Display panel and manufacturing method and display device

Abstract

The application relates to a display panel, a preparation method and a display device. The display panel comprises a substrate, an isolation structure, a step groove, a plurality of light-emitting structures and a plurality of inorganic packaging units. The isolation structure is located on one side of the substrate and encloses a plurality of isolated openings. The step groove is located on at least one side of the isolated opening and at least penetrates part of the isolation structure. The step groove comprises at least two grooves in communication with each other, and a step surface is arranged between the two adjacent grooves. The light-emitting structure is at least partially arranged in the isolated opening. The inorganic packaging unit covers the corresponding light-emitting structure, and at least part of the inorganic packaging unit extends from the corresponding isolated opening into the step groove and covers at least one step surface. The application can effectively improve the performance of the display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method and a display device. BACKGROUND

[0002] Organic Light Emitting Diode (OLED) display technology is considered as the most potential new display technology of the next generation. Compared with liquid crystal display technology, OLED display technology has the advantages of low energy consumption, low cost, self-luminous, wide viewing angle and fast response speed.

[0003] In the preparation process of a traditional OLED display panel, a fine metal mask (FMM) is usually used to realize the patterning of light-emitting pixels. FMM technology is mature and has rich mass production experience. However, FMM technology also has the problems of limited precision and high cost. The fine metal mask-free technology eliminates the limitations of the traditional OLED process on the size, resolution and other performance of the display screen, and has the advantages of high performance, full-size, and agile delivery. The patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115220A, CN118678729A, CN118660529A and CN118660589A disclose the related content of the fine metal mask-free technology, which are referred to for reference.

[0004] However, the performance of the display panel formed by the current fine metal mask-free technology still needs to be improved. SUMMARY

[0005] In order to overcome the technical problems mentioned in the technical background, the embodiments of the present application provide a display panel capable of improving performance, a preparation method and a display device.

[0006] A display panel comprises:

[0007] a substrate;

[0008] an isolation structure located on one side of the substrate and enclosing a plurality of isolated openings;

[0009] a step groove located on at least one side of the isolated opening and at least penetrating part of the isolation structure, the step groove comprising at least two grooves in communication with each other, and a step surface between the adjacent two grooves;

[0010] a plurality of light-emitting structures, at least part of the light-emitting structures being located in the corresponding isolated openings;

[0011] a plurality of inorganic encapsulation units covering the corresponding light emitting structures, and at least part of the inorganic encapsulation units extending from the corresponding isolation openings into the step groove and covering at least one of the step surfaces.

[0012] In one of the embodiments, the display panel further comprises:

[0013] an organic encapsulation layer covering the inorganic encapsulation units;

[0014] Optionally, the display panel further comprises:

[0015] a second inorganic encapsulation layer covering the organic encapsulation layer.

[0016] In one of the embodiments,

[0017] part of the structure of the inorganic encapsulation units extends to the sidewall of the step groove away from the corresponding isolation opening;

[0018] Optionally, the sidewall of the step groove is perpendicular to the plane where the substrate is located.

[0019] In one of the embodiments, the step groove comprises a first recess and a second recess which are in communication with each other, the first recess is located on the side of the second recess close to the substrate, and the top of the first recess is located inside the bottom of the second recess in the orthographic projection on the substrate.

[0020] In one of the embodiments, the step groove comprises a first recess and a second recess which are in communication with each other, the first recess is located on the side of the second recess close to the substrate, and the bottom of the second recess is located inside the top of the first recess in the orthographic projection on the substrate.

[0021] In one of the embodiments, the depth of the first recess is greater than the thickness of the light emitting structure.

[0022] Optionally, the light emitting structure comprises a light emitting layer and a first electrode, the first electrode is located on the side of the light emitting layer away from the substrate and is electrically connected to the isolation structure.

[0023] Optionally, the light emitting structure further comprises a light extraction layer, the light extraction layer is located on the side of the first electrode away from the substrate.

[0024] Optionally, the display panel further comprises a plurality of second electrodes arranged at intervals, the second electrodes are located on the side of the isolation structure close to the substrate, the isolation openings expose at least part of the corresponding second electrodes, and the light emitting layer covers the corresponding second electrodes.

[0025] In one of the embodiments, the plurality of inorganic encapsulation units comprises a first encapsulation unit and a second encapsulation unit, the first encapsulation unit and the second encapsulation unit cover light emitting structures for emitting light of different colors located in different isolation openings,

[0026] In the same area where the step groove is located, the second encapsulation unit is in contact with the first encapsulation unit.

[0027] In one of the embodiments, in the same area where the step groove is located, part of the structure of the second encapsulation unit is located on the side of the first encapsulation unit away from the substrate, and the second encapsulation unit overlaps with the part of the first encapsulation unit covering the sidewall of the step groove;

[0028] Optionally, the step groove comprises a first groove and a second groove in communication with each other, the first groove is located on the side of the second groove close to the substrate;

[0029] The edge of the second encapsulation unit overlaps with the part of the first encapsulation unit covering the sidewall of the second groove, or the edge of the second encapsulation unit overlaps with the part of the first encapsulation unit covering the sidewall of the first groove.

[0030] In one of the embodiments, the plurality of inorganic encapsulation units further comprises a third encapsulation unit, the first encapsulation unit, the second encapsulation unit and the third encapsulation unit respectively cover light emitting structures for emitting light of different colors located in different isolation openings, and the third encapsulation unit is located on the two sides of the first encapsulation unit respectively,

[0031] In the same area where the step groove is located, the third encapsulation unit is in contact with the first encapsulation unit.

[0032] In one of the embodiments, the display panel further comprises a pixel definition layer, the pixel definition layer is located between the isolation structure and the substrate, and encloses a plurality of pixel openings, the pixel openings are in communication with the corresponding isolation openings;

[0033] The step groove exposes the pixel definition layer.

[0034] In one of the embodiments, the substrate comprises an organic layer, the display panel further comprises an inorganic layer, the inorganic layer covers the organic layer, the isolation structure is located on the side of the inorganic layer away from the substrate,

[0035] The step groove exposes the inorganic layer, and part of the structure of the inorganic encapsulation unit is in contact with the inorganic layer in the step groove;

[0036] Optionally, the inorganic layer comprises a pixel definition layer, the pixel definition layer enclosing a plurality of pixel openings, the pixel openings being in communication with the corresponding isolation openings.

[0037] Optionally, the organic layer comprises a planarization layer.

[0038] In one of the embodiments, the step groove extends through the isolation structure and the inorganic layer and into the organic layer, and a partial structure of the inorganic encapsulation unit is in contact with the sidewall and / or the bottom of the inorganic layer.

[0039] In one of the embodiments, the groove closest to the substrate among the at least two grooves of the step groove exposes the top of the inorganic layer, and the orthographic projection of the adjacent groove on the substrate is inside the orthographic projection of the groove closest to the substrate on the substrate.

[0040] The partial structure of the inorganic encapsulation unit is in contact with the top of the inorganic layer in the step groove.

[0041] A method for manufacturing a display panel, comprising:

[0042] providing a substrate;

[0043] forming an isolation structure on one side of the substrate, the isolation structure enclosing a plurality of isolation openings;

[0044] performing at least two etchings on the isolation structure to form a step groove on at least one side of the isolation opening, the step groove comprising at least two grooves in communication with each other, and a step surface between the adjacent two grooves;

[0045] forming at least a partial structure of a light-emitting structure in the corresponding isolation opening, and forming an inorganic encapsulation unit covering the corresponding light-emitting structure, at least part of the inorganic encapsulation unit extending from the isolation opening into the step groove and covering at least one step surface.

[0046] In one of the embodiments, the performing at least two etchings on the isolation structure to form a step groove on at least one side of the isolation opening comprises:

[0047] forming a first patterned photoresist covering part of the isolation structure and the isolation opening, the first patterned photoresist having a first opening therein;

[0048] performing a first etching on the isolation structure based on the first opening to form a first initial groove;

[0049] removing the first patterned photoresist;

[0050] forming a second patterned photoresist covering the partial structure of the isolation structure and the isolation opening, the second patterned photoresist having a second opening therein, a footprint of the first opening on the substrate being inside a footprint of the second opening on the substrate;

[0051] performing a second etching on the isolation structure based on the second opening to form a first recess corresponding to the first initial groove and a second recess in communication with the first recess;

[0052] Optionally, the first etching and / or the second etching comprises anisotropic etching.

[0053] Optionally, the anisotropic etching comprises dry etching.

