Five-axis laser processing path planning method, device, equipment and medium

Abstract

The invention discloses a five-axis laser processing path planning method and device, equipment and a medium, and relates to the technical field of laser processing. A space filling line cluster is constructed, the filling line cluster and a processed surface are subjected to Boolean operation to obtain a preliminary continuous processing track, the processing track is discretized into track curve segments, and the track curve segments are divided into two groups; the tangent vectors of the two end points of the curve segment are calculated, the curvature of the corresponding curve segment is obtained according to the included angle of the tangent vectors of the two end points, the discrete density is dynamically constrained through the tangent vector included angle in the process, and path planning is carried out in the form of equal curvature discrete represented by kinematics characteristics; and based on the u-direction parameter value and the v-direction parameter value, generating a three-dimensional laser coordinate point position and a two-dimensional laser direction vector corresponding to the discrete points so as to obtain a five-axis laser processing path of each discrete point on the track curve segment, so that the three-axis coordinate and the two-axis direction vector can be synchronized into the five-axis laser processing path. Therefore, a high-precision laser processing path can be obtained to process the workpiece.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a five-axis laser processing path planning method, device, equipment and medium. Background Art

[0002] Laser machining systems use lasers as "tools" to precisely remove material from the workpiece surface layer by layer through the interaction of a high-energy-density laser beam with the material, thereby achieving high-precision, complex-structure workpiece machining. The laser machining path, that is, the predetermined motion trajectory of the laser spot during the machining process, is not only the basis for achieving precise removal, but also the core component of the entire laser machining system, directly determining the accuracy and surface quality of the final workpiece. In particular, path planning is particularly critical for five-axis laser machining of spatial surfaces such as the inner walls of curved surfaces in confined spaces. Such paths not only need to include the X, Y, and Z axis coordinate information of the laser focus in the three-dimensional Cartesian coordinate system, but also must simultaneously and precisely control the angle of the laser beam relative to the machining surface to ensure that the laser beam can act on the complex surface in the optimal posture (for example, always perpendicular to the machining point or incident at a specific angle), which is crucial for machining high-quality microstructures on the curved surface.

[0003] Existing laser processing systems, such as those widely used in laser marking and laser engraving, are very mature in their application on two-dimensional planes. However, for complex three-dimensional free-form surface features, such as machining complex patterns on the surface of a narrow cavity with large curvature, there is still a lack of mature, efficient, and universal processing technology solutions. The processing of such complex surfaces places higher requirements on trajectory planning, requiring more targeted algorithms to generate five-axis linkage paths that adapt to surface changes.

[0004] For path planning in complex three-dimensional laser processing, the current method mainly relies on the equal-step parameter discretization method. However, the equal-step parameter discretization method has the following defects: on the one hand, the equal-step parameter discretization ignores the geometric characteristics of the surface, causing the actual path to deviate from the theoretical model, resulting in large path deviation; on the other hand, the three-axis coordinates and the two-axis direction vectors are calculated step by step, resulting in the coordinates and directions being out of sync, causing large errors; at the same time, the scattered path is composed of short straight line segments, and there are tangential / curvature discontinuities at the connection points, resulting in an uneven trajectory; to address the defects of the equal-step parameter discretization method, the NURBS surface fitting method is often used at this stage, but the NURBS surface fitting method relies on chord height constraint interpolation and does not directly control the kinematic characteristics for path planning. At the same time, there is also the defect of the three-axis coordinates and the two-axis direction vectors being out of sync, making it difficult to obtain a high-precision laser processing path. Summary of the Invention

[0005] Embodiments of the present invention provide a five-axis laser machining path planning method, device, equipment and medium, which can solve the problem in the prior art that it is difficult to obtain a high-precision laser machining path.

[0006] An embodiment of the present invention provides a five-axis laser machining path planning method, comprising the following steps: Obtaining the processed area of ​​the workpiece; Construct a filling curve cluster in the parameter space, perform Boolean intersection between the filling curve cluster and the processed area to obtain a continuous processing trajectory; The machining trajectory is discretized into trajectory curve segments. For each curve segment within the trajectory curve segment, the tangent vectors of the two end points of the curve segment are calculated, and the curvature of the corresponding curve segment is obtained based on the angle between the tangent vectors of the two end points. When the curvature is less than a preset threshold, the u-direction parameter values ​​and v-direction parameter values ​​of the two end points of the corresponding curve segment are obtained, and the u-direction parameter values ​​and v-direction parameter values ​​of each discrete point within the trajectory curve segment are obtained. The u-direction parameter value and the v-direction parameter value are used to represent the incremental movement distance of the discrete point relative to the current position; The u-axis parameter values ​​and the v-axis parameter values ​​are mapped to the model space to obtain the three-dimensional laser coordinate points of the corresponding discrete points; based on the u-axis parameter values ​​and the v-axis parameter values, the two-dimensional laser direction vectors of the corresponding discrete points are generated to obtain the five-axis laser processing path of each discrete point on the trajectory curve segment; According to the five-axis laser processing path, the processing area is laser processed.

