IC integrated circuit reliability test machine and test method

Abstract

The invention discloses an IC integrated circuit reliability testing machine and a testing method, and belongs to the technical field of circuit testing. The IC integrated circuit reliability testing machine comprises a rack, a conveying assembly is installed in the rack, supporting bases are fixed to the two sides of the rack, installation assemblies are fixedly installed on the supporting bases, testing assemblies are installed on the installation assemblies, side supporting plates are installed on the two sides of the upper surface of the rack, and cleaning assemblies are installed on the side supporting plates. The problem that in the actual use process of the prior art, impurities possibly exist in a test port of an integrated circuit, and then testing is hindered is solved, dust and impurities on the IC integrated circuit are cleaned through the wiping sponge and the brush, the cleanliness of the surface of the IC integrated circuit is guaranteed, and the test efficiency is improved. Therefore, the IC integrated circuit cannot be interfered by impurities during testing, the reliability of testing the IC integrated circuit is improved, the accuracy of wiring of the IC integrated circuit is ensured, and the testing result is more reliable.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit testing, in particular to an IC integrated circuit reliability testing machine and a testing method. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a specific process, the transistors, resistors, capacitors, inductors, and other components required for a circuit are interconnected with wiring and fabricated on one or more small semiconductor wafers or dielectric substrates. After IC fabrication, it is necessary to conduct reliability testing.

[0003] Chinese patent publication number CN116736077A discloses an integrated circuit reliability test device, which includes: a test main control module for controlling the operation of the entire test device; a signal generator module for generating various test signals and using these test signals to perform performance tests on the integrated circuit; a signal acquisition and analysis module for receiving signals output by the integrated circuit and digitally processing and analyzing them to obtain performance indicators of the integrated circuit; a temperature control module for performing temperature stress tests on the integrated circuit, controlling the temperature environment to detect performance changes of the integrated circuit at different temperatures; and a carrier module for mounting the integrated circuit to be tested. Compared with existing technologies, this patent has high test efficiency, high test accuracy, a wide test range, comprehensive reliability testing, easy system upgrades, and easy operation and maintenance.

[0004] During actual use of the above patent, impurities may exist in the test port of the integrated circuit, thereby hindering the test; therefore, it does not meet existing needs. In response to this, we have proposed an IC integrated circuit reliability tester and test method. Summary of the Invention

[0005] The purpose of the present invention is to provide an IC integrated circuit reliability tester and testing method, which cleans dust and impurities on the IC integrated circuit through a wiping sponge and a brush, thereby ensuring the cleanliness of the IC integrated circuit surface, so that the IC integrated circuit will not be disturbed by impurities during testing, and improving the reliability of the IC integrated circuit test. The laser positioning device set at the bottom of the rotating plate accurately positions the terminal of the IC integrated circuit, so that the test head can accurately contact the terminal of the IC integrated circuit, ensuring the accuracy of the IC integrated circuit connection, making the test results more reliable, and solving the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: an IC integrated circuit reliability testing machine, comprising a frame, a side support plate and a support base, a conveying assembly installed in the frame, a placement slot provided on the conveying assembly, support bases fixed on both sides of the frame, a mounting assembly fixedly installed on the support base, a test assembly installed on the mounting assembly, side support plates installed on both sides of the upper surface of the frame, a cleaning assembly installed on the side support plates, and a heating chamber provided on the right side of the cleaning assembly.

[0007] Preferably, the mounting assembly includes a support column, a top plate, a mounting plate, a support rod, a test system and a moving assembly, the top plate is fixedly mounted on the support column, the support rod is fixed to the lower surface of the top plate, the bottom of the support rod is fixed to the mounting plate, the testing system is provided on the mounting plate, and the moving assembly is provided on the side of the mounting plate.

[0008] Preferably, the testing system comprises:

[0009] A data acquisition unit, used for collecting test data of the IC tested by the test component in real time;

[0010] A data processing unit, used to process instantaneous interference signals using a sliding average filter and perform normalization on the data;

[0011] A data analysis unit, configured to analyze the performance of the IC using the processed data and evaluate the reliability of the IC;

[0012] The report generation unit is used to generate a test report including test conditions, key data charts, failure analysis conclusions and improvement suggestions.

[0013] Preferably, the moving assembly includes a connecting plate, a second moving block, a second threaded rod and a fourth motor. The connecting plate is fixed to the side of the mounting plate, and the second threaded rod is rotatably installed on the connecting plate. One end of the second threaded rod passes through the connecting plate and is installed at the output end of the fourth motor, and the second moving block is movably installed on the second threaded rod.

[0014] Preferably, the transmission assembly includes a first motor, a driving shaft, a belt, a rack and a driven shaft. The first motor is installed on the outside of the frame, the output end of the first motor is connected to the driving shaft, the driving shaft is rotatably installed on the inside of the frame, a belt is installed on the driving shaft, the end of the belt away from the driving shaft is installed on the driven shaft, the driven shaft is installed on the inside of the frame, and racks are provided at both ends of the belt.

[0015] Preferably, the cleaning assembly includes a mounting shaft, a gear, a mounting piece, a mounting frame, a wiping sponge and a brush, gears are provided at both ends of the mounting shaft, a mounting piece is fixed in the middle of the mounting shaft, four mounting frames are installed on the mounting piece at equal distances, and a wiping sponge and a brush are respectively installed on the mounting frames.

