Curve-based GDSII optimization methods, systems, media, procedures, and electronic terminals for the routing layer.
By using the Manhattan-style global routing algorithm and the weakpoints graphics library for matching, combined with curve replacement technology, the problems of current density concentration and lithography error caused by right-angle routing in integrated circuits are solved. This achieves consistency in routing pattern and reduces process weak points, thereby improving the process yield and electromigration reliability of integrated circuits.
Patent Information
- Application Number
- CN202511165445.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-20
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2045-08-20
AI Technical Summary
In integrated circuit design, right-angle wiring leads to concentrated current density, increasing resistance and electromigration risks. Furthermore, right-angle configurations are prone to diffraction during photolithography, causing inconsistencies between the physical design drawings and the actual circuit wiring on the wafer, which affects the extraction of parasitic capacitance and resistance and timing analysis.
The initial routing is generated using the Manhattan global routing algorithm. Shape matching is performed using the weakpoints graphics library. The weakpoints region is traversed one by one to extract right-angled configuration blocks and perform curve replacement according to the turning direction. Euler spiral, Clothoid curve, circular arc, elliptical equation or Bezier algorithm are used to perform smooth curve fitting to replace right-angled routing segments.
Without performing global curve routing, it reduces process weaknesses caused by right angles, ensures consistency between the physical design drawings and the actual wafer lithography circuit routing, reduces data processing volume and running time, and improves process yield and electromigration reliability.
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Figure CN120724959B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit design, and in particular to a curve-based routing layer GDSII optimization method, system, medium, program, and electronic terminal. Background Technology
[0002] The design and manufacturing of integrated circuits are advancing rapidly along with societal development. Since the introduction of Moore's Law, the number of transistors in a chip has grown from a few thousand to tens of billions. In particular, since the process node entered the nanometer era, the complexity of design has exploded. Since 2020, the computing power demands of AI, autonomous driving, and HPC have driven the further development of integrated circuits. This has also made it necessary for the design and manufacturing ends of advanced node integrated circuits to collaborate and complete the production process. The design end needs to consider the production difficulties of the manufacturing end and avoid risks at the front end, thereby finding the best balance between performance, power consumption, area, and cost.
[0003] Currently, in the integrated circuit field, chip design primarily uses right-angle wiring. Curved lines are only used in a few large areas for packaging convenience. However, the massive computational demands of curved wiring on the lower layers make it currently impossible to implement. Right-angle wiring leads to current density concentration at corners (point discharge effect), increasing resistance and electromigration risks. Furthermore, right-angle configurations are prone to diffraction during chip lithography, causing corner rounding errors. This results in a discrepancy between the physical design drawings and the actual wafer lithography circuit layout, causing significant errors in subsequent RC analysis for parasitic capacitance and resistance extraction, as well as timing analysis. Therefore, how to minimize weak points caused by right angles while avoiding global curved wiring, and ensuring consistency in the shape of the circuit layout between the physical design drawings and the actual wafer lithography, has become a pressing problem to solve. Summary of the Invention
[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a curve-based GDSII optimization method, system, medium, program and electronic terminal to solve the above problems.
[0005] To achieve the above and other related objectives, the first aspect of this application provides a curve-based routing layer GDSII optimization method, comprising: generating initial routing using a Manhattan-style global routing algorithm; performing shape matching between the initial routing and graphics in a preset weakpoints graphics library, and taking the shape-matching parts of the initial routing as weakpoints regions; traversing each weakpoints region one by one and extracting right-angled configuration blocks from them, and determining the turning direction of the right-angled configuration blocks; and performing curve replacement on the right-angled configuration blocks according to the turning direction.
[0006] In one embodiment of the first aspect of this application, the method of sequentially traversing each weakpoints region and extracting right-angled configuration blocks from them, and determining the turning direction of the right-angled configuration blocks, includes: taking the region corresponding to two intersecting wire segments with a vector product of zero within the weakpoints region as a right-angled configuration block; calculating the two-dimensional cross product of the two intersecting wire segments; wherein, if the two-dimensional cross product is greater than zero, the turning direction of the right angle in the right-angled configuration block is convex; if the two-dimensional cross product is less than zero, the turning direction of the right angle in the right-angled configuration block is concave.
