Tray loading / unloading machine, chip testing equipment and control methods

Abstract

This invention provides a tray loading / unloading machine, chip testing equipment, and control method, relating to the field of chip testing technology. A transfer tray can be controllably moved between a first loading / unloading position in a first transfer channel and a second loading / unloading position in a second transfer channel. The transfer tray has a first area for holding the chip under test (DUT) and a second area for holding the chip already tested. A first picking mechanism of the loading transport device controllably transports the DUT from the loading tray at the loading position to the first area on the transfer tray, and a second picking mechanism of the unloading transport device controllably transports the chip already tested from the second area on the transfer tray to the unloading tray in the unloading channel. This technical solution uses a single transfer tray to transport both the DUT and the chip already tested, allowing for simultaneous loading and unloading, reducing the number of transport steps and thus improving chip testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a tray loading and unloading machine, chip testing equipment, and control method. Background Technology

[0002] After chip fabrication, functional testing is required using chip testing equipment. This equipment typically includes a loading machine, a unloading machine, and a testing machine. The loading machine loads the chips, the unloading machine unloads the tested chips, and the testing machine performs the functional tests. In existing technologies, loading and unloading usually use separate transfer trays, requiring a dedicated transport channel for each tray. This results in numerous transport operations during testing, leading to low testing efficiency. Therefore, there is an urgent need to design a tray loading / unloading machine that can improve testing efficiency. Summary of the Invention

[0003] One objective of this invention is to provide a tray loading and unloading machine that solves the technical problem of low testing efficiency caused by the large number of feeding operations in existing chip loading and unloading machines.

[0004] A further objective of this invention is to improve the versatility of tray loading and unloading machines.

[0005] Another object of the present invention is to provide a chip testing device including the above-mentioned tray loading and unloading machine.

[0006] Another object of the present invention is to provide a control method applicable to the above-mentioned chip testing equipment.

[0007] Specifically, the present invention provides a tray loading and unloading machine, comprising:

[0008] At least one loading channel is arranged along a first horizontal direction for conveying a loading tray along the loading channel to a loading position, the loading tray being used to carry the chip under test;

[0009] The loading and conveying device includes a first picking mechanism movable along a second horizontal direction, the first picking mechanism being configured to controllably transport the chip under test in the loading tray at the loading position to a first area on a transfer tray;

[0010] At least one unloading channel, arranged on the same side and parallel to the loading channel, is used to transport an unloading tray, which is used to carry the tested chip.

[0011] The unloading and conveying device is arranged parallel to the loading and conveying device and includes a second picking mechanism that is movable along a second horizontal direction. The second picking mechanism is configured to controllably transport the tested chips in a second area on the transfer tray to the unloading tray of the unloading channel.

[0012] A transfer assembly includes at least one transfer disk, a first transfer channel, and a second transfer channel; the first transfer channel is arranged on the same side and parallel to the loading channel, and the second transfer channel is arranged on one side of the chip testing device; the transfer disk can be controllably moved between a first loading / unloading position of the first transfer channel and a second loading / unloading position of the second transfer channel; the transfer disk has a first area for holding the chip to be tested and a second area for holding the tested chip.

[0013] Optionally, the first transfer channel includes a first transfer slide rail, a first support member, and a rotating mechanism. The rotating mechanism moves controllably along the first transfer slide rail, and the first support member is disposed above the rotating mechanism and can rotate under the drive of the rotating mechanism.

[0014] The first support member is used to support the turntable, and under the drive of the rotating mechanism, the turntable can rotate to a preset angle;

[0015] The second transfer channel includes a second transfer slide rail and a second carrier; the second carrier moves in a controlled manner along the second transfer slide rail and is used to carry the transfer tray.

[0016] Optionally, it also includes:

[0017] The first visual inspection mechanism is fixedly installed on one side of the first material handling mechanism and can move synchronously with the first material handling mechanism; the first visual inspection mechanism is used to inspect the shape defects on the upper surface of the chip to be tested in the loading tray.

[0018] The second visual inspection mechanism is located between the feeding channel and the first transfer channel;

[0019] The second visual inspection mechanism is used to detect shape defects on the lower surface of the chip under test.

[0020] Optionally, it also includes:

[0021] The feeding and flipping assembly includes a feeding and receiving adsorption assembly and a feeding and flipping mechanism movable along the second horizontal direction; the feeding and receiving adsorption assembly is disposed on the feeding and flipping mechanism, and the feeding and receiving adsorption assembly is used to receive the chip under test transported by the first material handling mechanism; the feeding and flipping mechanism can drive the feeding and receiving adsorption assembly to flip up and down, thereby placing the flipped chip under test in the first area.

[0022] The unloading and flipping assembly is arranged opposite to the loading and flipping assembly, and includes an unloading receiving and adsorption assembly and an unloading and flipping mechanism movable along the second horizontal direction; the unloading receiving and adsorption assembly is disposed on the unloading and flipping mechanism, and the unloading receiving and adsorption assembly is used to pick up the tested chip in the second region; the unloading and flipping mechanism can drive the unloading receiving and adsorption assembly to flip up and down, thereby placing the flipped tested chip on the second picking mechanism.

[0023] Optionally, the number of the loading channel is one, and the number of the unloading channels is multiple, with the multiple unloading channels used to unload the tested chips that meet different testing requirements;

[0024] One loading channel and multiple unloading channels are arranged side by side, and are respectively arranged on opposite sides of the first transfer channel.

[0025] In particular, the present invention also provides a chip testing device, comprising:

[0026] Such as the tray loading and unloading machine mentioned above;

[0027] A chip testing device is located at one end of the feeding channel; it includes a testing machine, at least one test socket, and at least one transfer component.

[0028] The transfer component is configured to controllably transport the tested chip on the test socket to the second area of ​​the transfer tray, and synchronously, controllably transport the chip under test in the transfer tray to the test socket;

[0029] The test socket is configured to reciprocate between the testing machine and the transfer component, thereby carrying the chip under test to the test position of the testing machine, which is used to perform electrical performance testing on the chip under test.

[0030] Optionally, it also includes a test environment switching device;

[0031] The test environment switching device has a controllable and closable first sealed door and at least one second sealed door. The test environment switching device is located at the junction of the first transfer channel and the second transfer channel, and is arranged on one side of the chip detection device. The first sealed door is opposite to the first transfer channel; the second sealed door is opposite to the second transfer channel.