[0016] Preferably, the test assembly includes a mounting sleeve, a movable assembly, a test head, a laser positioning device, a rotating plate, a rotating column, a third motor and a stopper. The movable assembly is installed in the mounting sleeve, the test head is installed on the movable assembly, a rotating column is installed at the bottom of the mounting sleeve, a protrusion is provided on the rotating column, and stops are fixed on both sides of the rotating column on the lower surface of the mounting sleeve. The rotating column passes through the rotating plate and is connected to the output end of the third motor. The rotating plate is fixed on the rotating column, and a laser positioning device is installed at the bottom of the rotating plate.

[0017] Preferably, the movable component includes a second motor, a first threaded rod, a movable tube, a first movable block, a sliding rod and a clamping block. The output end of the second motor is connected to the first threaded rod, and the corresponding surface of the first threaded rod is provided with a sliding rod. The first movable block is movably installed on the first threaded rod and the sliding rod, the movable tube is installed on the first movable block, and the clamping block is installed on the movable tube.

[0018] Preferably, the brush cleans dust and impurities through a variety of fiber bristles and electrostatic adsorption; the brush includes: an electrostatic bristle area, a micron fiber bristle area, a nanofiber bristle area, an electrostatic release layer, an elastic support layer, and a brush base;

[0019] The electrostatic bristle area is set as electrostatic adsorption bristles, which are used to absorb dust through electrostatic adsorption bristles; the micron fiber bristle area is set as micron-level fiber bristles, which are used to clean larger particles of impurities;

[0020] The nanofiber bristle area is provided with nano-scale fiber bristles for cleaning smaller particles of impurities; the elastic support layer is provided between the micron fiber bristle area and the nanofiber bristle area and the brush base, and the material is an elastic rubber strip, which is used to elastically support the micron fiber bristles and nanofiber bristles in the micron fiber bristle area and the nanofiber bristle area to prevent the fiber bristles from curling;

[0021] The electrostatic release layer is configured as conductive fibers, the conductive fibers are spaced apart from the electrostatic adsorption bristles, one end of the conductive fibers is electrically connected to an electrostatic conductive strip, the electrostatic conductive strip is electrically connected to a withstand voltage switch, and the withstand voltage switch is electrically connected to an electrostatic release ground terminal;

[0022] During the cleaning process, the withstand voltage switch is disconnected, the electrostatic release layer and the electrostatic release grounding terminal are not conductive, the static electricity in the electrostatic brush area is not released, and the dust is absorbed by the electrostatic adsorption bristles;

[0023] After cleaning is completed, the withstand voltage switch is turned on, the electrostatic conductive belt is connected to the electrostatic release grounding terminal, and the electrostatic release layer releases static electricity to the electrostatic release grounding terminal through the electrostatic conductive belt; after the static electricity in the electrostatic brush area is released, the electrostatically adsorbed dust after cleaning is easier to fall off for dust collection and processing.

[0024] Preferably, the laser positioning device comprises:

[0025] Precision bidirectional grating, positioning indexing plate, laser ray mechanism, reflection photoelectric conversion mechanism and detection and positioning control module; the precision bidirectional grating is set on the positioning indexing plate, and the vertical and horizontal bidirectional gratings centered on the center point of the positioning indexing plate respectively detect the vertical coordinate and horizontal coordinate of the positioning point of the IC integrated circuit;

[0026] The positioning indexing plate is set as an annular scale plate, which is arranged on the bottom surface of the laser positioning device to detect the rotation angle of the IC integrated circuit;

[0027] The laser ray mechanism emits a positioning detection laser line to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser line, which passes through the precision bidirectional grating and irradiates the reflective photoelectric conversion mechanism;

[0028] The reflective photoelectric conversion mechanism receives the laser line reflected from the positioning point of the IC integrated circuit, and converts the optical signal of the laser line reflected from the positioning point into a positioning detection electrical signal through photoelectric conversion;

[0029] The detection and positioning control module calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk based on the positioning detection electrical signal;

[0030] Establish a spatial positioning coordinate system with the center point of the positioning indexing disk as the coordinate origin; calculate the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk;

[0031] By calculating the distance from the IC integrated circuit positioning point to the center point of the positioning indexing disk, as well as the angle between the line connecting the IC integrated circuit positioning point to the center point of the positioning indexing disk and the line connecting the center point of the positioning indexing disk and the center point of the test head, combined with the direction of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk, the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk is obtained, thereby determining whether the IC integrated circuit and the test head are precisely aligned, thereby improving the IC integrated circuit test positioning accuracy.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The present invention cleans dust and impurities on the IC integrated circuit by means of a wiping sponge and a brush. The brush can clean larger impurities on the surface of the IC integrated circuit, and the wiping sponge can wipe impurities on the surface of the IC integrated circuit that are not easily cleaned, thereby ensuring the cleanliness of the surface of the IC integrated circuit, preventing the IC integrated circuit from being disturbed by impurities during testing, and improving the reliability of the IC integrated circuit test. The laser positioning device provided at the bottom of the rotating plate accurately positions the terminal of the IC integrated circuit, so that the test head can accurately contact the terminal of the IC integrated circuit, thereby ensuring the accuracy of the IC integrated circuit connection and making the test result more reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is an overall schematic diagram of the IC integrated circuit reliability tester of the present invention;

[0035] Figure 2 Schematic diagram of the transmission component of the IC integrated circuit reliability tester of the present invention;

[0036] Figure 3 Schematic diagram of a cleaning component of an IC integrated circuit reliability tester of the present invention;

[0037] Figure 4 Schematic diagram of the installation components of the IC integrated circuit reliability tester of the present invention;

[0038] Figure 5 Schematic diagram of the test assembly of the IC integrated circuit reliability tester of the present invention;

[0039] Figure 6 A schematic diagram of the active components of the IC integrated circuit reliability tester of the present invention;

[0040] Figure 7 Schematic diagram of the test system of the IC integrated circuit reliability tester of the present invention;

[0041] Figure 8 A test flow chart of the IC integrated circuit reliability tester of the present invention;

[0042] Figure 9 Schematic diagram of the brush structure of the IC integrated circuit reliability tester of the present invention;

[0043] Figure 10 The figure is a schematic structural diagram of the laser positioning device of the IC integrated circuit reliability tester of the present invention.

