High power inverter valve block module and inverter

Abstract

The present application relates to the field of converter, and discloses a kind of high-power converter valve group module and converter, high-power converter valve group module includes: base;IGCT assembly unit, including the IGCT assembly and drive assembly adjacent along first direction;Anti-parallel diode assembly unit, with IGCT assembly along second direction adjacent;Clamp diode assembly unit, with anti-parallel diode assembly unit in first direction adjacent;Absorption assembly unit, with clamp diode assembly unit in first direction adjacent;Composite clamp busbar assembly, be arranged in the side of clamp diode assembly unit away from IGCT assembly unit;Composite parallel busbar assembly, be arranged in the side of IGCT assembly away from drive assembly;Cooling assembly, be arranged in the side of absorption assembly unit away from clamp diode assembly unit.The present application can improve unit space utilization for modular design, and can obtain high current sharing effect under the repeated frequency drive control.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of converter, in particular to a high-power converter valve group module and a converter. BACKGROUND

[0002] In the related art, the converter is an electrical device that changes the voltage, frequency, phase number and other electrical quantities or characteristics of the power supply. The converter is usually composed of multiple bridge arms. The single bridge arm structure is complex and large in size, resulting in a large space occupation of the converter and a low power density per unit space, which is not conducive to assembly and disassembly maintenance. At the same time, in the related art application, there is no application case of directly parallel connection of high-power IGCT to expand the current-carrying capacity under repetitive frequency drive control. SUMMARY

[0003] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present application is to propose a high-power converter valve group module, which has a relatively compact structure, a high power density per unit space, and can reduce the volume and energy density of the converter. This design is also conducive to achieving the application goal of directly parallel connection of high-power IGCT to expand the current-carrying capacity under repetitive frequency drive control.

[0004] The present application also aims to propose a converter to apply the above-mentioned high-power converter valve group module.

[0005] According to an embodiment of the present application, a high-power converter valve group module comprises: a base; an IGCT assembly unit comprising an IGCT assembly and a drive assembly detachably arranged on the base, the IGCT assembly and the drive assembly being adjacent along a first direction; an anti-parallel diode assembly unit detachably arranged on the base and adjacent to the IGCT assembly along a second direction; a clamping diode assembly unit detachably arranged on the base and adjacent to the anti-parallel diode assembly unit in the first direction and adjacent to the drive assembly in the second direction; an absorption assembly unit adjacent to the clamping diode assembly unit in the first direction and adjacent to the drive assembly in the second direction, wherein the second direction is perpendicular to the first direction; a composite clamping busbar assembly arranged on a side of the clamping diode assembly unit and the anti-parallel diode assembly unit away from the IGCT assembly unit; a composite parallel busbar assembly arranged on a side of the IGCT assembly away from the drive assembly and a side of the anti-parallel diode assembly unit away from the clamping diode assembly unit; and a cooling assembly arranged on a side of the absorption assembly unit away from the clamping diode assembly unit and a side of the drive assembly away from the IGCT assembly.

[0006] According to the high-power converter valve group module, the IGCT component unit, the anti-parallel diode component unit, the clamping diode component unit, the absorption component unit, the composite clamping busbar component, the composite parallel busbar component and the cooling component are modularly designed, are arranged compactly on the base, can reduce the volume of the high-power converter valve group module, improve the unit space utilization, facilitate the assembly and disassembly and maintenance of the high-power converter valve group module, and are favorable for expanding the current-carrying capacity, meanwhile, the compact structure design of the application is favorable for improving the high-current effect of the high-power IGCT parallel application of the converter valve device under the repeated frequency driving control.

[0007] In some embodiments of the application, the IGCT component includes a plurality of IGCT elements and a plurality of first heat sinks, the plurality of IGCT elements are arranged along a third direction, and any two adjacent IGCT elements are pressed by the first heat sink; the driving component includes a plurality of drivers, the plurality of drivers are arranged along the third direction and correspond to the plurality of IGCT elements, and each IGCT element is connected to the corresponding driver along the first direction, wherein the third direction, the second direction and the first direction are perpendicular to each other.

[0008] In some embodiments of the application, the IGCT component further includes a first upper pressing plate, a first lower pressing plate, a first connecting column, a first receiving piece and a first insulating block, the first upper pressing plate and the first lower pressing plate are arranged at intervals along the third direction and are detachably connected by the first connecting column, the first lower pressing plate is detachably arranged on the base, the plurality of IGCT elements and the plurality of first heat sinks are arranged between the first upper pressing plate and the first lower pressing plate, the IGCT elements at both ends of the third direction are pressed by the first heat sink and have the first receiving piece, and at least one group of adjacent two IGCT elements is provided with a first insulating block; the driving component further includes a bottom plate, a top plate, a fixing column, a power supply box and a transformer, the bottom plate is detachably arranged on the base and is arranged at intervals with the top plate along the third direction, the top plate is connected to the bottom plate by the fixing column, the power supply box is arranged on the top plate, the transformer is arranged on the bottom plate, and the plurality of drivers are arranged on the fixing column.

[0009] In some embodiments of the application, the plurality of IGCT elements are configured as two groups, i.e., a first group and a second group, the first group and the second group each include a plurality of IGCT elements electrically connected in series, the first group and the second group are electrically connected in parallel, and the IGCT elements of the first group and the IGCT elements of the second group are staggered arranged along the third direction.

[0010] In some embodiments of the present application, the anti-parallel diode assembly unit comprises a plurality of anti-parallel diodes and a plurality of second heat sinks, the plurality of anti-parallel diodes are arranged along the third direction, and any two adjacent anti-parallel diodes are crimped by the second heat sink.

[0011] In some embodiments of the present application, the anti-parallel diode assembly unit further comprises a second upper pressing plate, a second lower pressing plate, a second connecting column, a second receiving member, and a second insulating block, the second upper pressing plate and the second lower pressing plate are arranged along the third direction and are detachably connected by the second connecting column, the second lower pressing plate is detachably arranged on the base, the plurality of anti-parallel diodes and the plurality of second heat sinks are arranged between the second upper pressing plate and the second lower pressing plate, the anti-parallel diodes at both ends of the third direction are crimped by the second heat sink and the second receiving member, and at least one group of adjacent anti-parallel diodes is provided with a second insulating block.

