Wafer carrier with position correction function

Abstract

The application discloses a wafer carrier with a position correction function and relates to the technical field of wafer carriers.The wafer carrier comprises a base, a fixing cylinder is arranged on the upper side of the base, damping springs are mounted on the outer side of the fixing cylinder, a first coil is embedded on the lower side of the fixing cylinder, the two ends of the first coil are electrically connected with a control system, a guide column is mounted in the fixing cylinder, a detection ball and a pushing plate are mounted between the fixing cylinder and the guide column, a wafer loading plate is arranged on the upper side of the guide column, wafers are loaded on the wafer loading plate, a conducting medium is arranged on the wafer loading plate, the conducting medium is affected by a Lorentz force, flows along the inner wall of the outer ring electrode in a ring shape, the heated conducting medium flows in the heating cavity in a ring shape, the conducting medium continuously contacts the heating wire, the temperature of the conducting medium is more uniform, the overall temperature of the heating cavity is uniform, the wafer loading groove preheats the wafers and the tray, the wafers reach the required temperature, and the processing efficiency of the wafers is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer carriers, and particularly relates to a wafer carrier with a position correction function. BACKGROUND

[0002] A wafer is a basic material for manufacturing semiconductor devices, usually made of high-purity single crystal silicon, and has a circular shape. It is a core component of the integrated circuit (IC) and microelectronics industry, used to make various circuit element structures, ultimately forming IC products with specific electrical functions. Wafers are usually carried by wafer carriers, which are precision carrying devices designed specifically for semiconductor wafers. They are mainly used in wafer manufacturing, storage, transportation, and other links to ensure the physical safety and chemical purity of wafers in harsh environments.

[0003] The existing wafer carrier mainly has the following problems: (1) no buffering treatment when placing the wafer, resulting in the wafer being unable to be used, (2) no correction of the position of the wafer. SUMMARY

[0004] The present application aims to provide a wafer carrier with a position correction function to solve the problems in the prior art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a wafer carrier with a position correction function, the wafer carrier comprising a base, a fixed cylinder is arranged on the upper side of the base, a shock-absorbing spring is installed on the outer side of the fixed cylinder, a first coil is embedded on the lower side of the fixed cylinder, the two ends of the first coil are electrically connected with a control system, a guide column is installed in the fixed cylinder, a detection ball and a pushing plate are installed between the fixed cylinder and the guide column, a wafer carrier plate is arranged on the upper side of the guide column, and a wafer is carried on the wafer carrier plate.

[0006] The upper end and the lower end of the shock-absorbing spring are respectively provided with a driving disc and a driven disc, a fixed disc is installed on the outer side of the shock-absorbing spring, the fixed disc is installed on the base through a support rod, the support rod is arranged on the base, a magnetic material is arranged on the lower side of the driving disc, the magnetic material on the lower side of the driving disc faces the shock-absorbing spring, the inner wall of the fixed disc is in contact with the shock-absorbing spring, and the fixed disc and the driven disc are electrically connected with the control system through wires;

[0007] The upper side of the driving disc is rotatably installed on the wafer carrier plate through a bearing, the bearing on the driving disc can ensure that the wafer carrier plate does not rotate when the driving disc rotates, a gear tooth is arranged on the lower side of the driving disc, the gear teeth are arranged along the circumference of the driving disc, the gear teeth are engaged with a driving gear, the output shaft of a driving motor is installed in the middle of the driving gear, the driving motor is installed on the wafer carrier plate through a motor base, and the motor base is arranged on the wafer carrier plate.

[0008] The stiffness of the damping spring is designed to be adjustable to meet the buffering requirements of different wafers; the control system drives the driving gear to rotate through the driving motor, the driving gear drives the driving disc to rotate through the gear, and the driving disc drives the damping spring to rotate; since the damping spring is located in the spiral groove and the spiral groove is spirally distributed, the damping spring will move upward spirally under the driving of the driving disc, so that the effective number of turns of the damping spring increases, the stiffness of the damping spring decreases, and the buffering effect improves, so that different wafers can be matched with the required buffering effect, and problems such as wafer deviation caused by mismatched buffering effect are prevented; the effective number of turns refers to the number of turns of the damping spring between the driving disc and the upper end of the fixed cylinder.

