Wafer carrying device with friction increasing and viscosity reducing functions

Abstract

The invention discloses a wafer carrying device with friction increasing and viscosity reducing functions, and relates to the technical field of wafer carrying. The bionic friction-increasing and viscosity-reducing material is made of an elastic body, and is structurally divided into three parts, namely a tail end convex straight column array, a supporting layer and a back connecting layer. Wherein the tail end of each straight column array unit protrudes and is in a spherical crown shape. According to the bionic friction-increasing and viscosity-reducing material with the straight-column-array spherical-crown-shaped tail end protrusions, for a smooth wafer surface, the friction force between wafer carrying mechanical fingers and a wafer can be increased by means of the excellent tribological characteristic of an elastic body, the bionic micro-nano structure design and the Van der Waals force acting mechanism, and therefore the friction force between the wafer carrying mechanical fingers and the wafer can be increased; and meanwhile, the convex shape at the tail end of the straight column forms a separation behavior of edge avulsion during interface normal desorption, and normal desorption can be realized under extremely small adhesive force.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer handling, and in particular to a wafer handling device with the functions of increasing friction and reducing viscosity. Background Art

[0002] At present, wafer handling in the semiconductor manufacturing field is mostly carried out by using a robotic arm in conjunction with an end suction cup or rubber pad. However, traditional flat rubber pads often produce a high adhesion force when in direct contact with the wafer, causing the wafer to be pulled or partially adhered during the disengagement operation, increasing the risk of surface scratches and contamination. At the same time, the friction provided by ordinary suction cups or rubber pads during lateral grasping is relatively limited, which may cause the wafer to slip or shift during the handling process. To avoid these problems, the industry usually increases the complexity of the mechanical structure or improves the vacuum adsorption capacity, but this further leads to an increase in manufacturing costs and failure rates, and it is impossible to strike a balance between high friction and low adhesion. Therefore, how to effectively reduce normal adhesion while improving lateral stability during wafer handling remains a major problem in the existing technology. Summary of the Invention

[0003] In order to overcome the defects of the above-mentioned prior art, the present invention provides the following technical solutions: A wafer handling device with friction-increasing and viscosity-reducing functions, comprising an end actuator for a semiconductor wafer handling robot arm, the end actuator comprising an actuator base, a first actuator swing arm is installed on the actuator base through a joint movable mechanism, a second actuator swing arm is installed on the first actuator swing arm through a joint movable mechanism, and an end actuator swing arm is installed on the second actuator swing arm through a joint movable mechanism, a plurality of friction-increasing and viscosity-reducing materials are adhered and installed on the end actuator swing arm through a back connecting layer, the friction-increasing and viscosity-reducing materials consist of three parts: an end protruding straight column array, a supporting layer, and a back connecting layer, the end protruding straight column array is fixed on the supporting layer, wherein the end protrusion of the straight column array is spherical crown-shaped; wherein the joint movable mechanism comprises a driving motor, a limiting ring, a drag reduction rotating plate and an actuator boss, wherein the actuator boss is fixedly connected to the passive swing arm, wherein the driving motor and the limiting ring are fixedly connected to the active swing arm.

[0004] Preferably, the driving motor and the limiting ring in the joint movable mechanism at the connection between the execution base and the first execution swing arm are fixed to the execution base, and the execution boss is fixed to the first execution swing arm; the driving motor and the limiting ring in the joint movable mechanism at the connection between the first execution swing arm and the second execution swing arm are fixed to the first execution swing arm, and the execution boss is fixed to the second execution swing arm; the driving motor and the limiting ring in the joint movable mechanism at the connection between the second execution swing arm and the end execution swing arm are fixed to the second execution swing arm, and the execution boss is fixed to the end execution swing arm.

[0005] Preferably, the end raised straight column array and the support layer are made of an elastomer, which is silicone, rubber or polyurethane; the end raised straight column array is arranged on the support layer in a hexagonal close-packed arrangement, a circumferentially equidistant arrangement or a rectangular equidistant arrangement.