[0012] In some embodiments of the present application, the clamping diode assembly unit comprises a clamping diode, a freewheeling diode, a first absorption resistor, and a third heat sink, the clamping diode and the third heat sink are both a plurality of, the plurality of clamping diodes, the freewheeling diode, and the first absorption resistor are arranged along the third direction in sequence, and any two adjacent components are crimped by the third heat sink.

[0013] In some embodiments of the present application, the clamping diode assembly unit comprises a third upper pressing plate, a third lower pressing plate, a third connecting column, a third insulating block, and a third receiving member, the third upper pressing plate and the third lower pressing plate are arranged along the third direction and are detachably connected by the third connecting column, the third lower pressing plate is detachably arranged on the base, the clamping diode, the freewheeling diode, and the first absorption resistor are arranged between the third upper pressing plate and the third lower pressing plate, one of the plurality of clamping diodes close to the third upper pressing plate is crimped by the third heat sink and the third receiving member, the first absorption resistor is crimped by the third heat sink and another third receiving member, and at least one group of adjacent clamping diodes is provided with a third insulating block.

[0014] In some embodiments of the present application, the absorption assembly unit comprises a second absorption resistor and an absorption capacitor, the absorption capacitor is a plurality of and is arranged along the third direction, and the absorption capacitor is closer to the base than the second absorption resistor.

[0015] In some embodiments of the present application, the cooling assembly comprises an inlet manifold, an outlet manifold and a plurality of branch pipes, the inlet manifold and the outlet manifold extend along the third direction and are spaced apart in the second direction, each of the branch pipes communicates the inlet manifold and the outlet manifold to form a cooling branch, and the first radiator, the second radiator and the third radiator are arranged in series on at least one of the cooling branches.

[0016] In some embodiments of the present application, the high-power converter valve group module comprises a first isolation plate and a second isolation plate, the first isolation plate is an insulating member and is arranged on a side of the composite parallel busbar assembly away from the IGCT assembly and the anti-parallel diode assembly unit, and the second isolation plate is arranged on a side of the cooling assembly away from the absorption assembly unit and the driving assembly.

[0017] According to the converter provided by the embodiment of the present application, the high-power converter valve group module is used to reduce the size of the bridge arm, thereby reducing the volume of the whole device, and the high-power converter valve group module can realize modular design, facilitating the assembly or disassembly of the bridge arm, thereby facilitating the assembly, disassembly or maintenance of the converter.

[0018] According to the converter provided by the embodiment of the present application, the high-power converter valve group module is used to reduce the size of the bridge arm, thereby reducing the volume of the whole device, and the high-power converter valve group module can realize modular design, facilitating the assembly or disassembly of the bridge arm, thereby facilitating the assembly, disassembly or maintenance of the converter.

[0019] Additional aspects and advantages of the present application will be made apparent by the following description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 is a perspective structural schematic view of the high-power converter valve group module provided by some embodiments of the present application, viewed from the angle of the composite clamping busbar assembly;

[0022] Figure 2 is a perspective structural schematic view of the high-power converter valve group module provided by some embodiments of the present application, viewed from the angle of the clamping diode assembly unit;

[0023] Figure 3 is a perspective structural schematic view of the high-power converter valve group module provided by some embodiments of the present application, viewed from the angle of the IGCT assembly unit;

[0024] Figure 4is a three-dimensional structural schematic view of a high-power converter valve group module provided by some embodiments of the present application, viewed from the angle of an IGCT component unit and a composite parallel busbar assembly;

[0025] Figure 5 is a structural schematic view of the cooperation of a driving assembly and a partial cooling assembly provided by some embodiments of the present application;

[0026] Figure 6 is a cooling loop schematic view between a cooling assembly, an IGCT component, an anti-parallel unit and an anode clamping unit provided by some embodiments of the present application;

[0027] Figure 7 is a three-dimensional structural schematic view of a bridge arm provided by some embodiments of the present application.

[0028] Reference signs:

[0029] 100, high-power converter valve group module;

[0030] 10, base;

[0031] 20, IGCT component unit;

[0032] 21, IGCT component;

[0033] 211, first upper pressing plate; 212, first lower pressing plate; 213, first connecting column; 214, first heat sink; 215, first insulating block; 216, first receiving member; 217, IGCT component;

[0034] 22, driving assembly;

[0035] 221, power supply box; 222, transformer; 223, driver; 224, bottom plate; 225, top plate; 226, fixing column;

[0036] 30, anti-parallel diode component unit;

[0037] 31, second upper pressing plate; 32, second lower pressing plate; 33, second connecting column; 34, second heat sink; 35, second insulating block; 36, second receiving member; 37, anti-parallel diode;

[0038] 40, clamping diode component unit;

[0039] 41, third upper pressing plate; 42, third lower pressing plate; 43, third connecting column; 44, third heat sink; 45, third insulating block; 46, third receiving member; 47, clamping diode; 48, freewheeling diode; 49, first absorption resistor;

[0040] 50, absorption component unit; 51, second absorption resistor; 52, absorption capacitor;

[0041] 70, composite type clamping busbar assembly; 80, composite type parallel busbar assembly;

[0042] 90, cooling assembly;

[0043] 91, inlet manifold; 911, first extension pipe; 92, outlet manifold; 921, second extension pipe; 93, branch pipe;

[0044] 110, first isolation plate; 120, second isolation plate;

[0045] 200, bridge arm. DETAILED DESCRIPTION

[0046] The embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components have the same or similar designations and functions throughout. The embodiments described below are examples in which the present application is applied, and are intended to explain the present application, and are not to be understood as limiting the present application.

[0047] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0048] In addition, the features defined as "first", "second" can explicitly or implicitly include one or more of the features, for distinguishing the description of the features, without order, without light and heavy.

[0049] In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified.

[0050] In the description of the present application, it needs to be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] The following will be described with reference to Figures 1-7, describes a high-power converter valve group module 100 according to an embodiment of the present application.

