Automatic polishing equipment for sealing surface along grains

By designing automatic polishing equipment, combined with floating components and guide springs, automatic polishing of the sealing surface is achieved, which solves the problems of low polishing efficiency and inconsistent effects, improves the yield rate and production efficiency, and is suitable for sealing surface polishing.

CN120715786APending Publication Date: 2025-09-30HEBEI HANGRUI XINKE PRECISION MASCH CO LTD
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Patent Information

Application Number
CN202511072613.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-01
Publication Date
2025-09-30

AI Technical Summary

Technical Problem

In the prior art, the polishing efficiency of sealing workpieces is low, the polishing effect is inconsistent, and it is difficult to achieve large-scale economic production. In addition, the efficiency of manual fine polishing is low and the yield rate is low.

Method used

An automatic polishing equipment for sealing surface along the grain is designed. It adopts a machine table, a grinding head assembly, a displacement assembly and a rotary drive unit, combined with a floating assembly and a guide spring, to realize automatic polishing of the grinding head assembly along the trajectory contour of the sealing surface, ensuring appropriate contact pressure and guidance, and is suitable for different sealing surface shapes.

Benefits of technology

It realizes automatic and efficient polishing of the sealing surface, improves the consistency of the polishing effect and the yield rate, is suitable for large-scale production, and reduces the requirements for operating skills and maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of polishing equipment, and particularly relates to automatic sealing surface rift-grain polishing equipment which comprises a machine table and a grinding head assembly, a workpiece clamping tool is arranged on the machine table, the key point is that a displacement assembly and a rotary driving unit are arranged on the machine table, a base plate is arranged on the displacement assembly, and the grinding head assembly is arranged on the base plate. A floating assembly capable of floating up and down along the Z axis is arranged on the base plate, the grinding head assembly is fixedly connected with the first rotating shaft and arranged on the floating assembly through the first rotating shaft, and the grinding head assembly has the freedom degree of moving along the X axis, the Y axis and the Z axis relative to the machine table through a displacement assembly. The grinding head assembly is connected with the rotation driving unit and has the freedom degree of rotating around the axis of the first rotating shaft under driving of the rotation driving unit, and the axis of the first rotating shaft is parallel to the Z axis. According to the equipment, the sealing face of a workpiece can be automatically and efficiently polished along grains, the polishing effect is effectively improved, and the yield of the workpiece is increased.
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Description

Technical Field

[0001] The invention belongs to the technical field of polishing equipment, and in particular relates to an automatic polishing equipment for sealing surfaces along grains. Background Art

[0002] In modern industrial production, improving sealing performance is crucial to equipment reliability and efficiency. Traditional metal sealing components, resulting from milling and grinding processes, often have high surface roughness, which can easily lead to poor sealing and leakage. This problem is particularly acute in high-pressure, high-temperature, or corrosive environments. To overcome this challenge, along-the-grain polishing has been introduced into the sealing manufacturing process. Along-the-grain polishing is a sophisticated surface treatment process that polishes along the material's grain—the contour of the sealing surface—to significantly improve the smoothness and flatness of the sealing surface. Along-the-grain polishing significantly reduces surface roughness and creates a more uniform microstructure, minimizing minor gaps and irregularities between sealing surfaces. This not only effectively enhances sealing performance, reduces the risk of leakage, but also extends the service life of the seal. Furthermore, along-the-grain polishing protects against corrosion and contamination. By removing surface oxides and impurities, polished sealing components exhibit enhanced corrosion resistance when exposed to corrosive media, making them particularly suitable for applications requiring high cleanliness, such as semiconductors and optics.

[0003] Existing processes for preparing the surface of sealing workpiece substrates and performing parallel-grain polishing typically rely on manual fine grinding. This method is not only inefficient but also suffers from inconsistent polishing results and low yield rates, making it difficult to achieve cost-effective large-scale production. Summary of the Invention

[0004] In order to solve the problems existing in the above-mentioned prior art, the present invention provides an automatic polishing device for sealing surfaces along the grain, which can automatically and efficiently polish the sealing surface of a workpiece along the grain, effectively improving the polishing effect and increasing the yield rate of the workpiece.

