Chip mounter and chip mounting method

Abstract

The invention belongs to the technical field of chip mounting, and particularly relates to a chip mounting machine and a chip mounting method. The chip mounter comprises a chip stripping mechanism which is arranged below a blue film storage mechanism and is suitable for upwards jacking a part of blue film bearing a chip into a convex shape, so that a sucking and conveying mechanism moved above the chip sucks out the chip from the blue film; a double-seat adsorption mechanism; and the mounting mechanism is suitable for sucking the chip transferred by the double-seat adsorption mechanism and mounting the chip onto the substrate in the substrate conveying mechanism. The chip mounter is provided with the chip stripping mechanism, a part of a blue film bearing a chip can be ejected upwards to form a convex shape, so that the sucking and conveying mechanism easily sucks and picks up the chip from the blue film, the double-seat sucking mechanism can not turn over or turn over the chip, and then the chip is mounted on a substrate in the substrate conveying mechanism by the mounting mechanism to be inversely mounted. A forward mounting mechanism and an inverted mounting mechanism do not need to be prepared independently, and each mechanism is not vacant any more.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip placement, and in particular relates to a chip placement machine and a chip placement method. Background Art

[0002] After the chip is manufactured, it must be connected to a substrate to communicate with external circuits and execute corresponding commands. This step of connecting the chip to the substrate is also called packaging. The placement machine is responsible for removing the chip from the blue film, transporting it, and attaching it to the substrate.

[0003] According to the orientation of the pins when the chip is connected to the substrate, the package can be divided into upright and flip-up. Upright means that the chip is mounted on the substrate with the pins facing upward, and flip-up means that the chip is mounted on the substrate with the pins facing downward. Chips can be upright or flip-up, which requires the placement machine to be able to transport the chip taken out of the blue film with the pins facing upward and stick it on the substrate, or to transport the chip taken out of the blue film with the pins facing downward and stick it on the substrate as needed. However, existing placement machines usually only have a upright mechanism or a flip-up mechanism separately. For example, a chip flip-up device disclosed in Publication (Announcement) No. CN117497434A can only perform flip-up. This means that if the placement machine is to be able to perform both upright and flip-up, it is necessary to prepare both upright and flip-up mechanisms at the same time. There is a problem that the flip-up mechanism is redundant when the chip is upright and the upright mechanism is redundant when the chip is flip-up.

[0004] To this end, the present application proposes a placement machine that can perform both upright placement and flip placement without the need for separate upright placement mechanisms and flip placement mechanisms. Summary of the Invention

[0005] The object of the present invention is to provide a chip placement machine and a placement method, so that the placement machine can perform both face-up and flip-up placement without the need to prepare separate face-up and flip-up mechanisms.

[0006] To this end, the present invention provides a chip mounter, comprising: a chip peeling mechanism, which is arranged below a blue film storage mechanism, and is suitable for pushing part of the blue film carrying the chip upward into a convex shape, so that a suction and delivery mechanism moved above the chip can suck the chip out of the blue film; a double-seat adsorption mechanism, which comprises an inner adsorption seat and an outer adsorption seat, both of which are suitable for directly adsorbing the unflipped chip that has been delivered, and the inner adsorption seat and the outer adsorption seat are both rotatably arranged, and the inner adsorption seat is suitable for turning and approaching the outer adsorption seat after the outer adsorption seat drives the chip thereon to rotate, and after sucking and receiving the chip on the outer adsorption seat, turning again to flip the chip; a mounting mechanism, which is suitable for sucking the chip after being transferred by the double-seat adsorption mechanism, and mounting the chip on the substrate in the substrate conveying mechanism.

[0007] On the other hand, the present invention also provides a chip mounting method, comprising: the chip mounting machine as described above; through a chip peeling mechanism, part of the blue film carrying the chip is pushed upward into a convex shape, so that the suction and delivery mechanism moved above the chip can suck the chip out of the blue film; the inner adsorption seat in the double-seat adsorption mechanism directly absorbs the delivered unflipped chip, or after the outer adsorption seat drives the chip on it to rotate, the inner adsorption seat turns and approaches the outer adsorption seat to absorb and receive the chip on the outer adsorption seat, and then the inner adsorption seat turns again to flip the chip; a mounting mechanism, which is suitable for sucking the chip after being transferred by the double-seat adsorption mechanism, and attaching the chip to the substrate in the substrate conveying mechanism.