[0032] The test environment switching device has a sealed inner cavity for accommodating the transfer plate; a gas path assembly is provided in the sealed inner cavity, and the gas path assembly performs a gas sealing operation on the sealed inner cavity in a controlled manner;

[0033] During the transfer process between the first transfer channel and the second transfer channel, the transfer disk can switch the transfer environment after passing through the sealed inner cavity.

[0034] Optionally, the chip testing equipment includes two test sockets and two transfer components; and the transfer component includes two transfer trays;

[0035] The second transfer channel includes a first branch channel and a second branch channel, the first branch channel and the second branch channel are arranged collinearly along a second horizontal direction, and the test environment switching device is located between the two branch channels;

[0036] The two turntables can alternately pass through the sealed inner cavity and then move along the first branch channel and the second branch channel respectively;

[0037] The two transfer components are respectively arranged opposite each other on both sides of the testing machine; the two test seats are arranged in a one-to-one correspondence with the two transfer components;

[0038] Both sets of transfer components are used to move the chip under test in the corresponding transfer tray to the corresponding test socket, and to move the chip under test in the test socket to the transfer tray; the two test sockets can be controlled to move alternately along the second direction to the test position.

[0039] In particular, the present invention also provides a control method for a chip testing device, applied to the aforementioned chip testing device, comprising the following steps:

[0040] When the transfer tray moves to the first loading / unloading position, the first picking mechanism of the loading and conveying device is controlled to transport the chip under test on the loading tray to the first area on the transfer tray; at the same time, the second picking mechanism of the unloading and conveying device is controlled to transport the chip under test on the second area to the unloading tray of the unloading channel, so as to perform loading and unloading simultaneously.

[0041] Control the transfer tray to transport materials along the first transfer channel to the second loading / unloading position of the second transfer channel;

[0042] The transfer assembly is controlled to move the tested chip on the test socket to the second area;

[0043] The transfer component is controlled to move the chip under test in the first area to the test socket;

[0044] The test socket is controlled to move to the test position, and the test socket is controlled to connect with the detection electromechanical device, thereby performing performance testing on the chip under test.

[0045] Optionally, controlling the transfer tray to convey materials along the first transfer channel to the second loading / unloading position of the second transfer channel specifically includes the following steps:

[0046] The control rotation mechanism drives the first bearing member to rotate, thereby driving the central turntable to rotate to a preset angle;

[0047] Control the first carrier to drive the transfer plate to move along the first transfer channel from the first loading / unloading position to the first transfer station;

[0048] The first sealed door of the test environment switching device is opened, and dry gas is filled into the inner cavity of the test environment switching device.

[0049] The first carrier is controlled to transfer the transfer plate to the sealed inner cavity of the test environment switching device;

[0050] Control the first sealing door to close, and control the cessation of filling with drying gas;

[0051] The second sealed door of the test environment switching device is opened, and the sealed inner cavity is evacuated.

[0052] Control the transfer tray to move to the second transfer station;

[0053] The second carrier is controlled to move the transfer plate along the second transfer channel from the second transfer station to the second loading / unloading position.

[0054] The transfer assembly of the present invention includes at least one transfer tray, a first transfer channel, and a second transfer channel. The transfer tray is controllably movable between a first loading / unloading position in the first transfer channel and a second loading / unloading position in the second transfer channel. The transfer tray has a first area for holding a chip under test (DUT) and a second area for holding a chip already tested. A first picking mechanism of the loading transport device controllably transports the DUT from the loading tray at the loading position to the first area on the transfer tray, and a second picking mechanism of the unloading transport device controllably transports the chip already tested from the second area on the transfer tray to the unloading tray in the unloading channel. The above technical solution uses a single transfer tray to transport both the DUT and the chip already tested, allowing for simultaneous loading and unloading, reducing the number of transport steps, and thus improving chip testing efficiency.

[0055] Furthermore, in this invention, there is one loading channel and multiple unloading channels. The multiple unloading channels are used to unload tested chips that meet different testing requirements, thereby improving the versatility of the tray loading and unloading machine.

[0056] The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0057] The following sections will describe some specific embodiments of the invention in detail by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or portions. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0058] Figure 1 This is a schematic structural diagram of a tray loading and unloading machine according to an embodiment of the present invention;

[0059] Figure 2 yes Figure 1 The diagram shown is a schematic structural diagram of the tray loading and unloading machine with the outer casing hidden at one angle.

[0060] Figure 3 yes Figure 1 The diagram shown is a schematic structural diagram of the tray loading and unloading machine from another angle, with the outer casing hidden.

[0061] Figure 4 This is a schematic structural diagram of a first transit channel according to an embodiment of the present invention;

[0062] Figure 5 This is a schematic side view of a first transit channel according to an embodiment of the present invention;

[0063] Figure 6This is a schematic structural diagram of a first material handling mechanism according to an embodiment of the present invention;

[0064] Figure 7 This is a schematic structural diagram of a feeding and flipping assembly according to an embodiment of the present invention;

[0065] Figure 8 This is a schematic structural diagram of a first vision detection mechanism and a second vision detection mechanism according to an embodiment of the present invention;

[0066] Figure 9 This is a schematic structural diagram of a test environment switching device and a second relay channel according to an embodiment of the present invention;

[0067] Figure 10 This is a schematic structural diagram of a chip detection device according to an embodiment of the present invention;

[0068] Figure 11 This is a schematic flowchart of a control method for a chip testing device according to an embodiment of the present invention;

[0069] Figure 12 This is a schematic flowchart of a control method for a chip testing device according to another embodiment of the present invention;

[0070] Figure 13 This is a schematic flowchart of a control method for a chip testing device according to yet another embodiment of the present invention;

[0071] Figure 14 This is a schematic flowchart of a control method for a chip testing device according to yet another embodiment of the present invention.

