A portable laser cleaning device, a built-in control system, and a safety configuration method.

Abstract

This invention provides a portable laser cleaning device, a built-in control system, and a safety configuration method, relating to the field of laser equipment technology. The built-in control system stores rapid conversion information for laser patterns. This rapid conversion information is used to roughly estimate the fixed-point temperature of the current laser parameter configuration applied to the current laser pattern. By measuring the difference between the current laser parameter configuration and a reference laser parameter configuration, the estimated laser source hotspot temperature at each point under the current laser parameter configuration can be roughly assessed. The entire process requires only simple mathematical calculations and does not involve complex parameter iterations or simulation environment operation. The safety configuration method only needs to rapidly convert and estimate the reference laser source hotspot temperatures at the corresponding maximum and minimum temperature points, and adjust the laser parameter configuration based on a parameter adjustment strategy. This ensures that the adjusted laser parameter configuration, when used for laser pattern drawing, maintains the temperature at all points within the target temperature range.

Description

Technical Field

[0001] This invention relates to the field of laser equipment technology, and in particular to a portable laser cleaning device, a built-in control system, and a safety configuration method. Background Technology

[0002] Laser cleaning is a green and environmentally friendly industrial surface treatment technology. It involves using a high-energy laser beam to irradiate the surface of a workpiece, causing surface contaminants, rust, or coatings to evaporate, crack, or sublimate instantly, thus achieving a clean and new-looking surface. Laser cleaning is characterized by being non-abrasive, pollution-free, non-contact, heat-free, and suitable for various processing environments and industrial materials. The operation requires no chemical agents or cleaning solutions, making it the most reliable, effective, and environmentally friendly solution for industrial surface treatment today, and the future trend and preferred choice for industrial cleaning.

[0003] Most existing laser cleaning devices on the market are tabletop operation devices, which require the items to be cleaned to be placed on the cleaning table. The advantages are high precision, powerful functions and good safety, but the disadvantage is that the equipment is not easy to carry and install. In order to meet flexible and ever-changing cleaning needs, portable laser cleaning devices have also been proposed. Current portable laser cleaning devices have eliminated many auxiliary functions, retaining only the most basic laser generation and logic control functions, which is an inevitable choice for portability.

[0004] Furthermore, since portable laser cleaning devices are mostly used for temporary operations, their configurations are basically set by the users themselves. Users cannot use auxiliary functions (such as simulation calculations or temperature monitoring functions) to verify their configuration settings. They can only rely on their own experience to make a rough assessment of the configuration. Often, due to inaccurate temperature assessments or incorrect configuration settings, the cleaning temperature is too low or too high, resulting in substandard cleaning capabilities or overheating and damage to the object's surface.

[0005] Therefore, there is a need to provide a portable laser cleaning device, a built-in control system, and a safety configuration method to solve the technical problem that existing portable laser cleaning devices can only rely on the user's own experience for rough assessment and configuration without the aid of other auxiliary functional devices. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a portable laser cleaning device, a built-in control system, and a safety configuration method. It aims to provide a rapid laser parameter safety configuration strategy without the need for complex simulation analysis and calculation, without relying on other auxiliary functional devices, thereby meeting the user's rough assessment configuration needs and ensuring temperature safety during the cleaning process.

[0007] To achieve the above objectives, this application proposes a portable laser cleaning device, comprising a laser cleaning handpiece, a control board, and an operation panel: wherein,

[0008] The laser cleaning handpiece includes a head structure and a handpiece structure connected by an adjustable rotating shaft; wherein, the head structure is provided with a laser generating module and an air blowing motor module, and the bottom of the handpiece structure is provided with a cable outlet, and the laser generating module and the air blowing module are electrically connected to a control board through the cable outlet;

[0009] The laser generating module includes a laser generator, a focusing lens, and a laser output head connected in sequence; wherein, the laser generator transmits the laser path to the focusing lens through a reflective lens, the focusing lens is used to focus the laser to the laser output head, and the focusing lens is respectively located at... X shaft and Y The axis is equipped with a laser galvanometer motor for angle adjustment;

[0010] The control board is based on ARM The microcontroller is configured and connected to the laser galvanometer motor driver, blower motor driver, temperature acquisition module, data storage module, and... RS The 232 communication module is electrically connected, the laser generating module is electrically connected to the laser galvanometer motor driver, and the blower motor driver is electrically connected to the air blowing motor module. RS The 232 communication module is electrically connected to the operation panel, and the temperature acquisition module is used to acquire the temperature status of the device.

[0011] On the other hand, the present invention also provides a built-in control system deployed in the control board of a portable laser cleaning device. The control board controls the laser cleaning based on a configuration file, which includes laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range.

[0012] The laser pattern configuration describes the laser pattern used; the laser parameter configuration includes cleaning speed, laser frequency, laser pulse width, and laser power; the cleaning object configuration is based on manual input matching and includes object substrate type and surface adhesion type; the target temperature range is set based on manual input.

[0013] As a further solution, the data storage module pre-stores a laser pattern configuration library, which contains several laser patterns and their corresponding quick conversion information; wherein...

[0014] The laser pattern is drawn in a segmented order based on several segmented lines; the rapid conversion information includes the maximum and minimum temperature points of the laser pattern, the maximum and minimum temperature points of each segmented line, the reference laser source hotspot temperature corresponding to each point, and the reference laser parameter configuration.

