Laser grooving device

Abstract

The invention belongs to the technical field of laser processing, and particularly relates to a laser grooving device. The laser grooving device comprises a positioning structure, the positioning structure comprises a rotationally-arranged clamping disc and a rotating assembly in transmission connection with the clamping disc, the clamping disc is provided with a clamping through hole used for fixing a workpiece, and the rotating assembly is used for driving the clamping disc to rotate so that the workpiece can rotate by a preset angle; and the laser generating structure comprises a laser device used for generating laser beams and a moving assembly connected with the laser device, and the moving assembly is used for driving the laser device to move spatially so that the laser beams can machine the combination groove in the circumferential side face of the workpiece. According to the invention, the combination grooves can be formed in the positions where the injection molding part is in plastic coating contact with the liquid cooling plate, so that the reliability of plastic coating combination of the liquid cooling plate and the injection molding part is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of laser processing, and in particular relates to a laser grooving device. Background Art

[0002] With the rapid development of new energy vehicles, high-power electronic devices, and energy storage systems, efficient thermal management has become a core technical bottleneck to ensure their performance, safety, and reliability. Liquid cooling technology, with its superior heat dissipation efficiency, is increasingly becoming a key technical solution for solving high-heat flux dissipation issues. As the core heat transfer component of a liquid cooling system, the performance and reliability of the liquid cold plate directly determine the effectiveness and service life of the entire cooling system.

[0003] In the structural design of a liquid cold plate, the port area is a critical interface for connecting the plastic coolant lines, fulfilling the dual functions of sealing and pressure bearing. To ensure that the coolant does not leak under high pressure and withstands the stresses of vibration, thermal cycling, and other equipment operations, the coolant lines are typically overmolded around the ports of the metal liquid cold plate. This ensures a secure and reliable seal between the coolant lines and the metal substrate.

[0004] However, traditional surface treatments for liquid cooling plate ports include simple sandblasting, roughening, or creating shallow straight grooves. These methods offer limited improvement in the bonding area between the coolant line and the cold plate, relying primarily on intermolecular forces and limited mechanical interlocking, often resulting in insufficient bond strength. Under the impact of long-term vibration and stress changes, the plastic-metal interface can easily separate, ultimately leading to coolant leakage, causing equipment failure or even damage. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a laser grooving device, which aims to solve the problem of how to roughen the surface of a workpiece and improve the reliability of subsequent plastic coating.

[0006] To achieve the above objectives, the technical solution adopted in this application is: A laser grooving device is provided for processing a workpiece, the laser grooving device comprising: A positioning structure comprising a rotatably arranged clamping disc and a rotating assembly drivingly connected to the clamping disc, wherein the clamping disc is provided with a clamping through hole for fixing the workpiece, and the rotating assembly is used to drive the clamping disc to rotate so as to rotate the workpiece by a predetermined angle; and The laser generating structure includes a laser for generating a laser beam and a moving component connected to the laser, wherein the moving component is used to drive the laser to move in space so that the laser beam can process a bonding groove on the peripheral side of the workpiece.

[0007] In some embodiments, the peripheral side surface of the workpiece includes two first surfaces disposed opposite to each other and two second surfaces disposed opposite to each other, the two first surfaces are located between the two second surfaces, the combining groove includes a first groove segment located on the first surface and a second groove segment located on the second surface, the laser beam processes the first groove segment on the first surface, and processes the second groove segment on the second surface according to the position where the first groove segment extends to the second surface.

[0008] In some embodiments, the laser grooving device further includes a visual tracking and positioning mechanism and a controller, wherein the visual tracking and positioning mechanism is used to detect the intersection position of two first groove segments and one of the second surfaces and generate position information, and the controller controls the laser beam to process the second groove segment on the corresponding second surface according to the position information.

[0009] In some embodiments, the range of the incident angle of the laser beam incident on the peripheral side surface of the workpiece is greater than 0 and less than or equal to 90 degrees.

[0010] In some embodiments, the rotating assembly includes a rotating driver and a driving gear provided on the rotating driver, a side surface of the clamping disk is provided with a plurality of gear teeth, and the driving gear engages with the clamping disk.

[0011] In some embodiments, the positioning structure also includes a positioning shell, which has a rotating cavity. The clamping disk is installed in the rotating cavity. A guide ring groove is provided on the surface of the clamping disk. A positioning guide ring is protruded from the cavity wall of the rotating cavity toward the guide ring groove.

[0012] In some embodiments, the positioning shell includes a first fixed base and a second base docked with the first base, the rotating chamber includes a first cavity located at the first base and a second cavity located at the second base, the clamping disk includes a first clamping block located at the first cavity and a second clamping block located at the second cavity, the guide ring groove includes a first half groove located at the first clamping block and a second half groove located at the second clamping block, the positioning guide ring includes a first half ring located at the first cavity and inserted into the first half groove and a second half ring located at the second cavity and inserted into the second half groove, the clamping through hole is partially located at the first clamping block, and the other part is located at the second clamping block.

[0013] In some embodiments, the second base is rotatably connected to the first base, and the second base rotates relative to the first base to separate the first clamping block and the second clamping block.

[0014] In some embodiments, two positioning structures are provided, the two positioning structures are respectively located at two ends of the workpiece, and any of the positioning structures is provided with the laser generating structure.

[0015] In some embodiments, the moving component includes a first linear moving module and a second linear moving module connected to the first linear moving module, the laser is connected to the second linear moving module, the first linear moving module and the second linear moving module are used to drive the laser to move along a first direction and a second direction respectively, and the first direction and the second direction are orthogonal.

