Wafer-level vacuum bonding device and bonding method

Abstract

The invention relates to the technical field of wafer bonding, in particular to a wafer-level vacuum bonding device and method, and the device comprises a covering part and a bearing part which are matched with each other. The middle pressure applying piece is fixedly mounted on the side, facing the bearing piece, of the covering piece; the multiple deflection plate sets are arranged along the middle pressure applying piece in the circumferential direction at equal intervals, and second abutting wheels and third abutting wheels are arranged on the deflection plate sets; the elastic structure is connected with the deflection plate set, the middle pressing piece and the covering piece, and a first abutting wheel is connected to the elastic structure; the driving assembly is arranged on the covering piece, and the driving assembly can drive a follower arranged on the covering piece to move in the radial direction of the covering piece; and the follower can be sequentially matched with the second abutting wheel, the first abutting wheel and the third abutting wheel, so that the deflection plate group can gradually act on the wafers along the radial direction of the covering piece to eliminate bubbles between the bonded wafers.

Description

Technical Field

[0001] The present invention relates to a wafer bonding technology, in particular to a wafer-level vacuum bonding device and a bonding method. Background Art

[0002] Wafer vacuum bonding is a technology that bonds two wafers together in a vacuum environment. In a vacuum environment, the molecules or atoms on the wafer surface can contact and interact more closely, thereby forming a stronger bonding force.

[0003] Furthermore, during the vacuuming process, the bubbles between the two wafers will move toward the edge of the wafer under the action of negative pressure, thereby achieving a certain degree of bubble elimination. However, based on the edge effect, during the vacuuming process, the edge area of ​​the wafer is prone to local stress concentration due to its different physical and mechanical properties from the interior, resulting in the stress in this area being much greater than that in the internal area, thereby hindering the discharge of bubbles and affecting the quality of the product after wafer bonding. Summary of the Invention

[0004] The object of the present invention is to provide a wafer-level vacuum bonding device and bonding method to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions: A wafer-level vacuum bonding device comprises a cover member and a supporting member adapted to each other; Also includes: an intermediate pressure member, fixedly mounted on a side of the covering member facing the supporting member; A plurality of deflection plate groups are equidistantly arranged along the circumference of the intermediate pressure member, and a second abutment wheel and a third abutment wheel are provided on the deflection plate groups; an elastic structure connecting the deflection plate assembly, the intermediate pressure member and the covering member, wherein the elastic structure is connected to a first abutting wheel; a driving assembly, disposed on the cover member, capable of driving a follower disposed on the cover member to move in a radial direction of the cover member; The follower can cooperate with the second abutment wheel, the first abutment wheel and the third abutment wheel in sequence, so that the deflection plate group can gradually act on the wafer along the radial direction of the covering member.

[0006] As a further embodiment of the present invention, the deflection plate assembly includes a first pressure plate rotatably mounted on the intermediate pressure member and a second pressure plate disposed within the cover member, the second abutment wheel is rotatably connected to the first pressure plate, and the third abutment wheel is rotatably connected to the second pressure plate; An arc-shaped protrusion is provided on one end of the intermediate pressure member facing the first pressing plate and one end of the first pressing plate facing the second pressing plate, and the first pressing plate and the second pressing plate are adapted to the arc-shaped protrusion.

[0007] As a further solution of the present invention: the elastic structure includes a first cylindrical spring, a second cylindrical spring and a pulling kit fixedly mounted on the intermediate pressure piece, the end of the first cylindrical spring away from the intermediate pressure piece is fixedly connected to the first pressure plate, the pulling kit is rotatably connected to the second pressure plate, and the end of the second cylindrical spring away from the pulling kit is fixedly connected to the second pressure plate.

[0008] As a further embodiment of the present invention, the pulling assembly includes a connecting plate fixedly mounted on the covering member, a lifting member slidably mounted on the connecting plate, the lifting member being rotatably connected to the second pressing plate, and the lifting member and the connecting plate being connected via a third cylindrical spring; The first abutment wheel is rotatably connected to the lifting member.