[0072] Figure label:

[0073] 100 - Tray loading / unloading machine; 210 - Loading tray; 220 - Unloading tray; 300 - Tested chip (chip to be tested); 10 - Loading channel; 20 - Unloading channel; 11 - Loading hopper; 12 - First conveying mechanism; 21 - Unloading hopper; 22 - Second conveying mechanism; 30 - Frame; 40 - Loading and handling device; 50 - Unloading and handling device; 60 - First transfer channel; 41 - First slide rail; 42 - Third slide rail; 43 - First picking mechanism; 44 - Loading and flipping assembly; 45 - First bracket; 46 - Second bracket; 51 - Second slide rail; 52 - Fourth slide rail; 53 - Unloading and flipping assembly; 54 - Second picking mechanism; 55 - Third bracket; 56 - Fourth... Support frame, 61-transfer plate, 62-first transfer slide rail, 611-first area, 612-second area, 63-rotation mechanism, 64-first bearing component, 431-first adsorption rod, 70-first visual inspection mechanism, 80-second visual inspection mechanism, 531-second adsorption rod, 532-first driving component, 533-second rotating component, 534-sixth slide rail, 535-second driving component, 90-test environment switching device, 91-first sealing door, 92-second sealing door, 93-second transfer channel, 931-first branch channel, 932-second branch channel, 94-inspection machine, 95-test seat, 96-transfer assembly, 961-transfer material handling device, 962-transfer guide rail. Detailed Implementation

[0074] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0075] In the description of this invention, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0076] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically stated, this indicates that other features are not excluded and may be further included.

[0077] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0078] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0079] Figure 1 This is a schematic structural diagram of a tray loading and unloading machine 100 according to an embodiment of the present invention. Figure 2 yes Figure 1 The diagram shown is a schematic structural representation of a tray loading / unloading machine 100, with the outer casing hidden at one angle. Figure 3 yes Figure 1 The diagram shown is a schematic structural diagram of the tray loading and unloading machine 100 from another angle, with the outer casing hidden.

[0080] like Figures 1 to 3As shown, in a specific embodiment, the tray loading / unloading machine 100 includes at least one loading channel 10, a loading and conveying device 40, at least one unloading channel 20, an unloading and conveying device 50, and a transfer assembly. The loading channel 10 is arranged along a first horizontal direction and is used to transport the loading tray 210 along the loading channel 10 to the loading position. The loading tray 210 is used to carry the chip under test 300. The loading and conveying device 40 includes a first picking mechanism 43 movably arranged along a second horizontal direction. The first picking mechanism 43 is configured to controllably transport the chip under test 300 in the loading tray 210 at the loading position to a first area 611 on the transfer tray 61. The unloading channel 20 is arranged on the same side and parallel to the loading channel 10 and is used to transport the unloading tray 220, which is used to carry the tested chip 300. The unloading and conveying device 50 is arranged parallel to the loading and conveying device 40, and includes a second picking mechanism 54 movable along a second horizontal direction. The second picking mechanism 54 is configured to controllably transport the tested chip 300 in the second area 612 on the transfer tray 61 to the unloading tray 220 of the unloading channel 20. The transfer assembly includes at least one transfer tray 61, a first transfer channel 60, and a second transfer channel 93. The first transfer channel 60 is on the same side as and parallel to the loading channel 10, and the second transfer channel 93 is arranged on one side of the chip testing device. The transfer tray 61 can be controllably moved between a first loading / unloading position of the first transfer channel 60 and a second loading / unloading position of the second transfer channel 93. The transfer tray 61 has a first area 611 for holding the chip 300 to be tested and a second area 612 for holding the tested chip 300. Here, the first horizontal direction is... Figure 2 The X direction in the middle, the second horizontal direction is Figure 2 The Y direction in the example. The types of chips transmitted in this embodiment include, but are not limited to, memory chips.

[0081] This embodiment uses a turntable 61 to transport the chip to be tested 300 and the chip already tested 300. It can unload while loading, which can reduce the number of transports and thus improve the chip testing efficiency.

[0082] In some embodiments, the first region 611 and the second region 612 are the same size, which can be understood as each occupying half of the turntable 61. In other embodiments, the sizes of the first region 611 and the second region 612 can also be designed according to specific design requirements.

[0083] In some embodiments, the tray loading / unloading machine 100 includes a frame 30, with a loading channel 10 and a unloading channel 20 both mounted on the frame 30 along a first horizontal direction. A first transfer channel 60 is mounted on the frame 30 parallel to the loading channel 10. A loading conveying device 40 and an unloading conveying device 50 are both mounted on the frame 30 along a second horizontal direction.

[0084] Figure 4 This is a schematic structural diagram of a first transfer channel 60 according to an embodiment of the present invention. Figure 5 This is a schematic side view of a first transit channel 60 according to an embodiment of the present invention. Figure 4 and Figure 5 As shown, in some embodiments, the first transfer channel 60 includes a first transfer slide rail 62, a first support member 64, and a rotating mechanism 63. The rotating mechanism 63 moves controllably along the first transfer slide rail 62. The first support member 64 is disposed above the rotating mechanism 63 and can rotate under the drive of the rotating mechanism 63. The first support member 64 is used to support the transfer disk 61, and the transfer disk 61 can rotate to a preset angle under the drive of the rotating mechanism 63. The second transfer channel 93 includes a second transfer slide rail and a second support member. The second support member moves controllably along the second transfer slide rail and is used to support the transfer disk 61. Here, the first transfer slide rail 62 is arranged on the frame 30 along a first horizontal direction, and the rotating member rotates controllably, thereby driving the first support member 64 and the transfer disk 61 to rotate. Here, the rotation angle can be 90°, thereby meeting different loading and unloading position requirements.

[0085] In some embodiments, the first transfer channel 60 and the second transfer channel 93 are arranged vertically. A multi-directional conveying device is provided between the first transfer channel 60 and the second transfer channel 93. The multi-directional conveying device includes a moving mechanism and a lifting motion module. The moving mechanism can reciprocate the transfer tray 61 along a first horizontal direction, that is, it can receive the transfer tray 61 conveyed from the first transfer channel 60, and it can also convey the transfer tray 61 onto the first transfer channel 60. The lifting motion module includes a lifting platform and at least one transmission mechanism disposed on the lifting platform. The lifting platform can drive the transmission mechanism to move up and down. The transmission mechanism can reciprocate the transfer tray 61 along a second horizontal direction, that is, it can receive the transfer tray 61 conveyed from the second transfer channel 93, and it can also convey the transfer tray 61 onto the second transfer channel 93.