[0044] In the figure: 1. frame; 2. transmission component; 21. first motor; 22. driving shaft; 23. belt; 24. rack; 25. driven shaft; 3. placement groove; 4. side support plate; 5. cleaning component; 51. mounting shaft; 52. gear; 53. mounting part; 54. mounting frame; 55. wiping sponge; 56. brush; 561. electrostatic bristle area; 562. micron fiber bristle area; 563. nanofiber bristle area; 564. electrostatic release layer; 565. elastic support layer; 566. brush base; 6. test component; 61. mounting sleeve; 62. movable component; 621. second motor; 622. first threaded rod; 623. movable tube; 62 4. First moving block; 625. Slide rod; 626. Clamping block; 63. Test head; 64. Laser positioning device; 641. Precision bidirectional grating; 642. Positioning dividing plate; 643. Laser ray mechanism; 644. Reflection photoelectric conversion mechanism; 645. Detection and positioning control module; 65. Rotating plate; 66. Rotating column; 67. Third motor; 68. Stop block; 7. Support seat; 8. Mounting assembly; 81. Support column; 82. Top plate; 83. Mounting plate; 84. Support rod; 85. Test system; 86. Moving assembly; 861. Connecting plate; 862. Second moving block; 863. Second threaded rod; 864. Fourth motor; 9. Heating chamber. DETAILED DESCRIPTION

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0046] In order to solve the problem that impurities may exist in the test port of the integrated circuit during actual use of the existing technology, thereby hindering the test, please refer to Figures 1-10 , this embodiment provides the following technical solutions:

[0047] The IC integrated circuit reliability tester includes a frame 1, a side support plate 4 and a support seat 7. A conveying component 2 is installed in the frame 1, and a placement slot 3 is provided on the conveying component 2. Support seats 7 are fixed on both sides of the frame 1, and a mounting component 8 is fixed on the support seat 7. A test component 6 is installed on the mounting component 8. Side support plates 4 are installed on both sides of the upper surface of the frame 1, and a cleaning component 5 is installed on the side support plate 4. A heating chamber 9 is provided on the right side of the cleaning component 5. The IC integrated circuit is placed in the placement slot 3, and the IC integrated circuit is heated in the heating chamber 9, cleaned by the cleaning component 5, and then transferred to the test component 6 for testing. The IC integrated circuit is tested by the heating chamber 9. High-temperature processing can test the reliability of IC integrated circuits in high-temperature environments and can discover potential hidden dangers in advance, such as material degradation caused by thermal stress, solder joint failure, and thermal migration within the circuit, thereby improving the durability and reliability of IC integrated circuits. By simulating extreme high-temperature environments, defects in IC integrated circuit design can be identified and resolved, ensuring the stability and reliability of IC integrated circuits in actual use. High-temperature simulation can also identify potential defects in IC integrated circuits, reduce failure rates, thereby improving the overall quality of the product and user satisfaction, and evaluate the performance stability and durability of ICs under long-term high-temperature conditions, thereby extending their service life.

[0048] The mounting assembly 8 includes a support column 81, a top plate 82, a mounting plate 83, a support rod 84, a test system 85 and a moving assembly 86. The top plate 82 is fixedly mounted on the support column 81, the support rod 84 is fixed to the lower surface of the top plate 82, the bottom of the support rod 84 is fixed to the mounting plate 83, the testing system 85 is provided on the mounting plate 83, and the moving assembly 86 is provided on the side of the mounting plate 83.

[0049] The test system 85 comprises:

[0050] A data acquisition unit, used for collecting test data of the IC tested by the test component 6 in real time;

[0051] A data processing unit, used to process instantaneous interference signals using a sliding average filter and perform normalization on the data;

[0052] A data analysis unit, configured to analyze the performance of the IC using the processed data and evaluate the reliability of the IC;

[0053] The report generation unit is used to generate a test report including test conditions, key data charts, failure analysis conclusions and improvement suggestions.

[0054] When analyzing the collected original parameters of voltage, current, and temperature in the test, the distribution characteristics of performance indicators are determined by calculating the mean and variance of key parameters. Through electrical measurement, spectrum analysis and other methods, early defects, random failures during use and aging problems during wear and tear can be quickly identified, significantly improving fault diagnosis efficiency. Parameter drift is observed through time series analysis to identify early failure characteristics of IC integrated circuits. The main fault types are located using Pareto charts to obtain analysis results of IC integrated circuits. It can continuously record the timing changes of key parameters (such as voltage, current, and temperature) and capture gradual failure modes that are difficult to detect with traditional static testing. Statistical analysis of parameter drift can identify potential failure risks in advance. The combination of time series analysis and Pareto charts can efficiently identify early failure characteristics of IC integrated circuits and optimize fault location.