[0009] As a further embodiment of the present invention, a sealing cover is provided on the covering member, and the driving assembly includes a second hydraulic cylinder fixedly mounted on the covering member and located in the sealing cover, a connecting member fixedly mounted on the second hydraulic cylinder, and a hinged rod rotatably mounted on the connecting member; The driving assembly also includes a plurality of first sliding grooves equidistantly arranged on the covering member, wherein a slider is slidably installed in the first sliding groove, and the end of the hinged rod away from the connecting member is rotatably connected to the slider, and the slider is connected to the follower.

[0010] As a further solution of the present invention: an inclined surface and a straight surface are formed on the follower, and the inclined surface can guide the first abutment wheel, the second abutment wheel and the third abutment wheel to move toward the straight surface.

[0011] As a further solution of the present invention: it also includes: A positioning assembly is provided on the supporting member, wherein the positioning assembly is provided with a plurality of convex shafts and the positioning assembly is capable of driving the plurality of convex shafts to move along the radial direction of the supporting member; The negative pressure component is connected to the sealing cover and is used to generate negative pressure inside the covering member and the supporting member when the covering member and the supporting member are covered.

[0012] As a further solution of the present invention: the positioning assembly includes a plurality of second sliding grooves arranged along the radial direction of the supporting member, and a coaxial wheel group is slidably installed in the second sliding groove; The positioning assembly also includes a rotating member rotatably mounted on the bottom of the supporting member, an electric telescopic rod is rotatably mounted on the supporting member, the other end of the electric telescopic rod is rotatably connected to the rotating member, an inclined groove is provided on the rotating member, and the coaxial wheel set can roll in the inclined groove.

[0013] As a further solution of the present invention: the negative pressure assembly includes a conducting member connected to the sealing cover, and the end of the conducting member away from the sealing cover is connected to a negative pressure generating device.

[0014] A method for bonding using the wafer-level vacuum bonding apparatus comprises the following steps: Step 1: Place the wafers to be bonded in the support and start the positioning assembly so that the two sets of wafers to be bonded can completely overlap; Step 2: The covering member moves toward the supporting member until the two members are covered and the middle pressure member acts on the wafer and stops moving; Step 3: The driving assembly is activated and acts on the second abutting wheel, the first abutting wheel, and the third abutting wheel in sequence, so that the deflection plate assembly acts on the wafer step by step along the radial direction of the cover member; Step 4: Use a negative pressure component to generate negative pressure in the cover and the support, and use the negative pressure to bond the wafers.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The deflection plate group is provided so that the middle pressure member, the first pressure plate, and the second pressure plate can act on the wafer in sequence, and has the effect of directional air bubble discharge, so that the air bubbles in the wafer can move toward the edge of the wafer and be discharged, thereby preventing the existence of air bubbles from affecting the product quality of the wafer after bonding; Through the elastic structure and driving assembly, when the second pressure plate is in action, the first pressure plate can be locked in a state of abutment with the wafer, thereby preventing the bubbles from moving toward the first pressure plate when the second pressure plate acts on the wafer, ensuring the stability of the directional movement of the bubbles and ensuring the stable discharge of the bubbles. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a schematic structural diagram of an embodiment of a wafer-level vacuum bonding device.

[0017] Figure 2 This is a schematic structural diagram from another angle of an embodiment of a wafer-level vacuum bonding device.

[0018] Figure 3 This is a schematic diagram of the structure of a wafer-level vacuum bonding device after the frame structure is removed in one embodiment.

[0019] Figure 4This is a schematic structural diagram from another angle of an embodiment of a wafer-level vacuum bonding device after the frame structure is removed.

[0020] Figure 5 This is a schematic structural diagram of a sealing cover in one embodiment of a wafer-level vacuum bonding device.

[0021] Figure 6 This is a schematic structural diagram of a sealing cover and a covering member in one embodiment of a wafer-level vacuum bonding device.

[0022] Figure 7 This is a schematic structural diagram of a deflection plate group and an elastic structure in one embodiment of a wafer-level vacuum bonding device.

[0023] Figure 8 This is a schematic structural diagram of a deflection plate assembly, an elastic structure, and a follower in one embodiment of a wafer-level vacuum bonding device.