[0086] Specifically, the moving mechanism and the lifting motion module can be stacked, meaning the lifting platform can drive the transmission mechanism to move up and down relative to the transmission surface of the moving mechanism. Further, the lifting platform can drive the transmission mechanism to a first working height or a second working height. The first working height is when the transmission surface of the transmission mechanism is lower than the transmission surface of the moving mechanism, and the second working height is when the transmission surface of the transmission mechanism is higher than the transmission surface of the moving mechanism. When the lifting platform drives the transmission mechanism to the first working height, the transmission surface of the transmission mechanism is lower than the transmission surface of the moving mechanism. At this time, the moving mechanism can receive the transfer tray 61 conveyed along the first transfer channel 60 and drive it to move along the first horizontal direction, thereby moving the transfer tray 61 into the cavity of the multi-directional conveying device. In this state, as the lifting platform drives the transmission mechanism to rise from the first working height to the second working height, the transmission surface of the transmission mechanism can receive the transfer tray 61 on the moving mechanism and drive it to move along the second horizontal direction, thereby conveying it to the second transfer channel 93; thus realizing the reciprocating movement of the transfer tray 61 on the first transfer channel 60 and the second transfer channel 93. The first horizontal direction is perpendicular to the second horizontal direction.

[0087] In another embodiment, the first transfer channel 60 and the second transfer channel 93 are arranged to extend and connect along a first horizontal direction. A belt drive mechanism can be provided between the first transfer channel 60 and the second transfer channel 93. The moving mechanism can reciprocate to transport the transfer tray 61 along the first horizontal direction. That is, it can receive the transfer tray 61 transported from the first transfer channel 60 and transfer it to the second transfer channel 93; or it can receive the transfer tray 61 transported from the second transfer channel 93 and transfer it to the first transfer channel 60. This realizes the reciprocating movement of the transfer tray 61 on the first transfer channel 60 and the second transfer channel 93.

[0088] Figure 6 This is a schematic structural diagram of the first material handling mechanism 43 according to an embodiment of the present invention. Figure 6 As shown, in some embodiments, the first picking mechanism 43 includes multiple first adsorption rods 431 arranged side by side, all of which can adsorb the chip under test 300. This means that the first picking mechanism 43 can simultaneously transport multiple chips under test 300. When adsorbing the chip under test 300, the multiple first adsorption rods 431 can adsorb the chip under test 300 simultaneously or sequentially, depending on the design requirements. Here, the structure of the second picking mechanism 54 is the same as that of the first picking mechanism 43.

[0089] See Figure 2 and Figure 3In some embodiments, the feeding and conveying device 40 further includes a first bracket 45 and a first slide rail 41. The first bracket 45 is mounted on the frame 30 along a second horizontal direction, and the first slide rail 41 is mounted on the first bracket 45 and located above the feeding channel 10, the first transfer channel 60, and the unloading channel 20. The first picking mechanism 43 is slidably mounted on the first slide rail 41.

[0090] In some specific embodiments, the first support 45 is a first gantry support disposed between the feeding channel 10 and the chip testing device, and its length along the second direction spans the feeding channel 10 and the transfer conveying assembly; the first slide rail 41 is fixed on the crossbeam of the first gantry support, and the first picking mechanism 43 can be a plurality of suction nozzles arranged in parallel, which can move back and forth along the first slide rail 41 between the feeding position of the feeding channel 10 and the transfer plate 61 of the transfer conveying assembly, thereby simultaneously transporting at least one chip 300 to be tested in the feeding channel 10 to the first area 611 of the transfer plate 61.

[0091] In some embodiments, the unloading and conveying device 50 further includes a third bracket 55 and a second slide rail 51. The third bracket 55 is mounted on the frame 30 along a second horizontal direction, and the second slide rail 51 is mounted on the third bracket 55 and located at the top of the unloading channel 20 of the first transfer channel 60. The second picking mechanism 54 is slidably mounted on the second slide rail 51.

[0092] In some specific embodiments, the third support 55 is a third gantry support arranged parallel to the first gantry support. Since the feeding length of the feeding channel 10 is greater than the discharging length of the discharging channel 20 in this embodiment, the third gantry support is located on the side close to the feeding channel 10 and the discharging channel 20. The second gantry support spans the discharging channel 20 along the length of the second direction. The second slide rail 51 is fixed on the crossbeam of the third gantry support. The second picking mechanism 54 can be a plurality of suction nozzles arranged in parallel, which can move along the second slide rail 51, thereby transporting the tested chips in the second area 612 of the central turntable 61 to the corresponding discharging channel 20.

[0093] like Figures 2 to 3As shown, in some embodiments, the tray loading / unloading machine 100 further includes a loading and unloading flipping assembly 44 and an unloading and flipping assembly 53. The loading and flipping assembly 44 includes a loading receiving and adsorption assembly and a loading and flipping mechanism movable along a second horizontal direction. The loading receiving and adsorption assembly is disposed on the loading and flipping mechanism and is used to receive the chip 300 to be tested transported by the first picking mechanism 43. The loading and flipping mechanism can drive the loading receiving and adsorption assembly to flip up and down, thereby placing the flipped chip 300 to be tested in the first area 611. The unloading and flipping assembly 53 is arranged opposite to the loading and flipping assembly 44 and includes an unloading receiving and adsorption assembly and a loading and flipping mechanism movable along a second horizontal direction. The unloading receiving and adsorption assembly is disposed on the unloading and flipping mechanism and is used to pick up the tested chip 300 in the second area 612. The unloading and flipping mechanism can drive the unloading receiving and adsorption assembly to flip up and down, thereby placing the flipped chip 300 to be tested on the second picking mechanism 54. Here, it can be understood that when the chip under test 300 is loaded onto the tray, its functional surface is placed downwards in the loading tray 210 to avoid scratching it. However, when testing the chip under test 300, the test probes need to contact its functional surface, so the chip under test 300 needs to be flipped during loading. In other embodiments, if the chip under test 300 arrives with its functional surface facing upwards, then the loading flipping component 44 is not needed; the chip under test 300 can be directly placed on the transfer tray 61 by the first picking mechanism 43. Generally, the chip under test 300 arrives with its functional surface facing downwards, and the suction nozzle of the loading receiving and adsorption component of the loading flipping component 44 is facing upwards. When receiving the chip under test 300 adsorbed by the first picking mechanism 43, it rotates the chip under test 300 downwards by 180° and simultaneously transports it to the first area 611 of the transfer tray 61.