[0006] Preferably, the end of the straight column array is spherical cap-shaped, the curvature of the spherical cap changes with the diameter of the column, but the overall shape is spherical cap-shaped, and the shape of its arc has a curved profile along the cross section of the axis, and the curved profile is composed of curves with one or more curvature radii.

[0007] Preferably, the center distance between two straight column units in the straight column array is 0.5 to 2 times the inscribed circle of the straight column unit, and the cross section of the straight column is circular, hexagonal or triangular.

[0008] Preferably, the joint movable mechanism also includes an execution passive disk rotatably mounted in a limiting ring, the execution passive disk is fixedly connected to the execution boss by connecting screws, and two elastic swing arms are symmetrically mounted on the execution passive disk through two elastic swing arm brackets, and elastic swing arm pull rods are movably mounted in the middle of the two elastic swing arms, and pins are fixed on the ends of the two elastic swing arm pull rods away from the elastic swing arms, and the two pins are equipped with elastic rod springs in contact with one side of the elastic swing arm, and protrusions are provided at both ends of the elastic rod spring for contacting and cooperating with the pins, and the middle part of the elastic rod spring is fixedly matched with the execution passive disk.

[0009] Preferably, two inclined limiting extrusion panels are symmetrically fixedly installed at the edge of the executing passive disk, and the two inclined limiting extrusion panels are arranged at the side of the elastic swing arm. There are snap-in triangular blocks in contact with the two inclined limiting extrusion panels and the inner wall of the limiting ring, and a pushing triangular block is arranged on the side of the snap-in triangular block, and the pushing triangular block is arranged between the inclined limiting extrusion panel and the inner wall of the limiting ring; wherein the two snap-in triangular blocks and the two pushing triangular blocks are symmetrically arranged on the executing passive disk.

[0010] Preferably, the side of the triangle block close to the elastic swing arm is set with an arc surface, which is in contact and sliding cooperation with the elastic swing arm, and two elastic swing arm limit columns for limiting the swing angle of the elastic swing arm are fixedly installed on the passive disk, and a gap is provided between the elastic swing arm limit column and the elastic swing arm.

[0011] Preferably, the outer casing of the driving motor and the limiting ring are fixedly matched, and the inner wall of the limiting ring is also rotatably mounted with an execution active disk fixed to the two pushing triangle blocks. The execution active disk is fixed on the output shaft of the driving motor, the drag reduction rotating plate is fixedly matched with the limiting ring, and the execution boss and the execution passive disk are rotationally matched with the drag reduction rotating plate.

[0012] Compared with the prior art, the present invention has the following beneficial effects: (1) The bionic friction-increasing and viscosity-reducing material of the present invention can increase the effective contact area between the material and its interacting surface, thereby allowing a greater degree of intermolecular interaction between the two surfaces. At the same time, the spherical crown end protrusions of the straight column array can contact the irregular depressions of the rough surface to form a mechanical interlock. Both mechanisms effectively ensure the friction-increasing performance of the material; (2) The present invention arranges a spherical crown end protrusion straight column array on the contact surface of the end actuator swing arm, so that the surface can generate higher tangential friction when in contact with the wafer. Compared with traditional flat rubber pads or ordinary straight column arrays, the spherical crown protrusions can effectively provide additional friction support when subjected to lateral force, preventing the wafer from sliding during transportation. At the same time, the spherical crown protrusions can form local stress concentration areas on the wafer surface, thereby improving the gripping stability of the wafer and reducing the risk of falling, effectively improving the safety and production efficiency of the semiconductor production process; (3) Since the spherical crown end protrusion straight column array of the present invention can maintain a low adhesion force when in normal contact, it helps to achieve the viscosity reduction function and prevent the problem of difficulty in releasing the wafer due to excessive adsorption on the wafer surface. With the relatively small contact area between the spherical crown end and the wafer surface, the wafer can be separated more quickly and smoothly after the transportation is completed, greatly reducing the additional force required to detach from the wafer. This not only protects the integrity of the wafer surface and reduces minor surface damage, but also improves the repetitive efficiency of the transportation action, which is of significant significance to improving the work rhythm of the automated production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the end actuator of the present invention.