[0015] As a further solution, the laser parameters used at high frequencies are used as the baseline laser parameter configuration and input into the laser source hotspot model for segmented simulation calculations; among which,

[0016] A corresponding laser source hotspot model is established based on the laser generation module;

[0017] The calculation order and path of segmented simulation calculation are determined based on the laser pattern configuration, and the distribution location and number of laser source hotspots are determined based on the cleaning speed and calculation path.

[0018] The model parameters of the laser source hotspot model are determined based on the cleaning speed, laser frequency, laser pulse width and laser power, and segmented simulation calculations are performed iteratively to obtain the laser source hotspot distribution map corresponding to each iteration stage of the laser pattern.

[0019] Based on the distribution map of laser source hotspots at each iteration stage, determine the maximum and minimum temperature points of the laser pattern, as well as the maximum and minimum temperature points of each segment line.

[0020] In another aspect, the present invention also provides a security configuration method, applied to a built-in control system as described in any of the preceding claims, which quickly matches the security configuration through the following steps:

[0021] Step 1: Obtain the configuration file and parse it to get the laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range;

[0022] Step 2: Configure and match the corresponding safe temperature range based on the object to be cleaned; wherein, the maximum safe temperature is determined by the highest tolerance temperature of the object substrate type, and the minimum safe temperature is determined by the lowest cleaning temperature of the surface adhesion type.

[0023] Step 3: Determine whether the target temperature range is within the safe temperature range; if so, accept the current target temperature range; otherwise, ask whether to adjust the target temperature range and accept the target temperature range determined by the user.

[0024] Step 4: Obtain the quick conversion information corresponding to the laser pattern used in the laser pattern configuration library, convert the changes of each parameter between the current laser parameter configuration and the reference laser parameter configuration into independent influence factors corresponding to each laser parameter; perform weighted conversion on the reference laser source hotspot temperature at the maximum and minimum temperature points based on each independent influence factor to obtain the rough estimate of the laser source hotspot temperature at the maximum and minimum temperature points.

[0025] Step 5: Determine the coarse temperature range based on the maximum and minimum temperature points of the laser source hotspot, and determine whether the coarse temperature range is within the target temperature range; if so, accept the current configuration file as a safe configuration and end; otherwise, proceed to Step 6.

[0026] Step 6: Ask whether to perform automatic matching of security configuration; if yes, obtain the parameter adjustment strategy and execute Step 7; otherwise, ask whether to adjust the current configuration file, accept the configuration file determined by the user, and end.

[0027] Step 7: Adjust the laser parameter configuration based on the parameter adjustment strategy, re-obtain the coarse estimated laser source hot spot temperature at the maximum and minimum temperature points, and update the coarse estimated temperature range; wherein, when the coarse estimated temperature range is within the target temperature range, the current laser parameter configuration is output.

[0028] Step 8: Ask the user if they accept the current laser parameter configuration; if yes, update the current laser parameter configuration to the configuration file, accept the current configuration file as a safe configuration, and end; otherwise, depending on the user's choice, return to step 7 or accept the configuration file confirmed by the user and end.

[0029] As a further solution, the parameter adjustment strategy includes a single parameter adjustment strategy and a hybrid parameter adjustment strategy; wherein,

[0030] Single parameter adjustment strategy: Adjust only one of the following: cleaning speed, laser frequency, laser pulse width, and laser power;

[0031] Hybrid parameter adjustment strategy: Adjust at least one of the following parameters according to the preset parameter adjustment ratio: cleaning speed, laser frequency, laser pulse width, and laser power.

[0032] As a further solution, when adjusting laser parameters:

[0033] When the estimated laser source hotspot temperature at the minimum temperature point is less than the target temperature range, the laser source hotspot temperature is increased by iteratively decreasing the cleaning speed, iteratively increasing the laser frequency, iteratively increasing the laser pulse width, and / or iteratively increasing the laser power.

[0034] When the estimated hot spot temperature of the laser source at the maximum temperature point is greater than the target temperature range, the hot spot temperature of the laser source is reduced by iteratively increasing the cleaning speed, iteratively decreasing the laser frequency, iteratively decreasing the laser pulse width, and / or iteratively decreasing the laser power.

[0035] As a further solution, if the same laser parameter configuration cannot make the estimated laser source hotspot temperature at the maximum and minimum temperature points simultaneously fall within the target temperature range, then the laser parameters of each segment line are adjusted separately until the estimated laser source hotspot temperature at the maximum and minimum temperature points of each segment line simultaneously falls within the target temperature range, and this is used as the laser parameter configuration for each segment line to be used independently.

[0036] As a further solution, when the same laser parameter configuration cannot ensure that the estimated laser source hotspot temperatures at the temperature maximum and minimum points within the same segmented line are simultaneously within the target temperature range, a temporary segmentation point is automatically generated between the two points, and the segmented line is divided into two sub-segmented lines. The laser parameters of each sub-segmented line are adjusted separately until the estimated laser source hotspot temperatures at the temperature maximum / minimum points of each sub-segmented line are within the target temperature range, and this is used as the laser parameter configuration for each sub-segmented line to be used independently.

