Film electrode printing method in electrode design adjustment stage, printing table and control method

Abstract

The invention relates to a film electrode printing method in an electrode design adjustment stage, a printing table and a control method, and belongs to the technical field of electronic printing. The method comprises the following steps: designing an electrode pattern; covering a PI film on the surface of the substrate; performing laser cutting on the PI film along the edge line of the electrode pattern, and removing the PI film in the circuit pattern after cutting is completed; the area, where the PI film is removed, of the substrate is filled with resistance slurry, and redundant resistance slurry is scraped off; and drying, and stripping the residual PI film on the surface of the substrate. A pressure sensor is arranged on a scraper of the printing table, and printing can be automatically executed according to feedback of the pressure sensor. According to the invention, aiming at the electrode design adjustment stage design, the actual effect after the electrode pattern is changed can be rapidly verified, and the development and research of products are facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic printing, and in particular to a thin film electrode printing method, a printing table and a control method in the electrode design and adjustment stage. Background Art

[0002] The electrostatic chuck (ESC) is a core component in semiconductor manufacturing. It is mainly used to stably fix silicon wafers through electrostatic force during processes such as lithography, etching, and deposition. Its performance depends critically on the design of the electrode layer.

[0003] Currently, electrode layer manufacturing primarily relies on screen printing technology, but this process has significant limitations. During the electrode design and adjustment phase, electrode patterns are rapidly iterated, and each new electrode pattern requires a custom-made screen, which prolongs the development cycle and makes it difficult to meet the demand for rapid iteration. Summary of the Invention

[0004] In response to the problems in the prior art, the present invention proposes a thin film electrode printing method, a printing table and a control method in the electrode design and adjustment stage.

[0005] To achieve the above object, the present invention adopts the following technical solutions: In a first aspect, the present invention provides a thin film electrode printing method in the electrode design adjustment stage, comprising the following steps: S1: Design electrode pattern; S2: Laminating a layer of PI film with uniform thickness on the surface of the substrate; S3: Laser cutting the PI film on the substrate surface along the edge line of the electrode pattern. After cutting, the PI film inside the circuit pattern is removed, thereby completing the pretreatment of the substrate; S4: For the pretreated substrate, fill the area on the substrate where the PI film is removed with resistor paste, and scrape off excess resistor paste; S5: Dry the substrate and peel off the remaining PI film on the surface of the substrate.

[0006] Preferably, the size of the PI film in step S2 can completely cover the designed electrode pattern to avoid incomplete electrode printing.

[0007] Preferably, the thickness of the PI film is equal to the thickness of the electrode to be designed. The electrode thickness can be easily adjusted by changing the thickness of the PI film, which is suitable for the electrode design adjustment stage.

[0008] In the second aspect, the present invention proposes a printing table for implementing the above-mentioned step S4, comprising a porous printing table, a printing device and a control module, wherein the porous printing table is made of a porous material and a vacuum pump is provided underneath, and the vacuum pump is connected to the lower surface of the porous printing table through an air pipe; the printing device includes a driving mechanism fixed on the porous printing table, a fixed rod driven by the driving mechanism and a scraper fixed on the fixed rod, and the scraper is also provided with a pressure sensor, and the pressure sensor is used to detect the contact pressure between the scraper and the substrate to be printed; the control module is used to receive the output of the pressure sensor and control the vacuum pump and the driving mechanism.

[0009] Preferably, the fixing rod is also provided with a CCD camera for feeding back the printing process image to the control module in real time. The control module can display the image after receiving the feedback, so that the user can observe the printing status.

[0010] Preferably, the control module includes a control interface for inputting control parameters and a control circuit unit for controlling other modules according to the control parameters. The control parameters can be quickly set through the user-oriented control interface.

[0011] Preferably, the fixing rod is further provided with a fine-tuning mechanism for controlling the position adjustment of the scraper, and the fine position adjustment of the scraper can be achieved through the fine-tuning structure.

[0012] In a third aspect, the present invention provides a method for controlling the printing table, comprising the following steps: S401: Control the vacuum pump and the drive mechanism through the control module, keep the vacuum pump in the closed state, and raise the scraper to the highest point; S402: placing the pretreated substrate on a porous printing table and starting a vacuum pump; S403: adding resistor slurry to the base coating portion; S404: Setting the printing pressure and printing speed, and controlling the fixed rod to descend until the reading of the pressure sensor reaches the set printing pressure; S405: Control the fixing rod to move horizontally at the set printing speed to evenly cover the exposed surface of the green embryo with the resistor paste, and raise the fixing rod after completion; S406: Turn off the vacuum pump and remove the substrate.