[0016] The beneficial effects of the present application are: the liquid cooling plate is clamped by the positioning structure and can be driven to rotate around the horizontal axis; the moving component can drive the laser to inject the laser beam into the peripheral side of the liquid cooling plate and process a coupling groove with an annular structure; the coupling groove of the annular structure can increase the subsequent contact area between the liquid cooling plate and the injection molded part; and the multiple coupling grooves are arranged at intervals along the length direction of the liquid cooling plate, so that the positions where the injection molded part contacts the liquid cooling plate are all provided with coupling grooves, thereby improving the reliability of the coupling between the liquid cooling plate and the injection molded part. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 is a flow chart of the laser grooving method provided in an embodiment of the present application; Figure 2 This is a schematic diagram of the three-dimensional structure of a laser grooving device provided in another embodiment of the present application; Figure 3 Schematic diagram of the distribution of the peripheral side of the liquid cooling plate provided in another embodiment of the present application; Figure 4 yes Figure 2 An enlarged partial cross-sectional view of the liquid cooling plate with the middle section parallel to the second surface; Figure 5 yes Figure 2 A schematic diagram of the three-dimensional structure of the positioning structure of the laser grooving device; Figure 6 yes Figure 5 A local enlarged view of point A; Figure 7 yes Figure 5 A cross-sectional schematic diagram of a positioning structure; Figure 8 yes Figure 5 An exploded schematic diagram of the positioning structure; Figure 9 yes Figure 2 A schematic diagram of a three-dimensional structure of the first clamping block and the second clamping block of the two clamping plates in a separated state; Figure 10 yes Figure 2 Schematic diagram of the three-dimensional structure of the laser generating structure.

[0019] Among them, the reference numerals in the figures are: 100, laser slotting device; 10, laser generating structure; 11, laser; 12, moving assembly; 50, positioning cylinder; 51, visual tracking positioning mechanism; 20, positioning structure; 24, driving cylinder; 200, liquid cooling plate; 140, rack; 111, laser beam; 121, first linear motion module; 1211, first fixed seat; 1212, first motor; 1213, first slider; 122, second linear motion module; 1221, second motor; 1222, second fixed seat; 1223, second lead screw; 1224, second slider; 101, first surface; 102, second surface; 110, fixed Position; 120, horizontal dividing plane; 201, coupling groove; 21, rotating assembly; 211, rotating driver; 212, driving gear; 22, clamping plate; 23, positioning housing; 231, first base; 232, second base; 233, first cavity; 234, second cavity; 235, positioning guide ring; 236, avoidance through hole; 221, first clamping block; 222, second clamping block; 224, guide ring groove; 2241, first half groove; 2242, second half groove; 2351, first half ring; 2352, second half ring; 2011, first groove section; 2012, second groove section; 223, clamping through hole; DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit this application.

[0021] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0022] See also Figures 1 to 3 , an embodiment of the present application provides a laser grooving device 100 and a laser grooving method implemented using the same.

[0023] The laser grooving device 100 is used to process a workpiece to roughen the surface of the workpiece. The workpiece can be a liquid cooling plate 200 in the new energy field. The material of the liquid cooling plate 200 can be metal, such as aluminum or aluminum alloy. The liquid cooling plate 200 is in the shape of a thin plate and has a hollow structure inside to allow liquid to flow.

[0024] See also Figures 2 to 4 The laser grooving device 100 includes: a positioning structure 20 and a laser generating structure 10.

[0025] See also Figure 2 、 Figure 3 and Figure 5 The positioning structure 20 includes a rotatable clamping disc 22 and a rotating assembly 21 that is transmission-connected to the clamping disc 22. The clamping disc 22 is provided with a clamping through-hole 223 for fixing a workpiece. The rotating assembly 21 is used to drive the clamping disc 22 to rotate so that the workpiece rotates to a predetermined angle. It can be understood that the clamping disc 22 is rotatably arranged in a vertical plane, and the length direction of the liquid cooling plate 200 is arranged in a horizontal direction. The rotation centerline of the clamping disc 22 is arranged in a horizontal direction and coincides with the centerline of the liquid cooling plate 200, so that when the clamping disc 22 rotates 180 degrees, the liquid cooling plate 200 can be turned over in place. Of course, the range of the predetermined angle is 0 to 360 degrees. For example, the predetermined angle can be 30 degrees, 45 degrees, 90 degrees, 100 degrees, 270 degrees or 360 degrees. There is no limitation here and it can be selected according to actual conditions.

[0026] See also Figure 2 、 Figure 3 and Figure 5The laser generating structure 10 includes a laser 11 for generating a laser beam 111 and a moving component 12 connected to the laser 11. The moving component 12 is used to drive the laser 11 to move in space so that the laser beam 111 can process a coupling groove 201 on the peripheral side of the workpiece. It can be understood that the laser 11 is capable of emitting a high-energy laser beam 111. When the laser beam 111 is incident on the liquid cooling plate 200, the laser beam 111 can ablate the local material of the liquid cooling plate 200. As the moving component 12 drives the laser 11 to move, the laser beam 111 can be incident on different positions of the liquid cooling plate 200, and then a coupling groove 201 can be opened on the peripheral side of the liquid cooling plate 200.