[0037] As a further solution, the rough estimate of the laser source hotspot temperature is calculated using the following weighted formula:

[0038] T= ( K P + K τ + K f + K v ) / 4·(1+ β ) T 0;

[0039] in, K P , K τ , K f , K v These are the independent influencing factors corresponding to laser power, laser pulse width, laser frequency, and cleaning speed, respectively. T To roughly estimate the hot spot temperature of the laser source, T 0 is the reference laser source hotspot temperature. β To roughly estimate the temperature margin, the value is negative at the minimum or extreme temperature point, and positive at the maximum or extreme temperature point.

[0040] Compared with related technologies, the portable laser cleaning device, built-in control system, and safety configuration method provided by this invention have the following advantages:

[0041] 1. This invention is based on ARM The microcontroller provides a portable laser cleaning device with certain control and computing capabilities. It monitors the device's temperature status in real time through a temperature acquisition module. When the laser cleaning tool overheats during operation, the device is cooled down by blowing air through the blower motor driver and the air blowing motor module. When drawing segmented lines above the target temperature range, the air blowing motor module is started in advance to blow air in advance, and the air is turned off after the drawing is completed to allow the high-temperature area to cool down quickly and ensure that the substrate is not damaged by high temperature.

[0042] 2. The built-in control system of the present invention stores fast conversion information for laser patterns pre-existing in the laser pattern configuration library; wherein, the fast conversion information is used to roughly estimate the fixed point temperature of the current laser parameter configuration applied to the current laser pattern; by the difference between the current laser parameter configuration and the reference laser parameter configuration, the reference laser source hot spot temperature corresponding to each point is corrected, so as to roughly evaluate the rough estimate of the laser source hot spot temperature of each point under the current laser parameter configuration, and the whole process only requires simple mathematical calculations and does not involve complex parameter iteration and simulation environment operation;

[0043] 3. The safety configuration method of the present invention combines the rapid conversion information of the laser pattern used and the current laser parameter configuration to quickly calculate and estimate the reference laser source hot spot temperature corresponding to the maximum and minimum temperature points, and adjusts the laser parameter configuration based on the parameter adjustment strategy so that the adjusted laser parameter configuration can keep the temperature at all points within the target temperature range when used for laser pattern drawing. Attached Figure Description

[0044] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0046] Figure 1 A schematic diagram of a portable laser cleaning device provided by the present invention;

[0047] Figure 2 A schematic diagram of the main interface of a built-in control system provided by the present invention;

[0048] Figure 3 A schematic diagram of the system settings interface of a built-in control system provided by the present invention;

[0049] Figure 4 A schematic diagram of a cleaning settings interface for a built-in control system provided by the present invention. Figure 1 ;

[0050] Figure 5 A schematic diagram of a cleaning settings interface for a built-in control system provided by the present invention. Figure 2 ;

[0051] Figure 6 A schematic diagram illustrating the steps of a security configuration method provided by the present invention;

[0052] Figure 7 A schematic diagram of a laser pattern configuration provided by the present invention;

[0053] The attached figures are labeled as follows: 1. Head structure; 11. Laser generator; 12. Focusing field lens; 13. Laser output head; 14. Laser galvanometer motor; 2. Air blowing motor module; 3. Hand tool structure; 31. Adjustable rotating shaft; 32. Cable outlet; 4. Operation panel.

[0054] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0056] Example 1

[0057] Please see Figure 1 This application provides a portable laser cleaning device, including a laser cleaning handpiece, a control board, and an operation panel 4: wherein,

[0058] The laser cleaning handpiece includes a head structure 1 and a handpiece structure 3 connected by an adjustable rotating shaft 31; wherein, the head structure 1 is provided with a laser generating module and an air blowing motor module 2, and the handpiece structure 3 is provided with a cable outlet 32 ​​at the bottom, and the laser generating module and the air blowing module are electrically connected to the control board through the cable outlet 32.

[0059] The laser generating module includes a laser generator 11, a focusing lens 12, and a laser output head 13 connected in sequence; wherein, the laser generator 11 transmits the laser path to the focusing lens 12 through a reflecting mirror, the focusing lens 12 is used to focus the laser to the laser output head 13, and the focusing lens 12 is respectively positioned in... X shaft and Y The axis is equipped with a laser galvanometer motor 14 for angle adjustment;

[0060] The control board is based on ARM The microcontroller is configured and connected to the laser galvanometer motor driver 14, the blower motor driver, the temperature acquisition module, the data storage module, and... RS The 232 communication module is electrically connected, the laser generating module is electrically connected to the laser galvanometer motor 14 driver, and the blower motor driver is electrically connected to the air blowing motor module 2. RS The 232 communication module is electrically connected to the operation panel 4, and the temperature acquisition module is used to acquire the temperature status of the device.

[0061] It should be noted that this embodiment is based on ARM The microcontroller provides a portable laser cleaning device with certain control and computing capabilities, and monitors the device's temperature status in real time through a temperature acquisition module. When the laser cleaning tool overheats due to operation, the device can be cooled down by blowing air through the blower motor driver and the air blowing motor module 2. In addition, the air blowing motor module 2 can also maintain airflow during surface cleaning to remove surface residues and debris.