[0005] The specific technical solution adopted in the present invention is:

[0006] A sealing surface along the grain automatic polishing equipment includes a machine table and a grinding head assembly. The machine table is provided with a workpiece clamping tool. The key is that the machine table is provided with a displacement assembly and a rotation drive unit. The displacement assembly is provided with a base plate. The base plate is provided with a floating assembly that can float up and down along the Z axis. The grinding head assembly is fixedly connected to a first rotating shaft and is arranged on the floating assembly with the help of the first rotating shaft. The grinding head assembly has the freedom to move relative to the machine table along the X axis, Y axis, and Z axis with the help of the displacement assembly. The grinding head assembly is connected to the rotation drive unit and has the freedom to rotate around the axis of the first rotating shaft with the help of the rotation drive unit. The axis of the first rotating shaft is arranged parallel to the Z axis.

[0007] The floating assembly includes a floating base, a guide rail and a first spring. The floating base is connected to the base plate with the help of the guide rail. The guide rail is arranged parallel to the Z axis. The upper end of the first spring is connected to the floating base and the lower end is connected to the base plate. The first rotating shaft can be rotatably set on the floating base.

[0008] The grinding head assembly includes sandpaper and a grinding head. The upper end of the grinding head is fixedly connected to the first rotating shaft. The sandpaper is U-shaped and wraps the lower end of the grinding head. The lower end of the grinding head is plugged into the clamp to fix the sandpaper. The clamp is connected to the upper end of the grinding head by means of a second spring.

[0009] The rotation drive unit includes a motor arranged on the floating assembly, and the first rotating shaft is connected to the motor power.

[0010] The floating assembly is provided with a rotation angle sensor of the first rotating shaft.

[0011] The grinding head assembly includes a driving wheel, a driven wheel and a sanding belt. The sanding belt is sleeved on the driving wheel and the driven wheel and is tensioned by means of the driving wheel and the driven wheel. The driving wheel is connected to the first rotating shaft by means of a mounting frame. The driven wheel is cantilevered downward from the mounting frame to support the contact between the sanding belt and the sealing surface of the workpiece.

[0012] The rotary drive unit includes a guide spring, an inner guide plate and an outer guide plate. The inner guide plate and the outer guide plate are respectively installed above the workpiece and fixed by means of clamping tooling. The outer wall of the inner guide plate and the inner wall of the outer guide plate are offset from the trajectory of the sealing surface of the workpiece and matched to form an annular guide groove. The guide springs are respectively arranged on the left and right sides of the grinding head assembly. The two ends of the guide springs are respectively cantilevered in the front and rear directions of the grinding head assembly and form a guiding fit with the guide groove.

[0013] The displacement component is a slide module.

[0014] The beneficial effects of the present invention are:

[0015] The present invention arranges the grinding head module on the slide module, and the grinding head module has the freedom to rotate around the axis of the first rotating shaft on the slide module with the help of a rotary drive mechanism. The first rotating shaft is arranged parallel to the Z axis, and is combined with the slide module to drive the grinding head module to move, thereby realizing reciprocating cyclical along-grain polishing of the grinding head assembly along the trajectory profile of the sealing surface, realizing automated along-grain polishing, saving manpower labor, and also helping to improve work efficiency, making the polishing effect consistent, improving the yield rate, and being suitable for large-scale production.

[0016] The floating assembly enables the grinding head assembly to float in the Z-axis direction, ensuring that the sealing surface of the grinding head assembly and the workpiece always maintains appropriate contact pressure, improving the smoothness and flatness of the sealing surface after polishing, and ensuring consistent polishing effect.

[0017] The rotary drive mechanism includes a guide spring, an inner guide plate and an outer guide plate. With the help of the inner guide plate and the outer guide plate on the guide spring, it can automatically follow the trajectory contour of the sealing surface to drive the grinding head to rotate. Combined with the X-axis and Y-axis movement, the sealing surface can be polished along the grain, realizing mechanically guided drive rotation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 Schematic diagram of the assembly of the grinding head assembly and the base plate of Example 1;

[0020] Figure 3 for Figure 2 Exploded diagram;

[0021] Figure 4 Schematic diagram of the working state of the grinding head assembly of Example 2;

[0022] Figure 5 for Figure 4 The main view;

[0023] Figure 6 for Figure 5 AA section view;

[0024] Figure 7 for Figure 5 BB cross-sectional view;

[0025] Figure 8 Schematic diagram of the grinding head assembly state of Example 3;