[0009] The fixed cylinder is provided with a spiral groove outside, the spiral groove is spirally distributed, the damping spring is located in the spiral groove, and the damping spring and the spiral groove are matched; the driven disc is provided with a plurality of follower shafts inside, and the plurality of follower shafts are inserted into the spiral groove; in the rotation process of the driven disc, the follower shafts rotate with the driven disc and slide in the spiral groove, so as to ensure that the driven disc is separated from the guide column and ensure normal work of the driven disc.

[0010] The fixed cylinder is hollow inside, the fixed cylinder is provided with a plurality of sliding grooves inside, the lower side of the guide column is provided with a plurality of sliding plates, the plurality of sliding plates are respectively slidably installed in the plurality of sliding grooves, two groups of cylinders are sequentially arranged on the plurality of sliding plates, the detection balls are provided in two groups, the two groups of detection balls are slidably installed in the two groups of cylinders, the first spring is connected between the detection ball and the cylinder, the film pressure sensor is arranged on the surface of the detection ball, the displacement sensor is installed in the cylinder, the displacement sensor is used for detecting the displacement of the detection ball, and the film pressure sensor and the displacement sensor are electrically connected with the control system.

[0011] The middle parts of the plurality of sliding plates are provided with adjusting covers, the adjusting covers are located between the adjacent two groups of detection balls, the adjusting covers are hollow inside, the push plate is slidably installed in the adjusting cover, one end of the push plate penetrates out of the adjusting cover, and the second spring is connected between the other end of the push plate and the adjusting cover.

[0012] The heat conducting medium is arranged between the push plate and the adjusting cover, the metal material is arranged on the push plate and the adjusting cover, the metal material on the push plate and the adjusting cover is electrically connected with the control system, the metal material on the push plate and the adjusting cover is in contact with the heat conducting medium, and the heat conducting medium is a heat expansion material.

[0013] The bottom of the guide column is provided with a liquid storage bag, the first coil is located outside the liquid storage bag, the liquid storage bag is provided with a liquid inlet and a liquid outlet, the liquid inlet is located on one side of the liquid outlet, the liquid storage bag is made of elastic material, the liquid inlet is connected with the outlet of a vacuum pump through a pipeline penetrating through the base, the inlet of the vacuum pump is connected with a liquid storage tank through a pipeline, the liquid storage tank is provided with a magnetorheological fluid, the liquid outlet is connected with the outside air through a pipeline penetrating through the base, the vacuum pump and the liquid storage tank are installed on the base, the liquid inlet and the liquid outlet are both provided with an electromagnetic valve and a flow meter, and the electromagnetic valve and the flow meter are electrically connected with a control system.

[0014] The heating cavity is arranged in the object plate, the object plate on the upper side of the heating cavity is made of heat-conducting material, and a plurality of heating wires are arranged on the object plate on the lower side of the heating cavity.

[0015] A second coil is arranged on the object plate outside the heating cavity, the two ends of the second coil are electrically connected with the control system through wires, an inner electrode is arranged in the middle of the heating cavity, an outer electrode is arranged on the inner wall of the heating cavity, the inner electrode and the outer electrode are opposite to each other, and the inner electrode and the outer electrode are both arranged on the object plate and electrically connected with the control system through wires penetrating through the object plate.

[0016] A conductive medium is arranged in the heating cavity, the conductive medium is located between the inner electrode and the outer electrode, and the conductive medium has electrical conductivity.

[0017] An object slot is arranged on the upper side of the object plate, and a tray is arranged in the object slot, the tray is used for positioning and storing a wafer.

[0018] A control panel is arranged on the base, and the control panel is provided with a control system.

[0019] Compared with the prior art, the present application has the following beneficial effects:

[0020] 1. Wafer buffering treatment is used to prevent wafer deviation or damage. The impact force of the wafer and the tray downward is transmitted to the driving disc through the object plate, the impact force is transmitted to the damping spring by the driving disc, the impact force of the wafer and the tray downward is buffered through the damping spring, so as to ensure the stability of the wafer and the tray; the control system simultaneously connects the fixed disc and the driven disc into the circuit, so that the magnetic field is generated on the lower side of the damping spring, that is, the magnetic field is generated by the number of turns of the damping spring between the fixed disc and the driven disc, the magnetic field generated by the damping spring repels the magnetic material on the lower side of the driving disc, and the magnetic repulsion force buffers the driving disc, the object plate and the wafer again, so as to prevent the wafer from deviating or being damaged.

