A tin paste smearing device for PCB circuit board processing

Abstract

The application discloses a tin paste smearing device for PCB processing and relates to the technical field of tin paste printing. The device comprises a supporting mechanism and further comprises an anti-oxidation storage mechanism connected with the supporting mechanism, which comprises a material box provided with tin paste holes corresponding to the circuit board pins at the bottom. The anti-oxidation storage mechanism is installed to make the material fully filled in the tin paste holes, guarantee the material amount of the welding points, and isolate the tin paste from the air to avoid tin paste oxidation. The anti-residue discharging mechanism and the tin paste deformation control mechanism are installed to push the tin paste out of the tin paste holes, avoid the friction between the tin paste and the tin paste holes, and prevent the tin paste from being left, and at the same time, the circuit board is lowered synchronously during discharging to avoid the tin paste from leaving the welding points and affecting the element welding qualification rate. The tin paste anti-shortage mechanism is installed to separate the tin paste from the discharging rod after the tin paste is pushed out, avoid the discharging rod from taking away part of the tin paste, and prevent the uneven tin paste amount of multiple welding points from affecting the qualification rate.

Description

Technical Field

[0001] This invention relates to the field of solder paste printing technology, and more particularly to a solder paste application device for PCB circuit board processing. Background Technology

[0002] Solder paste printing is a core step in surface mount technology (SMT), and its quality directly affects the soldering reliability and production efficiency of electronic products.

[0003] When solder paste is printed, it enters the mold hole and then contacts the top of the circuit board. Because the solder paste is viscous, it is easy for solder paste residue to remain inside the mold hole, resulting in uneven solder paste amount at each solder joint. When the two pins of a component are located on two solder joints with different amounts of solder paste, cold solder joints may occur due to various factors such as melting speed during soldering. Summary of the Invention

[0004] This invention proposes a solder paste application device for PCB circuit board processing to address the aforementioned shortcomings of the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A solder paste application device for PCB circuit board processing includes a support mechanism and further includes:

[0007] An anti-oxidation storage mechanism, which is connected to a support mechanism, includes a material box, the bottom of which has solder paste holes corresponding to the pins of the circuit board, and a pressure plate is fitted inside the material box, the pressure plate having rod holes corresponding to the solder paste holes;

[0008] An anti-residue feeding mechanism, which is connected to an anti-oxidation storage mechanism, includes feeding rods fitted inside solder paste holes, and a mounting plate is fixed to the top of the plurality of feeding rods;

[0009] Solder paste deformation control mechanism, which is connected to the residue prevention feeding mechanism, includes a placement platform;

[0010] The solder paste anti-shortage mechanism, which is connected to the anti-oxidation storage mechanism, includes two movable plates three, and a wire is fixed between the two movable plates three;

[0011] The drive mechanism is connected to the support mechanism.

[0012] Furthermore, the support mechanism includes a base, and a plurality of brackets are fixed to the top of the base.

[0013] Furthermore, the anti-oxidation storage mechanism also includes a movable frame fixed to the top of the pressure plate, and a reciprocating screw is threaded inside the movable frame. A one-way gear is installed at the top of the reciprocating screw, and the reciprocating screw is rotatably connected to the top of the base.

[0014] The pressure plate is provided with a tube opening;

[0015] A spring is fixed to the top of the material box, and a pipe sealing plate is fixed to the top of the spring.

[0016] Furthermore, the anti-residue feeding mechanism also includes two vertical rods fixed to the top of the mounting plate, a limit plate fixed to the top of the two vertical rods, a movable plate sleeved on the outside of the two vertical rods, a reciprocating screw rod 2 threaded on the outside of the movable plate, a one-way gear 2 installed at the top of the reciprocating screw rod 2, and the reciprocating screw rod 2 rotatably connected to the top of the base.

[0017] A second spring is fitted around the outside of the first vertical rod. The bottom end of the second spring is fixedly connected to the first mounting plate, and the top end is fixedly connected to the first movable plate.