[0007] In one embodiment of the first aspect of this application, the method for performing curve replacement on the right-angled block according to the turning direction includes: locating two perpendicularly intersecting line segments L1 and L2 of the right-angled block and their common endpoint A; taking A as the starting point, respectively cutting line segments S1 and S2 of length d to be replaced on L1 and L2; wherein, R min The minimum radius of curvature allowed by the process is defined; a transition curve connecting S1 and S2 is constructed; wherein, the transition curve is an Euler spiral or a Clothoid curve, and the curvature of the transition curve increases linearly from 0 at point A to the midpoint of the curve. The curvature is maintained as first-order continuous; curve parameters are calculated based on an optimization model; wherein the optimization model aims to minimize bending strain energy, minimizing the integral of the square of curvature of the transition curve over its entire arc length, and ensuring that the area of the newly added wiring segment in the right-angled block after replacing the transition curve is less than a preset threshold K, and that the local radius of curvature at any point on the transition curve is greater than or equal to R. min Replace line segments S1 and S2 with the aforementioned transition curve.
[0008] In one embodiment of the first aspect of this application, the method of performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wiring segments that form a perpendicular line in the right-angled configuration block, pre-setting positioning control points near the two wiring segments, performing smooth curve fitting using a circular arc equation or an ellipse equation based on the positioning control points, and replacing the right-angled wiring segments at corresponding positions in the corresponding right-angled configuration block with the fitted smooth curve.
[0009] In one embodiment of the first aspect of this application, the method of performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wire segments that form a perpendicular line in the right-angled configuration block, determining the line width of the wire segments, and replacing the right-angled wire segments at the corresponding positions in the corresponding right-angled configuration block with a preset arc curve corresponding to the line width.
[0010] In one embodiment of the first aspect of this application, the method of performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wiring segments that form a perpendicular line in the right-angled configuration block, performing smooth curve fitting using a third-order Bezier or B-spline algorithm, and replacing the right-angled wiring segment at the corresponding position in the corresponding right-angled configuration block with the fitted smooth curve.
[0011] To achieve the above and other related objectives, a second aspect of this application provides a curve-based routing layer GDSII optimization system, comprising: an initial routing module for generating initial routing using a Manhattan-style global routing algorithm; a weakpoints region filtering module for matching the initial routing with shapes in a preset weakpoints graphics library, and using the shape-matching portions of the initial routing as weakpoints regions; a right-angle configuration block filtering module for traversing each weakpoints region sequentially and extracting right-angle configuration blocks from them, and determining the turning direction of the right-angle configuration blocks; and a curve replacement module for performing curve replacement on the right-angle configuration blocks according to the turning direction.
[0012] To achieve the above and other related objectives, a third aspect of this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described in any of the preceding claims.
[0013] To achieve the above and other related objectives, a fourth aspect of this application provides a computer program product comprising computer program code that, when executed on a computer, causes the computer to perform the method described in any of the preceding claims.
[0014] To achieve the above and other related objectives, a fifth aspect of this application provides an electronic terminal, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the method described in any of the preceding claims.
[0015] As described above, this application has the following beneficial effects:
[0016] This application provides a curve-based routing layer GDSII optimization method. Firstly, it uses a Manhattan global routing algorithm to generate initial routing. Manhattan global routing can quickly converge the routing search space, ensuring critical path delay convergence and obtaining optimal congestion heat distribution. Furthermore, the deterministic pin-to-pin topology formed during the Manhattan global routing stage provides a repeatable and traceable benchmark for subsequent process weak point detection and curvature reconstruction. Next, the initial routing is matched with patterns in a preset weakpoints graphics library, and the matching parts of the initial routing are designated as weakpoint regions. The weakpoints graphics library is directly derived from the wafer foundry's abstraction of features with the highest measured failure rates, such as sharp corners, narrow necks, and islands. After matching, the geometric units most sensitive to yield are immediately located, avoiding the omission of hidden defects. Furthermore, subsequent curve reconstruction is performed only on the identified weakpoint regions, avoiding indiscriminate scanning and replacement of the entire layout, significantly reducing data processing volume and runtime. Each weakpoint region is traversed sequentially, and right-angled configuration blocks are extracted. The turning direction of each right-angled configuration block is determined, and different curves or replacement strategies are applied to right-angled configurations with different turning directions. Finally, curve replacement is performed on the right-angled configuration blocks according to the turning direction. Multiple curve calculation methods can be used to derive the corresponding curves for replacing the right-angled configurations. This achieves the goal of minimizing the occurrence of weakpoints (process weaknesses) caused by right angles during routing without performing global curve routing, ensuring consistency in morphology between the physical design drawings and the actual wafer lithography circuit wiring. Attached Figure Description
[0017] Figure 1 The diagram shown is a flowchart illustrating a curve-based routing layer GDSII optimization method in one embodiment of this application.
