Tin soldering equipment for PCB (Printed Circuit Board)

Abstract

The invention relates to the field of PCB (printed circuit board) processing, and discloses soldering equipment for PCBs, which comprises a soldering table, two sides of the lower surface of the soldering table are supported by support frames, a feeding structure is arranged in the middle of the upper surface of the soldering table, a vertical frame is mounted on the left side of the upper surface of the soldering table, two lifting sleeves are movably sleeved on the vertical frame, and the upper surface of the vertical frame is provided with a feeding structure. The side faces, close to each other, of the two lifting sleeves are both connected with protruding plates, two first air cylinders are installed in the supporting frame on the left side, the top ends of output shafts of the two first air cylinders are connected to the corresponding protruding plates, when a tin welding gun moves downwards, tin soldering machining can be conducted on a PCB below the tin welding gun, and when the tin welding gun moves upwards to be separated from the PCB below the tin welding gun, tin soldering machining can be conducted on the PCB below the tin welding gun. The tin welding gun is automatically driven by the driving structure and the turnover structure to turn over by 180 degrees so as to carry out tin soldering processing on a PCB above the tin welding gun, so that the time consumed in the upward moving process of the tin welding gun is fully utilized, and the processing working efficiency is further improved.

Description

Technical Field

[0001] The present invention relates to the field of PCB board processing, in particular to a soldering device for PCB boards. Background Art

[0002] Soldering is a welding method that uses low-melting-point metal solder to heat, melt, penetrate and fill the gaps between metal parts. Because solder is usually a tin-based alloy and is often used as a heating tool, soldering equipment is required during PCB processing. In the prior art PCB soldering equipment, a linear motor is started to drive the soldering gun to move downward to solder the PCB. When the soldering gun is separated from the PCB and moved upward, the PCB is conveyed and moved, and soldering work is performed on different positions on the PCB. However, the soldering gun cannot be soldered on the PCB during the upward movement and during the process of conveying the PCB. As a result, the time consumed by the upward movement of the soldering gun is not fully utilized, and a large amount of working time is wasted when the soldering gun is continuously moved up and down for soldering, thereby reducing work efficiency. Summary of the Invention

[0003] In order to solve the problems raised in the above background technology, the present invention provides a soldering device for PCB boards.

[0004] The present invention provides a soldering device for PCB boards using the following technical solutions: A soldering device for PCB boards, comprising a soldering station, wherein both sides of the lower side of the soldering station are supported by a support frame, a loading structure is provided in the middle of the upper side of the soldering station, a vertical frame is installed at the left position above the soldering station, a movable sleeve on the vertical frame is provided with two lifting sleeves, and convex plates are connected to the side surfaces of the two lifting sleeves close to each other, two first cylinders are installed in the left support frame, the top ends of the two first cylinder output shafts are connected to the corresponding convex plates, and the right sides of the two lifting sleeves are fastened to the lifting plate by bolts, and multiple soldering guns are provided on the lifting plate through multiple groups of flip structures, two first connecting plates are connected to the left side of the vertical frame, a vertical plate is connected between the two first connecting plates, and a driving structure that drives the flip structure to rotate is provided on the lifting plate and the vertical plate; The flip structure includes a plurality of turntables rotatably mounted on a lifting plate, the turntables clamping the soldering gun via a clamping structure, the turntables are connected to a rotating rod that rotates through the lifting plate, and each of the rotating rods is fixed with a gear; The driving structure includes a first sliding groove opened on the left side of the two first connecting plates, a first slider is slidably arranged in the first sliding groove, a horizontal bar is connected between the two first sliders, the horizontal bar is provided with teeth engaged with the gear, a through rod is connected in the middle of the horizontal bar, a guide groove is opened on the vertical plate, the guide groove is in a "Z" shape, and the through rod passes through the guide groove.

[0005] Preferably, the clamping structure includes a fixed plate connected to the middle of a side of the turntable away from the rotating rod, the fixed plate is provided with a second sliding groove, two sleeves are slidably arranged in the second sliding groove, a screw is rotated through the second sliding groove, one end of the sleeve is provided with a threaded groove for the screw to pass through, and a rotating block is fixed on one end of the screw.