[0026] Figure 9 is a top view of the grinding head assembly of Example 3;

[0027] Figure 10 for Figure 9 CC sectional view;

[0028] In the accompanying drawings, 1. machine, 2. grinding head assembly, 201. sandpaper, 202. grinding head, 203. clamp, 204. driving wheel, 205. driven wheel, 206. sanding belt, 207. second spring, 3. workpiece, 301. sealing surface, 4. clamping fixture, 5. displacement assembly, 6. base plate, 7. floating base, 8. guide rail, 901. guide spring, 902. inner guide plate, 903. outer guide plate, 904. motor, 10. first spring, 11. first rotating shaft, 12. rotation angle sensor, 13. rotating base, 14. mounting bracket, 1401. first plate, 1402. second plate, 1403. third plate, 1404. fourth plate. DETAILED DESCRIPTION

[0029] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0030] Example 1, as Figure 1 As shown, this embodiment relates to an automatic polishing device for a sealing surface along the grain, comprising a machine table 1 and a grinding head assembly 2. The machine table 1 is provided with a clamping tool 4 for a workpiece 3. The key point is that the machine table 1 is provided with a displacement assembly 5 and a rotation drive unit, the displacement assembly 5 is provided with a base plate 6, and the base plate 6 is provided with a floating assembly that can float up and down along the Z axis. The grinding head assembly 2 is fixedly connected to the first rotating shaft 11 and is arranged on the floating assembly with the help of the first rotating shaft 11. The grinding head assembly 2 has the freedom to move along the X axis, Y axis and Z axis relative to the machine table 1 with the help of the displacement assembly 5. The grinding head assembly 2 is connected to the rotation drive unit and has the freedom to rotate around the axis of the first rotating shaft 11 with the help of the rotation drive unit. The axis of the first rotating shaft 11 is arranged parallel to the Z axis.

[0031] Among them, the displacement component 5 is a slide module, which includes an X-axis slide module, a pair of Y-axis slide modules and a Z-axis slide module. The X-axis slide module, a pair of Y-axis slide modules and the Z-axis slide module constitute a three-degree-of-freedom gantry slide module. The Y-axis slide module is fixed on the machine 1 through a fixed seat, the X-axis slide module is installed on the Y-axis slide module through a first fixed bracket, and the Z-axis slide module is set on the X-axis slide through a second fixed bracket. The X-axis drag chain, Y-axis drag chain and Z-axis drag chain respectively fix the cables of each axis slide module therein to provide physical protection, prevent the cables from being affected by external forces such as friction, collision and pulling, and reduce the risk of cable wear, rupture and damage.

[0032] The slide module mainly consists of an extruded aluminum slide bracket, a ball screw, a linear guide, a slide, a motor, a photoelectric switch, and a contact. The linear guide is the basic component of the slide module, used to support and guide the movement of the slide. The slide is the moving component in the slide module, and is installed on the linear guide to achieve reciprocating motion. The motor is responsible for providing power to the slide, allowing it to move along the linear guide. The ball screw is used to achieve efficient conversion between linear motion and rotational motion, reducing friction and improving motion accuracy. The photoelectric switch is used to achieve high-precision working positioning, and through control, precise positioning of the linear module during operation is achieved. Among the photoelectric switches, two are safety limit switches and one is the initial zero position switch. The zero return logic for power-on initialization is that the contact on the slide first returns to zero at high speed, passes the initial zero position switch, and then returns to zero at low speed in the opposite direction. This control logic can ensure the accuracy of each zero return.

[0033] The substrate 6 is arranged on the Z-axis slide module, so that the grinding head assembly 2 can move along the X-axis, Y-axis, and Z-axis directions. The rotary drive unit drives the grinding head assembly 2 to rotate around the axis of the first rotating shaft 11, so that the grinding head assembly 2 can perform reciprocating cyclical polishing along the trajectory profile of the sealing surface 301.

[0034] The floating assembly enables the grinding head assembly 2 to float in the Z-axis direction, ensuring that the sealing surface 301 of the grinding head assembly 2 and the workpiece 3 always maintains appropriate contact pressure, thereby improving the smoothness and flatness of the sealing surface 301 after polishing.