[0014] Figure 2 This is a schematic diagram of the structure of the boss according to the present invention.

[0015] Figure 3 Schematic diagram of the internal structure of the confinement ring of the present invention.

[0016] Figure 4 For the present invention Figure 3 Schematic diagram of the structure at point A in the middle.

[0017] Figure 5 This is a schematic diagram of the passive disk structure of the present invention.

[0018] Figure 6 It is a structural schematic diagram of the elastic swing arm of the present invention.

[0019] Figure 7 This is a schematic diagram of the structure of the bionic friction-increasing and viscosity-reducing material with a spherical crown-shaped end-protruding straight column array of the present invention.

[0020] Figure 8This is a schematic diagram of the cross-sectional structure of the bionic friction-increasing and viscosity-reducing material micro-column unit of the spherical crown-shaped end-protruding straight column array of the present invention.

[0021] Figure 9 This is a square arrangement diagram of the microstructure of a common adhesive material without end protrusions of the present invention.

[0022] Figure 10 This is a circumferential arrangement diagram of a common adhesive material microstructure without end protrusions of the present invention.

[0023] Figure 11 This is a hexagonal close-packed arrangement diagram of the microstructure of a common adhesive material without end protrusions of the present invention.

[0024] Figure 12 This is a diagram showing the main geometric parameters of the microstructure of a common adhesive material with end protrusions according to the present invention; In the figure: r refers to the radius of the array unit, D refers to the spacing between the array units, and ρ refers to the curvature of the protrusion at the end of the array unit.

[0025] Figure 13 This is a distribution diagram of the arc curvature of a single microstructure surface of a common adhesive material microstructure with a protruding end according to the present invention.

[0026] Figure 14 Schematic diagram of the back connection layer structure of the present invention.

[0027] Figure 15 This is a test result of the friction performance of a common adhesive material without end protrusions of the present invention.

[0028] Figure 16 This is a graph showing the adhesion performance test results of a common adhesive material without end protrusions of the present invention.

[0029] In the figure: 101-execution base; 102-first execution swing arm; 103-second execution swing arm; 104-end execution swing arm; 105-friction-increasing and viscosity-reducing material; 201-driving motor; 202-limiting ring; 203-drag-reducing rotating plate; 204-execution boss; 205-connecting screw; 206-execution active disk; 207-execution passive disk; 208-elastic swing arm bracket; 209-elastic swing arm; 210-elastic swing arm limiting column; 211-elastic swing arm pull rod; 212-elastic rod spring; 213-tilt limiting extrusion panel; 214-pushing triangle block; 215-snapping triangle block; 301-straight column array; 302-support layer; 303-back connection layer. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-16 , and further illustrate the technical solution of the present invention through specific implementation methods.