[0094] In some embodiments, the feeding and receiving adsorption assembly further includes a third slide rail 42 and a second support 46. The second support 46 is mounted on the frame 30 along a second horizontal direction, the third slide rail 42 is mounted on the second support 46, and the feeding and flipping mechanism is slidably mounted on the third slide rail 42.

[0095] In some embodiments, the feeding receiving and adsorption assembly further includes a fourth slide rail 52 and a fourth bracket 56. The fourth bracket 56 is mounted on the frame 30 along a second horizontal direction, the fourth slide rail 52 is mounted on the fourth bracket 56, and the feeding flipping mechanism is slidably mounted on the fourth slide rail 52.

[0096] Figure 7 This is a schematic structural diagram of a feeding and flipping assembly 53 according to an embodiment of the present invention. Figure 7As shown, in some embodiments, the feeding and receiving adsorption assembly includes multiple second adsorption rods 531 arranged side by side, each capable of adsorbing the tested chip 300. The feeding and flipping mechanism also includes a first driving member 532 and a second rotating member 533 connected to each other, with the second rotating member 533 connected to the multiple second adsorption rods 531. The first driving member 532 is configured to controllably drive the second rotating member 533 to rotate, thereby driving the multiple second adsorption rods 531 to rotate. Here, the rotation angle is 180°, allowing the second adsorption rods 531 to flip the tested chip 300. The feeding and flipping mechanism also includes a second driving member 535 and a vertically arranged sixth slide rail 534. The first driving member 532 is slidably connected to the sixth slide rail 534. The second driving member 535 is used to controllably drive the first driving member 532, the second rotating member 533, and the multiple second adsorption rods 531 to move vertically, thereby adjusting the vertical displacement of the second adsorption rods 531. Here, the structure of the feeding flipping component 44 is the same as that of the unloading flipping component 53, and will not be described in detail here.

[0097] Figure 8 This is a schematic structural diagram of a first visual inspection mechanism 70 and a second visual inspection mechanism 80 according to an embodiment of the present invention. Figure 8As shown, in some embodiments, the tray loading / unloading machine 100 further includes a first visual inspection mechanism 70 and a second visual inspection mechanism 80. The first visual inspection mechanism 70 is fixedly disposed on one side of the first picking mechanism 43 and can move synchronously with the first picking mechanism 43. The first visual inspection mechanism 70 is used to detect shape defects on the upper surface of the chip 300 to be tested within the loading tray 210. The second visual inspection mechanism 80 is disposed between the loading channel 10 and the first transfer channel 60, and is used to detect shape defects on the lower surface of the chip 300 to be tested. Here, the first visual inspection mechanism 70 is slidably mounted on the first slide rail 41, and is used to detect the position of the chip 300 to be tested, as well as to detect surface defects of the chip 300 to be tested. The first picking mechanism 43 accurately picks up the chip 300 to be tested based on the detection data of the first visual inspection mechanism 70. The first visual inspection mechanism 70 sequentially inspects multiple chips 300 to be tested. After the previous chip 300 is inspected, one of the first adsorption rods 431 picks up the previous chip 300, and then the first visual inspection mechanism 70 inspects the next chip 300. Then, another first adsorption rod 431 picks up the next chip 300, and so on, in a sequential manner. After all the first adsorption rods 431 have picked up the chips 300, they pass over the second visual inspection mechanism 80, which inspects the bottom surface defects of the chips 300. If both the first visual inspection mechanism 70 and the second visual inspection mechanism 80 find no surface defects, the chip 300 is then placed on the second adsorption rod 531 of the feeding and receiving adsorption assembly. In some embodiments, chips 300 with surface defects can be placed in a designated waste box.

[0098] In some embodiments, the tray loading and unloading machine 100 further includes a third vision inspection mechanism. After the second picking mechanism 54 picks up the tested chip 300, it moves the tested chip 300 to the top of the third vision inspection mechanism. The third vision inspection mechanism detects the bottom surface defects of the tested chip 300. After detecting that there are no surface defects, the tested chip 300 is then moved to the corresponding unloading channel 20 for unloading.

[0099] In some embodiments, there is one loading channel 10 and multiple unloading channels 20. The multiple unloading channels 20 are used to unload the tested chips 300 that meet different testing requirements. The one loading channel 10 and the multiple unloading channels 20 are arranged side by side and are respectively arranged on opposite sides of the first transfer channel 60.

[0100] This embodiment can unload tested chips 300 that meet different testing requirements, thereby improving the versatility of the tray loading / unloading machine 100. Here, the number of unloading channels 20 is six. In other embodiments, the number of unloading channels 20 can be determined according to specific design requirements. The second picking mechanism 54 moves the tested chip 300 to different unloading channels 20 for unloading based on the Bin value information of the tested chip 300 given by the chip detection device. The six unloading channels 20 correspond to different Bin value information.

[0101] In some embodiments, one loading channel 10 and six unloading channels 20 are arranged side by side, respectively on opposite sides of the first transfer channel 60. Here, one loading channel 10 and two unloading channels 20 are arranged side by side on the left side of the first transfer channel 60, and four unloading channels 20 are arranged side by side on the right side of the first transfer channel 60. This embodiment places the first transfer channel 60 in the middle position, which can reduce the travel distance of the first picking mechanism 43 and the second picking mechanism 54, and further improve testing efficiency.

[0102] In some embodiments, the feeding channel 10 includes a feeding hopper 11 and a first conveying mechanism 12. The feeding hopper 11 contains a plurality of stacked feeding trays 210. The first conveying mechanism 12 is used to sequentially convey the feeding trays 210 in the feeding hopper 11 to the feeding position. The unloading channel 20 includes an unloading hopper 21 and a second conveying mechanism 22. The unloading hopper 21 contains a plurality of stacked unloading trays 220. The second conveying mechanism 22 is used to convey the unloading trays 220 from the unloading position to the unloading hopper 21.

[0103] In some embodiments, this embodiment also provides a chip testing apparatus, including a tray loading / unloading machine 100 as described in any of the above embodiments and a chip testing device. The chip testing device is disposed at one end of the loading channel 10 and includes a testing machine, at least one test socket, and at least one transfer component. The transfer component is configured to controllably transport the tested chip on the test socket to the second region 612 of the transfer tray 61, and synchronously, to controllably transport the chip under test 300 in the first region 611 of the transfer tray 61 to the test socket. The test socket is configured to reciprocate between the testing machine and the transfer component, thereby carrying the chip under test 300 to the test position of the testing machine, which is used to perform electrical performance testing on the chip under test 300.