[0013] The beneficial effects of the present invention include: In view of the situation where the electrode pattern needs to be frequently changed during the electrode design adjustment stage, the present invention adopts a disposable PI film coating and cooperates with a printing table to print the electrodes. Since the PI film is easy to manufacture and has a low cost, the actual effect after the electrode pattern change can be verified more quickly, which is beneficial to product development; the present invention can effectively control the thickness uniformity of the printing by controlling the thickness uniformity of the PI film. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of a printing electrode process according to an embodiment of the present invention; Figure 2 Schematic diagram of the printing table structure according to one embodiment of the present invention.

[0015] Reference numerals: Ceramic green body 1, PI film 2, resistor paste 3, electrode 4, porous printing table 5, printing device 6, control module 7, scraper 61, fixing rod 62, driving mechanism 63, fine adjustment mechanism 64, camera bracket 65. DETAILED DESCRIPTION

[0016] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the invention, the specific implementation methods, structures, features and effects of the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0017] Example 1 like Figure 1 As shown, the electrostatic chuck generally includes a ceramic plate and an aluminum base. Electrodes are provided on or inside the ceramic plate. For the electrodes of the electrostatic chuck, a thin film electrode printing method in the electrode design adjustment stage includes the following steps: S1: Design the electrostatic chuck electrode pattern.

[0018] S2: A uniformly thick layer of PI film (polyimide film) 2 is applied to the surface of the ceramic green body 1. The PI film 2 is sized to completely cover the designed electrostatic chuck electrode pattern. During the coating process, ensure that no air bubbles are present within the film. The PI film 2 is bonded to the surface of the ceramic green body 1.

[0019] S3: Extract the edge line of the electrode pattern as the laser cutting route, fix the coated ceramic green body 1 in the laser cutting machine, and use laser to cut the PI film 2 on the coated ceramic green body 1 according to the laser cutting route. After the cutting is completed, remove the PI film 2 inside the circuit pattern to expose the area on the green body to be printed with the electrode, thus completing the pretreatment.

[0020] S4: Filling the exposed electrode printing area on the pre-treated ceramic green body 1 with the resistor paste 3 and scraping off excess paste.

[0021] S5: Drying the ceramic green body 1 to solidify the resistor paste 3 into the electrode 4 and weaken the adhesion of the PI film 2, and then peeling off the remaining PI film 2.

[0022] S6: The ceramic green body 1 is sent into a high-temperature furnace for sintering to obtain a ceramic disk with stable structure and electrodes 4 .

[0023] Example 2 like Figure 2 As shown, a printing table is used in the electrostatic chuck electrode printing process, including a porous printing table 5, a printing device 6 and a control module 7; The porous printing table 5 is made of porous ceramic material. A vacuum pump is provided below the porous printing table 5. The vacuum pump is connected to the lower surface of the porous printing table 5 through an air pipe. The vacuum pump is fixedly connected to the porous printing table 5. The ceramic green body 1 to be printed is placed on the porous printing table 5. After the vacuum pump is started, the adsorption force firmly fixes the ceramic green body 1 on the table.

[0024] The printing device 6 includes a scraper 61, a fixed rod 62, and a drive mechanism 63. The scraper 61 is fixedly connected to the fixed rod 62. The drive mechanism 63 is fixed to the porous printing table 5. The control end of the drive mechanism 63 is connected to the fixed rod 62. The drive mechanism 63 can drive the fixed rod 62 to move horizontally and vertically. The fixed rod 62 is also provided with a fine adjustment mechanism 64 for controlling small adjustments to the position of the scraper 61.

[0025] The control module 7 connects the vacuum pump, drive mechanism 63, and fine-tuning mechanism 64. It includes a control circuit unit located within the porous printing table 5 and a control interface located on the surface of the porous printing table 5. The control module 7 is used to control the on and off of the vacuum pump and the movement of the drive mechanism 63 and fine-tuning mechanism 64. The control interface is located outside the printing table and is electrically connected to the control circuit unit. It supports user interaction for inputting control parameters.

[0026] A CCD camera is mounted on the fixed rod 62 and secured to the fixed rod 62 via a camera bracket 65. The CCD camera is electrically connected to the control module 7 and provides real-time feedback of images of the ceramic green body 1 during the printing process to the control module 7, which is then displayed on a control interface. A pressure sensor is also mounted on the scraper 61 and connected to the control module 7. This provides real-time feedback of the pressure applied to the scraper 61 during the printing process. The control module 7 uses this pressure to determine whether the scraper 61 is in contact with the surface of the ceramic green body 1. It also determines whether the printing pressure is uniform based on changes in pressure, thereby adjusting the movement of the drive mechanism 63.

