole 46. First inner surface 48 extends inward from first edge portion 48a along the depth direction (inside-outside direction) of connector connection hole 46. Second inner surface 49 is the top surface located on the other side (upper side) in the height direction of connector connection hole 46. Second inner surface 49 extends inward from second edge portion 49a along the depth direction of connector connection hole 46.

[0047] First contact 51 is provided on first inner surface 48. Second contact 52 is provided on second inner surface 49. Each contact 51, 52 is connected to a signal line or ground pattern formed on substrate 28. Contacts 51, 52 are each composed of a plurality of metal pins arranged in parallel across the width of connector connection hole 46. For example, each contact 51, 52 has twelve metal pins. Terminals 41, 42 of relay connector 32 contact and conduct electricity with each contact 51, 52.

[0048] like Figure 4 As shown, in the depth direction of the connector connection hole 46, the second edge portion 49a is offset inward relative to the first edge portion 48a. Conversely, in the depth direction of the connector connection hole 46, the first edge portion 48a is offset toward the opening relative to the second edge portion 49a. Therefore, with respect to the connector connection hole 46, the first edge portion 48a, which serves as the lower jaw, protrudes outward relative to the second edge portion 49a, which serves as the upper jaw. As a result, the opening edge portion of the connector connection hole 46 forms an open space S1 that is open upward. Open space S1 allows the base of the relay connector 32 inserted into the connector connection hole 46 to swing upward.

[0049] An inclined surface 49b is formed on the second edge portion 49a facing the open space S1. The inclined surface 49b is gradually inclined in a direction (upward) away from the mounting surface 28a from the inner side (inside) of the connector connection hole 46 toward the opening side (outside). The inclination angle of the inclined surface 49b relative to the surface direction of the substrate 28 is not limited, and can be set to about 20 degrees to 40 degrees, for example. The inclination angle in this embodiment is about 30 degrees. The inclination angle of the inclined surface 49b can be designed in consideration of the standing height of the vertical wall 55 described later and the height of the socket connector 26 in the up and down directions. The inclination angle of the inclined surface 49b is preferably, for example, Figure 8 The angle at which the extended lines E1 and E2 do not intersect the vertical wall 55.

[0050] The connector connection hole 46 can have an expansion space S2 formed by recessing the portion of the first inner surface 48 further inward than the first contact 51 toward the mounting surface 28a (downward). The expansion space S2 is a space that expands the inner portion of the connector connection hole 46 downward. The expansion space S2 allows the front end of the relay connector 32 inserted into the connector connection hole 46 to swing downward.

[0051] like Figure 4 As shown, the frame 14 can include a frame member 56 having a plate portion 54 and a standing wall 55 , and a cover member 58 .

[0052] The frame member 56 can have a shallow bathtub shape by forming the vertical wall 55 on the outer peripheral edge of the plate portion 54. The plate portion 54 forms the operation surface 14a of the frame 14. The operation surface 14a is the surface where the keyboard device 20 and the touch pad 22 are exposed (see Figure 1 Studs 60 can be formed upright on the inner surface 54a of the plate portion 54. Studs 60 are positioned corresponding to at least four fixing pieces 34a and 34b. As described above, studs 60 can be used to secure the receptacle connector 26 to the substrate 28. The portion of the substrate 28 other than the periphery of the receptacle connector 26 is also appropriately supported by the inner surface 54a of the plate portion 54.

[0053] The vertical wall 55 rises upward from the edge of the outer periphery of the plate portion 54. A through hole 55a (also see Figure 1 The through hole 55a faces the plug connection port 30a of the receptacle connector 26. The through hole 55a is an opening for connecting the plug 36 to the plug connection port 30a.

[0054] The cover member 58 is a plate-shaped member that closes the opening of the frame member 56. A tapered portion 58a can be provided on the edge of the cover member 58. The tapered portion 58a slopes inward from the front end (upper end 55b) of the vertical wall 55. The receptacle connector 26 can be configured so that the upper and lower steps between the relay connector 32 and the plug retaining cylinder 30 extend into the inner surface of the tapered portion 58a.