[0062] Example 2

[0063] Please see Figures 2 to 5 This embodiment provides a built-in control system deployed in the control board of a portable laser cleaning device. The control board controls the laser cleaning based on a configuration file, which includes laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range.

[0064] The laser pattern configuration describes the laser pattern used; the laser parameter configuration includes cleaning speed, laser frequency, laser pulse width, and laser power; the cleaning object configuration is based on manual input matching and includes object substrate type and surface adhesion type; the target temperature range is set based on manual input.

[0065] like Figure 2 As shown, the corresponding cleaning settings and system settings can be selected via the operation panel 4. I / O Devices and viewing device information; system settings include, for example... Figure 3As shown, this contains some parameters that need to be set in advance, such as whether to enable security configuration matching, or to set alarm temperature, as well as login parameters and related system parameters.

[0066] Cleaning settings such as Figure 4 As shown, here you can adjust the laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range. If the safety configuration matching function is enabled, you can also set appropriate laser parameter configurations by clicking on the safety configuration matching function. This ensures that the overall temperature of the laser when drawing the pattern remains within the target temperature range throughout the entire cleaning process, thereby ensuring the effectiveness of the cleaning without damaging the substrate.

[0067] like Figure 4 and Figure 5 As shown, you can select a laser pattern through the preview interface. Different laser patterns have some specific adjustment parameters. For example, the outer and inner lengths of the square pattern can be adjusted. These laser patterns are stored in the laser pattern configuration library. The laser pattern is drawn in a segmented order based on several segmented lines.

[0068] Furthermore, because portable laser cleaning devices omit many auxiliary functions and have limited computing power, they cannot accurately perform complex simulation calculations and real-time monitoring of light source temperature. Therefore, the laser parameter configuration can only be roughly evaluated and configured by the user based on their own experience. Often, due to inaccurate temperature evaluation and incorrect configuration settings, the cleaning temperature is too low or too high, resulting in substandard cleaning ability or overheating and damage to the object surface.

[0069] To this end, for the laser patterns pre-existing in the laser pattern configuration library, corresponding quick conversion information is also stored; among which, the quick conversion information is used to roughly estimate the fixed point temperature of the current laser parameter configuration applied to the current laser pattern; these fixed points include the maximum and minimum temperature points of the laser pattern, and the maximum and minimum temperature points of each segment line;

[0070] Because the maximum and minimum temperature points of the laser pattern, as well as the maximum and minimum temperature points of each segment line, highly overlap under different laser parameter configurations, these points can be identified in advance through simulation and bound to the laser pattern for pre-existing use.

[0071] In use, this embodiment corrects the reference laser source hotspot temperature at each point by the difference between the current laser parameter configuration and the reference laser parameter configuration. This allows for a rough assessment of the laser source hotspot temperature at each point under the current laser parameter configuration. The entire process requires only simple mathematical calculations and does not involve complex parameter iterations or simulation environment operation.

[0072] It should be noted that while a rough estimate of the laser source hotspot temperature may have some error, it can largely reflect the temperature conditions at various points and is valuable in determining temperature ranges. Furthermore, by allowing a certain temperature margin, the accuracy of the range estimate can be ensured, and it can provide users with parameter references without adding any equipment.

[0073] To achieve rapid pre-construction of conversion information, this embodiment uses the configuration of frequently used laser parameters as the baseline laser parameter configuration and inputs it into the laser source hotspot model for segmented simulation calculations; wherein,

[0074] Specifically, the laser source hotspot model is established based on the laser generating module. It is necessary to simulate and model the laser generator 11, focusing field lens 12 and laser output head 13 of the laser generating module, and use the model parameters of the laser source hotspot model determined based on cleaning speed, laser frequency, laser pulse width and laser power for model simulation control.

[0075] In addition, it is necessary to determine the calculation order and calculation path of segmented simulation calculation based on the laser pattern configuration, and to determine the distribution location and number of laser source hotspots based on the cleaning speed and calculation path.

[0076] The simulation was then performed in segments to obtain the distribution map of laser source hotspots at each iteration stage of the laser pattern.

[0077] This embodiment can determine the maximum and minimum temperature points of the laser pattern, as well as the maximum and minimum temperature points of each segment line, by using the laser source hotspot distribution map at each iteration stage.

[0078] Example 3

[0079] Please see Figure 6 This embodiment is applied to a built-in control system as described in Embodiment 2, providing a security configuration method that quickly matches security configurations through the following steps:

[0080] Step 1: Obtain the configuration file and parse it to get the laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range;

[0081] Step 2: Configure and match the corresponding safe temperature range based on the object to be cleaned; wherein, the maximum safe temperature is determined by the highest tolerance temperature of the object substrate type, and the minimum safe temperature is determined by the lowest cleaning temperature of the surface adhesion type.

[0082] Step 3: Determine whether the target temperature range is within the safe temperature range; if so, accept the current target temperature range; otherwise, ask whether to adjust the target temperature range and accept the target temperature range determined by the user.

[0083] Step 4: Obtain the quick conversion information corresponding to the laser pattern used in the laser pattern configuration library, convert the changes of each parameter between the current laser parameter configuration and the reference laser parameter configuration into independent influence factors corresponding to each laser parameter; perform weighted conversion on the reference laser source hotspot temperature at the maximum and minimum temperature points based on each independent influence factor to obtain the rough estimate of the laser source hotspot temperature at the maximum and minimum temperature points.