[0031] The present invention provides a wafer handling device with friction-increasing and viscosity-reducing functions, including an end-effector for a semiconductor wafer handling robot arm, the end-effector including an execution base 101, a first execution swing arm 102 mounted on the execution base 101 via a joint motion mechanism, a second execution swing arm 103 mounted on the first execution swing arm 102 via a joint motion mechanism, an end-effector swing arm 104 mounted on the second execution swing arm 103 via a joint motion mechanism, a plurality of friction-increasing and viscosity-reducing components bonded to the end-effector swing arm 104 via a back connection layer 303. The friction-reducing and viscosity-reducing material 105 is composed of three parts: an end-protruding straight column array 301, a supporting layer 302, and a back connecting layer 303. The end-protruding straight column array 301 is fixed on the supporting layer 302, wherein the end protrusion of the straight column array 301 is spherical; wherein the joint movable mechanism includes a driving motor 201, a limiting ring 202, a drag-reducing rotating plate 203 and an execution boss 204, wherein the execution boss 204 is fixedly connected to the passive swing arm, wherein the driving motor 201 and the limiting ring 202 are fixedly connected to the active swing arm. The drive motor 201 and the restriction ring 202 in the joint mechanism at the connection between the actuator base 101 and the first actuator arm 102 are fixed to the actuator base 101, and the actuator boss 204 is fixed to the first actuator arm 102. The drive motor 201 and the restriction ring 202 in the joint mechanism at the connection between the first actuator arm 102 and the second actuator arm 103 are fixed to the first actuator arm 102, and the actuator boss 204 is fixed to the second actuator arm 103. The drive motor 201 and the restriction ring 202 in the joint mechanism at the connection between the second actuator arm 103 and the end actuator arm 104 are fixed to the second actuator arm 103, and the actuator boss 204 is fixed to the end actuator arm 104. The end protruding column array 301 and the support layer 302 are made of an elastomer such as silicone, rubber, or polyurethane. The end protruding column array 301 is arranged on the support layer 302 in a hexagonal close-packed pattern, a circularly equidistant pattern, or a rectangularly equidistant pattern. The ends of the straight column array 301 are spherical caps. The curvature of the cap varies with the diameter of the column, but the overall shape is spherical caps. The curvature of the caps, along the axis, has a curved profile with a specific radius of curvature. The curved profile is composed of curves of one or more different radii of curvature. The center-to-center distance between any two straight column units in the straight column array 301 is 1.20.5 to 2 times the inscribed circle of the straight column units. The cross-section of the straight columns is circular, hexagonal, or triangular.

[0032] The joint movable mechanism also includes an execution passive disk 207 rotatably installed in the limiting ring 202, and the execution passive disk 207 is fixedly connected to the execution boss 204 by a connecting screw 205. Two elastic swing arms 209 are symmetrically installed on the execution passive disk 207 through two elastic swing arm brackets 208. The middle parts of the two elastic swing arms 209 are movably installed with elastic swing arm pull rods 211. The two elastic swing arm pull rods 211 are fixed with pins at one end away from the elastic swing arm 209. The two pins are contacted with one side of the elastic swing arm 209 and are equipped with elastic rod springs 212. Both ends of the elastic rod spring 212 are provided with protrusions for contacting and cooperating with the pins. The middle part of the elastic rod spring 212 is fixedly matched with the execution passive disk 207. Two tilted limiting extrusion panels 213 are symmetrically fixedly mounted on the edge of the actuator passive disk 207. The two tilted limiting extrusion panels 213 are located to the sides of the elastic swing arm 209. A snap-in triangular block 215 is provided between the two tilted limiting extrusion panels 213 and the inner wall of the limiting ring 202. A push triangular block 214 is provided to the side of the snap-in triangular block 215. The push triangular block 214 is located between the tilted limiting extrusion panels 213 and the inner wall of the limiting ring 202. The two snap-in triangular blocks 215 and the two push triangular blocks 214 are symmetrically mounted on the actuator passive disk 207. The snap-in triangular blocks 215 have an arc-shaped surface on the side closest to the elastic swing arm 209, which is in sliding contact with the elastic swing arm 209. Furthermore, two elastic swing arm limiting posts 210 are fixedly mounted on the actuator passive disk 207 to limit the swing angle of the elastic swing arm 209. A gap is provided between the elastic swing arm limiting posts 210 and the elastic swing arm 209. The outer shell of the driving motor 201 and the limiting ring 202 are fixedly matched, and the inner wall of the limiting ring 202 is also rotatably mounted with an execution active disk 206 fixed to two pushing triangle blocks 214. The execution active disk 206 is fixed on the output shaft of the driving motor 201, the drag reduction rotating plate 203 is fixedly matched with the limiting ring 202, and the execution boss 204 and the execution passive disk 207 are rotationally matched with the drag reduction rotating plate 203.

