Converter, converter cabinet and computer program product with improved cooling

Abstract

The invention relates to a converter (10) comprising a plurality of semiconductor switches (12) and an energy storage device (14). The converter (10) also has a DC bus system (16), a first heat sink (22) for dissipating heat of the semiconductor switch (12), and a second heat sink (24) for dissipating heat of the energy storage device (14). The first and second heat sinks (22, 24) are mechanically connected to each other. According to the invention, the first and second heat sinks (22, 24) are arranged offset from one another in the assembly direction (25) of the converter (10). The invention also relates to a converter cabinet (50) comprising a wall panel (52), in the interior of which at least one converter (10) is arranged. According to the invention, the converter (10) is designed according to one embodiment of the claimed converter (10). Likewise, the invention relates to a computer program product (60) containing instructions which, when the computer program product (60) is executed by a computer, cause the computer to simulate the operating behavior of the converter (10) in which a heat release is achieved. According to the invention, the simulated converter (10) is designed according to one embodiment of the claimed converter (10).

Description

Technical Field

[0001] The present invention relates to a converter with improved cooling and a converter cabinet having such a converter. The present invention also relates to a computer program product for simulating the operating behavior of such a converter. Background Art

[0002] Patent application CN 107733242 A discloses a water-cooled converter. The converter's water cooling system is connected to a heat exchanger, through which waste heat from the converter is removed. The water cooling system includes three sub-cooling systems, each of which is connected to an IGBT arm of the converter.

[0003] European patent application EP 0 677 916 A2 discloses a rectifier device with air-cooled power semiconductors and a DC voltage intermediate circuit. The power semiconductors are arranged on the main surface of a cooling rail adjacent to two sub-capacitor banks. A plurality of cooling channels are provided in the cooling rail.

[0004] Converters are widely used in various industrial fields and power supply technologies, and the requirements for their electrical performance are constantly increasing. Consequently, there is a need for more efficient converter cooling. Simultaneously, these requirements also require simple and cost-effective manufacturing, as well as good robustness and reliability. The present invention aims to provide a converter that achieves improvements in at least one of these aspects. Summary of the Invention

[0005] This objective is achieved by a converter according to the present invention, comprising a plurality of semiconductor switches and at least one energy storage device. The converter further comprises a DC busbar system, through which at least one semiconductor switch is electrically connected to at least one energy storage device. The at least one energy storage device can be configured as a capacitor. The converter further comprises a first heat sink, through which heat can be dissipated from the semiconductor switches. The semiconductor switches can be configured as IGBTs, for example. To this end, the first heat sink is thermally connected to the semiconductor switches. The converter according to the present invention further comprises a second heat sink, through which heat can be dissipated from the energy storage device. To this end, at least one energy storage device, which can be configured as a capacitor, is thermally connected to the second heat sink. During operation of the converter, heat is dissipated substantially directly from the semiconductor switches to the first heat sink, and substantially directly from the energy storage device to the second heat sink. The first and second heat sinks are each liquid-cooled and mechanically connected. According to the present invention, the first and second heat sinks are arranged offset relative to each other along the assembly direction of the converter. The assembly direction refers to the direction along which at least one semiconductor switch is mounted on the first heat sink and / or along which at least one energy storage device is mounted on the second heat sink. This allows heat to be dissipated directly from the semiconductor switch and the at least one energy storage device via the first or second heat sink, respectively. The mechanical connection between the first and second heat sinks is formed in offset regions along the assembly direction. According to the present invention, the offset arrangement of the first and second heat sinks allows heat to be dissipated from ambient air in the environment surrounding the converter. This can suppress, for example, a rise in the temperature of the ambient air within the associated converter cabinet.

[0006] In one embodiment of the claimed converter, a detection device is disposed in the region between the first heat sink and the second heat sink along the assembly direction. The detection device can be disposed in the region on the side of the first heat sink facing away from the semiconductor switch. The detection device can be configured as a current measuring device and can be electrically connected to the semiconductor switch. Furthermore, the detection device can be connected to a control unit of the converter. The claimed converter provides a space-saving option for mounting the detection device.