[0007] Preferably, after obtaining the five-axis laser processing path of each discrete point on the trajectory curve segment, the method further includes densifying the five-axis laser processing path to obtain a smooth five-axis laser processing path, including: For the three-dimensional laser coordinate point, three adjacent discrete points P, P0 and P1 are selected, and Bezier curves are constructed for the discrete points P, P0 and P1 respectively, and the control points A and B that are tangent to the line segment PP0 and the line segment P0P1 are obtained respectively; Use points P0, A, B and P1 as control points to fit the curve and achieve densification of three-dimensional laser coordinate points; For the two-dimensional laser direction vector, the two-dimensional laser direction vector is converted into quaternion, and a second-order spherical interpolation model is constructed based on quaternion interpolation. The two-dimensional laser direction vector is densified by constructing auxiliary points for fitting. The densified three-dimensional laser coordinate points and two-dimensional laser direction vectors form a smooth five-axis laser processing path.

[0008] Preferably, the fitting curve between P0 and P1 is expressed as: ; The construction method of control points A and B is expressed as: ; in: and Respectively P 0 and P 1 tangent vector; ɑ and β Indicates adjustable parameters; The second-order spherical interpolation model is constructed based on quaternion interpolation, and its interpolation formula is expressed as: ; The quaternion first-order spherical interpolation function is expressed as: ; The auxiliary point expression formula is: ; in: Represents the quaternion sequence to be interpolated; represents the interpolation auxiliary point; t represents the adjustable parameter.

[0009] Preferably, obtaining the processed area of ​​the workpiece includes: Obtain the BRep topological model tree and its topological structure of the workpiece, and extract the processed area based on the topological tree structure features and geometric features; Among them, the processing surface is identified by traversing the number of wires in the BRep topology model tree, the processing wireframe is identified by traversing the number of wires in the BRep topology model tree, and the associated area is extracted through the geometric distance feature to obtain the processed area.

[0010] Preferably, obtaining the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment includes: Discretize the machining trajectory into trajectory curve segments, each trajectory curve segment contains multiple curve segments; For each curve segment, a parametric equation is used to calculate the tangent vectors M and M' at the endpoints A and B of the curve segment. The partial derivatives of the curve segment with respect to the X, Y, and Z directions are obtained and combined into a spatial direction vector. The angle between the tangent vectors M and M' is calculated based on the spatial direction vector, and the angle between the tangent vectors M and M' is equivalent to the curvature of the corresponding curve segment. When the curvature is less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the corresponding two end points of the curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained; When the curvature is less than the preset threshold, the midpoint of interval AB is interpolated as point C, and the parameter is the point corresponding to 0.5. Then, it is judged whether the curvature of interval AC and interval CB is less than the preset threshold. If it is less than the preset threshold, AC and CB are taken as curve segments to obtain the u-direction parameter value and v-direction parameter value of the corresponding discrete point. If it is higher than the preset threshold, AC and CB are further segmented until the curvature of the divided curve segments is less than the preset threshold.

[0011] An embodiment of the present invention further provides a five-axis laser machining path planning device, comprising: An area recognition module is used to obtain the processed area of ​​the workpiece; The trajectory generation module is used to construct a filling curve cluster in the parameter space and perform Boolean intersection between the filling curve cluster and the processed area to obtain a continuous processing trajectory; The parameter module is used to discretize the machining trajectory into trajectory curve segments. For each curve segment in the trajectory curve segment, the tangent vector of the two end points of the curve segment is calculated, and the curvature of the corresponding curve segment is obtained according to the angle between the tangent vectors of the two end points. When the curvature is less than a preset threshold, the u-direction parameter value and the v-direction parameter value of the two end points of the corresponding curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained. The u-direction parameter value and the v-direction parameter value are used to represent the incremental movement distance of the discrete point relative to the current position; The path planning module is used to map the u-axis parameter values ​​and the v-axis parameter values ​​to the model space to obtain the three-dimensional laser coordinate points of the corresponding discrete points; based on the u-axis parameter values ​​and the v-axis parameter values, the two-dimensional laser direction vectors of the corresponding discrete points are generated to obtain the five-axis laser processing path for each discrete point on the trajectory curve segment; According to the five-axis laser processing path, the processing area is laser processed.