[0084] Step 5: Determine the coarse temperature range based on the maximum and minimum temperature points of the laser source hotspot, and determine whether the coarse temperature range is within the target temperature range; if so, accept the current configuration file as a safe configuration and end; otherwise, proceed to Step 6.

[0085] Step 6: Ask whether to perform automatic matching of security configuration; if yes, obtain the parameter adjustment strategy and execute Step 7; otherwise, ask whether to adjust the current configuration file, accept the configuration file determined by the user, and end.

[0086] Step 7: Adjust the laser parameter configuration based on the parameter adjustment strategy, re-obtain the coarse estimated laser source hot spot temperature at the maximum and minimum temperature points, and update the coarse estimated temperature range; wherein, when the coarse estimated temperature range is within the target temperature range, the current laser parameter configuration is output.

[0087] Step 8: Ask the user if they accept the current laser parameter configuration; if yes, update the current laser parameter configuration to the configuration file, accept the current configuration file as a safe configuration, and end; otherwise, depending on the user's choice, return to step 7 or accept the configuration file confirmed by the user and end.

[0088] It should be noted that user-defined laser parameter configurations are prone to inaccurate temperature assessments and incorrect settings. For example, for concentric circle laser patterns and the same set of laser parameter configurations, the center temperature may be higher than the periphery temperature. Users may have set a laser parameter configuration based on a stable center temperature, resulting in insufficient periphery temperature to clean surface deposits. Alternatively, users may have set a laser parameter configuration based on a stable periphery temperature, resulting in an excessively high center temperature that damages the substrate.

[0089] Therefore, steps 2 and 3 determine a rough safe temperature range based on the object substrate type and surface adhesion type set by the user, and determine whether the target temperature range is within the safe temperature range, thus prompting the user to modify the reasonable target temperature range; if the user has not set the object substrate type and surface adhesion type, steps 2 and 3 can be skipped and step 4 can be executed directly.

[0090] Steps 4 to 8 combine the rapid conversion information of the laser pattern used with the current laser parameter configuration to quickly calculate and estimate the reference laser source hot spot temperature at the corresponding maximum and minimum temperature points. Based on the parameter adjustment strategy, the laser parameter configuration is adjusted so that when the adjusted laser parameter configuration is used for laser pattern drawing, the temperature at each point is kept within the target temperature range.

[0091] The principle behind the above method is as follows: since the maximum and minimum temperature points are pre-selected, only a rough estimate of the laser source hotspot temperature is needed during execution to obtain a rough temperature range. It takes advantage of the fact that if the pattern does not change, the maximum and minimum temperature points are unlikely to change, and any deviations will be very small. This is similar to how the hot spot of a cup will always be the same as long as the cup structure remains unchanged. Therefore, the temperature range corresponding to the laser parameter configuration can be quickly estimated without simulation calculations.

[0092] Among them, the reference laser source hotspot temperatures at the maximum and minimum temperature points are representative of the whole, which can determine the rough temperature range of the entire laser pattern, and no complex simulation iteration calculations are required on the device side.

[0093] Furthermore, parameter tuning strategies include single-parameter tuning strategies and hybrid parameter tuning strategies; among them,

[0094] Single parameter adjustment strategy: Adjust only one of the following: cleaning speed, laser frequency, laser pulse width, and laser power;

[0095] Hybrid parameter adjustment strategy: Adjust at least one of the following parameters according to the preset parameter adjustment ratio: cleaning speed, laser frequency, laser pulse width, and laser power.

[0096] Furthermore, when adjusting laser parameters:

[0097] When the estimated laser source hotspot temperature at the minimum temperature point is less than the target temperature range, the laser source hotspot temperature is increased by iteratively decreasing the cleaning speed, iteratively increasing the laser frequency, iteratively increasing the laser pulse width, and / or iteratively increasing the laser power.

[0098] When the estimated hot spot temperature of the laser source at the maximum temperature point is greater than the target temperature range, the hot spot temperature of the laser source is reduced by iteratively increasing the cleaning speed, iteratively decreasing the laser frequency, iteratively decreasing the laser pulse width, and / or iteratively decreasing the laser power.

[0099] It should be noted that in some cases, using the same laser parameter configuration throughout can ensure that the estimated laser source hotspot temperatures at both the maximum and minimum temperatures are simultaneously within the target temperature range; however, in other cases, the same laser parameter configuration may not be able to ensure that the estimated laser source hotspot temperatures at both the maximum and minimum temperatures are simultaneously within the target temperature range.

[0100] Or concentric circles ( Figure 4 and Figure 5 Taking the laser pattern of the last item (laser pattern) as an example, because the distance between the center and the outer ring is too large, no matter how the same laser parameter configuration is adjusted, it is impossible to ensure that the outer ring is not lower than the target temperature range and the inner ring is not higher than the target temperature range.

[0101] The innovative idea of ​​this embodiment is that since the laser pattern is based on the arrangement of segmented lines in a certain order, the laser parameters of each segmented line can be adjusted separately until the estimated laser source hot spot temperature of the temperature maximum and minimum points of each segmented line is simultaneously within the target temperature range, and this is used as the laser parameter configuration for each segmented line to be used independently.