[0027] See also Figure 2 、 Figure 3 and Figure 5 It can be understood that when the liquid cooling plate 200 is arranged horizontally, the laser 11 processes part of the side surfaces on both sides of the liquid cooling plate 200 and processes the upper surface of the liquid cooling plate 200 at the same time, that is, processes part of the coupling groove 201. Then, the rotating component 21 drives the liquid cooling plate 200 to rotate 180 degrees, so that the liquid cooling plate 200 is turned over, that is, the upper surface of the liquid cooling plate 200 is located at the bottom and the lower surface of the liquid cooling plate 200 is located at the top. The laser 11 continues to process part of the side surface and the upper surface of the liquid cooling plate 200 at this time, and finally forms a coupling groove 201 with an annular structure. By driving the laser 11 to move along the length direction of the liquid cooling plate 200 through the moving component 12, a plurality of coupling grooves 201 can be opened at intervals along the length direction of the liquid cooling plate 200, and each coupling groove 201 is arranged along the circumference of the liquid cooling plate 200.

[0028] See also Figure 2 、 Figure 3 and Figure 5 The laser grooving device 100 provided in the embodiment of the present application clamps the liquid cooling plate 200 through the positioning structure 20 and can drive the liquid cooling plate 200 to rotate around the horizontal axis. The moving component 12 can drive the laser 11 to inject the laser beam 111 into the side surface of the liquid cooling plate 200 and process a coupling groove 201 with an annular structure. The coupling groove 201 with an annular structure can increase the contact area between the subsequent liquid cooling plate 200 and the injection molded part. The multiple coupling grooves 201 are arranged at intervals along the first direction, and the first direction is along the length direction of the liquid cooling plate 200, so that the positions where the injection molded part and the liquid cooling plate 200 are in contact with the overmolding are all provided with coupling grooves 201, thereby improving the reliability of the overmolding of the liquid cooling plate 200 and the injection molded part. The interlocking area and directionality of the overmolding material are increased, the bonding strength and vibration resistance are improved, and the sealing performance of the port of the liquid cooling plate 200 is enhanced, which is suitable for new energy vehicle applications in high stress environments.

[0029] See also Figure 2 、 Figure 3 and Figure 5 It can be understood that the height direction of the liquid cooling plate 200, i.e., the vertical direction, is defined as the second direction, and the width direction of the liquid cooling plate 200 is defined as the third direction. The first direction, the second direction, and the third direction can be expressed as X, Z, and Y, respectively.

[0030] Optionally, the laser 11 in this embodiment is a semiconductor laser 11, and the wavelength of the laser beam 111 is in the range of 800 to 1000 nm. In this embodiment, the wavelength of the laser beam 111 is 915 nm. In other embodiments, the wavelength can be selected based on actual conditions and is not limited here. The power of the laser 11 is in the range of 300 to 600 W, and the processing speed is in the range of 800 to 1000 mm / s.

[0031] Optionally, the thickness of the tube wall of the liquid cooling plate 200 ranges from 0.1 to 1 mm, such as 0.1 mm, 0.132 mm, 0.211 mm, 0.278 mm, 0.365 mm, 0.439 mm, 0.522 mm, 0.608 mm, 0.727 mm, 0.845 mm, 0.937 mm or 1 mm.

[0032] The width of the liquid cooling plate 200 ranges from 50 to 2000 mm, such as 50 mm, 128 mm, 233 mm, 347 mm, 519 mm, 682 mm, 915 mm, 1104 mm, 1426 mm, 1783 mm, 1956 mm, or 2000 mm.

[0033] The length of the liquid cooling plate 200 ranges from 200 to 3000 mm, such as 200 mm, 287 mm, 463 mm, 722 mm, 938 mm, 1154 mm, 1436 mm, 1769 mm, 2085 mm, 2461 mm, 2897 mm, or 3000 mm.

[0034] The height of the liquid cooling plate 200 ranges from 0.1 to 1000 mm, such as 0.1 mm, 7.3 mm, 42.8 mm, 105.6 mm, 187.2 mm, 266.5 mm, 348.9 mm, 512.4 mm, 673.7 mm, 834.1 mm, 972.6 mm, or 1000 mm.

[0035] The depth of the coupling groove 201 ranges from 0.01 mm to 100 mm, such as 0.01 mm, 0.027 mm, 0.315 mm, 1.42 mm, 3.78 mm, 8.66 mm, 15.23 mm, 27.89 mm, 46.15 mm, 72.64 mm, 98.47 mm, or 100 mm.

[0036] See also Figure 3 、 Figure 4 and Figure 6 In some embodiments, the peripheral side surface of the liquid cooling plate 200 includes two first surfaces 101 disposed opposite to each other and two second surfaces 102 disposed opposite to each other, the two first surfaces 101 are located between the two second surfaces 102, the coupling groove 201 includes a first groove section 2011 located on the first surface 101 and a second groove section 2012 located on the second surface 102, and the laser beam 111 processes the first groove section 2011 on the first surface 101 and processes the second groove section 2012 on the second surface 102 according to the position where the first groove section 2011 extends to the second surface 102.

[0037] See also Figures 2 to 4 It is understood that the first surface 101 can be a flat surface or a curved surface, and the second surface 102 is a flat surface. In this embodiment, when the liquid cooling plate 200 is arranged horizontally, the two first surfaces 101 are located on either side of the liquid cooling plate 200 and arranged along the height direction. Both are convex arc surfaces. The two second surfaces 102 are the upper surface and the lower surface, respectively, and are parallel to the horizontal plane. That is, one second surface 102 is arranged upward and the other second surface 102 is arranged downward. After the liquid cooling plate 200 is turned over, the positions of the two second surfaces 102 are interchanged.