[0006] Preferably, the feeding structure includes a second connecting plate arranged above the soldering station near the front and rear edges, the upper and lower ends of the second connecting plate are connected to fixing strips, and the side surfaces of the fixing strips close to each other are provided with a first groove, and a feeding frame is movably inserted into the first grooves of the two fixing strips in each group, and a second groove is provided on the top of the feeding frame, and a placing plate is placed in the second groove, and a positioning structure is provided at the front and rear edges of the placing plate and the feeding frame, and a clamping structure is provided at one end of the placing plate and the feeding frame, and a plurality of placing slots distributed in an array are provided on the top of the placing plate, and a first opening is provided in the middle of the lower slot wall of each placing slot, and the inner diameter of the first opening is 0.8 times the slot diameter of the placing slot.

[0007] Preferably, the positioning structure includes two groups of positioning rods connected to the front and rear of the lower groove wall of the second groove, and the placement plate is provided with positioning holes for the positioning rods to pass through.

[0008] Preferably, the clamping structure includes two clamping grooves opened at the left end below the placement plate, a pull rod is inserted into the clamping groove, a clamping block is installed on the end of the pull rod inserted into the clamping groove, the right edge above the clamping block is an inclined surface, and a second opening for the pull rod to pass through is opened on the left groove wall of the clamping groove, the second opening is an inverted "U" shape, a pull rod is connected to the end of the pull rod that movably passes through the feeding frame, a spring is provided on the pull rod, and the two ends of the spring are respectively connected to the pull rod and the feeding frame.

[0009] Preferably, a through groove is provided on the groove wall of the first groove, and connecting blocks are connected to the front and rear sides of the feeding frame near the pull rod, and a push plate is connected to one end of the connecting block passing through the through groove, and a plurality of push holes are provided on the push plate at equal intervals, and a pushing structure for intermittently pushing the two push plates to move is provided on the second connecting plate on the rear side.

[0010] Preferably, the pushing structure includes a mounting plate fastened to the second connecting plate on the rear side by bolts, a second cylinder is mounted on the mounting plate, a U-shaped frame is connected to one end of the output shaft of the second cylinder, a switching rod is vertically movable through both ends of the U-shaped frame, and a switching structure is provided on the switching rod.

[0011] Preferably, the switching structure includes a fixed sleeve fixedly mounted on the middle of the switching rod, the fixed sleeve is connected to an insertion rod, a movable sleeve on the end of the insertion rod away from the fixed sleeve is provided with a fixed tube, and one end of the fixed tube is connected to the lifting plate.

[0012] Preferably, a mounting seat is installed above the inner side surfaces of the two second connecting plates, a blower is installed on the mounting seat, an air outlet pipe is connected to the air outlet end of the blower, and an air outlet cover is installed on one end of the air outlet pipe.

[0013] In summary, the present invention has the following beneficial technical effects: 1. The present invention provides a loading structure, a turning structure, and a driving structure on the soldering station and the vertical frame, so that when the soldering gun moves downward, it can perform soldering on the PCB board below. When the soldering gun moves upward and leaves the PCB board below, the driving structure and the turning structure automatically drive the soldering gun to turn 180 degrees to perform soldering on the PCB board above. This fully utilizes the time consumed in the upward movement of the soldering gun, thereby improving processing efficiency. 2. The present invention provides a pushing structure and a switching structure on the loading structure and the vertical frame, utilizes the lifting plate to drive the soldering gun to move up and down, cooperates with the switching structure to move the switching rod up and down, and then inserts the two ends of the switching rod into the pushing holes at corresponding positions on the two pushing plates respectively. In conjunction with the pushing structure, the upper and lower groups of PCB boards to be processed can be automatically driven to move intermittently, thereby realizing the intermittent automatic loading function of the upper and lower groups of PCB boards, further improving the processing efficiency; 3. The present invention provides a mounting base, a blower, an air outlet pipe and an air outlet cover in the feeding structure, and utilizes the air flow blown out from the air outlet cover to accelerate the solidification of the tin liquid when the soldering gun is soldering the upper PCB board, thereby avoiding the problem of tin liquid dripping during the soldering process and improving the soldering work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic structural diagram of a soldering device for a PCB board according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of a vertical frame in an embodiment of the present invention; Figure 3 In the embodiment of the present invention Figure 2 A magnified view of the structure at point A; Figure 4 This is a structural diagram of a vertical frame located on one side of a vertical plate in an embodiment of the present invention; Figure 5 This is a schematic structural diagram of a vertical frame after the vertical plate is disassembled in an embodiment of the present invention; Figure 6 In the embodiment of the present invention Figure 5 A magnified view of the structure at point B; Figure 7 This is a schematic structural diagram of the rear side of a soldering device for a PCB board according to an embodiment of the present invention; Figure 8 In the embodiment of the present invention Figure 7 A magnified view of the structure at C; Figure 9 This is a schematic structural diagram of a feeding structure in an embodiment of the present invention; Figure 10 This is a schematic structural diagram of the fixing bar, feeding frame and placement plate in an embodiment of the present invention; Figure 11 In the embodiment of the present invention Figure 10 Enlarged view of the structure at point D.

