Heat dissipation structure and heat dissipation module thereof

Abstract

The invention provides a heat dissipation structure and a heat dissipation module thereof, the heat dissipation structure is used for abutting against or bearing an opening end of a heat pipe, the heat dissipation structure comprises at least two column bodies and a connecting ring connected with the column bodies, the connecting ring is provided with an abutting part, and the abutting part is used for abutting against or bearing the opening end of the heat pipe. The top connection portion of the heat dissipation structure can abut against the opening end of the heat pipe, so that it is guaranteed that the circumference of the opening end of the heat pipe can be completely in contact with the top connection portion, working fluid cooled in the heat pipe can flow in the horizontal direction and the vertical direction along the connecting ring and the at least two columns, and the backflow speed of the working fluid is increased.

Description

Technical Field

[0001] The present invention relates to a capillary structure of a heat dissipation module, and in particular to a heat dissipation structure and a heat dissipation module thereof which can increase the reflux efficiency of a working liquid and enhance the structural strength. Background Art

[0002] As customers' requirements for heat dissipation in electronic devices (such as computers and servers) increase, a 3D vapor chamber (3D VC) structure has been developed. Compared to traditional 2D vapor chambers, this 3D vapor chamber offers higher integration, more efficient vapor diffusion, lower thermal resistance, and a higher heat dissipation limit. However, as the integration density of electronic devices such as chips increases, the demand for heat dissipation increases, making conventional heat pipes and / or vapor chambers unable to meet the high heat flux requirements. Consequently, 3D vapor chambers have gradually replaced single heat pipes and / or vapor chambers and are widely used in the electronics cooling field.

[0003] In today's 3D vapor chamber (3D VC) structure, the heat pipe and vapor chamber are connected only by horizontal welding between the holes in the vapor chamber and the open end of the heat pipe. Due to the limited linear contact, the heat pipe has no vertical support or fixing structure after it is inserted into the cavity of the vapor chamber. Therefore, when the heat pipe is subjected to external forces in the vertical direction or when the heat sink fins are installed due to excessive weight, it may cause the heat pipe to fall off or bend and break, resulting in air leakage and other problems. Therefore, Taiwan Patent No. TWI871804 provides a solution to this problem. It disposes a powder ring below the heat pipe as a vertical support member for the heat pipe, which effectively solves the problem of insufficient vertical strength of the heat pipe.

[0004] However, the design of the aforementioned patent utilizes a heat pipe connected to a powder ring. Since the working fluid in the heat pipe can only flow along the vertical direction (Z-axis) within the heat pipe, and the circumference of the heat pipe's open end only partially contacts the multiple powder rings, the cooled working fluid can only flow back to the evaporation area through this local contact. The remaining working fluid must flow back to the evaporation area through the capillary on the upper side of the heat spreader via a longer return path or directly accumulate at the open end, resulting in a longer dripping time. This can easily lead to poor working fluid return flow, which can easily cause dry heating in the evaporation area and result in heat dissipation failure. Summary of the Invention

[0005] Thus, in order to effectively solve the above-mentioned problem, an object of the present invention is to provide a heat dissipation structure that can improve the reflux efficiency of the working liquid inside the vapor chamber.

[0006] To achieve the above-mentioned objectives, the present invention provides a heat dissipation structure for supporting or receiving the open end of a heat pipe. The heat dissipation structure includes: at least two columns; and a connecting ring connecting the at least two columns, the connecting ring having a top connection portion, which is used to support or receive the open end of the heat pipe.

[0007] Wherein, the connecting ring and the at least two columns are integrally formed.

[0008] The top connection portion has a through hole, and the through hole is used to correspond to the opening of the heat pipe.

[0009] The connecting ring has a connecting portion, and the connecting portion is used to connect the at least two columns.

[0010] Each of the columns has an upper end surface and a lower end surface, and the upper and lower end surfaces are respectively arranged at the upper and lower ends of the column. The connecting portion transversely connects the upper end surfaces of the at least two columns to connect the at least two columns into one.

[0011] The column is a porous body, and the connecting ring is a porous body.

[0012] Wherein, a plurality of grooves are provided on the column.

[0013] The column has an axial channel, which extends axially toward the column and penetrates the column.