[0012] An embodiment of the present invention further provides an electronic device, including a memory and a processor; The memory is used to store computer programs; The processor is used to implement the steps of the above-mentioned five-axis laser machining path planning method when executing the computer program stored in the memory.

[0013] An embodiment of the present invention further provides a computer-readable storage medium for storing a computer program, which, when executed by a processor, implements the steps of the above-mentioned five-axis laser machining path planning method.

[0014] The embodiments of the present invention provide a five-axis laser machining path planning method, device, equipment, and medium. Compared with the prior art, the advantages thereof are as follows: The present invention constructs a space-filling line cluster, performs Boolean operations on the filling line cluster and the processed surface to obtain a preliminary continuous processing trajectory, discretizes the processing trajectory into trajectory curve segments, calculates the tangent vectors of the two end points of the curve segment, and obtains the curvature of the corresponding curve segment based on the angle between the tangent vectors of the two end points. This process uses the dynamic constraint discrete density of the tangent vector angle to perform path planning in the form of equal curvature discreteness characterized by kinematic characteristics; then, based on the u-direction parameter value and the v-direction parameter value, generates the three-dimensional laser coordinate point position and the two-dimensional laser direction vector of the corresponding discrete point to obtain the five-axis laser processing path of each discrete point on the trajectory curve segment, which can synchronize the three-axis coordinate and the two-axis direction vector into a five-axis laser processing path, thereby obtaining a high-precision laser processing path for processing the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the overall process of a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 2 A schematic diagram of a BRep model of a workpiece and its topological structure in a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 3 A schematic diagram of a cluster of filling curves in a space constructed by a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 4 A schematic diagram of a parameter line cluster constructed for a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 5 A schematic flow chart of an equal curvature method for five-axis laser machining path planning provided by an embodiment of the present invention; Figure 6 A schematic diagram of mapping parameter space to model space for a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 7 A schematic diagram of three-axis trajectory point densification for a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 8 A schematic diagram of laser direction vector conversion for a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 9 A schematic diagram of a smoothing process of a single trajectory of a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 10 A schematic diagram of smoothing all machining trajectories within a range of a five-axis laser machining path planning method provided by an embodiment of the present invention; Figure 11 A schematic diagram of a corresponding motion program for generating a five-axis laser path in a five-axis laser machining path planning method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0016] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0017] See also Figure 1 , an embodiment of the present invention provides a five-axis laser machining path planning method, comprising the following steps: Step 1: Process the model of the workpiece and convert it into a universal recognizable format. Obtain the BRep model of the workpiece and its topological structure; Figure 2 As shown in the figure, a feature surface recognition strategy is constructed based on the geometric primitive information of the model to extract the processed area.

[0018] The entity structure types in the BRep model are TopShape, Face, Wire, Edge, and Vertex from top to bottom (TopShape is a collection of all entity structure types); the BRep topology model tree contains the hierarchical relationships between all entities and their geometric data.

[0019] Extract the processed area according to the characteristics of the topological tree model, including: Method 1: Search based on tree structure features, such as Step 1 and Step 2. Step 1 sequentially searches for the number of wires in the face. The processed face has the largest number of wires. Based on this feature, the processed face is extracted. Step 2 sequentially searches for the number of edges contained in the wires in the processed face. The feature wireframe has the largest number of edges. Based on this feature, one of the processed wireframes is extracted.

[0020] Method 2: Extraction based on geometric features, such as: Step 3, the processed area contains two sectors in addition to the feature wireframe. The two sectors are closest to the feature wireframe in terms of geometric features. According to this geometric feature, the two sectors are extracted to complete the extraction of the processed area.

[0021] Step 2: If Figure 3 As shown, a filling curve cluster of the space is constructed, and a Boolean operation is performed between the filling curve cluster and the processed area to obtain a continuous processing trajectory.

[0022] The processed area extracted in step 1 is a topological structure and is expressed in parameter form. Its parameter range is obtained to construct a parameter line cluster. Usually, equal-step parameter line clusters, equal-space parameter line clusters, and specified fill line clusters can be used. The Boolean intersection of the fill line cluster and the processed area can obtain a continuous processing trajectory.