[0015] Explanation of reference numerals: 1, soldering station; 2, support frame; 3, vertical frame; 4, lifting sleeve; 5, lifting plate; 6, vertical plate; 7, soldering gun; 8, guide groove; 9, first connecting plate; 10, turntable; 11, through rod; 12, rotating rod; 13, gear; 14, first chute; 15, first slider; 16, horizontal bar; 17, fixed plate; 18, second chute; 19, jacket; 20, screw; 21, rotating block; 22, fixed bar; 23, second connecting plate; 24, first groove; 25, feeding frame; 26, second groove; 27. Placement plate; 28. Placement slot; 29. ​​First opening; 30. Positioning rod; 31. Positioning hole; 32. Clamping slot; 33. Clamping block; 34. Second opening; 35. Pull rod; 36. Pull strip; 37. Spring; 38. Through slot; 39. Push plate; 40. Connecting block; 41. Push hole; 42. Mounting plate; 43. Second cylinder; 44. U-shaped frame; 45. Switching rod; 46. Fixed tube; 47. Insert rod; 48. Fixed sleeve; 49. Mounting seat; 50. Blower; 51. Air outlet pipe; 52. Air outlet hood. DETAILED DESCRIPTION

[0016] The following is combined with Figures 1-11 The present invention is described in further detail.