[0035] like Figure 2 、 Figure 3 As shown, the floating assembly includes a floating base 7, a guide rail 8 and a first spring 10. The floating base 7 is connected to the substrate 6 with the help of the guide rail 8. The guide rail 8 is arranged parallel to the Z axis and is fixed on the substrate 6. A slider is fixedly connected to the floating base 7 and cooperates with the guide rail 8. The guiding cooperation between the channel slider and the guide rail 8 improves the movement accuracy of the floating base 7 and prevents the grinding head assembly 2 from deflecting; the upper end of the first spring 10 is connected to the floating base 7 and the lower end is connected to the substrate 6. The first spring 10 is a tension spring, which generates a pulling force on the floating base 7 so that the floating base 7 can float up and down, ensuring the positive pressure when the grinding head assembly 2 contacts the sealing surface 301. The substrate 6 can be raised and lowered along the Z axis to adjust the stretching amount of the first spring 10, thereby changing the friction between the grinding head assembly 2 and the sealing surface 301, thereby improving the polishing effect.

[0036] The first rotating shaft 11 can be rotatably set on the floating base 7. Specifically, a rotating base 13 is installed on the floating base 7. The first rotating shaft 11 is installed on the rotating base 13 with the help of a bearing and is connected to the floating base 7 with the help of the rotating base 13. The first rotating shaft 11 is fixed to the motor shaft of the motor 904 through a coupling. The motor 904 is installed on the rotating base 13. The first rotating shaft 11 can only rotate around its own axis and cannot move axially, thereby avoiding the risk of the grinding head assembly 2 colliding with the workpiece to generate axial force transmitted to the motor shaft, thereby protecting the motor 904.

[0037] The floating base 7 is provided with a rotation angle sensor 12 of the first rotating shaft 11 . The rotation angle sensor 12 monitors the rotation angle of the grinding head assembly 2 in real time, thereby improving the accuracy of the polishing path of the grinding head assembly 2 .

[0038] like Figure 2 、 Figure 3 As shown, the grinding head assembly 2 includes sandpaper 201 and a grinding head 202. The upper end of the grinding head 202 is fixedly connected to the first rotating shaft 11. The sandpaper 201 is U-shaped and wraps around the lower end of the grinding head 202. The lower end of the grinding head 202 engages with a clamp 203 to secure the sandpaper 201. The clamp 203 is connected to the upper end of the grinding head 202 via a second spring 207. The clamp 203 engages with the lower end of the grinding head 202 via a through hole provided in the clamp 203. The upper end of the grinding head 202 and the sidewalls of the clamp 203 are each provided with a protrusion that hooks with the hooks at both ends of the second spring 207. The sandpaper 201 cut to size is clamped between the clamp 203 and the grinding head 202. The second spring 207 provides an upward pulling force for the clamp 203, so that the clamp 203 and the grinding head 202 match to clamp the sandpaper 201. When the sandpaper 201 needs to be replaced, the second spring 207 can be removed or the clamp 203 is pulled downward to quickly remove the sandpaper 201 and put new sandpaper 201 between the clamp 203 and the grinding head 202, which helps to quickly replace the sandpaper.

[0039] During operation, the workpiece 3 is first surface treated, such as deburring and degreasing, to control the smoothness of the workpiece 3; then the workpiece 3 is fixed on the machine table 1 with the help of the clamping tool 4, and then the workpiece is automatically polished along the grain, and different mesh sandpapers are used for semi-finishing polishing and fine polishing automatic polishing.

[0040] The difference between Example 2 and Example 1 is that the only difference lies in the rotation drive unit, and the rotation angle sensor 12 is not required.

[0041] like Figure 4-7As shown, the rotational drive unit in this embodiment includes a guide spring 901, an inner guide plate 902, and an outer guide plate 903. The inner guide plate 902 and the outer guide plate 903 are each mounted above the workpiece 3 and secured by a clamping fixture. The outer sidewalls of the inner guide plate 902 and the inner sidewalls of the outer guide plate 903 are offset from the trajectory of the sealing surface 301 of the workpiece 3 and form an annular guide groove. The guide springs 901 are respectively disposed on the left and right sides of the grinding head assembly 2. The ends of the guide springs 901 extend in the front-to-back direction of the grinding head assembly 2 and form a guiding engagement with the guide groove. The first rotating shaft 11 is not connected to the motor 904. The rotation of the grinding head module 2 about the axis of the first rotating shaft 11 caused by the trajectory of the sealing surface 301 eliminates the motor drive of Example 1 and adopts a mechanically guided drive instead.

