Composite material, semiconductive shielding material and high-voltage cable

Abstract

The invention discloses a composite material, a semiconductive shielding material and a high-voltage cable. The composite material is prepared from the following raw materials in parts by weight: 50 to 70 parts of basic resin, 20 to 30 parts of conductive filler and 0.5 to 15 parts of auxiliaries, wherein the base resin comprises the following components in percentage by mass: 60%-80% of first resin and 20%-40% of polysulfide rubber. According to the composite material with the repairable performance, the polysulfide rubber containing the dynamic disulfide bonds is used, micro-cracks generated in the machining or service process can be effectively repaired through fracture and recombination of the dynamic disulfide bonds, and the repairable characteristic can be effectively introduced to endow the material with the repairable performance; electric field distortion and great reduction of mechanical performance caused by interface defects can be avoided, and the reliability of long-term operation of the cable is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the field of organic polymer materials, in particular to a composite material, a semi-conductive shielding material and a high-voltage cable. Background Art

[0002] Semiconductive shielding material, the core material of power cables, is tightly coated inside and outside the insulation layer through a three-layer co-extrusion process. This ensures uniform electric field distribution, suppresses partial discharge, and extends cable service life. Traditional semiconductive shielding materials primarily consist of a base resin (such as ethylene-vinyl acetate copolymer, polypropylene), conductive fillers (such as carbon black, carbon nanotubes), a crosslinker, and processing aids. Their performance must meet key performance criteria, including volume resistivity (100–10⁴Ω·cm), surface smoothness (maximum protrusion height ≤ 5μm), and mechanical stability. However, over long-term service, thermal cycling, mechanical stress concentration, and thermal aging can lead to microcracks in the shielding layer or localized breakage of the conductive network, a critical issue limiting cable life. For example, in a 110kV cable failure case, due to unrepaired microcracks in the stress cone, an axial discharge breakdown occurred after 14 years of operation. The measured electric field strength at the fault point was 4.2 times the design value.

[0003] Traditional repair technologies for cable damage rely primarily on physical blocking or external curing: 1) Mechanical repair methods, such as cutting and creating intermediate joints (taking over three hours), can damage the cable's mechanical strength, reduce the current carrying capacity at the joint by 15%-20%, and fail to prevent the formation of new cracks. 2) Heat-shrink encapsulation: Silicone grease is used to fill cracks, but it easily carbonizes at high temperatures, increasing interfacial resistivity and exacerbating electric field distortion. 3) External self-healing systems: Microencapsulated repair agents are used, but the number of repairs is limited (≤3), and the release of the repair agent can disrupt the original conductive network, causing volume resistivity fluctuations exceeding two orders of magnitude. Even after these repairs, the cables still exhibit significant mechanical degradation and large resistivity fluctuations. Summary of the Invention

[0004] Based on this, it is necessary to provide a composite material, a semi-conductive shielding material and a high-voltage cable that are repairable and have little impact on mechanical properties and resistivity after repair.

[0005] The present application provides a composite material, wherein the raw materials thereof include, by weight: 50 to 70 parts of a base resin, 20 to 30 parts of a conductive filler, and 0.5 to 15 parts of an additive;

[0006] The base resin includes, by mass percentage, 60% to 80% of the first resin and 20% to 40% of the polysulfide rubber.

[0007] In one embodiment, the first resin includes one or both of ethylene-butyl acrylate copolymer and low-density polyethylene.

[0008] In one embodiment, the polysulfide rubber satisfies one or more of the following conditions:

[0009] (1) Molecular weight is 8000~12000;

[0010] (2) Sulfur content 37%~42%;

[0011] (3) Glass transition temperature ≤ -30℃.

[0012] In one embodiment, the conductive filler includes one or both of carbon black and carbon nanotubes.

[0013] In one embodiment, the carbon black satisfies one or both of the following conditions:

[0014] (1) Oil absorption value is 150 ml / 100g~170 ml / 100g;

[0015] (2) Ash content <0.2%;

[0016] (3) The average particle size is 15nm~25nm.

[0017] In one embodiment, the auxiliary agent includes one or more of a dispersant, a plasticizer, an antioxidant, and a cross-linking agent.

[0018] In one embodiment, the auxiliary agent includes the dispersant, the plasticizer, the antioxidant and the cross-linking agent in a mass ratio of (0.5~3): (1~4): (1~4): (0.9~3).