[0008] The beneficial effect of the present invention is that the chip mounter is provided with a chip peeling mechanism, which can push part of the blue film carrying the chip upward into a convex shape, so that the suction and delivery mechanism can easily suck the chip out of the blue film. According to whether the chips of this batch are mounted upright or flipped, the double-seat adsorption mechanism can directly absorb the delivered unflipped chips through the inner adsorption seat, and then stick them to the substrate in the substrate conveying mechanism for upright mounting without processing. It can also use the inner adsorption seat, and after the outer adsorption seat drives the chip on it to rotate, it turns and approaches the outer adsorption seat, absorbs and receives the chip on the outer adsorption seat, and then turns again to flip the chip, and then sticks it to the substrate in the substrate conveying mechanism for flipping by the mounting mechanism. There is no need to prepare upright mounting mechanism and flipping mechanism separately, and each mechanism will no longer be idle. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the prior art descriptions. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0010] Figure 1 It is a schematic structural diagram of the chip placement machine of the present invention;

[0011] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0012] Figure 3 It is a schematic diagram of the cooperation between the chip peeling mechanism and the blue film storage mechanism of the present invention;

[0013] Figure 4 This is a schematic diagram of the structure of the chip peeling mechanism of the present invention. Figure 1 ;

[0014] Figure 5 This is a schematic diagram of the structure of the chip peeling mechanism of the present invention. Figure 2 ;

[0015] Figure 6 is an exploded view of the chip peeling mechanism of the present invention;

[0016] Figure 7 It is a structural schematic diagram of the blue film storage mechanism of the present invention;

[0017] Figure 8 It is a structural schematic diagram of the suction and delivery mechanism of the present invention;

[0018] Figure 9 This is a schematic diagram of the structure of the double-seat adsorption mechanism of the present invention. Figure 1 ;

[0019] Figure 10 This is a schematic diagram of the structure of the double-seat adsorption mechanism of the present invention. Figure 2 ;

[0020] Figure 11 It is a structural schematic diagram of the mounting mechanism of the present invention;

[0021] Figure 12 yes Figure 1 Enlarged view of point B in the middle;

[0022] Figure 13 It is a structural schematic diagram of the mounting station of the substrate conveying mechanism of the present invention;

[0023] In the picture:

[0024] Chip peeling mechanism 100, peeling base 110, peeling cylinder cover 120, negative pressure chamber 130, adsorption assembly 140, lifting through hole 121, lifting assembly 150;

[0025] Annular groove 141, central island 142, protrusion 143, adsorption hole 144;

[0026] Lifting cylinder 151, lifting drive member 152, ejector pin 153;

[0027] The blue film storage mechanism 200 stores the first linear module 210, stores the second linear module 220, stores the base 230, the blue film support plate 240, the film clamping drive member 250, and the blue film clamping plate 260;

[0028] Suction and delivery mechanism 300, suction and delivery robot arm 310, suction and delivery visual recognition camera 320, chip suction nozzle 330;

[0029] Double-seat adsorption mechanism 400;

[0030] An inner adsorption seat 410, an inner adsorption surface 411, an inner rotation shaft 412, and an inner rotation driving member 413;

[0031] An outer adsorption seat 420, an outer adsorption surface 421, an outer rotating shaft 422, and an outer rotating driving member 423;

[0032] Adsorption base 430, moving assembly 440, moving driving member 441, moving end 442, inner rotating shaft 412, transfer notch 450;

[0033] Mounting mechanism 500, mounting first linear module 510, mounting base 520, mounting second linear module 530, mounting visual recognition camera 540, mounting alignment driver 550, mounting adsorption seat 560, force sensor 570, heating plate 580, mounting adsorption through hole 581;

[0034] Substrate conveying mechanism 600, substrate transport robot 610, substrate storage table 620, dispensing conveyor belt 630, dispensing assembly 631, mounting table 640, heating plate 650, substrate adsorption hole plate 660, substrate visual recognition camera 670;

[0035] Elevator cam 710. DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments that can be realized by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Example