[0042] This embodiment is applicable to a workpiece in which the trajectory of the sealing surface 301 is arranged around a through hole, so that the clamping tool 4 can fix the inner guide plate 902 through the through hole of the workpiece.

[0043] Specifically, such as Figure 7 As shown, the middle part of the guide spring piece 901 is in contact with the side wall of the clamp 203, and the front and rear ends of the guide spring piece 901 are respectively cantilevered in the front and rear directions by the clamp 203 to form an overhanging part, and the overhanging part of the guide spring piece 901 can be squeezed by the guide groove to produce deformation; the moving component 5 drives the grinding head component 2 to move along the X-axis and the Y-axis. When the straight section of the sealing surface 301 is polished, a gap is set between the guide spring piece 901 on the left side of the clamp 203 and the inner side wall of the outer guide plate 903, and the guide spring piece 901 on the right side of the clamp 203 is in contact with the outer side wall of the inner guide plate 902; when the grinding head module When the guide spring 901 moves to the curved corner, the overhanging end of the left guide spring 901 is squeezed against the curved corner of the inner side wall of the outer guide plate 903. The overhanging end of the left guide spring 901 is deformed by the squeezing of the outer guide plate 903 and transmits the force to the clamp 203. The right guide spring 901 abuts against the curved corner of the outer side wall of the inner guide plate 902, so that the clamp 203 can drive the grinding head 202 to rotate around the axis of the first rotating shaft 11. Combined with the movement of the X-axis and Y-axis, the grinding head 202 automatically follows the trajectory contour of the sealing surface 301 to polish the sealing surface 301 along the grain.

[0044] This embodiment not only reduces the maintenance cost of high-precision electrical equipment by reducing the number of motors and sensors, but also achieves the adaptability of the grinding head 202 to the grinding trajectory with the help of the guiding cooperation of the inner guide plate 902, the outer guide plate 903 and the guide spring 901. There is no need to calculate the plane position of the grinding head 202 to match the rotation angle of the motor, which reduces the skill requirements for the operator. While simplifying the structure and reducing costs, it improves the adaptability to complex sealing surface trajectories and the polishing stability.

[0045] Example 3 is basically the same as Example 2, except that Figures 8-10 As shown, the grinding head assembly 2 includes a driving wheel 204, a driven wheel 205 and a sanding belt 206. The sanding belt 206 is sleeved on the driving wheel 204 and the driven wheel 205 and is tensioned by means of the driving wheel 204 and the driven wheel 205. The driving wheel 204 is connected to the first rotating shaft 11 by means of the mounting frame 14, and the driven wheel 205 is cantilevered downward from the mounting frame 14 to support the sanding belt 206 in contact with the sealing surface 301 of the workpiece 3.

[0046] This embodiment is suitable for processing a sealing surface 301 that is flush with or protrudes from the end surface of the workpiece 3 .

[0047] The mounting frame 14 includes a first plate 1401, a second plate 1402, a third plate 1403, and a fourth plate 1404. The driving wheel 204 and the driven wheel 205 are arranged in parallel. The fourth plates 1404 are respectively arranged on the left and right sides of the abrasive belt 206. The driving wheel 204 and the driven wheel 205 are connected by the fourth plates 1404. The first plate 1401 is arranged above the abrasive belt 206. One of the fourth plates 1404 is connected to the first plate 1401 by the second plate 1402, and the other fourth plate 1404 is connected to the first plate 1401 by the third plate 1403. The connections between the plates are all made by bolts. The fourth plates 1404 are connected by a connecting plate, which is located between the driving wheel 204 and the driven wheel 205. The arrangement of the second plate 1402 and the connecting plate effectively improves the overall stability of the grinding head assembly 2 and reduces the shaking of the abrasive belt 206. The first plate 1401 is connected to the first rotating shaft 11.

[0048] A motor is mounted on the third plate 1403 for rotating the driving wheel 204. Guide springs 901 are respectively disposed on the fourth plate 1404.

[0049] The driven wheel 205 supports the sanding belt 206 to contact the sealing surface 301 for polishing. When the sand surface of the sanding belt 206 is worn and the polishing effect is insufficient, the motor rotates the driving wheel 204 to move the unworn sand surface of the sanding belt 206 to the bottom of the driven wheel 205 to contact the sealing surface 301 for polishing, which can effectively reduce the replacement frequency of the sanding belt 206.