[0017] Reference Figures 1-11, the embodiment of the present invention discloses a soldering device for PCB boards, including a soldering station 1, both sides of the lower side of the soldering station 1 are supported by a support frame 2, a loading structure is provided in the middle of the upper part of the soldering station 1, a vertical frame 3 is installed at the left position above the soldering station 1, and a movable sleeve on the vertical frame 3 is provided with two lifting sleeves 4, and the two lifting sleeves 4 are connected with convex plates on the side surfaces close to each other, two first cylinders are installed in the left support frame 2, and the top ends of the two first cylinder output shafts are respectively connected to the corresponding convex plates, and the right sides of the two lifting sleeves 4 are fastened to the lifting plate 5 by bolts, and a plurality of soldering guns 7 are provided on the lifting plate 5 through multiple groups of flip structures, two first connecting plates 9 are connected to the left side of the vertical frame 3, a vertical plate 6 is connected between the two first connecting plates 9, and a driving structure for driving the flip structure to rotate is provided on the lifting plate 5 and the vertical plate 6; The flip structure includes a plurality of turntables 10 rotatably mounted on the lifting plate 5. The turntable 10 clamps the soldering gun 7 through a clamping structure. The turntable 10 is connected to a rotating rod 12 that rotates and passes through the lifting plate 5. A gear 13 is fixedly sleeved on each rotating rod 12. When the first cylinder is started to drive the soldering gun 7 on the lifting plate 5 to move downward to solder the PCB board below, when the soldering gun 7 moves upward, the rotation of the turntable 10 on the lifting plate 5 can be used to drive the soldering gun 7 to rotate half a circle, so that when the soldering gun 7 moves upward, it can perform soldering work on the PCB board on the upper side, thereby reducing time waste and greatly improving soldering work efficiency. The driving structure includes a first slide groove 14 provided on the left side of the two first connecting plates 9, a first slider 15 is slidably provided in the first slide groove 14, a horizontal bar 16 is connected between the two first sliders 15, and the horizontal bar 16 is provided with teeth meshing with the gear 13. A through rod 11 is connected in the middle of the horizontal bar 16, and a guide groove 8 is provided on the vertical plate 6. The guide groove 8 is in a "Z" shape. The through rod 11 passes through the guide groove 8. In the process of the lifting plate 5 driving the tin soldering gun 7 to move upward, one end of the through rod 11 is driven to slide upward in the guide groove 8. When the through rod 11 slides upward at the inclined section of the guide groove 8, it can drive the horizontal bar 16 to move horizontally on the lifting plate 5, and the gear 13 drives the rotating rod 12 and the turntable 10 to rotate as a whole on the lifting plate 5, thereby automatically realizing the flipping of the tin soldering gun 7; The clamping structure includes a fixed plate 17 connected to the middle of a side of the turntable 10 away from the rotating rod 12, a second slide groove 18 is provided on the fixed plate 17, two sleeves 19 are slidably provided in the second slide groove 18, a screw 20 is rotated through the second slide groove 18, one end of the sleeve 19 is provided with a threaded groove for the screw 20 to pass through, and a rotating block 21 is fixed on one end of the screw 20. When the tin soldering gun 7 is placed between the two sleeves 19 of each group, the corresponding rotating block 21 can be used to rotate the screw 20 on the fixed plate 17, so that the two sleeves 19 move in a direction close to each other, thereby clamping the tin soldering gun 7, making the installation or disassembly of the tin soldering gun 7 simpler and more convenient; A mounting base 49 is installed above the inner side surfaces of the two second connecting plates 23, and a blower 50 is installed on the mounting base 49. An air outlet pipe 51 is connected to the air outlet end of the blower 50, and an air outlet cover 52 is installed on one end of the air outlet pipe 51. When the soldering gun 7 performs soldering on the upper PCB board, the blower 50 can be started, and the air outlet cover 52 at one end of the air outlet pipe 51 blows air toward the soldering position of the upper PCB board, thereby accelerating the solidification of the tin liquid during the soldering process, avoiding the problem of dripping of the tin liquid during the soldering process, and improving the quality of the soldering work. In addition, a hemispherical shielding piece (not shown in the figure) is provided at the corresponding soldering point position on the upper PCB board. A through hole for inserting the gun head of the soldering gun 7 is opened in the middle of the shielding piece. The shielding piece can further avoid the problem of dripping of the tin liquid when soldering the upper PCB board.

[0018] See also Figure 1 、 Figure 9 、 Figure 10 and Figure 11 The feeding structure includes a second connecting plate 23 arranged above the soldering station 1 near the front and rear edges. The upper and lower ends of the second connecting plate 23 are connected to fixing bars 22. The fixing bars 22 are provided with a first groove 24 on one side close to each other. A feeding frame 25 is movably inserted into the first groove 24 of the two fixing bars 22 in each group. A second groove 26 is provided on the top of the feeding frame 25. A placing plate 27 is placed in the second groove 26. A positioning structure is provided at the front and rear edges of the placing plate 27 and the feeding frame 25. The placing plate 27 and the feeding frame 25 are provided with a positioning structure. A clamping structure is provided at one end. A plurality of placement slots 28 are provided on the top of the placement plate 27 and are distributed in an array. A first opening 29 is provided in the middle of the lower wall of each placement slot 28. The inner diameter of the first opening 29 is 0.8 times the diameter of the placement slot 28. When soldering a PCB board, the PCB board to be soldered can be placed in the placement slot 28 on the placement plate 27. The opening of the first opening 29 allows the soldering gun 7 to smoothly solder the upper PCB board. At the same time, the movement of the feeding frame 25 in the fixing bar 22 can be used to transport the PCB board for loading. The positioning structure includes two sets of positioning rods 30 connected to the front and rear of the lower groove wall of the second groove 26. The placement plate 27 is provided with positioning holes 31 for the positioning rods 30 to pass through. When the placement plate 27 with the PCB board is placed in the second groove 26 of the feed frame 25, the positioning rods 30 can be used to pass through the positioning holes 31 on the placement plate 27 to position the placement plate 27 on the feed frame 25, thereby preventing the placement plate 27 from deviating from its position on the feed frame 25. The clamping structure includes two clamping grooves 32 provided at the left end below the placement plate 27, a pull rod 35 is inserted into the clamping groove 32, and a clamping block 33 is installed on one end of the pull rod 35 inserted into the clamping groove 32. The clamping block 33 is in the shape of a "7", and the right edge of the clamping block 33 is inclined. A second opening 34 for the pull rod 35 to pass through is provided on the left groove wall of the clamping groove 32. The second opening 34 is in the shape of an inverted "U". A pull rod 36 is connected to one end of the pull rod 35 that is movable through the feed frame 25. A spring 37 is sleeved on the pull rod 35, and both ends of the spring 37 They are respectively connected to the pull rod 36 and the feeding frame 25. During the process of pressing the placement plate 27 into the placement groove 28, the groove wall at one end of the clamping groove 32 on the placement plate 27 squeezes the inclined surface of the clamping block 33, pushing the clamping block 33 to move in the clamping groove 32. The spring 37 is stretched by the pull rod 36. When the placement plate 27 is fully inserted into the placement groove 28, the elastic force of the spring 37 is used to pull the clamping block 33 to move in the opposite direction and reset. The clamping block 33 is clamped to the placement plate 27 to avoid the problem of the placement plate 27 falling on the feeding frame 25 during the soldering process.