[0104] Figure 9 This is a schematic structural diagram of a test environment switching device and a second relay channel 93 according to an embodiment of the present invention. Figure 9As shown, in some embodiments, the chip testing equipment further includes a test environment switching device 90. The test environment switching device 90 is disposed at the interface between the first transfer channel 60 and the second transfer channel 93, and is arranged on one side of the chip testing device.

[0105] The test environment switching device 90 has a sealed inner cavity accommodating the transfer tray 61. A gas path assembly is installed within the sealed inner cavity, which controls the gas sealing operation. During the transfer of the transfer tray 61 between the first transfer channel 60 and the second transfer channel 93, after passing through the sealed inner cavity, the transfer environment of the transfer tray 61 can be switched. Here, the gas path assembly is used to fill the sealed inner cavity with dry air or to evacuate the inner cavity. When the transfer tray 61 enters the sealed inner cavity, the gas path assembly continuously fills the sealed inner cavity with dry air, making it difficult for outside air to enter the sealed inner cavity. When the transfer tray 61 is transferred from the sealed inner cavity to the second transfer station, the gas path assembly continuously evacuates the sealed inner cavity, generating negative pressure, allowing gas from the chip testing device to enter the sealed inner cavity, preventing gas from the sealed inner cavity from entering the chip testing device, thereby effectively controlling the dew point environment within the chip testing device.

[0106] In some embodiments, the test environment switching device 90 has a controllable, openable and closable first sealing door 91 and at least one second sealing door 92. The first sealing door 91 is connected to a first transfer station of a first transfer channel 60, and the second sealing door 92 is connected to a second transfer station of a second transfer channel 93. Both the first sealing door 91 and the second sealing door 92 are controllable and can be opened and closed. When the first sealing door 91 is open, the sealed cavity is in communication with the first transfer channel 60. The first carrier 64 can convey the transfer plate 61 to the sealed cavity of the test environment switching device 90 at the first transfer station. When the second sealing door 92 is open, the sealed cavity is in communication with the second transfer channel 93. The second carrier can receive the transfer plate 61 conveyed from the sealed cavity of the test environment switching device 90 at the second transfer station. Here, when the first sealing door 91 is open, the air circuit assembly continuously fills the sealed cavity with dry air until the first sealing door 91 is closed. When the second sealing door 92 is open, the gas circuit assembly continuously evacuates the sealed inner cavity until the second sealing door 92 is closed.

[0107] Figure 10 This is a schematic structural diagram of a chip detection device according to an embodiment of the present invention. Figure 10As shown, in some specific embodiments, the chip testing equipment includes two test sockets 95 and two transfer components 96; the transfer component includes two transfer trays 61, and the second transfer channel 93 includes a first branch channel 931 and a second branch channel 932. The first branch channel 931 and the second branch channel 932 are arranged collinearly along a second horizontal direction, and the test environment switching device 90 is disposed between the two branch channels. The two transfer trays 61 can alternately pass through the sealed inner cavity and move along the first branch channel 931 and the second branch channel 932 respectively; the two transfer components 96 are respectively disposed opposite to each other on both sides of the testing machine 94; the two test sockets 95 are disposed one-to-one with the two transfer components 96; both sets of transfer components 96 are used to transport the chip under test 300 in the corresponding transfer tray 61 to the corresponding test socket 95, and to transport the tested chip in the test socket 95 to the transfer tray 61; the two test sockets 95 can be controlled to move alternately along the second direction to the test position.

[0108] Specifically, the test environment switching device 90 is equipped with two second sealing doors 92, and the two second sealing doors 92 are respectively positioned opposite to the first branch channel 931 and the second branch channel 932; the first transfer channel 60 is arranged in a T-shape with the first branch channel 931 and the second branch channel 932.

[0109] Specifically, the transfer component 96 includes a transfer guide rail 962 and a transfer material handling device 961; the transfer material handling device 961 can move controllably along the transfer guide rail 962; the two transfer guide rails 962 are arranged on both sides of the chip detection device along the first horizontal direction and correspond to the first branch channel 931 and the second branch channel 932 respectively.

[0110] Specifically, the arrangement of the left and right sides of the chip detection device is the same;

[0111] The arrangement on the left side of the chip testing device is described as follows: the turntable 61 can move along the first branch channel 931 to the first loading and unloading position, and the corresponding transfer and material handling device 961 can transfer the chip to be tested 300 in the turntable 61 to the corresponding test socket 95. Simultaneously, the transfer and material handling device 961 can also transfer the tested chip in the test socket 95 to the turntable 61.

[0112] Figure 11 This is a schematic flowchart of a control method for a chip testing device according to an embodiment of the present invention. Figure 11 As shown, the control method for the chip testing equipment, applied to the chip testing equipment in any of the above embodiments, includes the following steps:

[0113] In step S100, when the transfer tray 61 moves to the first loading / unloading position, the first picking mechanism 43 of the loading and conveying device 40 is controlled to transport the chip under test 300 on the loading tray 210 to the first area 611 on the transfer tray 61; at the same time, the second picking mechanism 54 of the unloading and conveying device 50 is controlled to transport the chip under test on the second area 612 to the unloading tray 220 of the unloading channel 20, so as to perform loading and unloading simultaneously.

[0114] Step S200: Control the transfer plate 61 to convey the material along the first transfer channel 60 to the second loading / unloading position of the second transfer channel 93;

[0115] In step S300, the control transfer component moves the tested chip 300 on the test socket 95 to the second area 612;

[0116] In step S400, the transfer component is controlled to move the chip under test 300 in the first area 611 to the test socket 95;

[0117] In step S500, the test socket 95 is moved to the test position and electrically connected to the test machine 94 to perform performance testing on the chip 300 under test.

[0118] This embodiment allows for simultaneous loading and unloading of chips, which can improve chip testing efficiency.

[0119] Figure 12 This is a schematic flowchart of a control method for a chip testing device according to another embodiment of the present invention. Figure 12 As shown, in some embodiments, step S200 specifically includes the following steps:

[0120] Step S210: Control the rotating mechanism 63 to drive the first bearing member 64 to rotate, thereby driving the central turntable 61 to rotate to a preset angle;

[0121] Step S220: Control the first carrier 64 to drive the turntable 61 to move along the first transfer channel 60 from the first loading / unloading position to the first transfer station;

[0122] Step S230: Control the opening of the first sealing door 91 of the test environment switching device 90, and control the filling of the inner cavity of the test environment switching device 90 with dry gas.