[0055] The moving assembly 86 includes a connecting plate 861, a second moving block 862, a second threaded rod 863 and a fourth motor 864. The connecting plate 861 is fixed to the side of the mounting plate 83. The second threaded rod 863 is rotatably installed on the connecting plate 861. One end of the second threaded rod 863 passes through the connecting plate 861 and is installed at the output end of the fourth motor 864. The second moving block 862 is movably installed on the second threaded rod 863. Starting the fourth motor 864 causes the second threaded rod 863 to rotate, thereby driving the second moving block 862 to move, which is used to adjust the position of the test assembly 6 to realize the test of the IC integrated circuit.

[0056] The transmission component 2 includes a first motor 21, a driving shaft 22, a belt 23, a rack 24 and a driven shaft 25. The first motor 21 is installed on the outside of the frame 1. The output end of the first motor 21 is connected to the driving shaft 22. The driving shaft 22 is rotatably installed on the inner side of the frame 1. A belt 23 is installed on the driving shaft 22. The end of the belt 23 away from the driving shaft 22 is installed on the driven shaft 25. The driven shaft 25 is installed on the inner side of the frame 1. Racks 24 are provided at both ends of the belt 23. Starting the first motor 21 causes the driving shaft 22 to rotate, driving the belt 23 to work. The operation of the belt 23 drives the placement slot 3 to move, so that the IC integrated circuit placed in the placement slot 3 moves, completing the test of the IC integrated circuit.

[0057] The cleaning assembly 5 includes a mounting shaft 51, a gear 52, a mounting member 53, a mounting frame 54, a wiping sponge 55 and a brush 56. Gears 52 are provided at both ends of the mounting shaft 51. A mounting member 53 is fixed in the middle of the mounting shaft 51. Four mounting frames 54 are installed on the mounting member 53 at equal distances. A wiping sponge 55 and a brush 56 are installed on the mounting frame 54 respectively. Two wiping sponges 55 and two brushes 56 are provided, and the wiping sponges 55 and the brushes 56 are arranged crosswise. The gear 52 is engaged with the rack 24. When the rack 24 moves with the belt When the rack 23 moves, the gear 52 engaged with the rack 24 rotates, driving the mounting shaft 51 to rotate, so that the wiping sponge 55 and the brush 56 clean the dust and impurities on the IC integrated circuit. The brush 56 can clean the larger impurities on the surface of the IC integrated circuit, and the wiping sponge 55 can wipe the impurities on the surface of the IC integrated circuit that are not easy to be cleaned, thereby ensuring the cleanliness of the surface of the IC integrated circuit, so that the IC integrated circuit will not be disturbed by impurities during testing, and improving the reliability of the IC integrated circuit test.

[0058] The test assembly 6 includes a mounting sleeve 61, a movable assembly 62, a test head 63, a laser positioning device 64, a rotating plate 65, a rotating column 66, a third motor 67 and a stopper 68. The movable assembly 62 is installed in the mounting sleeve 61, and the test head 63 is installed on the movable assembly 62. A rotating column 66 is installed at the bottom of the mounting sleeve 61, and a protrusion is provided on the rotating column 66. The lower surface of the mounting sleeve 61 is located on both sides of the rotating column 66 and has fixed blocks 68. The rotating column 66 passes through the rotating plate 65 and is connected to the output end of the third motor 67. The rotating plate 65 is fixed on the rotating column 66, and a laser positioning device 64 is installed at the bottom of the rotating plate 65.

[0059] The movable component 62 includes a second motor 621, a first threaded rod 622, a movable tube 623, a first moving block 624, a slide rod 625 and a clamping block 626. The output end of the second motor 621 is connected to the first threaded rod 622. The corresponding surface of the first threaded rod 622 is provided with a slide rod 625. The first moving block 624 is movably installed on the first threaded rod 622 and the slide rod 625. The movable tube 623 is installed on the first moving block 624. The clamping block 626 is installed on the movable tube 623. The movable tube 623 includes a fixed tube, a compression spring and an inner sleeve. The fixed tube is fixed on the first moving block 624. The inner sleeve is movably installed in the fixed tube. The inner sleeve and the interior of the fixed tube are connected together by a compression spring, and the inner sleeve is fixed on the clamping block 626.

[0060] Move the IC integrated circuit to the top of the test assembly 6, and accurately locate the terminal of the IC integrated circuit through the laser positioning device 64 provided at the bottom of the rotating plate 65. After the positioning is completed, start the third motor 67 to rotate the rotating column 66, and then rotate the rotating plate 65 away from the mounting sleeve 61. The stopper 68 provided cooperates with the protrusion to limit the rotation angle of the rotating plate 65, and fix the test head 63 through the clamping block 626. The inner sleeve and the fixed tube are connected by a compression spring, so that the movable tube 623 can be extended and retracted. Under the elasticity of the spring, the test head 63 can be clamped and fixed. Then start the second motor 621 to rotate the first threaded rod 622, and proceed. The first moving block 624 is driven to move, and the test head 63 is lowered to the positioned position, so that the test head 63 contacts the IC integrated circuit terminal and the IC integrated circuit is tested. The laser positioning device 64 provided at the bottom of the rotating plate 65 accurately positions the IC integrated circuit terminal. After the positioning is completed, the rotating column 66 is rotated, and then the rotating plate 65 is rotated away from the mounting sleeve 61. Then, the second motor 621 is started to lower the test head 63 to the positioned position, so that the position of the test head 63 is consistent with the position positioned by the laser positioning device 64, thereby achieving precise positioning, ensuring the accuracy of the IC integrated circuit wiring, and making the test results more reliable.

