Solar panel and control module integrated patch and patch method thereof

Abstract

The invention relates to the field of solar photovoltaic patches, and provides a solar panel and control module integrated patch and a patch method thereof, and the solar panel and control module integrated patch comprises a PCB, a solar power generation module, a prefabricated circuit, a via hole busbar, a bonding pad, a positioning hole, an energy storage control module, a load control module, a solar cell patch positioning chamfer and a patch process method. The device provided by the invention solves the problems of material cost and labor cost of an existing solar patch product, and the problem of saving the internal space of a system.

Description

Technical Field

[0001] The present invention relates to the field of solar photovoltaic patches, and provides a solar panel and control module integrated patch and a patch method thereof. The front side is a solar power generation module for power generation, and the back side is a system control module. The product is automatically mounted using the SMT patch process technology. Background Art

[0002] Currently, photovoltaic products include small and lightweight patch products. These products typically use single- or double-layer PCBs, with solar cell patches attached to their front surfaces via SMT packaging technology. This creates a semi-finished solar patch, which is then laminated to complete the patch product.

[0003] In actual applications, this type of solar product only functions as a power generation module and requires an additional electronic control system module to achieve the desired effect. This additional electronic control system module not only increases the system's internal space but also increases material and labor costs. Summary of the Invention

[0004] The technical problems to be solved by the present invention are the material cost and labor cost problems of existing solar patch products, and the problem of saving space inside the system.

[0005] To solve the above technical problems, the technical solution adopted by the present invention is: a solar panel and control module integrated patch and its patch method, which includes a PCB board, a solar power generation module, a prefabricated circuit, a via bus, a solder pad, a positioning hole, an energy storage control module, a load control module, a solar cell patch positioning chamfer, and a patch process method.

[0006] The PCB board is a double-layer FR4 circuit board with positioning holes set at the bevel corners. There are prefabricated circuits and pads on both sides. There are solar cell patch positioning chamfers at the corners of the solar power generation module patch area, and the via bus connects the prefabricated circuits to the positive and negative electrode pads of the battery.

[0007] The soldering pads include front soldering pads for solar power generation modules, and back soldering pads for energy storage control modules and load control modules, as well as positive and negative soldering pads connected to the battery.

[0008] The solar power generation module is composed of solar cell patches connected in series and parallel, which are installed on the front of the PCB board and connected to the welding pads.

[0009] The energy storage control module is installed on the back of the PCB board and connected to the pad.

[0010] The load control module is installed on the back of the PCB board and connected to the pad.

[0011] The patch process method uses SMT patch packaging technology, including: positioning, tinning, patching, inspection, reflow soldering, testing, paint dipping, drying, packaging and other processes.

[0012] Advantageous Effects of the Invention

[0013] A solar panel and control module integrated patch and patch method thereof, comprising: a PCB board, a solar power generation module, a prefabricated circuit, a via bus, a soldering pad, a positioning hole, an energy storage control module, a load control module, a solar cell patch, a solar cell patch positioning chamfer, and a patch process method.

[0014] High-efficiency monocrystalline silicon solar cells are used as power generation units, achieving high power conversion efficiency. To meet power voltage requirements, prefabricated circuits within the PCB are arranged in an array and soldered in series or parallel. The resulting solar power generation module is mounted on the front of the PCB. The energy storage control module and load control module are mounted on the back of the PCB. These modules are mounted to the PCB using SMT chip packaging technology, creating an integrated product with the power generation module on the front and the control system on the back. This streamlined component layout minimizes space.

[0015] The control module on the back of the PCB is automatically printed using high-temperature solder paste. The machine then feeds the printed circuit board to the placement machine for placement. The electronic components are then placed using a feeder loading system. The semi-finished product undergoes reflow soldering. After testing, the electronic components on the back of the PCB are installed and soldered. Following the same process, the solar power module on the front is automatically printed using low-temperature solder paste. The solar cell panels on the front are then placed using a tray loading system. After reflow soldering and testing, the finished product is then installed and soldered. Qualified PCBs undergo varnish dipping and drying before being packaged, boxed, and shipped. Automated installation, soldering, and protective protection saves time and reduces errors.