[0123] Step S240: Control the first carrier 64 to transfer the transfer plate 61 to the sealed inner cavity of the test environment switching device 90;

[0124] Step S250: Control the first sealing door 91 to close and control the cessation of the filling of drying gas;

[0125] Step S260: Open the second sealing door 92 of the test environment switching device 90 and control the vacuuming of the sealed inner cavity;

[0126] Step S270: Control the transfer plate 61 to move to the second transfer station;

[0127] In step S280, the second carrier is controlled to move the transfer plate 61 along the second transfer channel 93 from the second transfer station to the second loading / unloading position.

[0128] In other embodiments, step S260 involves controlling the opening of the second sealing door 92 of the test environment switching device 90 and controlling the evacuation of the sealed cavity. This can be replaced by first controlling the evacuation of the sealed cavity and then controlling the opening of the second sealing door 92 of the test environment switching device 90. This can further prevent the influence of the external gas environment on the internal test environment and improve the accuracy of the test.

[0129] Figure 13 This is a schematic flowchart illustrating the control method of a tray loading / unloading machine 100 according to yet another embodiment of the present invention. Figure 13 As shown, in another embodiment, the step of controlling the first picking mechanism 43 of the loading and conveying device 40 to transport the chip under test 300 on the loading tray 210 to the first area 611 on the transfer tray 61 specifically includes:

[0130] Step S110: Control the first material handling mechanism 43 to pick up the chip under test 300 on the loading tray 210 and move the chip under test 300 to the first handover station;

[0131] Step S120: Control the feeding and receiving adsorption component to pick up the chip 300 to be tested on the first feeding mechanism 43, and control the feeding and flipping mechanism to drive the feeding and receiving adsorption component to flip up and down to flip the tested chip 300.

[0132] Step S130: Control the feeding and receiving adsorption component to place the flipped tested chip 300 into the first area 611.

[0133] Figure 14 This is a schematic flowchart illustrating the control method of a tray loading / unloading machine 100 according to yet another embodiment of the present invention. Figure 14 As shown, in another embodiment, the step of controlling the second picking mechanism 54 of the unloading and conveying device 50 to transport the chip under test on the second region 612 to the unloading tray 220 of the unloading channel 20 specifically includes:

[0134] Step S140: Control the feeding receiving adsorption component to pick up the tested chip 300 on the second area 612, and control the feeding flipping mechanism to drive the feeding receiving adsorption component to flip up and down to flip the tested chip 300.

[0135] In step S150, the second picking mechanism 54 is controlled to pick up the tested chip 300 from the unloading and receiving adsorption assembly at the second handover station, and the second picking mechanism 54 is controlled to place the tested chip 300 on the unloading tray 220. It should be noted that steps S140 and S110 are not sequential and can be performed simultaneously or separately.

[0136] In some embodiments, step S110 specifically includes the following steps:

[0137] Step S111: Control the first vision inspection mechanism 70 to inspect the position and upper surface defects of the chip 300 under test;

[0138] Step S112: Control the first picking mechanism 43 to pick up the chip under test 300 from the loading tray 210 according to the position of the chip under test 300;

[0139] Step S113: Control the first material handling mechanism 43 to move the chip under test 300 above the second vision inspection mechanism 80, and control the second vision inspection mechanism 80 to inspect the defects on the lower surface of the chip under test 300.

[0140] In step S114, when it is determined that there are no defects on the upper and lower surfaces of the chip under test 300, the first material handling mechanism 43 is controlled to move the chip under test 300 to the first handover station.

[0141] In step S114, if there is a defect on the upper or lower surface of the chip under test 300, the first picking mechanism 43 is controlled to move the chip under test 300 to the waste box.

[0142] In step S150, after the second picking mechanism 54 receives the tested chip 300, it moves the tested chip 300 to the third vision inspection mechanism for surface defect detection. After the detection is successful, the tested chip 300 is moved to the unloading tray 220 of different unloading channels 20 for unloading according to the Bin value information of the tested chip 300 given by the chip detection device. The six unloading channels 20 correspond to different Bin value information.

[0143] In some embodiments, the two test sockets 95 are defined as a first test socket and a second test socket, and the control method of the chip testing equipment further includes the following steps:

[0144] Step 1: Control the first test socket to move to the test position and control the first test socket to be electrically connected to the test machine 94, so as to perform performance testing on the chip under test 300 on the first test socket;

[0145] Step 2: After the chip under test 300 completes the test, control the first test socket to move out of the test position;

[0146] Step 3: Control the second test socket to move to the test position and control the second test socket to be electrically connected to the test machine 94, so as to perform performance testing on the chip under test 300 on the second test socket.

[0147] This embodiment uses two test sockets 95 to move alternately to the test position, which reduces the waiting time for loading. The testing machine 94 alternately tests the chip under test 300 on the two test sockets 95 and is always in the testing state, thus improving the chip testing efficiency.

[0148] Therefore, those skilled in the art should recognize that although numerous exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Thus, the scope of the present invention should be understood and construed as covering all such other variations or modifications.

Claims

1. A tray loading and unloading machine, characterized in that, include: At least one loading channel is arranged along a first horizontal direction for conveying a loading tray along the loading channel to a loading position, the loading tray being used to carry the chip under test; The loading and conveying device includes a first picking mechanism movable along a second horizontal direction, the first picking mechanism being configured to controllably transport the chip under test in the loading tray at the loading position to a first area on a transfer tray; At least one unloading channel, arranged on the same side and parallel to the loading channel, is used to transport an unloading tray, which is used to carry the tested chip. The unloading and conveying device is arranged parallel to the loading and conveying device and includes a second picking mechanism that is movable along a second horizontal direction. The second picking mechanism is configured to controllably transport the tested chips in a second area on the transfer tray to the unloading tray of the unloading channel. The relay transmission component includes at least one relay disk, a first relay channel, and a second relay channel; The first transfer channel is arranged on the same side and parallel to the loading channel, and the second transfer channel is arranged on one side of the chip testing device. The transfer plate can be controlled to move between the first loading / unloading position of the first transfer channel and the second loading / unloading position of the second transfer channel. The transfer plate has a first area for holding the chip to be tested and a second area for holding the tested chip. The second transfer channel includes a second transfer slide rail and a second carrier; the second carrier moves in a controlled manner along the second transfer slide rail and is used to carry the transfer tray.