[0061] Working principle: When using the IC integrated circuit reliability tester of the present invention, according to Figures 1-8 , including the following steps:

[0062] S1: Place the IC in the placement slot 3, start the first motor 21, rotate the driving shaft 22, and drive the belt 23 to work. The belt 23 drives the placement slot 3 to move, and the IC is heated in the heating chamber 9 and then transferred to the cleaning component 5;

[0063] S2: When the belt 23 moves, the rack 24 moves accordingly, causing the gear 52 meshing with the rack 24 to rotate, driving the mounting shaft 51 to rotate, so that the wiping sponge 55 and the brush 56 clean the dust and impurities on the IC;

[0064] S3: After cleaning, the belt 23 moves to the top of the test assembly 6, and the laser positioning device 64 locates the terminal of the IC. After positioning, the third motor 67 is started to rotate the rotating plate 65 away from the mounting sleeve 61.

[0065] S4: Starting the second motor 621 to rotate the first threaded rod 622, thereby driving the first moving block 624 to move, lowering the test head 63 to a predetermined position, so that the test head 63 contacts the terminal of the IC to test the IC;

[0066] S5: At this time, the data acquisition unit of the test system 85 collects the test data of the IC tested by the test head 63 in real time, uses a sliding average filter to process the instantaneous interference signal and normalizes the data;

[0067] S6: Use the processed data to analyze the performance of the IC integrated circuit and evaluate the reliability of the IC integrated circuit. After the evaluation is completed, a test report containing test conditions, key data charts, failure analysis conclusions and improvement suggestions is generated.

[0068] In summary, the IC integrated circuit reliability tester of the present invention performs high-temperature treatment on the IC integrated circuit through the heating chamber 9, and can test the reliability of the IC integrated circuit in a high-temperature environment. It can detect potential hidden dangers in advance, such as material degradation caused by thermal stress, solder joint failure, and thermal migration within the circuit, thereby improving the durability and reliability of the IC integrated circuit. By simulating an extreme high-temperature environment, it can identify and solve defects in the IC integrated circuit design, ensuring the stability and reliability of the IC integrated circuit in actual use. The high-temperature simulation can also identify potential defects in the IC integrated circuit, reduce the failure rate, thereby improving the overall quality of the product and user satisfaction, and evaluate the performance stability and durability of the IC under long-term high-temperature conditions. Thereby extending its service life, the dust and impurities on the IC integrated circuit are cleaned by the provided wiping sponge 55 and brush 56. The brush 56 can clean larger impurities on the surface of the IC integrated circuit, and the wiping sponge 55 can wipe impurities on the surface of the IC integrated circuit that are not easy to be cleaned, thereby ensuring the cleanliness of the surface of the IC integrated circuit, so that the IC integrated circuit will not be disturbed by impurities during testing, and improving the reliability of the IC integrated circuit test. The laser positioning device 64 provided at the bottom of the rotating plate 65 accurately positions the terminal of the IC integrated circuit, so that the test head 63 can accurately contact the terminal of the IC integrated circuit, ensuring the accuracy of the IC integrated circuit wiring, and making the test result more reliable.

[0069] In another embodiment, a brush 56 cleans dust and impurities by using multiple fiber bristles and electrostatic adsorption; the brush 56 includes: an electrostatic bristle area 561561, a micron fiber bristle area 562562, a nanofiber bristle area 563563, an electrostatic release layer 654564, an elastic support layer 565565, and a brush base 566566;

[0070] The electrostatic bristle area 561 is configured as an electrostatic adsorption bristle, which is used to electrostatically adsorb dust through the electrostatic adsorption bristles; the micron fiber bristle area 562 is configured as a micron-level fiber bristle, which is used to clean larger particles of impurities;

[0071] The nanofiber bristle area 563 is provided with nano-scale fiber bristles for cleaning smaller particles of impurities; the elastic support layer 565 is provided between the micron fiber bristle area 562 and the nanofiber bristle area 563 and the brush base 566. The material is an elastic rubber strip, which is used to elastically support the micron fiber bristles and nanofiber bristles of the micron fiber bristle area 562 and the nanofiber bristle area 563 to prevent the fiber bristles from curling;

[0072] The electrostatic release layer 654 is configured as conductive fibers, the conductive fibers are alternately arranged with the electrostatic adsorption bristles, one end of the conductive fibers is electrically connected to an electrostatic conductive strip, the electrostatic conductive strip is electrically connected to a withstand voltage switch, and the withstand voltage switch is electrically connected to an electrostatic release ground terminal;

[0073] During the cleaning process, the withstand voltage switch is disconnected, the electrostatic release layer 654 is not conductive with the electrostatic release ground terminal, the static electricity in the electrostatic bristle area 561 is not released, and the dust is electrostatically attracted by the electrostatic adsorption bristles;

[0074] After cleaning is completed, the voltage-resistant switch is turned on, the electrostatic conductive belt is connected to the electrostatic release ground terminal, and the electrostatic release layer 654 releases static electricity to the electrostatic release ground terminal through the electrostatic conductive belt; after the static electricity in the electrostatic brush area 561 is released, the electrostatically adsorbed dust after cleaning is easier to fall off for dust collection and processing.