[0018] The mounting plate has an opening, and the movable frame is fitted inside the opening;

[0019] A metal tube is fixed on the mounting plate, and a feeding connector is connected to the top of the metal tube. The feeding connector is connected to a feeding machine. An electric valve is fixed inside the metal tube, and the metal tube is sleeved inside the pipe opening.

[0020] The feeding rod is sleeved inside the rod hole, and the feeding rod cooperates with the solder paste hole.

[0021] Furthermore, the solder paste deformation control mechanism also includes a connecting plate fixed to the bottom of the first moving plate, and a second moving plate fixed to the bottom of the connecting plate. The second moving plate is sleeved on the outside of the second reciprocating screw and the first reciprocating screw.

[0022] The movable plate 2 is internally fitted with two vertical rods 2, the bottom ends of the two vertical rods 2 are fixed with limit plates 2, the two vertical rods 2 are fixed to the bottom of the placement platform, and the outside of the vertical rods 2 is fitted with springs 3, the bottom end of the springs 3 is fixedly connected to the movable plate 2, and the top end is fixedly connected to the placement platform.

[0023] The top of the base is fixed with multiple sets of support rods, and the bottom of the placement platform is provided with support holes corresponding to the support rods.

[0024] Furthermore, the solder paste anti-scraping mechanism also includes a mounting plate two fixed to one side of the two brackets. A reciprocating screw three is rotatably connected inside the mounting plate two. A pulley is fixed to one end of the reciprocating screw three. A belt is connected to the outside of the two pulleys. Two movable plates three are respectively threaded around the outside of the reciprocating screw three. A guide rod is sleeved inside the movable plate three.

[0025] One of the brackets is fixed to one side with a motor, and the output end of the motor is fixedly connected to one of the reciprocating screws.

[0026] Furthermore, the drive mechanism includes a second motor fixed to the top of the base, and a gear is fixed to the output end of the second motor. One side of the gear meshes with a first one-way gear, and the other side meshes with a second one-way gear.

[0027] Furthermore, a controller is fixed on one side of the material box, and the controller is electrically connected to motor one and motor two respectively.

[0028] Compared with existing technologies, the beneficial effects of this invention are:

[0029] This invention utilizes an anti-oxidation storage mechanism to ensure the solder paste is fully filled into the solder paste holes, guaranteeing the amount of solder paste at the solder joints and isolating the solder paste from the air to prevent oxidation. An anti-residue feeding mechanism and a solder paste deformation control mechanism push the solder paste out of the holes, preventing residue caused by friction between the solder paste and the holes. Simultaneously, the circuit board moves downwards during feeding to prevent partial solder paste separation from the solder joints, thus avoiding impacting the component soldering pass rate. Furthermore, an anti-shortage solder paste mechanism separates the solder paste from the feeding rod after feeding, preventing the feeding rod from carrying away some solder paste, which could lead to uneven solder paste levels at multiple solder joints and affect the pass rate. Attached Figure Description

[0030] Figure 1 This is a first-view structural schematic diagram of a solder paste application device for PCB circuit board processing proposed in this invention.

[0031] Figure 2 This is a second-view structural schematic diagram of a solder paste application device for PCB circuit board processing proposed in this invention.

[0032] Figure 3 This is a third-view structural diagram of a solder paste application device for PCB circuit board processing proposed in this invention.

[0033] Figure 4 This is a first-view structural diagram of the material box of a solder paste application device for PCB circuit board processing proposed in this invention.

[0034] Figure 5This is a second-view structural diagram of the material box of a solder paste application device for PCB circuit board processing proposed in this invention.

[0035] Figure 6 This is a schematic diagram of the anti-residue feeding mechanism of a solder paste application device for PCB circuit board processing proposed in this invention.

[0036] Figure 7 This is a cross-sectional schematic diagram of the anti-oxidation storage mechanism of a solder paste application device for PCB circuit board processing proposed in this invention.

[0037] Figure 8 This is a schematic diagram of the solder paste anti-shortage mechanism of a solder paste application device for PCB circuit board processing proposed in this invention.