[0052] As shown in Figures 1 to 3 , a high-power converter valve group module 100 according to an embodiment of the present application includes a base 10, an IGCT assembly unit 20, an anti-parallel diode assembly unit 30, a clamping diode assembly unit 40, an absorption assembly unit 50, a composite clamping busbar assembly 70, a composite parallel busbar assembly 80, and a cooling assembly 90. The IGCT assembly unit 20 includes an IGCT assembly 21 and a drive assembly 22 detachably provided on the base 10, and the IGCT assembly 21 and the drive assembly 22 are adjacent in a first direction. The anti-parallel diode assembly unit 30 is detachably provided on the base 10 and is adjacent to the IGCT assembly 21 in a second direction. The clamping diode assembly unit 40 is detachably provided on the base 10 and is adjacent to the anti-parallel diode assembly unit 30 in the first direction and is adjacent to the drive assembly 22 in the second direction. The absorption assembly unit 50 is adjacent to the clamping diode assembly unit 40 in the first direction and is adjacent to the drive assembly 22 in the second direction, wherein the second direction is perpendicular to the first direction. The composite clamping busbar assembly 70 is provided on a side of the clamping diode assembly unit 40 and the anti-parallel diode assembly unit 30 away from the IGCT assembly unit 20. The composite parallel busbar assembly 80 is provided on a side of the IGCT assembly 21 away from the drive assembly 22 and a side of the anti-parallel diode assembly unit 30 away from the clamping diode assembly unit 40. The cooling assembly 90 is provided on a side of the absorption assembly unit 50 away from the clamping diode assembly unit 40 and a side of the drive assembly 22 away from the IGCT assembly 21.

[0053] In the above technical solution, the IGCT assembly unit 20, the anti-parallel diode assembly unit 30, and the clamping diode assembly unit 40 are all modular structures, which are convenient to detachably install on the base 10, and the IGCT assembly unit 20, the anti-parallel diode assembly unit 30, and the clamping diode assembly unit 40 adopt the above arrangement in the first direction and the second direction, which can improve the compactness of the overall structure, reduce the volume, and the absorption assembly unit 50 is arranged in the space between the clamping diode assembly unit 40 and the drive assembly 22, thereby further improving the compactness of the entire valve group. For the convenience of understanding, as an example, referring to Figures 1 to 3 , the first direction can be the left-right direction, and the second direction can be the front-back direction.

[0054] The composite clamping busbar assembly 70 can be a busbar structure formed by encapsulating all components together by glue. This busbar structure is more compact and smaller in size. The composite clamping busbar assembly 70 is arranged on the side of the clamping diode assembly unit 40 away from the IGCT assembly unit 20. In this way, the distance between the composite clamping busbar assembly 70 and the clamping diode assembly unit 40 can be reduced, the electrical connection between the composite clamping busbar assembly 70 and the clamping diode assembly unit 40 is facilitated, the size of the composite clamping busbar assembly 70 is reduced, and the cost is reduced.

[0055] The composite parallel busbar assembly 80 can be a busbar structure formed by encapsulating all components together by glue. This busbar structure is more compact and smaller in size. The composite parallel busbar assembly 80 is arranged on the side of the IGCT assembly 21 away from the drive assembly 22, and on the side of the antiparallel diode assembly unit 30 away from the clamping diode assembly unit 40. The cooling assembly 90 is adjacent to the absorption assembly unit 50 and the drive assembly 22, and faces the composite parallel busbar assembly 80. In this way, the composite parallel busbar assembly 80 is away from the cooling assembly 90, which can reduce the risk of short circuit caused by leakage of the cooling medium, and can reduce the interference of the cooling assembly 90 on the composite parallel busbar assembly 80, facilitating the connection of the overall high-power converter valve group module 100 to another high-power converter valve group module 100 through the composite parallel busbar assembly 80. It can be understood that the high-power converter valve group module 100 with the above structure can form a long rectangular or square large modular structure, which is convenient for assembling multiple high-power converter valve group modules 100 to form a converter.

[0056] It should be noted that the present application is an improvement on the layout of the components of the high-power converter valve group module 100. The functions and electrical connection relationships of the IGCT assembly 21, the drive assembly 22, the antiparallel diode assembly unit 30, the clamping diode assembly unit 40, the absorption assembly unit 50, the composite clamping busbar assembly 70, and the composite parallel busbar assembly 80 are known to those skilled in the art, and will not be described here.

[0057] Secondly, the IGCT assembly 21, the drive assembly 22, the antiparallel diode assembly unit 30, and the clamping diode assembly unit 40 are detachably connected to the base 10. In this way, any one of the IGCT assembly 21, the drive assembly 22, the antiparallel diode assembly unit 30, and the clamping diode assembly unit 40 can be detachable from the base 10, which facilitates the disassembly and maintenance of a certain component or unit, and reduces the cost of use when a certain component is damaged.

[0058] According to the high-power converter valve group module 100 of the embodiment of the present application, the IGCT component unit 20, the anti-parallel diode component unit 30, the clamping diode component unit 40, the absorption component unit 50, the composite clamping busbar component 70, the composite parallel busbar component 80 and the cooling component 90 are modular designs, and are arranged compactly on the base 10, so that the volume of the high-power converter valve group module 100 can be reduced, the unit space utilization rate is improved, and the assembly and disassembly and maintenance of the high-power converter valve group module 100 are facilitated. In addition, the high-power converter valve group module 100 with the above distribution structure is more compact in distribution between components, especially in distribution of electrical elements, so that the power density of the entire high-power converter valve group module 100 can be increased.

[0059] In some embodiments of the present application, the IGCT component 21 and the driving component 22 are detachably connected at the ends away from the base 10. The IGCT component 21 and the driving component 22 are detachably connected to the base 10, and on this basis, the ends away from the base 10 of the IGCT component 21 and the driving component 22, that is, the top of the IGCT component 21 and the driving component 22, are detachably connected, so that the fixing firmness of the IGCT component 21 and the driving component 22 to the base 10 is improved, and the installation reliability of the IGCT component 21 and the driving component 22 to the base 10 is further improved.