[0102] This is equivalent to reducing the laser pattern to a combination of multiple "sub-patterns" again, which can shorten the matching distance and reduce the probability of the laser source hotspot temperature being within the target temperature range at the same time, without being able to take into account both the maximum and minimum temperature points.

[0103] If adopted Figure 7 The laser pattern shown above, with its segmented lines, still cannot meet the temperature adjustment requirements, specifically as follows: Figure 7 The overall pattern can be divided into 6 "arc" segment lines, thus providing a more refined laser parameter configuration strategy. However, within the same "arc" segment line, point 1P has a high pattern density and high overlap, while point 2P is relatively sparse and far from point 1P (the center). Therefore, if the same set of laser parameter configurations is used for the "arc" segment line, it is very likely that "either the center temperature is high or the far end temperature is insufficient".

[0104] Therefore, this embodiment adopts a method of automatically generating temporary segmentation points. Specifically, when the same laser parameter configuration cannot make the estimated laser source hotspot temperature of the temperature maximum and minimum points within the same segment line simultaneously fall within the target temperature range, a temporary segmentation point is automatically generated between the two points, and the segment line is divided into two sub-segment lines. The laser parameters of each sub-segment line are adjusted separately until the estimated laser source hotspot temperature of the temperature maximum / minimum points of each sub-segment line falls within the target temperature range, and this is used as the laser parameter configuration for each sub-segment line to be used independently.

[0105] Using the above method, laser parameter configuration can be adjusted for two segments within the same segmented line, based on actual conditions and needs. This allows for a more refined laser parameter configuration strategy with simple modifications to the existing functionality.

[0106] In a specific embodiment, points 1P and 2P are the maximum and minimum temperature points of the current segmented line, respectively. This embodiment obtains the minimum temperature adjustment (absolute value) of 1P and 2P to the target temperature range based on the current laser parameter configuration strategy; that is, how much temperature the upper limit of the target temperature range corresponding to 1P needs to be reduced at least, and how much temperature the lower limit of the target temperature range corresponding to 2P needs to be increased at least.

[0107] Then, the temperature influence range is determined by the minimum temperature adjustment amount of 1P and 2P. That is, the larger the minimum temperature adjustment amount, the larger the temperature influence range. Correspondingly, in order to limit the temperature influence range, this embodiment takes the inverse ratio of the minimum temperature adjustment amount of 1P and 2P to determine the ratio of the two ends of the automatically generated temporary segment point between the two points. The purpose is to limit and offset the temperature influence range.

[0108] The principle can be understood as follows: the larger the temperature influence range, the more drastic the adjustment of laser parameters. This influence is the root cause of "either the center temperature is high or the far end temperature is insufficient". Therefore, it is necessary to limit it to a smaller range to avoid affecting the other party nearby. Since the other party has a smaller temperature influence range, it is allocated a larger proportion of the two ends. Because it is farther away from the range of drastic laser parameter adjustment, it will not significantly affect the party with a larger temperature influence range, and its own adjustment will also be less affected.

[0109] like Figure 7 As shown, in this embodiment, the position coordinates of points 1P and 2P are determined, and the position coordinates of the temporary segment point are obtained by substituting the position ratios of the two ends. Specifically, the coordinate analysis formula of the current segment line can be obtained, and then the horizontal / vertical coordinates of points 1P and 2P can be converted according to the position ratios of the two ends and substituted into the coordinate analysis formula for calculation. The output is the position coordinate of the temporary segment point corresponding to 3P.

[0110] Based on this, the following unified processing steps can be obtained to automatically generate temporary segmentation points:

[0111] Obtain the coordinate analysis formula of the current segmented line, as well as the position coordinates of the temperature maximum and minimum points, and roughly estimate the hot spot temperature of the laser source;

[0112] Calculate the temperature difference between the rough estimate of the laser source hotspot temperature at the temperature maximum point and the upper limit of the target temperature range to obtain the minimum temperature adjustment amount for the upper limit.

[0113] The temperature difference between the rough estimate of the laser source hotspot temperature at the temperature minimum point and the summer boundary of the target temperature range is calculated to obtain the minimum temperature adjustment amount for the lower boundary.

[0114] The inverse ratio of the minimum temperature adjustment at the upper bound to the minimum temperature adjustment at the lower bound is used as the ratio of the temporary segment point to the two ends of the temperature maximum and minimum points.

[0115] Determine the coordinates of the independent variable in the coordinate analysis formula (the X-axis coordinates in this embodiment), and determine the coordinates of the temporary segmentation points by using the position coordinates of the temperature maximum and minimum points and the ratio of the positions at both ends;

[0116] Substitute the independent variable coordinates of the temporary segment point into the coordinate analysis formula to calculate the dependent variable coordinates of the temporary segment point (Y-axis coordinates in this embodiment) to obtain the coordinate position of the temporary segment point (X-axis coordinates, Y-axis coordinates).

[0117] Furthermore, the hotspot temperature of the laser source is roughly estimated using the following weighted conversion formula:

[0118] T= ( K P + K τ + K f + K v ) / 4·(1+ β ) T 0;

[0119] in, K P , K τ , K f , K v These are the independent influencing factors corresponding to laser power, laser pulse width, laser frequency, and cleaning speed, respectively. T To roughly estimate the hot spot temperature of the laser source, T 0 is the reference laser source hotspot temperature. β To roughly estimate the temperature margin, the value is negative at the minimum or extreme temperature point, and positive at the maximum or extreme temperature point.