[0054] In one of the embodiments, the performing at least two etchings on the isolation structure to form a stepped groove on at least one side of the isolation opening comprises:

[0055] forming a third patterned photoresist covering the partial structure of the isolation structure and the isolation opening, the third patterned photoresist having a third opening therein;

[0056] performing an etching on the isolation structure based on the third opening to form a second recess;

[0057] performing a further etching on the isolation structure based on the second recess to form a first recess below the second recess, a footprint of a bottom of the second recess on the substrate being inside a footprint of a top of the first recess on the substrate.

[0058] A display device comprising the display panel or the display panel formed according to the method for manufacturing a display panel.

[0059] The display panel, the method for manufacturing a display panel and the display device can effectively increase the surface area of the isolation structure outside the isolation opening by arranging the stepped groove penetrating through at least part of the isolation structure. The stepped groove comprises at least two recesses in communication with each other and a stepped surface between the adjacent two recesses. At this time, the surface area of the isolation structure outside the isolation opening can be effectively increased. Meanwhile, at least part of the inorganic encapsulation unit extends from the isolation opening into the stepped groove and covers at least one stepped surface, thereby increasing the encapsulation area of the inorganic encapsulation unit and effectively improving the encapsulation effect.

[0060] And, when the display panel is in a force condition (especially a folding condition), the inorganic encapsulation unit is arranged to extend from the isolation opening to the step groove and cover at least one step surface, so that the stress generated by the inorganic encapsulation unit corresponding to each isolation opening can be dispersed in the isolation opening and the step groove, preventing stress concentration on the side wall of the isolation opening, thereby effectively preventing the inorganic encapsulation unit from breaking, so that the inorganic encapsulation unit can play a better function of preventing oxygen and water from invading, thereby further improving the encapsulation reliability. BRIEF DESCRIPTION OF DRAWINGS

[0061] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0062] Figures 1 to 8 Partial cross-sectional structure schematic diagram of the display panel in different embodiments;

[0063] Figure 9 Preparation flowchart of the display panel in one embodiment;

[0064] Figures 10 to 13 Partial cross-sectional structure schematic diagram in the preparation process of the display panel in one embodiment;

[0065] Figure 14 Top view schematic diagram of the display panel in one embodiment.

[0066] Explanation of reference signs:

[0067] 100 - substrate, 200 - isolation structure, 210 - base, 220 - isolation part, 230 - blocking part, 300 - step groove, 310 - first groove, 320 - second groove, 330 - first initial groove, 410 - light emitting structure, 411 - light emitting layer, 412 - first electrode, 420 - second electrode, 500 - inorganic encapsulation unit, 510 - first encapsulation unit, 520 - second encapsulation unit, 530 - third encapsulation unit, 600 - organic encapsulation layer, 700 - second inorganic encapsulation layer, 800 - pixel definition layer, 910 - first patterned photoresist, 920 - second patterned photoresist. DETAILED DESCRIPTION

[0068] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0069] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0070] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It should be noted that, in the case of no conflict, different features in the embodiments of the present application can be combined with each other.

[0071] For some elements, sometimes the terms of “upper” or “above” are used when describing the position of the element in the Z direction, and the terms of “lower” or “below” are used when describing the position of the element in the opposite direction. In addition, when using the terms of “upper”, “above”, “lower”, “below”, “relative” and the like to define the positional relationship between two elements, it not only includes the state that the above two elements are directly connected, but also includes the state that the above two elements are separated by a gap, other elements. In addition, the terms “first”, “second”, “third” and the like are only used for differentiation and description, and cannot be understood as indicating or implying relative importance.

[0072] In one embodiment, a display panel is provided, which can be an organic light emitting diode display panel (OLED) or a quantum dot light emitting diodes display panel (QLED). Please refer to Figure 14 The display panel includes a display area AA having a display function and a non-display area NA.

[0073] The shape of the display area AA of the display panel can be rectangular, or square, circular, or elliptical, or other shapes.

[0074] The display region AA is provided with a plurality of pixels PX arranged in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3, for example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, the pixel PX includes a sub-pixel SPX emitting white or other color light in addition to the sub-pixels SPX1, SPX2, and SPX3.

[0075] The sub-pixel SPX includes a pixel circuit and a light emitting device driven by the pixel circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light emitting device, the second sub-pixel SPX2 includes a second light emitting device, and the third sub-pixel SPX3 includes a third light emitting device. One pixel circuit drives at least one light emitting device to emit light. For example, the display region AA includes a normal display region and a light-transmitting display region, the light-transmitting display region is a display region corresponding to a sensor and having light-transmitting performance, and the normal display region is a display region not corresponding to the sensor, one pixel circuit drives one light emitting device to emit light in the normal display region, and one pixel circuit drives one or more light emitting devices to emit light in the light-transmitting display region.

[0076] Specifically, referring to Figure 1 , the display panel includes a substrate 100, an isolation structure 200, a step groove 300, a plurality of light emitting structures 410, and a plurality of inorganic encapsulation units 500.

[0077] Exemplarily, the substrate 100 can include a substrate, a pixel circuit layer, and a planarization layer.

[0078] The substrate can include a flexible substrate or a rigid substrate. The pixel circuit layer is located on one side of the substrate and includes a pixel circuit for driving the light emitting device to emit light. The pixel circuit can include a transistor, a storage capacitor, and the like. The pixel circuit can include a 7T1C, 8T1C pixel circuit, and the like. In addition, the pixel circuit layer further includes at least one insulating layer, which can isolate adjacent conductive layers in the pixel circuit layer and can include at least one of an inorganic layer and an organic layer. The planarization layer is located on the side of the pixel circuit layer away from the substrate. Exemplarily, at least one wire changing layer can also be provided on the pixel circuit layer. Each wire changing layer can be covered with a layer of planarization layer.

[0079] The isolation structure 200 is located on one side of the substrate 100. The isolation structure 200 can be enclosed to form an isolation opening.

[0080] Exemplarily, the planarization layer of the top layer can be provided with a plurality of second electrodes 420 arranged at intervals away from the substrate. The second electrode 420 can be, for example, an anode. The second electrode 420 can be electrically connected to the pixel circuit layer through a via in the planarization layer and a trace in the rewiring layer, and the like. It can be understood that when the pixel circuit layer is provided with a plurality of rewiring layers and a plurality of planarization layers covering the plurality of rewiring layers, the planarization layer of the top layer is the planarization layer farthest from the pixel circuit layer. "Plurality" means two or more.

[0081] The isolation structure 200 can be located on the side of the second electrode 420 away from the substrate 100. The isolation opening can expose at least part of the corresponding second electrode 420.

[0082] The isolation structure 200 can enclose a plurality of isolation openings. The plurality of isolation openings can be arranged one-to-one with the second electrode 420. Each isolation opening can expose the corresponding second electrode 420. Exemplarily, each isolation opening can expose part of the upper surface of the corresponding second electrode 420. Alternatively, each isolation opening can also expose the entire upper surface of the corresponding second electrode 420. Here, the upper surface of the second electrode 420 can be the surface of the second electrode 420 away from the substrate 100.

[0083] Exemplarily, the isolation structure 200 can include an isolation portion 220 and a barrier portion 230 arranged in a stacked manner in a direction away from the substrate 100 (i.e., the Z direction).

[0084] The edge of the barrier portion 230 facing the isolation opening can be arranged protruding compared to the side of the isolation portion 220 facing the isolation opening, thereby forming a hanging eave shape towards the isolation opening. The materials of the isolation portion 220 and the barrier portion 230 can be different. The material of the isolation portion 220 can include a conductive material, and specifically can include at least one of aluminum (Al) and an aluminum alloy, which can include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The barrier portion 230 can be a single-layer structure or a multi-layer structure. In the case of a single-layer structure, the material of the barrier portion 230 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. In the case of a multi-layer structure, one layer of the barrier portion 230 includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and another layer of the barrier portion 230 can include a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0085] Exemplarily, the isolation structure 200 can include a base portion 210, an isolation portion 220, and a barrier portion 230 arranged in a stacked manner away from the substrate 100.

[0086] The base 210 is convexly arranged relative to the isolation portion 220 in a direction towards the isolation opening. The material of the base 210 can include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum tungsten alloy (MoW), or molybdenum niobium alloy (MoNb).

[0087] The stepped groove 300 is located at least at one side of the isolation opening. Specifically, the stepped groove 300 can be located at least at one side of the isolation opening in any direction parallel to the substrate 100. There can be one stepped groove 300 outside the same isolation opening, or there can be multiple stepped grooves 300 arranged at intervals. The stepped grooves 300 corresponding to adjacent isolation openings can be independent of each other. Alternatively, adjacent isolation openings can share the same stepped groove 300. The embodiments of the present application do not limit this. Illustratively, the stepped groove 300 can be annular, thereby surrounding the corresponding isolation opening for one turn. Alternatively, multiple stepped grooves 300 arranged at intervals can be provided outside the same isolation opening, and the multiple stepped grooves 300 can collectively surround the corresponding isolation opening for one turn.