[0018] Figure 2 The diagram shows a flowchart of extracting right-angled blocks and determining their turning direction in one embodiment of this application.
[0019] Figure 3 The diagram shows a flowchart of performing curve replacement on right-angled blocks according to the turning direction in one embodiment of this application.
[0020] Figure 4 The diagram shown is a schematic representation of a curve-based routing layer GDSII optimization system according to an embodiment of this application.
[0021] Figure 5 The diagram shown is a structural schematic of an electronic terminal according to an embodiment of this application. Detailed Implementation
[0022] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.
[0023] In the embodiments of this application, terms such as "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. For example, "first XX" and "second XX" are merely used to distinguish different XXs and do not limit their order. Those skilled in the art will understand that terms such as "first" and "second" do not limit the quantity or execution order, and that "first" and "second" do not necessarily imply that they are different.
[0024] It should be noted that, in the embodiments of this application, the words "exemplary" or "for example" indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0025] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.
[0026] like Figure 1As shown, the first aspect of this application proposes a curve-based GDSII optimization method for routing layers, comprising:
[0027] S1: Generate initial routing using the Manhattan global routing algorithm.
[0028] It should be understood that in the back-end physical design of integrated circuits, the Manhattan global routing algorithm employs a strict XY orthogonal grid model, discretizing the chip plane into a mesh network of traversable lines and via nodes. On this network, the algorithm utilizes minimum cost flow, A* search, or Steiner tree-based heuristics to quickly generate the shortest or second shortest pin-to-pin topology for each netlist connection. Since the grid orientation is limited to horizontal and vertical, the search space is significantly compressed, and the routing convergence speed is much higher than that of grids with arbitrary angles or curved routes, providing predictable time and space complexity for large-scale designs. It is precisely this regularized grid characteristic that allows the global routing stage to provide a deterministic connection topology early on. The line length, path hierarchy, and number of vias of the critical path thus have good repeatability, facilitating rapid iteration of subsequent timing, power, and signal integrity analyses. Simultaneously, the congestion heatmap naturally formed by the rectangular grid has clear partitioning characteristics, allowing the optimizer to centrally schedule strategies such as layer hops and trace redistribution in local hotspot areas, thereby achieving near-optimal congestion balance at the global scale. More importantly, the regularized layout provides a stable benchmark for post-processing of the layout: the spatial relationships, hierarchical occupancy, and orthogonal corner positions of all pin-to-pin connections are determined in the data structure. Subsequent weakpoints region detection and curvature reconstruction algorithms can perform differential operations on this benchmark, which not only ensures the traceability of modifications but also avoids redundant calculations on irrelevant regions.
[0029] S2: Match the initial wiring with the graphics in the preset weakpoints graphics library, and take the parts of the initial wiring that match the shape as weakpoints areas.
[0030] It should be understood that the weakpoints graphic library is a layout process defect knowledge base jointly maintained by wafer foundries, EDA suppliers, and design companies. It mainly includes geometric patterns that repeatedly trigger failures in mass production lines and lithography simulations. Its construction process is usually based on large-scale wafer foundry statistics: the defect coordinates on wafers with declining yields are located in the layout, and high-risk structures such as sharp corners, narrow necks, islands, cantilevered edges, and line-end interference are identified through morphological clustering. Digital features such as boundary contours, layer number combinations, and linewidth / spacing thresholds are extracted for each type of weakpoint. At the same time, OPC, LFD, and electromigration simulation results are introduced to add metrics such as processing window shrinkage and local current density amplification factor to each template.