[0038] In the diagram: 1. Support mechanism; 11. Base; 12. Bracket; 2. Anti-oxidation storage mechanism; 21. Material box; 22. Solder paste hole; 23. Pressure plate; 24. Rod hole; 25. Pipe opening; 26. Moving frame; 27. Reciprocating screw one; 28. One-way gear one; 29. ​​Spring one; 210. Pipe opening sealing plate; 3. Anti-residue feeding mechanism; 31. Mounting plate one; 32. Feeding rod; 33. Vertical rod one; 34. Spring two; 35. Limiting plate one; 36. Reciprocating screw two; 37. One-way gear two; 38. Moving plate one; 39. Movable port; 310. Metal tube; 311. Feeding connector; 312. Electric valve; 4. Solder paste deformation control mechanism; 41. Connecting plate; 42. Moving plate two; 43. Vertical rod two; 44. Spring three; 45. Limiting plate two; 46. Placement platform; 47. Support hole; 48. Support rod; 51. Mounting plate two; 52. Reciprocating screw three; 53. Motor one; 54. Pulley; 55. Belt; 56. Moving plate three; 57. Guide rod; 58. Wire; 6. Drive mechanism; 61. Motor two; 62. Gear. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0040] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; and they may refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] Example: Refer to Figures 1-8 A solder paste application device for PCB circuit board processing includes a support mechanism 1, and further includes:

[0043] An anti-oxidation storage mechanism 2, which is connected to a support mechanism 1, includes a material box 21. The bottom of the material box 21 has solder paste holes 22 corresponding to the pins of the circuit board. A pressure plate 23 is fitted inside the material box 21. The pressure plate 23 has rod holes 24 corresponding to the solder paste holes 22.

[0044] The anti-residue feeding mechanism 3 is connected to the anti-oxidation storage mechanism 2, and includes feeding rods 32 sleeved inside the solder paste hole 22, with mounting plates 31 fixed to the top of the multiple feeding rods 32.

[0045] Solder paste deformation control mechanism 4, which is connected to anti-residue feeding mechanism 3, includes a placement platform 46;

[0046] The solder paste anti-shortage mechanism is connected to the anti-oxidation storage mechanism 2, and includes two movable plates 56, with wires 58 fixed between the two movable plates 56.

[0047] The drive mechanism 6 is connected to the support mechanism 1.

[0048] The support mechanism 1 includes a base 11, and a plurality of brackets 12 are fixed on the top of the base 11.

[0049] The anti-oxidation storage mechanism 2 also includes a movable frame 26 fixed on the top of the pressure plate 23. The movable frame 26 is threaded with a reciprocating screw 27. A one-way gear 28 is installed at the top of the reciprocating screw 27. The reciprocating screw 27 is rotatably connected to the top of the base 11.

[0050] The pressure plate 23 has a pipe opening 25;

[0051] A spring 29 is fixed to the top of the material box 21, and a pipe sealing plate 210 is fixed to the top of the spring 29.

[0052] When the amount of solder paste in the hopper 21 is not much, the top of the solder paste is lower than the bottom of the metal tube 310. When the solder paste is squeezed, it will seep out from the tube opening 25. Therefore, when the amount of solder paste is not much, the pressure plate 23 moves down to contact the tube opening sealing plate 210. The tube opening sealing plate 210 blocks the tube opening 25 to ensure that the solder paste is squeezed and discharged normally.

[0053] The anti-residue feeding mechanism 3 also includes two vertical rods 33 fixed to the top of the mounting plate 31. The top of the two vertical rods 33 is fixed with a limit plate 35. The two vertical rods 33 are fitted with a movable plate 38. The movable plate 38 is threaded with a reciprocating screw 36. The top of the reciprocating screw 36 is equipped with a one-way gear 37. The reciprocating screw 36 is rotatably connected to the top of the base 11.

[0054] A spring 34 is fitted on the outside of the vertical rod 33. The bottom end of the spring 34 is fixedly connected to the mounting plate 31, and the top end is fixedly connected to the movable plate 38.