[0007] In another embodiment of the converter to be protected, the first heat sink and the second heat sink are designed to be essentially planar at least in the area of ​​the semiconductor switch or the energy storage device. Therefore, the heat sink can be described as a disk-shaped body in terms of its thermal conductivity. In addition, the essentially flat heat sink is designed to be flat in the area of ​​at least one energy storage device or semiconductor switch. As a result, a large-area thermal contact can be achieved between at least one energy storage device or semiconductor switch and the respective heat sink. In addition, the planar heat sink can provide a higher cooling capacity. In addition, the first heat sink and the second heat sink can be manufactured independently of each other. For example, the first heat sink can be made of a first material and the second heat sink can be made of a second material. In addition, the first heat sink can be manufactured by a first manufacturing process and the second heat sink can be manufactured by a second manufacturing process. As a result, a higher degree of structural freedom can be achieved, allowing the heat sink to be designed in accordance with the requirements.

[0008] Furthermore, the first and second heat sinks can be arranged substantially parallel to one another. This should be understood to mean that at least one planar area of ​​each heat sink, preferably the largest planar area, is arranged substantially parallel to one another. This allows for a predefined substantially rectangular area within which the hydraulic connection between the first and second heat sinks is formed. Furthermore, the parallel arrangement of the first and second heat sinks allows for simplified installation of the converter.

[0009] Furthermore, cooling channels for a cooling fluid to flow through may be formed in each of the first and / or second heat sinks. The cooling fluid may be a liquid, through which liquid cooling is provided to the first and second heat sinks. The first and second heat sinks may be forcedly cooled by the cooling fluid itself, in particular, forcedly cooled from the inside. This ensures efficient heat dissipation from the first and / or second heat sinks. The cooling fluid in the heat sinks allows these heat sinks to dissipate heat to a heat sink, in particular, a heat sink structurally separate from the converter, such as a heat sink located outside a converter cabinet housing the converter. The cooling channels within the heat sinks may be hydraulically connected or hydraulically separated. Through the hydraulically connected cooling channels, the first and second heat sinks can dissipate heat together. Heat losses from at least one energy storage device or semiconductor switch can thus be dissipated by the cooling fluid. Hydraulically connected cooling channels also constitute a thermally conductive connection between the heat sinks. Alternatively, hydraulically separated cooling channels allow for separate heat dissipation from the heat sinks. Thus, each heat sink can be optimally designed for the expected waste heat from at least one energy storage device or semiconductor switch. This allows a demand-based, material- and weight-saving structural design of the heat sink.

[0010] In another embodiment of the claimed converter, a gap is formed between the first heat sink and the second heat sink. This gap is configured to allow ambient air (e.g., ambient air inside the converter cabinet) to circulate for heat dissipation. The ambient air can, in particular, be air that directly contacts the claimed converter. During normal operation, the ambient air may be heated by the converter's residual heat, potentially causing a harmful increase in the ambient air temperature inside the converter cabinet. A thermal connection can be formed between the first and second heat sinks in the gap, allowing ambient air from the converter to circulate through the first and / or second heat sinks for heat dissipation. The gap, at least partially defined by the first and second heat sinks, can be configured as an air duct. Thus, the gap is designed to provide an increased surface area for heat dissipation from the converter's ambient air. This overall provides efficient and compact heat dissipation for the converter and its ambient air. The thermal properties of the heat sinks can also be utilized to dissipate heat from the ambient air. The converter can also be equipped with a fan, which can be mounted on the converter, to direct airflow across the gap. The gap at least partially defined by the heat sink is particularly well-suited as a duct for fan-driven air. The fan is available in a variety of sizes and power ratings, making it easily adaptable to the requirements of the desired converter. The fan can be mounted on the converter's end faces and can be selected largely independently of the structural constraints imposed by the converter's electrical architecture. This allows for the use of larger or higher-performance fans in the desired converter compared to existing technologies. Furthermore, the heat dissipation by the fan in the desired converter can be easily calculated, simplifying the simulation process.