[0019] In one embodiment, the auxiliary agent meets one or more of the following conditions:

[0020] (1) The antioxidant includes one or more of antioxidant 168, antioxidant 1010, antioxidant 508T, and antioxidant 619;

[0021] (2) The dispersant includes one or more of benzoyl peroxide, TEGO Dispers 760W, and ethylene bisstearamide;

[0022] (3) The plasticizer includes one or more of dioctyl phthalate, stearic acid, paraffin and titanium dioxide;

[0023] (4) The crosslinking agent includes one or more of di-tert-butylperoxyisopropylbenzene, diisopropylbenzene peroxide and 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane.

[0024] The present application also provides a semi-conductive shielding material, comprising the above-mentioned composite material.

[0025] Furthermore, the present application also provides a high-voltage cable, comprising the composite material as described above or the semi-conductive shielding material as described above.

[0026] The present application provides a composite material with repairable properties. By using polysulfide rubber containing dynamic disulfide bonds, the breakage and recombination of the dynamic disulfide bonds can effectively repair microcracks generated during processing or service, which can effectively introduce the material to have repairable properties, avoid electric field distortion and a significant decrease in mechanical properties caused by interface defects, and significantly improve the long-term operation reliability of the cable. DETAILED DESCRIPTION

[0027] In order to facilitate understanding of the present application, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0029] As used herein, the phrase "and / or" includes any one of two or more of the listed items, as well as any and all combinations of the listed items. These combinations include any combination of two, any more, or all of the listed items. For example, "A and / or B" includes A, B, and the combination of A and B.

[0030] In this document, unless otherwise specified, "one or more" means any one of the listed items or any combination of the listed items. Similarly, "one or more" and other expressions that mean "one or more" are also understood in the same way unless otherwise specified.

[0031] Herein, terms such as "further," "further," "particularly," "for example," "such as," "example," and "for instance" are used for descriptive purposes to indicate a connection between the preceding and following technical solutions in terms of their coverage. However, they should not be construed as limiting the preceding technical solution or the scope of protection herein. Herein, unless otherwise specified, "A (such as B)" means that B is a non-limiting example of A, and it should be understood that A is not limited to B.

[0032] As used herein, "optionally," "optional," and "optional" mean optional, that is, any one of the two parallel options of "with" or "without." If multiple "optional" items appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "optional" item is independent of the other. In this application, descriptions such as "optionally contain" and "optionally include" mean "containing or not containing." "Optional component X" means the presence or absence of component X, or the presence or absence of component X.

[0033] In this document, the terms "first," "second," "third," and "fourth" in "the first aspect," "the second aspect," "the third aspect," and "the fourth aspect" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or quantity, nor as implicitly indicating the importance or quantity of the technical features indicated. Furthermore, the terms "first," "second," "third," and "fourth," etc., serve only as non-exhaustive enumeration and description and should not constitute a closed-ended limitation on quantity.

[0034] In this article, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0035] As used herein, when referring to a numerical interval (i.e., a numerical range), unless otherwise specified, the distribution of the optional numerical values ​​within the numerical interval is deemed to be continuous and includes the two numerical endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between the two numerical endpoints. Unless otherwise specified, when a numerical interval refers only to integers within the numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe a feature or characteristic, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. "Numerical interval" allows for a broad range of numerical interval types including percentage intervals, ratio intervals, and ratio intervals.

[0036] Herein, "room temperature" or "normal temperature" generally refers to 4°C to 35°C, for example, 20°C ± 5°C. In some embodiments herein, "room temperature" or "normal temperature" refers to 10°C to 30°C. In some embodiments herein, "room temperature" or "normal temperature" refers to 20°C to 30°C.

[0037] In this document, if a method flow involves multiple steps, unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be performed in an order other than the order described. Moreover, any step can include multiple sub-steps or multiple stages, and these sub-steps or stages do not necessarily need to be completed at the same time, but can be performed at different times, and their execution order does not necessarily need to be sequential, but can be performed in rotation, alternation, or simultaneously with other steps or parts of sub-steps or stages of other steps.

[0038] The present application provides a composite material, wherein the raw materials thereof include, by weight: 50 to 70 parts of a base resin, 20 to 30 parts of a conductive filler, and 0.5 to 15 parts of an additive;

[0039] The base resin includes, by mass percentage, 60% to 80% of the first resin and 20% to 40% of the polysulfide rubber.