[0120] Furthermore, based on Example 2, this embodiment proposes the following independent influencing factors only when the system parameters are adjusted independently (adjustments between parameters do not affect each other and do not constitute a limitation) (this embodiment does not discuss more complex control systems with mutual interference):

[0121] Under otherwise unchanged conditions, the temperature rise of the laser source hotspot. ΔT With laser energy E The relationship is linear, that is: ΔT = k `· E ;in, k ` are linear coefficients, and since E = P · t Therefore, laser power and temperature rise value ΔT It also shows a near-linear relationship. P For laser power, t For irradiation time, the independent influencing factor of laser power is: K P =( P / P 0); where, P The current laser power, P 0 represents the laser power configured based on the reference laser parameters;

[0122] Furthermore, under otherwise unchanged conditions, the system is assumed to remain relatively stationary during cleaning; when the laser is stationary during irradiation, the irradiation time... t It equals the laser pulse width; therefore, the laser pulse width is related to the temperature rise value. ΔT The relationship is also nearly linear; therefore, the independent influencing factor of the laser pulse width is: K τ =( τ / τ 0); where, τ The current laser pulse width, τ 0 is the laser pulse width configured with reference laser parameters;

[0123] Furthermore, all other things being equal, the higher the laser frequency (here, laser frequency refers to the illumination frequency of the laser beam, not the light wave frequency of the laser source), the more times the area within the laser source's hotspot is irradiated. E = E p · f ;in, E p Since the energy is a single pulse (considered constant here), the independent influence factor of the laser frequency is: K f =( f / f 0); where, f The current laser frequency, f 0 is the laser frequency configured with reference laser parameters.

[0124] Furthermore, all other things being equal, the higher the cleaning speed, the shorter the irradiation time within the laser source hotspot area, i.e. E = P · t , t = d / v ;in, d Let be the diameter of the laser source hotspot; therefore, the independent influencing factor of the cleaning speed is: k v =( v 0 / v );

[0125] Furthermore, to ensure the reliability of the calculation that the estimated temperature range falls within the target temperature range, this embodiment also incorporates a rough temperature margin when roughly estimating the laser source hotspot temperature. β Among them, the rough estimate of the temperature margin. β When roughly estimating the lower temperature limit, a negative value is used to push it down slightly; when roughly estimating the upper temperature limit, a positive value is used to raise it up slightly, thus leaving a margin on both sides to accommodate unpredictable temperature fluctuations.

[0126] Furthermore, since the device in Embodiment 1 includes an air blowing motor module 2, when the user-defined configuration file is not a safe configuration, segmented lines above the target temperature range are determined based on the user-defined configuration file, generating an air blowing motor module 2 configuration and applying it to the air blowing motor driver; wherein, the air blowing motor module 2 configuration determines the air blowing point and air shut-off point of the air blowing motor module 2 based on the start and end points of the segmented lines, combined with the user-set advance air blowing parameters and delayed air shut-off parameters. Figure 3 As shown, these are system parameters set by the user.

[0127] In actual use, since the configuration of the air blowing motor module 2 is set in advance, when drawing laser patterns, as long as the next segment line is a segment line with a temperature higher than the target temperature range, the air blowing motor module 2 will be started in advance to blow air in advance according to the configuration of the air blowing motor module 2, and the air will be turned off after the drawing is completed so that the high temperature area can be cooled down quickly to ensure that the substrate is not damaged by high temperature.

[0128] The above are only some embodiments of this application and do not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A built-in control system, deployed in a control board of a portable laser cleaning device, the control board being electrically connected to a data storage module, characterized in that, The control board controls the laser cleaning process based on a configuration file, which includes laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range. The laser pattern configuration describes the laser pattern used; the laser parameter configuration includes cleaning speed, laser frequency, laser pulse width, and laser power; the cleaning object configuration is based on manual input matching and includes object substrate type and surface adhesion type; the target temperature range is set based on manual input. The data storage module pre-stores a laser pattern configuration library, which contains several laser patterns and their corresponding fast conversion information; wherein... The laser pattern is drawn in a segmented order based on several segmented lines; the rapid conversion information includes the maximum and minimum temperature points of the laser pattern, the maximum and minimum temperature points of each segmented line, the reference laser source hotspot temperature corresponding to each point, and the reference laser parameter configuration. The rapid conversion information is used to roughly estimate the temperature of each point in the current laser pattern when the current laser parameter configuration is applied. By adjusting the difference between the current laser parameter configuration and the reference laser parameter configuration, the reference laser source hotspot temperature at each point is corrected, thus roughly assessing the estimated laser source hotspot temperature at each point under the current laser parameter configuration.

2. The built-in control system according to claim 1, characterized in that, The laser parameters used at high frequencies are used as the baseline laser parameters and input into the laser source hotspot model for segmented simulation calculations; among them, A corresponding laser source hotspot model is established based on the laser generation module; The calculation order and path of segmented simulation calculation are determined based on the laser pattern configuration, and the distribution location and number of laser source hotspots are determined based on the cleaning speed and calculation path. The model parameters of the laser source hotspot model are determined based on the cleaning speed, laser frequency, laser pulse width and laser power, and segmented simulation calculations are performed iteratively to obtain the laser source hotspot distribution map corresponding to each iteration stage of the laser pattern. Based on the distribution map of laser source hotspots at each iteration stage, determine the maximum and minimum temperature points of the laser pattern, as well as the maximum and minimum temperature points of each segment line.