[0038] like Figure 1 As shown, the present invention provides a chip placement machine, comprising: a chip peeling mechanism 100, which is arranged below a blue film storage mechanism 200 and is suitable for pushing the blue film carrying the chip upward into a convex shape so that the suction mechanism 300 moved above the chip can suck the chip out of the blue film; Figure 2 The double-seat adsorption mechanism 400 includes an inner adsorption seat 410 and an outer adsorption seat 420, both of which are suitable for directly adsorbing the unflipped chips sent, and the inner adsorption seat 410 and the outer adsorption seat 420 are both rotatable. The inner adsorption seat 410 is suitable for turning and approaching the outer adsorption seat 420 after the outer adsorption seat 420 drives the chip thereon to rotate, and then turning again after receiving the chip on the outer adsorption seat 420 to flip the chip; return to Figure 1 The mounting mechanism 500 is suitable for sucking the chips transferred by the double-seat adsorption mechanism 400 and attaching the chips to the substrate in the substrate conveying mechanism 600.

[0039] The chip placement machine is provided with a chip peeling mechanism 100, which can push the part of the blue film carrying the chip upward into a convex shape, so that the suction and delivery mechanism 300 can easily suck the chip out of the blue film. According to whether the chips of this batch are mounted upright or flipped, the double-seat adsorption mechanism 400 can directly absorb the delivered unflipped chips through the inner adsorption seat 410, and then stick them to the substrate in the substrate conveying mechanism 600 for upright mounting by the placement mechanism 500 without processing. It can also use the inner adsorption seat 410, and after the outer adsorption seat 420 drives the chip on it to rotate, turn and approach the outer adsorption seat 420, absorb and receive the chip on the outer adsorption seat 420, and then turn again to flip the chip, and then stick it to the substrate in the substrate conveying mechanism 600 by the placement mechanism 500 for flipping. There is no need to prepare upright and flip mechanisms separately, and each mechanism will no longer be idle.

[0040] like Figure 3 As shown, the chip peeling mechanism 100 may include: a peeling base 110, which is arranged below the blue film storage mechanism 200; a peeling cylinder cover 120, which is arranged on the peeling base 110, and a peeling cylinder cover 120 is made transparent. Figure 3 , to form a negative pressure chamber 130; the upper end surface of the stripping cylinder cover 120 is provided with an adsorption assembly 140 communicating with the negative pressure chamber 130 to adsorb the blue film around the chip; combined Figure 5 The upper end surface of the stripping cylinder cover 120 is provided with a lifting hole 121, and the lifting component 150 arranged in the negative pressure chamber 130 is suitable for extending through the lifting hole 121 to push the part of the blue film carrying the chip upward into a convex shape.

[0041] like Figure 5 As shown, the adsorption component 140 may include: an annular groove 141, which is provided on the upper end surface of the stripping cylinder cover 120 and forms a central island 142; a plurality of annularly distributed protrusions 143 are provided at intervals in the annular groove 141, and the protrusions 143 are all at the same height as the central island 142; a plurality of adsorption holes 144 connected to the negative pressure chamber 130 are provided at the bottom of the annular groove 141, and the adsorption holes 144 are located in the gaps between the protrusions 143. The blue film stored in the blue film storage mechanism 200 will stick to the upper end surface of the stripping cylinder cover 120. When the blue film storage mechanism 200 moves a chip to the stripping cylinder cover 120 by moving the blue film, the negative pressure chamber 130 generates negative pressure, refer to Figure 5The blue film around the chip will be sucked through the adsorption holes 144 set in the annular groove 141, and in at least one embodiment, in the gap of the protrusion 143 with the adsorption holes 144, there is an adsorption hole 144 at the head and tail of the gap, so that the blue film around the chip is attached to the protrusion 143 and sucked into the annular groove 141, so that the blue film around the chip has adsorbed parts in the circumferential and radial directions of the upper end surface of the stripping tube cover 120, so that the blue film around the chip is tightened. When the lifting component 150 is extended through the lifting through hole 121, the part of the blue film carrying the chip that is also tightened will immediately respond and become convex. After becoming convex, the contact area between the chip and the blue film is reduced, and the resistance hindering the separation of the chip and the blue film is greatly reduced, so that the suction mechanism 300 can easily suck the chip out of the blue film.