[0038] See also Figure 3 、 Figure 4 and Figure 6 It can be understood that, during the grooving process, the upper end of the first groove section 2011 extends to the first surface 101 located above, and the lower end of the first groove section 2011 extends the horizontal dividing plane 120 of the liquid cooling plate 200. The horizontal dividing plane 120 is parallel to the horizontal plane and divides the liquid cooling plate 200 into two identical parts along the vertical direction.

[0039] See also Figure 3 、 Figure 4 and Figure 6 The two first groove sections 2011 extend to the intersection of the first surface 101 and the second surface 102, and form two positioning points 110 respectively. When processing the second groove section 2012, these two positioning points 110 are used as reference points. For example, the laser beam 111 starts from one of the positioning points 110 and ends at the other positioning point 110. The laser beam 111 performs a straight line scan between the two positioning points 110, thereby processing the second groove section 2012. The two ends of the second groove section 2012 are respectively connected to the two first groove sections 2011.

[0040] See also Figure 3 、 Figure 4 and Figure 6After the second groove section 2012 is processed on one of the second surfaces 102, the rotating assembly 21 drives the liquid cooling plate 200 to rotate 180 degrees and repeats the above processing process, that is, the first groove section 2011 is further processed on the first surface 101, and the two first groove sections 2011 are connected. Then, based on the two first groove sections 2011, the second groove section 2012 is processed on the other second surface 102, and finally the connecting groove 201 is formed.

[0041] See also Figure 3 、 Figure 4 and Figure 6 It can be understood that, in the process of processing the second groove segment 2012 on one of the second surfaces 102, only the upper half of the two first surfaces 101 are processed with a first groove segment 2011; in the process of processing the second groove segment 2012 on the other second surface 102, the lower half of the two first surfaces 101 are also processed with a first groove segment 2011, and the two first groove segments 2011 on the same first surface 101 are connected.

[0042] See also Figures 2 to 4 Alternatively, because the width of the liquid cooling plate 200 is relatively large compared to its height, the second surface 102 is easily deformed during transportation, installation, and processing of the liquid cooling plate 200, making it difficult to accurately move and process the laser beam 111. In the embodiment provided in this application, two first groove sections 2011 are first processed on each of the two first surfaces 101. Because the height of the liquid cooling plate 200 is relatively small, it is easy to control the movement and precise processing of the laser beam 111 on the first surfaces 101, and the extension path of the first groove section 2011 is less likely to deviate. The first groove section 2011 extends to the second surface 102, and then, based on the intersection point of the first groove section 2011 and the second surface 102, the two intersection points are used as two positioning points 110, and the movement of the laser beam 111 on the second surface 102 can be accurately guided, thereby accurately processing the second groove section 2012.

[0043] See also Figure 3 、 Figure 4 and Figure 6 When the second groove segment 2012 extends along the third direction, the second groove segment 2012 is unlikely to shift, and when multiple second groove segments 2012 are arranged along the first direction, adjacent second groove segments 2012 are unlikely to misalign or intersect, and each second groove segment 2012 can be arranged at a predetermined spacing, such as equal spacing. The subsequent bonding strength between the injection-molded part and the liquid cooling plate 200 is evenly distributed along the peripheral side of the liquid cooling plate 200, avoiding areas of low bonding strength that could subsequently cause separation between the plastic and metal interface under the impact of long-term vibration and stress changes. This ultimately improves the reliability of the overmolded bonding between the injection-molded part and the liquid cooling plate 200.

[0044] It can be understood that, for the same coupling groove 201 , each first groove section 2011 and each second groove section 2012 are located on the same radial plane of the liquid cooling plate 200 .

[0045] Optionally, the spacing between each coupling groove 201 increases successively in the direction away from the end face of the liquid cooling plate 200, that is, the closer to the end face of the liquid cooling plate 200, the smaller the spacing between two adjacent coupling grooves 201. This is because the closer to the outlet of the end face of the liquid cooling plate 200, the greater the pressure and stress changes, and thus it is necessary to increase the contact area between the liquid cooling plate 200 and the injection molded part. As the position is away from the end face of the liquid cooling plate 200, the spacing between two adjacent coupling grooves 201 increases, thereby reducing the number of coupling grooves 201 to be processed, improving the processing efficiency of the liquid cooling plate 200 and reducing the processing cost.

[0046] See also Figure 2 In some embodiments, the laser grooving device 100 further includes a visual tracking and positioning mechanism 51 and a controller. The visual tracking and positioning mechanism 51 is used to detect the intersection position of the two first groove segments 2011 and one of the second surfaces 102 and generate position information. The controller controls the laser beam 111 to process the second groove segment 2012 on the corresponding second surface 102 according to the position information.

[0047] See also Figure 2 Optionally, the visual tracking and positioning mechanism 51 may be a CCD camera that can accurately capture the intersection of each second groove segment 2012 and the second surface 102. During the processing, a plurality of first groove segments 2011 may be processed on one first surface 101 first, and then a plurality of first groove segments 2011 may be processed on the other first surface 101. The number of first groove segments 2011 on the two first surfaces 101 is the same, and they correspond one to one and are arranged in pairs.

[0048] See also Figures 2 to 4 The two first groove segments 2011 in the same pair extend to the intersection of the first surface 101 and the second surface 102, and form two positioning points 110 respectively. The CCD camera captures the two positioning points 110 of the same pair. When processing the second groove segment 2012, the two positioning points 110 are used as reference points. For example, the laser beam 111 starts from one of the positioning points 110 and ends at the other positioning point 110. The CCD camera sends the position information of the two positioning points 110 of the same pair to the controller. The controller controls the laser beam 111 to perform a straight line scan between the two positioning points 110, thereby processing the second groove segment 2012. Similarly, multiple second groove segments 2012 are processed on one of the second surfaces 102.