[0011] Furthermore, cooling fins can be formed in the gap between the first and second heat sinks. The cooling fins can be connected to the first and / or second heat sinks, respectively. In particular, the cooling fins can be connected to only one of the heat sinks, or to both. The cooling fins can bridge any misalignment between the first and second heat sinks in the converter assembly direction. The cooling fins can also serve as mechanical supports between the heat sinks. The cooling fins can be thermally connected to the first and second heat sinks and extend through the gap through which air can flow. The cooling fins can be fanned. This increases the surface area covered by airflow, thereby improving the converter's ability to dissipate heat from the ambient air. The increased surface area of ​​the cooling fins enhances the transfer of heat from the airflow to the first and / or second heat sinks. Therefore, the cooling fins can be arranged within an air duct and extend substantially along the air duct. Furthermore, at least one of the cooling fins can include a cooling channel that is thermally connected to the first and / or second heat sinks. As a result, the overall heat dissipation performance of the converter can be further improved. By means of the cooling fins, substantially rectangular air flow cross sections can be defined in the air duct, which can be simulated in a simple manner.

[0012] Furthermore, the DC busbar system for electrically connecting at least one semiconductor switch to at least one energy storage device can be designed to be stepless. Accordingly, the DC busbar system can be designed to be essentially flat, i.e., without steps, for example, by bending. Corresponding to the DC busbar system, the at least one energy storage device and its connected semiconductor switch can be arranged flush in the assembly direction. The DC busbar system can, for example, be designed as a stamped part, eliminating the need for bending. This simplifies the manufacturing process of the claimed converter. The DC busbar system also has a low inductance.

[0013] Furthermore, the converter can have a conductive rail which can be fixed on the side of the first heat sink facing away from the semiconductor switch. Alternatively, the busbar can also be fixed on the side of the second heat sink facing away from the at least one energy storage device. The busbar can be electrically isolated from the first or second heat sink, for example by a suitable intermediate layer or coating. The busbar is designed and arranged so that the first or second heat sink is used as a heat sink to dissipate heat from the converter. The busbar can be electrically connected to at least one semiconductor switch. Furthermore, the busbar can be formed as an unbent stamping part and can therefore be manufactured cost-effectively. In particular, the busbar can be formed as a flat and unbent structure, i.e., no bending process is required. The same applies to the insulating intermediate layer which can be arranged on the busbar. Therefore, the insulating intermediate layer can also be mounted on the busbar in a flat manner, thereby enabling automated production. This also simplifies the production of the required converter.

[0014] In another embodiment of the claimed converter, the half-bridge to which the semiconductor switches belong is designed without snubber capacitors. The claimed converter, and in particular its busbars, have reduced stray inductance, thus eliminating the need for snubber capacitors. Consequently, the claimed converter has a reduced number of components, enabling faster manufacturing. Furthermore, the reduced number of components improves the reliability of the claimed converter.

[0015] Furthermore, in the claimed converter, the second heat sink can extend beyond at least one energy storage device in a layer direction on one side. The layer direction refers to the direction along the substantially planar second or first heat sink. The layer direction is substantially perpendicular to the converter assembly direction. Thus, the second heat sink extends beyond at least one energy storage device and forms an area that partially overlaps with the first heat sink in the assembly direction. Corresponding sections of the first and second heat sinks can thus partially define a gap between the heat sinks. Similarly, the corresponding sections can also constitute air ducts that can be supplied by a fan and / or contain cooling fins. By designing the first and / or second heat sinks accordingly, the cross-sectional area of ​​the gap or corresponding air duct can be predetermined. The second heat sink can at least partially extend beyond at least one energy storage device in the layer direction, thereby facing the first heat sink. Thus, the gap or cooling channel can have a maximum width in the layer direction equal to the dimension of the first heat sink in the layer direction. Consequently, the claimed converter can easily achieve scalability in terms of cooling capacity. This allows the converter to operate at higher electrical power, requiring a corresponding increase in cooling capacity. At the same time, the required converter can be designed compactly. Therefore, the second heat sink extends beyond the at least one energy storage device in the layer direction, thereby improving the electrical power carrying capacity of the converter.

[0016] Furthermore, the first heat sink and / or the second heat sink can be produced by additive manufacturing, for example by laser sintering, 3D printing or binder jetting, whereby the cooling channels and / or cooling fins can be easily adapted to the required converter.