[0042] like Figure 5 As shown, the lifting hole 121 is opened on the central island 142; Figure 6 As shown, the lifting assembly 150 may include: a lifting cylinder 151, which is arranged in the stripping base 110 and is combined with Figure 4 , and the upper part penetrates the negative pressure chamber 130, and the lower part extends out of the peeling base 110 and is connected to the lifting drive member 152; the ejector pin 153 is provided at the upper end of the lifting cylinder 151 and is adapted to the lifting through hole 121, and is suitable for extending through the lifting through hole 121 when the lifting cylinder 151 rises. In at least one embodiment, the lifting drive member 152 can be a motor, refer to Figure 6 The lifting drive member 152 can lift the lifting cylinder 151 through the lifting cylinder cam 710, and a sealing ring can be provided between the lifting cylinder 151 and the stripping base 110 to ensure the sealing of the negative pressure chamber 130.

[0043] like Figure 2 and Figure 7 As shown, the blue film storage mechanism 200 may include: a first-line linear module 210 for storing, on which a second-line linear module 220 for storing is provided; a storage base 230, which is arranged on the second-line linear module 220 for storing; a blue film supporting plate 240, which is arranged on the storage base 230; a film clamping driver 250, which is arranged on the storage base 230 and connected to the blue film clamping plate 260; by storing the first-line linear module 210 and the second-line linear module 220, the storage base 230 can be moved, thereby moving the blue film clamped between the blue film supporting plate 240 and the blue film clamping plate 260. In at least one embodiment, the film clamping driver 250 can be a cylinder. As Figure 1 and Figure 8As shown, the suction mechanism 300 may include: a suction robot arm 310, which is provided with a suction visual recognition camera 320 and a chip suction nozzle 330. Through the suction visual recognition camera 320, the suction robot arm 310 can align the chip suction nozzle 330 with the chip. Identifying the chip by suction visual recognition camera 320 is a prior art.

[0044] like Figure 2 and Figure 9 As shown, the double-seat adsorption mechanism 400 may include an inner adsorption seat 410 and an outer adsorption seat 420, which are respectively adapted to adsorb the delivered chip through the inner adsorption surface 411 and the outer adsorption surface 421. Figure 9 and Figure 10 In the figure, the inner adsorption surface 411 of the inner adsorption seat 410 is facing downward, and the outer adsorption surface 421 of the outer adsorption seat 420 is facing outward. In actual use, in the initial state, both the inner adsorption surface 411 and the outer adsorption surface 421 are facing upward. The outer adsorption seat 420 is rotatably mounted on the adsorption base 430, suitable for driving the chip thereon to rotate; the inner adsorption seat 410 is rotatably mounted on the moving assembly 440, so that after the outer adsorption seat 420 drives the chip thereon to rotate, the inner adsorption surface 411 is turned to and close to the outer adsorption surface 421, so as to absorb and receive the chip on the outer adsorption surface 421, and the chip is turned from facing outward on the outer adsorption seat 420 to facing inward on the inner adsorption surface 411 on the inner adsorption seat 410. In at least one embodiment, when the chip is upright, the suction and delivery mechanism 300 can place the chip sucked from the blue film directly on the inner suction surface 411 of the inner suction seat 410, and then the mounting mechanism 500 will stick the unflipped chip on the inner suction surface 411 to the substrate in the substrate conveying mechanism 600; when the chip is flipped, the suction and delivery mechanism 300 will first place the chip sucked from the blue film on the outer suction surface 421 of the outer suction seat 420, and then the outer suction seat 420 will rotate inward 90°, and the chip will also rotate, and the inner suction seat 410 rotates outward 90° so that the inner adsorption surface 411 faces the outer adsorption surface 421. The inner adsorption seat 410 moves toward the outer adsorption seat 420 through the moving component 440, so that the inner adsorption surface 411 is close to the outer adsorption surface 421. Through suction control, the inner adsorption seat 410 absorbs and receives the chip on the outer adsorption surface 421. After the inner adsorption seat 410 is separated from the outer adsorption seat 420, it is rotated upward 90° again. At this time, the chip is flipped and then attached to the substrate in the substrate conveying mechanism 600 by the mounting mechanism 500 for flipping.