[0055] The mounting plate 31 has an opening 39, and the movable frame 26 is fitted inside the opening 39.

[0056] A metal tube 310 is fixed on the mounting plate 31. The top end of the metal tube 310 is connected to a feeding connector 311. The feeding connector 311 is connected to a feeding machine. An electric valve 312 is fixed inside the metal tube 310. The metal tube 310 is fitted inside the pipe opening 25.

[0057] When the electric valve 312 is opened, the feeder adds solder paste into the material box 21 through the feed connector 311 and the metal pipe 310.

[0058] The feeding rod 32 is sleeved inside the rod hole 24, and the feeding rod 32 cooperates with the solder paste hole 22.

[0059] The solder paste deformation control mechanism 4 also includes a connecting plate 41 fixed to the bottom of the moving plate 38. The bottom of the connecting plate 41 is fixed with a moving plate 42, which is sleeved on the outside of the reciprocating screw 36 and the reciprocating screw 27.

[0060] The movable plate 2 42 is fitted with two vertical rods 2 43 inside. The bottom ends of the two vertical rods 2 43 are fixed with limit plates 2 45. The two vertical rods 2 43 are fixed to the bottom of the placement platform 46. The outside of the vertical rods 2 43 is fitted with springs 3 44. The bottom end of the springs 3 44 is fixedly connected to the movable plate 2 42, and the top end is fixedly connected to the placement platform 46.

[0061] Multiple sets of support rods 48 are fixed to the top of the base 11, and support holes 47 corresponding to the support rods 48 are opened at the bottom of the placement platform 46.

[0062] The solder paste anti-scraping mechanism also includes a mounting plate 2 51 fixed on one side of the two brackets 12. A reciprocating screw 3 52 is rotatably connected inside the mounting plate 2 51. A pulley 54 is fixed at one end of the reciprocating screw 3 52. A belt 55 is connected to the outside of the two pulleys 54. Two movable plates 3 56 are threadedly sleeved on the outside of the reciprocating screw 3 52. A guide rod 57 is sleeved inside the movable plate 3 56.

[0063] One of the brackets 12 has a motor 53 fixed to one side, and the output end of the motor 53 is fixedly connected to one of the reciprocating screws 52.

[0064] The drive mechanism 6 includes a second motor 61 fixed to the top of the base 11. A gear 62 is fixed to the output end of the second motor 61. One side of the gear 62 meshes with a first one-way gear 28, and the other side meshes with a second one-way gear 37.

[0065] A controller is fixed on one side of the material box 21. The controller is electrically connected to motor 53 and motor 61 respectively.

[0066] Working principle:

[0067] The start motor 61 drives the gear 62 to rotate forward. The forward rotation of the gear 62 satisfies the direction of rotation of the one-way gear 28 driving the reciprocating screw 27, so that the moving frame 26 pushes the pressure plate 23 down along the feeding rod 32 by a specified distance, squeezing the solder paste below. After being squeezed, the solder paste will fill the inside of the solder paste hole 22 and contact the solder joint of the circuit board above the placement table 46.

[0068] The starting motor 61 drives the gear 62 to reverse. The reverse rotation of gear 62 satisfies the direction of rotation of the reciprocating screw 36 driven by the one-way gear 37, causing the moving plate 38 to move down and compress the spring 34. The spring 34 pushes the mounting plate 31 down, and at the same time, the moving plate 38 pushes the connecting plate 41 and the moving plate 42 down. The downward movement of the moving plate 42 causes the compressed spring 44 to extend and return to its original position. Because the spring 44 has a large elastic force, the pressure of the placement platform 46 and the circuit board cannot compress the spring 44. The compression and return of the spring 44 can only be achieved through the movement of the moving plate 42. Therefore, although the spring 44 releases its elastic force during the return, the elastic force of the spring 44 is still sufficient to support the placement platform 46 and the circuit board, keeping the circuit board close to the bottom of the material box 21. Only after the spring 44 has fully returned to its original position will the moving plate 42 drive the circuit board to move down.