[0049] See also Figures 3 to 6Then, the rotating assembly 21 drives the liquid cooling plate 200 to flip over. Similarly, the laser beam 111 first machines first groove segments 2011 on both first surfaces 101. This process can be based on the positional information of the first groove segments 2011 on the first surface 101 before the liquid cooling plate 200 flips over, and then the first groove segments 2011 after the liquid cooling plate 200 flips over. This ensures that the number of first groove segments 2011 machined on the same first surface 101 is the same and connected. The CCD camera then scans the same pair of two positioning points 110, and the laser beam 111 scans and processes between the two positioning points 110, ultimately machining second groove segments 2012 on the other second surface 102, ultimately completing the machining of multiple coupling grooves 201.

[0050] Optionally, by real-time monitoring of the intersection position through a CCD camera, the controller can accurately control the processing path of the laser beam 111, thereby improving the processing path accuracy of the coupling groove 201, preventing the coupling grooves 201 from being misaligned, intersecting, or having their spacing accidentally increased, thereby enhancing the reliability and sealing of the overmolding interface.

[0051] It can be understood that the laser grooving device 100 provided in the embodiment of the present application can avoid the deviation of the grooving positioning caused by the uneven surface of the liquid cooling plate 200, thereby affecting the strength of the plastic-coating bonding. The CCD camera can accurately determine the two positioning points 110 of the same pair. The controller uses the two positioning points 110 as reference points to control the moving component 12 to accurately move and scan the laser beam 111 between the two positioning points 110, thereby realizing the processing of each second groove segment 2012. The processing process of each second groove segment 2012 is not affected by the shape of the second surface 102, and the grooving position will not be offset, thereby improving the processing quality and processing accuracy. Subsequently, the mechanical interlocking strength of the plastic and metal interface can be enhanced to reduce the risk of leakage.

[0052] See also Figure 4 In some embodiments, the range of the incident angle of the laser beam 111 incident on the peripheral side of the workpiece is greater than 0 and less than or equal to 90 degrees.

[0053] It can be understood that processing areas are provided at both ends of the liquid cooling plate 200 and near the end surface, and the injection molded parts are subsequently overmolded in the processing areas. The incident angle can be the angle between the laser beam 111 and the predetermined direction, the predetermined direction is parallel to the first emission direction, and the predetermined direction is from the current processing area to another processing area.

[0054] When the incident angle is 90 degrees, the coupling groove 201 is a straight-walled groove, that is, the groove wall of the coupling groove 201 is perpendicular to the second surface 102 .

[0055] See also Figures 2 to 4When the incident angle is greater than 0 and less than 90 degrees, such as 30 degrees, 45 degrees, 60 degrees or 75 degrees, the groove wall of the coupling groove 201 is in an inclined state, and the groove wall of the coupling groove 201 is inclined along the direction away from the end face of the liquid cooling plate 200, so that the coupling groove 201 has an inverted groove structure. After the subsequent overmolding with the injection molded part, the contact area between the injection molded part and the liquid cooling plate 200 can be increased, the bonding strength is improved and the sealing is higher, so that the injection molded part and the liquid cooling plate 200 are not easily separated along the first direction, and the coupling groove 201 has higher pull-out resistance.

[0056] Alternatively, the laser 11 can be rotatably mounted, for example, by mounting the laser 11 on a rotating mechanism, which can be driven to rotate the laser 11 to adjust the incident angle. The rotating mechanism can be a servo motor, and the laser 11 is mounted on the rotating shaft of the servo motor.

[0057] See also Figure 5 、 Figure 7 and Figure 8 In some embodiments, the rotating assembly 21 includes a rotating driver 211 and a driving gear 212 provided on the rotating driver 211 . A plurality of gear teeth are provided on the side surface of the clamping disk 22 , and the driving gear 212 engages with the clamping disk 22 .

[0058] See also Figure 5 、 Figure 7 and Figure 8 Optionally, the rotation driver 211 can also be a servo motor, and the driving gear 212 is installed on the output shaft of the servo motor. The clamping disk 22 is circular and is arranged to rotate around its center. The driving gear 212 can drive the clamping disk 22 to rotate, so that the liquid cooling plate 200 rotates synchronously with the clamping disk 22. After the clamping disk 22 rotates 180 degrees, the liquid cooling plate 200 also rotates 180 degrees and turns over.

[0059] As can be understood, the clamping hole 223 passes through the circular portion of the clamping plate 22, and the wall of the clamping hole 223 slightly compresses the liquid cooling plate 200, maintaining stability during processing. The driving gear 212 and the clamping plate 22 are engaged by gears, and transmission is transmitted through high-precision gears, ensuring that the clamping plate 22 drives the liquid cooling plate 200 to rotate stably to the predetermined angle, reducing machining deviations in the coupling groove 201 caused by inaccurate positioning during processing.

[0060] See also Figure 5 、 Figure 7 and Figure 8 In some embodiments, the positioning structure 20 further includes a positioning shell 23, the positioning shell 23 has a rotating cavity, the clamping disk 22 is installed in the rotating cavity, a guide ring groove 224 is provided on the surface of the clamping disk 22, and a positioning guide ring 235 is protruded from the wall of the rotating cavity toward the guide ring groove 224.