2. The tray loading and unloading machine according to claim 1, characterized in that, The first transfer channel includes a first transfer slide rail, a first support member, and a rotating mechanism. The rotating mechanism moves controllably along the first transfer slide rail, and the first support member is disposed above the rotating mechanism and can rotate under the drive of the rotating mechanism. The first support member is used to support the turntable, and the turntable can be rotated to a preset angle under the drive of the rotating mechanism.

3. The tray loading and unloading machine according to claim 1, characterized in that, Also includes: The first visual inspection mechanism is fixedly installed on one side of the first material handling mechanism and can move synchronously with the first material handling mechanism; The first visual inspection mechanism is used to detect shape defects on the upper surface of the chip to be tested in the loading tray; The second visual inspection mechanism is located between the feeding channel and the first transfer channel; The second visual inspection mechanism is used to detect shape defects on the lower surface of the chip under test.

4. The tray loading and unloading machine according to claim 1, characterized in that, Also includes: The feeding and turning assembly includes a feeding and receiving adsorption assembly and a feeding and turning mechanism that can move along the second horizontal direction; The feeding and receiving adsorption component is disposed on the feeding and flipping mechanism. The feeding and receiving adsorption component is used to receive the chip to be tested transported by the first material handling mechanism. The feeding and flipping mechanism can drive the feeding and receiving adsorption component to flip up and down, thereby placing the flipped chip to be tested in the first area. The unloading and flipping assembly is arranged opposite to the loading and flipping assembly, and includes an unloading receiving and adsorption assembly and an unloading and flipping mechanism movable along the second horizontal direction; the unloading receiving and adsorption assembly is disposed on the unloading and flipping mechanism, and the unloading receiving and adsorption assembly is used to pick up the tested chip in the second region; the unloading and flipping mechanism can drive the unloading receiving and adsorption assembly to flip up and down, thereby placing the flipped tested chip on the second picking mechanism.

5. The tray loading and unloading machine according to any one of claims 1-4, characterized in that, The number of the feeding channel is one, and the number of the unloading channels is multiple. The multiple unloading channels are used to unload the tested chips that meet different testing requirements. One loading channel and multiple unloading channels are arranged side by side, and are respectively arranged on opposite sides of the first transfer channel.

6. A chip testing device, characterized in that, include: Tray loading and unloading machine as described in any one of claims 1-5; A chip testing device is located at one end of the feeding channel; it includes a testing machine, at least one test socket, and at least one transfer component. The transfer component is configured to controllably transport the tested chip on the test socket to the second area of ​​the transfer tray, and synchronously, controllably transport the chip under test in the transfer tray to the test socket; The test socket is configured to reciprocate between the testing machine and the transfer component, thereby carrying the chip under test to the test position of the testing machine, which is used to perform electrical performance testing on the chip under test.

7. The chip testing equipment according to claim 6, characterized in that, It also includes testing environment switching equipment; The test environment switching device has a controllable and closable first sealed door and at least one second sealed door. The test environment switching device is located at the junction of the first transfer channel and the second transfer channel, and is arranged on one side of the chip detection device. The first sealed door is opposite to the first transfer channel; the second sealed door is opposite to the second transfer channel. The test environment switching device has a sealed inner cavity for accommodating the transfer plate; a gas path assembly is provided in the sealed inner cavity, and the gas path assembly performs a gas sealing operation on the sealed inner cavity in a controlled manner; During the transfer process between the first transfer channel and the second transfer channel, the transfer disk can switch the transfer environment after passing through the sealed inner cavity.

8. The chip testing equipment according to claim 7, characterized in that, It includes two test seats and two transfer components; and the transfer component includes two transfer trays; The second transfer channel includes a first branch channel and a second branch channel, the first branch channel and the second branch channel are arranged collinearly along a second horizontal direction, and the test environment switching device is located between the two branch channels; The two turntables can alternately pass through the sealed inner cavity and then move along the first branch channel and the second branch channel respectively; The two transfer components are respectively arranged opposite each other on both sides of the testing machine; the two test seats are arranged in a one-to-one correspondence with the two transfer components; Both sets of transfer components are used to move the chip under test in the corresponding transfer tray to the corresponding test socket, and to move the chip under test in the test socket to the transfer tray; the two test sockets can be controlled to move alternately along the second direction to the test position.

9. A control method for a chip testing device, applied to the chip testing device according to any one of claims 6-8, characterized in that, Includes the following steps: When the transfer tray moves to the first loading / unloading position, the first picking mechanism of the loading and conveying device is controlled to transport the chip under test on the loading tray to the first area on the transfer tray; at the same time, the second picking mechanism of the unloading and conveying device is controlled to transport the chip under test on the second area to the unloading tray of the unloading channel, so as to perform loading and unloading simultaneously. Control the transfer tray to transport materials along the first transfer channel to the second loading / unloading position of the second transfer channel; The transfer assembly is controlled to move the tested chip on the test socket to the second area; The transfer component is controlled to move the chip under test in the first area to the test socket; The test socket is controlled to move to the test position, and the test socket is controlled to connect with the detection electromechanical device, thereby performing performance testing on the chip under test.

10. The control method according to claim 9, characterized in that, The process of controlling the transfer tray to convey materials along the first transfer channel to the second loading / unloading position of the second transfer channel specifically includes the following steps: The control rotation mechanism drives the first bearing member to rotate, thereby driving the central turntable to rotate to a preset angle; Control the first carrier to drive the transfer plate to move along the first transfer channel from the first loading / unloading position to the first transfer station; The first sealed door of the test environment switching device is opened, and dry gas is filled into the inner cavity of the test environment switching device. The first carrier is controlled to transfer the transfer plate to the sealed inner cavity of the test environment switching device; Control the first sealing door to close, and control the cessation of filling with drying gas; The second sealed door of the test environment switching device is opened, and the sealed inner cavity is evacuated. Control the transfer tray to move to the second transfer station; The second carrier is controlled to move the transfer plate along the second transfer channel from the second transfer station to the second loading / unloading position.

Images