[0023] Step 3: Construct a path discretization algorithm to discretize the machining trajectory, and then obtain the u and v parameter values ​​corresponding to the discretized points.

[0024] The trajectory is discretized in the parameter space using the equal parameter or equal curvature method. The equal curvature method ensures that the distance between two discrete points is approximately a straight line. The flowchart of the equal curvature method is as follows: Figure 5 As shown in the figure, first calculate the two end points of the curve segment using a parametric equation. Usually, the corresponding parameter values ​​of the two end points are 0 and 1. Then, calculate the tangent vectors M and M' of the two end points respectively, and find the partial derivatives of the parametric curve in the X, Y, and Z directions respectively, and combine them into a spatial direction vector. Then calculate the angle between the two tangent vectors M and M', which can be approximately represented as the degree of curvature. Next, determine whether the curvature is within the required range. If not, interpolate the midpoint of interval AB to point C, and the point corresponding to the parameter 0.5. Then determine whether intervals AC and CB meet the requirements.

[0025] A path discretization algorithm was constructed to calculate the u and v parameter values ​​of each point. This step was added before calculating the laser five-axis coordinates. This solved the problem of the point coordinates of the processing points calculated by directly traversing the path being out of sync with the laser direction, thereby improving the accuracy of the laser path.

[0026] Step 4: Calculate the geometric feature information of the processed surface based on the u and v parameter values ​​to obtain the preliminary five-axis laser processing path.

[0027] like Figure 6 As shown in Figure 1, the three-dimensional coordinate value of the point can be obtained by mapping the parameter space to the model space. The laser normal of the point can be calculated by the cross product method, approximation method, etc. to obtain the preliminary processing path.

[0028] Step 5: Densify the preliminary five-axis laser processing path to obtain a continuous and smooth five-axis laser processing path.

[0029] The five-axis path can be divided into three-axis laser point densification and two-axis laser direction densification according to the densification object; Figure 7 As shown in the figure, the three-axis trajectory points are densified; the Bezier curve is used as the densification tool, and two control points tangent to the space curve on both sides of the fitting point are constructed to assist in fitting; the fitting formula and control point calculation method are expressed as follows: The fitting curve between P0P1 is expressed as: .

[0030] The control points are A and B, and their construction is expressed as: .

[0031] in: and Respectively P 0 and P 1 tangent vector; ɑ and β Indicates an adjustable parameter.

[0032] The two-axis laser direction is densified, and quaternions are introduced as a calculation tool. It only needs to perform polynomial multiplication, which has high computational efficiency and avoids the defect that rotation matrix interpolation requires multiple vector cross product operations; Figure 8 As shown, the laser direction vector is first converted into a quaternion expression, and then interpolated in segments. To ensure that the fitting vector passes through all the original vectors, auxiliary points are constructed for fitting. The specific calculation formula is expressed as follows: The second-order spherical interpolation model is constructed based on quaternion interpolation, and its interpolation formula is expressed as: .

[0033] The quaternion first-order spherical interpolation function is expressed as: .

[0034] The auxiliary point expression formula is: .

[0035] in: Represents the quaternion sequence to be interpolated; represents the interpolation auxiliary point; t represents the adjustable parameter.

[0036] The smoothing process of a single trajectory is as follows Figure 9 As shown in the figure, first, based on the u and v parameters of the n discrete points, the direction vector corresponding to each point is calculated, and a total of n groups of direction vectors are obtained; then, the adjacent direction vectors (i.e., the i-1th and i-th) are used to derive the fill line equation corresponding to the i-1th point; this process ultimately generates n-1 fill line equations.

[0037] The calculation steps of the direction vector of a single point: determine the calculation equation and parameter t: clarify the equation used to calculate the direction vector of the point and its parameter t; the value of parameter t is determined by the normalized position ratio of the point (point i) in the total point set (n points); substitute and solve: substitute the determined parameter t into the corresponding calculation equation to obtain the direction vector of the point (point i).

[0038] like Figure 10As shown in FIG, on the basis of completing the smoothing of a single trajectory, all trajectories are traversed in sequence to achieve the smoothing of all processing trajectories in the interval.

[0039] By performing three-dimensional laser point interpolation and two-dimensional laser direction interpolation on the path, the laser processing path is made smoother and there is no soft impact on each axis during the movement.