[0045] In at least one embodiment, Figure 10 As shown, the adsorption base 430 is provided with an outer shaft 422, which is in transmission connection with the outer rotation drive member 423; the outer adsorption base 420 is provided on the outer shaft 422; Figure 9As shown, the moving assembly 440 may include: a moving driving member 441, which is suitable for driving the moving end 442 to move toward the outer adsorption seat 420; Figure 10 The movable end 442 is provided with an inner rotating shaft 412, which is in transmission connection with the inner rotating driving member 413; the inner adsorption seat 410 is arranged on the inner rotating shaft 412; the adsorption base 430 is provided with a transfer notch 450; the outer adsorption surface 421 of the outer adsorption seat 420 and the inner adsorption surface 411 of the inner adsorption seat 410 are both located in the transfer notch 450. By placing both the outer adsorption surface 421 and the inner adsorption surface 411 in the transfer notch 450 of the adsorption base 430, sufficient rotation space can be provided for the outer adsorption seat 420, and sufficient movement space can be provided for the inner adsorption seat 410 to rotate and approach the outer adsorption seat 420. In at least one embodiment, the outer adsorption seat 420 and the inner adsorption seat 410 are both narrow strips. By providing the transfer notch 450, the outer adsorption seat 420 and the inner adsorption seat 410 can be replaced with wider specifications without hindrance. In at least one embodiment, the outer rotation driving member 423 and the inner rotation driving member 413 may be motors, and the moving driving member 441 may be a linear module.

[0046] like Figure 2 As shown, the mounting mechanism 500 may include: a first mounting linear module 510, on which a mounting base 520 is provided; Figure 11 As shown, the second linear module 530 is mounted on the mounting base 520; Figure 12 , a mounting visual recognition camera 540 is arranged below the mounting base 520; a mounting alignment driver 550 is arranged on the mounting second linear module 530 and is suitable for driving the connected mounting adsorption seat 560 to rotate so as to rotate the chip adsorbed by the mounting adsorption seat 560; a force sensor 570 is provided between the mounting alignment driver 550 and the mounting adsorption seat 560; a heating plate 580 is provided on the mounting adsorption seat 560, and a mounting adsorption through hole 581 is opened on the heating plate 580, and the mounting adsorption seat 560 is suitable for adsorbing the chip through the mounting adsorption through hole 581. The mounting visual recognition camera 540 is used to identify the swing direction of the chip adsorbed by the mounting adsorption seat 560, and the mounting alignment driver 550 can rotate and fine-tune the swing direction of the chip based on the recognition result. The mounting visual recognition camera 540 identifies the chip and the mounting alignment driver 550 rotates and fine-tunes the swing direction of the chip, which is a prior art. By providing the force sensor 570 and the heating plate 580 , a certain pressure and temperature can be maintained when the chip is attached to the substrate.

[0047] like Figure 1The substrate conveying mechanism 600 shown may include: a substrate handling robot 610, adapted to transport substrates from a substrate storage table 620 to a glue dispensing conveyor belt 630; a glue dispensing assembly 631, disposed on one side of the glue dispensing conveyor belt 630 and adapted to dispense glue to the substrates on the glue dispensing conveyor belt 630; a mounting station 640, disposed at the output end of the glue dispensing conveyor belt 630 and adapted to receive glued substrates; a heating plate 650, provided with a substrate adsorption hole plate 660, mounted on the mounting station 640; and a substrate visual recognition camera 670, disposed above the mounting station 640. The glue dispensing assembly 631 is conventional. The substrate visual recognition camera 670 is used to identify and locate the substrate and is conventional. The heating plate 650 is used to maintain the temperature of the substrate.

[0048] In at least one embodiment, a chip bonding method is also provided, including: the chip bonding machine as described above; through the chip peeling mechanism 100, the part of the blue film carrying the chip is pushed upward into a convex shape, so that the suction and delivery mechanism 300 moved above the chip can suck the chip out of the blue film; the inner adsorption seat 410 in the double-seat adsorption mechanism 400 directly adsorbs the unflipped chip that has been delivered, or after the outer adsorption seat 420 drives the chip on it to rotate, the inner adsorption seat 410 turns and approaches the outer adsorption seat 420 to absorb and receive the chip on the outer adsorption seat 420, and then the inner adsorption seat 410 turns again to flip the chip; a mounting mechanism 500, which is suitable for sucking the chip after being transferred by the double-seat adsorption mechanism 400, and attaching the chip to the substrate in the substrate conveying mechanism 600.

[0049] The chip mounting process and technical effects of this chip mounting method have been described above and will not be repeated here.