[0021] 2. Wafer preheating to improve wafer processing efficiency. The control system connects the heating wire in the heating chamber to the circuit, heating the conductive medium. The second coil generates a magnetic field parallel to its axis. The conductive medium is located between the inner and outer electrodes and is conductive, so current flows through it from the inside out. This current is affected by the magnetic field of the second coil, causing the conductive medium to be subjected to Lorentz force and flow in a ring along the inner wall of the outer electrode. This circular flow of the heated conductive medium within the heating chamber ensures continuous contact with the heating wire, resulting in a more uniform temperature within the heating chamber. The thermally conductive material on the upper side of the heating chamber preheats the tray on the upper side of the carrier plate, facilitating the preheating of the wafer and tray to reach the required temperature and improve wafer processing efficiency.

[0022] 3. Wafer position correction process to ensure normal wafer operation. The control system connects the push plates and metal materials on the adjustment covers to the circuit, allowing current to flow through them. This generates heat, which is then transferred to the heat-conducting medium. The medium absorbs the heat and expands, pushing the push plate away from the guide post. Simultaneously, the push plate compresses the second spring. Since multiple sets of push plates and adjustment covers are provided, they all push outward the same distance and contact the inner wall of the sliding groove, centered on the guide post. This achieves wafer position correction and ensures normal wafer operation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 This is a front view of the entire invention;

[0025] Figure 3 This is a schematic diagram of the liquid inlet and liquid outlet in this invention;

[0026] Figure 4 This is a schematic diagram of the shock-absorbing spring in this invention;

[0027] Figure 5 This is a schematic diagram of the spiral groove structure in this invention;

[0028] Figure 6 This is a schematic diagram of the structure of the inner and outer electrodes in this invention;

[0029] Figure 7 This is a schematic diagram of the guide post structure in this invention;

[0030] Figure 8This is a schematic diagram of the detection ball in this invention.

[0031] In the diagram: 1. Control panel; 11. Base; 12. Fixing cylinder; 121. Shock-absorbing spring; 122. First coil; 13. Guide column; 131. Sliding plate; 132. Liquid storage bag; 133. Liquid inlet; 134. Liquid outlet; 14. Carrying plate; 141. Inner ring electrode; 142. Outer ring electrode; 143. Second coil; 15. Detection ball; 16. Push plate; 161. Adjustment cover; 2. Active disc; 201. Active gear; 202. Drive motor; 21. Driven disc; 211. Follower shaft; 22. Fixing disc. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Example: Figures 1-8 As shown, the present invention provides a technical solution for a wafer carrier with a position correction function. The wafer carrier includes a base 11, a fixing cylinder 12 is provided on the upper side of the base 11, a shock-absorbing spring 121 is installed on the outer side of the fixing cylinder 12, a first coil 122 is embedded on the lower side of the fixing cylinder 12, and the two ends of the first coil 122 are electrically connected to the control system. A guide post 13 is installed inside the fixing cylinder 12, a detection ball 15 and a push plate 16 are installed between the fixing cylinder 12 and the guide post 13, a carrying plate 14 is provided on the upper side of the guide post 13, and a wafer is carried on the carrying plate 14. A control panel 1 is provided on the base 11, and a control system is provided in the control panel 1. A carrying groove is provided on the upper side of the carrying plate 14, and a tray is provided in the carrying groove. The tray is used for positioning and storing wafers. A heating chamber is provided inside the carrying plate 14. The carrying plate 14 on the upper side of the heating chamber is made of a heat-conducting material, and a plurality of heating wires are provided on the carrying plate 14 on the lower side of the heating chamber. The plurality of heating wires are electrically connected to the control system.