[0055] like Figure 4 As shown, the socket connector 26 can be mounted on the substrate 28 via the surface mount connector 27 and supported on the substrate 28 and the frame 14 via the studs 60. In this state, a predetermined gap C1 can be set between the open end (outer end face 30b) of the plug connection port 30a and the inner surface of the vertical wall 55. The gap C1 is the opposing distance between the vertical wall 55 and the plug connection port 30a. The gap C1 can be set to 0.2 mm, for example. The front end of the plug holding cylinder 30 can also contact the inner surface of the vertical wall 55 or be inserted into the through hole 55a. In this case, the gap C1 becomes zero or negative.

[0056] In this state, a predetermined gap C2 can be provided between the rear surface 46a of the connector connection hole 46 and the front end surface 32a of the relay connector 32. Gap C2 can be set to, for example, 0.5 mm. In other words, gap C2 can be set larger than gap C1. Gap C2 creates a space that allows the relay connector 32 to move toward the rear side of the connector connection hole 46 during removal and installation of the receptacle connector 26, as described later.

[0057] Next, a specific configuration example of the relay connector 32 and a connection structure between the relay connector 32 and the surface mount connector 27 will be described.

[0058] Figure 5A This is a schematic bottom view of the receptacle connector 26 as viewed from the one surface 40 a side. Figure 5B It is a schematic plan view of the receptacle connector 26 as viewed from the other surface 40b side. Figure 6A This is an explanatory diagram showing a state before the relay connector 32 and the surface mount connector 27 are connected. Figure 6B Yes Figure 6A The ground pin 42a shown in FIG. 4 is in contact with the first contact 51. Figure 6A as well as Figure 6B , the surface mount connector 27 is cut along a plane perpendicular to the vertical direction and is shown in a plan view of the first contact 51. Furthermore, the relay connector 32 omits components other than the first terminal 41 and is shown in a plan view of the first terminal 41 from above.

[0059] like Figure 5A As shown, the plurality of metal pins of the first terminal 41 of the relay connector 32 are arranged in parallel in the width direction of one side 40a of the plate 40. The metal pins constituting the first terminal 41 may include two ground pins 41a, 41a, two high-speed transmission pins 41b, 41b, two high-speed reception pins 41c, 41c, two power pins 41d, 41d, a plug direction detection pin 41e, an expansion pin 41f, a low-speed transmission pin 41g, and a low-speed reception pin 41h.

[0060] The ground pin 41a is connected to the ground pattern of the substrate 28 via the first contact 51. The high-speed transmission pin 41b, high-speed reception pin 41c, plug direction detection pin 41e, expansion pin 41f, low-speed transmission pin 41g, and low-speed reception pin 41h are signal pins connected to the signal line of the substrate 28 via the first contact 51. The power pin 41d is a power pin connected to the power line of the substrate 28 via the first contact 51.

[0061] Ground pins 41a are located at both ends of the width of the board 40. Two high-speed transmit pins 41b are arranged next to one ground pin 41a. Two high-speed receive pins 41c are arranged next to the other ground pin 41a. Power pins 41d are located next to high-speed transmit pin 41b and next to high-speed receive pin 41c. Plug orientation detection pin 41e is located next to power pin 41d, which is located next to high-speed transmit pin 41b. Extension pin 41f is located next to power pin 41d, which is located next to high-speed receive pin 41c. Low-speed transmit pin 41g is located next to plug orientation detection pin 41e. Low-speed receive pin 41h is located next to extension pin 41f.