[0031] After obtaining the initial right-angle wiring, the system first calls the weakpoints graphics library jointly maintained by the wafer foundry, and then compares the shape of the problematic fiberglass with the graphics included in the weakpoints graphics library. Since the weakpoints graphics library is directly derived from mass production statistics and the foundry's latest DFM rules, it can accurately locate the geometric units most sensitive to yield, avoiding the omission of hidden defects or false positives for benign structures. Furthermore, the matching results provide extremely precise spatial boundaries, allowing subsequent curvature reconstruction only for local areas identified as having potential process risks, significantly compressing the computational domain. Compared to indiscriminate scanning and replacement of the entire layout, shape matching only requires processing less than five percent of the total geometry, reducing the runtime and memory usage of the curve replacement process by an order of magnitude, while ensuring minimal modification scope and controllable parasitic parameter drift, bringing significant time advantages to subsequent approval.
[0032] Preferably, the morphological comparison algorithm uses a morphological matching engine based on geometric hashing and topological equivalence. It scans the initial wiring layer GDS data layer by layer, extracts feature vectors for each wire, polygon or path segment, and performs fast matching with templates in the library. When a local layout with a similarity to the template reaches a threshold is detected, the system immediately marks it as a weakpoints region.
[0033] S3: Traverse each weakpoints region one by one and extract right-angled configuration blocks from them, and determine the turning direction of the right-angled configuration blocks.
[0034] like Figure 2 As shown, preferably, the method of sequentially traversing each of the weakpoints regions and extracting right-angled configuration blocks from them, and determining the turning direction of the right-angled configuration blocks, includes: taking the region corresponding to two intersecting wire segments with a vector product of zero within the weakpoints region as a right-angled configuration block; calculating the two-dimensional cross product of the two intersecting wire segments; wherein, if the two-dimensional cross product is greater than zero, the turning direction of the right angle in the right-angled configuration block is convex; if the two-dimensional cross product is less than zero, the turning direction of the right angle in the right-angled configuration block is concave.
[0035] It should be understood that the system iterates through the marked weakpoints region one by one, calculating the dot product of the vectors corresponding to two adjacent wire segments for each local layout. When the dot product is zero, it is determined that the two are orthogonal, thus locking in the candidate block forming a right angle (right-angle configuration block). Subsequently, the two-dimensional cross product of this vector pair is further calculated. The sign of the two-dimensional cross product accurately reflects the polarity of the corner—a positive cross product indicates a counterclockwise rotation, corresponding to a 270-degree outward concave angle; a negative cross product indicates a clockwise rotation, corresponding to a 90-degree inward convex sharp angle. Through this "dot product-cross product" joint discrimination mechanism, the algorithm can quickly and unambiguously distinguish between inward concave right angles and outward convex right angles at the vector level, thereby performing differentiated right-angle-curve replacements in the subsequent process.
[0036] S4: Perform curve replacement on the right-angled block according to the turning direction.
[0037] like Figure 3 As shown, preferably, the method for performing curve replacement on the right-angled block according to the turning direction includes: locating two perpendicularly intersecting line segments L1 and L2 of the right-angled block and their common endpoint A; starting from A, cutting line segments S1 and S2 of length d to be replaced on L1 and L2 respectively; wherein, R min The minimum radius of curvature allowed by the process is defined; a transition curve connecting S1 and S2 is constructed; wherein, the transition curve is an Euler spiral or a Clothoid curve, and the curvature of the transition curve increases linearly from 0 at point A to the midpoint of the curve. The curvature is maintained as first-order continuous; curve parameters are calculated based on an optimization model; wherein the optimization model aims to minimize bending strain energy, minimizing the integral of the square of curvature of the transition curve over its entire arc length, and ensuring that the area of the newly added wiring segment in the right-angled block after replacing the transition curve is less than a preset threshold K, and that the local radius of curvature at any point on the transition curve is greater than or equal to R. min Replace line segments S1 and S2 with the aforementioned transition curve.