[0088] Meanwhile, the stepped groove 300 at least penetrates part of the isolation structure 200. Specifically, the stepped groove 300 can only penetrate part of the isolation structure 200 without penetrating the isolation structure 200. Alternatively, the stepped groove 300 can penetrate and penetrate the isolation structure 200. Alternatively, the stepped groove 300 can penetrate the isolation structure 200 and extend to a structure below the isolation structure 200. The structure below the isolation structure 200, i.e., the structure on the side of the isolation structure 200 close to the substrate 100.

[0089] Meanwhile, the stepped groove 300 includes at least two grooves in communication with each other, and has a stepped surface between adjacent two grooves. The stepped surface can be parallel to the substrate 100 or not parallel to the substrate 100. The number of stepped surfaces can be determined according to the number of grooves in the stepped groove 300. When the stepped groove 300 includes two grooves, the stepped groove 300 includes one stepped surface. When the stepped groove 300 includes more than two grooves, the stepped groove 300 includes two or more stepped surfaces.

[0090] Meanwhile, the opening size of each groove of the stepped groove 300 can not be limited. Specifically, it can be set according to actual needs.

[0091] Illustratively, the stepped groove 300 includes a first groove 310 and a second groove 320 in communication with each other. The first groove 310 is located on the side of the second groove 320 close to the substrate 100, and the top of the first groove 310 is located inside the bottom of the second groove 320 in the orthographic projection on the substrate 100. At this time, the opening size of the second groove 320 can be greater than the opening size of the first groove 310.

[0092] Exemplarily, the stepped groove 300 comprises a first groove 310 and a second groove 320 which are in communication with each other, the first groove 310 is located at the side of the second groove 320 close to the substrate 100, and the bottom of the second groove 320 is located inside the top of the first groove 310 in the orthographic projection on the substrate 100. At this time, the opening size of the first groove 310 can be greater than the opening size of the second groove 320.

[0093] At least part of the light-emitting structure 410 is located in the corresponding isolated opening. Exemplarily, the light-emitting structure 410 can comprise a light-emitting layer 411 and a first electrode 412.

[0094] Exemplarily, the light-emitting layer 411 can comprise a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL and an electron injection layer EIL which are stacked in the direction away from the substrate 100 (i.e. the Z direction). The light-emitting layer 411 can comprise one light-emitting material layer EML or a plurality of light-emitting material layers EML.

[0095] The first electrode 412 is located at the side of the light-emitting layer 411 away from the substrate 100. One of the first electrode 412 and the second electrode 420 is a cathode, and the other is an anode. For example, the first electrode 412 is a cathode. The second electrode 420 is an anode.

[0096] The second electrode 420, the light-emitting layer 411 and the first electrode 412 corresponding to the same isolated opening can form one light-emitting device or a plurality of light-emitting devices. Corresponding to a plurality of isolated openings, a plurality of light-emitting devices can be formed. The sub-pixel SPX at least comprises the second electrode 420, the light-emitting layer 411 and the first electrode 412.

[0097] Exemplarily, the plurality of isolated openings enclosed by the isolation structure 200 can comprise a plurality of first isolated openings, a plurality of second isolated openings and a plurality of third isolated openings. The plurality of light-emitting devices can comprise a plurality of first light-emitting devices, a plurality of second light-emitting devices and a plurality of third light-emitting devices. The first light-emitting devices are arranged corresponding to the first isolated openings, the second light-emitting devices are arranged corresponding to the second isolated openings, and the third light-emitting devices are arranged corresponding to the third isolated openings.

[0098] Exemplarily, one isolated opening can be arranged corresponding to one light-emitting device, for example, the first light-emitting devices are arranged one-to-one corresponding to the first isolated openings, the second light-emitting devices are arranged one-to-one corresponding to the second isolated openings, and the third light-emitting devices are arranged one-to-one corresponding to the third isolated openings.

[0099] Exemplarily, one isolated opening can also be arranged corresponding to a plurality of light-emitting devices, for example, a plurality of light-emitting devices with the same light-emitting color can be arranged corresponding to one isolated opening.

[0100] The inorganic encapsulation unit 500 covers the corresponding light emitting structure 410. Exemplarily, the inorganic encapsulation unit 500 and the light emitting structure 410 can be arranged one-to-one.

[0101] In the process of preparing the display panel, the light emitting structure 410 can be formed by an evaporation process, thereby being cut off by the roof of the isolation opening. The inorganic encapsulation unit 500 can be formed by a chemical vapor deposition (CVD) process. The inorganic encapsulation unit 500 can cover the light emitting structure 410 and the sidewall of the isolation structure 200 which is not covered by the light emitting structure.

[0102] Meanwhile, at least part of the inorganic encapsulation unit 500 extends from the isolation opening into the step groove 300 and covers at least one step surface.

[0103] It can be understood that, when the inorganic encapsulation unit 500 covers the step surface, the inorganic encapsulation unit 500 can contact the step surface or have other film layer structures between the inorganic encapsulation unit 500 and the step surface.

[0104] Specifically, the step groove 300 can be arranged around all the isolation openings, so that the inorganic encapsulation unit 500 corresponding to all the isolation openings extends into the step groove 300. Alternatively, the step groove 300 can be arranged around part of the isolation openings, and the step groove 300 is not arranged around another part of the isolation openings, so that part of the inorganic encapsulation unit 500 extends into the step groove 300, and another part of the inorganic encapsulation unit 500 does not extend into the step groove 300.

[0105] Furthermore, when the step groove 300 includes one step surface, the inorganic encapsulation unit 500 covers the step surface. When the step groove 300 includes more than one step surface, the number of step surfaces covered by the inorganic encapsulation unit 500 can be one or more than one.

[0106] In the embodiment, the step groove 300 is arranged to at least penetrate part of the isolation structure 200. The step groove 300 includes at least two grooves which are in communication with each other, and the adjacent two grooves have a step surface. At this time, the surface area of the isolation structure 200 outside the isolation opening can be effectively increased. Meanwhile, at least part of the inorganic encapsulation unit 500 is arranged to extend from the isolation opening into the step groove 300 and cover at least one step surface, thereby increasing the encapsulation area of the inorganic encapsulation unit 500, so that the encapsulation effect can be effectively improved.

[0107] And, when the display panel is in a force condition (especially a folding condition), the inorganic encapsulation unit 500 is arranged to extend from the isolation opening into the step groove 300 and cover at least one step surface, so that the stress generated by the inorganic encapsulation unit 500 corresponding to each isolation opening can be dispersed in the isolation opening and the step groove 300, preventing stress concentration on the side wall of the isolation opening, thereby effectively preventing the inorganic encapsulation unit 500 from breaking, so that the inorganic encapsulation unit 500 can play a better function of preventing oxygen and water from invading, thereby further improving the encapsulation reliability.

[0108] In one embodiment, referring to Figure 1 , the display panel further comprises an organic encapsulation layer 600. The organic encapsulation layer 600 covers the inorganic encapsulation unit 500. Specifically, the organic encapsulation layer 600 can cover the inorganic encapsulation unit 500 corresponding to each isolation opening at the same time. At the same time, the surface of the organic encapsulation unit away from the substrate 100 can be a relatively flat surface.

[0109] Exemplarily, the display panel further comprises a second inorganic encapsulation layer 700. The second inorganic encapsulation layer 700 covers the organic encapsulation layer 600. Specifically, the second inorganic encapsulation layer 700 can cover the side of the organic encapsulation unit away from the substrate 100.

[0110] The organic encapsulation layer 600 and the inorganic encapsulation unit 500 have weak bonding force between them due to the difference in materials, so they are easy to separate, which in turn affects the encapsulation effect. In the present embodiment, at least the step groove 300 penetrating part of the isolation structure 200 is arranged, and the inorganic encapsulation unit 500 is arranged to extend from the isolation opening into the step groove 300 and cover at least one step surface, so as to effectively increase the bonding area between the organic encapsulation layer 600 and each inorganic encapsulation unit 500, thereby effectively increasing the bonding strength between the organic encapsulation layer 600 and each inorganic encapsulation unit 500, preventing cracks between the organic encapsulation layer 600 and the inorganic encapsulation unit 500, thereby further improving the encapsulation effect.