[0024] Figure 9 This is a schematic diagram of the internal structure of a supporting component in an embodiment of a wafer-level vacuum bonding device.

[0025] Figure 10 This is a schematic structural diagram of a positioning component in an embodiment of a wafer-level vacuum bonding device.

[0026] In the figure: 1. frame structure; 2. first hydraulic cylinder; 3. covering member; 301. annular covering part; 302. first slide groove; 4. sealing cover; 5. second hydraulic cylinder; 6. connecting member; 7. hinged rod; 8. slider; 9. follower; 901. inclined surface; 902. flat surface; 10. intermediate pressure member; 11. first pressure plate; 12. second pressure plate; 13. first cylindrical spring; 14. second cylindrical spring; 15. connecting plate; 16. lifting member; 17. first abutting wheel; 18. third cylindrical spring; 19. second abutting wheel; 20. third abutting wheel; 21. supporting member; 2101. annular protrusion; 2102. second slide groove; 22. coaxial wheel group; 2201. convex shaft; 23. electric telescopic rod; 24. rotating member; 2401. inclined groove; 25. conducting member; 26. negative pressure generating device. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0029] See also Figures 1 to 10 In an embodiment of the present invention, a wafer-level vacuum bonding device includes a cover member 3 and a supporting member 21 that are adapted to each other, wherein the cover member 3 is provided with an annular cover portion 301, and the supporting member 21 is provided with an annular protrusion 2101, and the outer diameter of the annular protrusion 2101 is the same as the inner diameter of the annular cover portion 301, so that when the two are matched, a sealed chamber can be formed inside the cover member 3 and the supporting member 21, and at the same time, the annular cover portion 301 can move relative to the annular protrusion 2101, so that the intermediate pressure member 10 can still move relative to the wafer inside the supporting member 21 when a sealed chamber is formed inside the cover member 3 and the supporting member 21, thereby ensuring that the intermediate pressure member 10 can act on the wafer and expel bubbles in the middle of the wafer by squeezing.

[0030] It also includes: a frame structure 1, an intermediate pressure member 10, a deflection plate group, an elastic structure and a driving component, wherein the covering member 3 is connected to the first hydraulic cylinder 2 arranged on the frame structure 1.

[0031] The intermediate pressure member 10 is fixedly mounted on a side of the cover member 3 facing the supporting member 21; The deflection plate group is provided in multiple groups along the circumference of the intermediate pressure member 10 at equal intervals, and the deflection plate group is provided with a second abutment wheel 19 and a third abutment wheel 20; The deflection plate assembly includes a first pressure plate 11 rotatably mounted on the intermediate pressure member 10 and a second pressure plate 12 disposed within the cover member 3 , the second abutment wheel 19 being rotatably connected to the first pressure plate 11 , and the third abutment wheel 20 being rotatably connected to the second pressure plate 12 ; An arc-shaped protrusion is provided on one end of the intermediate pressure member 10 facing the first pressure plate 11 and one end of the first pressure plate 11 facing the second pressure plate 12 , and the first pressure plate 11 and the second pressure plate 12 are adapted to the arc-shaped protrusion.

[0032] In this embodiment, in the initial state, the wafer to be bonded is placed inside the supporting member 21, and then the first hydraulic cylinder 2 is controlled to move. At this time, the covering member 3 can move toward the supporting member 21, and when the annular covering portion 301 cooperates with the annular protrusion 2101 and the intermediate pressure member 10 acts on the wafer, the driving component can cooperate with the second abutting wheel 19 to deflect the first pressure plate 11 relative to the intermediate pressure member 10 to abut against the wafer. In this process, the bubbles squeezed out by the intermediate pressure member 10 can be acted upon by the first pressure plate 11, so that the bubbles continue to move along the wafer. The first pressure plate 11 moves in the radial direction toward the edge, and when the first pressure plate 11 is deflected to abut against the wafer, the driving component will drive the second pressure plate 12 to move, so that the end of the second pressure plate 12 connected to the elastic structure moves toward the wafer and abuts the wafer. Subsequently, the driving component can cooperate with the third abutting wheel 20 to drive the second pressure plate 12 to deflect to abut against the wafer, so that the bubbles squeezed out by the first pressure plate 11 continue to move in the radial direction of the wafer, so that the bubbles can be squeezed out from between the wafers, eliminating the influence of the bubbles on the quality of the wafer after bonding.