[0038] It should be understood that, firstly, starting from the common inflection point A, only two segments S1 and S2 of length d to be replaced are extracted, and d is set to be no less than the minimum radius of curvature R of the process. min The necessary geometric lower bound ensures the arrangeability of the transition curve at the layout level from the source. Furthermore, by introducing the Euler spiral or Clothoid curve as the transition curve, the curvature linearly increases from 0 to... Maintaining first-order continuity not only completely eliminates curvature singularities at sharp corners but also naturally aligns with the photolithographic step compensation curve in terms of curvature distribution, significantly widening the depth of focus and reducing deformation errors. Furthermore, this transition curve scheme prioritizes reducing bending strain energy during construction. Through full-length curvature optimization, it simultaneously suppresses the originally extremely high current density peaks and mechanical stress concentrations at sharp corners. Simultaneously, a hard limit of no more than a threshold K is set on the area of newly added conductors, ensuring that changes in parasitic capacitance and resistance remain within a controllable range, neither disrupting timing nor introducing additional power consumption. The minimum radius of curvature of the curve throughout its entire arc length is always greater than or equal to the R specified by the process. min This fundamentally avoids the rework risks associated with subsequent layout rule checks and lithography corrections. In summary, this partial replacement strategy achieves an optimal balance among multiple indicators, including improved process yield, enhanced electromigration reliability, wider lithography window, and suppression of layout data increments, significantly improving the engineering feasibility of advanced node layout post-processing.
[0039] Preferably, the method for performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wire segments that form a perpendicular line in the right-angled configuration block, pre-setting positioning control points near the two wire segments, performing smooth curve fitting using a circular arc equation or an ellipse equation based on the positioning control points, and replacing the right-angled wire segments at the corresponding positions in the corresponding right-angled configuration block with the fitted smooth curve.
[0040] It should be understood that by pre-setting positioning control points in the neighborhood of two intersecting conductors and performing least-squares fitting of the control points using circular or elliptical equations, this embodiment can generate a smooth transition curve in the local space that is strictly consistent with the original trace width and direction. This approach not only eliminates the risk of electric field concentration and electromigration at sharp points caused by right angles, but also ensures that the curve and the original conductor maintain first-order tangential continuity at the endpoints, ensuring minimal parasitic parameter drift and no impact on timing integrity. Circular / elliptical curves naturally satisfy the lithography-friendly characteristics of constant or gradually changing curvature, which can significantly widen the depth of focus and reduce line edge roughness. At the same time, the number of geometric control points required for fitting is minimal, and the increase in layout data and processing overhead are almost negligible. This achieves a dual improvement in manufacturability and electrical reliability with minimal data cost, providing a simple, efficient, and easily approved local curve reconstruction scheme for advanced node back-end layouts.
[0041] Preferably, the positioning control point can be one or more.
[0042] It should be understood that the number of positioning control points can be flexibly set according to the local wiring congestion and geometric constraints, and can be a single point or multiple points. When the neighborhood space is ample and only basic circularization is required, setting a single control point can quickly generate a fixed radius arc with minimal computation. However, when the surrounding wiring is dense and fine control of curvature extension is required, or when multiple layers of conflict need to be avoided, multiple control points can be added. By using least squares fitting, a higher-order degree of freedom elliptic curve can be obtained, ensuring that the transition section meets the minimum curvature radius of the process and fits the original wiring boundary to the maximum extent, further reducing data increment and improving local manufacturability.
[0043] Preferably, the method for performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wire segments that form a perpendicular line in the right-angled configuration block, determining the line width of the wire segments, and replacing the right-angled wire segments at the corresponding positions in the corresponding right-angled configuration block with a preset arc curve corresponding to the line width.
[0044] It should be understood that this embodiment first reads the actual linewidths of the two vertical conductors within the right-angle block, then calls a pre-calibrated standard arc template based on the linewidth dimension to directly embed the template curve and replace the original right angle. On the one hand, this ensures that the bending radius of the replacement curve strictly matches the conductor width, naturally conforming to the process's consistency constraint of "linewidth - minimum arc radius," avoiding rule violations caused by recalculating curvature. On the other hand, the template insertion method eliminates the need for real-time curve fitting and energy optimization steps, requiring only simple geometric Boolean operations at runtime, greatly shortening post-processing time and reducing storage increments. Furthermore, the template curve aligns with the tangent of the original conductor at its endpoints, making parasitic resistance and capacitance drift controllable and predictable, eliminating the need for re-iteration in subsequent timing and signal integrity verification. Overall, this width-matched arc replacement strategy achieves rapid and verifiable repair of sharp corner weaknesses with minimal computational cost, providing an efficient and stable engineering path for batch manufacturability optimization of large-scale routing layers (GSDII).