[0062] like Figure 5B As shown, the plurality of metal pins of the second terminal 42 of the relay connector 32 are arranged in parallel in the width direction of the other surface 40b of the plate 40. The metal pins constituting the second terminal 42 can include two ground pins 42a, 42a, two high-speed transmission pins 42b, 42b, two high-speed reception pins 42c, 42c, two power pins 42d, 42d, a plug direction detection pin 42e, an expansion pin 42f, a low-speed transmission pin 42g, and a low-speed reception pin 42h.

[0063] The ground pin 42a is connected to the ground pattern of the substrate 28 via the second contact 52. The high-speed transmission pin 42b, high-speed reception pin 42c, plug orientation detection pin 42e, expansion pin 42f, low-speed transmission pin 42g, and low-speed reception pin 42h are signal pins connected to the signal line of the substrate 28 via the second contact 52. The power pin 42d is a power pin connected to the power line of the substrate 28 via the second contact 52. The arrangement order of the pins 42a to 42h of the second terminal 42 is reversed from the arrangement order of the pins 41a to 41h of the first terminal 41. The number and arrangement order of the metal pins of the terminals 41 and 42 vary depending on the connection standard supported by the receptacle connector 26, and the same applies to the mating contacts 51 and 52.

[0064] like Figure 5A As shown, the tip of the ground pin (first ground pin) 41a of the first terminal 41 in this embodiment protrudes toward the front end (inward) of the board 40, further than the tips of the high-speed transmit pin 41b and the high-speed receive pin 41c, which serve as signal pins (first signal pins). The tip of the ground pin (first ground pin) 41a of the first terminal 41 protrudes toward the front end (inward) of the board 40, further than the tip of the power pin 41d. In other words, the tip of the ground pin 41a is offset toward the front end of the board 40, further than the tips of the other pins 41b to 41h.

[0065] like Figure 5B As shown, in this embodiment, the tip of the ground pin (second ground pin) 42a of the second terminal 42 is aligned with the tip of the high-speed transmission pin 42b, which serves as a signal pin (second signal pin). The tip of the ground pin (second ground pin) 42a of the second terminal 42 is also aligned with the tip of the power pin 42d. The alignment of the tip of the ground pin 42a with the tips of the other pins 42b to 42h encompasses both situations where the tips are completely aligned in the inner and outer directions, and also encompasses situations where slight misalignment occurs due to manufacturing errors, assembly errors, and the like.

[0066] Such a relay connector 32 is as follows Figure 6A as well as Figure 6BThe surface mount connector 27 is connected as shown. During this connection, the ground pins 41a at both ends of the first terminal 41 contact the first contact 51 earlier than the other pins 41b to 42h. In addition, the second contact 52 is offset from the first contact 51 to the inner side (inner side) of the connector connection hole 46 (see FIG. Figure 7 Therefore, when the ground pin 41a of the first terminal 41 contacts the first contact 51, the second terminal 42 does not contact the second contact 52 (see Figure 8 ).

[0067] Next, the mounting operation of the receptacle connector 26 and its effects will be described.

[0068] like Figures 7 to 9 As shown, the receptacle connector 26 is mounted on the surface mount connector 27 in a state where the cover member 58 is removed from the frame member 56 .

[0069] First, if Figure 7 as well as Figure 8 As shown by the hollow arrow, the receptacle connector 26 is moved obliquely inward and downward, and the relay connector 32 is inserted into the connector connection hole 46 .

[0070] At this time, the first contact 51 of the surface mount connector 27 is offset toward the opening side (outside) relative to the second contact 52 in the depth direction (inside-outside direction) of the connector connection hole 46. The front end of the ground pin 41a of the first terminal 41 protrudes toward the front end side of the board 40 relative to the front end of the high-speed transmission pin 41b, etc., which is a signal pin. Therefore, when the relay connector 32 is connected to the surface mount connector 27, the ground pin 41a contacts the first contact 51 first. At this contact timing, the other pins 41b to 41h and the pins 42a to 42h of the second terminal 42 do not contact the contacts 51 and 52 (see Figure 6B as well as Figure 8 ).