[0016] The beneficial effect of the present invention is that the solar power generation module and the control module are combined and assembled during product production, and the internal circuits of the PCB board are preset according to the component layout, the layout is reasonable, and the space occupied by the components is saved. There is no need to install the control module additionally after the finished product is completed, thereby reducing material costs and labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front schematic diagram of the present invention;

[0018] Figure 2 It is a schematic diagram of the internal circuit of the present invention;

[0019] In the figure, 1. PCB board, 2. solar power generation module, 3. prefabricated circuit, 4. via bus, 5. soldering pad, 6. positioning hole, 7. energy storage control module, 8. load control module, 9. solar cell patch positioning chamfer. DETAILED DESCRIPTION

[0020] A solar panel and control module integrated patch and patch method thereof, comprising: a PCB board 1, a solar power generation module 2, a prefabricated circuit 3, a via bus 4, a soldering pad 5, a positioning hole 6, an energy storage control module 7, a load control module 8, a solar cell patch positioning chamfer 9, and a patch process method.

[0021] The PCB board 1 is a double-layer FR4 circuit board with positioning holes 6 set at the oblique corners. There are prefabricated circuits 3 and pads 5 on the front and back sides. There are solar cell patch positioning chamfers 9 at the corners of the patch area of ​​the solar power generation module 2, and the via bus 4 connects the prefabricated circuit 3 to the positive and negative electrode pads 5 of the battery.

[0022] The pads 5 include the front pads 5 for mounting the solar power generation module 2 , and the back pads 5 include the pads 5 for the energy storage control module 7 and the load control module 8 , as well as the positive and negative pads 5 connected to the battery and the load.

[0023] The solar power generation module 2 is composed of solar cell patches connected in series and parallel, is installed on the front of the PCB board 1, and is connected to the welding pad 5.

[0024] The energy storage control module 7 is mounted on the back of the PCB board 1 and connected to the pad 5 .

[0025] The load control module 8 is mounted on the back of the PCB board 1 and connected to the pad 5 .

[0026] The patch process method uses SMT patch packaging technology, including: positioning, tinning, patching, inspection, reflow soldering, testing, paint dipping, drying, packaging and other processes.

[0027] Solar power module 2 utilizes an array of solar cells, spaced 0.5mm apart. Each cell has a pre-defined chamfer 9 for positioning and identification during placement by the placement machine. The number of solar cells within module 2 is determined by the product's final voltage, and the cell size is designed based on the dimensions of PCB 1 to achieve optimal area utilization.

[0028] PCB 1 is made of FR4 material and utilizes a tin-spraying process. A double-layer board is used, with SOP-coated pads 5, oil-filled vias, and 1oz copper foil. Two diagonally opposite positioning holes 6 are located outside the mounting area for the solar power module 2 on PCB 1 to facilitate laser trimming and positioning. Prefabricated circuits 3 are prefabricated within the mounting area for the solar power module 2. These prefabricated circuits 3 are designed as an array based on the dimensions of the solar cell patch. Small solder pads 5 are reserved to connect the electrical solder points on the solar cell patch to the prefabricated circuits 3 on PCB 1. The number of prefabricated circuits 3 on PCB 1 matches the number of circuits on the back of the solar cell patch. The reserved solder pads 5 for the positive and negative electrodes of the solar cell patch on the prefabricated circuits 3 are spaced evenly horizontally, with the width and height of the solder pads 5 matching those of the prefabricated circuits 3. The spacing between the positive and negative solder pads 5 on the solar cell patch is staggered to minimize short circuits.