[0033] It should be noted that, in the initial state, there is a predetermined angle θ between the first pressure plate 11 and the intermediate pressure member 10, and the first pressure plate 11 is tilted upward compared to the intermediate pressure member 10, and there is also a predetermined angle θ between the second pressure plate 12 and the first pressure plate 11, and the second pressure plate 12 is tilted upward compared to the first pressure plate 11. This arrangement enables the intermediate pressure member 10 to act preferentially on the wafer when the cover 3 moves toward the supporting member 21 to squeeze out the bubbles in the middle of the wafer, and then during the deflection of the first pressure plate 11, the wafer can be subjected to the directional force of the first pressure plate 11 along the radial direction of the wafer, so that the bubbles can gradually move toward the edge of the wafer during the deflection of the first pressure plate 11, and when the first pressure plate 11 is completely in contact with the wafer, the second pressure plate 12 still maintains an angle θ with the wafer diameter, so that when the second pressure plate 12 moves to abut against the wafer and deflects, it can continue to drive out the bubbles squeezed out by the first pressure plate 11, thereby ensuring that the bubbles can be discharged from the edge of the wafer.

[0034] It should be noted that since an arc-shaped protrusion is provided on one end of the intermediate pressure member 10 facing the first pressure plate 11 and one end of the first pressure plate 11 facing the second pressure plate 12, the first pressure plate 11 and the second pressure plate 12 are adapted to the arc-shaped protrusion, so that when the intermediate pressure member 10, the first pressure plate 11 and the second pressure plate 12 are in contact with the wafer, there will be no gap between the two adjacent ones, and no bubbles will remain due to the existence of the gap.

[0035] Based on the above settings, the intermediate pressure member 10, the first pressure plate 11, and the second pressure plate 12 can act on the wafer in sequence, and have the effect of directional discharge of bubbles, so that the bubbles in the wafer can move toward the edge of the wafer and be discharged, thereby preventing the presence of bubbles from affecting the product quality of the wafer after bonding.

[0036] See also Figure 8 The elastic structure connects the deflection plate group, the intermediate pressure member 10 and the covering member 3, and the elastic structure is connected to the first abutting wheel 17; The elastic structure includes a first cylindrical spring 13, a second cylindrical spring 14 and a pulling kit fixedly mounted on the intermediate pressure member 10, wherein the end of the first cylindrical spring 13 away from the intermediate pressure member 10 is fixedly connected to the first pressure plate 11, the pulling kit is rotatably connected to the second pressure plate 12, and the end of the second cylindrical spring 14 away from the pulling kit is fixedly connected to the second pressure plate 12, wherein the pulling kit includes a connecting plate 15 fixedly mounted on the covering member 3, a lifting member 16 is slidably mounted on the connecting plate 15, the lifting member 16 is rotatably connected to the second pressure plate 12, and the lifting member 16 and the connecting plate 15 are connected via a third cylindrical spring 18; The first abutment wheel 17 is rotatably connected to the lifting member 16 .

[0037] In the initial state, the first cylindrical spring 13, the second cylindrical spring 14 and the third cylindrical spring 18 are all in a stretched state, wherein the first cylindrical spring 13 and the second cylindrical spring 14 can maintain a predetermined angle θ between the first pressure plate 11 and the intermediate pressure member 10, and between the second pressure plate 12 and the first pressure plate 11, thereby ensuring the position stability of the first pressure plate 11 and the second pressure plate 12 in the initial state.

[0038] Specifically, a stop position is formed at the position where the first pressure plate 11 is rotatably connected to the intermediate pressure piece 10. The stop position can ensure that the first pressure plate 11 can stop rotating when it deflects upward to a predetermined angle θ relative to the intermediate pressure piece 10. At this time, the first cylindrical spring 13, which is in a stretched state in the initial state, can stabilize the position of the first pressure plate 11. The same applies to the second pressure plate 12.