[0111] In one embodiment, referring to Figure 1 , part of the structure of the inorganic encapsulation unit 500 extends to the side wall of the step groove 300 away from its corresponding isolation opening. At this time, the edge of the inorganic encapsulation unit 500 located in the step groove 300 can be in contact with the side wall of the step groove 300.

[0112] In the display panel manufacturing process, the patterning of each sub-pixel is realized by a photolithography process. Specifically, after the formation of the isolation opening and the step groove 300, a material layer of the light-emitting structure 410 can be deposited on the entire surface by an evaporation process. The material layer of the light-emitting structure 410 is interrupted by the eaves of the isolation structure 200 in the isolation opening. Then, on the material layer of the light-emitting structure 410, a material layer of the inorganic encapsulating unit 500 is formed on the entire surface of the material layer of the light-emitting structure 410 and the isolation structure 200 not covered by the material layer of the light-emitting structure 410 by a chemical vapor deposition process. After that, a patterned photoresist is formed on the material layer of the inorganic encapsulating unit 500. The patterned photoresist covers the isolation opening corresponding to the color sub-pixel being processed and extends into the corresponding step groove 300. Then, based on the patterned photoresist, dry etching is performed on the material layer of the inorganic encapsulating unit 500 to form the corresponding inorganic encapsulating unit 500. The inorganic encapsulating unit 500 extends from the isolation opening into the step groove 300. The edge of the inorganic encapsulating unit 500 located in the step groove 300 can be in contact with the sidewall of the step groove 300.

[0113] After that, wet etching is performed on the material layer of the light-emitting structure 410 to form the light-emitting structure 410. In this process, since the edge of the inorganic encapsulating unit 500 located in the step groove 300 is in contact with the sidewall of the step groove 300, the material layer of the light-emitting structure 410 below the inorganic encapsulating unit 500 in the step groove 300 can be completely covered and thus will not be removed by wet etching. Therefore, in the final product structure, no gap space will be formed between the inorganic encapsulating unit 500 and the step groove 300 due to the removal of the material layer of the light-emitting structure 410, thereby improving the structural stability of the product. It can be understood that in the embodiment of the present application, the light-emitting structure 410 is located not only in the isolation opening but also in the step groove 300. However, the light-emitting structure 410 located in the step groove 300 is disconnected from the light-emitting structure 410 located in the isolation opening, thereby not affecting the normal light emission of the light-emitting device.

[0114] At the same time, the extension of the inorganic encapsulating unit 500 to the sidewall of the step groove 300 away from the corresponding isolation opening can also make the inorganic encapsulating unit 500 in the step groove 300 have a larger bonding area with the organic encapsulating unit, thereby increasing the bonding force between them.

[0115] Specifically, please refer to Figure 1 and Figure 2The step groove 300 includes at least two recesses which are in communication with each other. The edge of the inorganic packaging unit 500 can fall on the sidewall of any one of the recesses. Meanwhile, when the edge of the inorganic packaging unit 500 located in the step groove 300 is in contact with the sidewall of the step groove 300, the edge of the inorganic packaging unit 500 can just contact the sidewall of the step groove 300, or can contact the sidewall of the step groove 300 after contacting the sidewall of the step groove 300 and then climb up the sidewall of the step groove 300 to contact at least part of the sidewall of the step groove 300.

[0116] Exemplarily, referring to Figure 2 The step groove 300 includes a first recess 310 and a second recess 320 which are arranged in sequence in the direction away from the substrate 100. The edge of the inorganic packaging unit 500 can fall on the sidewall of the first recess 310. And the sidewall of the first recess 310 is in contact with the edge of the inorganic packaging unit 500. Alternatively, referring to Figure 1 The edge of the inorganic packaging unit 500 can fall on the sidewall of the second recess 320. And the sidewall of the second recess 320 is in contact with the edge of the inorganic packaging unit 500. Of course, when the sidewall of the second recess 320 is in contact with the edge of the inorganic packaging unit 500, the sidewall of the first recess 310 can also be in contact with the inorganic packaging unit 500.

[0117] Exemplarily, referring to Figure 1 or Figure 2 The sidewall of the step groove 300 is perpendicular to the plane where the substrate 100 is located. Specifically, the "sidewall of the step groove 300" here can be all the sidewalls of the recesses of the step groove 300, or can be part of the sidewalls of the recesses of the step groove 300. That is, all the sidewalls of the recesses of the step groove 300 can be perpendicular to the plane where the substrate 100 is located, or part of the sidewalls of the recesses of the step groove 300 can be perpendicular to the plane where the substrate 100 is located.

[0118] When the sidewall of the step groove 300 is perpendicular to the plane where the substrate 100 is located, the angle between the sidewall of the step groove 300 and the bottom of the step groove 300 is 90°. At this time, in the process of preparing the display panel, the material layer of the light-emitting structure 410 formed by evaporation is not easy to climb up the perpendicular sidewall of the step groove 300, so in the final product, the light-emitting structure 410 is rarely formed on the perpendicular sidewall of the step groove 300, and the light-emitting structure 410 formed on the perpendicular sidewall of the step groove 300 is in a discontinuous form. The material layer of the inorganic packaging unit 500 is formed by a chemical vapor deposition process, so it has good coverage. Therefore, by arranging the sidewall of the step groove 300 to be perpendicular to the plane where the substrate 100 is located, the edge of the inorganic packaging unit 500 located in the step groove 300 can be effectively in contact with the sidewall of the step groove 300.

[0119] Of course, the sidewall of the stepped groove 300 is not limited to be perpendicular to the plane on which the substrate 100 lies. When the angle between the sidewall of the stepped groove 300 and the bottom of the stepped groove 300 is greater than 90° and less than or equal to a preset angle, the sidewall of the stepped groove 300 is close to perpendicular to the substrate 100, so that the light-emitting structure 410 is discontinuous on the vertical sidewall of the stepped groove 300, and the inorganic packaging unit 500 contacts the sidewall of the stepped groove 300. The preset angle can be set according to actual needs, for example, can be 95°.

[0120] Alternatively, the angle between the sidewall of the stepped groove 300 and the bottom of the stepped groove 300 can also be less than 90°. At this time, the angle between the sidewall of at least one groove of the stepped groove 300 and the bottom of the stepped groove 300 is less than 90°, so that the at least one groove of the stepped groove 300 has a shape of a small mouth and a large belly. At this time, during the preparation of the display panel, at least part of the sidewall of the groove with a shape of a small mouth and a large belly will not be evaporated to the material of the light-emitting structure 410 due to the shielding of the top, so as to not be covered by the material layer of the light-emitting structure 410. The material layer of the inorganic packaging unit 500 is formed by a chemical vapor deposition process, so as to contact the sidewall of the stepped groove 300 which is not covered by the material layer of the light-emitting structure 410. For example, the angle between the sidewall of the stepped groove 300 and the bottom of the stepped groove 300 can be greater than or equal to 85° and less than 90°.

[0121] Alternatively, referring to Figure 3 , among the two adjacent grooves of the stepped groove 300, the bottom of the groove far from the substrate 100 (such as the second groove 320) is located inside the top of the groove close to the substrate 100 (such as the first groove 310) in the orthographic projection on the substrate 100. At this time, the stepped groove 300 as a whole has a shape of a small mouth and a large belly. Therefore, during the preparation of the display panel, at least part of the sidewall of the groove close to the substrate 100 (such as the first groove 310) will not be evaporated to the material layer of the light-emitting structure 410, so as to not be covered by the material layer of the light-emitting structure 410, so that the inorganic packaging unit 500 can also contact the sidewall of the groove. At the same time, the inorganic packaging unit 500 can also cover the stepped surface at this time. It can be understood that at this time, the angle between the sidewall of the stepped groove 300 and the bottom of the stepped groove 300 can not be limited.

[0122] The material of the isolation structure 200 is usually metal. The material of the light-emitting structure 410 is usually organic material. The inorganic packaging unit 500 contacts the sidewall of the stepped groove 300, which can effectively improve the binding force and the binding strength of the inorganic packaging unit 500 and the isolation structure 200 directly, so as to effectively improve the packaging effect, compared with the inorganic packaging unit 500 completely contacting and covering the sidewall of the stepped groove 300.

[0123] In one embodiment, the stepped groove 300 comprises a first groove 310 and a second groove 320 which are in communication with each other, and the first groove 310 is located on the side of the second groove 320 close to the substrate 100.

[0124] Please refer to Figure 1 or Figure 2 , the top of the first groove 310 is projected on the substrate 100 inside the bottom of the second groove 320. Alternatively, please refer to Figure 3 , the bottom of the second groove 320 is projected on the substrate 100 inside the top of the first groove 310.