[0014] To achieve the above-mentioned objectives, the present invention provides a heat dissipation module, comprising: a temperature averaging plate and at least one heat pipe, wherein the temperature averaging plate has an airtight chamber filled with a working liquid inside, a first capillary structure is provided on the lower side of the temperature averaging plate relative to the airtight chamber, and at least one through hole is opened on one side of the temperature averaging plate and connected to the airtight chamber; at least one heat dissipation structure is arranged in the airtight chamber and on the first capillary structure, and is arranged corresponding to the through hole, the heat dissipation structure comprising: at least two columns; and a connecting ring connecting the at least two columns, the connecting ring having A top connection portion; the heat pipe has a heat pipe cavity inside, and the two ends of the heat pipe respectively have a closed end and an open end. The heat pipe passes through the through hole corresponding to the open end to enter the airtight cavity of the temperature spreader, and is completely supported by the top connection portion of the heat dissipation structure at the open end; the setting of the heat dissipation structure can provide axial support, positioning and support for the open end of the heat pipe to be inserted into the airtight cavity, thereby strengthening the overall structural strength, and can directly guide the condensed reflux working liquid in the heat pipe from the open end through the heat dissipation structure to the first capillary structure.

[0015] Wherein, the connecting ring and the at least two columns are integrally formed.

[0016] Thus, the heat dissipation structure provided by the present invention connects multiple columns through a connecting ring, and allows the top connection portion of the connecting ring to completely connect the entire open end of the heat pipe to ensure that the entire open circumference of the heat pipe is in contact with the top connection portion. In this way, the working fluid can flow smoothly along the horizontal direction (XY axis) and the vertical direction (Z axis) through the open end through the connecting ring and the columns, thereby improving the reflux speed of the working fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional schematic diagram of the heat dissipation structure of the present invention;

[0018] Figure 2 for Figure 1 A three-dimensional schematic diagram of the heat dissipation structure from another angle;

[0019] Figure 3 for Figure 1 Schematic diagram of the appearance of the heat dissipation structure supporting the heat pipe;

[0020] Figure 4 for Figure 3 A side view schematic diagram of the heat dissipation structure supporting the heat pipe;

[0021] Figure 5 is a three-dimensional schematic diagram of another heat dissipation structure of the present invention;

[0022] Figure 6 for Figure 5 A three-dimensional schematic diagram of the heat dissipation structure from another angle;

[0023] Figure 7 It is a three-dimensional schematic diagram of another heat dissipation structure of the present invention;

[0024] Figure 8 for Figure 7 A three-dimensional schematic diagram of the heat dissipation structure from another angle;

[0025] Figure 9 A schematic top view of another heat dissipation structure of the present invention;

[0026] Figure 10 For the Figure 9 The schematic cross-sectional view shown by section line 10-10 in FIG.

[0027] Figure 11 It is a cross-sectional schematic diagram of the heat dissipation module of the present invention.

[0028] Explanation of the reference numerals in the accompanying drawings: heat dissipation structure 1; column 11; axial channel 110; upper end surface 111; lower end surface 112; side surface 113; top 114; bottom 115; joint 116; groove 117; connecting ring 12; through hole 120; top connection portion 121; arc portion 1211; connecting portion 122; temperature homogenizing plate 2; airtight chamber 20; through hole 200; first capillary structure 21; second capillary structure 22; heat pipe 3; heat pipe chamber 30; open end 31; opening 310; closed end 32; third capillary structure 33; heat dissipation module 4. DETAILED DESCRIPTION

[0029] The above-mentioned objectives and structural and functional characteristics of the present invention will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0030] like Figures 1 to 4 As shown, the present invention provides a heat dissipation structure 1, which is used to top (support) and support the open end 31 of a heat pipe 3. The heat dissipation structure 1 includes: a plurality of columns 11 (three are used for illustration in this embodiment), each column 11 has an upper end surface 111, a lower end surface 112, a side surface 113 and an axial channel 110, the upper and lower end surfaces 111 and 112 are respectively provided at the upper and lower ends of the column 11, the side surface 113 connects the upper end surface 111 and the lower end surface 112, and the axial channel 110 faces The column 11 extends axially and penetrates the column 11 to connect the upper and lower end surfaces 111 and 112; and a connecting ring 12 is provided. The connecting ring 12 connects the columns 11 and has a top connection portion 121 and a connecting portion 122. The connecting portion 122 connects the upper end surfaces 111 of the three columns 11 transversely to connect the three columns 11 into a whole. The top connection portion 121 is used to connect and support the open end 31 of the heat pipe 3, thereby strengthening the structural strength of the heat pipe 3 in the vertical direction. In addition, the top connection portion 121 has a through hole 120, which is used to correspond to the opening 310 of the heat pipe 3.