[0071] Specifically, when the relay connector 32 is connected to the surface-mount connector 27, static electricity may be carried by the relay connector 32. Even in such cases, the static electricity carried by the mounting substrate 12 in this embodiment is discharged to the ground when the ground pin 41a contacts the first contact 51. This prevents large currents caused by static electricity from flowing to the signal lines of the substrate 28 via the high-speed transmission pin 41b, which serves as a signal pin. As a result, the electronic device 10 and the mounting substrate 12 can prevent electrostatic damage (ESD) to other electronic components mounted on the substrate 28 and other electronic components mounted on the housing 14 and the cover 16.

[0072] like Figure 4 as well as Figure 6BAs shown in FIG. 1 , the positional offset distance between the front end of the ground pin 41a and the front end of the high-speed transmission pin 41b is referred to as the distance L. The distance L can be appropriately set in consideration of the positional relationship between the pins 41a to 41h of the first terminal 41 and the first contact 51. For example, the distance L can be set as follows: Figure 6B as well as Figure 8 As shown in FIG. 1 , at the moment when the ground pin 41a contacts the first contact 51, the other pins 41b to 41h are not in contact with the first contact 51. For example, the distance L can be set as follows: Figure 4 As shown, at the position where the relay connector 32 is connected to the surface mount connector 27 , the other pins 41 b to 41 h are also at a distance that allows them to reliably contact the first contact 51 .

[0073] Next, if Figure 9 As shown by the hollow arrow in the figure, the receptacle connector 26 is pressed downward in the direction in which the plug retaining cylinder 30 moves downward. This causes the receptacle connector 26 to rotate counterclockwise in the figure, with the connection between the relay connector 32 and the connector connection hole 46 serving as a fulcrum. In other words, the receptacle connector 26 tilts downward, with the connection with the connector connection hole 46 serving as a fulcrum.

[0074] Next, if Figure 4 As indicated by the hollow arrow, receptacle connector 26 is moved outward. Plug connection port 30a is positioned at the desired position opposite through-hole 55a. Finally, fixing pieces 34a and 34b are fastened to substrate 28, and cover member 58 is assembled to frame member 56. This completes the installation of receptacle connector 26 in electronic device 10.

[0075] In addition, the mounting substrate 12 of this embodiment corresponds to the smooth removal action of the socket connector 26 described later. Therefore, the mounting substrate 12 is configured to be able to attach and detach the relay connector 32 in a posture inclined upward relative to the depth direction of the connector connection hole 46. Specifically, the electronic device 10 of this embodiment can insert the relay connector 32 into the connector connection hole 46 (see FIG. 1 ) along the extension line E1 of the inclined surface 49b. Figure 8 ). Figure 8 The extension line E2 in the figure is an imaginary line parallel to the extension line E1 and passing through the lower surface 26a of the socket connector 26. In the electronic device 10 of this embodiment, the extension line E1 of the inclined surface 49b preferably does not intersect the vertical wall 55. The electronic device 10 is more preferably a structure in which the extension line E2 does not intersect the vertical wall 55 when the upper surface (the other surface 40b) of the plate 40 of the relay connector 32 is in contact with or close to the inclined surface 49b. As a result, the electronic device 10 can avoid the socket connector 26 from interfering with the vertical wall 55 and can be smoothly loaded and unloaded on the surface mount connector 27 (see Figures 7 to 9 ).

[0076] When mounting substrate 12 is assembled into housing 14, a configuration is sometimes employed in which no vertical wall 55 is provided near surface mount connector 27. Alternatively, receptacle connector 26 may be connected to surface mount connector 27 without mounting substrate 12 being assembled into housing 14. In these cases, receptacle connector 26 need not be connected at an angle relative to surface mount connector 27. In other words, receptacle connector 26 may be connected while being horizontally movable relative to connector connection hole 46 along its depth. Even in such cases, ground pin 41a of mounting substrate 12 initially contacts first contact point 51, thereby suppressing the aforementioned electrostatic damage.