[0017] In particular, the cooling channels can be adjusted according to the requirements of the converter, thereby enabling a higher cooling capacity for the converter.

[0018] The present invention also achieves the above basic purpose through a converter cabinet. The converter cabinet includes a wall panel, and at least one converter is arranged inside the wall panel. According to the present invention, the converter is constructed according to any of the above embodiments. The converter can be arranged basically vertically, and a fan is provided at one end of the bottom. Therefore, by allowing air to circulate and be discharged from the cover side, the converter cabinet can be cooled. Due to the improved cooling capacity of the converter to be protected, the converter cabinet can accommodate a larger number of converters compared to the converter cabinet in the prior art. Alternatively, as a supplement, the converter cabinet to be protected can carry a higher electrical power compared to the converter cabinet in the prior art. Therefore, the characteristics of the converter can be correspondingly applied to the converter cabinet to be protected.

[0019] The aforementioned object is also achieved by a method according to the present invention for simulating the operating behavior of a power converter. The method comprises a first step of providing a data set with which at least part of the functional mode of the power converter to be simulated can be simulated. In particular, the data set can include a digital image of the power converter, i.e., a representation of its structure. This can include the dimensions, position, shape, material specifications, and / or relevant material properties of a heat sink, at least one energy storage device, at least one semiconductor switch, and / or a fan. Alternatively, the data set can also include specifications regarding heat release behavior, thermal conductivity, and / or heat release behavior.

[0020] The method according to the present invention also includes setting at least one operating condition that characterizes the operating behavior to be simulated. The operating condition can include the electrical load of the converter and / or the resulting heat release in at least one semiconductor switch and / or at least one energy storage device. Alternatively or additionally, the ambient temperature and / or information about the air flow around the converter can also be part of the operating condition. The claimed method also includes a third step, in which a computer program product is executed to process the data set provided in the first step in combination with the at least one operating condition specified in the second step. The computer program product is designed to simulate the operating behavior of the converter based on the data set and the at least one operating condition. During this process, at least one operating parameter is determined. This operating parameter can, for example, be the temperature distribution on the surface and / or in the material of at least one heat sink, at least one energy storage device, and / or at least one semiconductor element. Alternatively or additionally, the operating parameter can also include thermal parameters of a liquid used to cool the at least one heat sink. The computer program product can be formed as a so-called digital twin, as described in more detail, for example, in US 2017 / 286572 A1. The disclosure of US 2017 / 286572 A1 is incorporated into the present application by reference.

[0021] In addition, the method according to the present invention also comprises the 4th step, wherein, at least one operating parameter determined in the 3rd step is output to user and / or data interface.This data interface is applicable to the result of said method being output to other computer programs towards simulation.According to the present invention, the optical filter assembly that emulates by this method constitutes according to above-mentioned arbitrary embodiment.Therefore, the feature of the current transformer of being claimed for protection is applicable to the method of being claimed for protection equally.

[0022] The above-mentioned object is also achieved by a computer program product according to the present invention. This computer program product comprises instructions that, when executed by a computer, enable the computer to simulate a method for operating a converter. According to the present invention, the computer program product is configured to perform the method of any of the above-mentioned embodiments. Alternatively, the converter simulated by the computer program product can be constructed according to any of the above-mentioned embodiments. Additionally or additionally, the computer program product can be configured to correspondingly simulate the operating behavior of a converter cabinet according to any of the above-mentioned embodiments.

[0023] The operating method can include the electrical behavior and / or thermal behavior of the converter. Thermal behavior can include heat release from semiconductor switches, energy storage devices, heat transfer to the DC bus system, busbars, heat sinks, or thermal conductivity within these components. Similarly, thermal conductivity can include heat transfer to a cooling fluid, cooling fins, and / or air flow covering any of these components. The operating behavior can be determined based on at least one operating parameter, such as the converter's electrical power consumption and / or ambient air temperature. Furthermore, fan speed or fan flow can be predefined operating parameters. The operating parameters can be provided by a user and / or a suitable data interface, such as another simulation-oriented computer program. The computer program product can also include a physics module, which can be used to simulate, i.e., simulate, the operating behavior. Similarly, the computer program product can be configured to output simulation results to a user and / or a suitable data interface, such as another simulation-oriented computer program. The required computer program product can be designed as a so-called digital twin, such as described in US 2017 / 0286572 A1. The disclosure of US 2017 / 0286572 Al is incorporated into this application by reference.