[0125] Meanwhile, the depth of the first groove 310 is greater than the thickness of the light emitting structure 410.

[0126] Exemplarily, the light emitting structure 410 comprises a light emitting layer 411 and a first electrode 412. The first electrode 412 is located on the side of the light emitting layer 411 away from the substrate 100 and is electrically connected to the isolation structure 200. At this time, the depth of the first groove 310 can be greater than the total thickness of the light emitting layer 411 and the first electrode 412.

[0127] Exemplarily, the light emitting structure 410 further comprises a light extraction layer (not shown). The light extraction layer is located on the side of the first electrode 412 away from the substrate 100. At this time, the depth of the first groove 310 can be greater than the total thickness of the light emitting layer 411, the first electrode 412 and the light extraction layer.

[0128] In the present embodiment, the depth of the first groove 310 is greater than the thickness of the light emitting structure 410. Therefore, in the stepped groove 300, the light emitting structure 410 will not fill the first groove 310. Therefore, the part of the inorganic packaging unit 500 in the stepped groove 300 can be in contact with the sidewall of the first groove 310, thereby improving the bonding strength between the inorganic packaging unit 500 and the isolation structure 200, thereby improving the packaging effect.

[0129] In one embodiment, please refer to Figure 4 , the plurality of inorganic packaging units 500 comprises a first packaging unit 510 and a second packaging unit 520. The first packaging unit 510 and the second packaging unit 520 cover the light emitting structures 410 for emitting different colors of light located in different isolation openings.

[0130] In the same area where the stepped groove 300 is located, the second packaging unit 520 is in contact with the first packaging unit 510. At this time, the inorganic packaging units 500 corresponding to different isolation openings can be in contact with each other, thereby improving the water and oxygen resistance of each inorganic packaging unit 500, thereby improving the packaging reliability.

[0131] In one embodiment, please refer toFigure 4 Or Figure 5 In the same area where the step groove 300 is located, part of the structure of the second packaging unit 520 is located on the side of the first packaging unit 510 away from the substrate 100, and the second packaging unit 520 is overlapped with the part of the first packaging unit 510 covering the sidewall of the step groove 300.

[0132] Specifically, the plurality of isolation openings in the isolation structure 200 can include a first isolation opening and a second isolation opening. In the process of preparing the display panel, the first light-emitting structure corresponding to the first isolation opening and the first packaging unit 510 can be formed first. Then, the second light-emitting structure corresponding to the second isolation opening and the second packaging unit 520 can be formed.

[0133] Exemplarily, the sidewall of the step groove 300 can be perpendicular or close to perpendicular to the substrate 100, so that there are few and discontinuous first light-emitting structures on the sidewall of the step groove 300, so that the first packaging unit 510 can cover and contact the sidewall of the step groove 300. At the same time, the part of the first packaging unit 510 covering the sidewall of the step groove 300 can be perpendicular or close to perpendicular to the substrate 100. The part of the first packaging unit 510 covering the sidewall of the step groove 300 is referred to as the first covering part, and the first covering part can be perpendicular or close to perpendicular to the substrate 100. At this time, the second packaging unit 520 can extend to cover the first covering part of the first packaging unit 510. And since the first covering part is perpendicular or close to perpendicular to the substrate 100, there are few and discontinuous first light-emitting structures on the first covering part. Therefore, the second packaging unit 520 can cover and contact the first covering part, so that effective overlap of the second packaging unit 520 and the first packaging unit 510 can be achieved.

[0134] It can be understood that the "first covering part" of the first packaging unit 510 described above can cover the sidewall of the step groove 300 away from the corresponding isolation opening, and / or cover the sidewall of the step groove 300 close to the corresponding isolation opening. The present application does not limit this.

[0135] At the same time, the step groove 300 includes at least two grooves in communication with each other. The sidewall of the step groove 300 covered by the above-mentioned "first covering part" can be the sidewall of any one or several grooves.

[0136] Exemplarily, the step groove 300 includes a first groove 310 and a second groove 320 in communication with each other. The first groove 310 is located on the side of the second groove 320 close to the substrate 100.

[0137] Please refer to Figure 4The edge of the second packaging unit 520 is overlapped with the portion of the first packaging unit 510 covering the side wall of the second groove 320, so as to realize the overlap of the second packaging unit 520 and the portion of the first packaging unit 510 covering the side wall of the step groove 300.

[0138] Alternatively, please refer to Figure 5 The edge of the second packaging unit 520 is overlapped with the portion of the first packaging unit 510 covering the side wall of the second groove 320, so as to realize the overlap of the second packaging unit 520 and the portion of the first packaging unit 510 covering the side wall of the step groove 300.

[0139] Of course, in other embodiments, the connection mode of the second packaging unit 520 and the first packaging unit 510 is not limited to this. For example, the step groove 300 includes the first groove 310 and the second groove 320 arranged in sequence away from the substrate 100. The orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100. Alternatively, the angle between the side wall of the first groove 310 and the bottom of the first groove 310 is less than 90°, and the orthographic projection of the top of the first groove 310 on the substrate 100 is located inside the orthographic projection of the bottom of the first groove 310 on the substrate 100. In these cases, there is a shielding structure above the edge area of the bottom of the first groove 310. In at least part of the shielded area of the first groove 310, the light-emitting structure 410 formed by the evaporation process cannot enter. At the same time, the first packaging unit 510 and the second packaging unit 520 can be formed by a chemical vapor deposition process. Therefore, the first packaging unit 510 and the second packaging unit 520 can also be connected in at least part of the shielded area of the first groove 310.

[0140] In other embodiments, please refer to Figure 6 The end of the second packaging unit 520 can also not be overlapped with the first packaging unit 510. And the end of the second packaging unit 520 can be spaced apart from the first packaging unit 510 in the direction perpendicular to the substrate.

[0141] In one embodiment, please refer to Figure 4 Or Figure 5 The plurality of inorganic packaging units 500 further include a third packaging unit 530. The first packaging unit 510, the second packaging unit 520, and the third packaging unit 530 respectively cover the light-emitting structures 410 for emitting different colors of light located in different isolation openings.

[0142] Specifically, the plurality of isolation openings in the isolation structure can include a first isolation opening and a second isolation opening. In the display panel manufacturing process, the first light-emitting structure and the first encapsulation unit 510 corresponding to the first isolation opening can be formed first. Then, the second light-emitting structure and the second encapsulation unit 520 corresponding to the second isolation opening can be formed. Then, the third light-emitting structure and the third encapsulation unit 530 corresponding to the third isolation opening can be formed. The materials of the light-emitting layers 411 of the first light-emitting structure, the second light-emitting structure, and the third light-emitting structure are different.

[0143] Meanwhile, the third encapsulation unit 530 and the second encapsulation unit 520 are respectively located on the two sides of the first encapsulation unit 510.

[0144] In the same step groove 300 area, the third encapsulation unit 530 and the first encapsulation unit 510 are in contact. The third encapsulation unit 530 can be set in a similar manner to the second encapsulation unit 520, which will not be repeated here.

[0145] In this embodiment, the first encapsulation unit 510, the second encapsulation unit 520, and the third encapsulation unit 530 respectively cover the light-emitting structures 410 for emitting different colors of light located in different isolation openings. Meanwhile, the third encapsulation unit 530 and the second encapsulation unit 520 are respectively located on the two sides of the first encapsulation unit 510, so as to facilitate the effective lap joint of various color corresponding inorganic encapsulation units 500, thereby improving the bonding force and packaging reliability of the inorganic encapsulation unit 500.

[0146] In one embodiment, please refer to Figure 1 The display panel further includes a pixel definition layer 800. The pixel definition layer 800 is located between the isolation structure 200 and the substrate 100. The pixel definition layer 800 encloses a plurality of pixel openings. The pixel opening and the corresponding isolation opening are in communication. The light-emitting structure 410 can be located in the pixel opening and the isolation opening.

[0147] Exemplarily, the pixel opening and the isolation opening can be one-to-one correspondence. The orthographic projection of the pixel opening on the substrate 100 can be located inside the orthographic projection of the isolation opening on the substrate 100.

[0148] Meanwhile, the pixel opening and the second electrode 420 can be one-to-one correspondence. The pixel opening can expose the upper surface of the second electrode 420 corresponding thereto, or can completely expose the upper surface of the second electrode 420.

[0149] The pixel definition layer 800 can be a single-layer structure or a multi-layer structure.

[0150] Exemplarily, the pixel definition layer includes a plurality of sub-layers, and the plurality of sub-layers include a first sub-layer and a second sub-layer which are sequentially stacked in a direction away from the array substrate 100, that is, the pixel definition layer can adopt a double-layer design.