[0050] When the sanding belt 206 needs to be replaced, the second plate 1402 is disassembled, and the old sanding belt 206 can be removed from the driving wheel 204 and the driven wheel 205. Then, a new sanding belt 206 is put on the driving wheel 204 and the driven wheel 205, and the second plate 1402 is installed to resume sanding.

Claims

1. An automatic polishing device for sealing surfaces along the grain, comprising a machine platform (1) and a grinding head assembly (2), wherein the machine platform (1) is provided with a clamping fixture (4) for a workpiece (3), and characterized in that: The machine (1) is provided with a displacement component (5) and a rotation drive unit, the displacement component (5) is provided with a base plate (6), the base plate (6) is provided with a floating component that can float up and down along the Z axis, the grinding head component (2) is fixedly connected to the first rotating shaft (11) and is arranged on the floating component with the help of the first rotating shaft (11), the grinding head component (2) has the freedom to move along the X axis, Y axis and Z axis relative to the machine (1) with the help of the displacement component (5), the grinding head component (2) is connected to the rotation drive unit and has the freedom to rotate around the axis of the first rotating shaft (11) with the help of the rotation drive unit, and the axis of the first rotating shaft (11) is arranged parallel to the Z axis.

2. The automatic polishing equipment for sealing surfaces along the grain according to claim 1, characterized in that: The floating assembly includes a floating base (7), a guide rail (8) and a first spring (10). The floating base (7) is connected to the base plate (6) by means of the guide rail (8). The guide rail (8) is arranged parallel to the Z axis. The upper end of the first spring (10) is connected to the floating base (7) and the lower end is connected to the base plate (6). The first rotating shaft (11) can be rotatably arranged on the floating base (7).

3. The automatic polishing equipment for sealing surfaces along the grain according to claim 1, characterized in that: The grinding head assembly (2) comprises sandpaper (201) and a grinding head (202), the upper end of the grinding head (202) is fixedly connected to the first rotating shaft (11), the sandpaper (201) is U-shaped and wraps the lower end of the grinding head (202), the lower end of the grinding head (202) is plugged into and matched with a clamp (203) to fix the sandpaper (201), and the clamp (203) is connected to the upper end of the grinding head (202) by means of a second spring (207).

4. The automatic polishing equipment for sealing surfaces along the grain according to claim 3, characterized in that: The rotation drive unit comprises a motor (904) arranged on the floating assembly, and the first rotating shaft (11) is connected to the motor (904) by power.

5. The automatic polishing equipment for sealing surfaces along the grain according to claim 4, characterized in that: The floating assembly is provided with a rotation angle sensor (12) of the first rotating shaft (11).

6. The automatic polishing equipment for sealing surfaces along the grain according to claim 1, characterized in that: The grinding head assembly (2) comprises a driving wheel (204), a driven wheel (205) and a sanding belt (206); the sanding belt (206) is sleeved on the driving wheel (204) and the driven wheel (205) and is tensioned by the driving wheel (204) and the driven wheel (205); the driving wheel (204) is connected to the first rotating shaft (11) by means of a mounting frame (14); and the driven wheel (205) is cantilevered downward from the mounting frame (14) to support the sanding belt (206) in contact with the sealing surface (301) of the workpiece (3).

7. The automatic polishing device for sealing surfaces along the grain according to claim 3 or 6, characterized in that: The rotary drive unit comprises a guide spring (901), an inner guide plate (902) and an outer guide plate (903), wherein the inner guide plate (902) and the outer guide plate (903) are respectively mounted above the workpiece (3) and fixed by means of a clamping fixture (4), wherein the outer side wall of the inner guide plate (902) and the inner side wall of the outer guide plate (903) are respectively offset from the trajectory of the sealing surface (301) of the workpiece (3) and matched to form an annular guide groove, wherein the guide spring (901) is respectively arranged on the left and right sides of the grinding head assembly (2), and the two ends of the guide spring (901) are respectively cantilevered in the front and rear directions of the grinding head assembly (2) and form a guide fit with the guide groove.

8. The automatic polishing equipment for sealing surfaces along the grain according to claim 1, characterized in that: The displacement component (5) is a slide module.