[0024] The simulated converter can be simulated advantageously due to its structure. The air duct, particularly one with cooling fins, can define at least one substantially rectangular cross-section through which the airflow can pass. Such a rectangular cross-section can be simulated in a simplified manner and, for example, can be represented with sufficient accuracy by a characteristic curve that indicates the current cooling capacity as a function of at least one current operating parameter. Furthermore, the claimed converter achieves such an increased cooling capacity that interference influences and / or feedback effects, such as those caused by an increase in ambient air temperature, that occur in conventional converters or converter cabinets can be largely ignored. Simulation of the claimed converter or converter cabinet is thus simplified. The claimed computer program product can provide convincing simulation results with low computing power. Furthermore, the claimed computer program product is substantially real-time capable. The claimed computer program product enables more precise monitoring of the claimed converter or a converter in operation. For example, sensor measurements, particularly temperature measurements, in the converter or converter cabinet can be plausible, thereby identifying faulty components. The claimed computer program product can be monolithic, i.e., run on a single hardware platform. Alternatively, the claimed computer program product can be modular, i.e., comprised of subroutines that can run on independent hardware platforms and work together via a communication data connection to achieve the desired simulation.

[0025] In one embodiment of the claimed computer program product, the computer program product comprises a data interface configured to connect the computer program product to at least one sensor, which is assigned to a corresponding physical converter. During the intended operation of the claimed computer program product, the physical converter can be monitored by the computer program product. The data interface is configured to determine the degree of consistency between the simulated operating behavior and the actual operating behavior based on measurement signals or measured values ​​provided by the at least one sensor. In particular, the operating parameters determined in the claimed method and by the claimed computer program product can correspond to measurement signals or measured values ​​detected by the at least one sensor in the physical converter. Furthermore, the data interface can be designed as a so-called application programming interface (API). BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention will be further described with reference to various embodiments and the accompanying drawings. The drawings should be read as complementary to each other, i.e., the same reference numerals in different drawings have the same technical meaning. Features of the various embodiments may also be combined with each other. In addition, features of the embodiments shown in the drawings may be combined with features summarized above. Specifically, the following is shown:

[0027] Figure 1 is a side view of a first embodiment of the claimed converter;

[0028] Figure 2 is a partial cutaway oblique view of a second embodiment of the converter claimed;

[0029] Figure 3 for Figure 2 an uncut oblique view of the portion shown;

[0030] Figure 4 is an oblique view from below of a third embodiment of the converter claimed;

[0031] Figure 5 is an oblique view from above of a third embodiment of the converter claimed;

[0032] Figure 6 This is an embodiment of the converter cabinet claimed. DETAILED DESCRIPTION

[0033] A first embodiment of the claimed converter 10 is Figure 1 . The converter 10 comprises an energy storage device 14, which is designed as a capacitor and is connected to a semiconductor switch 12. The energy storage device 14 is electrically connected to the semiconductor switch 12 via a so-called DC busbar system 16. The converter 10 also comprises a heat sink 20, through which the energy storage device 14 and the semiconductor switch 12 need to dissipate heat during normal operation. During normal operation, the semiconductor switch 12 and at least one energy storage device 14 generate heat flows 39, which are introduced into the heat sink 20. The semiconductor switch 12 is arranged on the first heat sink 22 and maintains thermally conductive contact with the first heat sink. A cooling fluid line 44 is provided on the first heat sink 22, through which the cooling fluid 42 can be introduced into or out of the first heat sink 22. The heat absorbed by the cooling fluid 42 can be carried away by the converter 10, for example, by transferring it to a structurally separated heat sink (in Figure 1 (not shown in detail). Similarly, at least one energy storage device 14 is arranged on the second radiator 24 and maintains heat-conducting contact with the second radiator. The second radiator 24 is also equipped with a cooling fluid pipeline 44 like the first radiator 22, which can import or export the cooling fluid 42. The first radiator and the second radiator 22, 24 are each designed to be basically flat. Therefore, the first radiator and the second radiator 22, 24 extend basically along the layer direction 27 and can basically be described as disk-shaped in terms of their thermal properties, that is, thermal conductivity. The first and second radiators 22, 24 are arranged in parallel and are staggered with each other along the assembly direction 25 of the converter 10. The assembly direction 25 is Figure 1 Indicated by corresponding arrows.