[0061] See also Figure 5 、 Figure 7 and Figure 8 As can be understood, the positioning housing 23 is provided with an escape hole 236 that extends horizontally through both sides of the positioning housing 23, allowing the liquid cooling plate 200 to be inserted into the clamping hole 223 through the escape hole 236. The guide ring groove 224 extends in a circular path, thereby guiding the clamping plate 22 to rotate about its center of circle through the cooperation of the positioning guide ring 235 and the guide ring groove 224. Guide ring grooves 224 are provided on both sides of the clamping plate 22, and each guide ring groove 224 is provided with a positioning guide ring 235. The two guide ring grooves 224 cooperate with the two positioning guide rings 235, ensuring that the clamping plate 22 rotates smoothly within the rotating chamber and preventing radial or axial deviation of the liquid cooling plate 200.

[0062] It is understandable that the positions of the guide ring groove 224 and the positioning guide ring 235 can be interchanged, that is, the guide ring groove 224 is opened on the inner wall of the rotating chamber, and the positioning guide ring 235 is protruded on the disk surface of the clamping disk 22.

[0063] See also Figure 5 、 Figure 7 and Figure 8 In some embodiments, the positioning shell 23 includes a first base 231 that is fixedly arranged and a second base 232 that is docked with the first base 231, the rotating chamber includes a first cavity 233 located at the first base 231 and a second cavity 234 located at the second base 232, the clamping disk 22 includes a first clamping block 221 located at the first cavity 233 and a second clamping block 222 located at the second cavity 234, the guide ring groove 224 includes a first half groove 2241 located at the first clamping block 221 and a second half groove 2242 located at the second clamping block 222, the positioning guide ring 235 includes a first half ring 2351 located at the first cavity 233 and inserted into the first half groove 2241 and a second half ring 2352 located at the second cavity 234 and inserted into the second half groove 2242, and the clamping through hole 223 is partially located at the first clamping block 221, and the other part is located at the second clamping block 222.

[0064] See also Figure 5 、 Figure 7 and Figure 8Optionally, the first base 231 is fixed to the rack 140, and the second base 232 is located above the first base 231. The first clamping block 221 and the second clamping block 222 have the same structure. The first clamping block 221 and the second clamping block 222 are connected to form a circular clamping disk 22, which can clamp the liquid cooling plate 200. The first clamping block 221 and the second clamping block 222 can be separated and opened to facilitate the removal or installation of the liquid cooling plate 200. The first half groove 2241 and the second half groove 2242 have the same length, and the first half ring 2351 and the second half ring 2352 also have the same length.

[0065] By arranging the positioning housing 23 and the clamping plate 22 in a split type, it is possible to adapt to the clamping of liquid cooling plates 200 of different sizes and shapes, and facilitate the processing and installation of the positioning housing 23 and the clamping plate 22.

[0066] Optionally, the first base 231 is provided with an avoidance groove communicating with the first cavity 233 . The avoidance groove is located at the bottom of the first base 231 , and the driving gear 212 engages with the clamping plate 22 at the avoidance groove, which is conducive to a compact structure.

[0067] See also Figure 5 、 Figure 7 and Figure 8 In some embodiments, the second base 232 is rotatably connected to the first base 231 , and the second base 232 rotates relative to the first base 231 to separate the first clamping block 221 and the second clamping block 222 .

[0068] See also Figure 9 Optionally, the second base 232 rotates a certain angle relative to the first base 231, such as 90 degrees, and the second clamping block 222 rotates synchronously with the second base 232 and separates from the first clamping block 221, thereby improving the flexibility and operational convenience of the liquid cooling plate 200.

[0069] Optionally, the positioning structure 20 also includes a driving cylinder 24, the piston rod of the driving cylinder 24 is connected to the second base 232 and is used to drive the second base 232 to rotate, and when the first clamping block 221 and the second clamping block 222 are docked, the driving cylinder 24 keeps the second base 232 in position unchanged to improve the stability of the docking of the first clamping block 221 and the second clamping block 222.

[0070] See also Figure 2 and Figure 9 In some embodiments, two positioning structures 20 are provided. The two positioning structures 20 are respectively located at two ends of the liquid cooling plate 200 , and each positioning structure 20 is provided with a laser generating structure 10 .

[0071] It can be understood that by defining two positioning structures 20 at each end of the liquid cooling plate 200, each positioning structure 20 is equipped with a laser generating structure 10, which significantly improves processing efficiency and processing consistency of the bonding groove 201. The arrangement of dual positioning structures 20 and dual laser generating structures 10 simultaneously clamps and processes both ends of the liquid cooling plate 200, ensuring that the bonding groove 201 is evenly distributed around the side surface of the liquid cooling plate 200, thereby improving processing speed and groove consistency.

[0072] See also Figure 2 Optionally, the laser slotting device 100 further includes a positioning cylinder 50 disposed on the frame 140. One end of the liquid cooling plate 200 abuts the positioning cylinder 50 in the horizontal direction. The positioning cylinder 50 can be used to quickly position the liquid cooling plate 200 on the frame 140. The initial positioning position of the liquid cooling plate 200 is adjusted by moving the piston rod of the positioning cylinder 50. Since the liquid cooling plate 200 is positioned in the horizontal direction, the piston rod of the positioning cylinder 50 does not need to be moved when the liquid cooling plate 200 is turned over. After the liquid cooling plate 200 is turned over in place, the positioning cylinder 50 still effectively positions the liquid cooling plate 200, thereby improving the positioning efficiency of the liquid cooling plate 200. Since the positioning cylinder 50 does not need to be moved during the turning process, the positioning accuracy before and after the turning can be made consistent, ultimately improving processing efficiency and processing accuracy.