[0045] Preferably, the method for performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wiring segments that form a perpendicular line in the right-angled configuration block, using a third-order Bezier or B-spline algorithm to perform smooth curve fitting, and replacing the right-angled wiring segment at the corresponding position in the corresponding right-angled configuration block with the fitted smooth curve.
[0046] It should be understood that by extracting the endpoints and tangential constraints of two perpendicular wires in the right-angled block, the system calls a third-order Bezier or B-spline algorithm to generate a smooth transition curve, with control points achieving an adjustable curvature distribution locally. Compared to fixed-radius arcs, third-order Bezier or B-spline offers higher degrees of freedom, precisely controlling the mid-section curvature while maintaining first-order tangential continuity at the endpoints; thus, it can completely eliminate peak current density at the tip and automatically adjust the curve's outward extension based on the neighborhood's free spacing, minimizing the increase in layout area. A unified mathematical expression allows curve data to be described with a small number of control points, significantly reducing the GDS file size, and is naturally compatible with OPC's vectorized segmentation algorithm, eliminating the need for additional discretization overhead in back-end lithography correction. Leveraging the "local modification—full curve smoothing" characteristic of Bezier or B-spline, any design iteration only requires adjusting a single control point to quickly reconstruct the curve, improving the flexibility and maintainability of layout post-processing.
[0047] Preferably, when the turning direction is determined to be a convex right angle (i.e., a convex angle with an interior angle of approximately 90°), the system calls an arc, involute, or third-order B-spline algorithm to construct a smooth transition curve that satisfies first-order tangential continuity and second-order curvature continuity using the start and end points of the traces on both sides of the inflection point and tangential constraints. This curve replaces the original sharp-angle conductor segment. This significantly reduces the concentration of electric field at the tip, lowers the local current density peak and electromigration risk, and relaxes the lithography depth of focus, achieving forced circularization. When the turning direction is determined to be a concave right angle (i.e., a concave angle with an interior angle of approximately 270°), only when the concave angle region is less than the minimum spacing recommended by the process is a minimum radius chamfer or short arc is inserted for limited correction; if the space margin is sufficient and manufacturability score deduction is not triggered, the original Manhattan angle remains unchanged. This differentiated processing avoids unnecessary data inflation in the concave area and ensures that all potential manufacturing weaknesses are addressed in a targeted manner, achieving an optimal balance between curve replacement effect and layout increment.
[0048] like Figure 4 As shown, a second aspect of this application provides a curve-based routing layer GDSII optimization system, comprising: an initial routing module for generating initial routing using a Manhattan-style global routing algorithm; a weakpoints region filtering module for matching the initial routing with shapes in a preset weakpoints graphics library, and using the shape-matching parts of the initial routing as weakpoints regions; a right-angle configuration block filtering module for traversing each weakpoints region sequentially and extracting right-angle configuration blocks from them, and determining the turning direction of the right-angle configuration blocks; and a curve replacement module for performing curve replacement on the right-angle configuration blocks according to the turning direction.
[0049] It should be understood that the specific process of each module performing the above-mentioned steps has been described in detail in the above method embodiments, and will not be repeated here for the sake of brevity.
[0050] It should also be understood that the module division in the embodiments of this application is illustrative and only represents a logical functional division; in actual implementation, there may be other division methods. Furthermore, the functional modules in the various embodiments of this application can be integrated into a single processor, exist as separate physical entities, or be integrated into a single module. The integrated modules described above can be implemented in hardware or as software functional modules.
[0051] A third aspect of this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method described in any of the preceding claims.
[0052] A fourth aspect of this application provides a computer program product including computer program code that, when run on a computer, causes the computer to perform the method described in any of the preceding claims.
[0053] like Figure 5 As shown, a fifth aspect of this application provides an electronic terminal, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the method described in any of the preceding claims. The electronic terminal includes: at least one processor 501, a memory 502, at least one network interface 503, and a user interface 505. The various components in the device are coupled together via a bus system 504. It is understood that the bus system 504 is used to implement communication between these components. In addition to a data bus, the bus system 504 also includes a power bus, a control bus, and a status signal bus.