[0040] The present application provides a composite material with repairable properties. By using polysulfide rubber containing dynamic disulfide bonds, the breakage and recombination of the dynamic disulfide bonds can effectively repair microcracks generated during processing or service, which can effectively introduce the material to have repairable properties, avoid electric field distortion and a significant decrease in mechanical properties caused by interface defects, and significantly improve the long-term operation reliability of the cable.

[0041] In a specific example, the first resin includes one or both of ethylene-butyl acrylate copolymer and low-density polyethylene.

[0042] Furthermore, the mass percentage of butyl acrylate in the ethylene-butyl acrylate copolymer is 25% to 30%. Specifically, the mass percentage of butyl acrylate in the ethylene-butyl acrylate copolymer can be, but is not limited to, 25%, 26%, 27%, 28%, 29% or 30%.

[0043] Furthermore, the melt index of the ethylene butyl acrylate copolymer at 190° C. and 2.16 kg is 5 g / 10 min to 7 g / 10 min. Specifically, the melt index of the ethylene butyl acrylate copolymer at 190° C. and 2.16 kg can be, but is not limited to, 5 g / 10 min, 5.5 g / 10 min, 6 g / 10 min, 6.5 g / 10 min, or 7 g / 10 min.

[0044] Furthermore, by regulating the mass ratio of the first resin to polysulfide rubber (PSR), not only can the repairability of the composite material as a semi-conductive electrical shielding layer material be guaranteed, but the surface can also have good smoothness, reduce surface defects, and lower local field intensity peaks.

[0045] In one specific example, the molecular weight of the polysulfide rubber is 8,000 to 12,000. Polysulfide rubber is a synthetic rubber obtained by polycondensation of a dihalogenated alkane with an alkali metal or alkaline earth metal polysulfide. Specifically, the molecular weight of the polysulfide rubber can be, but is not limited to, 8,000, 9,000, 10,000, 11,000, or 120,000.

[0046] In a specific example, the sulfur content is 37% to 42%. Specifically, the sulfur content of the polysulfide rubber can be, but is not limited to, 37%, 38%, 39%, 40%, 41%, or 42%.

[0047] In a specific example, the glass transition temperature is ≤ -30°C.

[0048] In a specific example, the conductive filler includes one or both of carbon black and carbon nanotubes.

[0049] In a specific example, the oil absorption value of the carbon black is 150 ml / 100 g to 170 ml / 100 g. The oil absorption value of the carbon black can be, but is not limited to, 150 ml / 100 g, 155 ml / 100 g, 160 ml / 100 g, 165 ml / 100 g, or 170 ml / 100 g.

[0050] In one specific example, the carbon black has an ash content of <0.2%.

[0051] In one specific example, the average particle size of the carbon black is 15 nm to 25 nm. Specifically, the average particle size of the carbon black can be, but is not limited to, 15 nm, 16 nm, 17 nm, 18 nm, 19 nm, 20 nm, 21 nm, 22 nm, 23 nm, 24 nm, or 25 nm.

[0052] In a specific example, the auxiliary agent includes one or more of a dispersant, a plasticizer, an antioxidant, and a cross-linking agent.

[0053] In a specific example, the auxiliary agent includes a dispersant, a plasticizer, an antioxidant, and a cross-linking agent in a mass ratio of (0.5~3):(1~4):(1~4):(0.9~3).

[0054] In a specific example, the antioxidant includes one or more of antioxidant 168 , antioxidant 1010 , antioxidant 508T, and antioxidant 619 .

[0055] In one specific example, the dispersant includes one or more of benzoyl peroxide, TEGO Dispers 760W, and ethylene bisstearamide.

[0056] In a specific example, the plasticizer includes one or more of dioctyl phthalate, stearic acid, paraffin wax, and titanium dioxide.

[0057] In a specific example, the cross-linking agent includes one or more of di-tert-butylperoxyisopropylbenzene, dicumyl peroxide, and 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane.