[0077] Next, the removal operation of the receptacle connector 26 and its effects will be described.

[0078] When the socket connector 26 is assembled in the frame 14, Figure 4 As shown, it is mounted on a substrate 28 via a surface mount connector 27. Each fixing piece 34a, 34b is fastened to the substrate 28 by screws.

[0079] According to this state, for example, when removing the failed receptacle connector 26 for replacement, first, the cover member 58 is removed from the frame member 56 (see Figure 9 ). This exposes the interior of the housing 14, allowing access to the receptacle connector 26. Remove the screws securing the fixing pieces 34a and 34b to the substrate 28. The receptacle connector 26 is now supported on the substrate 28 only by the connection between the relay connector 32 and the surface mount connector 27.

[0080] Next, Figure 4 The socket connector 26 is pressed in the opposite direction of the hollow arrow in FIG. The socket connector 26 is pressed inward. Figure 4 In the illustrated mounted state of the receptacle connector 26, a gap C2 exists between the rear surface 46a of the connector connection hole 46 and the front end 32a of the relay connector 32. Therefore, the receptacle connector 26 (and the relay connector 32) can move toward the rear side of the connector connection hole 46 by an amount corresponding to the gap C2.

[0081] Make the socket connector 26 face the Figure 9 Move in the direction opposite to the hollow arrow in the figure. The receptacle connector 26 is lifted upward, with the connection between the relay connector 32 and the connector connection hole 46 serving as a fulcrum. This causes the receptacle connector 26 to rotate so that its outermost end (outer end surface 30b) describes an arc. In other words, the receptacle connector 26 tilts upward, with the connection between the relay connector 32 and the connector connection hole 46 serving as a fulcrum.

[0082] Therefore, the receptacle connector 26 is oriented toward Figure 8 as well as Figure 7 Move in the opposite direction of the hollow arrow in FIG. Pull the socket connector 26 out of the surface mount connector 27 obliquely upward and outward. Thus, the removal of the socket connector 26 from the surface mount connector 27 is completed.

[0083] Thus, in the mounting substrate 12 and electronic device 10 of this embodiment, the socket connector 26 is not soldered to the substrate 28, making it easy to replace the socket connector 26, thereby reducing replacement costs. Furthermore, the socket connector 26 can be tilted upward or downward relative to the surface-mount connector 27. This prevents the mounting substrate 12 and electronic device 10 from interfering with the vertical wall 55 when replacing the socket connector 26, making replacement easier. Furthermore, the socket connector 26 has a horizontal interlocking structure that interlocks with the surface-mount connector 27 along the surface direction of the substrate 28. Therefore, the socket connector 26 does not overlap the surface-mount connector 27, thereby increasing the height of the mounting substrate 12. Consequently, the mounting substrate 12 also contributes to the thinning and lightweight design of the frame 14. Furthermore, the horizontal interlocking structure of the socket connector 26 reduces the number of connectors between the substrate 28 and the socket connector 26, and also shortens the length of the electrode wires within the socket connector 26. Therefore, the mounting substrate 12 is also suitable for high-speed signal transmission.

[0084] In addition, the receptacle connector 26 of this embodiment is Figure 4 In the illustrated installation state, a tiny gap C1 of, for example, 0.2 mm is provided between the outer end face 30b and the inner face of the vertical wall 55. This prevents the plug connection port 30a from approaching the through-hole 55a, preventing the gap C1 from being noticeable when the through-hole 55a is viewed from outside the frame 14. On the other hand, consider the case where the socket connector 26 is tilted upward or downward while maintaining this gap C1. In this case, the outer end face 30b may contact the vertical wall 55, preventing the socket connector 26 from being tilted upward or downward to the desired angle. The reason for this is that the outer end face 30b is located below the connection between the relay connector 32, which serves as a fulcrum for rotation, and the connector connection hole 46.