[0031] The column 11 may be a solid body or, in the present embodiment, the column 11 may be a hollow body, and at least three columns 11 are provided in the heat dissipation structure 1, which are arranged along the periphery of the connecting ring 12, and the three columns 11 are respectively located at relative positions 120 degrees apart. However, it is not limited to this. Another option is that only two columns 11 may be provided, which are respectively located at relative positions 180 degrees apart. Another option is that four columns 11 may also be provided, and the four columns 11 are respectively located at relative positions 90 degrees apart. In other words, the present invention does not limit the number of columns 11. Basically, as long as there are two or more columns 11, it can be applied to the present invention. According to different numbers of columns 11, by designing relative or non-relative positions at appropriate angles, the effect of structural stability can be effectively achieved.

[0032] It is worth mentioning that in this embodiment, the column 11 can also be a porous body, more specifically a hollow porous body, and the connecting ring 12 is also a porous body, and the connecting ring 12 and the at least two columns 11 can be a single-component porous structure formed integrally. It can be understood that the connecting ring 12 and the at least two columns 11 are structures with multiple pores, and the multiple pores can provide capillary force for the reflux of the working liquid. However, it is not limited to this. The connecting ring 12 and the at least two columns 11 can also be multiple independent components that are assembled and sintered into one. However, it is not limited to this. Each column 11 can also be a non-porous body, such as a metal column, and a plurality of grooves can be provided on the side wall of the column 11 to increase the capillary force for the reflux of the working liquid.

[0033] In this embodiment, if Figure 1 As shown, the connecting ring 12 is a hollow annular ring having a circular or geometric through-hole 120 and a circumference line, and the circumference line passes through the axial channels 110 of the three cylinders 11, so that the opening of the axial channels 110 of the cylinder 11 is crescent-shaped. In addition, it can be understood that since the cylinder 11 is a hollow annular body and the circumference line passes through the centers of the three hollow annular bodies, the structure of the heat dissipation structure 1 obtained is stable. However, it is not limited to this, please refer to Figures 5 and 6 As shown, in another embodiment, the connecting ring 12 is a hollow annular ring having a circumference, and the cylinder 11 is a hollow annular body. The circumference is the axial channel 110 that does not pass through the three cylinders 11, so the opening of the axial channel 110 of the cylinder 11 is circular, and at least a portion of the arc portion 1211 of the connecting ring 12 extends inwardly into the through hole 120, so that the through hole 120 is non-circular.

[0034] Please continue to refer to Figures 1 to 4 As shown, each of the columns 11 includes a top 114, a bottom 115, and a joint 116 connecting the top 114 and the bottom 115. The top 114 is used to connect the connecting ring 12, and the upper end surface 111 of the top 114 and the top connection portion 121 of the connecting ring 12 are coplanar. It can be understood that the column 11 formed by the top 114, the joint 116, and the bottom 115 is roughly trapezoidal, so the column 11 can also be called a trapezoidal powder ring, and this heat dissipation structure 1 can also be called a trapezoidal integrated overlapping powder ring. In this embodiment, the bottom 115 and the joint 116 are both an integrally formed structure formed by a hollow annular body, but it is not limited to this. In other embodiments, such as Figures 7 and 8 As shown, the bottom portion 115 and the joint portion 116 may also be semi-cylindrical structures.

[0035] Please refer to Figures 9 and 10, which is another embodiment of the heat dissipation structure 1 of the present invention. The connecting ring 12 and the three columns 11 are multiple independent components that are combined into one body through assembly. Each column 11 has a groove 117. The connecting portion 122 of the connecting ring 12 can be assembled into the groove 117, so that the column 11 is assembled with the connecting ring 12 and then sintered into a whole. It is understood that the groove 117 can be a crescent shape, a meniscus shape, or an arc shape in addition to a crescent shape.

[0036] Please refer to Figure 11 As shown, the present invention also provides a heat dissipation module 4 using the above heat dissipation structure 1, which includes: a temperature averaging plate 2, which has an airtight chamber 20 inside and is filled with a working liquid, a first capillary structure 21 is provided on the lower side of the temperature averaging plate 2 relative to the airtight chamber 20, a second capillary structure 22 is provided on the upper side of the temperature averaging plate 2 relative to the airtight chamber 20, and at least one through hole 200 is opened on one side of the temperature averaging plate 2 and connected to the airtight chamber 20; at least one The heat dissipation structure 1 is arranged in the airtight chamber 20 and is located on the first capillary structure 21 and is arranged corresponding to the through hole 200. The heat dissipation structure 1 includes: at least two columns 11, each of which has an upper end surface 111, a lower end surface 112 and a side surface 113. The upper and lower end surfaces 111 and 112 are respectively arranged at the upper and lower ends of the column 11, and the side surface 113 connects the upper end surface 111 and the lower end surface 112; and a connecting ring 12, connecting The at least two columns 11 are connected, and the connecting ring 12 has a top connection portion 121, and the top connection portion 121 has a through hole 120, and the through hole 120 corresponds to the through hole 200; and at least one heat pipe 3, having a heat pipe chamber 30 inside, and the two ends of the heat pipe 3 respectively have a closed end 32 and an open end 31, and the heat pipe chamber 30 is formed between the closed end 32 and the open end 31, and a third capillary structure 3 is provided on the wall surface of the heat pipe chamber 30. 3, the heat pipe 3 passes through the through hole 200 corresponding to the open end 31 and enters the airtight chamber 20 of the temperature vapor chamber 2, and is received and supported by the top connection portion 121 of the heat dissipation structure 1. It can be understood that the top connection portion 121 provides support force to the second capillary structure 22 and the open end 31 of the heat pipe 3 to enhance the structural strength of the heat pipe 3 in the vertical direction; in addition, the open end 31 of the heat pipe 3 can directly or indirectly contact the second capillary structure 22.