[0034] The second heat sink 24 is designed to extend adjacent to the at least one energy storage device 14 and protrude beyond the energy storage device in a layer direction 27. The at least one energy storage device 14 is extended beyond the second heat sink 24 by a projection width 17. In this projection region, the second heat sink 24 faces the first heat sink 22. A gap 23 is provided between the first heat sink 22 and the second heat sink 24 in the region of the projection width 17. Support members 34 are provided in the region of this gap 23, supporting the first heat sink 22 on the second heat sink 24. The support members 34 also establish a thermally conductive connection between the first heat sink 22 and the second heat sink 24. Similarly, a plurality of cooling fins 28 are provided between the support members 34, i.e., within the gap 32. These cooling fins 28 also form a thermally conductive connection with the first heat sink 22 and the second heat sink 24. During normal operation, heat flux 39 generated by the at least one energy storage device 14 and the semiconductor switch 12 can be directed into the first heat sink 22 and the second heat sink 24 and discharged via a cooling fluid 42, respectively. Likewise, heat flow 39 from the cooling fins 28 and the support member 34 is directed into the first and second heat sinks 22, 24 and discharged through the cooling fluid 42. Figure 1 Air can flow through the cross section perpendicular to the drawing plane, thereby forming an air duct 32. The cooling fins 28 are arranged in such a way that the air duct 32, i.e., the ventilated cross section located between the supports 34, is segmented by the cooling fins 28. The cooling fins 28 provide a larger surface area, thereby improving the heat transfer between the air-flowable cross section and the heat sinks 22, 24. The cooling fins 28 and / or the supports 34 can be produced using an additive manufacturing process. In addition, the gap 23 is configured along the assembly direction 25 so that the at least one semiconductor switch 12 and the at least one energy storage device 14 are flush in the assembly direction 25. Therefore, at least one DC busbar system 16 connecting the semiconductor switch 12 to the at least one energy storage device 14 is designed to be stepless. The corresponding DC busbar system 16 is essentially a flat structure, in particular a strip-shaped structure. The corresponding DC busbar system 16 is a stamped part, which can therefore be manufactured cost-effectively. Furthermore, an electrically insulating intermediate layer 26 is provided on the first and second heat sinks 22, 24, respectively, on the sides 21, 29 facing away from the semiconductor switch 12 or the at least one energy storage device 14. The intermediate layer 26 electrically isolates the conductor track 18 from the first and second heat sinks 22, 24.

[0035] In the region between the first and second heat sinks 22, 24, a detection device 46 is arranged in the assembly direction 25, which detection device is designed as a current measuring device. The detection device 46 is electrically connected to the semiconductor switch 12 and can be connected to a control unit (not shown in detail) of the converter 10. The conductor rail 18 is designed as a bent stamped part and provides an electrical connection for the converter 10. The intermediate layer 26 is thermally conductive and establishes a thermally conductive connection between the first or second heat sink 22, 24 and the conductor rail 18. The conductor rail 18 thus also assists in dissipating heat from the converter 10. Furthermore, a computer program product 60 is provided, by means of which the converter 10 (see Figure 1 The computer program product 60 is designed as a digital twin of the converter 10 .