[0029] When the solar power generation module 2, composed of solar cell patches on the front of PCB board 1, receives sunlight and generates and collects electrical energy, it is then converged at both ends of the prefabricated circuit 3 of a single solar cell patch. The energy is then connected to the energy storage control module 7 on the back of PCB board 1 via a via bus 4 on the prefabricated circuit 3 of PCB board 1. The output of energy storage control module 7 is connected to the positive and negative pads 5 reserved for the battery, charging the battery connected to the positive and negative pads 5. When the electrical load needs to use electrical energy, the battery connected to the positive and negative pads 5 of the battery is connected to the load control module 8 via the prefabricated circuit 3. The output of load control module 8 is connected to the positive and negative pads 5 reserved for the load on the back, and the load is directly connected to the positive and negative pads 5 reserved for the load for use. Both energy storage control module 7 and load control module 8 have current limiting, voltage limiting, voltage stabilization, anti-reverse, anti-overcharge, and anti-overdischarge protection functions, ensuring stable charging and load protection, greatly extending the product's service life.

[0030] The back of the PCB board 1 is designed with reserved positive and negative electrode pads 5 for the battery connected to the output side of the energy storage control module 7, and reserved positive and negative electrode pads 5 for the load connected to the output side of the load control module 8. When in use, the battery and load ports are directly connected. The energy storage control module 7 and load control module 8 designed and installed on the back of the PCB board 1 and the corresponding positive and negative electrode pads 5 of the battery and load reduce the cost of additional control modules when subsequent products are used. The integrated design saves space occupied by the product control module. The reserved positive and negative electrode pads 5 of the battery and load can realize quick connection between the battery and the load when in use, which is easy to operate and use.

[0031] The patch method used in the present invention is an SMT patch packaging technology process designed for double-sided patch design of PCB board 1, including the following steps:

[0032] S1-Tinning the back of PCB board 1: After stirring the high-temperature solder paste evenly, use a tinning machine and utilize the positioning holes 6 on the PCB board 1 to tin the pads 5 of the energy storage control module 7 and the load control module 8 on the PCB board 1 conveyed to the tinning machine, and then convey the PCB board 1 to the placement machine.

[0033] S2-PCB board 1 back side patch: In the placement machine, using the feeder automatic loading method, the placement machine sticks the electronic component energy storage control module 7 and the load control module 8 to the solder paste of the pad 5 on the back side of the PCB board 1, and transports the PCB board 1 to the inspection equipment.

[0034] S3-Intermediate inspection: In the intermediate inspection equipment, the electronic component energy storage control module 7 and load control module 8 installed on the back of the PCB board 1 are inspected using photo comparison technology. After passing the intermediate inspection, the PCB board 1 is transported to the reflow soldering equipment.

[0035] S4-Reflow soldering: In the reflow soldering equipment, the temperature of the reflow soldering equipment adopts the temperature setting value of the high-temperature solder paste. After receiving the PCB board 1, the temperature will automatically rise. After reaching the temperature setting value of the high-temperature solder paste, the high-temperature solder paste melts, and the energy storage control module 7 and the load control module 8 are welded to the reserved pad 5 of the control module on the back of the PCB board 1. The PCB board 1 is then transported to the semi-finished product testing equipment.

[0036] S5-PCB board 1 semi-finished product test: After the reflow soldering is completed, the PCB board 1 is tested as a semi-finished product. If the test is qualified, the PCB board 1 is transported to the tin brushing machine for secondary placement of the PCB board 1.

[0037] S6-Tinning the front of PCB board 1: After stirring the low-temperature solder paste evenly, use a tinning machine to brush tin on the soldering pads 5 of each solar cell patch in the solar power generation module 2 on the front of PCB board 1 using the positioning holes 6 on PCB board 1, and then convey the PCB board 1 to the placement machine.