[0039] See also Figure 5~Figure 6 、 Figure 8 The cover 3 is provided with a sealing cover 4, and the driving assembly is provided on the cover 3. The driving assembly can drive a follower 9 provided on the cover 3 to move along the radial direction of the cover 3. The driving assembly includes a second hydraulic cylinder 5 fixedly mounted on the cover 3 and located in the sealing cover 4. A connecting member 6 is fixedly mounted on the second hydraulic cylinder 5, and a hinged rod 7 is rotatably mounted on the connecting member 6; The driving assembly also includes a plurality of first sliding grooves 302 equidistantly arranged on the covering member 3 in a circumferential manner, wherein a slider 8 is slidably installed in the first sliding groove 302 , and the end of the hinged rod 7 away from the connecting member 6 is rotatably connected to the slider 8 , and the slider 8 is connected to the follower 9 .

[0040] When the middle pressure member 10 abuts against the wafer, the second hydraulic cylinder 5 will be activated, and its telescopic shaft can be retracted, thereby driving the connecting member 6 to move downward. At this time, the connecting member 6 drives the slider 8 to move along the length direction of the first slide groove 302 through the hinged rod 7, so that the follower 9 can cooperate with the second abutment wheel 19, the first abutment wheel 17 and the third abutment wheel 20 to realize the deflection of the first pressure plate 11 and the descent and deflection of the second pressure plate 12, thereby realizing the discharge of bubbles inside the wafer.

[0041] Furthermore, when the connecting member 6 moves, it can drive multiple groups of followers 9 to move synchronously through the hinged rod 7, and make the first pressure plate 11 and the second pressure plate 12 arranged in a circle move synchronously, so that the bubbles inside the wafer can diverge from the middle of the wafer in a circular shape toward the outside. Compared with the method of eliminating bubbles by rolling, on the one hand, it can ensure the integrity of the action surface, and on the other hand, it can avoid the bubbles being squeezed and the movement path being too long, resulting in incomplete extrusion.

[0042] The follower 9 can cooperate with the second abutment wheel 19, the first abutment wheel 17 and the third abutment wheel 20 in sequence, so that the deflection plate assembly can gradually act on the wafer along the radial direction of the cover 3; An inclined surface 901 and a straight surface 902 are formed on the follower 9 . The inclined surface 901 can guide the first abutting wheel 17 , the second abutting wheel 19 and the third abutting wheel 20 to move toward the straight surface 902 .

[0043] When the slider 8 moves along the length direction of the first slide groove 302, the follower 9 moves synchronously. During this process, the inclined surface 901 on the follower 9 can cooperate with the second abutment wheel 19, the first abutment wheel 17 and the third abutment wheel 20 in sequence, thereby driving the first pressure plate 11 and the second pressure plate 12 to move. Specifically: When the inclined surface 901 cooperates with the second abutment wheel 19, the inclined surface 901 can act on the second abutment wheel 19 to deflect the second abutment wheel 19 and the first pressure plate 11 relative to the intermediate pressure member 10. When the second abutment wheel 19 moves to the flat surface 902, the first pressure plate 11 and the wafer are in a completely fitted state. Then the follower 9 continues to move, so that the second abutment wheel 19 keeps rolling and abutting with the flat surface 902 while the first abutment wheel 17 can cooperate with the inclined surface 901. During this process, the first abutment wheel 17 can drive the second pressure plate 12 toward the wafer through the lifting member 16. When the first abutment wheel 17 moves to the flat surface 902, one end of the second pressure plate 12 abuts against the wafer. At this time, the end of the second pressure plate 12 is in contact with the end of the first pressure plate 11. The arc-shaped protrusion cooperates to lock the first pressure plate 11 in this state, so that when the follower 9 continues to move and separates from the second abutment wheel 19, the first pressure plate 11 can still maintain the abutment state with the wafer. Thereafter, the inclined surface 901 cooperates with the third abutment wheel 20 to realize the deflection of the second pressure plate 12. Based on the above arrangement, firstly, during the movement of the follower 9, the first pressure plate 11 and the second pressure plate 12 can move in sequence, thereby realizing the directional discharge of bubbles in the wafer. Secondly, when the second pressure plate 12 moves, the first pressure plate 11 can be locked in the abutment state with the wafer, thereby preventing the bubbles from moving toward the direction of the first pressure plate 11 when the second pressure plate 12 acts on the wafer, thereby ensuring the stability of the directional movement of the bubbles and ensuring the stable discharge of the bubbles.