[0036] exist Figure 2 and Figure 3 In FIG. 1 , a second embodiment of the claimed converter 10 is schematically and partially illustrated. Figure 2 A cutaway oblique view of the structure is shown. Figure 3 An oblique view without sectioning is shown. The converter 10 comprises a second heat sink 24 which extends in a layer direction 27 beyond at least one energy storage device 14, not shown in detail, by a projecting width 17. In the area defined by the projecting width 17, supports 34 are provided, with cooling fins 28 being provided between each two supports. The cooling fins 28 extend in parallel and separate air ducts 32 between the supports 34. A fan 30 is provided on one side edge of the second heat sink 24, the diameter of which is at least equal to the width of the air duct 32. By means of the fan 30, an air inflow 35 can be forced to be generated in a predetermined manner, which air inflow 35 passes through the converter 10. The air of the air inflow 35 can be taken from the ambient air. Therefore, the cooling channel 32 is fed with an air flow by the fan 30. The heat flow 39 from the cooling fins 28 is introduced into the second heat sink 24 and into the cooling channel 32. Figure 3 The first heat sink 22 is shown in more detail in FIG. The heat introduced by the air inlet 35 to the cooling fins 28 is absorbed by the heat sinks 22, 24 and carried away by the cooling fluid 42. As a result, the air outlet 37 is cooled compared to the air inlet 35 and can be discharged to the ambient air. The air mass introduced as the air inlet 35 and discharged as the air outlet 37 forms an air circulation in the air duct 32. Alternatively, the flow direction of the air circulation can also be reversed. The air duct 32 is closed by the first heat sink 22, which is connected to the support 34 and the cooling fins 28 in the assembly direction 25. The first and second heat sinks 22, 24 are designed to be connected to the support 34 and the cooling fins 28 in a heat-conducting manner. The operating behavior of the converter 10, including the release of heat in the form of a heat flow 39, is simulated by a computer program product 60 designed as a digital twin of the converter 10.

[0037] also, Figure 4 and Figure 5 A third embodiment of the claimed converter 10 is shown. Figure 4 and Figure 5 In FIG. 1 , the converter 10 is shown in oblique views from opposite sides. The converter 10 is shown in FIG. 1 with respect to the assembly direction 25. Figure 4 Shown from below, Figure 5 The converter 10 includes a heat sink 20, on which a semiconductor switch 12 and at least one energy storage device 14 are arranged. The at least one energy storage device 14 is configured as a capacitor and is arranged on a first heat sink 22, and the semiconductor switch 12 is arranged on a second heat sink 24. Figure 5 The center portion is shielded by a DC busbar system 16, which is designed to be stepless and electrically connects at least one of the semiconductor switches to the energy storage device 14. The DC busbar system 16 is designed as a stamped part and is substantially flat. A first heat sink 22 and a second heat sink 24 are spaced apart in the assembly direction 25. Furthermore, the second heat sink 24 extends beyond the energy storage device 14 by a projection width 17 and, together with the first heat sink 22, partially defines a gap 23. An air duct 32 is provided in the region of the gap 23, allowing air flow along the layer direction 27. The air duct 32 is divided by a plurality of cooling fins 28, through which an inflow of air 35 is directed through the converter 10. The cooling fins 28 are thermally conductively connected to the heat sink 20, so that the inflow of air 35 exits the converter 10 as a cooled outflow of air 37. The converter 10 is also equipped with a conductor rail 18, which is provided on the side 21 of the second heat sink 24 facing away from the semiconductor switch 12. The conductive rail 18 is a multi-component structure and is electrically isolated from the second heat sink 24 by an intermediate layer 26. The intermediate layer 26 is thermally conductive and forms a thermally conductive connection with the conductive rail 18. Thus, the conductive rail 18 further assists in heat dissipation from the converter 10. The operating behavior of the converter 10 is simulated using a computer program product 60, which is designed as a digital twin of the converter 10.

[0038] One embodiment of the claimed converter cabinet 50 is Figure 6Schematically illustrated in FIG. The converter cabinet 50 includes a wall panel 52 that separates the multiple converters 10 from the external environment 55. Each converter 10 is equipped with a fan 30, through which air flows into the converter 10. The inflow 35 of air generated by each fan 30 cools the ambient air from the interior of the converter 10. Heat removed by the inflow 35 of air is absorbed by the converter 10 and discharged into the interior of the converter cabinet 50 as cooled air outflow 37. The heat absorbed by the converter 10 is removed via cooling channels and cooling fluid (not shown in detail). At least one converter 10 is constructed according to the above embodiment and has improved cooling capacity. Therefore, the converter cabinet 50 can accommodate a larger number of converters 10 or arrange the converters 10 more closely than conventional converter cabinets. The converter cabinet 50 is sealed from the external environment 55, thereby preventing air exchange with the environment 55. This minimizes the ingress of contaminants from the external environment 55 . Figure 6 The operating behavior of at least one converter 10 is simulated by means of a computer program product 60 . The computer program product 60 is designed as a digital twin of the corresponding converter 10 .