[0075] The principle and effect include: the IC integrated circuit test surface cleanliness requirement is very high; the brush 56 cleans dust and impurities through a variety of fiber bristles and electrostatic adsorption; it can clean a variety of dust; the brush 56 includes: an electrostatic brush area 561561, a micron fiber brush area 562562, a nanofiber brush area 563563, an electrostatic release layer 654564, an elastic support layer 565565, and a brush base 566566; the electrostatic brush area 561 is set as an electrostatic adsorption brush, which is used to remove dust and impurities through static The electrostatic adsorption bristles adsorb dust by electrostatic force; the micron fiber bristle area 562 is set as micron-level fiber bristles for cleaning larger particles of impurities; the nanofiber brush area 563 is set as nanofiber bristles for cleaning smaller particles of impurities; it can clean dust more thoroughly; it can clean impurities of different particle sizes; the elastic support layer 565 is set between the micron fiber brush area 562 and the nanofiber brush area 563 and the brush base 566, and the material is an elastic rubber strip for elastically supporting the micron fiber brush area 562 and the nanofiber brush area The micron fiber bristles and nanofiber bristles in the brush bristle area 563 prevent the fiber bristles from curling and can protect the surface of the IC integrated circuit from being scratched; the electrostatic release layer 654 is set as conductive fiber, and the conductive fiber and the electrostatic adsorption bristles are arranged at intervals, and one end of the conductive fiber is electrically connected to the electrostatic conductive belt, the electrostatic conductive belt is electrically connected to the withstand voltage switch, and the withstand voltage switch is electrically connected to the electrostatic release grounding terminal; during the cleaning process, the withstand voltage switch is disconnected, the electrostatic release layer 654 and the electrostatic release grounding terminal are not conductive, the static electricity in the electrostatic brush bristle area 561 is not released, and the electrostatic adsorption bristles electrostatically adsorb dust; after cleaning is completed, the withstand voltage switch is connected, the electrostatic conductive belt and the electrostatic release grounding terminal are conductive, and the electrostatic release layer 654 releases static electricity to the electrostatic release grounding terminal through the electrostatic conductive belt; after the static electricity in the electrostatic brush bristle area 561 is released, the electrostatically adsorbed dust after cleaning is more likely to fall off for dust collection and processing; the cleaning effect on the surface of the IC integrated circuit is significantly improved; the interference factors of the IC integrated circuit test are significantly reduced; and the surface protection effect during the IC integrated circuit test is significantly improved.

[0076] In another embodiment, the laser positioning device 64 includes:

[0077] Precision bidirectional grating 641-641, positioning indexing plate 642-642, laser beam mechanism 643-643, reflection photoelectric conversion mechanism 644-644, and detection and positioning control module 645-645; precision bidirectional grating 641 is set on the positioning indexing plate 642, and the vertical and horizontal bidirectional gratings centered on the center point of the positioning indexing plate 642 respectively detect the vertical coordinate and horizontal coordinate of the positioning point of the IC integrated circuit;

[0078] The positioning indexing plate 642 is configured as an annular scale plate and is disposed on the bottom surface of the laser positioning device to detect the rotation angle of the IC integrated circuit;

[0079] The laser beam mechanism 643 emits a positioning detection laser beam to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser beam, passes through the precision bidirectional grating 641 and irradiates the reflective photoelectric conversion mechanism 644;

[0080] The reflective photoelectric conversion mechanism 644 receives the laser line reflected from the positioning point of the IC integrated circuit, and converts the optical signal of the laser line reflected from the positioning point into a positioning detection electrical signal through photoelectric conversion;

[0081] The detection and positioning control module 645 calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing plate 642 based on the positioning detection electrical signal;

[0082] Establish a spatial positioning coordinate system with the center point of the positioning indexing plate 642 as the coordinate origin; calculate the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing plate 642;

[0083] By calculating the distance from the IC integrated circuit positioning point to the center point of the positioning indexing disk 642, as well as the angle between the line connecting the IC integrated circuit positioning point to the center point of the positioning indexing disk 642 and the line connecting the center point of the positioning indexing disk 642 and the center point of the test head, combined with the direction of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk 642, the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk 642 is obtained, thereby determining whether the IC integrated circuit and the test head are precisely aligned, thereby improving the IC integrated circuit test positioning accuracy.

[0084] The principles and effects include: IC integrated circuits are very precise, and precise positioning is very critical during the test process. The laser positioning device 64 includes: a precise bidirectional grating 641641, a positioning dividing plate 642642, a laser beam mechanism 643643, a reflective photoelectric conversion mechanism 644644, and a detection and positioning control module 645645; the precise bidirectional grating 641 is arranged on the positioning dividing plate 642, and the longitudinal and transverse bidirectional gratings centered on the center point of the positioning dividing plate 642 respectively detect the longitudinal coordinates and transverse coordinates of the positioning point of the IC integrated circuit; the precise bidirectional grating 641 is arranged with grating scales in two directions perpendicular to each other to measure the longitudinal coordinates and transverse coordinates of the positioning point respectively; the positioning dividing plate 642 is set as an annular scale plate, which is set on the bottom surface of the laser positioning device to detect the rotation angle of the IC integrated circuit; the scale marking of the positioning dividing plate 642 is evenly scaled on the annular surface, and the positioning point of the IC integrated circuit reflects the laser line The corresponding scale markings on the positioning indexing plate 642 indicate the direction of the IC integrated circuit positioning point relative to the center point of the positioning indexing plate 642; the laser beam mechanism 643 emits a positioning detection laser line to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser line, which passes through the precision bidirectional grating 641 and is irradiated to the reflection photoelectric conversion mechanism 644; the reflection photoelectric conversion mechanism 644 receives the laser line reflected from the IC integrated circuit positioning point, and converts the laser line light signal reflected from the positioning point into a positioning detection electrical signal through photoelectric conversion; the detection and positioning control module 645 calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing plate 642 based on the positioning detection electrical signal; establishes a spatial positioning coordinate system with the center point of the positioning indexing plate 642 as the coordinate origin; and takes the center point of the annular inner and outer circles as the center point of the positioning indexing plate 642; calculating the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing plate 642 includes:

[0085]

[0086] Wherein, L represents the distance from the IC integrated circuit positioning point to the center point of the positioning indexing disk 642; W represents the angle between the line connecting the IC integrated circuit positioning point to the center point of the positioning indexing disk 642 and the line connecting the center point of the positioning indexing disk 642 and the center point of the test head; arcsin represents the inverse sine angle conversion calculation; x represents the horizontal coordinate of the IC integrated circuit positioning point on the test head surface; y represents the vertical coordinate of the IC integrated circuit positioning point on the test head surface; Ho represents the vertical distance between the center point of the positioning indexing disk 642 and the center point of the test head; by calculating the distance from the IC integrated circuit positioning point to the positioning indexing disk 642, the angle between the IC integrated circuit positioning point and the positioning indexing disk 642 is 0. 2 center points, as well as the angle between the line connecting the IC integrated circuit positioning point to the center point of the positioning indexing disk 642 and the line connecting the center point of the positioning indexing disk 642 and the center point of the test head, combined with the direction of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk 642, to obtain the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk 642, thereby determining whether the IC integrated circuit and the test head are precisely aligned; based on the three positioning principles of distance, angle and direction, accurate positioning of the IC integrated circuit test process can be performed; the positioning accuracy of the IC integrated circuit test process is significantly improved.

[0087] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0088] While the embodiments of the present invention have been shown and described, it will be apparent to those skilled in the art that various changes, modifications, substitutions, and alterations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. An IC integrated circuit reliability tester, comprising a frame (1), a side support plate (4) and a support base (7), characterized in that: A conveying assembly (2) is installed in the frame (1), a placement slot (3) is provided on the conveying assembly (2), support seats (7) are fixed on both sides of the frame (1), a mounting assembly (8) is fixed on the support seat (7), a test assembly (6) is installed on the mounting assembly (8), side support plates (4) are installed on both sides of the upper surface of the frame (1), a cleaning assembly (5) is installed on the side support plates (4), and a heating chamber (9) is provided on the right side of the cleaning assembly (5).

2. The IC integrated circuit reliability tester and testing method according to claim 1, characterized in that: The mounting assembly (8) comprises a support column (81), a top plate (82), a mounting plate (83), a support rod (84), a test system (85) and a moving assembly (86); the support column (81) is fixedly mounted with the top plate (82); the lower surface of the top plate (82) is fixed with the support rod (84); the bottom of the support rod (84) is fixed to the mounting plate (83); the testing system (85) is provided on the mounting plate (83); and the side of the mounting plate (83) is provided with the moving assembly (86).

3. The IC integrated circuit reliability tester and testing method according to claim 2, characterized in that: The testing system (85) comprises: A data acquisition unit, used for collecting in real time the test data of the IC tested by the test component (6); A data processing unit, used to process instantaneous interference signals using a sliding average filter and perform normalization on the data; A data analysis unit, configured to analyze the performance of the IC using the processed data and evaluate the reliability of the IC; The report generation unit is used to generate a test report including test conditions, key data charts, failure analysis conclusions and improvement suggestions.

4. The IC integrated circuit reliability tester and testing method according to claim 2, characterized in that: The moving assembly (86) includes a connecting plate (861), a second moving block (862), a second threaded rod (863) and a fourth motor (864). The connecting plate (861) is fixed to the side of the mounting plate (83). The second threaded rod (863) is rotatably mounted on the connecting plate (861). One end of the second threaded rod (863) passes through the connecting plate (861) and is mounted on the output end of the fourth motor (864). The second moving block (862) is movably mounted on the second threaded rod (863).

5. The IC integrated circuit reliability tester and testing method according to claim 1, wherein: The transmission assembly (2) comprises a first motor (21), a driving shaft (22), a belt (23), a rack (24) and a driven shaft (25), wherein the first motor (21) is mounted on the outside of the frame (1), the output end of the first motor (21) is connected to the driving shaft (22), the driving shaft (22) is rotatably mounted on the inside of the frame (1), a belt (23) is mounted on the driving shaft (22), an end of the belt (23) away from the driving shaft (22) is mounted on the driven shaft (25), the driven shaft (25) is mounted on the inside of the frame (1), and racks (24) are provided at both ends of the belt (23).

6. The IC integrated circuit reliability tester and testing method according to claim 1, characterized in that: The cleaning assembly (5) comprises a mounting shaft (51), a gear (52), a mounting member (53), a mounting frame (54), a wiping sponge (55) and a brush (56). Gears (52) are provided at both ends of the mounting shaft (51). A mounting member (53) is fixed in the middle of the mounting shaft (51). Four mounting frames (54) are equidistantly mounted on the mounting member (53). The wiping sponge (55) and the brush (56) are respectively mounted on the mounting frames (54).