[0058] The method for preparing the composite material comprises the following steps S1 to S6:

[0059] Step S1: weighing the base resin, conductive filler, dispersant, plasticizer, antioxidant and crosslinking agent according to the above mass ratio;

[0060] Step S2: mixing the first resin and polysulfide rubber (PSR) to prepare a base resin mixture;

[0061] Step S3: mixing the conductive filler and the dispersant to prepare a modified conductive filler;

[0062] Step S4: mixing the base resin mixture, the modified conductive filler, the plasticizer, the antioxidant and the cross-linking agent to prepare a mixed material;

[0063] Step S5: extruding and granulating the mixed material.

[0064] It is understood that a drying step is further included after granulation. Further, the drying temperature is 60°C to 80°C, and the drying time is 12 hours to 24 hours. Specifically, the drying temperature may be, but is not limited to, 60°C, 65°C, 70°C, 75°C, or 80°C, and the drying time may be, but is not limited to, 12 hours, 13 hours, 14 hours, 15 hours, 16 hours, 17 hours, 18 hours, 19 hours, 20 hours, 21 hours, 22 hours, 23 hours, or 24 hours.

[0065] In a specific example, in step S2, the mixing can be performed in a high-speed mixer with a rotation speed of 200 r / min to 300 r / min, further, the mixing temperature is 80° C. to 100° C., and the mixing time is 10 min to 20 min. Specifically, the rotation speed can be, but is not limited to, 200 r / min, 210 r / min, 220 r / min, 230 r / min, 20 r / min, 250 r / min, 260 r / min, 270 r / min, 280 r / min, 290 r / min, or 300 r / min. The mixing temperature can be, but is not limited to, 80° C., 85° C., 90° C., 95° C., or 100° C. The mixing time can be, but is not limited to, 10 min.

[0066] In a specific example, in step S3, the mixing can be performed in a high-speed mixer with a rotation speed of 800 r / min to 1200 r / min, further, the mixing temperature is 90° C. to 110° C., and the mixing time is 15 min to 30 min. Specifically, the rotation speed can be, but is not limited to, 800 r / min, 850 r / min, 900 r / min, 950 r / min, 1000 r / min, 1050 r / min, 1100 r / min, 1150 r / min, or 1200 r / min. The mixing temperature can be, but is not limited to, 90° C., 95° C., 100° C., 105° C., or 110° C. The mixing time can be, but is not limited to, 15 min, 16 min, 17 min, 18 min, 19 min, 20 min, 21 min, 22 min, 23 min, 24 min, 25 min, 26 min, 27 min, 28 min, 29 min, or 30 min.

[0067] In a specific example, in step S4, mixing can be performed in an internal mixer, but is not limited to, at a mixing temperature of 110° C. to 130° C., and for a mixing time of 15 min to 30 min. Specifically, the mixing temperature can be, but is not limited to, 110° C., 115° C., 120° C., 125° C., or 130° C. The mixing time can be, but is not limited to, 15 min, 16 min, 17 min, 18 min, 19 min, 20 min, 21 min, 22 min, 23 min, 24 min, 25 min, 26 min, 27 min, 28 min, 29 min, or 30 min.

[0068] In a specific example, in step S5, the granulation can be performed by extrusion in a twin-screw extruder, but is not limited to, at a temperature of 140° C. to 180° C. and a screw speed of 50 r / min to 100 r / min. Specifically, the extrusion temperature can be, but is not limited to, 140° C., 145° C., 150° C., 155° C., 160° C., 165° C., 170° C., 175° C., or 180° C. The screw speed can be, but is not limited to, 50 r / min, 60 r / min, 7 r / min, 80 r / min, 90 r / min, or 100 r / min.

[0069] The present application also provides a semi-conductive shielding material, comprising the above-mentioned composite material.

[0070] Furthermore, the present application also provides a high-voltage cable, comprising the composite material as described above or the semi-conductive shielding material as described above.

[0071] The present application will be further described in detail below with reference to specific examples. It should be understood that these examples are intended to illustrate the present application only and are not intended to limit the scope of the present application. For experimental methods in the following examples where specific conditions are not specified, reference should be made to the instructions provided in this application, or to experimental manuals or conventional conditions in the art, or to conditions recommended by the manufacturer, or to experimental methods known in the art.

[0072] In the following specific examples, the measured parameters of raw material components may have slight deviations within the range of weighing accuracy unless otherwise specified. For temperature and time parameters, acceptable deviations due to instrument testing accuracy or operational accuracy are allowed. "Normal temperature" refers to 25°C; "normal pressure" refers to 100 kPa or 101 kPa.