[0069] Mounting plate 1 31 moves down, pushing the unloading rod 32 down and inserting it into the solder paste hole 22, pushing the solder paste in the solder paste hole 22 downwards. At the same time as the unloading rod 32 inserts into the solder paste hole 22, spring 3 44 is fully reset. The moving plate 2 42 moves the circuit board down a distance that is the same as the downward speed of the unloading rod 32. Since the unloading rod 32 moves down the same distance as the circuit board, the three-dimensionality of the solder paste can be guaranteed, avoiding the residue in the solder paste hole 22 and also preventing the solder paste from being located outside the solder joint. This ensures the amount and position of solder paste at the solder joint and improves the pass rate of subsequent component soldering.

[0070] The downward movement of mounting plate 31 causes metal tube 310 to move downwards simultaneously. Metal tube 310 fits snugly against tube opening 25, preventing solder paste from overflowing through gaps when pressure is applied. The downward movement of metal tube 310 pushes tube opening sealing plate 210 to compress spring 29. When spring 29 can no longer be compressed, mounting plate 31 is restricted from further downward movement, and the feed rod 32 pushes the solder paste out of solder paste hole 22. Then, motor 61 is turned off, and motor 53 is started to drive reciprocating screw 52 to rotate. Reciprocating screw 52 rotates via pulley 5. 4 and belt 55 drive another reciprocating screw 3 52 to rotate, so that the two moving plates 3 56 drive the wire 58 to move synchronously. The wire 58 moves close to the bottom of the material box 21 and then contacts the bottom end of the feeding rod 32, cutting off the contact between the feeding rod 32 and the solder paste. This prevents the feeding rod 32 from taking away some solder paste when it resets, which would not be able to guarantee the uniformity of the solder paste amount at the solder joint. It also prevents different amounts of solder paste during soldering, which could cause problems in component soldering. The moving plate 3 56 moves to the end of the reciprocating screw 3 52 and then returns to its original position.

[0071] Continue starting motor 2 61 to reverse gear 62, causing moving plate 1 38 to push spring 2 34 downward. Because mounting plate 1 31 is restricted by metal tube 310, spring 2 34 is compressed. Moving plate 2 42 drives spring 3 44, placement platform 46 and circuit board downward. Support rod 48 inserts into support hole 47, pushing circuit board out of placement platform 46. Then, manually remove circuit board and place the next set of circuit boards. At this time, moving plate 1 38 has moved to the end of the screw. Reciprocating screw 2 36 continues to rotate, causing moving plate 1 38 to move upward, causing mounting plate 1 31 to drive unloading rod 32 to reset. Moving plate 2 42 pushes spring 3 44, placement platform 46 and circuit board upward. The top of circuit board aligns with the bottom of material box 21. Spring 3 44 is compressed. After resetting, the next set of solder paste unloading operation is performed according to the above steps.