[0054] The user interface 505 may include a monitor, keyboard, mouse, trackball, clicker, button, touchpad, or touch screen.
[0055] It is understood that memory 502 can be volatile memory or non-volatile memory, or both. Non-volatile memory can be read-only memory (ROM) or programmable read-only memory (PROM), which serves as an external cache. By way of example, but not limitation, many forms of RAM are available, such as static random access memory (SRAM) and synchronous static random access memory (SSRAM). The memories described in the embodiments of this invention are intended to include, but are not limited to, these and any other suitable categories of memory.
[0056] In this embodiment of the invention, the memory 502 is used to store various types of data to support the operation of the electronic terminal 500. Examples of this data include: any executable program for operation on the electronic terminal 500, such as the operating system 5021 and application programs 5022; the operating system 5021 contains various system programs, such as the framework layer, core library layer, driver layer, etc., for implementing various basic services and handling hardware-based tasks. The application program 5022 may contain various applications, such as a media player, browser, etc., for implementing various application services. The methods provided in this embodiment of the invention can be included in the application program 5022.
[0057] The methods disclosed in the above embodiments of the present invention can be applied to processor 501, or implemented by processor 501. Processor 501 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the integrated logic circuit of the hardware in processor 501 or by instructions in the form of software. The processor 501 may be a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Processor 501 can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. General-purpose processor 501 may be a microprocessor or any conventional processor, etc. The steps of the accessory optimization method provided in the embodiments of the present invention can be directly reflected as being executed by a hardware decoding processor, or being executed by a combination of hardware and software modules in the decoding processor. The software module may be located in a storage medium, which is located in memory. The processor reads the information in the memory and combines it with its hardware to complete the steps of the aforementioned method.
[0058] In an exemplary embodiment, the electronic terminal 500 may be used by one or more application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), or complex programmable logic devices (CPLDs) to execute the aforementioned method.
[0059] The terms “component,” “module,” “system,” etc., used in this specification are used to refer to computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. As illustrated, applications running on computing devices and computing devices can both be components. One or more components may reside in a process and / or an execution thread, and components may be located on a single computer and / or distributed among two or more computers. Furthermore, these components can be executed from various computer-readable media on which various data structures are stored. Components can communicate, for example, via local and / or remote processes based on signals having one or more data packets (e.g., data from two components interacting with another component between a local system, a distributed system, and / or a network, such as the Internet interacting with other systems via signals).
[0060] Those skilled in the art will recognize that the various illustrative logical blocks and steps described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this application.
[0061] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.
[0062] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.
[0063] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0064] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0065] In the above embodiments, the functions of each functional unit can be implemented entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. A computer program product includes one or more computer instructions (programs). When the computer program instructions (programs) are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. Computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., high-density digital video discs, DVDs), or semiconductor media (e.g., solid-state disks, SSDs, etc.).
[0066] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0067] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
[0068] In summary, this application effectively overcomes the various shortcomings of the prior art and has high industrial application value.
[0069] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.
Claims
1. A curve-based GDSII routing layer optimization method, characterized in that, include: Initial routing is generated using the Manhattan global routing algorithm; The initial wiring is matched with the graphics in the preset weakpoints graphics library, and the part of the initial wiring that matches the shape is taken as the weakpoints area. Each weakpoint region is traversed one by one, and right-angled configuration blocks are extracted from them. The turning direction of the right-angled configuration blocks is then determined. The right-angled block is replaced with a curve according to the turning direction. When the turning direction is determined to be an outward right angle, the system calls an arc, involute, or third-order B-spline algorithm to construct a smooth transition curve that satisfies first-order tangential continuity and second-order curvature continuity using the start and end points of the traces on both sides of the inflection point and tangential constraints. This curve replaces the original sharp-angled conductor segment. When the turning direction is determined to be an inward right angle, a minimum radius chamfer or short arc is inserted for limited correction only if the concave angle region is less than the minimum spacing recommended by the process. If the space margin is sufficient and the manufacturability score deduction is not triggered, the original Manhattan angle remains unchanged.