[0073] In the following examples and comparative examples, ethylene-butyl acrylate copolymer was purchased from Arkema, France, with the brand name 7500; polysulfide rubber was purchased from Xinjiecheng Chemical, with the brand name JLY-121; and conductive carbon black was purchased from Cabot Corporation, with the brand name VXC500.

[0074] Example 1

[0075] This embodiment provides a composite material, which is composed of 60 parts by mass of a base resin, 30 parts by mass of conductive carbon black, 2 parts by mass of a dispersant, 3 parts by mass of a plasticizer, 3 parts by mass of an antioxidant, and 2 parts by mass of a crosslinking agent.

[0076] Among them, the matrix resin includes 90% by mass of ethylene-butyl acrylate copolymer (EBA) and 10% by mass of polysulfide rubber (PSR), the dispersant is benzoyl peroxide, the plasticizer is dioctyl phthalate, the antioxidant is a compound of antioxidant 1010 and antioxidant 168 with a mass ratio of 2:1, and the crosslinking agent is diisopropyl peroxide.

[0077] The specific preparation method comprises the following steps:

[0078] S1: Weigh the base resin, conductive carbon black, dispersant, plasticizer, antioxidant and crosslinking agent according to the above mass ratio and dry them;

[0079] Step S2: Ethylene-butyl acrylate copolymer (EBA) and polysulfide rubber (PSR) were mixed in a high-speed mixer at a temperature of 90° C., a rotation speed of 300 r / min, and a mixing time of 20 min to form a base resin mixture;

[0080] Step S3: mixing the conductive carbon black and the dispersant in a high-speed mixer at a temperature of 110° C., a rotation speed of 1200 r / min, and a mixing time of 30 min to obtain a modified conductive filler;

[0081] Step S4: adding the base resin mixture, modified conductive filler, plasticizer, antioxidant and cross-linking agent into an internal mixer and mixing at 130° C. for 30 minutes;

[0082] Step S5: the mixed material is extruded into granules through a twin-screw extruder, with the extrusion temperature set at 170°C and the screw speed at 80 r / min;

[0083] Step S6: drying after granulation at a drying temperature of 80° C. for 24 h to obtain a composite material.

[0084] Example 2

[0085] The difference between this embodiment and embodiment 1 lies in the different base resin compositions. In this embodiment, the base resin comprises 80% by mass of ethylene-butyl acrylate copolymer (EBA) and 20% by mass of polysulfide rubber (PSR).

[0086] Example 3

[0087] The difference between this embodiment and embodiment 1 lies in the different base resin compositions. In this embodiment, the base resin comprises 70% by mass of ethylene-butyl acrylate copolymer (EBA) and 30% by mass of polysulfide rubber (PSR).

[0088] Example 4

[0089] The difference between this embodiment and embodiment 1 lies in the base resin. In this embodiment, the base resin includes 90% by mass of low-density polyethylene (LDPE) and 10% by mass of polysulfide rubber (PSR).

[0090] Example 5

[0091] The difference between this embodiment and embodiment 1 is that the conductive carbon black is different. In this embodiment, the conductive carbon black is not mixed with the dispersant first, but is directly mixed with other additives.

[0092] Comparative Example 1

[0093] The difference between this comparative example and Example 1 lies in the different base resin compositions. In this comparative example, polysulfide rubber (PSR) is not added to the base resin.

[0094] Performance Testing

[0095] The composite materials obtained in Examples 1 to 3 and Comparative Example 1 were hot pressed at 200°C to obtain blocks, and the blocks were cut using a blade so that each block after cutting had the same size. The cut blocks were cut at the same position using a cutter so that the fracture sizes formed after cutting were consistent. The cut blocks were repaired at 60°C for 4 hours.

[0096] The electrical and mechanical performance tests were carried out, and the test results are shown in Table 1 below.

[0097] Table 1 Material properties of the above examples and comparative examples

[0098]

[0099] From the test results in Table 1 above, it can be seen that the tensile strength of Examples 1 to 4 and Comparative Example 1 shows that after the polysulfide rubber is introduced into the matrix resin, the initial tensile strength does not change much. When the shielding material is repaired at 60°C, the tensile strength of the shielding material remains above 85%, indicating that the introduction of polysulfide rubber increases the repairability of the shielding material.