[0038] S7-PCB board 1 front surface patch: In the placement machine, using the tray loading method, the placement machine sticks the electronic component solar cell patch to the solder paste of the front pad 5 of the PCB board 1 to form the solar power generation module 2, and transports the PCB board 1 to the intermediate inspection equipment.

[0039] S8-Intermediate inspection: In the intermediate inspection equipment, the solar power generation module 2 installed on the front of the PCB board 1 is inspected using photo comparison technology. After passing the intermediate inspection, the PCB board 1 is transported to the reflow soldering equipment.

[0040] S9-Reflow soldering: In the reflow soldering equipment, the temperature of the reflow soldering equipment adopts the temperature setting value of the low-temperature solder paste. After receiving the PCB board 1, the temperature will automatically rise. After reaching the low-temperature solder paste temperature setting value, the low-temperature solder paste melts, and the solar power generation module 2 is soldered to the solar power generation module reserved pad 5 on the front of the PCB board 1. The PCB board 1 is then transported to the finished product testing equipment.

[0041] S10-PCB board 1 finished product test: After the reflow soldering is completed, the PCB board 1 is tested as a finished product. If the test is qualified, the battery and load pads 5 reserved on the PCB1 are covered with protective stickers and transported to the PCB board 1 dipping equipment.

[0042] S11-PCB board 1 dipping: In the dipping equipment, epoxy resin paint is applied on the PCB board 1. This paint has high strength, excellent properties and stable chemical properties. It can provide protection on the circuit board and extend the service life of the PCB board 1 and the electronic components installed on the PCB board 1.

[0043] S12 - Drying: The PCB board 1 dipped in paint is transported to a dryer for drying. After drying, the protective stickers on the solder pads 5 of the battery and load on the PCB 1 are removed.

[0044] S13-packaging, the dried PCB board 1 is transported to the packaging area, and the operator places the PCB board in an anti-static bag and then places it in a packaging box.

[0045] During the electronic component mounting process, high-temperature and low-temperature solder pastes are used to implement the mounting process on the front and back sides of the PCB board 1 based on their different temperature characteristics. This solves the problem of electronic components on the other side falling off due to heat during the second mounting process. Ultimately, it is possible to mount solar cell patches and control system components on the same PCB board, saving production cycle and product space.

[0046] In summary, the integrated solar panel and control module patch and the patch method thereof protected by the present invention can solve the material cost and labor cost problems of existing solar patch products, and save space inside the system.

[0047] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A solar panel and control module integrated patch and patch method, comprising a PCB board, a solar power generation module, a prefabricated circuit, a via bus, a solder pad, positioning holes, an energy storage control module, a load control module, and a solar cell patch positioning chamfer, and a patch process method, characterized by: The PCB board is a double-layer FR4 circuit board with positioning holes set at the oblique corners. There are prefabricated circuits and pads on both sides. There are solar cell patch positioning chamfers at the corners of the solar power generation module patch area, and the via bus connects the prefabricated circuits to the positive and negative electrode pads.

2. The solar panel and control module integrated patch and patch method according to claim 1, characterized in that: The soldering pads include front soldering pads for solar power generation modules, and back soldering pads for energy storage control modules and load control modules, as well as positive and negative soldering pads connected to the battery.

3. The solar panel and control module integrated patch and patch method according to claim 1, characterized in that: The solar power generation module is composed of solar cell patches connected in series and parallel, which are installed on the front of the PCB board and connected to the welding pads.

4. The solar panel and control module integrated patch and patch method according to claim 1, characterized in that: The energy storage control module is installed on the back of the PCB board and connected to the pad.

5. The solar panel and control module integrated patch and patch method according to claim 1, characterized in that: The load control module is installed on the back of the PCB board and connected to the pad.

6. The solar panel and control module integrated patch and patch method according to claim 1, characterized in that: The patch process method uses the SMT patch packaging technology, which includes: positioning, tinning, patching, inspection, reflow soldering, testing, paint dipping, drying, packaging and other process steps.

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