[0019] See also Figure 1 、 Figure 6 and Figure 8 A through groove 38 is provided on the groove wall of the first groove 24, and a connecting block 40 is connected to the front and rear sides of the feeding frame 25 near the pull bar 36. One end of the connecting block 40 passing through the through groove 38 is connected to a push plate 39, and a plurality of push holes 41 are provided on the push plate 39 at equal intervals. A pushing structure for intermittently pushing the two push plates 39 is provided on the second connecting plate 23 at the rear side; The pushing structure includes a mounting plate 42 fastened to the second connecting plate 23 at the rear side by bolts, a second cylinder 43 is mounted on the mounting plate 42, one end of the output shaft of the second cylinder 43 is connected to a U-shaped frame 44, and a switching rod 45 is vertically movable through both ends of the U-shaped frame 44. The switching rod 45 is provided with a switching structure. After the second cylinder 43 is started to drive the U-shaped frame 44 to move toward the side away from the vertical frame 3, the switching rod 45 can be moved upward on the U-shaped frame 44. After the top end of the switching rod 45 is inserted into the pushing hole 41 on the upper pushing plate 39, the second cylinder 43 The U-shaped frame 44 is driven to move in the opposite direction, and the upper push plate 39 is pushed to move through the switching rod 45, thereby pushing the upper PCB board to move and load. Then, when the second cylinder 43 drives the U-shaped frame 44 to move away from the vertical frame 3, the switching rod 45 can be moved up and down on the U-shaped frame 44. After the bottom end of the switching rod 45 is inserted into the pushing hole 41 on the lower push plate 39, the second cylinder 43 is started again to drive the U-shaped frame 44 to move in the opposite direction to push the lower PCB board for loading. In this way, the loading work of the upper and lower PCB boards is realized intermittently. The switching structure includes a fixed sleeve 48 fixedly mounted on the middle part of the switching rod 45, and an insertion rod 47 is connected to the fixed sleeve 48. A fixed tube 46 is movably mounted on the end of the insertion rod 47 away from the fixed sleeve 48. One end of the fixed tube 46 is connected to the lifting plate 5. The lifting plate 5 moves up and down, driving the fixed tube 46, the insertion rod 47 and the fixed sleeve 48 to move up and down as a whole, thereby driving the two ends of the switching rod 45 to automatically insert into the upper or lower push hole 41 to realize the loading function.