[0037] The configuration of the heat dissipation structure 1 provides axial support, positioning, and support for the open end 31 of the heat pipe 3 when inserted into the airtight chamber 20, thereby enhancing the overall structural strength. Furthermore, the condensed and refluxed working liquid in the heat pipe 3 can be directly and quickly guided through the open end via the connecting ring and the column to the first capillary structure 21. It will be understood that in this embodiment, the first, second, and third capillary structures 21, 22, and 33 can be any of sintered powder, woven mesh, grid, and fiber, and can be capillary structures of the same or different properties.

[0038] In summary, the heat dissipation structure of the present invention ensures that the circumference of the open end of the heat pipe is completely in contact with the top connection portion, allowing the cooling working fluid in the heat pipe to flow horizontally and vertically along the connecting ring and the at least two columns. This allows the working fluid to circulate in both the vertical and horizontal directions (XYZ axes), thereby significantly improving the return flow rate of the working fluid.

[0039] The above description has provided a detailed description of the present invention. However, the above description is merely a preferred embodiment of the present invention and should not limit the scope of the present invention. In other words, all equivalent variations and modifications based on the present invention are still within the scope of the present invention.

Claims

1. A heat dissipation structure for supporting or receiving an open end of a heat pipe, characterized in that: The heat dissipation structure includes: at least two cylinders; and A connecting ring is used to connect the at least two columns. The connecting ring has a top connection portion. The top connection portion is used to connect or receive the open end of the heat pipe.

2. The heat dissipation structure according to claim 1, wherein: The connecting ring and the at least two columns are integrally formed.

3. The heat dissipation structure according to claim 1, wherein: The top connection portion has a through hole, and the through hole is used to correspond to the opening of the heat pipe.

4. The heat dissipation structure according to claim 1, wherein: The connecting ring has a connecting portion, and the connecting portion is used to connect the at least two columns.

5. The heat dissipation structure according to claim 4, wherein: Each of the columns has an upper end surface and a lower end surface, and the upper end surface and the lower end surface are respectively arranged at the upper and lower ends of the column. The connecting portion horizontally connects the upper end surfaces of the at least two columns to connect the at least two columns into one body.

6. The heat dissipation structure according to claim 1, wherein: The column is a porous body, and the connecting ring is also a porous body.

7. The heat dissipation structure according to claim 1, wherein: The column is provided with a plurality of grooves.

8. The heat dissipation structure according to claim 1, wherein: The column has an axial channel, which extends axially toward the column and penetrates the column.

9. A heat dissipation module, characterized in that: Include: A temperature averaging plate having an airtight chamber filled with a working liquid, a first capillary structure disposed on the lower side of the temperature averaging plate relative to the airtight chamber, and at least one through hole formed on one side of the temperature averaging plate and connected to the airtight chamber; At least one heat dissipation structure is disposed in the airtight chamber and on the first capillary structure, and is disposed corresponding to the through hole, the heat dissipation structure comprising: at least two cylinders; and a connecting ring connecting the at least two columns, the connecting ring having a top connecting portion; and At least one heat pipe has a heat pipe chamber inside, and the two ends of the heat pipe respectively have a closed end and an open end. The heat pipe passes through the through hole corresponding to the open end to enter the airtight chamber of the temperature vapor chamber and is supported by the top connection portion of the connecting ring. The setting of the heat dissipation structure can provide axial support, positioning and support for the open end of the heat pipe to be inserted into the airtight chamber, and then the top connection portion can completely contact the circumference of the open end of the heat pipe, so that the working fluid cooled in the heat pipe can flow rapidly in the horizontal and vertical directions along the connecting ring and the at least two columns to the first capillary structure.

10. The heat dissipation module according to claim 9, wherein: The connecting ring and the at least two columns are integrally formed.

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