[0060] In some embodiments of the present application, as shown in Figure 3 and Figure 4 , the IGCT component 21 includes a plurality of IGCT elements 217 and a plurality of first heat sinks 214, the plurality of IGCT elements 217 are arranged along a third direction, and any two adjacent IGCT elements 217 are pressed by the first heat sink 214; the driving component 22 includes a plurality of drivers 223, the plurality of drivers 223 are arranged along the third direction and correspond to the plurality of IGCT elements 217, and each IGCT element 217 is connected to the corresponding driver 223 along a first direction, wherein the third direction, the second direction and the first direction are perpendicular to each other.

[0061] For the convenience of understanding, as an example, referring to Figure 3 and Figure 4 , the third direction can be the up-down direction.

[0062] The first heat sink 214 can be a component capable of dissipating heat, for example, but not limited to, a cold plate, a cold tube, a heat dissipation fin, and the like. In the above-mentioned solution, the first heat sink 214 can cool and dissipate heat from both ends of each IGCT component 217, thereby improving heat dissipation efficiency. The function, structure, and connection relationship with other components of the IGCT component 217 are known to those skilled in the art, and thus will not be described here. The number of IGCT components 217 can be selected as needed to meet different current-carrying capacity requirements. Alternatively, referring to Figure 3 、 Figure 4 and Figure 5 , the IGCT component 217 can be four.

[0063] The driver 223 can be a component capable of driving the IGCT component 217 to work. It should be noted that the structure, function, and connection relationship with the IGCT assembly 21 or other components of the driver 223 are known to those skilled in the art, and thus will not be described here.

[0064] In the above-mentioned technical solution, the plurality of IGCT components 217 and the first heat sink 214 are arranged along the third direction, so that the IGCT assembly 21 can be a module extending along the third direction, and the overall structure is more compact, thereby reducing the volume. Similarly, the plurality of drivers 223 are arranged along the third direction, so that the driving assembly 22 is also a module extending along the third direction, and the structure of the driving assembly 22 is more compact, thereby reducing the volume.

[0065] In some embodiments of the present application, as shown in Figure 3 and Figure 4 , the IGCT assembly 21 further comprises a first upper pressing plate 211, a first lower pressing plate 212, a first connecting column 213, a first receiving member 216, and a first insulating block 215. The first upper pressing plate 211 and the first lower pressing plate 212 are arranged at intervals along the third direction and are detachably connected through the first connecting column 213. The first lower pressing plate 212 is detachably arranged on the base 10. The plurality of IGCT components 217 and the plurality of first heat sinks 214 are arranged on the first upper pressing plate 211 and the first lower pressing plate 212. The IGCT components 217 at both ends in the third direction are pressed by the first heat sink 214 and have the first receiving member 216. At least one group of two adjacent IGCT components 217 has the first insulating block 215.

[0066] It can be understood that the first heat sink 214 is arranged at both ends of the third direction of each IGCT component 217 in the above structure, so that the heat dissipation and cooling capacity of each IGCT component 217 can be improved, and the first heat sink 214 at the lower end is connected to the first lower pressing plate 212 through the first receiving member 216, and the first heat sink 214 at the upper end is connected to the first upper pressing plate 211 through the first receiving member 216. That is, the first upper pressing plate 211, the first lower pressing plate 212, the first connecting column 213, and the first receiving member 216 can fix the plurality of IGCT components 217 as a whole to form a modular IGCT assembly 21, so that the overall structure of the IGCT assembly 21 is more compact, and the overall structure is more reliable, which can ensure the installation firmness of each component, reduce the risk of damage caused by loosening or separation of a certain component, and improve the reliability of installation or disassembly of the base 10.

[0067] The first insulation block 215 can refer to a component that can play an insulating role, and the number of the first insulation block 215 can be set as needed. Any two adjacent IGCT components 217 can be isolated by the first insulation block 215, or part of the two adjacent IGCT components 217 can be isolated by the first insulation block 215. For example, referring to Figure 3 and Figure 4 , the IGCT components 217 can be four, and the two in the middle are isolated by the first insulation block 215.

[0068] Optionally, the first upper pressing plate 211 and the first lower pressing plate 212 can be, but are not limited to, a thin plate, a sheet metal part, or a block-shaped component with a large thickness, and the like. Optionally, the first connecting column 213 can be, but is not limited to, a pin column, a double-headed stud, and the like. For example, when the first connecting column 213 is a double-headed stud, it is convenient to detachably connect the first upper pressing plate 211 and the first lower pressing plate 212.

[0069] In some embodiments of the present application, as shown in Figure 3 and Figure 4 , the drive assembly 22 includes a bottom plate 224, a top plate 225, a fixing column 226, a power supply box 221, and a transformer 222. The bottom plate 224 is detachably arranged on the base 10 and is spaced apart from the top plate 225 along the third direction. The top plate 225 is connected to the bottom plate 224 through the fixing column 226. The power supply box 221 is arranged on the top plate 225, the transformer 222 is arranged on the bottom plate 224, and a plurality of drivers 223 are arranged on the fixing column 226.

[0070] The power box 221, the transformer 222 and the plurality of drivers 223 can be fixed as a whole through the bottom plate 224, the top plate 225 and the fixing column 226 to form the modularized driving assembly 22, so that the driving assembly 22 has a more compact and reliable structure, the mounting firmness of each component can be ensured, the risk of damage caused by loosening or disengagement of a certain component can be reduced, and the reliability of mounting or dismounting on the base 10 can be improved.

[0071] It should be noted that the structure, function and connection relationship with the IGCT assembly 21 or other components of the power box 221 and the transformer 222 mentioned above are known to those skilled in the art, and will not be described here.

[0072] Optionally, the bottom plate 224 and the top plate 225 can be, but are not limited to, a thin plate, a sheet metal part or a block-shaped component with a large thickness, etc. Optionally, the fixing column 226 can be, but is not limited to, a pin column, a double-headed stud, etc. For example, when the fixing column 226 is a double-headed stud, it is convenient to detachably connect with the bottom plate 224 and the top plate 225.