[0027] Example 3 Step S4 in Example 1 is specifically performed using a printing table, and the control method of the printing table includes the following steps: S401: Control the vacuum pump and the driving mechanism 63 through the control module 7, keep the vacuum pump in the closed state, and raise the scraper 61 to the highest point.

[0028] S402 : placing the pre-treated ceramic green body 1 on the porous printing table 5 , and starting the control switch of the vacuum pump to tightly adsorb the ceramic green body 1 on the porous printing table 5 .

[0029] S403: Add sufficient amount of resistor paste for printing near the scraper end of the coated portion of the ceramic green body 1. The sufficient amount means that the amount of resistor paste is sufficient to completely fill the exposed electrode area of ​​the ceramic green body 1 to be printed after step S405.

[0030] S404: Set appropriate printing pressure and printing speed on the control interface, control the fixed rod 62 to descend, and make the pressure sensor value reach the set printing pressure.

[0031] S405: The driving mechanism 63 controls the fixing rod 62 to move horizontally at a set printing speed to evenly cover the exposed surface of the green embryo with the resistor paste. After printing is completed, the driving mechanism 63 is controlled to raise the fixing rod 62.

[0032] S406: Turn off the vacuum pump and take out the ceramic green body 1.

[0033] After the ceramic green body 1 is printed on the printing table, S5-S6 are continued to perform drying and sintering processes to complete the production of the electrode 4 in the electrostatic chuck.

[0034] This invention is suitable for situations where electrode patterns need to be frequently changed during the electrode design and adjustment phase. It can quickly verify the actual effect of the electrode pattern change, which is beneficial for product development. By controlling the thickness uniformity of the PI film, the thickness uniformity of the printing can also be effectively controlled. In addition to the electrostatic chuck application scenario shown in the embodiment, this invention can also be applied to other electrode printing scenarios.

[0035] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as above in terms of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can, without departing from the scope of the technical solution of the present invention, make some changes or modifications to equivalent embodiments using the technical contents disclosed above. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A thin film electrode printing method in the electrode design adjustment stage, characterized in that: The following steps are involved: S1: Design electrode pattern; S2: Laminating a layer of PI film with uniform thickness on the surface of the substrate; S3: Laser cutting the PI film on the substrate surface along the edge line of the electrode pattern. After cutting, the PI film inside the circuit pattern is removed, thereby completing the pretreatment of the substrate; S4: For the pretreated substrate, fill the area on the substrate where the PI film is removed with resistor paste, and scrape off excess resistor paste; S5: Dry the substrate and peel off the remaining PI film on the surface of the substrate.

2. The thin film electrode printing method according to claim 1, characterized in that: The size of the PI film in step S2 can completely cover the designed electrode pattern.

3. The thin film electrode printing method according to claim 1, characterized in that: The thickness of the PI film is equal to the thickness of the electrode to be designed.

4. A printing table for implementing step S4 of claim 1, characterized in that: It includes a porous printing table, a printing device and a control module. The porous printing table is made of porous material and a vacuum pump is arranged underneath. The vacuum pump is connected to the lower surface of the porous printing table through an air pipe. The printing device includes a driving mechanism fixed on the porous printing table, a fixed rod driven by the driving mechanism and a scraper fixed on the fixed rod. The scraper is also provided with a pressure sensor. The pressure sensor is used to detect the contact pressure between the scraper and the substrate to be printed. The control module is used to receive the output of the pressure sensor and control the vacuum pump and the driving mechanism.

5. The printing table according to claim 4, characterized in that The fixing rod is also provided with a CCD camera for feeding back the printing process image to the control module in real time.

6. The printing table according to claim 4, characterized in that The control module includes a control interface for inputting control parameters and a control circuit unit for controlling other modules according to the control parameters.

7. The printing table according to claim 4, characterized in that The fixing rod is also provided with a fine-tuning mechanism for controlling the position adjustment of the scraper.

8. A method for controlling a printing table according to claim 4, characterized in that: The following steps are involved: S401: Control the vacuum pump and the drive mechanism through the control module, keep the vacuum pump in the closed state, and raise the scraper to the highest point; S402: placing the pretreated substrate on a porous printing table and starting a vacuum pump; S403: adding resistor slurry to the base coating portion; S404: Setting the printing pressure and printing speed, and controlling the fixed rod to descend until the reading of the pressure sensor reaches the set printing pressure; S405: Control the fixing rod to move horizontally at the set printing speed to evenly cover the exposed surface of the green embryo with the resistor paste, and raise the fixing rod after completion; S406: Turn off the vacuum pump and remove the substrate.

Images