[0034] The upper and lower ends of the shock-absorbing spring 121 are respectively provided with an active disk 2 and a driven disk 21. A fixed disk 22 is installed on the outside of the shock-absorbing spring 121. The fixed disk 22 is installed on the base 11 by a support rod. The support rod is set on the base 11. The lower side of the active disk 2 is provided with a magnetic material. The magnetic material on the lower side of the active disk 2 faces the shock-absorbing spring 121. The inner wall of the fixed disk 22 is in contact with the shock-absorbing spring 121. The fixed disk 22 and the driven disk 21 are electrically connected to the control system through wires. The upper side of the active disk 2 is rotatably mounted on the carrying plate 14 by a bearing. The bearing on the active disk 2 can ensure that the carrying plate 14 does not rotate when the active disk 2 rotates. The lower side of the active disk 2 is provided with gear teeth. The gear teeth are arranged along the circumference of the active disk 2 and mesh with the active gear 201. The output shaft of the drive motor 202 is installed in the middle of the drive gear 201. The drive motor 202 is mounted on the carrying plate 14 by a motor mount. The motor mount is set on the carrying plate 14.

[0035] The stiffness of the damping spring 121 is adjustable to meet the buffering requirements of different wafers. The control system drives the drive gear 201 to rotate via the drive motor 202. The drive gear 201 drives the drive disk 2 to rotate via its teeth. The drive disk 2 drives the damping spring 121 to rotate. Since the damping spring 121 is located in the spiral groove and the spiral groove is spirally distributed, the damping spring 121 will move upward spirally under the drive of the drive disk 2, so that the effective number of turns of the damping spring 121 increases, the stiffness of the damping spring 121 will decrease, and the buffering effect will be improved, so that different wafers can match the required buffering effect and prevent wafer misalignment and other problems. The effective number of turns refers to the number of turns of the damping spring 121 between the drive disk 2 and the upper end of the fixed cylinder 12.

[0036] The outer side of the fixed cylinder 12 is provided with a spiral groove, which is spirally distributed. The shock-absorbing spring 121 is located in the spiral groove and the shock-absorbing spring 121 and the spiral groove are configured to cooperate. The driven plate 21 is provided with several following shafts 211, which are inserted into the spiral groove. During the rotation of the driven plate 21, the following shafts 211 follow the rotation of the driven plate 21 and slide in the spiral groove to ensure that the driven plate 21 is separated from the guide post 13 and to ensure that the driven plate 21 works normally.

[0037] The fixed cylinder 12 is hollow inside and has several sliding grooves. Several sliding plates 131 are located on the lower side of the guide column 13, and each sliding plate 131 is slidably installed within one of the sliding grooves. Two sets of cylinders are sequentially arranged on each sliding plate 131. Two sets of detection balls 15 are also arranged, slidably installed within the two sets of cylinders. A first spring connects the detection balls 15 to the cylinders. A thin-film pressure sensor is installed on the surface of each detection ball 15, and a displacement sensor is installed inside each cylinder. The displacement sensor detects the displacement of the detection ball 15. Both the thin-film pressure sensor and the displacement sensor are electrically connected to the control system. Each of the 31 has an adjustment cover 161 in the middle. The adjustment cover 161 is located between two adjacent sets of detection balls 15. The adjustment cover 161 is hollow inside. The push plate 16 is slidably installed inside the adjustment cover 161. One end of the push plate 16 extends out of the adjustment cover 161, and the other end of the push plate 16 is connected to the adjustment cover 161 by a second spring. A heat-conducting medium is provided between the push plate 16 and the adjustment cover 161. Both the push plate 16 and the adjustment cover 161 are provided with metal material. The metal material on the push plate 16 and the adjustment cover 161 is electrically connected to the control system. The metal material on the push plate 16 and the adjustment cover 161 is in contact with the heat-conducting medium, which is a material that expands when heated.

[0038] A liquid storage bag 132 is provided at the bottom of the guide column 13. The first coil 122 is located outside the liquid storage bag 132. The liquid storage bag 132 is provided with an inlet 133 and an outlet 134. The inlet 133 is located on the side of the outlet 134. The liquid storage bag 132 is made of elastic material. The inlet 133 passes through the base 11 through a pipe and is connected to the outlet of a vacuum pump (not shown in the figure). The inlet of the vacuum pump is connected to a liquid storage tank (not shown in the figure) through a pipe. The liquid storage tank is filled with magnetorheological fluid (not shown in the figure). The outlet 134 passes through the base 11 through a pipe and is connected to the outside air. The vacuum pump and the liquid storage tank are both installed on the base 11. Solenoid valves and flow meters are installed in both the inlet 133 and the outlet 134. The solenoid valves and flow meters are electrically connected to the control system.