[0073] See also Figure 10 In some embodiments, the moving component 12 includes a first linear moving module 121 and a second linear moving module 122 connected to the first linear moving module 121. The laser 11 is connected to the second linear moving module 122. The first linear moving module 121 and the second linear moving module 122 are used to drive the laser 11 to move along a first direction and a second direction, respectively. The first direction and the second direction are orthogonal.

[0074] Optionally, the first linear motion module 121 includes a first fixed seat 1211, a first slider 1213 slidably connected to the first fixed seat 1211, a first lead screw threadedly connected to the first slider 1213, and a first motor 1212 that drives the first lead screw to rotate. The second linear motion module 122 is connected to the first slider 1213, and the first motor 1212 converts the rotational motion into the linear motion of the first slider 1213 through the first lead screw, thereby driving the second linear motion module 122 to move back and forth along the first direction.

[0075] The second linear motion module 122 includes a second fixed base 1222 connected to the first fixed base 1211, a second slider 1224 slidably connected to the second fixed base 1222, a second lead screw 1223 threadedly connected to the second slider 1224, and a second motor 1221 that drives the second lead screw 1223. The laser 11 is connected to the second slider 1224. The second motor 1221 converts the rotational motion of the second slider 1224 into linear motion via the second lead screw 1223, thereby driving the laser 11 to reciprocate along the second direction.

[0076] It can be understood that the laser 11 has a processing stroke, which can project the laser beam 111 along the third direction, so that the laser beam 111 scans the liquid cooling plate 200 along the third direction, ensuring that the laser beam 111 can accurately track the contour of the side surface of the liquid cooling plate 200 and process a uniform and annular coupling groove 201.

[0077] The working process of the laser slotting device 100 is as follows: First, place the liquid cooling plate 200 horizontally on the first clamping block 221, and use the reference positioning function of the first clamping block 221 to ensure the initial placement position; Subsequently, the three-axis positioning cylinder 50 on the left end is activated to push the end surface of the liquid cooling plate 200 to complete the precise confirmation of the processing position and realize the calibration of the processing benchmark; Then, the driving cylinder 24 drives the second clamping block 222 downward to firmly fix the liquid cooling plate 200 on the clamping plate 22, effectively avoiding displacement deviation caused by vibration during the processing; At this time, the two lasers 11 are started synchronously, scanning and processing the side surfaces of the port portions at both ends of the liquid cooling plate 200, respectively, using a highly focused laser beam 111 to process the side surfaces. At the same time, the visual tracking and positioning mechanism locates and confirms the processing end points of the two first surfaces 102101, and determines the two positioning points 110. Then, the highly focused laser beam 111 is used to perform roughening processing (i.e., grooving processing) on ​​the second surface of the liquid cooling plate 200. The high energy characteristics of the laser form a regular groove structure on the metal surface. In this way, multiple first docking grooves arranged in an array are processed. After one side of the liquid cooling plate 200 is processed, the servo motor drives the horizontally placed liquid cooling plate 200 to be precisely flipped so that the other unprocessed side of the liquid cooling plate 200 faces upward, and then the plate is grooved according to the same processing parameters and process. In this way, multiple second docking grooves arranged in an array are processed, and the two ends of each first docking groove are connected to each second docking groove respectively, finally realizing the processing of high-quality annular structure coupling grooves 201 on both sides of the two ports of the liquid cooling plate 200.

[0078] The laser grooving device 100 provided in this embodiment utilizes a precise visual tracking and positioning mechanism and laser processing technology to create a uniform, design-compliant roughened structure and groove morphology on the surface of the liquid cooling plate 200. This critical processing step ensures the accuracy of the grooved positions on the liquid cooling plate 200 and forms a strong mechanical bond between the plastic pipe covering the port and the metal base of the liquid cooling plate 200 during subsequent injection molding. This fundamentally avoids problems such as leakage and loosening caused by a loose bond, laying a solid foundation for the overall performance of the liquid cooling system.

[0079] See also Figure 1 The present invention also proposes a laser grooving method, which uses the above-mentioned laser grooving device 100. The specific structure of the laser grooving device 100 refers to the above-mentioned embodiment. Since this laser grooving method adopts all the technical solutions of all the above-mentioned embodiments, it also has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0080] See also Figure 1 , the laser grooving method includes the following steps: S1: Prepare the positioning structure 20 and the laser generating structure 10; S2: The positioning structure 20 includes a rotatably arranged clamping disk 22 and a rotating assembly 21 that is transmission-connected to the clamping disk 22. The clamping disk 22 is provided with a clamping through-hole 223, and the workpiece is inserted into and fixed in the clamping through-hole 223. S3: First grooving: The laser generating structure 10 includes a laser 11 for generating a laser beam 111 and a moving assembly 12 connected to the laser 11. The moving assembly 12 drives the laser 11 to move in space so that the laser beam 111 processes a first butt-jointing groove on a portion of the circumferential side surface of the workpiece. S4: Turning over: the rotating assembly 21 drives the clamping plate 22 to rotate so as to turn the workpiece over; S5: Second grooving: The moving assembly 12 drives the laser 11 to move in space, so that the laser beam 111 processes a second butt joint groove on another portion of the circumferential side surface of the workpiece. The two ends of the first butt joint groove are respectively connected to the two ends of the second butt joint groove, forming a connecting groove 201. In this embodiment, the workpiece is a liquid cooling plate 200.