[0073] In some embodiments of the present application, as shown in Figure 3 and Figure 4 The first upper pressing plate 211 and the top plate 225 are detachably connected. Optionally, the connection mode between the first upper pressing plate 211 and the top plate 225 can be, but is not limited to, bolt connection, clamping or riveting, etc.

[0074] In some embodiments of the present application, the plurality of IGCT components 217 are configured as two groups, i.e., a first group and a second group, the first group and the second group each include a plurality of IGCT components 217 in series electrical connection, the first group and the second group are in parallel electrical connection, and the IGCT components 217 of the first group and the IGCT components 217 of the second group are staggered arranged along the third direction.

[0075] The number of IGCT components 217 can be four, the four IGCT components 217 are sequentially arranged along the third direction and can be respectively a first IGCT component, a second IGCT component, a third IGCT component and a fourth IGCT component, wherein the first IGCT component and the second IGCT component are in series electrical relationship, the first IGCT component and the third IGCT component are in direct parallel electrical relationship, and the second IGCT component and the fourth IGCT component are in direct parallel electrical relationship.

[0076] In the application of the IGCT under the repeated frequency driving control in the related art, the multiple IGCTs are not directly connected in parallel to expand the current passing capacity, and the technical solution can further expand the current passing capacity of the whole high-power converter valve group module 100 by adopting the direct parallel connection and the series connection of the multiple IGCT components 217 and the compact design of the whole high-power converter valve group module 100, which is beneficial to the application of the multiple IGCTs directly connected in parallel to improve the current passing capacity and the current sharing effect under the repeated frequency driving.

[0077] In some embodiments of the present application, as shown in Figure 2 The anti-parallel diode assembly unit 30 includes multiple anti-parallel diodes 37 and multiple second heat sinks 34, the multiple anti-parallel diodes 37 are arranged along the third direction, and any two adjacent anti-parallel diodes 37 are crimped by the second heat sink 34.

[0078] The second heat sink 34 can be a component that can play a role in heat dissipation, for example, but not limited to, a cold plate, a cold tube, a heat dissipation fin, etc. Among them, the function, composition and connection relationship with other components of the anti-parallel diode 37 are known to those skilled in the art, which will not be repeated here.

[0079] It can be understood that the multiple anti-parallel diodes 37 and the multiple second heat sinks 34 are arranged along the third direction, so that the anti-parallel diode assembly unit 30 can be a module extending along the third direction, and the overall structure is more compact, which can reduce the volume.

[0080] In some embodiments of the present application, as shown in Figure 2 The anti-parallel diode assembly unit 30 further includes a second upper pressing plate 31, a second lower pressing plate 32, a second connecting column 33, a second receiving member 36 and a second insulating block 35, the second upper pressing plate 31 and the second lower pressing plate 32 are arranged at intervals along the third direction and are detachably connected by the second connecting column 33, the second lower pressing plate 32 is detachably arranged on the base 10, the multiple anti-parallel diodes 37 and the multiple second heat sinks 34 are arranged between the second upper pressing plate 31 and the second lower pressing plate 32, the anti-parallel diodes 37 at both ends of the third direction are crimped with the second receiving member 36 through the second heat sink 34, and the second insulating block 35 is arranged between at least one group of two adjacent anti-parallel diodes 37.

[0081] The second insulating block 35 can be a component that can play a role in insulation, and the number of the second insulating block 35 can be set as needed. Among them, any two adjacent anti-parallel diodes 37 can be isolated by the second insulating block 35, or part of the two adjacent anti-parallel diodes 37 are isolated by the second insulating block 35. For example, referring to Figure 2The anti-parallel diodes 37 can be four, and the two in the middle are separated by the second insulating block 35.

[0082] It can be understood that the second heat sink 34 is arranged at both ends of the third direction of each anti-parallel diode 37 in the above structure, so that the heat dissipation and cooling capacity of each anti-parallel diode 37 can be improved, and the second heat sink 34 at the lower end is connected to the first lower pressing plate 212 through the second receiving member 36, and the second heat sink 34 at the upper end is connected to the first upper pressing plate 211 through the second receiving member 36. That is, the second upper pressing plate 31, the second lower pressing plate 32, the second connecting column 33, and the second receiving member 36 can fix the plurality of anti-parallel diodes 37 as a whole to form a modular anti-parallel diode assembly unit 30, so that the overall structure of the anti-parallel diode assembly unit 30 is more compact, and the overall structure is more reliable, which can ensure the installation firmness of each component, reduce the risk of damage caused by loosening or separation of a certain component, and improve the reliability of installation or disassembly of the base 10.

[0083] Optionally, the second upper pressing plate 31 and the second lower pressing plate 32 can be, but are not limited to, a thin plate, a sheet metal part, or a block-shaped part with a large thickness, etc. Optionally, the second connecting column 33 can be, but is not limited to, a pin column, a double-headed stud, etc. For example, when the second connecting column 33 is a double-headed stud, it is convenient to detachably connect the second upper pressing plate 31 and the second lower pressing plate 32.

[0084] In some embodiments of the present application, as shown in Figure 2 The clamping diode assembly unit 40 includes clamping diodes 47, freewheeling diodes 48, first absorption resistors 49, and third heat sinks 44. The clamping diodes 47 and the third heat sinks 44 are multiple. The plurality of clamping diodes 47, the freewheeling diodes 48, and the first absorption resistors 49 are arranged in sequence along the third direction, and any two adjacent components are pressed by the third heat sink 44.

[0085] The third heat sink 44 can be a component that can play a role in heat dissipation, for example, but is not limited to, a cold plate, a cold tube, a heat dissipation fin, etc. In the above scheme, the third heat sink 44 can cool and dissipate heat from both ends of each IGCT component 217, thereby improving the heat dissipation efficiency. The functions, structures, and connection relationships with other components of the clamping diode 47, the freewheeling diode 48, and the first absorption resistor 49 are known to those skilled in the art, and will not be described here. The number of clamping diodes 47 can be selected as needed to meet different current capacity requirements. Optionally, referring to Figure 2 The clamping diode 47 can be two.