[0040] Step 6: If Figure 11 As shown, the corresponding motion program is generated according to the five-axis laser path, and the motion program is sent to the motion controller to realize laser processing of complex spatial surfaces.

[0041] The present invention processes a general workpiece model to obtain a BRep model and its topological structure, formulates a feature surface recognition strategy, and extracts the workpiece surface; constructs a space filling line cluster, and obtains a preliminary processing trajectory through Boolean operations on the filling line cluster and the workpiece surface. Each step is processed using a topological method, which has a wider range of applications and can be used for three-dimensional surface path construction.

[0042] At the same time, the calculation error of the laser direction vector is reduced: the laser coordinates and laser vector of the processing point are obtained respectively through the u and v parameters. The three-axis laser coordinates are generated synchronously with the two-axis laser vector, avoiding the error caused by the asynchronous generation of the laser direction vector in the post-processing method.

[0043] Even if a preliminary five-axis machining path is generated, if it is not subsequently smoothed, these original paths composed of a large number of short straight line segments often have tangential or curvature discontinuities at the connection between segments; this discontinuity will cause the machine tool to produce sudden changes in speed and acceleration during actual movement, thereby causing mechanical vibration and impact; this impact will not only reduce the smoothness and contour accuracy of the machined surface, which is absolutely undesirable in high-precision machining, but will also aggravate the wear of key moving parts of the machine tool (such as guide rails, lead screws, and motors), shortening the service life of the equipment; therefore, smoothing post-processing technology optimizes the original path, such as using Bezier curve fitting, B-spline curve fitting, or quaternion interpolation methods to smoothly transition the tool tip point and tool posture, aiming to eliminate or weaken these impacts, ensure the smoothness of the machine tool operation, and thus improve the final machining quality and efficiency.

[0044] Therefore, the present invention constructs a five-axis laser trajectory smoothing method, which divides path smoothing into three-dimensional coordinate smoothing and two-dimensional direction smoothing according to data characteristics; for three-dimensional coordinate smoothing, a cubic Bezier curve is used, and a control point method is proposed to assist fitting smoothing, so as to solve the problem that the fitting line passes through the first and last control points while the middle control point is not on the fitting line; for two-dimensional direction smoothing, quaternions are introduced as a mathematical tool to perform auxiliary point coordinate calculation based on quaternions, and a second-order spherical interpolation smoothing method based on quaternions is constructed to achieve densification of two-dimensional direction vectors. The introduction of quaternions reduces the calculation amount of laser direction smoothing; it can not only effectively solve the adaptability problem of complex surface processing, but also significantly improve the stability of the processing process, the surface quality and dimensional accuracy of the workpiece through path optimization, while reducing machine tool wear.

[0045] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A five-axis laser machining path planning method, characterized in that: The following steps are involved: Obtaining the processed area of ​​the workpiece; Construct a filling curve cluster in the parameter space, perform Boolean intersection between the filling curve cluster and the processed area to obtain a continuous processing trajectory; The machining trajectory is discretized into trajectory curve segments. For each curve segment within the trajectory curve segment, the tangent vectors of the two end points of the curve segment are calculated, and the curvature of the corresponding curve segment is obtained based on the angle between the tangent vectors of the two end points. When the curvature is less than a preset threshold, the u-direction parameter values ​​and v-direction parameter values ​​of the two end points of the corresponding curve segment are obtained, and the u-direction parameter values ​​and v-direction parameter values ​​of each discrete point within the trajectory curve segment are obtained. The u-direction parameter value and the v-direction parameter value are used to represent the incremental movement distance of the discrete point relative to the current position; The u-axis parameter values ​​and the v-axis parameter values ​​are mapped to the model space to obtain the three-dimensional laser coordinate points of the corresponding discrete points; based on the u-axis parameter values ​​and the v-axis parameter values, the two-dimensional laser direction vectors of the corresponding discrete points are generated to obtain the five-axis laser processing path of each discrete point on the trajectory curve segment; According to the five-axis laser processing path, the processing area is laser processed.

2. A five-axis laser machining path planning method according to claim 1, characterized in that: After obtaining the five-axis laser processing path of each discrete point on the trajectory curve segment, the five-axis laser processing path is densified to obtain a smooth five-axis laser processing path, including: For the three-dimensional laser coordinate point, three adjacent discrete points P, P0 and P1 are selected, and Bezier curves are constructed for the discrete points P, P0 and P1 respectively, and the control points A and B that are tangent to the line segment PP0 and the line segment P0P1 are obtained respectively; Use points P0, A, B and P1 as control points to fit the curve and achieve densification of three-dimensional laser coordinate points; For the two-dimensional laser direction vector, the two-dimensional laser direction vector is converted into quaternion, and a second-order spherical interpolation model is constructed based on quaternion interpolation. The two-dimensional laser direction vector is densified by constructing auxiliary points for fitting. The densified three-dimensional laser coordinate points and two-dimensional laser direction vectors form a smooth five-axis laser processing path.