[0050] To sum up, the chip placement machine is provided with a chip peeling mechanism 100, which can push the part of the blue film carrying the chip upward into a convex shape, so that the suction and delivery mechanism 300 can easily suck the chip out of the blue film. According to whether the chips of this batch are mounted upright or flipped, the double-seat adsorption mechanism 400 can directly absorb the delivered unflipped chips through the inner adsorption seat 410, and then stick them to the substrate in the substrate conveying mechanism 600 for upright mounting by the placement mechanism 500 without processing. It can also use the inner adsorption seat 410, and after the outer adsorption seat 420 drives the chip on it to rotate, it turns and approaches the outer adsorption seat 420, absorbs and receives the chip on the outer adsorption seat 420, and then turns again to flip the chip, and then sticks it to the substrate in the substrate conveying mechanism 600 by the placement mechanism 500 for flipping. There is no need to prepare upright and flip mechanisms separately, and each mechanism will no longer be idle.

[0051] In the embodiments provided herein, it should be understood that the disclosed systems and devices may be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of the mechanism described is merely a logical functional division, and actual implementation may employ other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not implemented.

[0052] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] With the above-described preferred embodiments of the present invention as a guide, those skilled in the art will readily be able to make various changes and modifications without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the contents of the specification but must be determined in accordance with the scope of the claims.

Claims

1. A chip mounter, characterized in that: include: A chip peeling mechanism (100) is arranged below the blue film storage mechanism (200) and is suitable for pushing the portion of the blue film carrying the chip upwards into a convex shape, so that the suction mechanism (300) moved above the chip can suck the chip out of the blue film; The double-seat adsorption mechanism (400) includes an inner adsorption seat (410) and an outer adsorption seat (420), both of which are suitable for directly adsorbing the unflipped chip that has been delivered, and the inner adsorption seat (410) and the outer adsorption seat (420) are both rotatably arranged. The inner adsorption seat (410) is suitable for turning and approaching the outer adsorption seat (420) after the outer adsorption seat (420) drives the chip thereon to rotate, and then sucking and receiving the chip on the outer adsorption seat (420) and turning again to flip the chip; The mounting mechanism (500) is suitable for absorbing the chip transferred by the double-seat adsorption mechanism (400) and mounting the chip on the substrate in the substrate conveying mechanism (600).

2. The chip mounter according to claim 1, characterized in that: The chip peeling mechanism (100) comprises: a peeling base (110), which is arranged below the blue film storage mechanism (200); A stripping cylinder cover (120) is arranged on the stripping base (110) to form a negative pressure chamber (130); The upper end surface of the stripping cylinder cover (120) is provided with an adsorption component (140) in communication with the negative pressure chamber (130) to adsorb the blue film around the chip; The upper end surface of the stripping cylinder cover (120) is provided with a lifting through hole (121), and the lifting component (150) arranged in the negative pressure chamber (130) is suitable for extending through the lifting through hole (121) to push the part of the blue film carrying the chip upward into a convex shape.

3. The chip mounter according to claim 2, characterized in that: The adsorption assembly (140) includes: An annular groove (141) is provided on the upper end surface of the stripping cylinder cover (120) and forms a central island (142); A plurality of annularly distributed protrusions (143) are provided at intervals in the annular groove (141), and the protrusions (143) are all at the same height as the central island (142); A plurality of adsorption holes (144) communicating with the negative pressure cavity (130) are formed at the bottom of the annular groove (141), and the adsorption holes (144) are located in the gaps of the protrusions (143).

4. The chip mounter according to claim 3, characterized in that: The lifting through hole (121) is opened on the central island (142); The lifting assembly (150) comprises: A lifting cylinder (151) is provided in the stripping base (110), with its upper portion penetrating the negative pressure chamber (130), and its lower portion extending out of the stripping base (110) and being in transmission connection with the lifting drive member (152); A thimble (153) is provided at the upper end of the lifting cylinder (151) and is adapted to the lifting through hole (121), and is adapted to extend through the lifting through hole (121) when the lifting cylinder (151) rises.