[0044] See also Figure 3 、 Figures 9 and 10 The wafer-level vacuum bonding device also includes: a positioning component and a negative pressure component.

[0045] The positioning assembly is disposed on the supporting member 21 and is provided with a plurality of cams 2201. The positioning assembly is capable of driving the plurality of cams 2201 to move in the radial direction of the supporting member 21. The positioning assembly includes a plurality of second slide grooves 2102 disposed in the radial direction of the supporting member 21. The coaxial wheel groups 22 are slidably mounted in the second slide grooves 2102. The positioning assembly also includes a rotating member 24 rotatably mounted on the bottom of the supporting member 21, an electric telescopic rod 23 is rotatably mounted on the supporting member 21, the other end of the electric telescopic rod 23 is rotatably connected to the rotating member 24, and an inclined groove 2401 is provided on the rotating member 24, and the coaxial wheel group 22 can roll in the inclined groove 2401.

[0046] When the wafers to be bonded are placed on the supporting member 21, the electric telescopic rod 23 is controlled to move, which can drive the rotating member 24 to rotate. During this process, with the cooperation of the inclined groove 2401 and the second slide groove 2102, the coaxial wheel group 22 can drive the convex shaft 2201 to move along the length direction of the second slide groove 2102, thereby realizing the positioning of the wafers and ensuring the coaxiality between the two groups of wafers to be bonded. After the positioning is completed, the coaxial wheel group 22 can move in the opposite direction to reset the convex shaft 2201, so as to avoid interference between the convex shaft 2201 and the first pressure plate 11 and the second pressure plate 12 when squeezing out the bubbles inside the wafers.

[0047] See also Figures 2 to 4 The negative pressure component is connected to the sealing cover 4 and is used to generate negative pressure inside the covering member 3 and the supporting member 21 when they are covered. The negative pressure component includes a conductive member 25 connected to the sealing cover 4, and the end of the conductive member 25 away from the sealing cover 4 is connected to a negative pressure generating device 26.

[0048] After the middle pressure member 10, the first pressure plate 11 and the second pressure plate 12 complete the bubble extrusion operation, the negative pressure generating device 26 vacuums the inside of the cover member 3 and the supporting member 21. After vacuuming, the wafer surface can fit better during the bonding process, so that physical forces such as van der Waals force and electrostatic force and chemical bonding force can fully play their role, thereby enhancing the bonding strength.

[0049] As an embodiment of the present invention, a method for performing bonding using the wafer-level vacuum bonding apparatus as described above is also proposed, comprising the following steps: Step 1: Place the wafers to be bonded in the support 21 and start the positioning assembly so that the two groups of wafers to be bonded can completely overlap; Step 2: The covering member 3 moves toward the supporting member 21 until the two are covered and the middle pressure member 10 acts on the wafer and stops moving; Step 3: The driving assembly is activated and acts on the second abutting wheel 19, the first abutting wheel 17 and the third abutting wheel 20 in sequence, so that the deflection plate assembly acts on the wafer gradually along the radial direction of the cover 3; Step 4: Use a negative pressure assembly to generate negative pressure inside the cover 3 and the support 21, and use the negative pressure to bond the wafers.

[0050] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0051] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A wafer-level vacuum bonding device, comprising a cover member and a supporting member adapted to each other; It is characterized in that Also includes: an intermediate pressure member, fixedly mounted on a side of the covering member facing the supporting member; A plurality of deflection plate groups are equidistantly arranged along the circumference of the intermediate pressure member, and a second abutment wheel and a third abutment wheel are provided on the deflection plate groups; an elastic structure connecting the deflection plate assembly, the intermediate pressure member and the covering member, wherein the elastic structure is connected to a first abutting wheel; a driving assembly, disposed on the cover member, capable of driving a follower disposed on the cover member to move in a radial direction of the cover member; The follower can cooperate with the second abutment wheel, the first abutment wheel and the third abutment wheel in sequence, so that the deflection plate group can gradually act on the wafer along the radial direction of the covering member.