[0100] It can be seen from the elongation at break of Examples 1 to 3 and Comparative Example 1 that after polysulfide rubber is introduced into the matrix resin, the initial elongation at break decreases slightly with the increase of polysulfide rubber content. When the shielding material is repaired at 60°C, the tensile strength of the shielding material remains above 86%, indicating that the introduction of polysulfide rubber increases the repairability of the shielding material and has a good mechanical property repair effect.

[0101] It can be seen from the volume resistivity of Examples 1 to 3 and Comparative Example 1 that after the introduction of polysulfide rubber into the matrix resin, the initial volume resistivity does not change much. When the shielding material is repaired at 60°C, the tensile strength of the shielding material remains above 95%, indicating that the introduction of polysulfide rubber increases the repairability of the shielding material and the resistivity repair effect is good.

[0102] It can be seen from Examples 1 to 3 that as the content of polysulfide rubber in the matrix resin increases, the tensile strength and elongation at break of the shielding material decrease slightly, and the resistance increases slightly.

[0103] Comparing Example 1 and Example 4, it can be seen that compared with low-density polyethylene, polysulfide rubber has better compatibility with ethylene-butyl acrylate copolymer, so polysulfide rubber has a better repair effect on the ethylene-butyl acrylate copolymer matrix.

[0104] Comparing Example 1 and Example 5, it can be seen that compared with the unmodified carbon black, the addition of a dispersant to modify the carbon black is conducive to the uniform distribution of the carbon black, thereby ensuring the integrity of the conductive network, and thus the resistivity is lower.

[0105] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0106] The embodiments described above only express several implementation methods of the present invention, which are convenient for understanding the technical solutions of the present invention in a specific and detailed manner, but they cannot be understood as limiting the scope of protection of the invention patent. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, several variations and improvements can be made, which all fall within the scope of protection of the present invention. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments on the basis of the technical solutions provided by the present invention are all within the scope of protection of the claims attached to the present invention. Therefore, the scope of protection of the patent of the present invention shall be based on the content of the attached claims, and the description can be used to interpret the content of the claims.

Claims

1. A composite material, characterized in that The raw materials include, by weight, 50 to 70 parts of a base resin, 20 to 30 parts of a conductive filler, and 0.5 to 15 parts of an additive. The base resin includes, by mass percentage, 60% to 80% of the first resin and 20% to 40% of the polysulfide rubber.

2. The composite material according to claim 1, wherein The first resin includes one or both of ethylene-butyl acrylate copolymer and low-density polyethylene.

3. The composite material according to claim 1, wherein The polysulfide rubber meets one or more of the following conditions: (1) Molecular weight is 8000~12000; (2) Sulfur content 37%~42%; (3) Glass transition temperature ≤ -30℃.

4. The composite material according to claim 1, wherein The conductive filler includes one or both of carbon black and carbon nanotubes.

5. The composite material according to claim 4, wherein The carbon black satisfies one or more of the following conditions: (1) Oil absorption value is 150ml / 100g~170ml / 100g; (2) Ash content <0.2%; (3) The average particle size is 15nm~25nm.

6. The composite material according to any one of claims 1 to 5, characterized in that The auxiliary agent includes one or more of a dispersant, a plasticizer, an antioxidant and a cross-linking agent.

7. The composite material according to claim 6, wherein The auxiliary agent includes the dispersant, the plasticizer, the antioxidant and the cross-linking agent in a mass ratio of (0.5~3): (1~4): (1~4): (0.9~3).

8. The composite material according to claim 7, wherein The auxiliary agent meets one or more of the following conditions: (1) The antioxidant includes one or more of antioxidant 168, antioxidant 1010, antioxidant 508T, and antioxidant 619; (2) The dispersant includes one or more of benzoyl peroxide, TEGO Dispers 760W, and ethylene bisstearamide; (3) The plasticizer includes one or more of dioctyl phthalate, stearic acid, paraffin and titanium dioxide; (4) The crosslinking agent includes one or more of di-tert-butylperoxyisopropylbenzene, diisopropylbenzene peroxide and 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane.

9. A semi-conductive shielding material, characterized in that: The composite material comprises the composite material according to any one of claims 1 to 8.

10. A high voltage cable, characterized in that: The method comprises the composite material according to any one of claims 1 to 8 or the semiconductive shielding material according to claim 9.

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