[0085] Therefore, electronic device 10 of this embodiment maintains a clearance C2 on the inner side of relay connector 32 when in the normal connected state. This allows receptacle connector 26 to tilt upward after moving inward. Furthermore, receptacle connector 26 can tilt downward after being pressed inward. Consequently, mounting substrate 12 can avoid narrowing clearance C1 and preventing receptacle connector 26 from contacting vertical wall 55 when tilting upward or downward.

[0086] Regarding the above-mentioned tilting action, the mounting substrate 12 of this embodiment is capable of positionally offsetting the upper and lower edge portions 48a, 49a of the connector connection hole 46 in the inward and outward directions. An open space S1 is formed at the opening edge portion of the connector connection hole 46 by this position offset. Therefore, the mounting substrate 12 of this embodiment can smoothly rotate the socket connector 26 when the relay connector 32 is inserted into the connector connection hole 46. Moreover, the surface mount connector 27 can have an inclined surface 49b at the second edge portion 49a on the upper side of the open space S1. Therefore, the surface mount connector 27 suppresses the collision of the rotating relay connector 32 with the second edge portion 49a. As a result, the socket connector 26 can smoothly rotate to, for example Figure 8 The desired angle is shown.

[0087] like Figure 8 as well as Figure 9 As shown, the surface mount connector 27 can have a downward expansion space S2 on the inner side of the first contact 51 of the connector connection hole 46. Therefore, for the receptacle connector 26, the plate 40 of the relay connector 32 is prevented from interfering with the first inner surface 48 in the connector connection hole 46, and the receptacle connector 26 rotates more smoothly.

[0088] As described above, the mounting substrate 12 of this embodiment can suppress electrostatic damage when the relay connector 32 is connected to the surface mount connector 27. This is because the front end of the ground pin 41a of the first terminal 41 is made to protrude toward the front end of the board 40 (see distance L) more than the front end of the high-speed transmission pin 41b, which is a signal pin. With this distance L, the mounting substrate 12 can suppress electrostatic damage when the receptacle connector 26 is connected to the surface mount connector 27. Figure 4 In the state of being mounted on the substrate 28 as shown, the tips of the signal pins (such as the high-speed transmission pin 41 b ) become stubs.

[0089] Specifically, in the surface mount connector 27 of this embodiment, the first contact 51 is offset from the second contact 52 toward the opening side in the depth direction of the connector connection hole 46. In this structure, it is assumed that the relay connector 32 has the same terminal structure as a general double-sided terminal structure connector. In this case, the front end positions of all the pins 41a to 41h of the first terminal 41 are aligned with the Figure 5B The front ends of the pins 42a to 42h of the second terminal 42 are aligned. Figure 4When mounted on substrate 28 as shown, all pins 41a through 41h are located at connection locations that extend inward from first contact 51. As a result, in the direction of signal transmission from high-speed transmit pin 41b and high-speed receive pin 41c, which serve as signal pins, toward the connection point with first contact 51, portions such as high-speed transmit pin 41b are formed, branching out and extending outward. Thus, portions of signal pins such as high-speed transmit pin 41b that extend from the connection point form stubs, negatively impacting high-speed signal transmission. In this regard, the mounting substrate 12 of this embodiment, having the aforementioned distance L, has the advantage of suppressing the formation of such stubs on the signal pins and improving high-speed signal transmission performance.

[0090] In addition, the present invention is not limited to the above-mentioned embodiment, and can of course be freely modified within the scope not departing from the gist of the present invention.