2. The wafer-level vacuum bonding device according to claim 1, wherein: The deflection plate assembly includes a first pressure plate rotatably mounted on the intermediate pressure member and a second pressure plate disposed in the cover member, the second abutment wheel is rotatably connected to the first pressure plate, and the third abutment wheel is rotatably connected to the second pressure plate; An arc-shaped protrusion is provided on one end of the intermediate pressure member facing the first pressing plate and one end of the first pressing plate facing the second pressing plate, and the first pressing plate and the second pressing plate are adapted to the arc-shaped protrusion.

3. The wafer-level vacuum bonding device according to claim 2, wherein: The elastic structure includes a first cylindrical spring, a second cylindrical spring and a pulling kit fixedly mounted on the intermediate pressure piece, the end of the first cylindrical spring away from the intermediate pressure piece is fixedly connected to the first pressure plate, the pulling kit is rotatably connected to the second pressure plate, and the end of the second cylindrical spring away from the pulling kit is fixedly connected to the second pressure plate.

4. The wafer-level vacuum bonding device according to claim 3, wherein: The pulling kit includes a connecting plate fixedly mounted on the covering member, a lifting member slidably mounted on the connecting plate, the lifting member being rotatably connected to the second pressing plate, and the lifting member and the connecting plate being connected via a third cylindrical spring; The first abutment wheel is rotatably connected to the lifting member.

5. The wafer-level vacuum bonding device according to claim 1, wherein: The cover is provided with a sealing cover, the driving assembly includes a second hydraulic cylinder fixedly mounted on the cover and located in the sealing cover, the second hydraulic cylinder is fixedly mounted with a connecting piece, and the connecting piece is rotatably mounted with a hinged rod; The driving assembly also includes a plurality of first sliding grooves equidistantly arranged on the covering member, wherein a slider is slidably installed in the first sliding groove, and the end of the hinged rod away from the connecting member is rotatably connected to the slider, and the slider is connected to the follower.

6. The wafer-level vacuum bonding device according to claim 1, wherein: An inclined surface and a straight surface are formed on the follower, and the inclined surface can guide the first abutting wheel, the second abutting wheel and the third abutting wheel to move toward the straight surface.

7. The wafer-level vacuum bonding device according to claim 5, characterized in that: Also includes: A positioning assembly is provided on the supporting member, wherein the positioning assembly is provided with a plurality of convex shafts and the positioning assembly is capable of driving the plurality of convex shafts to move along the radial direction of the supporting member; The negative pressure component is connected to the sealing cover and is used to generate negative pressure inside the covering member and the supporting member when the covering member and the supporting member are covered.

8. The wafer-level vacuum bonding device according to claim 7, characterized in that: The positioning assembly includes a plurality of second sliding grooves arranged along the radial direction of the supporting member, and a coaxial wheel group is slidably installed in the second sliding groove; The positioning assembly also includes a rotating member rotatably mounted on the bottom of the supporting member, an electric telescopic rod is rotatably mounted on the supporting member, the other end of the electric telescopic rod is rotatably connected to the rotating member, an inclined groove is provided on the rotating member, and the coaxial wheel set can roll in the inclined groove.

9. The wafer-level vacuum bonding device according to claim 7, characterized in that: The negative pressure component includes a conducting piece communicated with the sealing cover, and one end of the conducting piece away from the sealing cover is connected to a negative pressure generating device.

10. A method for bonding using the wafer-level vacuum bonding apparatus according to any one of claims 7 to 9, characterized in that: The following steps are involved: Step 1: Place the wafers to be bonded in the support and start the positioning assembly so that the two sets of wafers to be bonded can completely overlap; Step 2: The covering member moves toward the supporting member until the two members are covered and the middle pressure member acts on the wafer and stops moving; Step 3: The driving assembly is activated and acts on the second abutting wheel, the first abutting wheel, and the third abutting wheel in sequence, so that the deflection plate assembly acts on the wafer step by step along the radial direction of the cover member; Step 4: Use a negative pressure component to generate negative pressure in the cover and the support, and use the negative pressure to bond the wafers.

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