Claims

1. A converter (10), comprising a plurality of semiconductor switches (12) and at least one energy storage device (14), a DC bus system (16), a first heat sink (22) for dissipating heat for the semiconductor switches (12), and a second heat sink (24) for dissipating heat for at least one of the energy storage devices (14), wherein: The first heat sink and / or the second heat sink (22, 24) are liquid-cooled, wherein, in order to dissipate heat from ambient air in an environment (55) of the converter (10), the first heat sink and the second heat sink (22, 24) are arranged offset from each other along an assembly direction (25) of the converter (10), wherein the assembly direction corresponds to a direction in which at least one semiconductor switch (12) is mounted on the first heat sink (22) and / or a direction in which at least one energy storage device (14) is mounted on the second heat sink (24), characterized in that the first heat sink (22) is connected to the second heat sink (24) via cooling fins (28).

2. The converter (10) according to claim 1, characterized in that The first heat sink and the second heat sink (22, 24) are designed to be flat at least in the region of the semiconductor switch (12) or at least one of the energy storage devices (14).

3. The converter (10) according to claim 1 or 2, characterized in that The first heat sink and the second heat sink (22, 24) are arranged parallel to each other.

4. The converter (10) according to any one of claims 1 to 3, characterized in that The first heat sink and / or the second heat sink (22, 24) are directly or indirectly connected to each other in a thermally conductive manner.

5. The converter (10) according to any one of claims 1 to 4, characterized in that The cooling channels are hydraulically connected or hydraulically separated from each other.

6. The converter (10) according to any one of claims 1 to 5, characterized in that A gap (23) is formed between the first heat sink (22) and the second heat sink (24), through which air can flow to dissipate heat from the ambient air in the interior space of the converter cabinet (50).

7. The converter (10) according to claim 6, characterized in that The converter (10) has a fan (30) which is arranged to supply air into the gap (23).

8. The converter (10) according to any one of claims 1 to 7, characterized in that The DC bus system (16) is designed to be stepless.

9. The converter (10) according to any one of claims 1 to 8, characterized in that The converter (10) has a conductor rail (18) which is fixed to a side (21) of the first heat sink (22) facing away from the semiconductor switch (12) and / or a side (29) of the second heat sink (24) facing away from at least one of the energy storage devices (14).

10. The converter (10) according to any one of claims 1 to 9, characterized in that The half-bridge to which the semiconductor switch (12) is assigned is designed without a buffer capacitor.

11. The converter (10) according to any one of claims 1 to 10, characterized in that The second heat sink (24) protrudes on one side in a layer direction (27) beyond at least one of the energy storage devices (14).

12. The converter (10) according to any one of claims 1 to 11, characterized in that The first heat sink and / or the second heat sink (22, 24) are manufactured by additive manufacturing.

13. A converter cabinet (50), comprising a wall panel (52), wherein at least one converter (10) is arranged inside the wall panel, characterized in that: The converter (10) is designed according to any one of claims 1 to 12.

14. A method for simulating the operating behavior of a converter (10), comprising the following steps: a) providing a data set that can be used to simulate at least part of the operating mode of the converter (10) to be simulated; b) setting at least one operating condition, said operating condition being characteristic of said operating behavior to be simulated; c) executing a computer program product (60) designed to simulate the operating behavior of the converter (10) based on the data set and the at least one operating condition and to determine at least one operating parameter; d) outputting the at least one operating parameter to a user and / or a data interface; It is characterized in that the converter (10) is designed according to any one of claims 1 to 12.

15. A computer program product (60) comprising instructions which, when executed by a computer, cause the computer to simulate an operating behavior of a converter (10) in which heat release occurs, characterized in that The computer program product (60) is designed to carry out the method according to claim 14.

16. The computer program product (60) according to claim 15, characterized in that The computer program product (60) comprises a data interface designed to connect the computer program product (60) to a sensor which is assigned to a corresponding physical converter (10).

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