[0033] The output shaft of the control drive motor 201 can drive the passive swing arm movement (wherein the passive swing arm refers to the first actuating swing arm 102 on the actuating base 101, the second actuating swing arm 103 on the first actuating swing arm 102, and the terminal actuating swing arm 104 on the second actuating swing arm 103). Specifically, the output shaft of the drive motor 201 drives the active actuating disk 206 to rotate, which in turn drives the push triangle block 214 to rotate. Since the two push triangle blocks 214 are symmetrically arranged, one of the push triangle blocks 214 will toggle the tilt limiting extrusion panel 213, which in turn drives the passive actuating disk 207 to rotate. The passive actuating disk 207 drives the actuating boss 204 to rotate via the connecting screw 205, and the actuating boss 204 drives the passive swing arm to rotate. In order to prevent the passive swing arm from swinging due to inertia or external force when the drive motor 201 stops, a snap-in triangle block 215 is set. Its purpose is that when the passive swing arm (such as the end execution swing arm 104) swings, the end execution swing arm 104 will drive the execution boss 204 to rotate (microscopic rotation, here refers to the movement trend), and the execution boss 204 drives the execution passive disk 207 to rotate through the connecting screw 205. The two symmetrical inclined limiting extrusion panels 213 on the execution passive disk 207 will push their corresponding snap-in triangle blocks 215 to rotate, because the elastic swing arm 209 set will push the snap-in triangle blocks 215 to rotate. Block 215 is pushed toward the direction of pushing triangular block 214 (the elastic swing arm 209 is pulled by the elastic swing arm pull rod 211, and the elastic swing arm pull rod 211 is pulled by the elastic rod spring 212, and the elastic rod spring 212 pulls the elastic swing arm 209 through the elastic swing arm pull rod 211 to swing toward the direction of the inserted triangular block 215). That is, when there is no movement, the inserted triangular block 215 will be subject to the force of the elastic swing arm 209 and move toward the narrow direction between the tilting limiting extrusion panel 213 and the limiting ring 202, and the tilting limiting extrusion panel 213 and the limiting ring 202 will squeeze the inserted triangular block 215.When the push triangle block 214 is used as the active moving component, the push triangle block 214 will move one of the inserted triangle blocks 215 toward the direction of the elastic swing arm limit column 210, and the other inserted triangle block 215 will be affected by the friction force of the limit ring 202 and will also move toward the direction of the elastic swing arm limit column 210. Therefore, the squeezing of the tilt limit extrusion panel 213 and the limit ring 202 on the inserted triangle block 215 will disappear. On the contrary, when the passive disk 207 (tilt limit extrusion panel 213) is most active, the push triangle block 214 is passive at this time because the two inserted triangle blocks 215 are symmetrically arranged. Regardless of the direction of rotation, one of the stuck triangles 215 will be moved away from the elastic swing arm limit column 210 by the friction of the restriction ring 202. At this time, the restriction ring 202 and the tilted restriction and extrusion panel 213 will squeeze the stuck triangle 215, thereby increasing the friction between them. The increased friction and extrusion will further increase the block, and the block will become stuck, forming a fixed relationship between the passive disk 207 and the restriction ring 202. Because the restriction ring 202 and the housing of the drive motor 201 are fixed, and the drive motor 201 and the restriction ring 202 are fixed to the active swing arm, the passive swing arm will not swing due to external forces and inertia, ensuring the stability of wafer handling.

[0034] The method for preparing the friction-increasing and viscosity-reducing material 105 is as follows: Method 1: 1. Fabricating a straight column array 301 with end protrusions: Step 1: Spin-coat an appropriate amount of photoresist on a glass substrate, use a mask to expose the photoresist under a photolithography machine, and after development, leave a straight column array 301 without end protrusions; Step 2: Place the glass substrate in an oven to melt the photoresist, so that the straight column array 301 forms a protrusion at the end; 2. Fabrication of a negative metal mold of a biomimetic material having an array of end-protruding columns 301: Step 1: Electroplating the column array 301 to form a metal layer at the structural gaps, and demolding to obtain a negative mold; 3. Making the bionic friction-increasing and viscosity-reducing material 105 of the straight column array 301 with raised ends: The polymer prepolymer is poured onto the metal negative mold, solidified and demoulded to obtain the desired material.