[0151] Exemplarily, the film-forming property of the first sub-layer is better than that of the second sub-layer. That is, under the condition of equal thickness, the first sub-layer can better cover the step structure formed by the second electrode 420 and will not produce cracks. Conversely, to obtain the same step coverage effect, the thickness of the first sub-layer is required to be thinner than that of the second sub-layer, that is, the thickness requirement of the first sub-layer is relatively low, which is beneficial to product thinning, and in addition, good film-forming property means good coverage of the formed film and is more conducive to water vapor isolation.

[0152] Exemplarily, the etching resistance of the second sub-layer is better than that of the first sub-layer. Since the side of the pixel definition layer 800 away from the substrate 100 will be etched in the process of preparing the display panel, by selecting a material with stronger etching resistance as the second sub-layer, the etching resistance of the pixel definition layer 800 can be improved, and the reliability of the display panel is further improved.

[0153] Exemplarily, the materials of the first sub-layer and the second sub-layer are different. For example, the material of the first sub-layer includes silicon nitride, and the material of the second sub-layer includes silicon oxide.

[0154] Exemplarily, the thickness of the first sub-layer is greater than or equal to 1000 microns and less than or equal to 5000 microns. For example, the thickness of the first sub-layer is 1000 microns, 2000 microns, 3000 microns, 4000 microns, 5000 microns, etc.

[0155] Exemplarily, the thickness of the second sub-layer is greater than or equal to 500 microns and less than or equal to 3000 microns. For example, the thickness of the second sub-layer is 500 microns, 1000 microns, 2000 microns, 3000 microns, etc.

[0156] Meanwhile, the step groove 300 exposes the pixel definition layer 800.

[0157] The material of the pixel definition layer 800 can include an inorganic material. Meanwhile, the planarization layer and the like in the substrate 100 can be an organic material. The pixel definition layer 800 can isolate water and oxygen in the planarization layer and the like organic material, preventing them from entering the light-emitting device.

[0158] In this embodiment, the step groove 300 exposes the pixel definition layer 800, without affecting the water and oxygen diffusion prevention performance of the pixel definition layer 800, so that the reliability of the light-emitting device can be ensured.

[0159] In one embodiment, please refer to Figure 7 or Figure 8The substrate 100 includes an organic layer. The display panel further includes an inorganic layer. The inorganic layer covers the organic layer. The isolation structure 200 is located on a side of the inorganic layer away from the substrate 100.

[0160] Exemplarily, the organic layer can include a planarization layer. When the substrate 100 includes a plurality of planarization layers, the organic layer can include at least a planarization layer located on a top layer.

[0161] Exemplarily, the inorganic layer can include a pixel definition layer 800.

[0162] Exemplarily, the display panel can further include an inorganic protective layer. The inorganic layer can include the inorganic protective layer.

[0163] Specifically, the inorganic protective layer is located on a side of the planarization layer away from the substrate 100. The second electrode 420 can be located on a side of the inorganic protective layer away from the substrate 100. The pixel definition layer 800 can cover the second electrode 420 and the inorganic protective layer. During the preparation of the display panel, the second electrode 420 exposed by the isolation opening can be damaged due to undergoing multiple etching processes. The inorganic protective layer under the second electrode 420 can prevent water vapor in the underlying organic material such as the planarization layer from invading the light-emitting structure 410 when the second electrode 420 is damaged.

[0164] The step groove 300 exposes the inorganic layer. Part of the structure of the inorganic encapsulation unit 500 contacts the inorganic layer in the step groove 300, so that the connection between the inorganic material and the inorganic material can be achieved, thereby improving the film layer bonding strength of the inorganic encapsulation unit 500 and improving the encapsulation reliability performance.

[0165] In one embodiment, the step groove 300 penetrates through the isolation structure 200 and the inorganic layer and extends into the organic layer, and the inorganic encapsulation unit 500 connects the inorganic layer side wall and / or bottom. It can be understood that the "inorganic layer side wall" here is the side part of the inorganic layer exposed by the step groove 300 and facing the step groove 300. The bottom of the inorganic layer can be the lower surface part of the inorganic layer on the side of the substrate exposed by the step groove 300.

[0166] Exemplarily, referring to Figure 7 or Figure 8 The step groove 300 includes the first groove 310 and the second groove 320 which are in communication with each other. The first groove 310 is located on a side of the second groove 320 close to the substrate 100. Meanwhile, the side wall of the step groove 300 is perpendicular or close to perpendicular to the substrate 100.

[0167] At this time, the bottom of the stepped groove 300 has a step difference with the inorganic layer. Therefore, in the case that the light emitting structure 410 covers the bottom of the stepped groove 300, the inorganic packaging unit 500 can cover the light emitting structure 410 and be in contact with the sidewall of the inorganic layer. Illustratively, at this time, the orthographic projection of the top of the first recess 310 on the substrate 100 can be inside the orthographic projection of the bottom of the second recess 320 on the substrate 100. Of course, the orthographic projection of the bottom of the second recess 320 on the substrate 100 can also be inside the orthographic projection of the top of the first recess 310 on the substrate 100.

[0168] Illustratively, referring to Figure 8 , the stepped groove 300 includes the first recess 310 and the second recess 320 which are in communication with each other. The first recess 310 is located on the side of the second recess 320 close to the substrate 100. The orthographic projection of the bottom of the second recess 320 on the substrate 100 is inside the orthographic projection of the top of the first recess 310 on the substrate 100.

[0169] At this time, the first recess 310 extends transversely relative to the second recess 320, and the transversely extending area is provided with a shielding structure, thereby forming a shielded area of the first recess 310. The inorganic packaging unit 500 can extend into the shielded area, thereby being in contact with the bottom of the inorganic layer (such as the bottom of the pixel definition layer 800 or the bottom of the inorganic protective layer). Illustratively, the sidewall of the stepped groove 300 is perpendicular or close to perpendicular to the substrate 100. At this time, the inorganic packaging unit 500 can be in contact with the sidewall and the bottom of the inorganic layer at the same time.

[0170] In one embodiment, referring to Figure 3 , of the at least two recesses of the stepped groove 300, the recess (such as the first recess 310) closest to the substrate exposes the top of the inorganic layer, i.e., exposes the top of the pixel definition layer 800 in the figure. And the recess (such as the second recess 320) adjacent to it has an orthographic projection on the substrate 100 inside the orthographic projection of the recess (such as the first recess 310) closest to the substrate on the substrate 100.

[0171] Part of the structure of the inorganic packaging unit 500 is in contact with the top of the inorganic layer in the stepped groove 300.

[0172] Illustratively, the stepped groove 300 includes the first recess 310 and the second recess 320 which are in communication with each other. The first recess 310 is located on the side of the second recess 320 close to the substrate 100. The orthographic projection of the bottom of the second recess 320 on the substrate 100 is inside the orthographic projection of the top of the first recess 310 on the substrate 100.

[0173] Meanwhile, the bottom of the first groove 310 exposes the top of the inorganic layer (such as the top of the pixel definition layer 800). Therefore, the inorganic packaging unit 500 can contact the top of the inorganic layer in the step groove 300.

[0174] Specifically, the isolation structure 200 can include, for example, a base 210, an isolation portion 220, and a barrier portion 230 stacked in a direction away from the substrate 100. The second groove 320 can pass through the barrier portion 230 and the isolation portion 220. The first groove 310 can pass through the base 210, thereby exposing the inorganic layer (such as the pixel definition layer 800).

[0175] In one embodiment, referring to Figure 9 Also provided is a method for manufacturing a display panel, comprising:

[0176] In step S10, the substrate 100 can include a substrate, a pixel circuit layer, and a planarization layer.

[0177] In step S20, a material layer of the isolation structure 200 can be formed first. Then, the material layer of the isolation structure 200 is etched to form the isolation structure 200.

[0178] In step S30, the isolation structure 200 is etched at least twice to form a step groove 300 on at least one side of the isolation opening. The step groove 300 includes at least two grooves that are in communication with each other, and the adjacent two grooves have a step surface therebetween.

[0179] In step S40, at least part of the light-emitting structure 410 is formed in the corresponding isolation opening, and the inorganic packaging unit 500 covering the light-emitting structure 410 is formed. At least part of the inorganic packaging unit 500 extends from the corresponding isolation opening into the step groove 300 and covers at least one step surface.

[0180] In step S10, the substrate 100 can include a substrate, a pixel circuit layer, and a planarization layer.