[0039] A second coil 143 is provided on the loading plate 14 outside the heating chamber. The two ends of the second coil 143 are electrically connected to the control system through wires. An inner ring electrode 141 is provided in the middle of the heating chamber, and an outer ring electrode 142 is provided on the inner wall of the heating chamber. The inner ring electrode 141 and the outer ring electrode 142 are facing each other. Both the inner ring electrode 141 and the outer ring electrode 142 are provided on the loading plate 14. Both the inner ring electrode 141 and the outer ring electrode 142 are electrically connected to the control system after passing through the loading plate 14 through wires. A conductive medium is provided in the heating chamber, and the conductive medium is located between the inner ring electrode 141 and the outer ring electrode 142. The conductive medium is conductive.

[0040] Working Principle: Pressing the start button on control panel 1 activates the wafer carrier, which enters preheating mode. The control system connects the heating wire in the heating chamber to the circuit, heating the conductive medium. The inner electrode 141 is connected to the positive terminal of the power supply, the outer electrode 142 to the negative terminal, and the two ends of the second coil 143 are connected to the circuit. The second coil 143 generates a magnetic field parallel to its axis. The conductive medium is located between the inner electrode 141 and the outer electrode 142 and is conductive, allowing current to flow from the inside out. The current is affected by the magnetic field of the second coil 143, causing the conductive medium to be affected by the Lorentz force. It will flow in a ring along the inner wall of the outer electrode 142, so that the heated conductive medium flows in a ring within the heating chamber, keeping the conductive medium in continuous contact with the heating wire. This makes the temperature of the conductive medium more uniform, so that the overall temperature of the heating chamber becomes uniform. The heat-conducting material on the upper side of the heating chamber preheats the loading slot on the upper side of the carrier plate 14, so that the loading slot can preheat the wafer and the tray, so that the wafer reaches the required temperature. The heating wire, outer electrode 142, inner electrode 141 and second coil 143 are de-energized after working for the set time.

[0041] The staff places the wafer on the tray, and then places the tray on the loading slot on the loading plate 14. The loading slot is used to position the wafer and the tray. The downward impact force of the wafer and the tray is transmitted to the active plate 2 through the loading plate 14. The active plate 2 transmits the impact force to the shock-absorbing spring 121. The shock-absorbing spring 121 buffers the downward impact force of the wafer and the tray to ensure the stability of the wafer and the tray.

[0042] While the damping spring 121 is buffering the wafer, the control system simultaneously connects the fixed disk 22 and the driven disk 21 to the circuit, so that a magnetic field is generated on the lower side of the damping spring 121. That is, the number of turns of the damping spring 121 between the fixed disk 22 and the driven disk 21 generates a magnetic field. The magnetic field generated by the damping spring 121 repels the magnetic material on the lower side of the active disk 2. The repulsive force of the magnetic field buffers the active disk 2, the carrier plate 14 and the wafer again. Since the damping spring 121 between the fixed disk 22 and the driven disk 21 is located in the spiral groove, the damping spring 121 is restricted by the spiral groove and will not contract.

[0043] After the wafer and tray are buffered by the shock-absorbing spring 121 and the magnetic repulsion force, the operator presses the centering mode button on the control panel 1. The control system first de-energizes the fixed plate 22 and the driven plate 21, and the wafer carrier will enter the centering mode to facilitate wafer processing. The control system connects the push plate 16 in each adjustment cover 161 and the metal material on the adjustment cover 161 to the circuit, so that current flows through the push plate 16 and the metal material on the adjustment cover 161. The metal material generates heat and conducts the heat to the heat-conducting medium. After absorbing the heat, the heat-conducting medium expands and pushes the push plate 16 to move away from the guide post 13. At the same time, the push plate 16 compresses the second spring. Since there are multiple sets of push plates 16 and adjustment covers 161, the multiple sets of push plates 16 push outward by the same distance and contact the inner wall of the sliding groove so that the guide post 13 is in the center position of the fixed cylinder 12, thereby realizing the center positioning of the wafer. At this time, the detection ball 15 is always abutted against the sliding groove by the first spring to ensure that the guide post 13 is stably corrected to the center position of the fixed cylinder 12.