[0035] Method 2: Step 1: Using 3D printing technology, print a metal negative mold of a biomimetic material having an array of end-protruding straight columns 301; Step 2: pouring the polymer prepolymer onto the metal negative mold, curing and demoulding to obtain the desired material.

[0036] Method 3: Step 1: Using machining technology, drill out a metal negative mold of a straight column array 301 with end protrusions; Step 2: pouring the polymer prepolymer onto the metal negative mold, curing and demoulding to obtain the desired material.

[0037] The material of the bionic friction-increasing and viscosity-reducing 105 material is elastomer, and its structure is divided into three parts: an array of end-protruding straight columns 301, a supporting layer 302, and a back connection layer 303. Among them, the end protrusions of the straight column array 301 units are spherical crown-shaped. The spherical crown-shaped end protrusion bionic friction-increasing and viscosity-reducing material 105 of the straight column array 301 involved in the present invention, for smooth wafer surfaces, utilizes the excellent tribological properties of elastomers and, based on the van der Waals force mechanism, can increase the friction between the wafer handling robot finger and the wafer. At the same time, the shape of the protrusions at the end of the straight columns forms an edge-tearing separation behavior during normal desorption at the interface, and normal desorption can be achieved under extremely small desorption forces. When transporting a rough wafer surface, in addition to the van der Waals force mechanism at the contact interface, the spherical crown-shaped end protrusions of the straight column array 301 can contact the irregular depressions on the rough surface to form a mechanical interlocking mechanism. These two mechanisms work together to ensure the high friction performance of the material. It can meet a series of product needs for increasing friction and reducing viscosity, and is especially suitable for the lossless handling of wafers in the passive semiconductor field.

[0038] Use a universal tensile testing machine to test friction and adhesion performance. See the attached test results. Figure 7 、 Figure 8 .

[0039] Experimental data indicates that the biomimetic friction-increasing and viscosity-reducing material 105 with a spherical cap-shaped array of straight columns 301 with protruding end caps, as obtained in this embodiment, exhibits improved friction performance and stronger viscosity-reducing performance compared to a straight column array 301 without protruding end caps. A performance comparison experiment was conducted between the biomimetic friction-increasing and viscosity-reducing material 105 with a spherical cap-shaped array of straight columns provided by the present invention and a conventional adhesive material without protruding end caps. The experimental results demonstrate that the friction-increasing and viscosity-reducing material 105 produced by the present invention achieves greater tangential friction and less normal adhesion. The present design can meet the needs of a wide range of products requiring friction-increasing and viscosity-reducing performance.

Claims

1. A wafer handling device with friction-increasing and viscosity-reducing functions, comprising an end-effector for a semiconductor wafer handling robot arm, the end-effector comprising an execution base (101), a first execution swing arm (102) being mounted on the execution base (101) via a joint movable mechanism, a second execution swing arm (103) being mounted on the first execution swing arm (102) via a joint movable mechanism, and an end-effector swing arm (104) being mounted on the second execution swing arm (103) via a joint movable mechanism, characterized in that: A plurality of friction-increasing and viscosity-reducing materials (105) are adhered and mounted on the end execution swing arm (104) through a back connection layer (303). The friction-increasing and viscosity-reducing materials (105) are composed of three parts: an end protruding straight column array (301), a support layer (302), and a back connection layer (303). The end protruding straight column array (301) is fixed on the support layer (302), wherein the end protrusion of the straight column array (301) is in a spherical crown shape. The joint movable mechanism comprises a driving motor (201), a limiting ring (202), a drag-reducing rotating plate (203), and an execution boss (204); the execution boss (204) is fixedly connected to the passive swing arm, and the driving motor (201) and the limiting ring (202) are fixedly connected to the active swing arm.

2. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 1, characterized in that: The driving motor (201) and the limiting ring (202) in the joint mechanism at the connection between the execution base (101) and the first execution swing arm (102) are fixed to the execution base (101), and the execution boss (204) is fixed to the first execution swing arm (102); The driving motor (201) and the limiting ring (202) in the joint mechanism at the connection between the first execution swing arm (102) and the second execution swing arm (103) are fixed to the first execution swing arm (102), and the execution boss (204) is fixed to the second execution swing arm (103); The driving motor (201) and the limiting ring (202) in the joint mechanism at the connection between the second execution swing arm (103) and the end execution swing arm (104) are fixed to the second execution swing arm (103), and the execution boss (204) is fixed to the end execution swing arm (104).

3. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 2, characterized in that: The end raised column array (301) and the support layer (302) are made of an elastomer, which is silicone, rubber or polyurethane; The end raised column array (301) is arranged on the support layer (302) in a hexagonal close-packed arrangement, a circumferentially equidistant arrangement, or a rectangularly equidistant arrangement.

4. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 3, characterized in that: The end of the straight column array (301) is in the shape of a spherical crown, the curvature of which is adjusted through the process, and the whole presents a spherical crown shape, and the shape of the arc has a curved profile along the cross section of the axis.

5. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 4, characterized in that: The center distance between two straight column units in the straight column array (301) is 0.5 to 2 times the inscribed circle of the straight column unit, and the cross section of the straight column is circular, hexagonal or triangular.

6. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 5, characterized in that: The joint movable mechanism also includes an execution passive disk (207) rotatably mounted in the limiting ring (202), the execution passive disk (207) and the execution boss (204) are fixedly connected by connecting screws (205), and two elastic swing arms (209) are symmetrically mounted on the execution passive disk (207) through two elastic swing arm brackets (208), and the middle parts of the two elastic swing arms (209) are movably mounted with elastic swing arm pull rods (211), and the ends of the two elastic swing arm pull rods (211) away from the elastic swing arms (209) are fixed with pins, and the two pins are provided with elastic rod springs (212) on the side of the elastic swing arms (209) in contact, and protrusions are provided at both ends of the elastic rod spring (212) for contacting and cooperating with the pins, and the middle part of the elastic rod spring (212) is fixedly cooperating with the execution passive disk (207).

7. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 6, characterized in that: Two inclined limiting extrusion panels (213) are symmetrically fixedly installed at the edge of the execution passive disk (207). The two inclined limiting extrusion panels (213) are arranged at the side of the elastic swing arm (209). A snap-in triangle block (215) is provided in contact between the two inclined limiting extrusion panels (213) and the inner wall of the limiting ring (202). A push triangle block (214) is provided on the side of the snap-in triangle block (215). The push triangle block (214) is provided between the inclined limiting extrusion panel (213) and the inner wall of the limiting ring (202). The two snap-in triangle blocks (215) and the two push triangle blocks (214) are symmetrically arranged on the execution passive disk (207).

8. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 7, characterized in that: A side of the inserted triangular block (215) close to the elastic swing arm (209) is provided with an arc surface, and the arc surface is in contact and sliding cooperation with the elastic swing arm (209), and two elastic swing arm limiting columns (210) for limiting the swing angle of the elastic swing arm (209) are fixedly mounted on the passive disk (207), and a gap is provided between the elastic swing arm limiting columns (210) and the elastic swing arm (209).

9. The wafer handling device with friction-increasing and viscosity-reducing functions according to claim 8, characterized in that: The housing of the driving motor (201) and the limiting ring (202) are fixedly matched, and the inner wall of the limiting ring (202) is also rotatably mounted with an execution active disk (206) fixed to two pushing triangle blocks (214). The execution active disk (206) is fixed on the output shaft of the driving motor (201), the drag reduction rotating plate (203) is fixedly matched with the limiting ring (202), and the execution boss (204) and the execution passive disk (207) are rotationally matched with the drag reduction rotating plate (203).

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