Claims

1. A mounting substrate, characterized in that: have: a substrate having a mounting surface; a surface mount connector mounted on the mounting surface of the substrate and having a connector connection hole opening along the surface direction of the substrate; and The receptacle connector has a plug connection port for connecting a plug, and a relay connector detachably connected to the connector connection hole. The surface mount connector has: A first contact point is provided on a first inner surface on one side in a height direction of the connector connection hole; and The second contact point is provided on the second inner surface on the other side in the height direction, The relay connector has: A plate is inserted into the connector hole; a first terminal, disposed on one side of the plate and connected to the first contact; and The second terminal is provided on the other side of the plate and connected to the second contact point. In the depth direction of the connector connection hole, the first contact is arranged to be offset from the second contact toward the opening side. The first terminal includes a first ground pin and a first signal pin, and a front end of the first ground pin protrudes further toward the front end side of the plate than a front end of the first signal pin.

2. The mounting substrate according to claim 1, wherein The second terminal has a second ground pin and a second signal pin, and a front end of the second ground pin and a front end of the second signal pin are aligned.

3. The mounting substrate according to claim 1 or 2, wherein: The first inner surface is a surface located on the mounting surface side in the height direction of the connector connection hole, The second inner surface is a surface located on the opposite side to the mounting surface side in the height direction of the connector connection hole.

4. The mounting substrate according to claim 3, wherein: The opening edge portion of the connector connection hole has: a first edge portion, which is an edge portion of the first inner surface; and The second edge portion is the edge portion of the second inner surface, In the depth direction of the connector connection hole, the second edge portion is offset to the inner side than the first edge portion.

5. The mounting substrate according to claim 4, wherein: The second edge portion has an inclined surface, and the inclined surface is gradually inclined from the inner side of the connector connection hole toward the opening side in a direction away from the mounting surface.

6. The mounting substrate according to claim 4, wherein: The connector connection hole has an expansion space formed by recessing a portion closer to the inside than the first contact toward the mounting surface in the height direction.

7. An electronic device comprising a housing and a mounting substrate supported by the housing, wherein: The mounting substrate comprises: a substrate having a mounting surface; a surface mount connector mounted on the mounting surface of the substrate and having a connector connection hole opening along the surface direction of the substrate; and The receptacle connector has a plug connection port for connecting a plug, and a relay connector detachably connected to the connector connection hole. The surface mount connector has: A first contact point is provided on a first inner surface on one side in a height direction of the connector connection hole; and The second contact point is provided on the second inner surface on the other side in the height direction, The relay connector has: A plate is inserted into the connector hole; a first terminal, disposed on one side of the plate and connected to the first contact; and The second terminal is provided on the other side of the plate and connected to the second contact point. In the depth direction of the connector connection hole, the first contact is arranged to be offset from the second contact toward the opening side. The first terminal includes a first ground pin and a first signal pin, and a front end of the first ground pin protrudes further toward the front end side of the plate than a front end of the first signal pin.

8. The electronic device according to claim 7, wherein: The second terminal has a second ground pin and a second signal pin, and a front end of the second ground pin and a front end of the second signal pin are aligned.

9. The electronic device according to claim 7 or 8, characterized in that: The first inner surface is a surface located on the mounting surface side in the height direction of the connector connection hole, The second inner surface is a surface located on the opposite side to the mounting surface side in the height direction of the connector connection hole.

10. The electronic device according to claim 9, wherein: The frame has: a plate portion supporting a surface of the substrate opposite to the mounting surface; and A vertical wall is erected from the edge of the plate portion and is formed with a through hole opposite to the plug connection port. The opening edge portion of the connector connection hole has: a first edge portion, which is an edge portion of the first inner surface; and The second edge portion is the edge portion of the second inner surface, In the depth direction of the connector connection hole, the second edge portion is offset to the inner side than the first edge portion.

11. The electronic device according to claim 10, wherein: The second edge portion has an inclined surface, which is gradually inclined away from the mounting surface from the inner side of the connector connection hole toward the opening side. An extension line of the inclined surface does not intersect the vertical wall.

12. The electronic device according to claim 10, wherein: The connector connection hole has an expansion space formed by recessing a portion of the first inner surface further inward than the first contact point toward the mounting surface in the height direction.

Images