3. A security configuration method, applied to a built-in control system as described in any one of claims 1 to 2, characterized in that, Quickly match security configurations using the following steps: Step 1: Obtain the configuration file and parse it to get the laser pattern configuration, laser parameter configuration, object to be cleaned configuration, and target temperature range; Step 2: Configure and match the corresponding safe temperature range based on the object to be cleaned; wherein, the maximum safe temperature is determined by the highest tolerance temperature of the object substrate type, and the minimum safe temperature is determined by the lowest cleaning temperature of the surface adhesion type. Step 3: Determine whether the target temperature range is within the safe temperature range; if so, accept the current target temperature range; otherwise, ask whether to adjust the target temperature range and accept the target temperature range determined by the user. Step 4: Obtain the quick conversion information corresponding to the laser pattern used in the laser pattern configuration library, convert the changes of each parameter between the current laser parameter configuration and the reference laser parameter configuration into independent influence factors corresponding to each laser parameter; perform weighted conversion on the reference laser source hotspot temperature at the maximum and minimum temperature points based on each independent influence factor to obtain the rough estimate of the laser source hotspot temperature at the maximum and minimum temperature points. Step 5: Determine the coarse temperature range based on the maximum and minimum temperature points of the laser source hotspot, and determine whether the coarse temperature range is within the target temperature range; if so, accept the current configuration file as a safe configuration and end; otherwise, proceed to Step 6. Step 6: Ask whether to perform automatic matching of security configuration; if yes, obtain the parameter adjustment strategy and execute Step 7; otherwise, ask whether to adjust the current configuration file, accept the configuration file determined by the user, and end. Step 7: Adjust the laser parameter configuration based on the parameter adjustment strategy, re-obtain the coarse estimated laser source hot spot temperature at the maximum and minimum temperature points, and update the coarse estimated temperature range; wherein, when the coarse estimated temperature range is within the target temperature range, the current laser parameter configuration is output. Step 8: Ask the user if they accept the current laser parameter configuration; if yes, update the current laser parameter configuration to the configuration file, accept the current configuration file as a safe configuration, and end; otherwise, depending on the user's choice, return to step 7 or accept the configuration file confirmed by the user and end.

4. The security configuration method according to claim 3, characterized in that, The parameter adjustment strategies include single-parameter adjustment strategies and hybrid parameter adjustment strategies; wherein... Single parameter adjustment strategy: Adjust only one of the following: cleaning speed, laser frequency, laser pulse width, and laser power; Hybrid parameter adjustment strategy: Adjust at least one of the following parameters according to the preset parameter adjustment ratio: cleaning speed, laser frequency, laser pulse width, and laser power.

5. A security configuration method according to claim 4, characterized in that, When adjusting laser parameters: When the estimated laser source hotspot temperature at the minimum temperature point is less than the target temperature range, the laser source hotspot temperature is increased by iteratively decreasing the cleaning speed, iteratively increasing the laser frequency, iteratively increasing the laser pulse width, and / or iteratively increasing the laser power. When the estimated hot spot temperature of the laser source at the maximum temperature point is greater than the target temperature range, the hot spot temperature of the laser source is reduced by iteratively increasing the cleaning speed, iteratively decreasing the laser frequency, iteratively decreasing the laser pulse width, and / or iteratively decreasing the laser power.

6. A security configuration method according to claim 5, characterized in that, If the same laser parameter configuration cannot ensure that the estimated laser source hotspot temperatures at the maximum and minimum temperature points are simultaneously within the target temperature range, then the laser parameters for each segment line are adjusted separately until the estimated laser source hotspot temperatures at the maximum and minimum temperature points of each segment line are simultaneously within the target temperature range. This adjustment is then used as the laser parameter configuration for each segment line to be used independently.

7. A security configuration method according to claim 6, characterized in that, If the same laser parameter configuration cannot ensure that the estimated laser source hotspot temperatures at the temperature maximum and minimum points within the same segmented line are simultaneously within the target temperature range, then a temporary segmentation point is automatically generated between the two points, and the segmented line is divided into two sub-segmented lines. The laser parameters of each sub-segmented line are adjusted separately until the estimated laser source hotspot temperatures at the temperature maximum / minimum points of each sub-segmented line are within the target temperature range, and this is used as the laser parameter configuration for each sub-segmented line to be used independently.

8. A security configuration method according to claim 3, characterized in that, The rough estimate of the laser source hotspot temperature is calculated using the following weighted formula: T= ( K P + K τ + K f + K v ) / 4·(1+ β ) T 0； in, K P , K τ , K f , K v These are the independent influencing factors corresponding to laser power, laser pulse width, laser frequency, and cleaning speed, respectively. T To roughly estimate the hot spot temperature of the laser source, T 0 is the reference laser source hotspot temperature. β To roughly estimate the temperature margin, the value is negative at the minimum or extreme temperature point, and positive at the maximum or extreme temperature point.

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