[0086] Any two adjacent components are crimped by the third heat sink 44, which can be understood as any two adjacent ones of the plurality of clamping diodes 47 are crimped by the third heat sink 44, the freewheeling diode 48 and the adjacent clamping diode 47 are crimped by the third heat sink 44, and the freewheeling diode 48 and the first absorption resistor 49 are crimped by the third heat sink 44.

[0087] In the above technical solution, the plurality of clamping diodes 47, the freewheeling diode 48 and the first absorption resistor 49 are arranged in the third direction in sequence, so that the clamping diode assembly unit 40 can be a module extending in the third direction, and the overall structure is more compact, and the volume can be reduced. Secondly, by crimping the plurality of clamping diodes 47, the freewheeling diode 48 and the first absorption resistor 49 together to form the clamping diode assembly unit 40, the freewheeling diode 48 and the first absorption resistor 49 can be modularly assembled together with the clamping diode 47, the overall structure is more compact, and the freewheeling diode 48 and the first absorption resistor 49 can be more reasonably arranged to save space.

[0088] In some embodiments of the present application, as shown in Figure 2 The clamping diode assembly unit 40 further includes a third upper pressing plate 41, a third lower pressing plate 42, a third connecting column 43, a third receiving member 46 and a third insulating block 45. The third upper pressing plate 41 and the third lower pressing plate 42 are arranged at intervals in the third direction and are detachably connected by the third connecting column 43. The third lower pressing plate 42 is detachably arranged on the base 10. The clamping diode 47, the freewheeling diode 48 and the first absorption resistor 49 are arranged between the third upper pressing plate 41 and the third lower pressing plate 42. One of the plurality of clamping diodes 47 close to the third upper pressing plate 41 is crimped with the third receiving member 46 by the third heat sink 44. The first absorption resistor 49 is crimped with another third receiving member 46 by the third heat sink 44. At least one group of adjacent two clamping diodes 47 is provided with the third insulating block 45.

[0089] The third insulating block 45 can be a component that can play an insulating role. The number of the third insulating block 45 can be set as required. Any two adjacent clamping diodes 47 can be isolated by the third insulating block 45, or part of the adjacent two clamping diodes 47 are isolated by the third insulating block 45. For example, referring to Figure 2 The clamping diode 47 can be four, and the two in the middle are isolated by the third insulating block 45. Alternatively, the third upper pressing plate 41 and the third lower pressing plate 42 can be, but are not limited to, a thin plate, a sheet metal part or a block-shaped component with a large thickness, etc. Alternatively, the third connecting column 43 can be, but is not limited to, a pin column, a double-headed stud, etc. For example, when the third connecting column 43 is a double-headed stud, it is convenient to detachably connect the third upper pressing plate 41 and the third lower pressing plate 42.

[0090] In the above technical solution, the third heat sink 44 is arranged at the two ends of the third direction of each clamping diode 47 in the above structure, so that the heat dissipation and cooling capacity of each clamping diode 47 can be improved, and the third heat sink 44 at the lower end is connected to the third lower pressing plate 42 through the third receiving member 46, and the third heat sink 44 at the upper end is connected to the third upper pressing plate 41 through the third receiving member 46. That is, the third upper pressing plate 41, the third lower pressing plate 42, the third connecting column 43, and the third receiving member 46 can fix the plurality of clamping diodes 47 as a whole to form a modular clamping diode assembly unit 40, so that the overall structure of the clamping diode assembly unit 40 is more compact, and the overall structure is more reliable, which can ensure the installation firmness of each component, reduce the risk of damage caused by loosening or separation of a certain component, and improve the reliability of installation or disassembly of the base 10.

[0091] In some embodiments of the present application, as shown in Figure 1 The absorption assembly unit 50 includes a second absorption resistor 51 and an absorption capacitor 52, the absorption capacitor 52 is multiple and arranged along the third direction, and the absorption capacitor 52 is closer to the base 10 than the second absorption resistor 51.

[0092] It can be understood that the above scheme can make the structure of the absorption assembly unit 50 more compact, and can reduce the size of the absorption assembly unit 50, thereby making the high-power inverter valve group module 100 more compact and smaller in size, and facilitating assembly.

[0093] In some embodiments of the present application, the second absorption resistor 51 is arranged on the side of at least one absorption capacitor 52 close to the clamping diode assembly unit 40. In this way, the arrangement of the second absorption resistor 51 and the absorption capacitor 52 is more compact, which is beneficial to save space and reduce the volume of the high-power inverter valve group module 100. For example, as shown in Figure 1 The absorption capacitor 52 is three, of which two absorption capacitors 52 are larger in size and arranged close to the base 10, and the other absorption capacitor 52 is smaller in size and away from the base 10, and the second absorption resistor 51 and the smaller size absorption capacitor 52 are arranged in the first direction.

[0094] Alternatively, as shown in Figure 1 The absorption assembly unit 50 can include a plurality of absorption capacitors 52, and the plurality of absorption capacitors 52 can be a first capacitor, a second capacitor, and a third capacitor, the first capacitor and the second capacitor are arranged close to the base 10, and the third capacitor is arranged on the upper side of the second capacitor and along the first direction with the first absorption resistor 49. The above structure can improve the compactness of the arrangement of the absorption assembly unit 50.

[0095] In some embodiments of the present application, as shown in Figures 2 to 4As shown, the cooling assembly 90 includes an inlet manifold 91 and an outlet manifold 92 extending along the third direction and spaced apart in the second direction, and a plurality of branch pipes 93 communicating the inlet manifold 91 and the outlet manifold 92 to form cooling branches, wherein the first heat sink 214, the second heat sink 34 and the third heat sink 44 are arranged in series on at least one cooling branch.

[0096] The inlet manifold 91 is configured to introduce the cooling medium, and the outlet manifold 92 is configured to output the cooled cooling medium. The branch pipes 93 can be provided in plurality and form a plurality of cooling branches with the inlet manifold 91 and the outlet manifold 92. The cooling medium can be, but is not limited to, a liquid, a gas, etc. For example, the liquid can be a non-conductive liquid. Optionally, the first heat sink 214, the second heat sink 34 and the third heat sink 44 can be internal heat sinks allowing the flow of the medium.