[0181] The substrate can include a flexible substrate or a rigid substrate. The pixel circuit layer is located on one side of the substrate and includes a pixel circuit for driving the light-emitting device to emit light. The pixel circuit can include transistors, storage capacitors, and the like. The pixel circuit can include 7T1C, 8T1C pixel circuits, and the like. In addition, the pixel circuit layer further includes at least one insulating layer, which can isolate adjacent conductive layers in the pixel circuit layer and can include at least one of an inorganic layer and an organic layer. The planarization layer is located on the side of the pixel circuit layer away from the substrate. For example, at least one rewiring layer can be provided on the pixel circuit layer. Each rewiring layer can be covered by a layer of planarization layer.

[0182] In step S20, a material layer of the isolation structure 200 can be formed first. Then, the material layer of the isolation structure 200 is etched to form the isolation structure 200.

[0183] Exemplarily, before the isolation structure 200 is formed, a plurality of second electrodes 420 can be formed on the side of the planarization layer of the top layer away from the substrate.

[0184] The plurality of isolation openings can be arranged one-to-one with the plurality of second electrodes 420. Each isolation opening can expose a corresponding second electrode 420. Exemplarily, each isolation opening can expose a part of the upper surface of the corresponding second electrode 420. Alternatively, each isolation opening can also expose the entire upper surface of the corresponding second electrode 420. Here, the upper surface of the second electrode 420 can be the surface of the second electrode 420 away from the substrate 100.

[0185] Exemplarily, the isolation structure 200 can include the isolation portion 220 and the barrier portion 230 arranged in a stacked manner in a direction away from the substrate 100 (i.e., the Z direction).

[0186] The edge of the barrier portion 230 facing the isolation opening can be arranged protruding compared to the side of the isolation portion 220 facing the isolation opening, thereby forming a hanging eave shape towards the isolation opening. The materials of the isolation portion 220 and the barrier portion 230 can be different. The material of the isolation portion 220 can include a conductive material, and specifically can include at least one of aluminum (Al) and an aluminum alloy, which can include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The barrier portion 230 can be a single-layer structure or a multi-layer structure. In the case of a single-layer structure, the material of the barrier portion 230 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. In the case of a multi-layer structure, one layer of the barrier portion 230 includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and another layer of the barrier portion 230 can include a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0187] Exemplarily, the isolation structure 200 can include the base portion 210, the isolation portion 220, and the barrier portion 230 arranged in a stacked manner in a direction away from the substrate 100.

[0188] The base portion 210 is arranged protruding in a direction facing the isolation opening relative to the isolation portion 220. The material of the base portion 210 can include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0189] Exemplarily, before the isolation structure 200 is formed in step S20, a material layer of a pixel definition layer 800 covering the plurality of second electrodes 420 can also be formed.

[0190] Then, after the isolation structure 200 is formed, the material layer of the pixel definition layer 800 can be etched based on the respective isolation openings, so as to form pixel openings communicating with the isolation openings.

[0191] Exemplarily, the isolation structure 200 encloses a plurality of isolation openings. The plurality of isolation openings can include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings.

[0192] The pixel definition layer 800 encloses a plurality of pixel openings. The plurality of pixel openings can include first pixel openings communicating with the first isolation openings, second pixel openings communicating with the second isolation openings, and third pixel openings communicating with the third isolation openings. The areas of the orthographic projections of the first pixel openings, the second pixel openings, and the third pixel openings on the substrate 100 are the same or different. The shapes of the orthographic projections of the pixel openings and the corresponding isolation openings on the substrate 100 can be the same or different. Generally, the area of the orthographic projection of an isolation opening on the substrate 100 is greater than the area of the orthographic projection of the pixel opening communicating with the isolation opening on the substrate 100. The orthographic projection of the pixel opening of the light emitting device on the substrate 100 overlaps with the orthographic projection of the isolation opening on the array substrate 100. The material of the pixel definition layer 800 can be an inorganic material, for example, the pixel definition layer 800 is formed by using an inorganic insulating material of at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0193] In step S30, the isolation structure 200 can be etched at least twice by a photolithography process or the like, or the isolation structure 200 and the structure thereunder can be etched at least twice, so as to form the step groove 300.

[0194] In step S40, the material layer of the light emitting structure 410 can be uniformly deposited by a deposition process. The material layer of the light emitting structure 410 is blocked by the eaves of the isolation structure 200 in the isolation openings. Then, on the material layer of the light emitting structure 410, a material layer of the inorganic encapsulation unit 500 is formed on the material layer of the light emitting structure 410 and the isolation structure 200 not covered by the material layer of the light emitting structure 410 by a chemical vapor deposition process. After that, a patterned photoresist is formed on the material layer of the inorganic encapsulation unit 500. The patterned photoresist covers the isolation openings corresponding to the color sub-pixels currently processed and extends into the corresponding step groove 300. After that, the material layer of the inorganic encapsulation unit 500 is dry-etched based on the patterned photoresist, so as to form the corresponding inorganic encapsulation unit 500. The inorganic encapsulation unit 500 extends from the isolation opening into the step groove 300. After that, the material layer of the light emitting structure 410 is wet-etched, so as to form the light emitting structure 410.

[0195] In the embodiment, before the light-emitting structure 410 and the inorganic packaging unit 500 are formed in the isolation opening, the isolation structure 200 is etched at least twice to form the stepped groove 300 on at least one side of the isolation opening. The stepped groove 300 includes at least two grooves in communication with each other, and a step surface between the two adjacent grooves. At this time, the surface area of the isolation structure 200 outside the isolation opening can be effectively increased. Meanwhile, the inorganic packaging unit 500 is arranged to extend from the isolation opening into the stepped groove 300 and cover at least one step surface, thereby increasing the packaging area of the inorganic packaging unit 500 and effectively improving the packaging effect.

[0196] When the display panel is in a stressed working condition (especially a folding working condition), the inorganic packaging unit 500 is arranged to extend from the isolation opening into the stepped groove 300 and cover at least one step surface, so that the stress generated by the inorganic packaging unit 500 corresponding to each isolation opening can be dispersed in the isolation opening and the stepped groove 300, preventing stress concentration on the side wall of the isolation opening, thereby effectively preventing the inorganic packaging unit 500 from breaking, so that the inorganic packaging unit 500 can play a better function of preventing oxygen and water from invading, thereby further improving the packaging reliability.

[0197] In one embodiment, step S30 includes:

[0198] Step S311, referring to Figure 10 , a first patterned photoresist 910 covering part of the isolation structure 200 and the isolation opening is formed, and the first patterned photoresist 910 has a first opening therein;

[0199] Step S312, referring to Figure 11 , the isolation structure 200 is etched based on the first opening to form a first initial groove 330;

[0200] Step S313, the first patterned photoresist 910 is removed;

[0201] Step S314, referring to Figure 12 , a second patterned photoresist 920 covering part of the isolation structure 200 and the isolation opening is formed, the second patterned photoresist 920 has a second opening therein, and the orthographic projection of the first opening on the substrate 100 is located inside the orthographic projection of the second opening on the substrate 100;

[0202] Step S315, referring to Figure 13 , the isolation structure 200 is etched based on the second opening to form a first groove 310 corresponding to the first initial groove 330 and a second groove 320 in communication with the first groove 310.

[0203] In step S311, a first photoresist layer can be coated first. Then the first photoresist layer is exposed and developed, so as to form a first patterned photoresist 910 with a first opening.

[0204] In step S312, when etching the isolation structure 200 for the first time, anisotropic etching can be used, so as to facilitate control of the size of the first initial groove 330. The anisotropic etching can be dry etching, for example.

[0205] In step S313, the first patterned photoresist 910 is removed by a stripping process.

[0206] In step S314, a second photoresist layer can be coated first. Then the second photoresist layer is exposed and developed, so as to form a second patterned photoresist 920 with a second opening.

[0207] In step S315, when etching the isolation structure 200 for the second time, anisotropic etching can also be used, so as to facilitate control of the degree of the second etching, and thus facilitate control of the size of the final first groove 310 and second groove 320. The anisotropic etching can be dry etching, for example.

[0208] At this time, the top of the first groove 310 in the orthographic projection on the substrate 100 can be located inside the bottom of the second groove 320 in the orthographic projection on the substrate 100.

[0209] In one embodiment, step S30 comprises:

[0210] In step S321, a third patterned photoresist covering part of the isolation structure 200 and the isolation opening is formed, and the third patterned photoresist has a third opening therein.

[0211] In step S322, the isolation structure 200 is etched based on the third opening, so as to form the second groove 320.

[0212] In step S323, the isolation structure 200 is etched again based on the second groove 320, so as to form the first groove 310 below the second groove 320, and the bottom of the second groove 320 in the orthographic projection on the substrate 100 is located inside the top of the first groove 310 in the orthographic projection on the substrate 100.