5. The chip mounter according to claim 1, characterized in that: The blue film storage mechanism (200) comprises: A first linear module (210) is stored, and a second linear module (220) is provided thereon; A storage base (230) is provided on the second linear module (220) for storing the second linear module; A blue film supporting plate (240) is arranged on the storage base (230); A film clamping driving member (250), which is arranged on the storage base (230) and connected to the blue film clamping plate (260); The suction and delivery mechanism (300) comprises: A suction and delivery mechanical arm (310) is provided with a suction and delivery visual recognition camera (320) and a chip suction nozzle (330).

6. The chip mounter according to claim 1, characterized in that: The double-seat adsorption mechanism (400) comprises: The inner adsorption seat (410) and the outer adsorption seat (420) are respectively adapted to adsorb the delivered chip via the inner adsorption surface (411) and the outer adsorption surface (421); The outer adsorption seat (420) is rotatably arranged on the adsorption base (430) and is suitable for driving the chip thereon to rotate; The inner adsorption seat (410) is rotatably arranged on the moving assembly (440) so that after the outer adsorption seat (420) drives the chip thereon to rotate, the inner adsorption surface (411) is turned and brought close to the outer adsorption surface (421) to absorb and receive the chip on the outer adsorption surface (421), and the chip facing outward on the outer adsorption seat (420) is changed to facing inward on the inner adsorption seat (410) toward the inner adsorption surface (411).

7. The chip mounter according to claim 6, characterized in that: The adsorption base (430) is provided with an outer rotating shaft (422), which is in transmission connection with an outer rotating driving member (423); The outer adsorption seat (420) is arranged on the outer rotating shaft (422); The moving assembly (440) comprises: A mobile driving member (441) adapted to drive the mobile end (442) to move toward the outer adsorption seat (420); The movable end (442) is provided with an inner rotating shaft (412), which is in transmission connection with an inner rotating driving member (413); The inner adsorption seat (410) is arranged on the inner rotating shaft (412); The adsorption base (430) is provided with a transfer notch (450); The outer adsorption surface (421) of the outer adsorption seat (420) and the inner adsorption surface (411) of the inner adsorption seat (410) are both located in the transfer gap (450).

8. The chip mounter according to claim 1, characterized in that: The mounting mechanism (500) comprises: Mounting a first linear module (510), on which a mounting base (520) is provided; Mounting a second linear module (530), which is arranged on the mounting base (520); a mounting visual recognition camera (540), which is arranged below the mounting base (520); A mounting and correction driving member (550) is provided on the mounting second linear module (530) and is adapted to drive the connected mounting adsorption seat (560) to rotate so as to rotate the chip adsorbed by the mounting adsorption seat (560); A force sensor (570) is provided between the mounting and correcting driving member (550) and the mounting adsorption seat (560); The mounting adsorption seat (560) is provided with a heating plate (580), and the heating plate (580) is provided with a mounting adsorption through hole (581). The mounting adsorption seat (560) is suitable for adsorbing the chip through the mounting adsorption through hole (581).

9. The chip mounter according to claim 1, characterized in that: The substrate conveying mechanism (600) comprises: A substrate transporting robot (610) adapted to transport a substrate on a substrate storage platform (620) to a dispensing conveyor belt (630); a glue dispensing assembly (631), which is arranged on one side of the glue dispensing conveyor belt (630) and is suitable for dispensing glue on the substrate on the glue dispensing conveyor belt (630); A mounting station (640) is provided at the output end of the dispensing conveyor belt (630) and is suitable for receiving the substrate after dispensing; A heating plate (650) is provided on the mounting platform (640), a substrate adsorption hole plate (660) is provided on the heating plate (650), and a substrate visual recognition camera (670) is provided above the mounting platform (640).

10. A chip bonding method, characterized in that: include: The chip mounter according to any one of claims 1 to 9; The chip peeling mechanism (100) pushes the portion of the blue film carrying the chip upward into a convex shape, so that the suction mechanism (300) moved above the chip can suck the chip out of the blue film; The inner adsorption seat (410) in the double-seat adsorption mechanism (400) directly adsorbs the delivered unflipped chip, or after the outer adsorption seat (420) drives the chip thereon to rotate, the inner adsorption seat (410) turns and approaches the outer adsorption seat (420) to absorb and receive the chip on the outer adsorption seat (420), and then the inner adsorption seat (410) turns again to flip the chip; The mounting mechanism (500) is suitable for absorbing the chip transferred by the double-seat adsorption mechanism (400) and mounting the chip on the substrate in the substrate conveying mechanism (600).

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