2. The curve-based routing layer GDSII optimization method according to claim 1, characterized in that, The method of sequentially traversing each of the weakpoints regions, extracting right-angled configuration blocks from them, and determining the turning direction of the right-angled configuration blocks includes: The region corresponding to two intersecting wire segments whose vector product is zero within the weakpoints region is taken as a right-angle configuration block; Calculate the two-dimensional cross product of the two intersecting wire segments; wherein, if the two-dimensional cross product is greater than zero, the turning direction of the right angle in the right-angled block is convex outward; if the two-dimensional cross product is less than zero, the turning direction of the right angle in the right-angled block is concave inward.
3. A curve-based routing layer GDSII optimization method according to claim 1 or 2, characterized in that, The method for performing curve replacement on the right-angled block according to the turning direction includes: Locate the two perpendicularly intersecting wire segments L1 and L2 of the right-angled configuration block and their common endpoint A; Starting from point A, cut line segments S1 and S2 of length d from L1 and L2 respectively to be replaced; where, R min The minimum radius of curvature allowed by the process; Construct a transition curve connecting S1 and S2; wherein the transition curve is an Euler spiral or a Clothoid curve, and the curvature of the transition curve increases linearly from 0 at point A to the midpoint of the curve. And maintain the first-order continuity of the curvature; The curve parameters are calculated based on the optimization model. The optimization model aims to minimize the bending strain energy, minimizing the integral of the square of curvature of the transition curve over its entire arc length, ensuring that the area of the newly added wiring segment within the right-angled block after replacing the transition curve is less than a preset threshold K, and that the local radius of curvature at any point on the transition curve is greater than or equal to R. min ; Replace line segments S1 and S2 with the aforementioned transition curve.
4. A curve-based routing layer GDSII optimization method according to claim 1 or 2, characterized in that, The method for performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wire segments that form a perpendicular line in the right-angled configuration block, setting a positioning control point near the two wire segments, performing smooth curve fitting using a circular arc equation or an ellipse equation based on the positioning control point, and replacing the right-angled wire segment at the corresponding position in the corresponding right-angled configuration block with the fitted smooth curve.
5. A curve-based routing layer GDSII optimization method according to claim 1 or 2, characterized in that, The method for performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wire segments that form a perpendicular line in the right-angled configuration block, determining the line width of the wire segments, and replacing the right-angled wire segments at the corresponding positions in the corresponding right-angled configuration block with a preset arc curve corresponding to the line width.
6. A curve-based routing layer GDSII optimization method according to claim 1 or 2, characterized in that, The method for performing curve replacement on the right-angled configuration block according to the turning direction includes: locating two intersecting wiring segments that form a perpendicular line in the right-angled configuration block, using a third-order Bezier or B-spline algorithm to perform smooth curve fitting, and replacing the right-angled wiring segment at the corresponding position in the corresponding right-angled configuration block with the fitted smooth curve.
7. A curve-based routing layer GDSII optimization system, characterized in that, include: The initial routing module is used to generate initial routing using the Manhattan global routing algorithm; The weakpoints region filtering module is used to perform shape matching between the initial wiring and the graphics in the preset weakpoints graphics library, and to take the parts of the initial wiring that match the shape as weakpoints regions. The right-angle configuration block filtering module is used to traverse each weakpoints region one by one and extract right-angle configuration blocks from them, and determine the turning direction of the right-angle configuration blocks; The curve replacement module is used to perform curve replacement on the right-angled configuration block according to the turning direction. When the turning direction is determined to be an outward convex right angle, the system calls the circular arc, involute, or third-order B-spline algorithm to construct a smooth transition curve that satisfies first-order tangential continuity and second-order curvature continuity using the start and end points of the traces on both sides of the inflection point and the tangential constraints, and replaces the original sharp-angled conductor segment with this curve. When the turning direction is determined to be an inward concave right angle, a minimum radius chamfer or short circular arc is inserted for limited correction only if the concave angle region is less than the minimum spacing recommended by the process. If the space margin is sufficient and the manufacturability score deduction is not triggered, the original Manhattan angle remains unchanged.
8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the method of any one of claims 1-6.
9. A computer program product, characterized in that, The computer program product includes computer program code that, when run on a computer, causes the computer to implement the method as described in any one of claims 1-6.
10. An electronic terminal, comprising a memory, a processor, and a computer program stored in the memory, characterized in that, The processor executes the computer program to implement the method according to any one of claims 1-6.
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