[0081] See also Figure 3 、 Figure 5 and Figure 6 In some embodiments, the peripheral side surface of the workpiece includes two first surfaces 101 disposed opposite to each other and two second surfaces 102 disposed opposite to each other, the two first surfaces 101 are located between the two second surfaces 102, and one of the second surfaces 102 is disposed upward and the other second surface 102 is disposed downward; In the turning step, the positions of the two second surfaces 102 are interchanged; In the first grooving step, the laser beam 111 opens two first groove sections 2011 on the two first surfaces 101 respectively, and then opens a second groove section 2012 on the upwardly disposed second surface 102 based on the two first groove sections 2011. The two ends of the second groove section 2012 are respectively connected to the two first groove sections 2011, and together form a first docking groove.

[0082] See also Figure 3 、 Figure 5 and Figure 6 In some embodiments, during the second grooving step, the laser beam 111 further forms two first groove sections 2011 on the two first surfaces 101, and a second groove section 2012 is formed on the upwardly disposed second surface 102 according to the two first groove sections 2011. The two ends of the second groove section 2012 are respectively connected to the two first groove sections 2011 to form a second docking groove together; the two first groove sections 2011 located on the same first surface 101 are connected.

[0083] See also Figure 3 、 Figure 5 and Figure 6 In some embodiments, the laser grooving device 100 further includes a visual tracking and positioning mechanism 51 and a controller. The visual tracking and positioning mechanism 51 is used to detect the intersection position of the upwardly disposed second surface 102 and the corresponding two first groove segments 2011 and generate position information. The controller controls the laser beam 111 to process the second groove segment 2012 on the upwardly disposed second surface 102 according to the position information.

[0084] It can be understood that the intersection position is the positioning point 110 , and based on the two positioning points 110 on both sides of the same second surface 102 , the laser beam 111 is controlled to scan and process the second groove section 2012 between the two positioning points 110 .

[0085] The above are merely optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A laser grooving device for processing a workpiece, characterized in that: The laser grooving device comprises: A positioning structure comprising a rotatably arranged clamping disc and a rotating assembly drivingly connected to the clamping disc, wherein the clamping disc is provided with a clamping through hole for fixing the workpiece, and the rotating assembly is used to drive the clamping disc to rotate so as to rotate the workpiece by a predetermined angle; and The laser generating structure includes a laser for generating a laser beam and a moving component connected to the laser, wherein the moving component is used to drive the laser to move in space so that the laser beam can process a bonding groove on the peripheral side of the workpiece.

2. The laser slotting device according to claim 1, wherein: The peripheral side surface of the workpiece includes two first surfaces disposed opposite to each other and two second surfaces disposed opposite to each other, the two first surfaces are located between the two second surfaces, the combining groove includes a first groove segment located on the first surface and a second groove segment located on the second surface, the laser beam processes the first groove segment on the first surface, and processes the second groove segment on the second surface according to the position where the first groove segment extends to the second surface.

3. The laser slotting device according to claim 2, wherein: The laser grooving device also includes a visual tracking and positioning mechanism and a controller. The visual tracking and positioning mechanism is used to detect the intersection position of two first groove segments and one of the second surfaces and generate position information. The controller controls the laser beam to process the second groove segment on the corresponding second surface based on the position information.

4. The laser slotting device according to any one of claims 1 to 3, wherein: The range of the incident angle of the laser beam incident on the peripheral side surface of the workpiece is greater than 0 and less than or equal to 90 degrees.

5. The laser slotting device according to any one of claims 1 to 3, wherein: The rotating assembly includes a rotating driver and a driving gear provided on the rotating driver. A plurality of gear teeth are provided on the side surface of the clamping disk, and the driving gear meshes with the clamping disk.

6. The laser slotting device according to any one of claims 1 to 3, characterized in that: The positioning structure also includes a positioning shell having a rotating cavity. The clamping disk is installed in the rotating cavity. A guide ring groove is opened on the surface of the clamping disk. A positioning guide ring is protruded from the cavity wall of the rotating cavity toward the guide ring groove.

7. The laser slotting device according to claim 6, wherein: The positioning shell includes a first fixed base and a second base docked with the first base, the rotating chamber includes a first cavity located in the first base and a second cavity located in the second base, the clamping disk includes a first clamping block located in the first cavity and a second clamping block located in the second cavity, the guide ring groove includes a first half groove located in the first clamping block and a second half groove located in the second clamping block, the positioning guide ring includes a first half ring located in the first cavity and inserted into the first half groove, and a second half ring located in the second cavity and inserted into the second half groove, the clamping through hole is partially located in the first clamping block, and the other part is located in the second clamping block.

8. The laser slotting device according to claim 7, wherein: The second base is rotatably connected to the first base, and the second base rotates relative to the first base to separate the first clamping block and the second clamping block.

9. The laser slotting device according to any one of claims 1 to 3, characterized in that: Two positioning structures are provided, and the two positioning structures are respectively located at two ends of the workpiece, and any one of the positioning structures is provided with the laser generating structure.

10. The laser slotting device according to any one of claims 1 to 3, characterized in that: The moving component includes a first linear moving module and a second linear moving module connected to the first linear moving module. The laser is connected to the second linear moving module. The first linear moving module and the second linear moving module are used to drive the laser to move along a first direction and a second direction respectively. The first direction and the second direction are orthogonal.

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