[0213] In step S321, a third photoresist layer can be coated first. Then the third photoresist layer is exposed and developed, so as to form a third patterned photoresist with a third opening.

[0214] In step S322, the second groove 320 can be formed by etching based on the third opening and by an anisotropic etching method (e.g., a dry etching method), so as to facilitate control of the size and topography of the second groove 320. Of course, the second groove 320 can also be formed by etching based on the third opening and by an isotropic etching method (e.g., a wet etching method).

[0215] In step S323, when the isolation structure 200 is etched again based on the second groove 320, an isotropic etching method can be used. The isotropic etching method can be, for example, a wet etching method, so that the orthographic projection of the bottom of the second groove 320 on the substrate 100 is located inside the orthographic projection of the top of the first groove 310 on the substrate 100.

[0216] After step S323, the third patterned photoresist can be removed by a stripping process.

[0217] The isolation structure 200 can include, for example, a base portion 210, an isolation portion 220, and a barrier portion 230 stacked in a direction away from the substrate 100. In step S322, when the isolation structure 200 is etched based on the third opening, the base portion 210 and the isolation portion 220 can be dry etched, so as to form the second groove 320. In step S323, when the isolation structure 200 is etched again based on the second groove 320, the base portion 210 can be wet etched, so as to form the first groove 310. At this time, the second groove 320 can pass through the barrier portion 230 and the isolation portion 220. The first groove 310 can pass through the base portion 210.

[0218] In one embodiment, a display device is also provided, and the display device includes the display panel in the present application. The display device can include a device having image processing capability, such as a mobile phone, a desktop computer, a notebook computer, a tablet computer, a vehicle display, a wearable device, etc. Since the display device includes the display panel in the present application, the reliability of the electronic device is higher.

[0219] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but it should be considered that any combination of the technical features is within the scope of the present disclosure as long as the combination does not cause contradiction.

[0220] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; an isolation structure located on one side of the substrate and enclosing a plurality of isolated openings; a stepped groove located on at least one side of the isolated opening and extending through at least part of the isolation structure, the stepped groove comprising at least two recesses in communication with each other, and a step surface between adjacent two recesses; a plurality of light-emitting structures, at least part of the light-emitting structures being located in the corresponding isolated opening; a plurality of inorganic encapsulation units covering the corresponding light-emitting structures, and at least part of the inorganic encapsulation units extending into the stepped groove from the corresponding isolated opening and covering at least one step surface; the plurality of inorganic encapsulation units comprising a first encapsulation unit and a second encapsulation unit, the first encapsulation unit and the second encapsulation unit covering light-emitting structures for emitting different colors of light located in different isolated openings, in the same area where the stepped groove is located, the second encapsulation unit is in contact with the first encapsulation unit; in the same area where the stepped groove is located, part of the structure of the second encapsulation unit is located on the side of the first encapsulation unit away from the substrate, and the second encapsulation unit overlaps with the part of the first encapsulation unit covering the sidewall of the stepped groove.

2. The display panel of claim 1, wherein, The display panel further comprises: an organic encapsulation layer covering the inorganic encapsulation units; The display panel further comprises: a second inorganic encapsulation layer covering the organic encapsulation layer.

3. The display panel of claim 1, wherein part of the structure of the inorganic encapsulation unit extends to the sidewall of the stepped groove away from the corresponding isolated opening.

4. The display panel of claim 3, wherein, The sidewall of the stepped groove is perpendicular to the plane where the substrate is located.

5. The display panel of claim 1, wherein, The stepped groove comprises a first recess and a second recess in communication with each other, the first recess is located on the side of the second recess close to the substrate, and the top of the first recess is inside the bottom of the second recess in the orthogonal projection on the substrate.

6. The display panel of claim 1, wherein, The stepped groove comprises a first recess and a second recess in communication with each other, the first recess is located on the side of the second recess close to the substrate, and the bottom of the second recess is inside the top of the first recess in the orthogonal projection on the substrate.

7. The display panel of claim 5 or 6, wherein, The depth of the first recess is greater than the thickness of the light-emitting structure. The light-emitting structure comprises a light-emitting layer and a first electrode, the first electrode is located on the side of the light-emitting layer away from the substrate and is electrically connected to the isolation structure; The light-emitting structure further comprises a light extraction layer, the light extraction layer is located on the side of the first electrode away from the substrate; The display panel further comprises a plurality of second electrodes arranged at intervals, the second electrodes are located on the side of the isolation structure close to the substrate, the isolated opening exposes at least part of the corresponding second electrode, and the light-emitting layer covers the corresponding second electrode.

8. The display panel of claim 1, wherein, The stepped groove comprises a first recess and a second recess in communication with each other, the first recess is located on the side of the second recess close to the substrate; An edge of the second encapsulation unit is overlapped with a portion of the first encapsulation unit covering the second recess sidewall, or an edge of the second encapsulation unit is overlapped with a portion of the first encapsulation unit covering the first recess sidewall.

9. The display panel of claim 1, wherein, The plurality of inorganic encapsulation units further comprises a third encapsulation unit, the first, second and third encapsulation units respectively cover light emitting structures for emitting light of different colors located in different isolation openings, and the third encapsulation unit is located on the two sides of the first encapsulation unit respectively, In the same area where the step groove is located, the third encapsulation unit is in contact with the first encapsulation unit.

10. The display panel of claim 1, wherein, The display panel further comprises a pixel definition layer, the pixel definition layer is located between the isolation structure and the substrate, and is enclosed to form a plurality of pixel openings, the pixel openings are in communication with the corresponding isolation openings; The step groove exposes the pixel definition layer.

11. The display panel of claim 1, wherein, The substrate comprises an organic layer, the display panel further comprises an inorganic layer, the inorganic layer covers the organic layer, the isolation structure is located on the side of the inorganic layer away from the substrate, The step groove exposes the inorganic layer, and part of the structure of the inorganic encapsulation unit is in contact with the inorganic layer in the step groove.

12. The display panel of claim 11, wherein, The inorganic layer comprises a pixel definition layer, and the pixel definition layer is enclosed to form a plurality of pixel openings, the pixel openings are in communication with the corresponding isolation openings; The organic layer comprises a planarization layer.

13. The display panel of claim 11, wherein, The step groove penetrates through the isolation structure and the inorganic layer and extends into the organic layer, and part of the structure of the inorganic encapsulation unit is in contact with the inorganic layer sidewall and / or bottom.

14. The display panel of claim 11, wherein, Among the at least two recesses of the step groove, the recess closest to the substrate exposes the top of the inorganic layer, and the normal projection of the recess adjacent to it on the substrate is located inside the normal projection of the recess closest to the substrate on the substrate, Part of the structure of the inorganic encapsulation unit is in contact with the top of the inorganic layer in the step groove.

15. A method for manufacturing a display panel, characterized by, Comprising: providing a substrate; forming an isolation structure on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; performing at least two etchings on the isolation structure to form a step groove on at least one side of the isolation opening, the step groove comprising at least two recesses in communication with each other, and a step surface between adjacent two recesses; forming at least part of the structure of the light emitting structure in the corresponding isolation opening, and forming an inorganic encapsulation unit covering the corresponding light emitting structure, at least part of the inorganic encapsulation unit extending from the corresponding isolation opening into the step groove and covering at least one step surface; the at least two etchings on the isolation structure to form a step groove on at least one side of the isolation opening, comprising: forming a first patterned photoresist covering part of the isolation structure and the isolation opening, the first patterned photoresist having a first opening therein; performing a first etching on the isolation structure based on the first opening to form a first initial groove; removing the first patterned photoresist; forming a second patterned photoresist covering the partial structure of the isolation structure and the isolation opening, the second patterned photoresist having a second opening therein, a footprint of the first opening on the substrate being inside a footprint of the second opening on the substrate; performing a second etching on the isolation structure based on the second opening to form a first recess corresponding to the first initial groove and a second recess in communication with the first recess.

16. The method of producing a display panel according to claim 15, wherein The performing the at least two etchings on the isolation structure to form the stepped groove on at least one side of the isolation opening comprises: forming a third patterned photoresist covering the partial structure of the isolation structure and the isolation opening, the third patterned photoresist having a third opening therein; performing an etching on the isolation structure based on the third opening to form a second recess; performing a second etching on the isolation structure based on the second recess to form a first recess below the second recess, a footprint of a bottom of the second recess on the substrate being inside a footprint of a top of the first recess on the substrate.

17. A display device comprising: A display panel formed by the method of any one of claims 1 to 14 or the method of any one of claims 15 to 16.

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