[0044] During the correction process of the guide post 13, the pressure sensors on each detection ball 15 feed back the pressure data to the control system. The control system also uses the displacement sensors on one side of each detection ball 15 to detect the position changes of the guide post 13 and the wafer in real time, so as to help achieve wafer position correction and prevent adverse effects caused by wafer position displacement.

[0045] After the wafer position is corrected, the control system opens the solenoid valves in the inlet 133 and outlet 134, and uses a vacuum pump to draw the magnetorheological fluid in the storage tank into the inlet 133. The fluid then enters the storage bag 132 through the inlet 133. The air in the storage bag 132 is discharged to the outside atmosphere through the outlet 134. As the magnetorheological fluid continues to enter the storage bag 132, the storage bag 132 gradually expands and contacts the inner wall of the fixed cylinder 12 to adapt to the shape of the bottom of the fixed cylinder 12.

[0046] As the storage bag 132 gradually expands and contacts the inner wall of the fixed cylinder 12, the flow meter in the inlet 133 feeds back the flow data of the magnetorheological fluid to the control system. The control system closes the solenoid valve in the inlet 133, closes the solenoid valve in the outlet 134, and stops the vacuum pump. The control system connects the two ends of the first coil 122 to the circuit, and a magnetic field is generated in the first coil 122. The magnetic field of the first coil 122 causes the magnetorheological fluid to change from a liquid state to a solid state. The solidified magnetorheological fluid will be stuck on the lower side of the fixed cylinder 12. At this time, the guide column 13 will be limited by the magnetorheological fluid and the fixed cylinder 12.

[0047] After the guide post 13 is limited by the magnetorheological fluid and the fixed cylinder 12, the energizing signal of the first coil 122 of the control system is fed back to the control system. The control system de-energizes the metal material on the push plate 16 and the adjusting cover 161. At this time, the metal material no longer heats up, the heat conduction medium gradually contracts, the second spring is released, and the second spring pulls the push plate 16 to move towards the center of the guide post 13 so as to facilitate the next position correction of the wafer on the guide post 13.

[0048] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer carrier with position correction function, characterized in that: The wafer carrier includes a base (11), a fixing cylinder (12) is provided on the upper side of the base (11), a shock-absorbing spring (121) is installed on the outer side of the fixing cylinder (12), a first coil (122) is embedded on the lower side of the fixing cylinder (12), the two ends of the first coil (122) are electrically connected to the control system, a guide post (13) is installed inside the fixing cylinder (12), a detection ball (15) and a push plate (16) are installed between the fixing cylinder (12) and the guide post (13), a carrying plate (14) is provided on the upper side of the guide post (13), and a wafer is carried on the carrying plate (14); The fixed cylinder (12) is hollow inside, and a number of sliding grooves are provided inside the fixed cylinder (12). A number of sliding plates (131) are provided on the lower side of the guide column (13). The sliding plates (131) are slidably installed in the sliding grooves. Two sets of cylinders are arranged on the sliding plates (131) in sequence. Two sets of detection balls (15) are provided. The two sets of detection balls (15) are slidably installed in the two sets of cylinders. A first spring is connected between the detection balls (15) and the cylinders. A thin film pressure sensor is provided on the surface of the detection balls (15). A displacement sensor is installed inside the cylinder. The thin film pressure sensor and the displacement sensor are both electrically connected to the control system. An adjustment cover (161) is provided in the middle of several sliding plates (131). The adjustment cover (161) is located between two adjacent sets of detection balls (15). The adjustment cover (161) is hollow inside. The push plate (16) is slidably installed inside the adjustment cover (161). One end of the push plate (16) extends out of the adjustment cover (161). A second spring is connected between the other end of the push plate (16) and the adjustment cover (161). A heat-conducting medium is provided between the push plate (16) and the adjustment cover (161). Both the push plate (16) and the adjustment cover (161) are provided with metal material. The metal material on the push plate (16) and the adjustment cover (161) is electrically connected to the control system. The metal material on the push plate (16) and the adjustment cover (161) are in contact with the heat-conducting medium, which is a material that expands when heated.