7. The IC integrated circuit reliability tester and testing method according to claim 1, characterized in that: The test assembly (6) comprises a mounting sleeve (61), a movable assembly (62), a test head (63), a laser positioning device (64), a rotating plate (65), a rotating column (66), a third motor (67) and a stopper (68). The movable assembly (62) is mounted in the mounting sleeve (61), the test head (63) is mounted on the movable assembly (62), a rotating column (66) is mounted at the bottom of the mounting sleeve (61), a convex block is provided on the rotating column (66), the lower surface of the mounting sleeve (61) is located on both sides of the rotating column (66) and the stopper (68) is fixed, the rotating column (66) passes through the rotating plate (65) and is connected to the output end of the third motor (67), the rotating plate (65) is fixed on the rotating column (66), and the laser positioning device (64) is mounted at the bottom of the rotating plate (65).

8. The IC integrated circuit reliability tester and testing method according to claim 7, characterized in that: The movable assembly (62) comprises a second motor (621), a first threaded rod (622), a movable tube (623), a first moving block (624), a sliding rod (625) and a clamping block (626); the output end of the second motor (621) is connected to the first threaded rod (622); a sliding rod (625) is provided on a corresponding surface of the first threaded rod (622); the first moving block (624) is movably mounted on the first threaded rod (622) and the sliding rod (625); the movable tube (623) is mounted on the first moving block (624); and the clamping block (626) is mounted on the movable tube (623).

9. The IC integrated circuit reliability tester and testing method according to claim 6, characterized in that: The brush (56) cleans dust and impurities through a variety of fiber bristles and electrostatic adsorption; the brush (56) includes: an electrostatic bristle area (561), a micron fiber bristle area (562), a nanofiber bristle area (563), an electrostatic release layer (654), an elastic support layer (565) and a brush base (566); The electrostatic bristle area (561) is configured as an electrostatic adsorption bristle for electrostatically adsorbing dust through the electrostatic adsorption bristle; the micron fiber bristle area (562) is configured as a micron-grade fiber bristle for cleaning larger particles of impurities; The nanofiber brush area (563) is provided with nano-scale fiber bristles for cleaning smaller particle impurities; the elastic support layer (565) is provided between the micron fiber brush area (562) and the nanofiber brush area (563) and the brush base (566), and is made of an elastic rubber strip for elastically supporting the micron fiber bristles and nanofiber bristles of the micron fiber brush area (562) and the nanofiber brush area (563) to prevent the fiber bristles from curling; The electrostatic release layer (654) is configured as conductive fibers, the conductive fibers and the electrostatic adsorption bristles are arranged at intervals, one end of the conductive fibers is electrically connected to an electrostatic conductive strip, the electrostatic conductive strip is electrically connected to a withstand voltage switch, and the withstand voltage switch is electrically connected to an electrostatic release ground terminal; During the cleaning process, the withstand voltage switch is disconnected, the electrostatic release layer (654) is not connected to the electrostatic release ground terminal, the static electricity in the electrostatic brush bristle area (561) is not released, and the dust is electrostatically attracted by the electrostatic adsorption bristles; After cleaning is completed, the withstand voltage switch is turned on, the electrostatic conductive belt is connected to the electrostatic release ground terminal, and the electrostatic release layer (654) releases static electricity to the electrostatic release ground terminal through the electrostatic conductive belt; after the electrostatic brush area (561) releases static electricity, the electrostatically adsorbed dust after cleaning is more likely to fall off for dust collection and processing.

10. The IC integrated circuit reliability tester and testing method according to claim 7, characterized in that: The laser positioning device (64) comprises: A precision bidirectional grating (641), a positioning indexing disk (642), a laser beam mechanism (643), a reflection photoelectric conversion mechanism (644), and a detection and positioning control module (645); the precision bidirectional grating (641) is arranged on the positioning indexing disk (642), and the vertical and horizontal bidirectional gratings centered on the center point of the positioning indexing disk (642) respectively detect the vertical coordinate and the horizontal coordinate of the positioning point of the IC integrated circuit; The positioning indexing disk (642) is configured as an annular scale disk and is disposed on the bottom surface of the laser positioning device (64) for detecting the rotation angle of the IC integrated circuit; The laser ray mechanism (643) emits a positioning detection laser line to the IC integrated circuit positioning point; the IC integrated circuit positioning point reflects the laser line, passes through the precision bidirectional grating (641), and irradiates the reflective photoelectric conversion mechanism (644); The reflection photoelectric conversion mechanism (644) receives the laser line reflected from the positioning point of the IC integrated circuit, and converts the optical signal of the laser line reflected from the positioning point into a positioning detection electrical signal through photoelectric conversion; The detection and positioning control module (645) calculates the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk (642) based on the positioning detection electrical signal; Establishing a spatial positioning coordinate system with the center point of the positioning indexing disk (642) as the coordinate origin; calculating the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning indexing disk (642); By calculating the distance from the IC integrated circuit positioning point to the center point of the positioning index disk (642), and the angle between the line connecting the IC integrated circuit positioning point to the center point of the positioning index disk (642) and the line connecting the center point of the positioning index disk (642) and the center point of the test head, and combining the direction of the IC integrated circuit positioning point relative to the center point of the positioning index disk (642), the spatial coordinate position of the IC integrated circuit positioning point relative to the center point of the positioning index disk (642) is obtained, thereby determining whether the IC integrated circuit and the test head are precisely aligned, thereby improving the IC integrated circuit test positioning accuracy.

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