[0097] Each cooling branch can be in series with at least one first heat sink 214, or each cooling branch can be in series with at least one second heat sink 34, or each cooling branch can be in series with at least one third heat sink 44. Alternatively, each cooling branch can be in series with at least two of the first heat sink 214, the second heat sink 34 and the third heat sink 44.

[0098] For example, the plurality of branch pipes 93 communicate the inlet manifold 91 and the outlet manifold 92 to form a plurality of cooling branches, and the plurality of cooling branches can be divided into three groups, a first group of cooling branches equal in number to the first heat sinks 214 and one-to-one corresponding, each cooling branch in series with one first heat sink 214 (see Figure 5 ), a second group of cooling branches equal in number to the second heat sinks 34 and one-to-one corresponding, each cooling branch in series with one second heat sink 34, and a third group of cooling branches equal in number to the third heat sinks 44 and one-to-one corresponding, each cooling branch in series with one third heat sink 44.

[0099] Referring to Figure 6The plurality of cooling branches can also be divided into two groups, the number of cooling branches in the first group is equal to the number of the first heat sinks 214 and one-to-one corresponding, the number of the first heat sinks 214 is equal to the number of the second heat sinks 34, and each cooling branch is connected with one first heat sink 214 and one second heat sink 34 in series. The number of cooling branches in the second group is less than the number of the third heat sinks 44, and each cooling branch is connected with at least two third heat sinks 44 in series. In this technical solution, the cooling assembly 90 can cooperate with the first heat sink 214 to dissipate heat from both sides of the IGCT component 217, and cooperate with the second heat sink 34 to dissipate heat from both sides of the anti-parallel diode 37, and at the same time, the parallel heat dissipation layout can also be realized, and the cooling assembly 90 can cooperate with the third heat sink 44 to dissipate heat from both sides of the clamping diode 47, that is, the above-mentioned scheme can improve the heat dissipation efficiency, make the tube temperature uniformly distributed, and the flow of the cooling medium is relatively small.

[0100] In the above technical solution, the IGCT assembly 21, the anti-parallel diode assembly unit 30 and the clamping diode assembly unit 40 can be cooled and dissipated by heat by using the above-mentioned cooling assembly 90, and the arrangement of the cooling assembly 90 in the high-power converter valve group module 100 can be more compact, which is beneficial to reduce the volume of the high-power converter valve group module 100 and improve the structural compactness.

[0101] In some embodiments of the present application, as shown in Figures 2 to 4 The inlet manifold 91 is provided with a first extension pipe 911, and the outlet manifold 92 is provided with a second extension pipe 921. The second extension pipe 921 and the first extension pipe 911 are arranged at intervals in the third direction, and the pipe openings of the second extension pipe 921 and the first extension pipe 911 are both away from the composite clamping busbar assembly 70.

[0102] In the above technical solution, the first extension pipe 911 and the second extension pipe 921 make the interfaces of the inlet manifold 91 and the outlet manifold 92 located on the same side and away from the composite clamping busbar assembly 70. In this way, on the one hand, it is convenient for the inlet and outlet of the cooling medium, and on the other hand, it can also reduce the influence of the cooling medium on the composite clamping busbar assembly 70 and reduce the risk of short circuit. Moreover, the above-mentioned way of arranging the inlet manifold 91, the first extension pipe 911, the outlet manifold 92 and the second extension pipe 921 next to the drive assembly 22 can reduce the size of the high-power converter valve group module 100 in the first direction, so that the structure of the high-power converter valve group module 100 is more compact.

[0103] In some embodiments of the present application, as shown in Figure 1As shown, the composite clamping busbar assembly 70 and the absorbing assembly unit 50 are arranged in the first direction. In this way, the composite clamping busbar assembly 70 is away from the absorbing assembly unit 50 and close to the clamping diode assembly unit 40, which can reduce the distance between the composite clamping busbar assembly 70 and the clamping diode assembly unit 40, and further reduce the size of the composite clamping busbar assembly 70, thereby saving materials, reducing costs, and also reducing weight, facilitating assembly or disassembly of the high-power converter valve group module 100.

[0104] In some embodiments of the present application, as shown in Figure 1 The high-power converter valve group module 100 includes a first isolation plate 110 and a second isolation plate 120. The first isolation plate 110 is an insulating member and is arranged on the side of the composite parallel busbar assembly 80 away from the IGCT assembly 21 and the anti-parallel diode assembly unit 30. The second isolation plate 120 is arranged on the side of the cooling assembly 90 away from the absorbing assembly unit 50 and the driving assembly 22.

[0105] In the above technical solution, the first isolation plate 110 can play an insulating role, reducing the risk of short circuit between two high-power converter valve group modules 100 and improving the reliability of the high-power converter valve group module 100. The second isolation plate 120 can play a protective role on the cooling assembly 90, reducing the probability of damage to the cooling assembly 90 during handling or assembly.

[0106] As shown in Figure 7 According to an embodiment of the present application, a converter includes at least one bridge arm 200, and the bridge arm 200 includes at least two high-power converter valve group modules 100 as any of the above embodiments.

[0107] The converter can refer to an electrical device that changes the voltage, frequency, phase number and other electrical quantities or characteristics of a power supply system. Other configurations and operations of the converter are known to those skilled in the art, and will not be described in detail here.

[0108] According to the converter of the embodiment of the present application, the high-power converter valve group module 100 can reduce the size of the bridge arm 200, and further reduce the size of the entire device. Moreover, the high-power converter valve group module 100 can realize modular design, facilitating assembly or disassembly of the bridge arm 200, and further facilitating assembly, disassembly or maintenance of the converter.