2. A wafer carrier with position correction function according to claim 1, characterized in that: The upper and lower ends of the shock-absorbing spring (121) are respectively provided with an active plate (2) and a driven plate (21). A fixed plate (22) is installed on the outside of the shock-absorbing spring (121). The fixed plate (22) is installed on the base (11) by a support rod. The support rod is set on the base (11). A magnetic material is provided on the lower side of the active plate (2). The magnetic material on the lower side of the active plate (2) faces the shock-absorbing spring (121). The inner wall of the fixed plate (22) is in contact with the shock-absorbing spring (121). The fixed plate (22) and the driven plate (21) are both electrically connected to the control system through wires. The upper side of the drive disk (2) is rotatably mounted on the carrier plate (14) via a bearing. The lower side of the drive disk (2) is provided with gear teeth, which are arranged along the circumference of the drive disk (2). The gear teeth mesh with the drive gear (201). The output shaft of the drive motor (202) is installed in the middle of the drive gear (201). The drive motor (202) is mounted on the carrier plate (14) via a motor mount, which is located on the carrier plate (14).

3. A wafer carrier with position correction function according to claim 2, characterized in that: The fixed cylinder (12) has a spiral groove on its outer side. The spiral groove is spirally distributed. The shock-absorbing spring (121) is located in the spiral groove. The shock-absorbing spring (121) and the spiral groove are configured to cooperate. The driven disk (21) has several following shafts (211) inside. All of the following shafts (211) are inserted into the spiral groove.

4. A wafer carrier with position correction function according to claim 3, characterized in that: A liquid storage bag (132) is provided at the bottom of the guide column (13). The first coil (122) is located outside the liquid storage bag (132). The liquid storage bag (132) is provided with an inlet (133) and an outlet (134). The inlet (133) is located on the side of the outlet (134). The liquid storage bag (132) is made of elastic material. The inlet (133) passes through the base (11) through a pipe and is connected to the outlet of the vacuum pump. The inlet of the vacuum pump is connected to the liquid storage tank through a pipe. The liquid storage tank is provided with magnetorheological fluid. The outlet (134) passes through the base (11) through a pipe and is connected to the outside air. The vacuum pump and the liquid storage tank are both installed on the base (11). Solenoid valves and flow meters are installed in the inlet (133) and the outlet (134). The solenoid valves and flow meters are electrically connected to the control system.

5. A wafer carrier with position correction function according to claim 4, characterized in that: The loading plate (14) is provided with a heating chamber inside. The loading plate (14) on the upper side of the heating chamber is made of a heat-conducting material. Several heating wires are provided on the loading plate (14) on the lower side of the heating chamber. The several heating wires are electrically connected to the control system.

6. A wafer carrier with position correction function according to claim 5, characterized in that: A second coil (143) is provided on the loading plate (14) outside the heating chamber. The two ends of the second coil (143) are electrically connected to the control system through wires. An inner ring electrode (141) is provided in the middle of the heating chamber. An outer ring electrode (142) is provided on the inner wall of the heating chamber. The inner ring electrode (141) and the outer ring electrode (142) are facing each other. The inner ring electrode (141) and the outer ring electrode (142) are both provided on the loading plate (14). The inner ring electrode (141) and the outer ring electrode (142) are both electrically connected to the control system after passing through the loading plate (14) through wires. The heating chamber is provided with a conductive medium, which is located between the inner electrode (141) and the outer electrode (142), and the conductive medium is conductive.

7. A wafer carrier with position correction function according to claim 6, characterized in that: The upper side of the carrier plate (14) is provided with a carrier groove, and a tray is provided in the carrier groove. The tray is used for positioning and storing wafers.

8. A wafer carrier with position correction function according to claim 7, characterized in that: The base (11) is provided with a control panel (1), and the control panel (1) is provided with a control system.

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