[0020] The implementation principle of a soldering device for PCB boards in an embodiment of the present invention is as follows: first, the PCB boards to be soldered are stacked in the placement grooves 28 on the two placement plates 27 in sequence. After the other side is completed, the two placement plates 27 are respectively inserted into the second grooves 26 of the upper and lower feeding frames 25, and the positioning rods 30 pass through the positioning holes 31 on the placement plates 27 to prevent the placement plates 27 from being offset on the feeding frames 25. Under the elastic force of the spring 37, the clamping block 33 can be pulled to clamp onto the placement plates 27 to prevent the placement plates 27 from falling on the feeding frames 25. Then, the second cylinder 43 on the mounting plate 42 is started, and the second cylinder 43 drives the switching rod 45 to move away from the vertical After the frame 3 moves in the direction of movement, the first cylinder in the support frame 2 is started to drive the lifting plate 5 to move downward on the vertical frame 3, and the sliding of one end of the through rod 11 at the inclined section of the guide groove 8 drives the horizontal bar 16 to move horizontally on the lifting plate 5, and the gear 13 drives the rotating rod 12 and the turntable 10 to flip as a whole, so that the soldering head of the tin soldering gun 7 is flipped to the vertical downward direction, and the downward movement of the lifting plate 5 drives the switching rod 45 to move downward through the fixing tube 46, the insertion rod 47 and the fixing sleeve 48. When the bottom end of the switching rod 45 is inserted into the pushing hole 41 of the lower pushing plate 39, the second cylinder 43 is continued to be started to drive the switching rod 45 to move in the direction close to the vertical frame 3, thereby pushing the lower pushing plate 39, The feeding frame 25 and the placing plate 27 move as a whole toward one side of the tin soldering gun 7. When the PCB board below is automatically fed to the position below the tin soldering gun 7, the tin soldering gun 7 continues to move downward to solder the PCB board below. After soldering the PCB board below, the lifting plate 5 moves upward on the vertical frame 3, driving the tin soldering gun 7 to disengage from the PCB board below, and driving the bottom end of the switching rod 45 to be pulled out from the lower pushing hole 41, and then the second cylinder 43 drives the switching rod 45 to move in the direction away from the vertical frame 3. When the lifting plate 5 drives the top end of the switching rod 45 to be inserted into the upper pushing hole 41, the second cylinder 43 continues to drive the switching rod 45 to move in the direction close to the vertical frame 3 to push the PCB board above. When it reaches the upper position of the tin soldering gun 7, at this time, the lifting plate 5 continues to move upward, and the upward sliding of the inclined section of one end of the through rod 11 in the guide groove 8 can automatically drive the tin soldering gun 7 to flip half a circle, so that the welding head of the tin soldering gun 7 rotates to a vertically upward direction, so that the lifting plate 5 can drive the tin soldering gun 7 to move upward to solder the upper PCB board. In this reciprocating manner, the up and down movement of the tin soldering gun 7 is used to solder the upper and lower two groups of PCB boards in turn. When soldering the upper PCB board, the blower 50 can be started, and the air outlet hood 52 can blow air toward the soldering position of the upper PCB board to accelerate the solidification of the tin liquid during the soldering process, avoid the problem of dripping of the washing liquid during the soldering process, and improve the quality of the soldering work.

[0021] The above are all preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A soldering device for a PCB board, comprising a soldering station (1), characterized in that: The lower sides of the soldering station (1) are supported by support frames (2), a loading structure is provided in the middle of the upper part of the soldering station (1), a vertical frame (3) is installed at the left position on the upper part of the soldering station (1), two lifting sleeves (4) are provided on the movable sleeve of the vertical frame (3), and convex plates are connected to the side surfaces of the two lifting sleeves (4) close to each other, two first cylinders are installed in the left support frame (2), the top ends of the output shafts of the two first cylinders are connected to the corresponding convex plates, the right sides of the two lifting sleeves (4) are fastened to the lifting plate (5) by bolts, and a plurality of soldering guns (7) are provided on the lifting plate (5) through multiple groups of flip structures, two first connecting plates (9) are connected to the left side of the vertical frame (3), a vertical plate (6) is connected between the two first connecting plates (9), and a driving structure for driving the flip structure to rotate is provided on the lifting plate (5) and the vertical plate (6); The flip structure comprises a plurality of turntables (10) rotatably mounted on the lifting plate (5), the turntables (10) clamping the soldering gun (7) via a clamping structure, the turntables (10) being connected to a rotating rod (12) rotatably passing through the lifting plate (5), and each of the rotating rods (12) being fixedly sleeved with a gear (13); The driving structure includes a first sliding groove (14) provided on the left side of the two first connecting plates (9), a first slider (15) being slidably provided in the first sliding groove (14), a horizontal bar (16) being connected between the two first sliders (15), the horizontal bar (16) being provided with teeth meshing with the gear (13), a through rod (11) being connected in the middle of the horizontal bar (16), a guide groove (8) being provided on the vertical plate (6), the guide groove (8) being in a "Z" shape, and the through rod (11) passing through the guide groove (8).