[0072] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A solder paste application device for PCB circuit board processing, comprising a support mechanism (1), and further comprising: An anti-oxidation storage mechanism (2) is connected to a support mechanism (1) and includes a material box (21). The bottom of the material box (21) is provided with solder paste holes (22) corresponding to the pins of the circuit board. A pressure plate (23) is fitted inside the material box (21). A rod hole (24) corresponding to the solder paste holes (22) is provided on the pressure plate (23). The anti-residue feeding mechanism (3), which is connected to the anti-oxidation storage mechanism (2), includes feeding rods (32) sleeved inside the solder paste hole (22), and a mounting plate (31) is fixed to the top of the plurality of feeding rods (32). Solder paste deformation control mechanism (4), which is connected to anti-residue feeding mechanism (3), includes a placement platform (46) on which a circuit board is placed; Solder paste anti-shortage mechanism, which is connected to anti-oxidation storage mechanism (2), includes two movable plates (56), and wires (58) are fixed between the two movable plates (56). The drive mechanism (6) is connected to the support mechanism (1); The anti-oxidation storage mechanism (2) also includes a movable frame (26) fixed on the top of the pressure plate (23). The movable frame (26) is threaded with a reciprocating screw (27). A one-way gear (28) is installed at the top of the reciprocating screw (27). The reciprocating screw (27) is rotatably connected to the top of the base (11). The anti-residue feeding mechanism (3) also includes two vertical rods (33) fixed to the top of the mounting plate (31), a limit plate (35) fixed to the top of the two vertical rods (33), a movable plate (38) sleeved on the outside of the two vertical rods (33), a reciprocating screw (36) threaded on the outside of the movable plate (38), a one-way gear (37) installed at the top of the reciprocating screw (36), and the reciprocating screw (36) rotatably connected to the top of the base (11); The outside of the first vertical rod (33) is fitted with a second spring (34). The bottom end of the second spring (34) is fixedly connected to the first mounting plate (31), and the top end is fixedly connected to the first movable plate (38). The feeding rod (32) is sleeved inside the rod hole (24), and the feeding rod (32) cooperates with the solder paste hole (22); The solder paste deformation control mechanism (4) further includes a connecting plate (41) fixed to the bottom of the moving plate one (38), and a moving plate two (42) fixed to the bottom of the connecting plate (41). The moving plate two (42) is sleeved on the outside of the reciprocating screw two (36) and the reciprocating screw one (27). The movable plate 2 (42) is fitted with two vertical rods 2 (43) inside. The bottom ends of the two vertical rods 2 (43) are fixed with limit plates 2 (45). The two vertical rods 2 (43) are fixed to the bottom of the placement platform (46). The outside of the vertical rods 2 (43) is fitted with springs 3 (44). The bottom end of the springs 3 (44) is fixedly connected to the movable plate 2 (42), and the top end is fixedly connected to the placement platform (46).

2. The solder paste application device for PCB circuit board processing according to claim 1, characterized in that, The support mechanism (1) includes a base (11), and a plurality of brackets (12) are fixed on the top of the base (11).

3. The solder paste application device for PCB circuit board processing according to claim 2, characterized in that, The pressure plate (23) has a pipe opening (25); A spring (29) is fixed to the top of the hopper (21), and a pipe sealing plate (210) is fixed to the top of the spring (29).

4. The solder paste application device for PCB circuit board processing according to claim 3, characterized in that, The mounting plate (31) has an opening (39), and the movable frame (26) is fitted inside the opening (39); A metal tube (310) is fixed on the mounting plate (31). The top end of the metal tube (310) is connected to a feeding connector (311). The feeding connector (311) is connected to a feeding machine. An electric valve (312) is fixed inside the metal tube (310). The metal tube (310) is sleeved inside the pipe opening (25).

5. The solder paste application device for PCB circuit board processing according to claim 4, characterized in that, The top of the base (11) is fixed with multiple sets of support rods (48), and the bottom of the placement platform (46) is provided with support holes (47) corresponding to the support rods (48).

6. The solder paste application device for PCB circuit board processing according to claim 5, characterized in that, The solder paste anti-scraping mechanism also includes a mounting plate two (51) fixed on one side of the two brackets (12). The mounting plate two (51) is rotatably connected to a reciprocating screw three (52). One end of the reciprocating screw three (52) is fixed to a pulley (54). The two pulleys (54) are externally connected to a belt (55). The two movable plates three (56) are respectively threaded on the outside of the reciprocating screw three (52). The movable plates three (56) are internally fitted with a guide rod (57). The guide rod (57) is fitted inside the movable plates three (56). One of the brackets (12) is fixed to one side of a motor (53), and the output end of the motor (53) is fixedly connected to one of the reciprocating screws (52).

7. The solder paste application device for PCB circuit board processing according to claim 6, characterized in that, The drive mechanism (6) includes a second motor (61) fixed on the top of the base (11). A gear (62) is fixed at the output end of the second motor (61). One side of the gear (62) meshes with a first one-way gear (28), and the other side meshes with a second one-way gear (37).

8. The solder paste application device for PCB circuit board processing according to claim 7, characterized in that, A controller is fixed on one side of the hopper (21), and the controller is electrically connected to motor one (53) and motor two (61) respectively.

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