3. A five-axis laser machining path planning method according to claim 2, characterized in that: The fitting curve between P0 and P1 is expressed as: ； The construction method of control points A and B is expressed as: ； in: and Respectively P 0 and P 1 tangent vector; ɑ and β Indicates adjustable parameters; The second-order spherical interpolation model is constructed based on quaternion interpolation, and its interpolation formula is expressed as: ； The quaternion first-order spherical interpolation function is expressed as: ； The auxiliary point expression formula is: ； in: Represents the quaternion sequence to be interpolated; represents the interpolation auxiliary point; t represents the adjustable parameter.

4. A five-axis laser machining path planning method according to claim 1, characterized in that: The obtaining of the processed area of ​​the workpiece includes: Obtain the BRep topological model tree and its topological structure of the workpiece, and extract the processed area based on the topological tree structure features and geometric features; Among them, the processing surface is identified by traversing the number of wires in the BRep topology model tree, the processing wireframe is identified by traversing the number of wires in the BRep topology model tree, and the associated area is extracted through the geometric distance feature to obtain the processed area.

5. The five-axis laser machining path planning method according to claim 1, characterized in that: The obtaining of the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment includes: Discretize the machining trajectory into trajectory curve segments, each trajectory curve segment contains multiple curve segments; For each curve segment, a parametric equation is used to calculate the tangent vectors M and M' at the endpoints A and B of the curve segment. The partial derivatives of the curve segment with respect to the X, Y, and Z directions are obtained and combined into a spatial direction vector. The angle between the tangent vectors M and M' is calculated based on the spatial direction vector, and the angle between the tangent vectors M and M' is equivalent to the curvature of the corresponding curve segment. When the curvature is less than the preset threshold, the u-direction parameter value and the v-direction parameter value of the corresponding two end points of the curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained; When the curvature is less than the preset threshold, the midpoint of interval AB is interpolated as point C, and the parameter is the point corresponding to 0.

5. Then, it is judged whether the curvature of interval AC and interval CB is less than the preset threshold. If it is less than the preset threshold, AC and CB are taken as curve segments to obtain the u-direction parameter value and v-direction parameter value of the corresponding discrete point. If it is higher than the preset threshold, AC and CB are further segmented until the curvature of the divided curve segments is less than the preset threshold.

6. A five-axis laser processing path planning device, characterized in that: include: An area recognition module is used to obtain the processed area of ​​the workpiece; The trajectory generation module is used to construct a filling curve cluster in the parameter space and perform Boolean intersection between the filling curve cluster and the processed area to obtain a continuous processing trajectory; The parameter module is used to discretize the machining trajectory into trajectory curve segments. For each curve segment in the trajectory curve segment, the tangent vector of the two end points of the curve segment is calculated, and the curvature of the corresponding curve segment is obtained according to the angle between the tangent vectors of the two end points. When the curvature is less than a preset threshold, the u-direction parameter value and the v-direction parameter value of the two end points of the corresponding curve segment are obtained, and the u-direction parameter value and the v-direction parameter value of each discrete point in the trajectory curve segment are obtained. The u-direction parameter value and the v-direction parameter value are used to represent the incremental movement distance of the discrete point relative to the current position; The path planning module is used to map the u-axis parameter values ​​and the v-axis parameter values ​​to the model space to obtain the three-dimensional laser coordinate points of the corresponding discrete points; based on the u-axis parameter values ​​and the v-axis parameter values, the two-dimensional laser direction vectors of the corresponding discrete points are generated to obtain the five-axis laser processing path for each discrete point on the trajectory curve segment; According to the five-axis laser processing path, the processing area is laser processed.

7. An electronic device, characterized in that: include: memory and processor; The memory is used to store computer programs; The processor is configured to implement the steps of a five-axis laser machining path planning method as described in any one of claims 1 to 5 when executing the computer program stored in the memory.

8. A computer-readable storage medium, characterized in that Used to store a computer program, which, when executed by a processor, implements the steps of a five-axis laser machining path planning method as described in any one of claims 1 to 5.

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