2. The soldering device for PCB boards according to claim 1, characterized in that: The clamping structure includes a fixed plate (17) connected to the middle of a side surface of the turntable (10) away from the turn rod (12), the fixed plate (17) is provided with a second slide groove (18), two sleeves (19) are slidably provided in the second slide groove (18), a screw rod (20) is rotated through the second slide groove (18), one end of the sleeve (19) is provided with a thread groove for the screw rod (20) to pass through, and a rotating block (21) is fixedly provided on one end of the screw rod (20).

3. The soldering device for PCB boards according to claim 1, characterized in that: The feeding structure comprises a second connecting plate (23) arranged above the soldering station (1) near the front and rear edges, the upper and lower ends of the second connecting plate (23) are connected to fixing bars (22), the fixing bars (22) are provided with first grooves (24) on the side surfaces close to each other, a feeding frame (25) is movably inserted into the first grooves (24) of the two fixing bars (22) in each group, a second groove (26) is provided on the upper surface of the feeding frame (25), and the second groove (26) is provided on the upper surface of the second groove (26). 6) is provided with a placement plate (27), and positioning structures are provided at the front and rear edges of the placement plate (27) and the feeding frame (25), and a clamping structure is provided at one end of the placement plate (27) and the feeding frame (25), and a plurality of placement slots (28) distributed in an array are provided on the top of the placement plate (27), and a first opening (29) is provided in the middle of the lower slot wall of each placement slot (28), and the inner diameter of the first opening (29) is 0.8 times the slot diameter of the placement slot (28).

4. The soldering device for PCB boards according to claim 3, characterized in that: The positioning structure comprises two groups of positioning rods (30) connected to the front and rear of the lower groove wall of the second groove (26), and the placement plate (27) is provided with positioning holes (31) for the positioning rods (30) to pass through.

5. The soldering device for PCB boards according to claim 3, characterized in that: The clamping structure includes two clamping grooves (32) provided at the left end below the placement plate (27), a pull rod (35) being inserted into the clamping groove (32), a clamping block (33) being installed on one end of the pull rod (35) inserted into the clamping groove (32), the right edge of the upper side of the clamping block (33) being an inclined surface, a second opening (34) for the pull rod (35) to pass through being provided on the left groove wall of the clamping groove (32), the second opening (34) being in the shape of an inverted "U", a pull rod (36) being connected to one end of the pull rod (35) that is movable through the feeding frame (25), a spring (37) being sleeved on the pull rod (35), the two ends of the spring (37) being respectively connected to the pull rod (36) and the feeding frame (25).

6. The soldering device for PCB boards according to claim 3, characterized in that: A through groove (38) is provided on the groove wall of the first groove (24), and a connecting block (40) is connected to the front and rear sides of the feeding frame (25) near the pull bar (36). One end of the connecting block (40) passing through the through groove (38) is connected to a push plate (39), and a plurality of push holes (41) are provided on the push plate (39) at equal intervals. A pushing structure for intermittently pushing the two push plates (39) to move is provided on the second connecting plate (23) on the rear side.

7. The soldering device for PCB boards according to claim 6, characterized in that: The pushing structure comprises a mounting plate (42) fastened to a rear second connecting plate (23) by bolts, a second cylinder (43) being mounted on the mounting plate (42), a U-shaped frame (44) being connected to one end of an output shaft of the second cylinder (43), a switching rod (45) being vertically movable through both ends of the U-shaped frame (44), and a switching structure being provided on the switching rod (45).

8. The soldering device for PCB boards according to claim 7, characterized in that: The switching structure comprises a fixed sleeve (48) fixedly sleeved on the middle of the switching rod (45), an inserting rod (47) being connected to the fixed sleeve (48), a fixed tube (46) being movably sleeved on one end of the inserting rod (47) away from the fixed sleeve (48), and one end of the fixed tube (46) being connected to the lifting plate (5).

9. The soldering device for PCB boards according to claim 3, characterized in that: A mounting seat (49) is installed above the inner side surfaces of the two second connecting plates (23), a blower (50) is installed on the mounting seat (49), an air outlet pipe (51) is connected to the air outlet end of the blower (50), and an air outlet cover (52) is installed on one end of the air outlet pipe (51).

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