[0109] In the description of the specification, the description of the terms "some embodiments", "optionally", "further", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are contained in at least one embodiment or example of the present application. In the specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0110] Although embodiments of the present application have been shown and described, it would be appreciated by those skilled in the art that changes, modifications, alternatives and variations to these embodiments could be made without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A high-power converter valve group module, characterized in that, include: Base; An IGCT assembly unit includes an IGCT assembly and a drive assembly detachably mounted on the base, the IGCT assembly and the drive assembly being adjacent to each other along a first direction; An anti-parallel diode assembly unit is detachably mounted on the base and is adjacent to the IGCT assembly along the second direction; A clamping diode assembly unit is detachably mounted on the base and is adjacent to the anti-parallel diode assembly unit in the first direction and to the driving assembly in the second direction; An absorption component unit is adjacent to the clamping diode component unit in the first direction and to the driving component in the second direction, wherein the second direction is perpendicular to the first direction; A composite clamping busbar assembly is disposed on the side of the clamping diode assembly unit and the anti-parallel diode assembly unit that is away from the IGCT assembly unit; A composite parallel busbar assembly is located on the side of the IGCT assembly away from the drive assembly, and on the side of the anti-parallel diode assembly unit away from the clamping diode assembly unit; A cooling assembly is provided on the side of the absorption assembly unit away from the clamping diode assembly unit, and on the side of the drive assembly away from the IGCT assembly.

2. The high-power converter valve group module according to claim 1, characterized in that, The IGCT assembly includes multiple IGCT components and multiple first heat sinks. The multiple IGCT components are arranged along a third direction, and any two adjacent IGCT components are pressed together through the first heat sink. The driving component includes multiple drivers, which are arranged along the third direction and correspond to multiple IGCT components. Each IGCT component is connected to its corresponding driver along the first direction, wherein the third direction, the second direction, and the first direction are perpendicular to each other.

3. The high-power converter valve group module according to claim 2, characterized in that, The IGCT assembly further includes a first upper pressure plate, a first lower pressure plate, a first connecting post, a first receiving member, and a first insulating block. The first upper pressure plate and the first lower pressure plate are spaced apart along the third direction and are detachably connected by the first connecting post. The first lower pressure plate is detachably mounted on the base. A plurality of IGCT components and a plurality of first heat sinks are disposed between the first upper pressure plate and the first lower pressure plate. The IGCT components located at both ends of the third direction are pressed onto the first receiving member by the first heat sink. At least one set of two adjacent IGCT components is provided with a first insulating block. The drive assembly also includes a base plate, a top plate, a fixing column, a power supply box, and a transformer. The base plate is detachably mounted on the base and is spaced apart from the top plate along the third direction. The top plate is connected to the base plate through the fixing column. The power supply box is mounted on the top plate, the transformer is mounted on the base plate, and multiple drivers are mounted on the fixing column.

4. The high-power converter valve group module according to claim 2 or 3, characterized in that, The plurality of IGCT components are configured into two groups, namely a first group and a second group. Each of the first group and the second group includes a plurality of IGCT components connected in series. The first group and the second group are connected in parallel. The IGCT components of the first group and the IGCT components of the second group are arranged alternately along the third direction.

5. The high-power converter valve group module according to claim 2, characterized in that, The anti-parallel diode assembly unit includes multiple anti-parallel diodes and multiple second heat sinks. The multiple anti-parallel diodes are arranged along the third direction, and any two adjacent anti-parallel diodes are pressed together through the second heat sinks.

6. The high-power converter valve group module according to claim 5, characterized in that, The anti-parallel diode assembly unit further includes a second upper pressure plate, a second lower pressure plate, a second connecting post, a second receiving member, and a second insulating block. The second upper pressure plate and the second lower pressure plate are spaced apart along the third direction and are detachably connected by the second connecting post. The second lower pressure plate is detachably mounted on the base. A plurality of anti-parallel diodes and a plurality of second heat sinks are disposed between the second upper pressure plate and the second lower pressure plate. The anti-parallel diodes located at both ends of the third direction are pressed against the second receiving member by the second heat sink. At least one set of two adjacent anti-parallel diodes is provided with a second insulating block.

7. The high-power converter valve group module according to claim 5, characterized in that, The clamping diode assembly unit includes a clamping diode, a freewheeling diode, a first absorption resistor, and a third heat sink. There are multiple clamping diodes and multiple third heat sinks. The multiple clamping diodes, the freewheeling diodes, and the first absorption resistor are arranged sequentially along the third direction, and any two adjacent components are pressed together through the third heat sink.

8. The high-power converter valve group module according to claim 7, characterized in that, The clamping diode assembly unit includes: a third upper pressure plate, a third lower pressure plate, a third connecting post, a third insulating block, and a third receiving member. The third upper pressure plate and the third lower pressure plate are spaced apart along a third direction and are detachably connected by the third connecting post. The third lower pressure plate is detachably mounted on the base. The clamping diode, the freewheeling diode, and the first absorption resistor are disposed between the third upper pressure plate and the third lower pressure plate. One of the plurality of clamping diodes, the one closest to the third upper pressure plate, is press-fitted to the third receiving member through the third heat sink. The first absorption resistor is press-fitted to another third receiving member through the third heat sink. At least one set of two adjacent clamping diodes is provided with a third insulating block.

9. The high-power converter valve group module according to claim 7, characterized in that, The absorption component unit includes a second absorption resistor and an absorption capacitor. There are multiple absorption capacitors arranged along the third direction, and the absorption capacitors are closer to the base than the second absorption resistor.

10. The high-power converter valve group module according to claim 7, characterized in that, The cooling assembly includes an inlet manifold, an outlet manifold, and multiple branch pipes. The inlet manifold and the outlet manifold extend along the third direction and are spaced apart in the second direction. Each branch pipe connects the inlet manifold and the outlet manifold to form a cooling branch. The first radiator, the second radiator, and the third radiator are connected in series on at least one of the cooling branches.

11. The high-power converter valve group module according to claim 1, characterized in that, The high-power converter valve group module includes a first isolation plate and a second isolation plate. The first isolation plate is an insulating component and is located on the side of the composite parallel busbar assembly away from the IGCT assembly and the anti-parallel diode assembly unit. The second isolation plate is located on the side of the cooling assembly away from the absorption assembly unit and the drive assembly.

12. A converter, characterized in that, It includes at least one bridge arm, said bridge arm comprising at least two high-power converter valve group modules as claimed in any one of claims 1 to 11.

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